JP2020203239A - Impact dismantling device - Google Patents

Impact dismantling device Download PDF

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JP2020203239A
JP2020203239A JP2019111233A JP2019111233A JP2020203239A JP 2020203239 A JP2020203239 A JP 2020203239A JP 2019111233 A JP2019111233 A JP 2019111233A JP 2019111233 A JP2019111233 A JP 2019111233A JP 2020203239 A JP2020203239 A JP 2020203239A
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impact
electronic device
dismantling
cutting
striking
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JP7186443B2 (en
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高生 上田
Takao Ueda
高生 上田
茂樹 古屋仲
Shigeki Koyanaka
茂樹 古屋仲
達也 大木
Tatsuya Oki
達也 大木
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National Institute of Advanced Industrial Science and Technology AIST
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
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Abstract

To realize high-speed separation of an electronic substrate, a battery and a casing without imparting excessive crush or excessive impact to an electronic apparatus to be crushed.SOLUTION: An impact dismantling device includes a storage mechanism 1 storing a loaded electronic apparatus and having a discharge port 1a for discharging it to a first conveyor 2, a positioning mechanism 4 for positioning the electronic apparatus on the first conveyor 2 so as to assume a predetermined attitude, and a cutting mechanism 5 for cutting the electronic apparatus being carried in a positioned state into a predetermined width along both long sides of the electronic apparatus. After having its ends of the long sides cut by the cutting mechanism 5, the electronic apparatus is pushed out onto a second conveyor 7 and both of its short sides are cut into a predetermined width by a second positioning mechanism 8 and a second cutting mechanism 9, after which the inside of the electronic apparatus is simultaneously impacted by the impact device 10.SELECTED DRAWING: Figure 3

Description

本発明は、携帯電話等の電子機器を廃棄処分する際に利用される衝撃解体装置に関するものである。 The present invention relates to an impact dismantling device used when disposing of an electronic device such as a mobile phone.

廃棄物として処理されるスマートフォン、携帯電話に代表される電子機器は年々増大しており、産業廃棄物の低減、資源の有効利用の観点から、前段階として、電子基板、バッテリ、筐体などに効率よく解体して大別し、個別に廃棄処分、リサイクル処理を行うことが強く求められている。 The number of electronic devices such as smartphones and mobile phones that are treated as waste is increasing year by year. There is a strong demand for efficient dismantling, broad classification, and individual disposal and recycling.

特許文献１には、刃物により携帯機器の側面を切断して筐体の一部を分離することが示されている。特許文献２には、加熱して筐体の接合強度を低下させた後、ヘラ等の工具により解体することが示されている。 Patent Document 1 discloses that a side surface of a portable device is cut by a knife to separate a part of the housing. Patent Document 2 discloses that after heating to reduce the joint strength of the housing, it is disassembled with a tool such as a spatula.

特願２０１８−１３３７９８号公報Japanese Patent Application No. 2018-133798 特願２０１６−０９４２５１号公報Japanese Patent Application No. 2016-094251

こうした解体装置には、処理時間を１台当たり１秒以下までに短縮することが処理効率の目標とされている一方、電子基板を過破砕するとリサイクルが困難になる。さらには、電子機器に内蔵されているバッテリに過度な衝撃を加えると発火の危険性が高まり、処理の中断を余儀なくされる。
特許文献１や特許文献２に示されている技術では、このように相反する課題を一挙に解決することは困難であった。 For such dismantling devices, the goal of processing efficiency is to reduce the processing time to 1 second or less per unit, but over-crushing the electronic substrate makes recycling difficult. Furthermore, if an excessive impact is applied to the battery built in the electronic device, the risk of ignition increases, and the processing must be interrupted.
With the techniques shown in Patent Document 1 and Patent Document 2, it has been difficult to solve such conflicting problems at once.

そこで、本発明の目的は、一部切断処理された携帯電話等の電子機器に対して、複数箇所に同時に、最適化された衝撃を与えることにより、過破砕や過度な衝撃を与えることなく、電子基板、バッテリ、筐体などの高速分離を実現することにある。 Therefore, an object of the present invention is to apply an optimized impact to a plurality of locations at the same time to an electronic device such as a mobile phone that has been partially cut, without over-crushing or excessive impact. The purpose is to realize high-speed separation of electronic boards, batteries, housings, etc.

この課題を解決するため、本発明の衝撃解体装置は、投入された電子機器を保管して搬送装置に排出する排出口を備えた保管機構と、搬送装置上の電子機器を予め定められた姿勢となるよう位置決めする位置決め機構と、位置決めされた状態で搬送される電子機器の両端辺に沿って予め定められた幅で切断する切断機構と、両端辺切断後に搬送装置から排出される電子機器に対し、切断された端辺の両端部を打撃するよう配置された、少なくとも２個の打撃装置を備えるようにした。 In order to solve this problem, the impact dismantling device of the present invention has a storage mechanism provided with a discharge port for storing the input electronic device and discharging it to the transfer device, and a predetermined posture of the electronic device on the transfer device. A positioning mechanism that positions the two ends, a cutting mechanism that cuts with a predetermined width along both ends of the electronic device transported in the positioned state, and an electronic device discharged from the transport device after cutting both ends. On the other hand, at least two striking devices arranged to strik both ends of the cut end were provided.

本発明によれば、少なくとも２個の打撃装置が切断された端辺の両端部を確実に打撃するので、電子機器１個あたり１秒以内で、過破砕、バッテリ発火等が発生することのない、最適な破砕を実現することができる。 According to the present invention, since at least two striking devices reliably strike both ends of the cut end, over-crushing, battery ignition, etc. do not occur within 1 second per electronic device. , Optimal crushing can be achieved.

図１は、打撃装置としてチェーンを用い、その回転速度を変化させた際の携帯電話端部切断態様毎の破砕評価点を示す表である。FIG. 1 is a table showing crushing evaluation points for each mobile phone end cutting mode when a chain is used as a striking device and its rotation speed is changed. 図２は、両端打撃、一端打撃毎に評価点が２以上の破砕状態となったケースの発生確率を示す表である。FIG. 2 is a table showing the probability of occurrence of a case in which the evaluation points are 2 or more for each hit at both ends and hit at one end. 図３は、本発明の実施例を示す全体図である。FIG. 3 is an overall view showing an embodiment of the present invention.

発明者らは、上記のように相反する課題を同時に解決するため、破砕容器内でチェーンを回転させ、投入された被破砕物を打撃粉砕する、いわゆるクロスフローシュレッダーを用いて様々な実験を行った。
この実験では、ＳＵＳ製でリンク径８ｍｍ、6リンク、長さ２０８ｍｍ（６リンク）、幅２８ｍｍ、重量２４８ｇ（６リンク）のチェーンを使用し、そのリンクひとつ分の質量ｍ（４１．３ｇ）と先端速度ｖにより定まる運動エネルギーＥ（Ｅ＝ｍ・ｖ２／２）を様々に変化させ、運動エネルギー毎の破砕、粉砕状態を分析した。 In order to solve the conflicting problems at the same time as described above, the inventors conducted various experiments using a so-called cross flow shredder, in which a chain is rotated in a crushing container and the charged object to be crushed is crushed. It was.
In this experiment, a chain made of SUS with a link diameter of 8 mm, 6 links, a length of 208 mm (6 links), a width of 28 mm, and a weight of 248 g (6 links) was used, and the mass of one link was m (41.3 g). tip speed v is variously changed kinetic energy E (E = m · v 2 /2) determined by, and analyzed the crushing, grinding condition of each kinetic energy.

さらに、破砕品のサンプルとして、携帯電話の廃棄物を使用し、端部を切断しないケース（Ｍ０）、長辺の端部（端辺）を切断幅３ｍｍで２辺を切断したケース（Ｍ２）、長辺の端部を切断幅３ｍｍ及び短辺の端部を切断幅５ｍｍで４辺切断するケース（Ｍ４）に区分して実験を行った。
ここで、ＩＣ等の電子部品が最も多く搭載された基板を「メイン基板」と呼称し、評価点３を、メイン基板が筐体から分離し、かつバッテリが基板から分離した、最も望ましい破砕状態、評価点２を、メイン基板の１面が露出し、かつバッテリが基板から分離した状態、評価点１を、メイン基板が露出しておらず、あるいは（かつ）バッテリが基板から分離していない状態、評価点０は、メイン基板が破砕又は粉砕した状態と規定した。
なお、評価点２以上であれば、バッテリを傷つけることなく基板から電子部品を剥離させる次工程を実施できるため、工業的に解体成功だと判断できる。 Further, as a sample of the crushed product, a case where the waste of the mobile phone is used and the end is not cut (M0), and a case where the end (end) of the long side is cut with a cutting width of 3 mm (M2). The experiment was carried out by dividing the end of the long side into a case (M4) in which the end of the short side was cut with a cutting width of 3 mm and the end of the short side with a cutting width of 5 mm.
Here, the board on which the most electronic components such as ICs are mounted is called a "main board", and the evaluation point 3 is the most desirable crushed state in which the main board is separated from the housing and the battery is separated from the board. , Evaluation point 2 is in a state where one surface of the main board is exposed and the battery is separated from the board, and evaluation point 1 is in a state where the main board is not exposed or (and) the battery is not separated from the board. The state and the evaluation point 0 were defined as the state in which the main substrate was crushed or crushed.
If the evaluation score is 2 or higher, the next step of peeling the electronic component from the substrate can be performed without damaging the battery, so that it can be judged that the dismantling is industrially successful.

実験結果は、図１の表に示すとおりである。
チェーン回転速度（４）（運動エネルギー６．４Ｊ）以上のケースで、サンプルに切断処理を加えたＭ２、Ｍ４のケースでは、評価点２以上となり、解体に成功した。一方で、サンプルに切断処理を加えないＭ０のケースでは、いかなるチェーン回転速度においても評価点が２未満となり、解体に成功しなかった。
このことから、得られる破砕状態は、チェーン回転速度、チェーン先端速度、運動エネルギーに大きく依存し、運動エネルギーＥが６．４Ｊを超えればよいことが確認できた。しかし、運動エネルギーＥを過度に大きくすると、前述のようにバッテリの破壊の原因となる。 The experimental results are as shown in the table of FIG.
In the case of chain rotation speed (4) (kinetic energy 6.4J) or more, in the case of M2 and M4 in which the sample was cut, the evaluation score was 2 or more, and the dismantling was successful. On the other hand, in the case of M0 in which the sample was not cut, the evaluation score was less than 2 at any chain rotation speed, and the dismantling was not successful.
From this, it was confirmed that the obtained crushed state largely depends on the chain rotation speed, the chain tip speed, and the kinetic energy, and the kinetic energy E should exceed 6.4 J. However, if the kinetic energy E is excessively increased, it causes the destruction of the battery as described above.

そこで、高い評価点が得られた実験例をさらに詳細に分析すると、長辺の端部を切断した（Ｍ２）の場合、その両端に、長辺に直交する方向（短辺に沿う方向）にチェーンが衝突した際、高い評価点が安定的に得られていることが明らかとなった。 Therefore, a more detailed analysis of the experimental example in which a high evaluation score was obtained shows that in the case of cutting the end of the long side (M2), both ends are in the direction orthogonal to the long side (direction along the short side). It became clear that high evaluation points were stably obtained when the chains collided.

これを検証するため、追加実験として、Ｍ２について、チェーン回転速度（３）、すなわち、回転速度が１７１５ｒｐｍでの破砕機内部での挙動をハイスピードカメラにより観測した。
その結果、衝撃の態様が長辺の両端に打撃が加えられるもの（両端打撃）と長辺の一端のみに打撃が加えられるもの（一端打撃）の２種類に大別された。
両端打撃、一端打撃ともに９ケース発生し、評価点が２以上になったケースの発生確率を図２の表に示す。
一端打撃では、評価点の平均が１．３３であったのに対し、両端打撃では、２．４４の評価点が得られ、両端打撃により、高い評価点が安定的に得られることが分かる。 In order to verify this, as an additional experiment, the chain rotation speed (3), that is, the behavior inside the crusher at a rotation speed of 1715 rpm was observed with a high-speed camera for M2.
As a result, the modes of impact were roughly classified into two types: one in which the impact is applied to both ends of the long side (both ends impact) and the other in which the impact is applied to only one end of the long side (one end impact).
The table of FIG. 2 shows the probability of occurrence of 9 cases of both end hits and one end hits, and the evaluation points are 2 or more.
In the case of one-sided striking, the average evaluation score was 1.33, whereas in the case of striking both ends, an evaluation point of 2.44 was obtained, and it can be seen that a high evaluation point was stably obtained by striking both ends.

そこで、両端打撃が確実に発生するよう、本発明の実施例では、衝撃解体装置として、図３に示されるような技術的手段を採用した。
ホッパー等の保管機構１に投入された携帯電話等、廃棄対象の小型電子機器は、排出口１ａを介して、一個ずつ第１コンベヤ２上に排出される。
ロボットアーム等の整列機構３は、小型電子機器の姿勢を画像解析し、小型電子機器の長辺が搬送方向に対し平行となり、第１コンベヤ２の幅方向中心に配置させるよう整列させる。 Therefore, in the embodiment of the present invention, a technical means as shown in FIG. 3 is adopted as the impact dismantling device so that the impact on both ends is surely generated.
Small electronic devices to be discarded, such as mobile phones, which are put into the storage mechanism 1 such as a hopper, are discharged one by one onto the first conveyor 2 through the discharge port 1a.
The alignment mechanism 3 such as the robot arm analyzes the posture of the small electronic device and aligns the small electronic device so that the long side of the small electronic device is parallel to the transport direction and is arranged at the center in the width direction of the first conveyor 2.

次に、第１コンベヤ２と同一速度で移動する第１位置決め機構４が、小型電子機器の両長辺を同時に押圧し、整列された状態に位置決め固定し、内蔵する計測装置により、小型電子機器の短辺長さが計測される。
短辺長さの計測結果に基づき、プレス、グラインダ等の第１切断機構５による切断幅が自動的に調整され、第１位置決め機構４に固定された小型電子機器の長辺側端部を予め定められた幅で同時に切断する。 Next, the first positioning mechanism 4, which moves at the same speed as the first conveyor 2, simultaneously presses both long sides of the small electronic device, positions and fixes them in an aligned state, and uses the built-in measuring device to position and fix the small electronic device. The short side length of is measured.
Based on the measurement result of the short side length, the cutting width by the first cutting mechanism 5 such as a press or a grinder is automatically adjusted, and the long side end of the small electronic device fixed to the first positioning mechanism 4 is preliminarily adjusted. Cut at the same time with the specified width.

両長辺が切断された小型電子機器は、押し出し機構６により、第１コンベヤ２の端部で第２コンベヤ７上に押し出され、第２コンベヤ７と同一速度で移動する第２位置決め機構８が、小型電子機器の両短辺を同時に押圧して位置決め固定し、内蔵する計測装置により、小型電子機器の長辺長さが計測される。
長辺長さの計測結果に基づき、プレス、グラインダ等の第２切断機構９による切断幅が自動的に調整され、第２位置決め機構８に固定された小型電子機器の短辺側端部を予め定められた幅で同時に切断する。 The small electronic device whose long sides are cut is extruded onto the second conveyor 7 at the end of the first conveyor 2 by the extrusion mechanism 6, and the second positioning mechanism 8 moves at the same speed as the second conveyor 7. , Both short sides of the small electronic device are pressed at the same time for positioning and fixing, and the long side length of the small electronic device is measured by the built-in measuring device.
Based on the measurement result of the long side length, the cutting width by the second cutting mechanism 9 such as a press or a grinder is automatically adjusted, and the short side end of the small electronic device fixed to the second positioning mechanism 8 is preliminarily adjusted. Cut at the same time with the specified width.

このように、四辺を予め定められた幅で切断された小型電子機器は、第２位置決め機構８により姿勢が維持された状態で、回転駆動されるチェーン等を利用した打撃装置１０に投入される。
打撃装置１０は、複数のチェーンやハンマー等を回転させて打撃を与えるもので、第２位置決め機構８が計測した小型電子機器の長辺長さに基づいて、少なくとも小型電子機器の両長辺の端部内方において、短辺に沿って打撃を加えるよう、回転軸における位置を調整する調整機構を備えている。 In this way, the small electronic device whose four sides are cut to a predetermined width is put into the striking device 10 using a chain or the like that is rotationally driven while the posture is maintained by the second positioning mechanism 8. ..
The striking device 10 rotates a plurality of chains, hammers, and the like to give an impact, and is based on the long side length of the small electronic device measured by the second positioning mechanism 8, at least on both long sides of the small electronic device. It is equipped with an adjustment mechanism that adjusts the position on the rotation axis so that the impact is applied along the short side at the inside of the end.

以上の構成により、打撃装置１０による打撃は、小型電子機器当たり１秒以下の短時間で行われ、２．４４以上の高い評点を得ることができた。
なお、上記の実施例では、四辺を切断する上記Ｍ４で行ったが、小型電子機器の形態によっては、押し出し機構６、第２コンベヤ７、第２位置決め機構８、第２切断機構９を省略し、両長辺あるいは両短辺が切断された小型電子機器を第１コンベヤ２の終端に設置した直接打撃装置１０に投入しても高い評点を安定して得ることができる。
その他、破砕対象物に応じて、打撃機構、切断された両辺に対する打撃点、位置決め機構、切断機構など、市販の製品から好適なものを選定し種々変更することが可能である。 With the above configuration, the striking by the striking device 10 was performed in a short time of 1 second or less per small electronic device, and a high score of 2.44 or more could be obtained.
In the above embodiment, the above M4 for cutting the four sides was used, but depending on the form of the small electronic device, the extrusion mechanism 6, the second conveyor 7, the second positioning mechanism 8, and the second cutting mechanism 9 may be omitted. Even if a small electronic device having both long sides or both short sides cut off is put into the direct striking device 10 installed at the end of the first conveyor 2, a high score can be stably obtained.
In addition, it is possible to select a suitable one from commercially available products such as a striking mechanism, a striking point for both cut sides, a positioning mechanism, and a cutting mechanism according to the object to be crushed, and make various changes.

以上説明したように、本発明によれば、必要最小限の衝撃で過破砕やバッテリの発火を確実に防止しながら、電子機器１個あたり１秒以内で、効率的な破砕を実現することができるので、衝撃解体装置として広く採用されることが期待できる。 As described above, according to the present invention, it is possible to realize efficient crushing within 1 second per electronic device while surely preventing over-crushing and battery ignition with the minimum necessary impact. Therefore, it can be expected to be widely adopted as an impact dismantling device.

１：保管機構 ２：第１コンベヤ ３：整列機構
４：第１位置決め機構 ５：第１切断機構 ６：押し出し機構
７：第２コンベヤ ８：第２位置決め機構 ９：第２切断機構
１０：打撃装置 1: Storage mechanism 2: 1st conveyor 3: Alignment mechanism 4: 1st positioning mechanism 5: 1st cutting mechanism 6: Extruding mechanism 7: 2nd conveyor 8: 2nd positioning mechanism 9: 2nd cutting mechanism 10: Strike device

Claims (6)

投入された電子機器を保管して搬送装置に排出する排出口を備えた保管機構と、
前記搬送装置上の電子機器を予め定められた姿勢となるよう位置決めする位置決め機構と、
位置決めされた状態で搬送される電子機器の両端辺に沿って予め定められた幅で切断する切断機構と、
両端辺切断後に前記搬送装置から排出される電子機器に対し、切断された端辺の両端部に打撃を加えるよう配置された、少なくとも２個の打撃装置
とを備えた衝撃解体装置。 A storage mechanism equipped with a discharge port that stores the input electronic equipment and discharges it to the transport device,
A positioning mechanism that positions the electronic device on the transfer device so that it has a predetermined posture, and
A cutting mechanism that cuts with a predetermined width along both ends of an electronic device that is transported in a positioned state.
An impact dismantling device including at least two striking devices arranged so as to strike both ends of the cut end edge of an electronic device discharged from the transport device after cutting both ends. 切断する前記端辺を電子機器の長辺とし、前記打撃装置が電子機器の両短辺の両端部に打撃を加えるようにしたことを特徴とする請求項１に記載された衝撃解体装置。 The impact dismantling device according to claim 1, wherein the end side to be cut is a long side of the electronic device, and the striking device applies a striking force to both both short sides of the electronic device. 前記搬送装置、前記位置決め機構、前記切断機構を２系列配置し、電子機器の両長辺、両短辺を予め定められた幅で順次切断し、前記打撃装置に排出するようにしたことを特徴とする請求項１に記載された衝撃解体装置。 The transport device, the positioning mechanism, and the cutting mechanism are arranged in two series, and both long sides and both short sides of the electronic device are sequentially cut with a predetermined width and discharged to the striking device. The impact dismantling device according to claim 1. 前記位置決め機構が、電子機器を位置決めした際に電子機器の端辺間の長さを計測する計測装置を備え、その計測結果に基づいて、前記切断機構の切断幅を自動的に調整するようにしたことを特徴とする請求項１から３のいずれか１項に記載された衝撃解体装置。 The positioning mechanism includes a measuring device that measures the length between the ends of the electronic device when the electronic device is positioned, and the cutting width of the cutting mechanism is automatically adjusted based on the measurement result. The impact dismantling device according to any one of claims 1 to 3, wherein the impact dismantling device is characterized by the above. 前記打撃装置の質量と先端速度により定まる運動エネルギーＥの下限値を、破砕する電子機器の形態に合わせて選定したことを特徴とする請求項１から４のいずれか１項に記載された衝撃解体装置。 The impact dismantling according to any one of claims 1 to 4, wherein the lower limit value of the kinetic energy E determined by the mass and the tip velocity of the striking device is selected according to the form of the electronic device to be crushed. apparatus. 破砕する電子機器が携帯電話の場合、前記運動エネルギーＥの下限値を６．４Ｊとしたことを特徴とする請求項５に記載された衝撃解体装置。
The impact dismantling device according to claim 5, wherein when the electronic device to be crushed is a mobile phone, the lower limit value of the kinetic energy E is set to 6.4 J.
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