JP2020169393A - Surface treatment apparatus - Google Patents

Surface treatment apparatus Download PDF

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JP2020169393A
JP2020169393A JP2020120145A JP2020120145A JP2020169393A JP 2020169393 A JP2020169393 A JP 2020169393A JP 2020120145 A JP2020120145 A JP 2020120145A JP 2020120145 A JP2020120145 A JP 2020120145A JP 2020169393 A JP2020169393 A JP 2020169393A
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work
cathode
surface treatment
cathode rail
treatment apparatus
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勝己 石井
Katsumi Ishii
勝己 石井
重幸 渡邉
Shigeyuki Watanabe
重幸 渡邉
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Almex PE Inc
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/10Agitating of electrolytes; Moving of racks
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08Electroplating with moving electrolyte e.g. jet electroplating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

To provide a surface treatment apparatus in which electrical contact between a jig and a cathode rail can be more surely secured.SOLUTION: A surface treatment apparatus (1) includes: a treatment tank (3) for storing a treatment liquid; at least one anode (20) arranged inside the treatment tank; at least one cathode rail (40): and a plurality of jigs (30) which hold, in a hanging manner, a plurality of workpieces (2) to be immersed in the treatment liquid and are continuously or intermittently conveyed along a conveyance direction while coming in contact with at least the one cathode rail. At least the one cathode rail includes a metallic electrically conductive portion (43) that comes in contact with the plurality of jigs, and non-oily electrically conductive fluid (45) held on the electrically conductive portion.SELECTED DRAWING: Figure 6

Description

本発明は、ワークを間欠搬送する表面処理装置等に関する。 The present invention relates to a surface treatment apparatus or the like that intermittently conveys a work.

メッキ液が収容されたメッキ槽内にてワークを間欠搬送し、各停止位置にて陽極とワーク(陰極)間に電流を供給してワークをメッキするメッキ装置が特許文献1に開示されている。この装置では、メッキ槽と、そのメッキ槽の上流及び/または下流に配置された他の前処理槽及び/又は後処理槽とに、ワークを間欠搬送させる循環式間欠搬送装置(スプロケット及びチェーン)を用いて、ワークを間欠搬送している。 Patent Document 1 discloses a plating apparatus in which a work is intermittently conveyed in a plating tank containing a plating solution and a current is supplied between the anode and the work (cathode) at each stop position to plate the work. .. In this device, a circulation type intermittent transfer device (sprocket and chain) that intermittently transfers a work to a plating tank and other pretreatment tanks and / or posttreatment tanks arranged upstream and / or downstream of the plating tank. The work is intermittently transported using.

特にこのメッキ装置では、メッキ槽内の各停止処位置にてワークに供給された電流量を積算し、制御装置により該積算値がワークの所要電流量に到達すると、昇降装置を駆動して、ワークを支持搬送するハンガーをメッキ槽の上方に移動させ、ワークへの通電を解除している。それにより、例えば多品種少量のワークへの電流量を個別に調整して、メッキ膜厚をワーク毎に個別に調整できる。 In particular, in this plating device, the amount of current supplied to the work is integrated at each stop position in the plating tank, and when the integrated value reaches the required current amount of the work by the control device, the lifting device is driven. The hanger that supports and conveys the work is moved above the plating tank to release the power to the work. Thereby, for example, the amount of current to a high-mix low-volume work can be adjusted individually, and the plating film thickness can be adjusted individually for each work.

特許第2727250号公報Japanese Patent No. 2727250

電解メッキ装置として、メッキ液をワークに向けて吐出するノズル管をメッキ槽内に固定して配置するものが知られている。特許文献1のメッキ装置ではノズル管は使用されてなく、間欠搬送されるメッキ槽内にノズル管を配置した時の課題については認識がない。 As an electrolytic plating apparatus, there is known one in which a nozzle tube for discharging a plating solution toward a work is fixedly arranged in a plating tank. The plating apparatus of Patent Document 1 does not use a nozzle tube, and there is no recognition of the problem when the nozzle tube is arranged in the plating tank that is intermittently conveyed.

さらに特許文献1のメッキ装置は、メッキ槽及び他の処理槽にワークを間欠搬送させる循環式間欠搬送装置(スプロケット及びチェーン)と、個々のワークの治具(ハンガー)を個別に昇降させる昇降機構とを用いているため、装置が大掛かりとなる。また、間欠搬送でも連続搬送でも、スループットはメッキ槽の全長の影響を受けるため、メッキ槽の全長が異なる各種メッキ装置のラインアップを用意する必要がある。その際、循環式間欠搬送装置を含め装置全体を再設計しなければならない。 Further, the plating apparatus of Patent Document 1 includes a circulation type intermittent transfer device (sprocket and chain) that intermittently conveys a work to a plating tank and another processing tank, and an elevating mechanism that individually raises and lowers a jig (hanger) of each work. Since and is used, the device becomes large-scale. Further, since the throughput is affected by the total length of the plating tank in both intermittent transportation and continuous transportation, it is necessary to prepare a lineup of various plating devices having different total lengths of the plating tank. At that time, the entire device including the circulating intermittent transfer device must be redesigned.

本発明の少なくとも一つの態様は、処理槽内にて間欠停止されて処理されるワークに向けて処理液を吐出するノズル管を併用しても、処理されるワークの面内均一性を確保できる間欠搬送式の表面処理装置を提供することを目的とする。 In at least one aspect of the present invention, in-plane uniformity of the workpiece to be processed can be ensured even if a nozzle tube for discharging the treatment liquid toward the workpiece that is intermittently stopped in the processing tank is used in combination. It is an object of the present invention to provide an intermittent transfer type surface treatment apparatus.

本発明の他の少なくとも一つの態様は、共通の構造を有する処理槽ユニットを連結させて、処理槽の全長に亘ってワークへの電流制御及び間欠搬送を可能とした間欠搬送式の表面処理装置を提供することを目的とする。 At least one other aspect of the present invention is an intermittent transfer type surface treatment apparatus in which processing tank units having a common structure are connected to enable current control and intermittent transfer to a work over the entire length of the treatment tank. The purpose is to provide.

(1)本発明の一態様は、
処理液が収容される処理槽と、
前記処理槽内に配置される少なくとも一つの陽極と、
少なくとも1本の陰極レールと、
前記処理液に浸漬される複数のワークをそれぞれ垂下させて保持し、かつ、前記少なくとも1本の陰極レールと接触して前記複数のワークを陰極に設定する複数の治具を、前記処理槽内の複数の停止位置を始点及び/または終点として、間欠的に搬送させる間欠搬送装置と、
前記処理槽内に、平面視で、前記複数の停止位置の各々に停止されるワークと前記少なくとも一つの陽極との間に少なくとも一つ配置され、前記ワークに前記処理液を噴出する複数のノズル管と、
前記複数のノズル管の各々を、間欠停止された対応するワークに対して走査移動させる移動機構と、
を有する表面処理装置に関する。
(1) One aspect of the present invention is
A treatment tank that houses the treatment liquid and
With at least one anode arranged in the processing tank,
With at least one cathode rail
A plurality of jigs that hang and hold the plurality of works immersed in the treatment liquid and set the plurality of works as the cathode in contact with the at least one cathode rail are provided in the treatment tank. An intermittent transport device that intermittently transports the plurality of stop positions as start points and / or end points.
A plurality of nozzles are arranged in the processing tank between the work stopped at each of the plurality of stop positions and the at least one anode in a plan view, and eject the treatment liquid onto the work. With a tube
A moving mechanism that scans and moves each of the plurality of nozzle tubes with respect to the corresponding workpiece that has been intermittently stopped.
The present invention relates to a surface treatment apparatus having.

本発明の一態様によれば、間欠停止されるワークに対して、ワークの停止位置と対応して少なくとも一つ設けられたノズル管を走査移動させることができる。それにより、平面視でワークと陽極との間に位置するノズル管の影となって陽極−陰極間の電界が妨げられる領域が、ノズル管の走査移動に伴って移動する。このため、ノズル管によって電界が妨げられる領域が固定されず、処理されるワークの面内均一性が向上する。 According to one aspect of the present invention, at least one nozzle tube provided corresponding to the stop position of the work can be moved by scanning with respect to the work that is intermittently stopped. As a result, the region where the electric field between the anode and the cathode is obstructed by the shadow of the nozzle tube located between the work and the anode in a plan view moves with the scanning movement of the nozzle tube. Therefore, the region where the electric field is obstructed by the nozzle tube is not fixed, and the in-plane uniformity of the workpiece to be processed is improved.

(2)本発明の一態様(1)では、前記移動機構は、前記複数の停止位置で停止された前記複数のワークの各々の少なくとも水平幅と対応する長さ範囲を少なくとも一回循環して走査するように、前記複数のノズル管を移動させることができる。こうすると、処理されるワークの面内均一性が向上する。特に、ノズル管の初期位置から少なくとも一回循環走査させて初期位置に復帰させることが好ましい。ノズル管の影がワーク面内でほぼ均一化されるからである。 (2) In one aspect (1) of the present invention, the moving mechanism circulates at least once in a length range corresponding to at least the horizontal width of each of the plurality of workpieces stopped at the plurality of stop positions. The plurality of nozzle tubes can be moved so as to scan. In this way, the in-plane uniformity of the workpiece to be processed is improved. In particular, it is preferable to perform circular scanning at least once from the initial position of the nozzle tube to return to the initial position. This is because the shadow of the nozzle tube is almost uniform in the work surface.

(3)本発明の一態様(1)または(2)では、前記複数のノズル管は、前記複数の停止位置で停止された前記複数のワークの各々と対向する各位置に配置された少なくとも2本のノズル管を含み、前記少なくとも2本のノズル管は、垂直方向でそれぞれ異なる位置に前記処理液の複数の噴出口を含むことができる。この少なくとも2本のノズル管をワークに対して走査移動させることで、処理液が直接噴射されないむらが少なくなり、処理されるワークの面内均一性が向上する。 (3) In one aspect (1) or (2) of the present invention, the plurality of nozzle tubes are arranged at at least two positions facing each of the plurality of workpieces stopped at the plurality of stop positions. The nozzle tube includes a book, and the at least two nozzle tubes can include a plurality of spouts of the treatment liquid at different positions in the vertical direction. By scanning and moving the at least two nozzle tubes with respect to the work, unevenness in which the treatment liquid is not directly sprayed is reduced, and the in-plane uniformity of the work to be treated is improved.

(4)本発明の一態様(1)〜(3)では、前記処理槽は、互いに連結される複数の分割処理槽を含み、隣り合う2つの分割処理槽は、前記複数のワークが通過する開口を介して連通され、前記一つの陽極、前記少なくとも1本の陰極レール、前記少なくとも一つのノズル管、前記間欠搬送装置及び前記移動機構は、前記複数の分割処理槽毎にそれぞれ配置され、前記複数の分割処理槽の各々に設けられた前記少なくとも一つの陽極と前記少なくとも1本の陰極レールとは、少なくとも一つの整流器に接続することができる。こうして、装置全体の再設計を要せずに、分割処理槽の数を調整してユーザの要望に適した長さの処理槽を有する間欠搬送式の表面処理装置を容易に構築することができる。 (4) In one aspect (1) to (3) of the present invention, the treatment tank includes a plurality of division treatment tanks connected to each other, and the plurality of workpieces pass through the two adjacent division treatment tanks. The one anode, the at least one cathode rail, the at least one nozzle tube, the intermittent transfer device, and the moving mechanism are communicated with each other through the opening, and are arranged in each of the plurality of division processing tanks. The at least one anode and the at least one cathode rail provided in each of the plurality of division processing tanks can be connected to at least one rectifier. In this way, it is possible to easily construct an intermittent transfer type surface treatment device having a treatment tank having a length suitable for the user's request by adjusting the number of division treatment tanks without requiring redesign of the entire device. ..

(5)本発明の他の態様は、
複数の処理ユニットが連結される表面処理装置であって、
前記複数の処理ユニットの各々は、
処理液が収容される分割処理槽と、
前記分割処理槽内に配置される少なくとも一つの陽極と、
少なくとも1本の陰極レールと、
前記処理液に浸漬される複数のワークをそれぞれ保持し、かつ、前記少なくとも1本の陰極レールと接触して前記複数のワークを陰極に設定する複数の治具を、前記分割処理槽内の複数の停止位置を始点及び/または終点として、間欠的に搬送させる間欠搬送装置と、
前記少なくとも一つの陽極と前記少なくとも1本の陰極レールとに接続された少なくとも一つの整流器と、
を有し、
隣り合う2つの分割処理槽は、前記複数のワークが通過する開口を介して連通している表面処理装置に関する。
(5) Another aspect of the present invention is
A surface treatment device in which multiple treatment units are connected.
Each of the plurality of processing units
A split treatment tank that houses the treatment liquid and
With at least one anode arranged in the split processing tank,
With at least one cathode rail
A plurality of jigs in the split processing tank, each of which holds a plurality of workpieces immersed in the treatment liquid and in contact with the at least one cathode rail to set the plurality of workpieces as cathodes. Intermittent transport device that intermittently transports the stop position as the start point and / or the end point,
With at least one rectifier connected to the at least one anode and the at least one cathode rail,
Have,
The two adjacent division treatment tanks relate to a surface treatment apparatus that communicates through an opening through which the plurality of workpieces pass.

本発明の他の態様によれば、複数の処理ユニットの各々がそれぞれ独立して、分割処理槽、一つの陽極、少なくとも1本の陰極レール、間欠搬送装置及び少なくとも一つの整流器を有している。このため、装置全体の再設計を要せずに、処理ユニットの数を調整してユーザの要望に適した長さの処理槽を有する間欠搬送式の表面処理装置を容易に構築することができる。 According to another aspect of the present invention, each of the plurality of processing units independently has a split processing tank, one anode, at least one cathode rail, an intermittent transfer device, and at least one rectifier. .. Therefore, it is possible to easily construct an intermittent transfer type surface treatment device having a treatment tank having a length suitable for the user's request by adjusting the number of treatment units without requiring redesign of the entire device. ..

(6)本発明の他の態様(5)では、前記間欠搬送装置は、複数の押動片を備えて進退駆動されるプッシャーを含み、前記プッシャーは、前進時に前記複数の押動片が前記複数の治具の複数の被押動片を押動して前記複数のワークを前進させ、後退時に前記複数の押動片と前記複数の被押動片との係合が解除されて初期位置に復帰されても良い。こうして、プッシャーにより複数の治具は分割処理槽内または隣り合う分割処理槽間で同時に一ステップ移動されて間欠搬送される。 (6) In another aspect (5) of the present invention, the intermittent transfer device includes a pusher provided with a plurality of pushing pieces and driven to move forward and backward, and the pusher includes the plurality of pushing pieces when moving forward. The plurality of workpieces are pushed forward by pushing the plurality of pushed pieces of the plurality of jigs, and when the plurality of workpieces are retracted, the engagement between the plurality of pushed pieces and the plurality of pushed pieces is released and the initial position is obtained. It may be returned to. In this way, the pushers simultaneously move the plurality of jigs by one step within the division processing tank or between adjacent division processing tanks and intermittently convey the jigs.

(7)本発明の他の態様(5)では、前記間欠搬送装置は、複数の押動片を備えて進退駆動及び昇降駆動されるプッシャーを含み、前記複数の押動片は、前記プッシャーの昇降動作の一方により前記複数の治具に設けられた複数の被押動片が配置される凹部を含み、前記プッシャーの昇降動作の他方により前記複数の被押動片が前記凹部から離脱され、前記プッシャーは、前進時に前記複数の押動片が前記複数の被押動片を押動して前記複数のワークを前進させ、かつ、前進停止時に前記複数のワークを停止させ、前記複数の被押動片が前記凹部から離脱されている後退時に初期位置に復帰されても良い。こうして、プッシャーにより複数の治具は分割処理槽内または隣り合う分割処理槽間で同時に一ステップ移動されて間欠搬送される。特に、凹部と被押動片との係合により、複数の治具を所定の位置に停止させることができ、より高速な間欠送りが可能となる。 (7) In another aspect (5) of the present invention, the intermittent transfer device includes a pusher provided with a plurality of pushing pieces and driven to move forward and backward and up and down, and the plurality of pushing pieces are of the pusher. One of the elevating movements includes a recess in which a plurality of pushed pieces provided in the plurality of jigs are arranged, and the other of the elevating movements of the pusher separates the plurality of pushed pieces from the recess. In the pusher, the plurality of pushing pieces push the plurality of pushed pieces to advance the plurality of workpieces when moving forward, and the plurality of workpieces are stopped when the moving forward is stopped, and the plurality of working pieces are stopped. When the pushing piece is retracted from the recess, it may be returned to the initial position. In this way, the pushers simultaneously move the plurality of jigs by one step within the division processing tank or between adjacent division processing tanks and intermittently convey the jigs. In particular, by engaging the recess and the pushed piece, a plurality of jigs can be stopped at a predetermined position, and higher-speed intermittent feeding becomes possible.

(8)本発明の一態様(4)及び他の態様(5)〜(7)では、前記少なくとも一つの整流器は、前記複数の停止位置の数と一致する複数の整流器を含み、前記少なくとも1本の陰極レールは、前記複数の停止位置にそれぞれ停止された前記複数の治具にそれぞれ接触され、かつ、電気的に絶縁された複数の導電部を含み、前記複数の導電部がそれぞれ前記複数の整流器に接続されても良い。こうすると、複数のワークの陰極側が絶縁されてそれぞれ複数の整流器に接続されるので、複数のワークに流れる電流を個別に制御することができる。 (8) In one aspect (4) and other aspects (5) to (7) of the present invention, the at least one rectifier includes a plurality of rectifiers matching the number of the plurality of stop positions, and the at least one. The cathode rail includes a plurality of conductive portions that are in contact with the plurality of jigs that are stopped at the plurality of stop positions and are electrically insulated from each other, and the plurality of conductive portions are each such a plurality of conductive portions. It may be connected to the rectifier of. By doing so, the cathode side of the plurality of workpieces is insulated and connected to each of the plurality of rectifiers, so that the current flowing through the plurality of workpieces can be individually controlled.

(9)本発明の他の態様(8)では、前記少なくとも一つの陽極は、前記複数の停止位置の数と一致する複数の陽極を含み、前記複数の陽極がそれぞれ前記複数の整流器に接続される。このように、複数のワークの各々について陰極及び陽極が絶縁されるので、ワーク毎に完全個別給電が可能となる。 (9) In another aspect (8) of the present invention, the at least one anode includes a plurality of anodes matching the number of the plurality of stop positions, and the plurality of anodes are each connected to the plurality of rectifiers. To. In this way, since the cathode and the anode are insulated for each of the plurality of works, it is possible to supply power completely individually for each work.

本発明の実施形態に係る間欠搬送方式のメッキ装置におけるメッキ処理部の概略断面図である。It is schematic cross-sectional view of the plating processing part in the plating apparatus of the intermittent transfer system which concerns on embodiment of this invention. 図1に示すメッキ装置の一つの処理ユニットの概略平面図である。It is a schematic plan view of one processing unit of the plating apparatus shown in FIG. 一つの処理ユニット内に停止されるワークと陽極との位置関係を示す図である。It is a figure which shows the positional relationship between the work which is stopped in one processing unit, and the anode. ワークを搬送する搬送治具の斜視図である。It is a perspective view of the transport jig which transports a work. 陽極、陰極レール上の導電部及び整流器の接続を模式的に示す図である。It is a figure which shows typically the connection of the anode, the conductive part on the cathode rail, and a rectifier. 図6(A)(B)は陰極レールの正面図及び断面図である。6 (A) and 6 (B) are a front view and a cross-sectional view of the cathode rail. 搬送治具の被給電部がセル間で陰極レールの導電部を乗り継ぐ状態を模式的に示す図である。It is a figure which shows typically the state which the powered part of the transfer jig transfers the conductive part of a cathode rail between cells. セル内で往復水平走査移動されるノズル管を示す平面図である。It is a top view which shows the nozzle tube which is moved by the reciprocating horizontal scan in a cell. ノズル管の噴出口の配列ピッチを示す図である。It is a figure which shows the arrangement pitch of the nozzle tube of a nozzle tube. 処理ユニット毎に配置される間欠搬送装置の一例を示す図である。It is a figure which shows an example of the intermittent transfer apparatus arranged for each processing unit. 図11(A)(B)は処理ユニット毎に配置される間欠搬送装置の他の一例を示す図である。11 (A) and 11 (B) are views showing another example of the intermittent transfer device arranged for each processing unit. 間欠搬送方式に適した搬送治具の変形例を示す図である。It is a figure which shows the modification of the transfer jig suitable for an intermittent transfer system. 陰極レールの清掃機能を付加した搬送治具の変形例を示す図である。It is a figure which shows the modification of the transfer jig which added the cleaning function of a cathode rail.

以下、本発明の好適な実施の形態について詳細に説明する。なお、以下に説明する本実施形態は請求の範囲に記載された本発明の内容を不当に限定するものではなく、本実施形態で説明される構成の全てが本発明の解決手段として必須であるとは限らない。 Hereinafter, preferred embodiments of the present invention will be described in detail. It should be noted that the present embodiment described below does not unreasonably limit the content of the present invention described in the claims, and all the configurations described in the present embodiment are indispensable as a means for solving the present invention. Not necessarily.

1.複数の処理ユニット
図1は本実施形態に係る間欠搬送式のメッキ装置(広義には表面処理装置)の断面図である。図1において、このメッキ装置1は、回路基板等のワーク2をメッキするメッキ処理部が複数の処理ユニット3−1〜3−n(nは2以上の整数)を連結して構成される。複数の処理ユニット3−1〜3−nは実質的に同一の構造を有することができる。複数の処理ユニット3−1〜3−nの各々では、少なくとも一つ、図1では例えば4つのワーク2が間欠停止可能である。図1は最大サイズのワーク2を示し、メッキ装置1はその最大サイズ以下のワーク2を処理することができる汎用性を有する。
1. 1. A plurality of processing units FIG. 1 is a cross-sectional view of an intermittent transfer type plating apparatus (in a broad sense, a surface treatment apparatus) according to the present embodiment. In FIG. 1, the plating apparatus 1 is configured by a plating processing unit for plating a work 2 such as a circuit board by connecting a plurality of processing units 3-1 to 3-n (n is an integer of 2 or more). The plurality of processing units 3-1 to 3-n can have substantially the same structure. In each of the plurality of processing units 3-1 to 3-n, at least one, for example, four works 2 in FIG. 1 can be intermittently stopped. FIG. 1 shows a work 2 having a maximum size, and the plating apparatus 1 has versatility capable of processing a work 2 having a maximum size or less.

ワーク2は、後述される間欠搬送装置により、現在の停止位置から次の停止位置に向けて、A方向に順次間欠搬送される。本実施形態では、一つのワーク2は各処理ユニット内にて例えば4か所に停止される。最上流の処理ユニット3−1の上流側には、B方向への下降移動によりワーク2が搬入される搬入ユニット4が連結されても良い。処理ユニット3−1内のワーク2が間欠搬送される時に、搬入ユニット4内のワーク2も間欠搬送されて処理ユニット3−1に移動される。最下流の処理ユニット3−nの下流側には、処理ユニット3−nから水平移動されるワーク2をC方向に上昇させて搬出する搬出ユニット5が連結されても良い。処理ユニット3−n内のワーク2が間欠搬送される前に、搬出ユニット5内のワーク2は上方に搬出される。ただし、搬入ユニット4及び/又は搬出ユニット5は省略しても良い。この場合、処理ユニット3−1の最上流停止位置にワーク2が下降され、処理ユニット3−nの最下流停止位置のワーク2が上昇して搬出される。 The work 2 is sequentially intermittently conveyed in the A direction from the current stop position to the next stop position by the intermittent transfer device described later. In the present embodiment, one work 2 is stopped at, for example, four places in each processing unit. A carry-in unit 4 into which the work 2 is carried in by a downward movement in the B direction may be connected to the upstream side of the most upstream processing unit 3-1. When the work 2 in the processing unit 3-1 is intermittently conveyed, the work 2 in the carry-in unit 4 is also intermittently conveyed and moved to the processing unit 3-1. On the downstream side of the most downstream processing unit 3-n, a unloading unit 5 that raises the work 2 horizontally moved from the processing unit 3-n in the C direction and carries it out may be connected. Before the work 2 in the processing unit 3-n is intermittently conveyed, the work 2 in the carry-out unit 5 is carried out upward. However, the carry-in unit 4 and / or the carry-out unit 5 may be omitted. In this case, the work 2 is lowered to the most upstream stop position of the processing unit 3-1 and the work 2 at the most downstream stop position of the processing unit 3-n is raised and carried out.

図2は、処理ユニット3−2〜3−nと共通の構成を有する処理ユニット3−1の平面図である。処理ユニット3−1は、メッキ液(広義には処理液)が収容される分割処理槽6を有する。ワーク2は分割処理槽6内のメッキ液に浸漬される。分割処理槽6は上方が開口された略箱体であり、上流側及び下流側の隔壁にはそれぞれ開口6A,6Bが設けられ、隣り合うユニット(処理ユニット、搬入ユニットまたは搬出ユニット)との間でワーク2の水平移動が許容される。 FIG. 2 is a plan view of the processing unit 3-1 having the same configuration as the processing units 3-2-3-n. The treatment unit 3-1 has a split treatment tank 6 in which a plating liquid (treatment liquid in a broad sense) is housed. The work 2 is immersed in the plating solution in the split processing tank 6. The split processing tank 6 is a substantially box body having an opening at the upper side, and openings 6A and 6B are provided on the partition walls on the upstream side and the downstream side, respectively, and between adjacent units (processing unit, loading unit or unloading unit). Allows horizontal movement of the work 2.

本実施形態では、処理ユニット3−1内の複数例えば4つの停止位置にあるワーク2の表面及び裏面の少なくとも一方側に、少なくとも一つの陽極20が設けられる。本実施形態では、各停止位置にある各一つのワーク2の表面と対向する陽極20Aと、ワーク2の裏面と対向する陽極20Bが設けられる。陽極20(20A,20B)の各々は、互いに導通された複数の分割陽極を含むことができる。本実施形態では上流側の分割陽極20A1(20B1)と下流側の分割陽極20A2(20B2)に分割されている。陽極20は、3以上に分割された分割陽極を含んでいても良いが、互いに導通されることから一つの陽極とみなすことができる。 In the present embodiment, at least one anode 20 is provided on at least one of the front surface and the back surface of a plurality of, for example, four stop positions in the processing unit 3-1. In the present embodiment, the anode 20A facing the front surface of each work 2 at each stop position and the anode 20B facing the back surface of the work 2 are provided. Each of the anodes 20 (20A, 20B) can include a plurality of split anodes that are conductive to each other. In the present embodiment, the split anode 20A1 (20B1) on the upstream side and the split anode 20A2 (20B2) on the downstream side are divided. The anode 20 may include a divided anode divided into three or more, but it can be regarded as one anode because it conducts with each other.

図3は、処理ユニット3−1に配置される陽極20A1,20A2(20B1,20B2)とワーク2との位置関係を示す正面図である。図3に示すように、ワーク2は搬送治具30に保持される。図2及び図3に示すように、陽極20(20A,20B)の各々は、4つの停止位置にあるワーク2と正対する位置に配置される。要は、図2に示すように、陰極に設定されるワーク2と陽極20との間で均一な電界を形成できればよい。陽極20の形状は問わず、図2及び図3に示す陽極は輪郭が矩形であるが、平面視での輪郭を円形としても良い。陽極は、不溶性陽極であっても可溶性陽極であっても良い。 FIG. 3 is a front view showing the positional relationship between the anodes 20A1, 20A2 (20B1, 20B2) arranged in the processing unit 3-1 and the work 2. As shown in FIG. 3, the work 2 is held by the transfer jig 30. As shown in FIGS. 2 and 3, each of the anodes 20 (20A, 20B) is arranged at positions facing the work 2 at the four stop positions. In short, as shown in FIG. 2, it suffices if a uniform electric field can be formed between the work 2 set on the cathode and the anode 20. Regardless of the shape of the anode 20, the anode shown in FIGS. 2 and 3 has a rectangular contour, but the contour in a plan view may be circular. The anode may be an insoluble anode or a soluble anode.

本実施形態では、一つの処理ユニット3−1を4つのセル11−1〜11−4に区画する遮蔽板23を有することができる。各セル11−1〜11−4内に、平面視でワーク2の両側に陽極20(20A1,20A2,20B1,20B2)が配置される。遮蔽板23は、隣り合うセル間での電界(図2に矢印で示す陽極−陰極間の電界)の影響を遮断するために設けられる。遮蔽板23には、ワーク2が通過する開口23Aが形成される。 In the present embodiment, it is possible to have a shielding plate 23 for partitioning one processing unit 3-1 into four cells 11-1 to 11-4. Anodes 20 (20A1, 20A2, 20B1, 20B2) are arranged on both sides of the work 2 in a plan view in each cell 11-1 to 11-4. The shielding plate 23 is provided to block the influence of the electric field (electric field between the anode and the cathode shown by the arrow in FIG. 2) between adjacent cells. An opening 23A through which the work 2 passes is formed in the shielding plate 23.

2.搬送治具
図4は、搬送治具30の一例を示している。この搬送治具30は、水平アーム部300と、垂直アーム部310と、ワーク保持部320と、被案内部330と、被給電部340と、被押動片350とを有する。水平アーム部300は、間欠搬送方向Aと直交する方向Bに沿って延びる。垂直アーム部310は水平アーム部300に垂下して保持される。ワーク保持部320は垂直アーム部310に固定される。ワーク保持部320は、上部フレーム321と、上部フレーム321に例えば昇降可能に支持される下部フレーム322とを含む。上部フレーム321には、ワーク2の上部をクランプする複数のクランパー323が設けられる。下部フレーム322には、ワーク2の下部をクランプする複数のクランパー324が設けられる。ワーク2には下部のクランパー324により下向きのテンションが付与される。ただし、ワーク2が厚い場合や、ワーク2の下部から給電しない場合には、下部フレーム322及びクランパー324を省略しても良い。
2. Transfer Jig FIG. 4 shows an example of the transfer jig 30. The transfer jig 30 has a horizontal arm portion 300, a vertical arm portion 310, a work holding portion 320, a guided portion 330, a power supply receiving portion 340, and a pushed piece 350. The horizontal arm portion 300 extends along a direction B orthogonal to the intermittent transport direction A. The vertical arm portion 310 hangs down and is held by the horizontal arm portion 300. The work holding portion 320 is fixed to the vertical arm portion 310. The work holding portion 320 includes an upper frame 321 and a lower frame 322 that is supported by the upper frame 321 so as to be able to move up and down, for example. The upper frame 321 is provided with a plurality of clampers 323 for clamping the upper portion of the work 2. The lower frame 322 is provided with a plurality of clampers 324 for clamping the lower portion of the work 2. A downward tension is applied to the work 2 by the lower clamper 324. However, when the work 2 is thick or when power is not supplied from the lower part of the work 2, the lower frame 322 and the clamper 324 may be omitted.

被案内部330は、処理ユニット3−2〜3−nに沿って配置され、例えば処理ユニット3−2〜3−n毎に分割された案内レール(図示せず)に案内されて、搬送治具30を直線案内するものである。被案内部330は、案内レールの天面と転接するローラー331と、案内レールの両側面と転接するローラー332(図4では一方の側面に転接するローラーのみ図示)とを含むことができる。 The guided portion 330 is arranged along the processing unit 3-2-3-n, and is guided by, for example, a guide rail (not shown) divided into each processing unit 3-2-3-n to carry and cure. The tool 30 is guided in a straight line. The guided portion 330 can include a roller 331 that is in contact with the top surface of the guide rail and a roller 332 that is in contact with both side surfaces of the guide rail (in FIG. 4, only the roller that is in contact with one side surface is shown).

被給電部340は、図5及び図6にて説明する陰極レールと接触して、搬送治具30の水平アーム部300、垂直アーム部310、ワーク保持部320を介してワーク2を陰極に設定する。被給電部340は、間欠搬送方向Aに沿って延びる支持アーム341の上流側と下流側とに支持される2つの接触子342,343を含む。接触子342,343は、支持アーム341に平行リンク機構を介して支持され、陰極レールに圧接されるようにバネで付勢される。2つの接触子342,343は、クランパー323,324の少なくとも一方と電気的に接続されることで、ワーク2が陰極に設定される。 The power supply unit 340 comes into contact with the cathode rail described with reference to FIGS. 5 and 6 and sets the work 2 as the cathode via the horizontal arm unit 300, the vertical arm unit 310, and the work holding unit 320 of the transfer jig 30. To do. The power supply unit 340 includes two contacts 342 and 343 supported on the upstream side and the downstream side of the support arm 341 extending along the intermittent transfer direction A. The contacts 342 and 343 are supported by the support arm 341 via a parallel link mechanism and are spring-loaded so as to be pressed against the cathode rail. The two contacts 342 and 343 are electrically connected to at least one of the clampers 323 and 324 to set the work 2 as the cathode.

被押動片350は、例えば垂直アーム部310に固定され、ワーク保持部320の真上の位置にて被押動片350を垂直にして配置される。被押動片350は、後述する間欠搬送装置により図示C方向から押動されて、搬送治具30に間欠搬送力を伝達させるものである。なお、図4に示す搬送治具30には、連続搬送時に使用される被係合部360が設けられており、搬送治具30は間欠搬送にも連続搬送にも兼用できる。 The pushed piece 350 is fixed to, for example, the vertical arm portion 310, and is arranged with the pushed piece 350 vertically at a position directly above the work holding portion 320. The pushed piece 350 is pushed from the direction C shown in the drawing by an intermittent transfer device described later to transmit an intermittent transfer force to the transfer jig 30. The transport jig 30 shown in FIG. 4 is provided with an engaged portion 360 used during continuous transport, and the transport jig 30 can be used for both intermittent transport and continuous transport.

3.陰極レール及び整流器
図5に示すように各処理ユニット3−1〜3−n(図5は2つの処理ユニットのみ図示)は、少なくとも1本の陰極レール40を有する。陰極レール40は、搬送方向Aと平行に複数並列に配置しても良い。この場合、複数の陰極レール40は同じ整流器に接続されても良いし、異なる整流器に接続されて給電部位毎に電流値を独立して制御するようにしても良い。本実施形態では1本の陰極レール40が設けられる。1本の陰極レール40は、好ましくは処理ユニット3−1〜3−n毎に分割された複数の分割陰極レール40−1〜40−n(図5は2つの分割陰極レール40−1,40−2のみを示す)を有し、搬送方向Aで連続するように連結される。分割陰極レール40−1〜40−nの各々は、図5及び図6(A)に示すように、絶縁レール41上にて間隔(非導電部)42をあけて、ワーク2が停止される各セル毎に一つずつ計4つの導電部43を有する。4つの導電部43の各々は、各処理ユニット3−1〜3−nの4箇所の停止位置にてワーク2を保持して停止された図4に示す搬送治具30の被給電部340(2つの接触子342,343)と電気的に導通される。なお、図5では各処理ユニット3−1〜3−nに収容されるメッキ液の液面Lが示され、ワーク2はメッキ液中に浸漬される。なお、図6(B)に示すように、陰極レール40の幅方向の両端には隔壁44,44が設けられ、導電部43上に非油性の導電性流体(例えば水)45を保持することができる。こうすると、被給電部340(2つの接触子342,343)と導電部43との電気的接触を、導電性流体45を介してより確実に担保することができる。ただし、水の導電性は金属である導電部43の導電性よりもはるかに低いので、隣り合う導電部43,43間の絶縁性は維持される。また、図6(B)に示すように、導電部43を絶縁レール41上に固定するボルト46は、被給電部340の走行路を挟んだ両側に配置することができる。これにより、導電部34にボルトの座ぐり穴を設ける必要がなくなり、抵抗となる要因を排除できる。
3. 3. Cathode rail and rectifier As shown in FIG. 5, each processing unit 3-1 to 3-n (FIG. 5 shows only two processing units) has at least one cathode rail 40. A plurality of cathode rails 40 may be arranged in parallel in parallel with the transport direction A. In this case, the plurality of cathode rails 40 may be connected to the same rectifier, or may be connected to different rectifiers to independently control the current value for each feeding portion. In this embodiment, one cathode rail 40 is provided. One cathode rail 40 is preferably a plurality of divided cathode rails 40-1 to 40-n divided for each processing unit 3-1 to 3-n (FIG. 5 shows two divided cathode rails 40-1, 40). -Only shown), and they are connected so as to be continuous in the transport direction A. As shown in FIGS. 5 and 6 (A), the work 2 is stopped at each of the divided cathode rails 40-1 to 40-n at intervals (non-conductive portions) 42 on the insulating rail 41. Each cell has a total of four conductive portions 43, one for each cell. Each of the four conductive portions 43 was stopped by holding the work 2 at four stop positions of each processing unit 3-1 to 3-n, and the power-fed portion 340 of the transfer jig 30 shown in FIG. 4 ( It is electrically conductive with the two contacts 342 and 343). Note that FIG. 5 shows the liquid level L of the plating solution contained in each of the treatment units 3-1 to 3-n, and the work 2 is immersed in the plating solution. As shown in FIG. 6B, partition walls 44 and 44 are provided at both ends of the cathode rail 40 in the width direction, and a non-oil conductive fluid (for example, water) 45 is held on the conductive portion 43. Can be done. In this way, the electrical contact between the power-fed portion 340 (two contacts 342 and 343) and the conductive portion 43 can be more reliably ensured via the conductive fluid 45. However, since the conductivity of water is much lower than that of the conductive portion 43, which is a metal, the insulation between the adjacent conductive portions 43, 43 is maintained. Further, as shown in FIG. 6B, the bolts 46 for fixing the conductive portion 43 on the insulating rail 41 can be arranged on both sides of the traveling path of the fed portion 340. As a result, it is not necessary to provide a counterbore for the bolt in the conductive portion 34, and a factor that becomes resistance can be eliminated.

各処理ユニット3−1〜3−nは、ワーク2が停止される各セル毎に一つずつ計4つの整流器50(図5では一つの整流器50のみを示す)を有する。4つの整流器50の各一つの正端子51は各セルに配置された陽極20(20A1,20A2,20B1,20B2)と接続される。4つの整流器50の各一つの負端子52は分割陰極レール40−1〜40−nの各一つのセルに対応する導電部43と接続される。 Each processing unit 3-1 to 3-n has a total of four rectifiers 50 (only one rectifier 50 is shown in FIG. 5), one for each cell in which the work 2 is stopped. Each positive terminal 51 of each of the four rectifiers 50 is connected to the anodes 20 (20A1, 20A2, 20B1, 20B2) arranged in each cell. The negative terminal 52 of each of the four rectifiers 50 is connected to the conductive portion 43 corresponding to each cell of the divided cathode rails 40-1 to 40-n.

4.ワークの停止時の電流制御
各処理ユニット3−1〜3−nの4箇所の停止位置(セル)にて、4つのワーク2に流れる電流は、各セル毎に一つずつ設けられた整流器50の各々により独立して制御される。しかも、セル間では陰極同士が絶縁され、陽極同士も絶縁されるので、各一つのワーク2毎に絶縁分離させて、各整流器50によりワーク2を個別的に給電制御することができる。加えて、セル間では遮蔽板23により電界を分離することで、セル間での影響を排除して、ワーク2毎の個別給電が担保される。それにより、ワーク2のメッキ品質を向上させることができる。
4. Current control when the work is stopped At the four stop positions (cells) of each processing unit 3-1 to 3-n, the current flowing through the four works 2 is a rectifier 50 provided for each cell. It is controlled independently by each of. Moreover, since the cathodes are insulated from each other and the anodes are also insulated from each other between the cells, the work 2 can be individually supplied and controlled by each rectifier 50 by insulating and separating each work 2. In addition, by separating the electric field between the cells by the shielding plate 23, the influence between the cells is eliminated and the individual power supply for each work 2 is secured. Thereby, the plating quality of the work 2 can be improved.

本実施形態の間欠搬送方式を従来の連続搬送方式と対比すると、連続搬送されるワーク(陰極)は固定された陽極との位置関係が常時変化するのに対して、本実施形態の停止されたワーク(陰極)2は陽極20と正対させることができる。このように、ワーク2の停止中は陰極と陽極との位置関係が一定となり、各ワークは同一メッキ条件となるので、メッキ品質が向上すると期待される。特にワーク2が停止していれば接触抵抗の変動はなくなるので、緻密な電流制御が可能となる。また、連続搬送に用いられる長い陰極レール途中には固定ボルト用の座ぐり穴等があり、陰極レールの抵抗値が場所毎に異なり均一抵抗とはならない。そのため、ワークの連続搬送中の位置によってワークに流れる電流が異なるが、間欠搬送ではそのような不具合を解消できる。さらに、本実施形態は、連続搬送のようにワークの連続搬送速度よりメッキ品質が悪影響を受けることもない。 Comparing the intermittent transfer method of the present embodiment with the conventional continuous transfer method, the work (cathode) continuously transferred has a constantly changing positional relationship with the fixed anode, whereas the present embodiment has been stopped. The work (cathode) 2 can face the anode 20. As described above, while the work 2 is stopped, the positional relationship between the cathode and the anode is constant, and each work has the same plating conditions, so that the plating quality is expected to be improved. In particular, if the work 2 is stopped, the contact resistance does not fluctuate, so that precise current control becomes possible. Further, there is a counterbore hole for a fixing bolt in the middle of the long cathode rail used for continuous transportation, and the resistance value of the cathode rail differs depending on the location and does not become a uniform resistance. Therefore, the current flowing through the work differs depending on the position during continuous transportation of the work, and such a problem can be solved by intermittent transportation. Further, in the present embodiment, unlike the continuous transfer, the plating quality is not adversely affected by the continuous transfer speed of the work.

ただし、上述のような完全個別給電を必ずしも実施せずにワーク2を間欠搬送しても良い。つまり、各処理ユニット3−1〜3−nの4つのセル11−1〜11−4にて、陰極及び陽極の一方または双方を共通(共通陰極及び/または共通陽極)にしても良い。 However, the work 2 may be intermittently conveyed without necessarily performing the complete individual power supply as described above. That is, one or both of the cathode and the anode may be common (common cathode and / or common anode) in the four cells 11-1 to 11-4 of each processing unit 3-1 to 3-n.

5.ワークの間欠搬送中の電流制御
ワーク2がセル間で間欠搬送される間も、整流器50によりワーク2に電流が供給される。ここで、間欠搬送中に、図4に示す搬送治具30の2つの接触子342,343の少なくとも一方は陰極レール上の導電部43と接触している。つまり、搬送上流側の接触子342が間隔42の位置にて絶縁レール41と接触しても、搬送下流側の接触子343は導電部43と接触している。同様に、搬送下流側の接触子343が間隔42の位置にて絶縁レール41と接触しても、搬送上流側の接触子342は隣のセルの導電部43と接触している。それらの過程で、搬送下流側の接触子343が例えばセル11−1の導電部43と接触し、搬送上流側の接触子342はセル11−2の導電部43と接触する。この場合、ワーク2はセル11−1及びセル11−2に対応する2つの整流器50から電流が供給される。このセル間を移動する過程の状態(乗り継ぎ状態)を、図7に模式的に示す。図7において、図4に示す搬送治具30の被給電部340が模式的に示され、被給電部340は上流側セルの導電部43と下流側セルの導電部43とに接触している。ここで、ワーク2が停止している時の整流器50の出力を維持してワーク2を間欠搬送すると、2つの整流器50と接続される乗り継ぎ中のワーク2には過渡的に2倍の電流が流れる虞がある。特に、間欠搬送速度が遅いほど、過渡電流の影響は大きい。
5. Current control during intermittent transfer of the work While the work 2 is intermittently transferred between cells, the rectifier 50 supplies current to the work 2. Here, during intermittent transfer, at least one of the two contacts 342 and 343 of the transfer jig 30 shown in FIG. 4 is in contact with the conductive portion 43 on the cathode rail. That is, even if the contactor 342 on the upstream side of the transport comes into contact with the insulating rail 41 at the position of the interval 42, the contactor 343 on the downstream side of the transport is in contact with the conductive portion 43. Similarly, even if the contactor 343 on the downstream side of the transport contacts the insulating rail 41 at the position of the interval 42, the contactor 342 on the upstream side of the transport is in contact with the conductive portion 43 of the adjacent cell. In these processes, the contactor 343 on the downstream side of the transport comes into contact with, for example, the conductive portion 43 of the cell 11-1, and the contactor 342 on the upstream side of the transport comes into contact with the conductive portion 43 of the cell 11-2. In this case, the work 2 is supplied with current from two rectifiers 50 corresponding to cells 11-1 and 11-2. The state of the process of moving between the cells (transit state) is schematically shown in FIG. In FIG. 7, the powered portion 340 of the transfer jig 30 shown in FIG. 4 is schematically shown, and the fed portion 340 is in contact with the conductive portion 43 of the upstream cell and the conductive portion 43 of the downstream cell. .. Here, if the output of the rectifier 50 is maintained when the work 2 is stopped and the work 2 is intermittently conveyed, the connecting work 2 connected to the two rectifiers 50 is transiently doubled in current. There is a risk of flowing. In particular, the slower the intermittent transfer speed, the greater the effect of the transient current.

本実施形態では、ワーク2の間欠搬送中には以下の2つの電流制御のいずれかを採用している。間欠搬送速度が比較的遅い場合には、上述した過渡電流を低減または防止するために、ワーク2の停止時での整流器50の出力(例えば100%)を漸減(例えば50%まで漸減)させた後に漸増(100%まで戻す)させる。間欠搬送速度が比較的速い場合には、過渡電流は流れる期間が極めて短いため無視することができる。よって、その場合にはワーク2の停止時とワーク2の間欠搬送時とで整流器50の出力を異ならせるように制御しなくても良い。例えば、ワーク200の搬送方向の幅を800mm、間欠搬送速度を12m/min、図7に模式的に示す被給電部430の搬送方向の幅を60mmと仮定すると、間欠搬送時間は5secとなり、被給電部430がセル間で導電部43を乗り継ぎするのに要する時間(過渡電流が流れ得る時間)はわずか0.3secである。 In this embodiment, one of the following two current controls is adopted during the intermittent transfer of the work 2. When the intermittent transfer speed is relatively slow, the output (for example, 100%) of the rectifier 50 when the work 2 is stopped is gradually reduced (for example, gradually reduced to 50%) in order to reduce or prevent the above-mentioned transient current. Later, it is gradually increased (returned to 100%). When the intermittent transfer speed is relatively high, the transient current can be ignored because the flow period is extremely short. Therefore, in that case, it is not necessary to control the output of the rectifier 50 to be different between when the work 2 is stopped and when the work 2 is intermittently conveyed. For example, assuming that the width of the work 200 in the transport direction is 800 mm, the intermittent transport speed is 12 m / min, and the width of the powered portion 430 schematically shown in FIG. 7 in the transport direction is 60 mm, the intermittent transport time is 5 sec. The time required for the power feeding unit 430 to transfer the conductive unit 43 between the cells (the time during which the transient current can flow) is only 0.3 sec.

6.ノズル管の移動走査
各処理ユニット3−1〜3−nの4つのセル11−1〜11−4にて、図8に示すように、平面視で、停止位置にあるワーク2の各面(表面及び裏面)と陽極20との間に少なくとも1本のノズル管60をさらに設けることができる。ノズル管60は、ワーク(陰極)2と陽極20との間に形成される電界を遮るので、複数のノズル管60を設ける場合でもその本数は少ないことが好ましい。ノズル管60は、図9に示すようにメッキ液を噴出する複数の噴出口60Aを有する。図9に示すノズル管60の噴出口60Aは垂直方向ピッチPは従来の連続搬送式に用いられるピッチ(例えば7.5mm)よりも小さく、噴出口60Aの外径以上でかつ5mm以下とすることができる。単位時間当たりのメッキ液供給量を多くするためである。加えて、小さいサイズのチップや密なパターンに均等にメッキ液を供給するためにも、ピッチPは小さい方が良い。なお、図9ではワーク2の表裏面側のノズル管60はワーク2を挟んで対向配置されているが、非対向位置に設けても良い。対向配置させればワーク2が液圧で変形することを解消でき、非対向配置させるとワーク2の貫通孔にメッキ液を供給し易くなる。なお、連続搬送方式でもノズル管が設けられるが、その本数は一処理ユニットに十数本と多い。
6. Moving scanning of nozzle tube In four cells 11-1 to 11-4 of each processing unit 3-1 to 11-4, as shown in FIG. 8, each surface of the work 2 at the stop position in a plan view ( At least one nozzle tube 60 can be further provided between the front surface and the back surface) and the anode 20. Since the nozzle tube 60 blocks the electric field formed between the work (cathode) 2 and the anode 20, it is preferable that the number of the nozzle tubes 60 is small even when a plurality of nozzle tubes 60 are provided. As shown in FIG. 9, the nozzle tube 60 has a plurality of outlets 60A for ejecting the plating solution. The nozzle pipe 60 shown in FIG. 9 has a vertical pitch P smaller than the pitch (for example, 7.5 mm) used in the conventional continuous transfer type, and has an outer diameter of the nozzle pipe 60A or more and 5 mm or less. Can be done. This is to increase the amount of plating solution supplied per unit time. In addition, the pitch P should be small in order to evenly supply the plating solution to small-sized chips and dense patterns. In FIG. 9, the nozzle tubes 60 on the front and back sides of the work 2 are arranged to face each other with the work 2 in between, but they may be provided at non-opposing positions. If they are arranged to face each other, the deformation of the work 2 due to hydraulic pressure can be eliminated, and if they are arranged to face each other, it becomes easier to supply the plating solution to the through holes of the work 2. Nozzle tubes are also provided in the continuous transfer method, but the number of nozzle tubes is as large as a dozen per processing unit.

ワークの連続搬送方式では多数のノズル管が固定されていたが、間欠搬送方式を採用する本実施形態では、各処理ユニット3−1〜3−nの4つのセル11−1〜11−4にて、少なくとも1本のノズル管60を、例えば図8の矢印A1方向及びA2方向(共に間欠搬送方向Aと平行である)に水平走査移動させている。それにより、図9に示すように、ワーク2の全面に対して均一にメッキ液を噴出させることができる。また、ノズル管60の移動速度は、連続搬送方式でのワーク2の移動速度(例えば0.8m/min)よりも速くすることができる。こうすると、単位時間当たりのメッキ液供給量を多くすることができる。なお、連続搬送式でワーク速度を速くすると処理槽の全長が長くなって装置が大型化するが、本実施形態のような間欠搬送では装置は大型化しない。 In the continuous work transfer method, a large number of nozzle tubes were fixed, but in the present embodiment in which the intermittent transfer method is adopted, the four cells 11-1 to 11-4 of each processing unit 3-1 to 11-4 are used. Therefore, at least one nozzle tube 60 is horizontally scanned and moved in, for example, the arrow A1 direction and the A2 direction (both parallel to the intermittent transport direction A) in FIG. As a result, as shown in FIG. 9, the plating solution can be uniformly ejected onto the entire surface of the work 2. Further, the moving speed of the nozzle tube 60 can be faster than the moving speed of the work 2 (for example, 0.8 m / min) in the continuous transfer method. In this way, the amount of plating liquid supplied per unit time can be increased. If the work speed is increased in the continuous transfer type, the total length of the processing tank becomes longer and the device becomes larger, but the device does not become larger in the intermittent transfer as in the present embodiment.

ノズル管60の往復移動機構は図示を省略するが、公知の往復直線運動させる機構(例えば可逆モータで駆動されるピニオン−ラック機構、ピストン−クランク機構等)を採用することができる。この往復移動機構は、各セルで停止されているワーク2の少なくとも水平幅と対応する長さ範囲を少なくとも一回循環して走査するように、2本のノズル管60を移動させることができる。こうすると、処理されるワーク2の面内均一性が向上する。特に、ノズル管60の初期位置から少なくとも一回循環走査させて初期位置に復帰させることが好ましい。ノズル管60の影がワーク面内でほぼ均一化されるからである。なお、ノズル管60は装置の稼動中に亘って往復走査移動を連続させても良いし、ワーク2の間欠搬送中は往復走査移動を停止しても良い。 Although the reciprocating mechanism of the nozzle tube 60 is not shown, a known reciprocating linear motion mechanism (for example, a pinion-rack mechanism driven by a reversible motor, a piston-crank mechanism, etc.) can be adopted. This reciprocating movement mechanism can move the two nozzle tubes 60 so as to circulate and scan at least once in the length range corresponding to at least the horizontal width of the work 2 stopped in each cell. In this way, the in-plane uniformity of the work 2 to be processed is improved. In particular, it is preferable to perform circular scanning at least once from the initial position of the nozzle tube 60 to return to the initial position. This is because the shadow of the nozzle tube 60 is substantially made uniform in the work surface. The nozzle tube 60 may continue the reciprocating scanning movement while the device is in operation, or may stop the reciprocating scanning movement during the intermittent transfer of the work 2.

本実施形態によれば、間欠停止されるワーク2に対して、ワーク2の停止位置と対応して少なくとも一つ例えば2本のノズル管60をワーク2に対して走査移動させることができる。それにより、平面視でワーク2と陽極20との間に位置するノズル管60の影となって陽極−陰極間の電界が妨げられる領域が、ノズル管60の移動に伴って移動する。このため、ノズル管60によって電界が妨げられる領域が固定されず、処理されるワーク2の面内均一性が向上する。なお、ノズル管60の走査移動方向は水平方向に限らない。例えばノズル管60を水平に配置して垂直方向に走査移動してもよく、走査移動方向は水平、垂直等のいずれの方向であっても良い。 According to the present embodiment, at least one, for example, two nozzle tubes 60 can be scanned and moved with respect to the work 2 to be intermittently stopped, corresponding to the stop position of the work 2. As a result, the region where the electric field between the anode and the cathode is obstructed by the shadow of the nozzle tube 60 located between the work 2 and the anode 20 in a plan view moves with the movement of the nozzle tube 60. Therefore, the region where the electric field is obstructed by the nozzle tube 60 is not fixed, and the in-plane uniformity of the work 2 to be processed is improved. The scanning moving direction of the nozzle tube 60 is not limited to the horizontal direction. For example, the nozzle tube 60 may be arranged horizontally and scanned and moved in the vertical direction, and the scanning moving direction may be any direction such as horizontal and vertical.

ノズル管60は公知の構造により分割処理槽内の噴出口60A付近のメッキ液を巻き込んで噴出させることができる。よって、陽極20付近の金属イオンが豊富なメッキ液をワーク2に向けて噴出でき、スループットが向上する。 The nozzle tube 60 has a known structure and can entrain and eject the plating solution near the ejection port 60A in the dividing treatment tank. Therefore, the plating solution rich in metal ions near the anode 20 can be ejected toward the work 2, and the throughput is improved.

なお、ノズル管60の走査移動は、間欠搬送方式の表面処理装置に広く適用することができ、必ずしも上述した実施形態のような構造、つまり複数の処理ユニットの連結構造、陰極分割構造、陽極分割構造や、後述するプッシャーによる間欠搬送機構を備えた構造等に限定されるものではない。 The scanning movement of the nozzle tube 60 can be widely applied to the surface treatment apparatus of the intermittent transfer type, and does not necessarily have the structure as in the above-described embodiment, that is, the connection structure of a plurality of treatment units, the cathode division structure, and the anode division. The structure is not limited to the structure and the structure provided with the intermittent transfer mechanism by the pusher described later.

7.処理ユニット毎の間欠搬送装置
本実施形態では、各処理ユニット3−1〜3−n毎に間欠搬送装置を設けることが好ましい。処理ユニットの数nを変更しても間欠搬送装置を再設計する必要がないからである。その便宜を求めなければ、特許文献1のように循環式間欠搬送装置を用いても良いし、各処理ユニット3−1〜3−nに共用される一つの間欠搬送装置を用いても良い。なお、以下に説明する間欠搬送装置は、必ずしも複数の処理ユニットを連結してメッキ槽を形成するものに限定されない。
7. Intermittent transfer device for each processing unit In the present embodiment, it is preferable to provide an intermittent transfer device for each processing unit 3-1 to 3-n. This is because it is not necessary to redesign the intermittent transfer device even if the number n of the processing units is changed. If the convenience is not required, a circulation type intermittent transfer device may be used as in Patent Document 1, or one intermittent transfer device shared by each processing unit 3-1 to 3-n may be used. The intermittent transfer device described below is not necessarily limited to a device in which a plurality of processing units are connected to form a plating tank.

各処理ユニット3−1〜3−n毎に設けられる間欠搬送装置として、図10または図11に示すものを採用することができる。図10に示す間欠搬送装置は、間欠搬送方向Aと平行な正逆方向A1,A2に向けて、例えばエアシリンダー等で進退駆動されるプッシャー70で構成される。プッシャー70は、4箇所に押動片71を有する。4つの押動片71は、4つの搬送治具30の被押動片350(図4参照)を押動可能である。4つの押動片71は、図10において時計周り方向Dに回転付勢されている。 As the intermittent transfer device provided for each of the processing units 3-1 to 3-n, the one shown in FIG. 10 or 11 can be adopted. The intermittent transfer device shown in FIG. 10 is composed of a pusher 70 that is driven forward and backward by, for example, an air cylinder or the like in the forward and reverse directions A1 and A2 parallel to the intermittent transfer direction A. The pusher 70 has push pieces 71 at four positions. The four pushing pieces 71 can push the pushed pieces 350 (see FIG. 4) of the four transport jigs 30. The four pushing pieces 71 are rotationally urged in the clockwise direction D in FIG.

プッシャー70は、方向A1に向けた前進時に4つの押動片71が4つの搬送治具30の被押動片350を押動して4つのワーク2を間欠搬送させる。プッシャー70は、方向A2に向けた後退時に、押動片71が被押動片350と接触すると、押動片71が矢印D方向への付勢力に抗して矢印Dとは逆方向に回転することで、被押動片350に邪魔されることなく初期位置に復帰される。こうして、各処理ユニット3−1〜3−n内にあった4つのワーク2は、プッシャー70により同時に一ステップ移動されて間欠搬送される。それにより、処理ユニット内の最下流位置以外の3つのワーク2は同一処理ユニット内で一ステップ移動され、同一または前段の処理ユニット内の最下流位置にあったワーク2はその後段の処理ユニット内の最上流位置に移動される。こうして、4つの搬送治具30に保持された4つのワーク2は、処理ユニット内の4つの停止位置を始点及び/または終点として、間欠的に搬送される。 In the pusher 70, when the pusher 70 advances in the direction A1, the four push pieces 71 push the pushed pieces 350 of the four transfer jigs 30 to intermittently convey the four works 2. When the pushing piece 71 comes into contact with the pushed piece 350 when the pusher 70 is retracted in the direction A2, the pushing piece 71 rotates in the direction opposite to the arrow D against the urging force in the arrow D direction. By doing so, it is returned to the initial position without being disturbed by the pushed piece 350. In this way, the four works 2 in each processing unit 3-1 to 3-n are simultaneously moved by one step by the pusher 70 and intermittently conveyed. As a result, the three works 2 other than the most downstream position in the processing unit are moved by one step in the same processing unit, and the work 2 at the same or most downstream position in the processing unit in the previous stage is in the processing unit in the subsequent stage. It is moved to the most upstream position of. In this way, the four works 2 held by the four transfer jigs 30 are intermittently conveyed with the four stop positions in the processing unit as the start point and / or the end point.

図10に示す間欠搬送装置は、搬送治具30を押動するだけであるから、搬送治具30の停止位置を制御することはできない。この間欠搬送装置は、間欠搬送速度が比較的遅く、プッシャー70での押動停止後も搬送治具30が前進し続ける慣性力を生じない場合に使用することができる。あるいは、この間欠搬送装置は、搬送治具30の案内ローラー331,332の少なくとも一つに、本願出願人による国際特許出願PCT/JP2018/020119に記載されたブレーキ機構を設けた場合にも採用することができる。 Since the intermittent transfer device shown in FIG. 10 only pushes the transfer jig 30, it is not possible to control the stop position of the transfer jig 30. This intermittent transfer device can be used when the intermittent transfer speed is relatively slow and the transfer jig 30 does not generate an inertial force that keeps moving forward even after the pusher 70 stops pushing. Alternatively, this intermittent transfer device is also adopted when at least one of the guide rollers 331 and 332 of the transfer jig 30 is provided with the brake mechanism described in the international patent application PCT / JP2018 / 020119 by the applicant of the present application. be able to.

図11(A)(B)に示す間欠搬送装置は、4つの押動片73を備えて進退駆動(A1,A2方向の駆動)及び昇降駆動(矢印E方向の駆動)されるプッシャー72を含む。4つの押動片73は、搬送治具30の被押動片350が嵌まり込む例えば上向き開口の凹部73Aを含む。図11(A)に示すように、プッシャー72が上昇されると、4つの凹部73Aに搬送治具30の被押動片350が嵌まり込む。その後、図11(B)に示すように、プッシャー72をA1方向に前進させると、4つの搬送治具30は同時に一ステップ分だけ間欠搬送される。また、プッシャー72の前進が終了すると、凹部73Aにより被押動片350の停止位置が一義的に定まる。その後、プッシャー72は下降され、さらに後退されて、初期位置に復帰される。特に、凹部73Aと被押動片350との係合により、複数の搬送治具30を所定の位置に停止させることができ、より高速な間欠送りが可能となる。 The intermittent transfer device shown in FIGS. 11A and 11B includes a pusher 72 having four push pieces 73 and being driven forward / backward (drive in the A1 and A2 directions) and up / down drive (drive in the arrow E direction). .. The four pushing pieces 73 include, for example, a recess 73A having an upward opening into which the pushed piece 350 of the transport jig 30 fits. As shown in FIG. 11A, when the pusher 72 is raised, the pushed piece 350 of the transfer jig 30 is fitted into the four recesses 73A. After that, as shown in FIG. 11B, when the pusher 72 is advanced in the A1 direction, the four transfer jigs 30 are intermittently transported by one step at the same time. Further, when the advance of the pusher 72 is completed, the stop position of the pushed piece 350 is uniquely determined by the recess 73A. After that, the pusher 72 is lowered, further retracted, and returned to the initial position. In particular, by engaging the recess 73A with the pushed piece 350, the plurality of transfer jigs 30 can be stopped at predetermined positions, and higher-speed intermittent feeding becomes possible.

なお、上記のように本実施形態について詳細に説明したが、本発明の新規事項および効果から実体的に逸脱しない多くの変形が可能であることは当業者には容易に理解できるであろう。従って、このような変形例はすべて本発明の範囲に含まれるものとする。例えば、明細書又は図面において、少なくとも一度、より広義または同義な異なる用語と共に記載された用語は、明細書又は図面のいかなる箇所においても、その異なる用語に置き換えることができる。また本実施形態及び変形例の全ての組み合わせも、本発明の範囲に含まれる。 Although the present embodiment has been described in detail as described above, those skilled in the art will easily understand that many modifications that do not substantially deviate from the novel matters and effects of the present invention are possible. Therefore, all such modifications are included in the scope of the present invention. For example, a term described at least once in a specification or drawing with a different term in a broader or synonymous manner may be replaced by that different term anywhere in the specification or drawing. Further, all combinations of the present embodiment and modifications are also included in the scope of the present invention.

図12は、図4に示す搬送治具30のうちのワーク保持部320をワーク保持部320Aに変更した変形例を示す、図12では、ワーク2を囲むハッチングで示す四角枠領域にダミー被処理部80を設けている。ダミー被処理部80はワーク2と共に表面処理(メッキ)される領域である。ダミー被処理部80は、図12に示す給電部81と接続される。この給電部81は図4に示す被給電部340と電気的に接続されることで、ダミー被処理部80はワーク2と同様にして陰極に設定される。 FIG. 12 shows a modified example in which the work holding portion 320 of the transfer jig 30 shown in FIG. 4 is changed to the work holding portion 320A. In FIG. 12, a dummy object is processed in the square frame area indicated by hatching surrounding the work 2. A unit 80 is provided. The dummy object to be treated 80 is a region to be surface-treated (plated) together with the work 2. The dummy processed unit 80 is connected to the power feeding unit 81 shown in FIG. The power supply unit 81 is electrically connected to the power supply unit 340 shown in FIG. 4, so that the dummy processing unit 80 is set to the cathode in the same manner as the work 2.

ワーク2の周縁はダミー被処理部80の内側に位置することから、ワーク2の周縁はエッジにならない。よって、ワーク2の周縁に電界が集中しないので、いわゆるドックボーンと称される厚膜部は生じない。ダミー被処理部80の電気抵抗をワーク2面内の電気抵抗と実質的に同じになるようにすれば、ワーク2の面内均一性が向上する。なお、メッキ装置1はメッキ処理部の後工程に剥離槽を有し、メッキ後に搬送治具30は剥離槽に投入されてメッキが剥離される。その際にダミー被処理部80に形成されたメッキも剥離されるので、搬送治具30を繰り返し再使用可能となる。 Since the peripheral edge of the work 2 is located inside the dummy object to be processed 80, the peripheral edge of the work 2 does not become an edge. Therefore, since the electric field is not concentrated on the peripheral edge of the work 2, a thick film portion called a so-called dock bone does not occur. If the electrical resistance of the dummy object to be processed 80 is made substantially the same as the electrical resistance in the two planes of the work, the in-plane uniformity of the work 2 is improved. The plating apparatus 1 has a peeling tank in a post-process of the plating processing unit, and after plating, the transfer jig 30 is put into the peeling tank to peel the plating. At that time, the plating formed on the dummy object to be processed 80 is also peeled off, so that the transfer jig 30 can be reused repeatedly.

図13は、図4に示す搬送治具30のうちの被給電部340に陰極レール40の清掃機能を付加した変形例である搬送治具30Aを示す。図13では、支持アーム341が、接触子342,343に加えて、陰極レール40と接触して陰極レール40を清掃する少なくとも一つのレール清掃部344を支持している。図13に示すレール清掃部344は、陰極レール40の導電部43を磨いて堆積層(例えば導電部上の酸化皮膜等)を削り取る研磨材例えばスクレーパー344Aと、研磨粉やごみを払い出すブラシ344Bの少なくとも一方または双方とを含んでいる。ブラシ344Bはスクレーパー344Aの下流側に設けることができる。清掃部344(344A,344B)は、接触子342,344と同様な構造により陰極レール40に圧接される。 FIG. 13 shows a transfer jig 30A which is a modified example of the transfer jig 30 shown in FIG. 4 in which a power feeding portion 340 is provided with a cleaning function of the cathode rail 40. In FIG. 13, the support arm 341 supports, in addition to the contacts 342 and 343, at least one rail cleaning portion 344 that contacts the cathode rail 40 to clean the cathode rail 40. The rail cleaning section 344 shown in FIG. 13 includes a polishing material such as scraper 344A that polishes the conductive section 43 of the cathode rail 40 to scrape off the deposited layer (for example, an oxide film on the conductive section), and a brush 344B that discharges polishing powder and dust. Includes at least one or both of. The brush 344B can be provided on the downstream side of the scraper 344A. The cleaning unit 344 (344A, 344B) is pressed against the cathode rail 40 by a structure similar to that of the contacts 342 and 344.

図13に示す清掃部344を有する搬送治具30Aを、メッキ装置1にて循環使用される多数の搬送治具の少なくとも一つとして用いることで、メッキ装置1を稼働させながら陰極レール40を清掃し、通電不良を防止することができる。それにより、陰極レール40の導電部43の電気抵抗値が高くなるなどの不具合を抑制し、従来週一回の頻度で実施されていたメンテナンス頻度を少なくすることができる。 By using the transfer jig 30A having the cleaning unit 344 shown in FIG. 13 as at least one of a large number of transfer jigs circulated and used in the plating device 1, the cathode rail 40 is cleaned while the plating device 1 is operated. Therefore, it is possible to prevent poor energization. As a result, it is possible to suppress problems such as an increase in the electrical resistance value of the conductive portion 43 of the cathode rail 40, and to reduce the frequency of maintenance that has been conventionally performed once a week.

なお、図13に示す搬送治具30Aは、上述した間欠搬送式の表面処理装置に限らず、導電部34が連続して設けられる陰極レールを有する連続搬送式の表面処理装置でも使用することができる。 The transfer jig 30A shown in FIG. 13 can be used not only in the above-mentioned intermittent transfer type surface treatment device but also in a continuous transfer type surface treatment device having a cathode rail in which the conductive portion 34 is continuously provided. it can.

1 表面処理装置、2 ワーク、3−1〜3−n 処理槽(分割処理槽)、20(20A1,20A2,20B1,20B2) 陽極、30,30A 搬送治具、40,40−1,40−2 陰極レール(分割陰極レール)、41 絶縁レール、42 間隔(非導電部)、43 導電部、50 整流器、51 正端子、52 負端子、60 ノズル管、60A 噴出口、70,72 プッシャー(間欠搬送装置)、71,73 押動片、73A 凹部 1 Surface treatment device, 2 works, 3-1 to 3-n treatment tank (split treatment tank), 20 (20A1,20A2,20B1,20B2) Anode, 30,30A transfer jig, 40,40-1,40- 2 Cathode rail (split cathode rail), 41 Insulated rail, 42 spacing (non-conductive part), 43 conductive part, 50 rectifier, 51 positive terminal, 52 negative terminal, 60 nozzle tube, 60A spout, 70,72 pusher (intermittent) Conveyor device), 71,73 Pushing piece, 73A recess

Claims (6)

処理液が収容される処理槽と、
前記処理槽内に配置される少なくとも一つの陽極と、
少なくとも1本の陰極レールと、
前記処理液に浸漬される複数のワークをそれぞれ垂下させて保持し、かつ、前記少なくとも1本の陰極レールと接触して前記複数のワークを陰極に設定し、搬送方向に沿って連続または間欠的に搬送される複数の治具と、
を有し、
前記少なくとも1本の陰極レールは、前記複数の治具と接触する金属製の導電部と、前記導電部上に保持される非油性の導電性流体と、を含むこと特徴とする表面処理装置。
A treatment tank that houses the treatment liquid and
With at least one anode arranged in the processing tank,
With at least one cathode rail
A plurality of workpieces immersed in the treatment liquid are each hung down and held, and the plurality of workpieces are set as cathodes in contact with at least one cathode rail, and the plurality of workpieces are set as cathodes continuously or intermittently along the transport direction. With multiple jigs transported to
Have,
The surface treatment apparatus, wherein the at least one cathode rail includes a metal conductive portion that comes into contact with the plurality of jigs, and a non-oil conductive fluid that is held on the conductive portion.
請求項1において、
前記少なくとも1本の陰極レールは、前記導電部の幅方向の両端には隔壁を含み、前記導電性流体は前記隔壁間に収容されること特徴とする表面処理装置。
In claim 1,
A surface treatment apparatus characterized in that the at least one cathode rail includes partition walls at both ends in the width direction of the conductive portion, and the conductive fluid is housed between the partition walls.
請求項2において、
前記導電性流体は水であること特徴とする表面処理装置。
In claim 2,
A surface treatment apparatus characterized in that the conductive fluid is water.
請求項3において、
前記複数の治具の各々は、前記搬送方向で離れて設けられ、前記少なくとも1本の陰極レールとそれぞれ接触する2つの被給電部を含むこと特徴とする表面処理装置。
In claim 3,
A surface treatment apparatus characterized in that each of the plurality of jigs is provided apart in the transport direction and includes two power-fed portions that are in contact with at least one cathode rail.
請求項1乃至4のいずれか一項において、
前記複数の治具は間欠的に搬送され、
前記導電部は、間欠停止される各位置に間隔を介して設けられることを特徴とする表面処理装置。
In any one of claims 1 to 4,
The plurality of jigs are intermittently conveyed.
A surface treatment apparatus characterized in that the conductive portion is provided at each position where it is intermittently stopped with an interval.
請求項1乃至5のいずれか一項において、
前記表面処理装置は複数の処理ユニットを含み、
前記少なくとも1本の陰極レールは、前記複数の処理ユニット毎に分割された複数の分割陰極レールを含むこと特徴とする表面処理装置。
In any one of claims 1 to 5,
The surface treatment apparatus includes a plurality of treatment units and includes a plurality of treatment units.
The surface treatment apparatus, wherein the at least one cathode rail includes a plurality of divided cathode rails divided into the plurality of processing units.
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