JP2021002564A - Printed circuit board for deterioration detection - Google Patents

Printed circuit board for deterioration detection Download PDF

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JP2021002564A
JP2021002564A JP2019114704A JP2019114704A JP2021002564A JP 2021002564 A JP2021002564 A JP 2021002564A JP 2019114704 A JP2019114704 A JP 2019114704A JP 2019114704 A JP2019114704 A JP 2019114704A JP 2021002564 A JP2021002564 A JP 2021002564A
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wiring
opening
deterioration
deterioration detection
side end
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JP7277279B2 (en
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大介 三浦
Daisuke Miura
大介 三浦
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Fanuc Corp
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Fanuc Corp
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Abstract

To provide a printed circuit board for deterioration detection that can increase the contact opportunity between liquid and a wiring and accelerate the deterioration of the wiring regardless of the posture of a printed circuit board.SOLUTION: A solder resist 30 has an opening 40 that exposes a plurality of parts (280, etc.) of a continuous wiring 28, or a plurality of openings 40 that expose a plurality of parts (280, etc.) of the continuous wiring 28, and in a one-sided plan view, there are a plurality of intersections 50 that intersect the wiring 28 at the end (300) of the solder resist 30 facing the opening 40, and the opening 40 is located vertically upward with respect to the intersection 50 at any of the intersections 50 no matter which part of the outer peripheral portion of the insulator 22 is directed vertically upward.SELECTED DRAWING: Figure 2

Description

本発明は、プリント基板に設けられる劣化検出用プリント配線基板に関する。 The present invention relates to a deterioration detection printed wiring board provided on a printed circuit board.

電子制御で動作する機械は、電子回路を構成するためのプリント基板を有する。このプリント基板は、清浄でない環境で劣化が促進される。配線が劣化して故障することを防ぐために、プリント基板には、主たる電子回路の配線とは別に、劣化状態を検出するための配線が設けられることがある。 A machine that operates under electronic control has a printed circuit board for forming an electronic circuit. This printed circuit board is accelerated to deteriorate in an unclean environment. In order to prevent the wiring from deteriorating and failing, the printed circuit board may be provided with wiring for detecting the deteriorated state in addition to the wiring of the main electronic circuit.

例えば、特許文献１には、プリント基板に劣化検出用の配線を形成する腐食監視装置が開示される。この装置では、プリント基板の大部分がソルダレジストで覆われる一方で、劣化検出用の配線がソルダレジストに形成される開口部により大気中に露出され、腐食性ガスに晒される。この装置によれば、劣化検出用の配線が腐食して断線するか否かを監視することによりプリント基板の腐食度合いを監視することができる。 For example, Patent Document 1 discloses a corrosion monitoring device that forms wiring for detecting deterioration on a printed circuit board. In this device, while most of the printed circuit board is covered with a solder resist, the wiring for deterioration detection is exposed to the atmosphere by the openings formed in the solder resist and is exposed to corrosive gas. According to this device, the degree of corrosion of the printed circuit board can be monitored by monitoring whether or not the wiring for deterioration detection is corroded and broken.

工作機械等は、ミスト状の油や水が存在する環境で稼働する。このため、工作機械に使用されるプリント基板には油や水等の液体が付着しやすい。プリント基板に液体が付着すると、液中に含まれる塩化物や硫化物等の異物に起因して配線が劣化する虞がある。また、配線は、ソルダレジストと接触する部分と接触しない部分との境界位置、言い換えると、ソルダレジストの端部の位置で腐食しやすいことが知られている。これらの現象によれば、ソルダレジストの端部に位置する劣化検出用の配線に液体を付着させることにより、劣化検出用の配線の劣化をより促進させることができると考えられる。 Machine tools, etc. operate in an environment where mist-like oil and water are present. Therefore, liquids such as oil and water tend to adhere to the printed circuit board used in the machine tool. If the liquid adheres to the printed circuit board, the wiring may deteriorate due to foreign substances such as chlorides and sulfides contained in the liquid. Further, it is known that the wiring is easily corroded at the boundary position between the portion in contact with the solder resist and the portion not in contact with the solder resist, in other words, at the position of the end portion of the solder resist. According to these phenomena, it is considered that the deterioration of the deterioration detection wiring can be further promoted by adhering the liquid to the deterioration detection wiring located at the end of the solder resist.

特開平３−１５８７４８号公報Japanese Unexamined Patent Publication No. 3-158748

プリント基板は、工作機械内で水平面に対して立てられた状態で取り付けられることがある。また、劣化検出用の配線とソルダレジストの開口部とを有するプリント基板が立てられると、ソルダレジストの端部に位置する劣化検出用の配線が開口部よりも鉛直上方向側に配置されることがある。この状態において、開口部に浸入する液体は、鉛直下方向に流れ落ちるため劣化検出用の配線に付着しにくい。 The printed circuit board may be mounted upright on a horizontal surface in a machine tool. Further, when the printed circuit board having the wiring for deterioration detection and the opening of the solder resist is erected, the wiring for deterioration detection located at the end of the solder resist is arranged vertically upward from the opening. There is. In this state, the liquid that has entered the opening flows down vertically, so that it does not easily adhere to the deterioration detection wiring.

そこで、本発明は、プリント基板の姿勢に関わらず、劣化検出用の配線と液体との接触機会を増やして配線の劣化を促進することができる劣化検出用プリント配線基板を提供することを目的とする。 Therefore, an object of the present invention is to provide a deterioration detection printed wiring board capable of increasing the contact opportunity between the deterioration detection wiring and the liquid and promoting the deterioration of the wiring regardless of the posture of the printed circuit board. To do.

本発明の態様は、板状の絶縁体と、前記絶縁体の片面に形成される配線と、前記片面および前記配線を覆うとともに前記配線の一部を大気中に露出させる開口部が形成されるソルダレジストと、を有する劣化検出用プリント配線基板であって、前記ソルダレジストには、連続する前記配線のうち複数の部分を露出させる前記開口部、または、連続する前記配線のうち複数の前記部分を露出させる複数の前記開口部が形成され、前記片面の平面視において、前記開口部に臨む前記ソルダレジストの端部に、前記配線と交差する交差部が複数存在し、前記絶縁体の外周部のどの箇所が鉛直上方向に向けられても、いずれかの前記交差部の位置において、当該交差部よりも前記開口部が鉛直上方向側に位置する。 In the embodiment of the present invention, a plate-shaped insulator, wiring formed on one side of the insulator, and an opening that covers the one side and the wiring and exposes a part of the wiring to the atmosphere are formed. A printed wiring board for deterioration detection having a solder resist, and the solder resist has an opening that exposes a plurality of portions of the continuous wiring, or a plurality of the portions of the continuous wiring. A plurality of the openings are formed, and in a plan view of the one side, a plurality of intersections intersecting with the wiring are present at the ends of the solder resist facing the openings, and the outer peripheral portion of the insulator is formed. No matter which part of the throat is directed vertically upward, the opening is located vertically upward with respect to the intersection at any position of the intersection.

本発明によれば、プリント基板の姿勢に関わらず、液体と配線との接触機会を増やすことができ、配線の劣化を促進することができる。 According to the present invention, the chance of contact between the liquid and the wiring can be increased regardless of the posture of the printed circuit board, and the deterioration of the wiring can be promoted.

第１実施形態のプリント基板と劣化検出用プリント配線基板を示す模式図である。It is a schematic diagram which shows the printed circuit board of 1st Embodiment and the printed wiring board for deterioration detection. 第１実施形態の第１具体例の劣化検出用プリント配線基板を模式的に示す平面図である。It is a top view which shows typically the deterioration detection printed wiring board of 1st specific example of 1st Embodiment. 第１実施形態の第２具体例の劣化検出用プリント配線基板を模式的に示す平面図である。It is a top view which shows typically the deterioration detection printed wiring board of the 2nd specific example of 1st Embodiment. 第１実施形態の第３具体例の劣化検出用プリント配線基板を模式的に示す平面図である。It is a top view which shows typically the deterioration detection printed wiring board of the 3rd specific example of 1st Embodiment. 第１実施形態の第５具体例の劣化検出用プリント配線基板を模式的に示す平面図である。It is a top view which shows typically the deterioration detection printed wiring board of the 5th specific example of 1st Embodiment. 第１実施形態の第６具体例の劣化検出用プリント配線基板を模式的に示す平面図である。It is a top view which shows typically the deterioration detection printed wiring board of 6th specific example of 1st Embodiment. 第１実施形態の第７具体例の劣化検出用プリント配線基板を模式的に示す平面図である。It is a top view which shows typically the deterioration detection printed wiring board of 7th specific example of 1st Embodiment. 第２実施形態のプリント基板と劣化検出用プリント配線基板を示す模式図である。It is a schematic diagram which shows the printed circuit board of 2nd Embodiment and the printed wiring board for deterioration detection. 第２実施形態の劣化検出用プリント配線基板の表面側を模式的に示す平面図である。It is a top view which shows typically the surface side of the deterioration detection printed wiring board of 2nd Embodiment. 第２実施形態の劣化検出用プリント配線基板の裏面側を模式的に示す平面図である。It is a top view which shows typically the back side of the deterioration detection printed wiring board of 2nd Embodiment.

本発明に係る劣化検出用プリント配線基板について、好適な実施形態を掲げ、添付の図面を参照しながら以下、詳細に説明する。 The printed wiring board for deterioration detection according to the present invention will be described in detail below with reference to the accompanying drawings, with reference to suitable embodiments.

［１．第１実施形態］
図１を用いて第１実施形態におけるプリント基板１０および劣化検出用プリント配線基板２０の構成を説明する。以下の説明では、プリント基板１０および劣化検出用プリント配線基板２０と平行する平面をｘｙ平面とする。ｘｙ平面のｘ軸とｙ軸は互いに直交する。また、ｘ軸の＋方向を＋ｘ方向とし、ｘ軸の−方向を−ｘ方向とする。同様に、ｙ軸の＋方向を＋ｙ方向とし、ｙ軸の−方向を−ｙ方向とする。 [1. First Embodiment]
The configuration of the printed circuit board 10 and the deterioration detection printed wiring board 20 in the first embodiment will be described with reference to FIG. In the following description, a plane parallel to the printed circuit board 10 and the deterioration detection printed wiring board 20 is defined as an xy plane. The x-axis and y-axis of the xy plane are orthogonal to each other. Further, the + direction of the x-axis is the + x direction, and the-direction of the x-axis is the −x direction. Similarly, the + direction of the y-axis is the + y direction, and the − direction of the y-axis is the −y direction.

プリント基板１０は、工作機械に使用される。プリント基板１０の片面または両面には、主たる電子回路の配線（不図示）が形成されるとともに、劣化検出回路１６の配線１８が形成される。劣化検出回路１６の配線１８には、劣化検出用プリント配線基板２０の配線２８と抵抗Ｒとが直列に接続される。配線１８および配線２８は、プリント基板１０に形成される電子回路の配線と比較して故障しやすい形態、具体的には、線幅が細くされる。また、劣化検出回路１６には、抵抗Ｒの両端の抵抗電圧を検出する電圧センサＶが設けられる。 The printed circuit board 10 is used in a machine tool. Wiring (not shown) of the main electronic circuit is formed on one side or both sides of the printed circuit board 10, and wiring 18 of the deterioration detection circuit 16 is formed. The wiring 28 of the deterioration detection printed wiring board 20 and the resistor R are connected in series to the wiring 18 of the deterioration detection circuit 16. The wiring 18 and the wiring 28 have a form that is more likely to fail than the wiring of the electronic circuit formed on the printed circuit board 10, specifically, the line width is narrowed. Further, the deterioration detection circuit 16 is provided with a voltage sensor V that detects the resistance voltage across the resistor R.

配線１８および配線２８が断線していない状態で劣化検出回路１６の一端に所定電圧が印加されると、電圧センサＶは抵抗電圧を検出する。対して、配線１８または配線２８が断線している状態で劣化検出回路１６の一端に所定電圧が印加されると、電圧センサＶはゼロの電圧を検出する。配線１８および配線２８は、プリント基板１０に形成される電子回路の配線よりも細い。このため、配線１８および配線２８の劣化（断線）は、プリント基板１０に形成される電子回路の配線の劣化（断線）よりも早く発生する。電圧センサＶの検出値がゼロということは、配線１８または配線２８が断線する程度まで、プリント基板１０に形成される電子回路の劣化が進行していることを意味する。つまり、電圧センサＶの検出値は、プリント基板１０に形成される電子回路の配線の劣化度合い（断線状態）を示す指標となる。 When a predetermined voltage is applied to one end of the deterioration detection circuit 16 while the wiring 18 and the wiring 28 are not broken, the voltage sensor V detects the resistance voltage. On the other hand, when a predetermined voltage is applied to one end of the deterioration detection circuit 16 while the wiring 18 or the wiring 28 is broken, the voltage sensor V detects a zero voltage. The wiring 18 and the wiring 28 are thinner than the wiring of the electronic circuit formed on the printed circuit board 10. Therefore, the deterioration (disconnection) of the wiring 18 and the wiring 28 occurs earlier than the deterioration (disconnection) of the wiring of the electronic circuit formed on the printed circuit board 10. When the detected value of the voltage sensor V is zero, it means that the deterioration of the electronic circuit formed on the printed circuit board 10 has progressed to the extent that the wiring 18 or the wiring 28 is disconnected. That is, the detected value of the voltage sensor V is an index indicating the degree of deterioration (disconnection state) of the wiring of the electronic circuit formed on the printed circuit board 10.

劣化検出用プリント配線基板２０は、絶縁体２２と、配線２８と、ソルダレジスト３０と、を有する。絶縁体２２は、板状に形成され、その外形は平面視において、ｘ軸に沿って延伸する１組の第１辺２４ａ、２４ｂと、ｙ軸に沿って延伸する第２辺２６ａ、２６ｂとからなる矩形形状である。第１辺２４ａは＋ｙ方向側に配置され、第１辺２４ｂは−ｙ方向側に配置される。第２辺２６ａは＋ｘ方向側に配置され、第２辺２６ｂは−ｘ方向側に配置される。なお、絶縁体２２の形状は矩形に限らない。例えば、他の多角形でもよいし、円形でもよい。 The deterioration detection printed wiring board 20 has an insulator 22, a wiring 28, and a solder resist 30. The insulator 22 is formed in a plate shape, and its outer shape is a set of first sides 24a and 24b extending along the x-axis and second sides 26a and 26b extending along the y-axis in a plan view. It has a rectangular shape consisting of. The first side 24a is arranged on the + y direction side, and the first side 24b is arranged on the −y direction side. The second side 26a is arranged on the + x direction side, and the second side 26b is arranged on the −x direction side. The shape of the insulator 22 is not limited to a rectangle. For example, it may be another polygon or a circle.

配線２８は、銅等の導体であり、絶縁体２２の片面または両面に形成される。配線２８の一端に位置する入力端子Ｖ１は、配線１８の第１端子１８１に接続され、配線２８の他端に位置する出力端子Ｖ２は、配線１８の第２端子１８２に接続される。 The wiring 28 is a conductor such as copper, and is formed on one side or both sides of the insulator 22. The input terminal V1 located at one end of the wiring 28 is connected to the first terminal 181 of the wiring 18, and the output terminal V2 located at the other end of the wiring 28 is connected to the second terminal 182 of the wiring 18.

図２〜図７に示されるように、ソルダレジスト３０は、絶縁体２２の片面の少なくとも一部および配線２８の一部（被覆部分２８２）を覆う。また、ソルダレジスト３０には、入力端子Ｖ１から出力端子Ｖ２まで連続する配線２８のうち複数の部分（劣化促進部分２８０）を大気中に露出させる開口部４０（図１〜図４）、または、入力端子Ｖ１から出力端子Ｖ２まで連続する配線２８のうち複数の部分（劣化促進部分２８０）を大気中に露出させる複数の開口部４０（図５〜図７）が形成される。片面の平面視において、開口部４０に臨むソルダレジスト３０の端部（開口側端部３００）には、配線２８と交差する交差部５０が複数存在する。交差部５０の位置には、配線２８とソルダレジスト３０の接触部分と非接触部分の境界が存在する。 As shown in FIGS. 2 to 7, the solder resist 30 covers at least a part of one side of the insulator 22 and a part of the wiring 28 (covered portion 282). Further, the solder resist 30 has an opening 40 (FIGS. 1 to 4) for exposing a plurality of portions (deterioration promoting portion 280) of the wiring 28 continuous from the input terminal V1 to the output terminal V2 to the atmosphere, or A plurality of openings 40 (FIGS. 5 to 7) are formed to expose a plurality of portions (deterioration promoting portion 280) of the wiring 28 continuous from the input terminal V1 to the output terminal V2 to the atmosphere. In a one-sided plan view, there are a plurality of intersections 50 that intersect the wiring 28 at the end (opening side end 300) of the solder resist 30 that faces the opening 40. At the position of the intersection 50, there is a boundary between the contact portion and the non-contact portion of the wiring 28 and the solder resist 30.

以下で説明する各具体例において、開口部４０は、絶縁体２２の外周部のどの箇所が鉛直上方向に向けられても、交差部５０に液体が残留する形態になっている。 In each specific example described below, the opening 40 has a form in which the liquid remains at the intersection 50 regardless of which part of the outer peripheral portion of the insulator 22 is directed in the vertically upward direction.

［１．１．第１具体例］
図２を用いて第１具体例の劣化検出用プリント配線基板２０を説明する。絶縁体２２の片面の平面視において、ソルダレジスト３０には、平行四辺形（図２では長方形）の１つの開口部４０が形成される。ソルダレジスト３０の開口側端部３００は、＋ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３０１と、−ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３０３と、＋ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３０２と、−ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３０４と、を有する。 [1.1. First specific example]
The deterioration detection printed wiring board 20 of the first specific example will be described with reference to FIG. In the plan view of one side of the insulator 22, one opening 40 of a parallelogram (rectangular in FIG. 2) is formed in the solder resist 30. The opening side end portion 300 of the solder resist 30 is an opening side end portion 301 arranged on the + y direction side and extending along the x-axis, and an opening side end portion 301 arranged on the −y direction side and extending along the x-axis. It has a portion 303, an opening side end portion 302 arranged on the + x direction side and extending along the y-axis, and an opening side end portion 304 arranged on the −x direction side and extending along the y-axis.

配線２８は、入力端子Ｖ１から出力端子Ｖ２にかけて１つ以上（図２では５つ）の箇所で折れ曲がっている。配線２８は、ソルダレジスト３０で覆われる被覆部分２８２と、開口部４０で大気中に露出される劣化促進部分２８０と、を交互に有する。被覆部分２８２と劣化促進部分２８０は連続する。配線２８は、３つの被覆部分２８２と２つの劣化促進部分２８０を有する。このうち、１つの劣化促進部分２８０は、開口側端部３０１から−ｙ方向側に延伸する部分と、開口側端部３０２から−ｘ方向側に延伸する部分と、を有する。また、他の劣化促進部分２８０は、開口側端部３０３から＋ｙ方向側に延伸する部分と、開口側端部３０４から＋ｘ方向側に延伸する部分と、を有する。 The wiring 28 is bent at one or more points (five in FIG. 2) from the input terminal V1 to the output terminal V2. The wiring 28 alternately has a covering portion 282 covered with the solder resist 30 and a deterioration promoting portion 280 exposed to the atmosphere at the opening 40. The covering portion 282 and the deterioration promoting portion 280 are continuous. The wiring 28 has three covering portions 282 and two deterioration promoting portions 280. Of these, one deterioration promoting portion 280 has a portion extending from the opening side end portion 301 in the −y direction side and a portion extending from the opening side end portion 302 in the −x direction side. Further, the other deterioration promoting portion 280 has a portion extending from the opening side end portion 303 in the + y direction side and a portion extending from the opening side end portion 304 in the + x direction side.

第１具体例において、開口側端部３０１〜３０４には、配線２８と交差する交差部５０が１つずつ存在する。 In the first specific example, each of the opening side ends 301 to 304 has one intersection 50 intersecting with the wiring 28.

絶縁体２２の第１辺２４ａが鉛直上方向に向けられると、開口部４０は、開口側端部３０３に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０に液体が浸入すると、開口部４０よりも鉛直下方向側に位置する開口側端部３０３に液体が溜まる。すると、開口側端部３０３に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。 When the first side 24a of the insulator 22 is directed in the vertically upward direction, the opening 40 is located on the vertically upward side of the intersection 50 existing at the opening side end portion 303. When the liquid enters the opening 40 in this arrangement, the liquid collects in the opening side end 303 located on the vertically downward side of the opening 40. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 303. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted.

絶縁体２２の第１辺２４ｂが鉛直上方向に向けられると、開口部４０は、開口側端部３０１に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０に液体が浸入すると、開口部４０よりも鉛直下方向側に位置する開口側端部３０１に液体が溜まる。すると、開口側端部３０１に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。 When the first side 24b of the insulator 22 is directed in the vertically upward direction, the opening 40 is located vertically upward with respect to the intersection 50 existing at the opening side end portion 301. When the liquid enters the opening 40 in this arrangement, the liquid collects in the opening side end 301 located vertically downward from the opening 40. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 301. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted.

絶縁体２２の第２辺２６ａが鉛直上方向に向けられると、開口部４０は、開口側端部３０４に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０に液体が浸入すると、開口部４０よりも鉛直下方向側に位置する開口側端部３０４に液体が溜まる。すると、開口側端部３０４に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。 When the second side 26a of the insulator 22 is directed in the vertically upward direction, the opening 40 is located on the vertically upward side with respect to the intersection 50 existing at the opening side end portion 304. When the liquid enters the opening 40 in this arrangement, the liquid collects in the opening side end 304 located on the vertically downward side of the opening 40. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 304. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted.

絶縁体２２の第２辺２６ｂが鉛直上方向に向けられると、開口部４０は、開口側端部３０２に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０に液体が浸入すると、開口部４０よりも鉛直下方向側に位置する開口側端部３０２に液体が溜まる。すると、開口側端部３０２に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。 When the second side 26b of the insulator 22 is directed in the vertically upward direction, the opening 40 is located on the vertically upward side of the intersection 50 existing at the opening side end portion 302. When the liquid enters the opening 40 in this arrangement, the liquid collects in the opening side end 302 located on the vertically downward side of the opening 40. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 302. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted.

上述した４つの姿勢では、開口部４０よりも鉛直下方向側に位置する開口側端部３００が水平となるため、その開口側端部３００に液体が溜まりやすい。しかし、開口部４０よりも鉛直下方向側に位置する開口側端部３００は水平である必要はない。開口部４０よりも鉛直下方向側に位置する開口側端部３００に水平面に対して垂直でない部分があれば、液体はその垂直でない部分に残留する。このため、交差部５０の位置で、液体を劣化促進部分２８０に付着させることができる。以下で説明する各具体例および第２実施形態も同様である。 In the four postures described above, since the opening side end portion 300 located on the vertically downward side of the opening 40 is horizontal, the liquid tends to collect in the opening side end portion 300. However, the opening side end portion 300 located on the vertically downward side of the opening 40 does not have to be horizontal. If there is a portion of the opening side end portion 300 located on the vertically downward side of the opening portion 40 that is not perpendicular to the horizontal plane, the liquid remains in the non-vertical portion. Therefore, the liquid can be attached to the deterioration promoting portion 280 at the position of the intersection 50. The same applies to each specific example and the second embodiment described below.

［１．２．第２具体例］
図３を用いて第２具体例の劣化検出用プリント配線基板２０を説明する。なお、第２具体例の劣化検出用プリント配線基板２０において、第１具体例の劣化検出用プリント配線基板２０と同じ構成には同一の符号を付す。 [1.2. Second specific example]
The deterioration detection printed wiring board 20 of the second specific example will be described with reference to FIG. In the deterioration detection printed wiring board 20 of the second specific example, the same reference numerals are given to the same configurations as the deterioration detection printed wiring board 20 of the first specific example.

開口部４０は、第１具体例と同様に平行四辺形（図３では長方形）である。更に、開口部４０の内側には、開口部４０よりも一回り小さい平行四辺形（図３では長方形）のソルダレジスト３０が設けられる。つまり、第２具体例の開口部４０は、平行四辺形（図３では長方形）の環状である。開口部４０の内側に設けられるソルダレジスト３０の開口側端部３００は、＋ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３０５と、−ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３０７と、＋ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３０６と、−ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３０８と、を有する。 The opening 40 is a parallelogram (rectangular in FIG. 3) as in the first specific example. Further, inside the opening 40, a parallelogram (rectangular in FIG. 3) solder resist 30 that is one size smaller than the opening 40 is provided. That is, the opening 40 of the second specific example is an annular shape of a parallelogram (rectangular in FIG. 3). The opening side end portion 300 of the solder resist 30 provided inside the opening portion 40 is arranged on the + y direction side and extends along the x-axis side, and is arranged on the −y direction side and is arranged on the x-axis side. The opening side end 307 extending along the + x direction, the opening side end 306 arranged along the + x direction and extending along the y-axis, and the opening side extending along the −x direction and extending along the y-axis. It has an end 308 and.

配線２８のパターンは、第１具体例の配線２８のパターンと同じである。配線２８は、５つの被覆部分２８２と４つの劣化促進部分２８０を有する。第１の劣化促進部分２８０は、開口側端部３０１と開口側端部３０５との間をｙ軸に沿って延伸する。第２の劣化促進部分２８０は、開口側端部３０６と開口側端部３０２との間をｘ軸に沿って延伸する。第３の劣化促進部分２８０は、開口側端部３０３と開口側端部３０７との間をｙ軸に沿って延伸する。第４の劣化促進部分２８０は、開口側端部３０８と開口側端部３０４との間をｘ軸に沿って延伸する。 The pattern of the wiring 28 is the same as the pattern of the wiring 28 of the first specific example. The wiring 28 has five covering portions 282 and four deterioration promoting portions 280. The first deterioration promoting portion 280 extends along the y-axis between the opening side end portion 301 and the opening side end portion 305. The second deterioration promoting portion 280 extends between the opening side end portion 306 and the opening side end portion 302 along the x-axis. The third deterioration promoting portion 280 extends along the y-axis between the opening side end portion 303 and the opening side end portion 307. The fourth deterioration promoting portion 280 extends along the x-axis between the opening side end portion 308 and the opening side end portion 304.

第２具体例において、開口側端部３０１〜３０８には、配線２８と交差する交差部５０が１つずつ存在する。 In the second specific example, the opening side ends 301 to 308 have one intersection 50 that intersects with the wiring 28.

絶縁体２２の第１辺２４ａ、２４ｂ、第２辺２６ａ、２６ｂのいずれかが鉛直上方向に向けられると、開口部４０は、いずれかの交差部５０よりも鉛直上方向側に位置する。開口部４０に液体が浸入すると、開口部４０よりも鉛直下方向側に位置する開口側端部３０１〜３０８に液体が溜まる。すると、開口側端部３０１〜３０８に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。 When any one of the first side 24a and 24b and the second side 26a and 26b of the insulator 22 is directed in the vertically upward direction, the opening 40 is located on the vertically upward side of any of the intersections 50. When the liquid enters the opening 40, the liquid collects in the opening side ends 301 to 308 located on the vertically downward side of the opening 40. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portions 301 to 308. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted.

［１．３．第３具体例］
図４を用いて第３具体例の劣化検出用プリント配線基板２０を説明する。なお、第３具体例の劣化検出用プリント配線基板２０において、第１具体例の劣化検出用プリント配線基板２０と同じ構成には同一の符号を付す。 [1.3. Third specific example]
The deterioration detection printed wiring board 20 of the third specific example will be described with reference to FIG. In the deterioration detection printed wiring board 20 of the third specific example, the same reference numerals are given to the same configurations as the deterioration detection printed wiring board 20 of the first specific example.

第３具体例の劣化検出用プリント配線基板２０の構成は、ソルダレジスト３０に円形の１つの開口部４０が形成される点を除き、第１具体例の劣化検出用プリント配線基板２０の構成と一致する。 The configuration of the deterioration detection printed wiring board 20 of the third specific example is the same as the configuration of the deterioration detection printed wiring board 20 of the first specific example, except that one circular opening 40 is formed in the solder resist 30. Match.

［１．４．第４具体例］
図３に示される第２具体例の劣化検出用プリント配線基板２０において、ソルダレジスト３０に円環形状の１つの開口部４０が形成されてもよい。 [1.4. Fourth specific example]
In the deterioration detection printed wiring board 20 of the second specific example shown in FIG. 3, one ring-shaped opening 40 may be formed in the solder resist 30.

［１．５．第５具体例］
図５を用いて第５具体例の劣化検出用プリント配線基板２０を説明する。絶縁体２２の片面の平面視において、ソルダレジスト３０には、平行四辺形（図５では長方形）の複数の開口部４０が形成される。ここでは４つの開口部４０ａ〜４０ｄが形成される。−ｘ方向側の開口部４０ａにおいて、ソルダレジスト３０の開口側端部３００は、＋ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３０９と、−ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３１０と、を有する。＋ｙ方向側の開口部４０ｂにおいて、ソルダレジスト３０の開口側端部３００は、＋ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３１１と、−ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３１２と、を有する。＋ｘ方向側の開口部４０ｃにおいて、ソルダレジスト３０の開口側端部３００は、＋ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３１３と、−ｙ方向側に配置されてｘ軸に沿って延伸する開口側端部３１４と、を有する。−ｙ方向側の開口部４０ｄにおいて、ソルダレジスト３０の開口側端部３００は、＋ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３１５と、−ｘ方向側に配置されてｙ軸に沿って延伸する開口側端部３１６と、を有する。 [1.5. Fifth specific example]
The deterioration detection printed wiring board 20 of the fifth specific example will be described with reference to FIG. In a plan view of one side of the insulator 22, a plurality of parallelogram (rectangular in FIG. 5) openings 40 are formed in the solder resist 30. Here, four openings 40a to 40d are formed. In the opening 40a on the −x direction side, the opening side end portion 300 of the solder resist 30 is arranged on the −y direction side with the opening side end portion 309 arranged on the + y direction side and extending along the x-axis. It has an opening-side end 310 that extends along the x-axis. In the opening 40b on the + y direction side, the opening side end portion 300 of the solder resist 30 is arranged on the + x direction side and extends along the y axis, and is arranged on the −x direction side and y. It has an opening side end 312 that extends along the axis. In the opening 40c on the + x direction side, the opening side end portion 300 of the solder resist 30 is arranged on the + y direction side and extends along the x axis, and the opening side end portion 313 is arranged on the −y direction side and x. It has an opening-side end 314 that extends along the axis. In the opening 40d on the −y direction side, the opening side end portion 300 of the solder resist 30 is arranged on the −x direction side and the opening side end portion 315 arranged on the + x direction side and extending along the y axis. It has an opening-side end 316 that extends along the y-axis.

配線２８は、入力端子Ｖ１から出力端子Ｖ２にかけて１つ以上（図５では４つ）の箇所で折れ曲がっている。配線２８は、ソルダレジスト３０で覆われる被覆部分２８２と、開口部４０で大気中に露出される劣化促進部分２８０と、を交互に有する。被覆部分２８２と劣化促進部分２８０は連続する。配線２８は、５つの被覆部分２８２と４つの劣化促進部分２８０を有する。 The wiring 28 is bent at one or more points (four in FIG. 5) from the input terminal V1 to the output terminal V2. The wiring 28 alternately has a covering portion 282 covered with the solder resist 30 and a deterioration promoting portion 280 exposed to the atmosphere at the opening 40. The covering portion 282 and the deterioration promoting portion 280 are continuous. The wiring 28 has five covering portions 282 and four deterioration promoting portions 280.

第１の劣化促進部分２８０は、開口側端部３１０と開口側端部３０９との間をｙ軸に沿って延伸する。第２の劣化促進部分２８０は、開口側端部３１２と開口側端部３１１との間をｘ軸に沿って延伸する。第３の劣化促進部分２８０は、開口側端部３１３と開口側端部３１４との間をｙ軸に沿って延伸する。第４の劣化促進部分２８０は、開口側端部３１５と開口側端部３１６との間をｘ軸に沿って延伸する。 The first deterioration promoting portion 280 extends along the y-axis between the opening side end portion 310 and the opening side end portion 309. The second deterioration promoting portion 280 extends along the x-axis between the opening side end portion 312 and the opening side end portion 311. The third deterioration promoting portion 280 extends along the y-axis between the opening side end portion 313 and the opening side end portion 314. The fourth deterioration promoting portion 280 extends along the x-axis between the opening side end portion 315 and the opening side end portion 316.

第５具体例において、開口側端部３０９〜３１６には、配線２８と交差する交差部５０が１つずつ存在する。 In the fifth specific example, the opening side ends 309 to 316 have one intersection 50 that intersects with the wiring 28.

絶縁体２２の第１辺２４ａが鉛直上方向に向けられると、開口部４０ａは、開口側端部３１０に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０ａに液体が浸入すると、開口部４０ａよりも鉛直下方向側に位置する開口側端部３１０に液体が溜まる。すると、開口側端部３１０に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。開口部４０ｃについても同じことがいえる。 When the first side 24a of the insulator 22 is directed vertically upward, the opening 40a is located vertically upward with respect to the intersection 50 existing at the opening side end 310. When the liquid enters the opening 40a in this arrangement, the liquid collects in the opening side end 310 located on the vertically downward side of the opening 40a. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 310. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted. The same can be said for the opening 40c.

絶縁体２２の第１辺２４ｂが鉛直上方向に向けられると、開口部４０ａは、開口側端部３０９に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０ａに液体が浸入すると、開口部４０ａよりも鉛直下方向側に位置する開口側端部３０９に液体が溜まる。すると、開口側端部３０９に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。開口部４０ｃについても同じことがいえる。 When the first side 24b of the insulator 22 is directed in the vertically upward direction, the opening 40a is located on the vertically upward side of the intersection 50 existing at the opening side end portion 309. When the liquid enters the opening 40a in this arrangement, the liquid collects at the opening side end portion 309 located on the vertically downward side of the opening 40a. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 309. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted. The same can be said for the opening 40c.

絶縁体２２の第２辺２６ａが鉛直上方向に向けられると、開口部４０ｂは、開口側端部３１２に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０ｂに液体が浸入すると、開口部４０ｂよりも鉛直下方向側に位置する開口側端部３１２に液体が溜まる。すると、開口側端部３１２に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。開口部４０ｄについても同じことがいえる。 When the second side 26a of the insulator 22 is directed in the vertically upward direction, the opening 40b is located vertically upward with respect to the intersection 50 existing at the opening side end portion 312. When the liquid enters the opening 40b in this arrangement, the liquid collects at the opening side end portion 312 located on the vertically downward side of the opening 40b. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 312. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted. The same can be said for the opening 40d.

絶縁体２２の第２辺２６ｂが鉛直上方向に向けられると、開口部４０ｂは、開口側端部３１１に存在する交差部５０よりも鉛直上方向側に位置する。この配置で開口部４０ｂに液体が浸入すると、開口部４０ｂよりも鉛直下方向側に位置する開口側端部３１１に液体が溜まる。すると、開口側端部３１１に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線が促進される。開口部４０ｄについても同じことがいえる。 When the second side 26b of the insulator 22 is directed in the vertically upward direction, the opening 40b is located on the vertically upward side of the intersection 50 existing at the opening side end portion 311. When the liquid enters the opening 40b in this arrangement, the liquid collects at the opening side end 311 located on the vertically downward side of the opening 40b. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 311. Therefore, deterioration of the deterioration promoting portion 280, here, disconnection is promoted. The same can be said for the opening 40d.

［１．６．第６具体例］
図６を用いて第６具体例の劣化検出用プリント配線基板２０を説明する。なお、第６具体例の劣化検出用プリント配線基板２０において、第５具体例の劣化検出用プリント配線基板２０と同じ構成には同一の符号を付す。 [1.6. Sixth Specific Example]
The deterioration detection printed wiring board 20 of the sixth specific example will be described with reference to FIG. In the deterioration detection printed wiring board 20 of the sixth specific example, the same reference numerals are given to the same configurations as the deterioration detection printed wiring board 20 of the fifth specific example.

第６具体例の劣化検出用プリント配線基板２０の構成は、開口部４０の形状を除き、第５具体例の劣化検出用プリント配線基板２０の構成と一致する。第６具体例において、それぞれの開口部４０は、内角が直角でない平行四辺形である。それぞれの開口側端部３００は、劣化促進部分２８０の軸線に対して直角でない角度で交差する。 The configuration of the deterioration detection printed wiring board 20 of the sixth specific example is the same as the configuration of the deterioration detection printed wiring board 20 of the fifth specific example except for the shape of the opening 40. In the sixth embodiment, each opening 40 is a parallelogram whose internal angles are not right angles. The respective opening side end portions 300 intersect at an angle not perpendicular to the axis of the deterioration promoting portion 280.

［１．７．第７具体例］
図７を用いて第７具体例の劣化検出用プリント配線基板２０を説明する。なお、第７具体例の劣化検出用プリント配線基板２０において、第５具体例の劣化検出用プリント配線基板２０と同じ構成には同一の符号を付す。 [1.7. Seventh Specific Example]
The deterioration detection printed wiring board 20 of the 7th specific example will be described with reference to FIG. 7. In the deterioration detection printed wiring board 20 of the 7th specific example, the same reference numerals are given to the same configurations as the deterioration detection printed wiring board 20 of the 5th specific example.

第７具体例の劣化検出用プリント配線基板２０の構成は、開口部４０の形状を除き、第５具体例の劣化検出用プリント配線基板２０の構成と一致する。第７具体例において、それぞれの開口部４０の形状は円形である。 The configuration of the deterioration detection printed wiring board 20 of the seventh specific example is the same as the configuration of the deterioration detection printed wiring board 20 of the fifth specific example, except for the shape of the opening 40. In the seventh specific example, the shape of each opening 40 is circular.

［２．第２実施形態］
図８を用いて第２実施形態におけるプリント基板１０および劣化検出用プリント配線基板２０の構成を説明する。なお、第２実施形態において、第１実施形態と同じ構成には同一の符号を付す。第１実施形態が配線２８の断線を検出するものであるのに対して、第２実施形態は配線２８の断線およびイオンマイグレーションによる短絡を検出するものである。 [2. Second Embodiment]
The configuration of the printed circuit board 10 and the deterioration detection printed wiring board 20 in the second embodiment will be described with reference to FIG. In the second embodiment, the same reference numerals are given to the same configurations as those in the first embodiment. The first embodiment detects the disconnection of the wiring 28, while the second embodiment detects the disconnection of the wiring 28 and the short circuit due to ion migration.

第２実施形態において、プリント基板１０に形成される配線１８は、第１ライン１８ａと第２ライン１８ｂを有する。第１ライン１８ａには、劣化検出用プリント配線基板２０の電圧ライン２８ａ（図９、図１０）と抵抗Ｒとが直列に接続される。第２ライン１８ｂには、劣化検出用プリント配線基板２０のグランドライン２８ｂ（図９、図１０）が接続される。第２ライン１８ｂは接地される。 In the second embodiment, the wiring 18 formed on the printed circuit board 10 has a first line 18a and a second line 18b. A voltage line 28a (FIGS. 9 and 10) of the deterioration detection printed wiring board 20 and a resistor R are connected in series to the first line 18a. The ground line 28b (FIGS. 9 and 10) of the deterioration detection printed wiring board 20 is connected to the second line 18b. The second line 18b is grounded.

第１ライン１８ａおよび電圧ライン２８ａが断線していない状態、または、電圧ライン２８ａとグランドライン２８ｂが短絡していな状態で劣化検出回路１６の一端に所定電圧が印加されると、電圧センサＶは抵抗電圧を検出する。対して、第１ライン１８ａまたは電圧ライン２８ａが断線している状態、または、電圧ライン２８ａとグランドライン２８ｂが短絡している状態で劣化検出回路１６の一端に所定電圧が印加されると、電圧センサＶはゼロまたは抵抗電圧未満の電圧を検出する。第１ライン１８ａ、電圧ライン２８ａ、グランドライン２８ｂは、プリント基板１０に形成される電子回路の配線よりも細い。このため、第１ライン１８ａ、電圧ライン２８ａ、グランドライン２８ｂの劣化（断線、短絡）は、プリント基板１０に形成される電子回路の配線の劣化（断線、短絡）よりも早く発生する。電圧センサＶの検出値が抵抗電圧未満ということは、第１ライン１８ａおよび電圧ライン２８ａの断線、または、電圧ライン２８ａとグランドライン２８ｂの短絡が発生する程度まで、プリント基板１０に形成される電子回路の劣化が進行していることを意味する。つまり、電圧センサＶの検出値は、プリント基板１０に形成される電子回路の配線の劣化度合い（断線状態または短絡状態）を示す指標となる。 When a predetermined voltage is applied to one end of the deterioration detection circuit 16 in a state where the first line 18a and the voltage line 28a are not disconnected or the voltage line 28a and the ground line 28b are not short-circuited, the voltage sensor V causes the voltage sensor V. Detect resistance voltage. On the other hand, when a predetermined voltage is applied to one end of the deterioration detection circuit 16 in a state where the first line 18a or the voltage line 28a is disconnected or the voltage line 28a and the ground line 28b are short-circuited, a voltage is applied. Sensor V detects a voltage below zero or resistance voltage. The first line 18a, the voltage line 28a, and the ground line 28b are thinner than the wiring of the electronic circuit formed on the printed circuit board 10. Therefore, the deterioration (disconnection, short circuit) of the first line 18a, the voltage line 28a, and the ground line 28b occurs earlier than the deterioration (disconnection, short circuit) of the wiring of the electronic circuit formed on the printed circuit board 10. If the detected value of the voltage sensor V is less than the resistance voltage, the electrons formed on the printed circuit board 10 to the extent that the first line 18a and the voltage line 28a are disconnected or the voltage line 28a and the ground line 28b are short-circuited. It means that the deterioration of the circuit is progressing. That is, the detected value of the voltage sensor V is an index indicating the degree of deterioration (disconnection state or short circuit state) of the wiring of the electronic circuit formed on the printed circuit board 10.

図９、図１０を用いて劣化検出用プリント配線基板２０を説明する。絶縁体２２の表面（図９）と裏面（図１０）には、２つの配線２８が形成され、更に表面の一部と裏面の一部はソルダレジスト３０で覆われる。 The deterioration detection printed wiring board 20 will be described with reference to FIGS. 9 and 10. Two wirings 28 are formed on the front surface (FIG. 9) and the back surface (FIG. 10) of the insulator 22, and a part of the front surface and a part of the back surface are covered with the solder resist 30.

ソルダレジスト３０には、絶縁体２２の中央部分から放射方向に向かって延伸する複数の開口部４０が形成される。具体的には、絶縁体２２の中央部分から＋ｘ方向、−ｘ方向、＋ｙ方向、−ｙ方向に延伸する４つの開口部４０が形成される。更に、絶縁体２２の中央部分から＋ｘ方向と＋ｙ方向の間の方向、＋ｘ方向と−ｙ方向の間の方向、−ｘ方向と＋ｙ方向の間の方向、−ｘ方向と−ｙ方向の間の方向に延伸する４つの開口部４０が形成される。 The solder resist 30 is formed with a plurality of openings 40 extending from the central portion of the insulator 22 in the radial direction. Specifically, four openings 40 extending from the central portion of the insulator 22 in the + x direction, the −x direction, the + y direction, and the −y direction are formed. Further, from the central portion of the insulator 22, the direction between the + x direction and the + y direction, the direction between the + x direction and the −y direction, the direction between the −x direction and the + y direction, and the direction between the −x direction and the −y direction. Four openings 40 extending in the direction of are formed.

上述したように、第２実施形態の劣化検出用プリント配線基板２０は、表面から裏面にかけて形成される２つの配線２８を有する。一方の配線２８は電圧ライン２８ａ（第１配線）であり、他方の配線２８はグランドライン２８ｂ（第２配線）である。 As described above, the deterioration detection printed wiring board 20 of the second embodiment has two wirings 28 formed from the front surface to the back surface. One wiring 28 is a voltage line 28a (first wiring), and the other wiring 28 is a ground line 28b (second wiring).

図９に示されるように、絶縁体２２の表面側には、電圧ライン２８ａの一端に位置する入力端子Ｖ１が形成される。図８に示されるように、入力端子Ｖ１は、第１ライン１８ａの第１端子１８１に接続される。図１０に示されるように、絶縁体２２の裏面側には、電圧ライン２８ａの他端に位置する出力端子Ｖ２が形成される。図８に示されるように、出力端子Ｖ２は、第１ライン１８ａの第２端子１８２に接続される。表面側の電圧ライン２８ａと裏面側の電圧ライン２８ａは、絶縁体２２の表面側から裏面側に貫通するスルーホール６０ａで互いに接続される。 As shown in FIG. 9, an input terminal V1 located at one end of the voltage line 28a is formed on the surface side of the insulator 22. As shown in FIG. 8, the input terminal V1 is connected to the first terminal 181 of the first line 18a. As shown in FIG. 10, an output terminal V2 located at the other end of the voltage line 28a is formed on the back surface side of the insulator 22. As shown in FIG. 8, the output terminal V2 is connected to the second terminal 182 of the first line 18a. The voltage line 28a on the front surface side and the voltage line 28a on the back surface side are connected to each other by a through hole 60a penetrating from the front surface side to the back surface side of the insulator 22.

図９に示されるように、絶縁体２２の表面側には、グランドライン２８ｂの一端に位置するグランド端子Ｇ２が形成される。図８に示されるように、グランド端子Ｇ２は、第２ライン１８ｂの第２グランド端子１８４に接続される。図１０に示されるように、絶縁体２２の裏面側には、グランドライン２８ｂの他端に位置するグランド端子Ｇ１が形成される。図８に示されるように、グランド端子Ｇ１は、第２ライン１８ｂの第１グランド端子１８３に接続される。表面側のグランドライン２８ｂと裏面側のグランドライン２８ｂは、絶縁体２２の表面側から裏面側に貫通するスルーホール６０ｂで互いに接続される。 As shown in FIG. 9, a ground terminal G2 located at one end of the ground line 28b is formed on the surface side of the insulator 22. As shown in FIG. 8, the ground terminal G2 is connected to the second ground terminal 184 of the second line 18b. As shown in FIG. 10, a ground terminal G1 located at the other end of the ground line 28b is formed on the back surface side of the insulator 22. As shown in FIG. 8, the ground terminal G1 is connected to the first ground terminal 183 of the second line 18b. The ground line 28b on the front surface side and the ground line 28b on the back surface side are connected to each other by a through hole 60b penetrating from the front surface side to the back surface side of the insulator 22.

図９に示されるように、絶縁体２２の表面側の平面視において、電圧ライン２８ａとグランドライン２８ｂは、絶縁体２２の略中央部分を中心にして交互にかつ同一方向に巻かれる螺線形状である。このため、絶縁体２２の中央部分から放射方向に向かって、螺線形状の電圧ライン２８ａとグランドライン２８ｂとが交互に並ぶ。電圧ライン２８ａとグランドライン２８ｂは互いに並行し、絶縁体２２の縁部分から中心部分（または中心部分から縁部分）に向かって延伸する。隣り合う電圧ライン２８ａとグランドライン２８ｂとの間の距離は、所定距離以下である。この所定距離は、電圧ライン２８ａとグランドライン２８ｂにイオンマイグレーションによる短絡が発生する距離である。この所定距離は、配線１８の太さに応じて適宜設定されてもよいし、一定であってもよい。 As shown in FIG. 9, in a plan view of the surface side of the insulator 22, the voltage line 28a and the ground line 28b are spirally wound alternately and in the same direction around the substantially central portion of the insulator 22. Is. Therefore, the spiral voltage lines 28a and the ground lines 28b are alternately arranged in the radial direction from the central portion of the insulator 22. The voltage line 28a and the ground line 28b are parallel to each other and extend from the edge portion of the insulator 22 toward the center portion (or from the center portion to the edge portion). The distance between the adjacent voltage lines 28a and the ground line 28b is not more than a predetermined distance. This predetermined distance is a distance at which a short circuit occurs between the voltage line 28a and the ground line 28b due to ion migration. This predetermined distance may be appropriately set according to the thickness of the wiring 18, or may be constant.

電圧ライン２８ａは、ソルダレジスト３０で覆われる被覆部分２８２ａと、開口部４０で大気中に露出される劣化促進部分２８０ａと、を交互に有する。被覆部分２８２ａと劣化促進部分２８０ａは連続する。同様に、グランドライン２８ｂは、ソルダレジスト３０で覆われる被覆部分２８２ｂと、開口部４０で大気中に露出される劣化促進部分２８０ｂと、を交互に有する。被覆部分２８２ｂと劣化促進部分２８０ｂは連続する。 The voltage line 28a alternately has a covering portion 282a covered with the solder resist 30 and a deterioration promoting portion 280a exposed to the atmosphere at the opening 40. The covering portion 282a and the deterioration promoting portion 280a are continuous. Similarly, the ground line 28b alternately has a covering portion 282b covered with a solder resist 30 and a deterioration promoting portion 280b exposed to the atmosphere at the opening 40. The covering portion 282b and the deterioration promoting portion 280b are continuous.

それぞれの開口部４０において、ソルダレジスト３０の開口側端部３００には、電圧ライン２８ａと交差する交差部５０ａとグランドライン２８ｂと交差する交差部５０ｂが存在する。 In each opening 40, at the opening side end 300 of the solder resist 30, there is an intersection 50a that intersects the voltage line 28a and an intersection 50b that intersects the ground line 28b.

絶縁体２２の裏面側の開口部４０および配線２８も表面側の開口部４０および配線２８と同じ構成であるため、その説明を省略する。 Since the opening 40 and the wiring 28 on the back surface side of the insulator 22 have the same configuration as the opening 40 and the wiring 28 on the front surface side, the description thereof will be omitted.

絶縁体２２の第１辺２４ａ、２４ｂ、第２辺２６ａ、２６ｂのいずれかが鉛直上方向に向けられると、いずれかの開口部４０は、その開口部４０内のいずれかの交差部５０よりも鉛直上方向側に位置する。開口部４０に液体が浸入すると、開口部４０よりも鉛直下方向側に位置する開口側端部３００に液体が溜まる。すると、開口側端部３００に存在する交差部５０の位置で、液体が劣化促進部分２８０に付着する。このため劣化促進部分２８０の劣化、ここでは断線またはイオンマイグレーションによる短絡が促進される。 When any of the first side 24a, 24b and the second side 26a, 26b of the insulator 22 is directed in the vertically upward direction, any opening 40 is formed from any intersection 50 in the opening 40. Is also located on the vertically upward side. When the liquid enters the opening 40, the liquid collects in the opening side end portion 300 located on the vertically downward side of the opening 40. Then, the liquid adheres to the deterioration promoting portion 280 at the position of the intersection 50 existing at the opening side end portion 300. Therefore, deterioration of the deterioration promoting portion 280, in which a short circuit due to disconnection or ion migration is promoted.

［３．実施形態から得られる発明］
上記実施形態から把握しうる発明について、以下に記載する。 [3. Invention obtained from the embodiment]
The inventions that can be grasped from the above embodiments are described below.

本発明の態様は、板状の絶縁体２２と、前記絶縁体２２の片面に形成される配線２８と、前記片面および前記配線２８を覆うとともに前記配線２８の一部を大気中に露出させる開口部４０が形成されるソルダレジスト３０と、を有する劣化検出用プリント配線基板２０であって、前記ソルダレジスト３０には、連続する前記配線２８のうち複数の部分（劣化促進部分２８０）を露出させる前記開口部４０（図２〜図４）、または、連続する前記配線２８のうち複数の前記部分（劣化促進部分２８０、２８０ａ、２８０ｂ）を露出させる複数の前記開口部４０（図５〜図７、図９、図１０）が形成され、前記片面の平面視において、前記開口部４０に臨む前記ソルダレジスト３０の端部（開口側端部３００）に、前記配線２８と交差する交差部５０、５０ａ、５０ｂが複数存在し、前記絶縁体２２の外周部（第１辺２４ａ、２４ｂ、第２辺２６ａ、２６ｂ）のどの箇所が鉛直上方向に向けられても、いずれかの前記交差部５０、５０ａ、５０ｂの位置において、当該交差部５０、５０ａ、５０ｂよりも前記開口部４０が鉛直上方向側に位置する。 Aspects of the present invention include a plate-shaped insulator 22, a wiring 28 formed on one side of the insulator 22, and an opening that covers the one side and the wiring 28 and exposes a part of the wiring 28 to the atmosphere. A deterioration detection printed wiring substrate 20 having a solder resist 30 on which a portion 40 is formed, and a plurality of portions (deterioration promoting portion 280) of the continuous wiring 28 are exposed to the solder resist 30. The openings 40 (FIGS. 2 to 4) or the plurality of openings 40 (FIGS. 5 to 7) that expose a plurality of the portions (deterioration promoting portions 280, 280a, 280b) of the continuous wiring 28. , FIG. 9 and FIG. 10) are formed, and in the plan view of the one side, the intersection 50 intersecting with the wiring 28 at the end (opening side end 300) of the solder resist 30 facing the opening 40. A plurality of 50a and 50b exist, and no matter which portion of the outer peripheral portion (first side 24a, 24b, second side 26a, 26b) of the insulator 22 is directed in the vertically upward direction, any one of the intersections 50 , 50a, 50b, the opening 40 is located on the vertically upward side of the intersections 50, 50a, 50b.

上記構成においては、劣化検出用プリント配線基板２０が取り付けられたプリント基板１０が立てられたとしても、劣化検出用プリント配線基板２０のいずれかの交差部５０、５０ａ、５０ｂの位置において、その交差部５０、５０ａ、５０ｂよりも開口部４０が鉛直上方向側に位置する。このため、開口部４０内の液体は、その開口部４０の鉛直下方向側に位置する交差部５０、５０ａ、５０ｂ、すなわち平面を鉛直上方向に向ける交差部５０、５０ａ、５０ｂに残留しやすくなる。従って、上記構成によれば、プリント基板１０の姿勢に関わらず、液体と配線２８との接触機会を増やすことができ、配線２８の劣化を促進することができる。 In the above configuration, even if the printed circuit board 10 to which the deterioration detection printed wiring board 20 is attached is erected, the intersections at any of the intersections 50, 50a, and 50b of the deterioration detection printed wiring board 20. The opening 40 is located on the vertically upward side of the portions 50, 50a, and 50b. Therefore, the liquid in the opening 40 tends to remain at the intersections 50, 50a, 50b located on the vertically downward side of the opening 40, that is, the intersections 50, 50a, 50b with the plane facing vertically upward. Become. Therefore, according to the above configuration, the chance of contact between the liquid and the wiring 28 can be increased regardless of the posture of the printed circuit board 10, and the deterioration of the wiring 28 can be promoted.

劣化検出用プリント配線基板２０において、前記配線２８として第１配線（電圧ライン２８ａ）と第２配線（グランドライン２８ｂ）を有し、前記第１配線（電圧ライン２８ａ）と前記第２配線（グランドライン２８ｂ）は同一の前記開口部４０により大気中に露出され、前記交差部５０ａ、５０ｂで前記第１配線（電圧ライン２８ａ）と前記第２配線（グランドライン２８ｂ）との間の距離は所定距離以下であり、前記所定距離は、前記第１配線（電圧ライン２８ａ）と前記第２配線（グランドライン２８ｂ）にイオンマイグレーションによる短絡が発生する距離である。 The deterioration detection printed wiring board 20 has a first wiring (voltage line 28a) and a second wiring (ground line 28b) as the wiring 28, and the first wiring (voltage line 28a) and the second wiring (ground). The line 28b) is exposed to the atmosphere through the same opening 40, and the distance between the first wiring (voltage line 28a) and the second wiring (ground line 28b) is predetermined at the intersections 50a and 50b. It is equal to or less than the distance, and the predetermined distance is a distance at which a short circuit occurs due to ion migration between the first wiring (voltage line 28a) and the second wiring (ground line 28b).

上記構成によれば、第１配線（電圧ライン２８ａ）または第２配線（グランドライン２８ｂ）の断線を促進することができるだけでなく、第１配線（電圧ライン２８ａ）と第２配線（グランドライン２８ｂ）の短絡を促進することができる。 According to the above configuration, not only can the disconnection of the first wiring (voltage line 28a) or the second wiring (ground line 28b) be promoted, but also the first wiring (voltage line 28a) and the second wiring (ground line 28b) can be promoted. ) Can be promoted.

劣化検出用プリント配線基板２０において、前記開口部４０で前記第１配線（電圧ライン２８ａ）と前記第２配線（グランドライン２８ｂ）は互いに並行する部分を有する。 In the deterioration detection printed wiring board 20, the first wiring (voltage line 28a) and the second wiring (ground line 28b) have a portion parallel to each other in the opening 40.

劣化検出用プリント配線基板２０において、前記第１配線（電圧ライン２８ａ）と前記第２配線（グランドライン２８ｂ）は、交互にかつ同一方向に巻かれる螺旋形状である。 In the deterioration detection printed wiring board 20, the first wiring (voltage line 28a) and the second wiring (ground line 28b) have a spiral shape in which they are wound alternately and in the same direction.

なお、本発明に係る劣化検出用プリント配線基板は、上述の実施形態に限らず、本発明の要旨を逸脱することなく、種々の構成を採り得ることはもちろんである。 It should be noted that the deterioration detection printed wiring board according to the present invention is not limited to the above-described embodiment, and of course, various configurations can be adopted without deviating from the gist of the present invention.

２０…劣化検出用プリント配線基板 ２２…絶縁体
２４ａ、２４ｂ…第１辺（外周部） ２６ａ、２６ｂ…第２辺（外周部）
２８…配線 ２８ａ…電圧ライン（第１配線）
２８ｂ…グランドライン（第２配線） ３０…ソルダレジスト
４０、４０ａ〜４０ｄ…開口部 ５０、５０ａ、５０ｂ…交差部
２８０、２８０ａ、２８０ｂ…劣化促進部分（部分）
３００〜３１６…開口側端部（端部） 20 ... Printed circuit board for deterioration detection 22 ... Insulators 24a, 24b ... First side (outer peripheral portion) 26a, 26b ... Second side (outer peripheral portion)
28 ... Wiring 28a ... Voltage line (first wiring)
28b ... Ground line (second wiring) 30 ... Solder resist 40, 40a to 40d ... Opening 50, 50a, 50b ... Intersection 280, 280a, 280b ... Deterioration promoting part (part)
300 to 316 ... Opening side end (end)

Claims (4)

板状の絶縁体と、前記絶縁体の片面に形成される配線と、前記片面および前記配線を覆うとともに前記配線の一部を大気中に露出させる開口部が形成されるソルダレジストと、を有する劣化検出用プリント配線基板であって、
前記ソルダレジストには、連続する前記配線のうち複数の部分を露出させる前記開口部、または、連続する前記配線のうち複数の前記部分を露出させる複数の前記開口部が形成され、
前記片面の平面視において、前記開口部に臨む前記ソルダレジストの端部に、前記配線と交差する交差部が複数存在し、
前記絶縁体の外周部のどの箇所が鉛直上方向に向けられても、いずれかの前記交差部の位置において、当該交差部よりも前記開口部が鉛直上方向側に位置する、劣化検出用プリント配線基板。 It has a plate-shaped insulator, wiring formed on one side of the insulator, and a solder resist in which an opening is formed that covers the one side and the wiring and exposes a part of the wiring to the atmosphere. It is a printed wiring board for deterioration detection.
The solder resist is formed with the openings that expose a plurality of portions of the continuous wiring, or the plurality of openings that expose a plurality of the portions of the continuous wiring.
In the plan view of the one side, a plurality of intersections intersecting with the wiring are present at the end of the solder resist facing the opening.
Deterioration detection print in which the opening is located vertically upward with respect to the intersection at any of the intersections, regardless of which part of the outer peripheral portion of the insulator is directed vertically upward. Wiring board. 請求項１に記載の劣化検出用プリント配線基板であって、
前記配線として第１配線と第２配線を有し、
前記第１配線と前記第２配線は同一の前記開口部により大気中に露出され、
前記交差部で前記第１配線と前記第２配線との間の距離は所定距離以下であり、
前記所定距離は、前記第１配線と前記第２配線にイオンマイグレーションによる短絡が発生する距離である、劣化検出用プリント配線基板。 The printed wiring board for deterioration detection according to claim 1.
It has a first wiring and a second wiring as the wiring.
The first wiring and the second wiring are exposed to the atmosphere by the same opening.
The distance between the first wiring and the second wiring at the intersection is not more than a predetermined distance.
The predetermined distance is a distance at which a short circuit occurs between the first wiring and the second wiring due to ion migration, which is a deterioration detection printed wiring board. 請求項２に記載の劣化検出用プリント配線基板であって、
前記開口部で前記第１配線と前記第２配線は互いに並行する部分を有する、劣化検出用プリント配線基板。 The printed wiring board for deterioration detection according to claim 2.
A printed wiring board for deterioration detection having a portion in which the first wiring and the second wiring are parallel to each other at the opening. 請求項３に記載の劣化検出用プリント配線基板であって、
前記第１配線と前記第２配線は、交互にかつ同一方向に巻かれる螺旋形状である、劣化検出用プリント配線基板。 The printed wiring board for deterioration detection according to claim 3.
A printed wiring board for deterioration detection, wherein the first wiring and the second wiring have a spiral shape in which they are wound alternately and in the same direction.
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JPH03158748A (en) * 1989-11-15 1991-07-08 Toshiba Corp Corrosion monitoring device for printed wiring board
JPH04206648A (en) * 1990-11-30 1992-07-28 Hitachi Chem Co Ltd Evaluating and testing method for generation of ion migration of insulating material for printed circuit board
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