JP2020520551A - 対象物の表面を処理するための装置 - Google Patents

対象物の表面を処理するための装置 Download PDF

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Publication number
JP2020520551A
JP2020520551A JP2019555804A JP2019555804A JP2020520551A JP 2020520551 A JP2020520551 A JP 2020520551A JP 2019555804 A JP2019555804 A JP 2019555804A JP 2019555804 A JP2019555804 A JP 2019555804A JP 2020520551 A JP2020520551 A JP 2020520551A
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JP
Japan
Prior art keywords
irradiation
working fluid
processing chamber
unit
unit according
Prior art date
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Pending
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JP2019555804A
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English (en)
Japanese (ja)
Inventor
スタルツマン、オリバー
シエッティンガー、トーマス
ヤーン−クアダー、ウーヴェ
シュミット、ピーター
Original Assignee
イスト メッツ ゲーエムベーハー
イスト メッツ ゲーエムベーハー
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Publication date
Application filed by イスト メッツ ゲーエムベーハー, イスト メッツ ゲーエムベーハー filed Critical イスト メッツ ゲーエムベーハー
Publication of JP2020520551A publication Critical patent/JP2020520551A/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Plasma & Fusion (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2019555804A 2017-04-13 2018-04-10 対象物の表面を処理するための装置 Pending JP2020520551A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102017108076.7 2017-04-13
DE102017108076.7A DE102017108076A1 (de) 2017-04-13 2017-04-13 Vorrichtung zur Oberflächenbehandlung von Objekten
PCT/EP2018/059139 WO2018189164A1 (de) 2017-04-13 2018-04-10 Vorrichtung zur oberflächenbehandlung von objekten

Publications (1)

Publication Number Publication Date
JP2020520551A true JP2020520551A (ja) 2020-07-09

Family

ID=61972117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019555804A Pending JP2020520551A (ja) 2017-04-13 2018-04-10 対象物の表面を処理するための装置

Country Status (6)

Country Link
EP (1) EP3610329A1 (de)
JP (1) JP2020520551A (de)
KR (1) KR20190137877A (de)
CN (1) CN110637257A (de)
DE (1) DE102017108076A1 (de)
WO (1) WO2018189164A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111359994B (zh) * 2020-03-16 2021-06-01 Tcl华星光电技术有限公司 清洗装置
CN114682569A (zh) * 2022-02-28 2022-07-01 歌尔股份有限公司 Uv清洗验证设备及清洗验证方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002057133A (ja) * 2000-08-15 2002-02-22 Tokyo Electron Ltd 基板処理装置
JPWO2005059976A1 (ja) * 2003-12-18 2007-07-12 東京エレクトロン株式会社 基板処理方法、基板処理装置およびコンピュータ読み取り可能な記録媒体
JP4337547B2 (ja) * 2003-12-26 2009-09-30 株式会社ジーエス・ユアサコーポレーション 紫外光洗浄装置および紫外光洗浄装置用紫外線ランプ
WO2006010110A2 (en) * 2004-07-09 2006-01-26 Akrion Technologies, Inc. Reduced pressure irradiation processing method and apparatus
JP4994074B2 (ja) * 2006-04-20 2012-08-08 東京エレクトロン株式会社 基板洗浄装置，基板洗浄方法，基板処理装置
JP5895929B2 (ja) * 2013-12-25 2016-03-30 ウシオ電機株式会社 光照射装置
JP5994821B2 (ja) * 2014-06-13 2016-09-21 ウシオ電機株式会社 デスミア処理装置およびデスミア処理方法
CN104858193B (zh) * 2015-06-12 2017-05-03 深圳市华星光电技术有限公司 玻璃基板的紫外光清洗装置
CN105445978A (zh) * 2016-01-27 2016-03-30 武汉华星光电技术有限公司 Tft阵列基板检测方法
CN105700206B (zh) * 2016-02-16 2019-12-06 京东方科技集团股份有限公司 一种基板表面信息检测装置以及方法

Also Published As

Publication number Publication date
CN110637257A (zh) 2019-12-31
WO2018189164A1 (de) 2018-10-18
EP3610329A1 (de) 2020-02-19
KR20190137877A (ko) 2019-12-11
DE102017108076A1 (de) 2018-10-18

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