JP2020502359A - 堆積装置、フレキシブル基板を被覆する方法、及び被覆を有するフレキシブル基板 - Google Patents
堆積装置、フレキシブル基板を被覆する方法、及び被覆を有するフレキシブル基板 Download PDFInfo
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- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
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- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
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Abstract
Description
明示的には示されていないが、2つ以上の被覆処理デバイスは堆積チャンバ120内に提供されうると理解されたい。例えば、一又は複数の被覆処理デバイスは更に、複数の堆積ユニットのうちの隣り合う2つの堆積ユニット間に提供されうる。したがって、有利には、層スタックの個々の層の高密度化が提供されうる。
Claims (15)
- フレキシブル基板(10)の上に層を堆積するための堆積装置(100)であって、
前記フレキシブル基板(10)を提供するためのストレージスプール(112)を格納する第1のスプールチャンバ(110)と、
前記第1のスプールチャンバ(110)の下流に配置された堆積チャンバ(120)と、
前記堆積チャンバ(120)の下流に配置され、堆積後に前記フレキシブル基板(10)を巻くための巻き取りスプール(152)を格納する第2のスプールチャンバ(150)とを備え、
前記堆積チャンバ(120)は、
少なくとも1つのグラファイトターゲット(125)付き堆積ユニット(124)を含む複数の堆積ユニット(121)を通って、前記フレキシブル基板を誘導するための被覆ドラム(122)と、
前記フレキシブル基板の上に堆積した層を高密度化するように構成された被覆処理デバイス(160)と
を備える、堆積装置(100)。 - 前記被覆処理デバイス(160)は非接触被覆処理デバイスである、請求項1に記載の堆積装置。
- 前記被覆処理デバイス(160)はイオン源、特に、リニアイオン源である、請求項1又は2に記載の堆積装置。
- 前記少なくとも1つの堆積ユニット(124)は直流スパッタ堆積ユニットであるか、前記少なくとも1つの堆積ユニット(124)はパルス式直流スパッタ堆積ユニットである、請求項1から3のいずれか一項に記載の堆積装置。
- 前記グラファイトターゲット(125)は平面ターゲットであるか、前記グラファイトターゲット(125)は回転式ターゲットである、請求項1から4のいずれか一項に記載の堆積装置。
- 前記被覆ドラムは、前記被覆ドラムに電位を印加するためのデバイス(140)に接続され、特に、前記電位は1kHz〜100kHzの周波数を有する中周波電位である、請求項1から5のいずれか一項に記載の堆積装置。
- 前記複数の堆積ユニット(121)は、前記フレキシブル基板(10)に導電性材料を堆積するように構成された少なくとも1つの直流スパッタ源(612)を備え、及び/又は、前記複数の堆積ユニットは、前記フレキシブル基板(10)に非導電性材料を堆積するための少なくとも1つのACスパッタ源(610)を備える、請求項1から6のいずれか一項に記載の堆積装置。
- 前記被覆ドラム(122)は回転軸(123)の周りに回転可能であり、前記被覆ドラム(122)は前記フレキシブル基板(10)に接触するための湾曲した基板支持面を備え、前記湾曲した基板支持面は導電性である、請求項1から7のいずれか一項に記載の堆積装置。
- 前記第1のスプールチャンバから前記第2のスプールチャンバまで、部分的に凸状で部分的に凹状の基板移送経路に沿って、前記フレキシブル基板を移送するように構成されたローラアセンブリを更に備える、請求項1から8のいずれか一項に記載の堆積装置。
- ダイヤモンド様カーボン層を含む積層でフレキシブル基板(10)を被覆するための堆積装置(100)であって、前記装置は、
前記フレキシブル基板(10)を提供するためのストレージスプール(112)を格納する第1のスプールチャンバ(110)と、
前記第1のスプールチャンバ(110)の下流に配置される堆積チャンバ(120)と、
前記堆積チャンバ(120)の下流に配置され、堆積後に前記フレキシブル基板(10)を巻くための巻き取りスプール(152)を格納する第2のスプールチャンバ(150)とを備え、
前記堆積チャンバ(120)は、
カーボン層を堆積するための少なくとも1つのグラファイトターゲット(125)付きスパッタ堆積ユニットを含む複数の堆積ユニット(121)を通って、前記フレキシブル基板を誘導するための被覆ドラム(122)であって、前記被覆ドラムの基板誘導面に電位を印加するように構成されている被覆ドラムと、
前記カーボン層を高密度化するように構成された被覆処理デバイス(160)と
を備える、堆積装置(100)。 - カーボン層を有するフレキシブル基板(10)を被覆する方法であって、
第1のスプールチャンバ(110)に設けられたストレージスプール(112)から前記フレキシブル基板を送り出すこと、
堆積チャンバ(120)に設けられた被覆ドラム(122)を用いて、前記フレキシブル基板を誘導する間に前記フレキシブル基板(10)の上にカーボン層を堆積すること、
被覆処理デバイス(160)を用いて前記カーボン層を高密度化すること、及び、
堆積後に第2のスプールチャンバ(150)に設けられた巻き取りスプール(152)に前記フレキシブル基板を巻くこと、
を含む方法。 - 前記被覆ドラムに電位を印加することであって、特に、1kHz〜100kHzの周波数を有する中周波電位を印加することを更に含む、請求項11に記載の方法。
- 前記カーボン層を高密度化することは、前記カーボン層にイオン衝突を適用することを含む、請求項11又は12に記載の方法。
- 前記カーボン層を堆積することは、グラファイトターゲット付き堆積ユニットを使用することによるスパッタリングを含む、請求項11から13のいずれか一項に記載の方法。
- 一又は複数の層による被覆を有するフレキシブル基板であって、少なくとも1つの層は、請求項11から14のいずれか一項に記載の方法によって作られるカーボン層、特にダイヤモンド様カーボン層である、フレキシブル基板。
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- 2017-11-28 WO PCT/EP2017/080694 patent/WO2019105534A1/en unknown
- 2017-11-28 JP JP2018566403A patent/JP2020502359A/ja active Pending
- 2017-11-28 KR KR1020197001274A patent/KR20190065233A/ko not_active IP Right Cessation
- 2017-11-28 US US16/308,695 patent/US20200318233A1/en not_active Abandoned
- 2017-11-28 EP EP17804899.7A patent/EP3717674A1/en not_active Withdrawn
- 2017-11-28 CN CN201780062678.4A patent/CN110100041A/zh active Pending
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2018
- 2018-11-27 TW TW107142240A patent/TWI728283B/zh not_active IP Right Cessation
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WO2019105534A1 (en) | 2019-06-06 |
TW201934780A (zh) | 2019-09-01 |
US20200318233A1 (en) | 2020-10-08 |
TWI728283B (zh) | 2021-05-21 |
KR20190065233A (ko) | 2019-06-11 |
EP3717674A1 (en) | 2020-10-07 |
CN110100041A (zh) | 2019-08-06 |
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