JP2020150072A - Light-emitting device - Google Patents
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Abstract
Description
本発明は、発光装置に関する。 The present invention relates to a light emitting device.
セラミック基板又は金属基板等の汎用基板の上に複数のＬＥＤ（Light-Emitting Diode）素子を実装したＣＯＢ（Chip On Board）タイプの発光装置が知られている。このタイプの発光装置として、複数の領域に分けて配置された複数のＬＥＤを駆動する電流を領域ごとに独立に制御し、各領域から出射される光を混合するものがある。 A COB (Chip On Board) type light emitting device in which a plurality of LED (Light-Emitting Diode) elements are mounted on a general-purpose substrate such as a ceramic substrate or a metal substrate is known. As a light emitting device of this type, there is a device in which the current for driving a plurality of LEDs arranged in a plurality of regions is independently controlled for each region, and the light emitted from each region is mixed.
例えば、特許文献１には、独立に駆動可能な複数の発光部からの出射光の混色性及び装置全体の発光色の演色性を向上させた発光装置が記載されている。この発光装置は、基板上に実装された第１の複数の発光素子及び第１の複数の発光素子を封止する第１の封止樹脂で構成され、シアン色の光を出射する第１の発光部を有する。また、この発光装置は、基板上に実装された第２の複数の発光素子及び第２の複数の発光素子を封止する第２の封止樹脂で構成され、赤色光を出射する第２の発光部を有する。また、この発光装置は、第１及び第２の発光部を取り囲むように基板上に実装された第３の複数の発光素子及び第３の複数の発光素子を封止する第３の封止樹脂で構成され、青色光を出射する第３の発光部を有する。また、この発光装置は、第３の発光部を取り囲むように基板上に実装された第４の複数の発光素子及び第４の複数の発光素子を封止する第４の封止樹脂で構成され、緑色光を出射する第４の発光部を有する。 For example, Patent Document 1 describes a light emitting device in which the color mixing property of the light emitted from a plurality of light emitting units that can be driven independently and the color rendering property of the light emitting color of the entire device are improved. This light emitting device is composed of a first plurality of light emitting elements mounted on a substrate and a first sealing resin for sealing the first plurality of light emitting elements, and is a first light emitting device that emits cyan light. It has a light emitting part. Further, this light emitting device is composed of a second plurality of light emitting elements mounted on a substrate and a second sealing resin for sealing the second plurality of light emitting elements, and emits red light. It has a light emitting part. Further, this light emitting device is a third sealing resin that seals a third plurality of light emitting elements and a third plurality of light emitting elements mounted on a substrate so as to surround the first and second light emitting portions. It has a third light emitting unit that emits blue light. Further, this light emitting device is composed of a fourth plurality of light emitting elements mounted on a substrate so as to surround the third light emitting portion and a fourth sealing resin for sealing the fourth plurality of light emitting elements. It has a fourth light emitting unit that emits green light.
特許文献１に記載の発光装置では、複数の発光領域間に配線パターンが設けられ、配線パターン上に樹脂枠等が設けられる。このため、発光領域内に設けられた配線パターン又は樹脂枠が発光装置の発光面の暗部となって、発光装置による照明にムラが生じてしまうという課題がある。また、配線パターン又は樹脂枠が発光領域内に設けられることで、発光素子を発光領域内に配置するためのスペースが少なくなるという課題がある。 In the light emitting device described in Patent Document 1, a wiring pattern is provided between a plurality of light emitting regions, and a resin frame or the like is provided on the wiring pattern. Therefore, there is a problem that the wiring pattern or the resin frame provided in the light emitting region becomes a dark portion of the light emitting surface of the light emitting device, and the illumination by the light emitting device becomes uneven. Further, since the wiring pattern or the resin frame is provided in the light emitting region, there is a problem that the space for arranging the light emitting element in the light emitting region is reduced.
そこで、本発明は、照明のムラを低減することが可能な発光装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a light emitting device capable of reducing uneven illumination.
本発明の一つの実施形態に係る発光装置は、基板上の第１の領域に配置され、ボンディングワイヤにより互いに直列に電気的に接続された第１の複数の発光素子と、基板上の第１の領域を取り囲む第２の領域に配置され、ボンディングワイヤにより互いに直列に電気的に接続された第２の複数の発光素子と、基板上に設けられ、第１の複数の発光素子に電圧を供給する第１の電極と第１の複数の発光素子とを電気的に接続する第１の配線パターンと、基板上に設けられ、第２の複数の発光素子に電圧を供給する第２の電極と第２の複数の発光素子とを電気的に接続する第２の配線パターンと、を有し、第１の配線パターンは、第２の領域の外側から第２の領域を通り第１の領域へ直線状に延びる一対の第１の突出部を有し、第１の配線パターン及び第２の配線パターンは、第１の突出部を除いて、第２の領域より外側に配置される、ことを特徴とする。 The light emitting device according to one embodiment of the present invention includes a first plurality of light emitting elements arranged in a first region on a substrate and electrically connected in series with each other by a bonding wire, and a first light emitting element on the substrate. A second plurality of light emitting elements arranged in a second region surrounding the region and electrically connected to each other in series by a bonding wire, and a voltage supplied to the first plurality of light emitting elements provided on the substrate. A first wiring pattern for electrically connecting the first electrode and the first plurality of light emitting elements, and a second electrode provided on the substrate and supplying a voltage to the second plurality of light emitting elements. It has a second wiring pattern that electrically connects the second plurality of light emitting elements, and the first wiring pattern passes from the outside of the second region to the first region through the second region. It has a pair of linearly extending first protrusions, and the first wiring pattern and the second wiring pattern are arranged outside the second region except for the first protrusion. It is a feature.
上記の発光装置において、第１の配線パターン及び第２の配線パターンは、それぞれ、第２の領域より外側において保護素子を介して互いに接続された、正と負の電位を供給する一対の配線パターンを有することが好ましい。 In the above light emitting device, the first wiring pattern and the second wiring pattern are a pair of wiring patterns that supply positive and negative potentials, respectively, connected to each other via a protective element outside the second region. It is preferable to have.
上記の発光装置は、第１の複数の発光素子及び第２の複数の発光素子が発する光の光路上に配置され、第２の領域に配置された第２の複数の発光素子が発する光を、第１の領域に配置された第１の複数の発光素子が発する光よりも広く配光させる配光レンズを更に有することが好ましい。 The light emitting device is arranged on the optical path of the light emitted by the first plurality of light emitting elements and the second plurality of light emitting elements, and emits the light emitted by the second plurality of light emitting elements arranged in the second region. , It is preferable to further have a light distribution lens that distributes light wider than the light emitted by the first plurality of light emitting elements arranged in the first region.
上記の発光装置は、第１の複数の発光素子及び第２の複数の発光素子を封止する封止樹脂を更に有し、封止樹脂は、第１の複数の発光素子及び第２の複数の発光素子が発する光を吸収してより長波長の光を発する蛍光体を含み、第１の複数の発光素子を封止する封止樹脂と第１の複数の発光素子とで構成される第１の発光部は、第１の複数の発光素子が発する光と蛍光体が発する光とを混色して、第１の白色光を発し、第２の複数の発光素子を封止する封止樹脂と第２の複数の発光素子とで構成される第２の発光部は、第２の複数の発光素子が発する光と蛍光体が発する光とを混色して、第１の白色光とは異なる第２の白色光を発することが好ましい。 The light emitting device further includes a first plurality of light emitting elements and a sealing resin for sealing the second plurality of light emitting elements, and the sealing resin includes the first plurality of light emitting elements and the second plurality of light emitting elements. It contains a phosphor that absorbs the light emitted by the light emitting element of the above and emits light having a longer wavelength, and is composed of a sealing resin that seals the first plurality of light emitting elements and a first plurality of light emitting elements. The light emitting unit 1 is a sealing resin that mixes the light emitted by the first plurality of light emitting elements and the light emitted by the phosphor to emit the first white light and seals the second plurality of light emitting elements. The second light emitting unit composed of the light emitting element and the second plurality of light emitting elements is different from the first white light by mixing the light emitted by the second plurality of light emitting elements and the light emitted by the phosphor. It is preferable to emit a second white light.
上記の発光装置において、第１の複数の発光素子は、異なる単色光を発する発光素子を組み合わせて第１の白色光を発し、第２の複数の発光素子は、異なる単色光を発する発光素子を組み合わせて第１の白色光とは異なる第２の白色光を発することが好ましい。 In the above light emitting device, the first plurality of light emitting elements combine light emitting elements that emit different monochromatic light to emit the first white light, and the second plurality of light emitting elements emit light emitting elements that emit different monochromatic light. It is preferable to emit a second white light different from the first white light in combination.
上記の発光装置は、基板上の第２の領域を取り囲む第３の領域に配置され、ボンディングワイヤにより互いに直列に電気的に接続された第３の複数の発光素子と、基板上に設けられ、第３の複数の発光素子に電圧を供給する第３の電極と第３の複数の発光素子とを電気的に接続する第３の配線パターンと、を更に有し、第１の配線パターンは、第３の領域の外側から第３の領域及び第２の領域を通り第１の領域へ直線状に延びる一対の第１の突出部を有し、第２の配線パターンは、第３の領域の外側から第３の領域を通り第２の領域へ直線状に延びる一対の第２の突出部を有し、第１の配線パターン、第２の配線パターン、及び第３の配線パターンは、第１の突出部及び第２の突出部を除いて、第３の領域より外側に配置されることが好ましい。 The light emitting device is arranged in a third region surrounding a second region on the substrate, and is provided on the substrate with a plurality of third light emitting elements electrically connected in series with each other by a bonding wire. It further has a third wiring pattern for electrically connecting the third electrode for supplying a voltage to the third plurality of light emitting elements and the third plurality of light emitting elements, and the first wiring pattern is It has a pair of first protrusions that extend linearly from the outside of the third region through the third region and the second region to the first region, and the second wiring pattern is the third region. The first wiring pattern, the second wiring pattern, and the third wiring pattern have a pair of second protrusions extending linearly from the outside through the third region to the second region. It is preferable that the wiring is arranged outside the third region, except for the protruding portion and the second protruding portion.
本発明は、照明のムラを低減することが可能な発光装置を提供することができる。 The present invention can provide a light emitting device capable of reducing uneven illumination.
以下、本発明の好適な実施形態について図面を用いて説明する。なお、本発明は以下の実施形態に限定されるものではなく、その要旨を逸脱しない範囲において適宜変更可能である。また、各図において同一、又は相当する機能を有するものは、同一符号を付し、その説明を省略又は簡潔にすることもある。 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments, and can be appropriately modified without departing from the gist thereof. In addition, those having the same or equivalent functions in each figure may be designated by the same reference numerals, and the description thereof may be omitted or simplified.
図１は、一つの実施形態に係る発光装置１の一例を模式的に示す上面図である。また、図２は、一つの実施形態に係る発光装置１の一例を模式的に示す断面図である。図２は、図１に示す発光装置１のＶＡ−ＶＡ線に沿った断面を示している。この発光装置１は、例えば、投光器、高天井照明、スタジアム照明、イルミネーション等の用途に利用される。 FIG. 1 is a top view schematically showing an example of a light emitting device 1 according to one embodiment. Further, FIG. 2 is a cross-sectional view schematically showing an example of the light emitting device 1 according to one embodiment. FIG. 2 shows a cross section of the light emitting device 1 shown in FIG. 1 along the VA-VA line. The light emitting device 1 is used for, for example, a floodlight, high ceiling lighting, stadium lighting, illumination, and the like.
発光装置１は、基板２、及び基板２上に実装された複数の発光素子３を有する。この基板２は、実装基板２０及び回路基板２１を有する。 The light emitting device 1 has a substrate 2 and a plurality of light emitting elements 3 mounted on the substrate 2. The board 2 has a mounting board 20 and a circuit board 21.
実装基板２０は、アルミニウム、セラミック又は銅等の耐熱性及び放熱性に優れた金属で形成される平坦な基板である。或いは、実装基板２０は、基板内部にメタルコアを有するメタルコア基板であってもよい。例えば、図１に示す実装基板２０は、上面視において正方形状を有し、その中央部に発光素子３が実装される円形状の実装領域２００を有する。この実装領域２００は、内側から順に、第１の領域２０１、第２の領域２０２、及び第３の領域２０３に分けられる。これらの各領域は、必ずしも円形状である必要はなく、第２の領域２０２が第１の領域２０１を取り囲むように配置され、第３の領域２０３が第２の領域２０２を取り囲むように配置されていればよい。また、実装領域２００は、４以上の領域に分けられてもよく、図９で後述するように２つの領域に分けられてもよい。実装基板２０は、実装領域２００上に実装される発光素子３から生じる熱を放熱させるための放熱板としても機能する。 The mounting substrate 20 is a flat substrate made of a metal having excellent heat resistance and heat dissipation, such as aluminum, ceramic, or copper. Alternatively, the mounting substrate 20 may be a metal core substrate having a metal core inside the substrate. For example, the mounting substrate 20 shown in FIG. 1 has a square shape when viewed from above, and has a circular mounting region 200 in which the light emitting element 3 is mounted at the center thereof. The mounting area 200 is divided into a first area 201, a second area 202, and a third area 203 in order from the inside. Each of these regions does not necessarily have to be circular, the second region 202 is arranged so as to surround the first region 201, and the third region 203 is arranged so as to surround the second region 202. I just need to be there. Further, the mounting area 200 may be divided into four or more areas, or may be divided into two areas as described later in FIG. The mounting board 20 also functions as a heat radiating plate for dissipating heat generated from the light emitting element 3 mounted on the mounting area 200.
回路基板２１は、ガラスエポキシ等の絶縁性の樹脂で形成される平坦な基板である。例えば、図１に示す回路基板２１は、上面視において実装基板２０と概ね同じ正方形状を有し、その中央部に実装領域２００と概ね同じ円形状の開口部を有する。回路基板２１は、例えば、接着シート又は接着剤等によって実装基板２０に固定される。 The circuit board 21 is a flat substrate formed of an insulating resin such as glass epoxy. For example, the circuit board 21 shown in FIG. 1 has a square shape substantially the same as the mounting board 20 in a top view, and has a circular opening substantially the same as the mounting region 200 in the central portion thereof. The circuit board 21 is fixed to the mounting board 20 with, for example, an adhesive sheet or an adhesive.
発光素子３は、発光装置１の発光面から照射される光を作るための単色光又は白色光を発するＬＥＤ等の半導体発光素子である。発光素子３は、それぞれ、例えば、ＲＧＢ（赤、緑、青）又はＣＭＹ（シアン、マゼンタ、黄）等の原色光を発する。或いは、発光素子３は、白色光を発してもよい。或いは、発光素子３は、青等の短波長の単色光を発し、この短波長の光を吸収してより長波長の赤、緑、黄等の単色光を発する蛍光体を含む封止樹脂２３と組み合わされて白色光を発してもよい。発光素子３は、その発する光が回路基板２１の開口部から照射されるように、発光装置１の発光面となる実装基板２０の実装領域２００に、例えば、接着剤等によって固定される。 The light emitting element 3 is a semiconductor light emitting element such as an LED that emits monochromatic light or white light for producing light emitted from the light emitting surface of the light emitting device 1. Each of the light emitting elements 3 emits primary color light such as RGB (red, green, blue) or CMY (cyan, magenta, yellow). Alternatively, the light emitting element 3 may emit white light. Alternatively, the light emitting element 3 emits a short wavelength monochromatic light such as blue, absorbs the short wavelength light, and emits a longer wavelength monochromatic light such as red, green, and yellow. May emit white light in combination with. The light emitting element 3 is fixed to the mounting area 200 of the mounting board 20 which is the light emitting surface of the light emitting device 1 by, for example, an adhesive so that the emitted light is emitted from the opening of the circuit board 21.
例えば、図１に示す発光素子３は、第１〜第３の３つの系統に分けられて、実装領域２００に配置されている。第１の領域２０１に配置された第１の複数の発光素子３は、同一の又は互いに異なる単色光を発する発光素子３を組み合わせて第１の色の光を発する第１の発光部を構成する。同様に、第２の領域２０２に配置された第２の複数の発光素子３は、第２の色の光を発する第２の発光部を構成し、第３の領域２０３に配置された第３の複数の発光素子３は、第３の色の光を発する第３の発光部を構成する。これらの第１〜第３の色は、互いに異なる色であってもよく、同一の色であってもよい。例えば、第１〜第３の色は、互いに色温度が異なる白色光とされる。 For example, the light emitting element 3 shown in FIG. 1 is divided into three systems, first to third, and arranged in the mounting area 200. The first plurality of light emitting elements 3 arranged in the first region 201 form a first light emitting unit that emits light of the first color by combining light emitting elements 3 that emit the same or different monochromatic light. .. Similarly, the second plurality of light emitting elements 3 arranged in the second region 202 form a second light emitting unit that emits light of the second color, and the third light emitting element 3 arranged in the third region 203. The plurality of light emitting elements 3 constitute a third light emitting unit that emits light of a third color. These first to third colors may be different colors from each other or may be the same color. For example, the first to third colors are white light having different color temperatures.
第１〜第３の複数の発光素子３は、それぞれ、所定数Ｎ個の発光素子３が、金、銀、銅又はアルミニウム等からなるボンディングワイヤ４によって互いに直列に電気的に接続されて構成される。例えば、図１では、所定数Ｎ＝１２である。第１〜第３の複数の発光素子３は、それぞれ、更に並列に接続されてもよい。例えば、図１に示す第１の領域２０１には、１２個の発光素子３で構成される第１の複数の発光素子３が、第１の領域２０１の左側の領域と右側の領域に並列にそれぞれ配置されている。また、第２の領域２０２には、１２個の発光素子３で構成される第２の複数の発光素子３が、第２の領域２０２の上側の領域と下側の領域に並列にそれぞれ配置されている。また、第３の領域２０３には、１２個の発光素子３で構成される第３の複数の発光素子３が、第３の領域２０３の左側の領域と右側の領域に並列にそれぞれ配置されている。 Each of the first to third light emitting elements 3 is configured by electrically connecting a predetermined number of N light emitting elements 3 in series with each other by a bonding wire 4 made of gold, silver, copper, aluminum or the like. To. For example, in FIG. 1, a predetermined number N = 12. The first to third plurality of light emitting elements 3 may be further connected in parallel. For example, in the first region 201 shown in FIG. 1, a plurality of first light emitting elements 3 composed of 12 light emitting elements 3 are arranged in parallel with the left region and the right region of the first region 201. Each is arranged. Further, in the second region 202, a second plurality of light emitting elements 3 composed of 12 light emitting elements 3 are arranged in parallel in the upper region and the lower region of the second region 202, respectively. ing. Further, in the third region 203, a third plurality of light emitting elements 3 composed of 12 light emitting elements 3 are arranged in parallel in the left region and the right region of the third region 203, respectively. There is.
電極５１Ａ、５１Ｂ、５２Ａ、５２Ｂ、５３Ａ、５３Ｂ、及び配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂは、回路基板２１上に金メッキ等で形成され、外部電源（図示せず）から印加される正と負の電位を発光素子３に供給する。実装領域２００に配置された発光素子３は、電極５１Ａ、５１Ｂ、５２Ａ、５２Ｂ、５３Ａ、５３Ｂ、及び配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂを介して、外部電源から電圧が印加されることで光を発する。 The electrodes 51A, 51B, 52A, 52B, 53A, 53B, and the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B are formed on the circuit board 21 by gold plating or the like, and are applied from an external power source (not shown). Positive and negative potentials are supplied to the light emitting element 3. A voltage is applied to the light emitting element 3 arranged in the mounting region 200 from an external power source via the electrodes 51A, 51B, 52A, 52B, 53A, 53B, and the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B. It emits light.
電極５１Ａ、５１Ｂは、第１の電極の一例であり、電極５２Ａ、５２Ｂは、第２の電極の一例であり、電極５３Ａ、５３Ｂは、第３の電極の一例である。また、配線パターン６１Ａ、６１Ｂは、第１の配線パターンの一例であり、配線パターン６２Ａ、６２Ｂは、第２の配線パターンの一例であり、配線パターン６３Ａ、６３Ｂは、第３の配線パターンの一例である。 The electrodes 51A and 51B are examples of the first electrode, the electrodes 52A and 52B are examples of the second electrode, and the electrodes 53A and 53B are examples of the third electrode. Further, the wiring patterns 61A and 61B are examples of the first wiring pattern, the wiring patterns 62A and 62B are examples of the second wiring pattern, and the wiring patterns 63A and 63B are examples of the third wiring pattern. Is.
例えば、図１に示す電極５１Ａ、５１Ｂ、５２Ａ、５２Ｂ、５３Ａ、５３Ｂは、回路基板２１の対角線上で互いに向かい合う頂点付近に設けられている。また、図１に示す配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂは、発光装置１の発光面となる実装領域２００の外縁部に沿った回路基板２１上に設けられている。電極５１Ａ、５２Ａ、５３Ａ、及び配線パターン６１Ａ、６２Ａ、６３Ａは、外部電源から印加される正電位を発光素子３の一端（アノード）に供給する。また、電極５１Ｂ、５２Ｂ、５３Ｂ、及び配線パターン６１Ｂ、６２Ｂ、６３Ｂは、外部電源から印加される負電位を発光素子３の他端（カソード）に供給する。 For example, the electrodes 51A, 51B, 52A, 52B, 53A, and 53B shown in FIG. 1 are provided near the vertices facing each other on the diagonal line of the circuit board 21. Further, the wiring patterns 61A, 61B, 62A, 62B, 63A, and 63B shown in FIG. 1 are provided on the circuit board 21 along the outer edge of the mounting region 200 which is the light emitting surface of the light emitting device 1. The electrodes 51A, 52A, 53A and the wiring patterns 61A, 62A, 63A supply a positive potential applied from an external power source to one end (anode) of the light emitting element 3. Further, the electrodes 51B, 52B, 53B and the wiring patterns 61B, 62B, 63B supply a negative potential applied from an external power source to the other end (cathode) of the light emitting element 3.
発光素子３が発する光の光量は、電極５１Ａ、５１Ｂ、５２Ａ、５２Ｂ、５３Ａ、５３Ｂ、及び配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂを介して供給される電流の大きさを調整することで、第１〜第３の系統ごとに独立に制御される。 The amount of light emitted by the light emitting element 3 adjusts the magnitude of the current supplied through the electrodes 51A, 51B, 52A, 52B, 53A, 53B, and the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B. Therefore, it is controlled independently for each of the first to third systems.
配線パターン６１Ａ、６１Ｂは、第３の領域２０３の外側の互いに反対の方向に設けられた電極５１Ａ、５１Ｂから、第３の領域２０３及び第２の領域２０２を通り第１の領域２０１へ直線状に延びる一対の第１の突出部７１Ａ、７１Ｂを有する。また、配線パターン６２Ａ、６２Ｂは、第３の領域２０３の外側の互いに反対の方向から、第３の領域２０３を通り第２の領域２０２へ直線状に延びる一対の第２の突出部７２Ａ、７２Ｂを有する。これにより、第１〜第３の複数の発光素子３が、発光装置１の発光面となる実装領域２００内に分散して配置されて、第１〜第３の系統ごとにボンディングワイヤ４によって配線されやすくなる。この結果、発光装置１による照明のムラが低減される。 The wiring patterns 61A and 61B are linear from the electrodes 51A and 51B provided on the outer side of the third region 203 in opposite directions to the first region 201 through the third region 203 and the second region 202. It has a pair of first protrusions 71A and 71B extending in. Further, the wiring patterns 62A and 62B are a pair of second protruding portions 72A and 72B extending linearly from the outer side of the third region 203 in opposite directions to the second region 202 through the third region 203. Has. As a result, the first to third light emitting elements 3 are dispersedly arranged in the mounting region 200 which is the light emitting surface of the light emitting device 1, and are wired by the bonding wires 4 for each of the first to third systems. It becomes easy to be done. As a result, uneven illumination by the light emitting device 1 is reduced.
例えば、図１に示す第１の突出部７１Ａは、ボンディングワイヤ４によって第１の複数の発光素子３の一端と電気的に接続され、第１の突出部７１Ｂは、ボンディングワイヤ４によって第１の複数の発光素子３の他端と電気的に接続される。また、第２の突出部７２Ａは、ボンディングワイヤ４によって第２の複数の発光素子３の一端と電気的に接続され、第２の突出部７２Ｂは、ボンディングワイヤ４によって第２の複数の発光素子３の他端と電気的に接続される。 For example, the first protruding portion 71A shown in FIG. 1 is electrically connected to one end of the first plurality of light emitting elements 3 by the bonding wire 4, and the first protruding portion 71B is first connected by the bonding wire 4. It is electrically connected to the other ends of the plurality of light emitting elements 3. Further, the second protruding portion 72A is electrically connected to one end of the second plurality of light emitting elements 3 by the bonding wire 4, and the second protruding portion 72B is connected to the second plurality of light emitting elements by the bonding wire 4. It is electrically connected to the other end of 3.
各系統の第１〜第３の複数の発光素子３は、上述のように、所定数Ｎ個の発光素子３が互いに直列に接続されて構成されることが好ましい。これにより、一つの発光素子３を発光させる電圧をＶｆとすると、例えば、正極の電極５１Ａ、５２Ａ、５３Ａと負極の電極５１Ｂ、５２Ｂ、５３Ｂとの間にＮ×Ｖｆの電圧を印加することで、第１〜第３の複数の発光素子３のそれぞれに同一の電圧Ｖｆが印加される。なお、第１〜第３の複数の発光素子３のそれぞれの発光素子３に印加される電圧は、必ずしも同一の電圧Ｖｆである必要はなく、例えば、発する原色光ごとに発光素子３に印加電圧を異ならせてもよい。また、各系統の第１〜第３の複数の発光素子３に印加される電圧も、必ずしもＮ×Ｖｆである必要はなく、系統ごとに印加電圧又は所定数Ｎを異ならせてもよい。 As described above, the first to third light emitting elements 3 of each system are preferably configured by connecting a predetermined number of N light emitting elements 3 in series with each other. As a result, assuming that the voltage for causing one light emitting element 3 to emit light is Vf, for example, by applying a voltage of N × Vf between the positive electrode 51A, 52A, 53A and the negative electrode 51B, 52B, 53B. , The same voltage Vf is applied to each of the first to third light emitting elements 3. The voltage applied to each of the light emitting elements 3 of the first to third light emitting elements 3 does not necessarily have to be the same voltage Vf. For example, the voltage applied to the light emitting element 3 for each primary color light emitted. May be different. Further, the voltage applied to the first to third plurality of light emitting elements 3 of each system does not necessarily have to be N × Vf, and the applied voltage or a predetermined number N may be different for each system.
発光装置１の発光面となる実装領域２００の縁部に沿った配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂ上には、実装領域２００に充填される封止樹脂２３の流出を防止するための樹脂枠２２が設けられる。樹脂枠２２は、白色粒子が混入された不透明なシリコーン樹脂等で構成されて反射性を有してもよい。これにより、発光素子３から側方に発せられた光が、封止樹脂２３によって反射されて発光装置１の発光面の正面（回路基板２１の開口部）に向かうため、発光装置１による照明が明るくなる。 The sealing resin 23 filled in the mounting area 200 is prevented from flowing out on the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B along the edge of the mounting area 200 which is the light emitting surface of the light emitting device 1. A resin frame 22 for the purpose is provided. The resin frame 22 may be made of an opaque silicone resin or the like mixed with white particles and may have reflectivity. As a result, the light emitted laterally from the light emitting element 3 is reflected by the sealing resin 23 and directed to the front surface of the light emitting surface of the light emitting device 1 (the opening of the circuit board 21), so that the lighting by the light emitting device 1 is illuminated. It gets brighter.
封止樹脂２３は、樹脂枠２２により囲まれる実装領域２００上の空間に充填され、実装領域２００上に配置された発光素子３を封止して保護する。封止樹脂２３は、発光素子３が発する光を吸収してより長波長の光を発する蛍光体を含んでもよい。この場合、第１の複数の発光素子３と第１の領域２０１上の封止樹脂２３とで構成される第１の発光部は、第１の複数の発光素子３が発する光と蛍光体が発する光とを混色して、第１の色の光を発する。また、第２の複数の発光素子３と第２の領域２０２上の封止樹脂２３とで構成される第２の発光部は、第２の複数の発光素子３が発する光と蛍光体が発する光とを混色して、第２の色の光を発する。また、第３の複数の発光素子３と第３の領域２０３上の封止樹脂２３とで構成される第３の発光部は、第３の色の光を発する。これらの第１〜第３の色は、互いに異なる色であってもよく、同一の色であってもよい。例えば、第１〜第３の色は、互いに色温度が異なる白色光とされる。 The sealing resin 23 fills the space on the mounting region 200 surrounded by the resin frame 22, and seals and protects the light emitting element 3 arranged on the mounting region 200. The sealing resin 23 may contain a phosphor that absorbs the light emitted by the light emitting element 3 and emits light having a longer wavelength. In this case, in the first light emitting unit composed of the first plurality of light emitting elements 3 and the sealing resin 23 on the first region 201, the light and the phosphor emitted by the first plurality of light emitting elements 3 are present. The light of the first color is emitted by mixing the emitted light. Further, the second light emitting portion composed of the second plurality of light emitting elements 3 and the sealing resin 23 on the second region 202 emits the light emitted by the second plurality of light emitting elements 3 and the phosphor. It mixes with light to emit a second color of light. Further, the third light emitting portion composed of the third plurality of light emitting elements 3 and the sealing resin 23 on the third region 203 emits light of the third color. These first to third colors may be different colors from each other or may be the same color. For example, the first to third colors are white light having different color temperatures.
保護素子８は、例えば、ツェナーダイオードであり、発光素子３に過電圧が供給されたときに電流をバイパスさせて発光素子３を保護する。保護素子８は、配線パターン６１Ａ、６２Ａ、６３Ａと配線パターン６１Ｂ、６２Ｂ、６３Ｂの間に、それぞれ、第１〜第３の複数の発光素子３と並列にワイヤを介して接続される。例えば、図１に示す保護素子８は、発光装置１の発光面となる実装領域２００より外側の回路基板２１上に設けられている。このように、発光装置１の保護素子８が、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂとともに実装領域２００より外側に設けられることで、第１〜第３の複数の発光素子３は、発光装置１の発光面となる実装領域２００内に分散して配置される。この結果、発光装置１による照明のムラが低減される。 The protection element 8 is, for example, a Zener diode, and protects the light emitting element 3 by bypassing a current when an overvoltage is supplied to the light emitting element 3. The protection element 8 is connected between the wiring patterns 61A, 62A, 63A and the wiring patterns 61B, 62B, 63B, respectively, in parallel with the first to third plurality of light emitting elements 3 via a wire. For example, the protection element 8 shown in FIG. 1 is provided on the circuit board 21 outside the mounting region 200, which is the light emitting surface of the light emitting device 1. In this way, the protective element 8 of the light emitting device 1 is provided outside the mounting area 200 together with the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B, so that the first to third plurality of light emitting elements 3 can be formed. , Dispersed and arranged in the mounting area 200 which is the light emitting surface of the light emitting device 1. As a result, uneven illumination by the light emitting device 1 is reduced.
以下、図１に示す発光装置１の製造方法について簡単に説明する。まず、実装基板２０の実装領域２００上に発光素子３が固定され、第１〜第３の複数の発光素子３が、それぞれ、ボンディングワイヤ４で所定数Ｎ個ずつ直列に電気的に接続される。次に、電極５１Ａ、５１Ｂ、５２Ａ、５２Ｂ、５３Ａ、５３Ｂ、及び配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂが設けられた回路基板２１が、実装基板２０上に固定される。次に、第１〜第３の複数の発光素子３の両端部に位置する発光素子３が、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂ、又は第１の突出部７１Ａ、７１Ｂ、第２の突出部７２Ａ、７２Ｂに、ボンディングワイヤ４で電気的に接続される。次に、実装領域２００の縁部に沿った配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂ上に、樹脂枠２２が固定される。そして、樹脂枠２２により囲まれる実装領域２００に封止樹脂２３が充填されて、発光素子３が封止される。以上の工程により、図１に示す発光装置１が製造される。 Hereinafter, a method for manufacturing the light emitting device 1 shown in FIG. 1 will be briefly described. First, the light emitting elements 3 are fixed on the mounting area 200 of the mounting substrate 20, and a predetermined number N of each of the first to third light emitting elements 3 are electrically connected in series by the bonding wires 4. .. Next, the circuit board 21 provided with the electrodes 51A, 51B, 52A, 52B, 53A, 53B and the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B is fixed on the mounting board 20. Next, the light emitting elements 3 located at both ends of the first to third plurality of light emitting elements 3 have wiring patterns 61A, 61B, 62A, 62B, 63A, 63B, or the first protruding portions 71A, 71B, first. It is electrically connected to the protrusions 72A and 72B of 2 by the bonding wire 4. Next, the resin frame 22 is fixed on the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B along the edge of the mounting area 200. Then, the sealing resin 23 is filled in the mounting region 200 surrounded by the resin frame 22, and the light emitting element 3 is sealed. Through the above steps, the light emitting device 1 shown in FIG. 1 is manufactured.
図３は、比較例の発光装置１ｂを模式的に示す上面図である。また、図４は、比較例の発光装置１ｂを模式的に示す断面図である。図４は、図３に示す発光装置１のＶＢ−ＶＢ線に沿った断面を示している。図３及び図４に示す比較例の発光装置１ｂは、図１及び図２に示した発光装置１と比べて、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂが、発光装置１の発光面となる実装領域２００内に配置されている点で異なる。その他については、発光装置１ｂは、図１及び図２に示した発光装置１と同じであるため、説明は省略する。 FIG. 3 is a top view schematically showing the light emitting device 1b of the comparative example. Further, FIG. 4 is a cross-sectional view schematically showing the light emitting device 1b of the comparative example. FIG. 4 shows a cross section of the light emitting device 1 shown in FIG. 3 along the VB-VB line. In the light emitting device 1b of the comparative example shown in FIGS. 3 and 4, the wiring patterns 61A, 61B, 62A, and 62B are mounted as the light emitting surface of the light emitting device 1 as compared with the light emitting device 1 shown in FIGS. 1 and 2. It differs in that it is arranged in the area 200. Other than that, the light emitting device 1b is the same as the light emitting device 1 shown in FIGS. 1 and 2, and thus the description thereof will be omitted.
図３及び図４に示す比較例の発光装置１ｂの配線パターン６１Ａ、６１Ｂは、第１の領域２０１と第２の領域２０２の間に設けられた回路基板２１上に設けられ、樹脂枠２２で覆われる。同様に、発光装置１ｂの配線パターン６２Ａ、６２Ｂは、第２の領域２０２と第３の領域２０３の間に設けられた回路基板２１上に設けられ、樹脂枠２２で覆われる。 The wiring patterns 61A and 61B of the light emitting device 1b of the comparative example shown in FIGS. 3 and 4 are provided on the circuit board 21 provided between the first region 201 and the second region 202, and are provided by the resin frame 22. Be covered. Similarly, the wiring patterns 62A and 62B of the light emitting device 1b are provided on the circuit board 21 provided between the second region 202 and the third region 203, and are covered with the resin frame 22.
発光素子３は、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂから少なくとも所定の距離を隔てて配置される必要がある。このため、発光装置１ｂでは、実装領域２００に配置された全ての発光素子３に電圧を印加して発光装置１ｂを点灯させたとき、図５に示すように、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂの周辺領域が暗部６４となって照明にムラが生じてしまう。 The light emitting element 3 needs to be arranged at least a predetermined distance from the wiring patterns 61A, 61B, 62A, and 62B. Therefore, in the light emitting device 1b, when the light emitting device 1b is turned on by applying a voltage to all the light emitting elements 3 arranged in the mounting area 200, the wiring patterns 61A, 61B, 62A, as shown in FIG. The peripheral region of 62B becomes a dark portion 64, causing uneven illumination.
一方、図１及び図２に示した本実施形態の発光装置１の配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂは、第１の突出部７１Ａ、７１Ｂ、及び第２の突出部７２Ａ、７２Ｂを除いて、実装領域２００より外側の回路基板２１上に設けられる。また、保護素子８も、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂとともに、実装領域２００より外側の回路基板２１上に設けられる。 On the other hand, the wiring patterns 61A, 61B, 62A, 62B of the light emitting device 1 of the present embodiment shown in FIGS. 1 and 2 exclude the first protruding portions 71A, 71B and the second protruding portions 72A, 72B. , It is provided on the circuit board 21 outside the mounting area 200. Further, the protective element 8 is also provided on the circuit board 21 outside the mounting area 200 together with the wiring patterns 61A, 61B, 62A, 62B, 63A, and 63B.
このため、発光装置１では、発光装置１ｂと比較して、暗部となる領域が実装領域２００内から除かれるため、実装領域２００に配置された全ての発光素子３に電圧を印加して発光装置１を点灯させたとき、図６に示すように、照明にムラが生じない。この結果、発光装置１による照明のムラが低減される。また、発光装置１では、発光装置１ｂと比較して、実装領域２００により多くの発光素子３を配置することができるため、照明が明るくなる。なお、第１の突出部７１Ａ、７１Ｂ、及び第２の突出部７２Ａ、７２Ｂは、これらが暗部とならないように、その幅が、実装領域２００上に配置された発光素子３を互いに電気的に接続するボンディングワイヤ４の平均ピッチ幅より短くされることが好ましい。 Therefore, in the light emitting device 1, since the dark region is excluded from the mounting area 200 as compared with the light emitting device 1b, a voltage is applied to all the light emitting elements 3 arranged in the mounting area 200 to make the light emitting device. When 1 is turned on, as shown in FIG. 6, there is no unevenness in lighting. As a result, uneven illumination by the light emitting device 1 is reduced. Further, in the light emitting device 1, more light emitting elements 3 can be arranged in the mounting area 200 as compared with the light emitting device 1b, so that the illumination becomes brighter. The widths of the first protrusions 71A and 71B and the second protrusions 72A and 72B are such that the light emitting elements 3 arranged on the mounting area 200 are electrically connected to each other so that they do not become dark parts. It is preferably shorter than the average pitch width of the bonding wires 4 to be connected.
図７は、一つの実施形態に係る発光装置１に配光レンズ９を組み合わせた発光装置１ｃの一例を模式的に示す図である。図７に示す発光装置１ｃは、図１に示した発光装置１の発光面から照射される光の光路上に配置された配光レンズ９を更に有する。 FIG. 7 is a diagram schematically showing an example of a light emitting device 1c in which a light distribution lens 9 is combined with a light emitting device 1 according to one embodiment. The light emitting device 1c shown in FIG. 7 further includes a light distribution lens 9 arranged on the optical path of the light emitted from the light emitting surface of the light emitting device 1 shown in FIG.
配光レンズ９は、図７に示すように、発光装置１の第２の領域２０２に配置された第２の複数の発光素子３が発する光を、発光装置１の第１の領域２０１に配置された第１の複数の発光素子３が発する光よりも広く配光させる。また、配光レンズ９は、発光装置１の第３の領域２０３に配置された第３の複数の発光素子３が発する光を、発光装置１の第２の領域２０２に配置された第２の複数の発光素子３が発する光よりも広く配光させる。 As shown in FIG. 7, the light distribution lens 9 arranges the light emitted by the second plurality of light emitting elements 3 arranged in the second region 202 of the light emitting device 1 in the first region 201 of the light emitting device 1. The light is distributed wider than the light emitted by the first plurality of light emitting elements 3. Further, the light distribution lens 9 is a second light emitting device 1 in which the light emitted by the third plurality of light emitting elements 3 arranged in the third region 203 of the light emitting device 1 is arranged in the second region 202 of the light emitting device 1. The light is distributed wider than the light emitted by the plurality of light emitting elements 3.
これにより、配光レンズ９を有する発光装置１ｃは、外部電源から電圧を印加する第１〜第３の複数の発光素子３の各系統の組み合わせを変えて、発光装置１ｃによる照明の配光角を調整することができる。例えば、発光装置１ｃが室内の天井等に設置される場合、発光装置１ｃは、電極５１Ａ、５１Ｂに電圧が印加されると、第１の領域２０１に配置された第１の複数の発光素子３が光を発し、室内の天井の直下の空間のみを照明する。また、発光装置１ｃは、電極５１Ａ、５１Ｂ、５２Ａ、５２Ｂに電圧が印加されると、第１の領域２０１及び第２の領域２０２に配置された第１〜第２の複数の発光素子３が光を発し、室内のより広い空間を照明する。また、発光装置１ｃは、電極５１Ａ、５１Ｂ、５２Ａ、５２Ｂ、５３Ａ、５３Ｂに電圧が印加されると、実装領域２００に配置された全ての発光素子３が光を発し、室内全体を照明する。 As a result, the light emitting device 1c having the light distribution lens 9 changes the combination of each system of the first to third plurality of light emitting elements 3 to which the voltage is applied from the external power source, and the light distribution angle of the illumination by the light emitting device 1c. Can be adjusted. For example, when the light emitting device 1c is installed on the ceiling or the like in a room, the light emitting device 1c has a plurality of first light emitting elements 3 arranged in the first region 201 when a voltage is applied to the electrodes 51A and 51B. Emits light and illuminates only the space directly below the ceiling in the room. Further, in the light emitting device 1c, when a voltage is applied to the electrodes 51A, 51B, 52A, 52B, the first and second plurality of light emitting elements 3 arranged in the first region 201 and the second region 202 are arranged. It emits light and illuminates a wider space in the room. Further, in the light emitting device 1c, when a voltage is applied to the electrodes 51A, 51B, 52A, 52B, 53A, 53B, all the light emitting elements 3 arranged in the mounting area 200 emit light to illuminate the entire room.
以上のように、発光装置は、第１の領域に配置され、ボンディングワイヤにより互いに直列に接続された第１の複数の発光素子と、第１の領域を取り囲む第２の領域に配置され、ボンディングワイヤにより互いに直列に接続された第２の複数の発光素子を有する。また、発光装置は、第１の複数の発光素子に電圧を供給する第１の電極と第１の複数の発光素子とを接続する第１の配線パターンと、第２の複数の発光素子に電圧を供給する第２の電極と第２の複数の発光素子とを接続する第２の配線パターンと、を有する。また、第１の配線パターンは、第２の領域の外側から第２の領域を通り第１の領域へ直線状に延びる一対の第１の突出部を有し、第１の配線パターン及び第２の配線パターンは、第１の突出部を除いて、第２の領域より外側に配置される。これにより、発光装置は、照明のムラを低減することができる。また、発光面となる実装領域上により多くの発光素子を配置することができるため、発光装置による照明が明るくなる。 As described above, the light emitting device is arranged in the first region, is arranged in the first plurality of light emitting elements connected in series with each other by the bonding wire, and in the second region surrounding the first region, and is bonded. It has a second plurality of light emitting elements connected in series with each other by wires. Further, the light emitting device has a first wiring pattern for connecting a first electrode for supplying a voltage to the first plurality of light emitting elements and the first plurality of light emitting elements, and a voltage to the second plurality of light emitting elements. It has a second wiring pattern for connecting the second electrode and the second plurality of light emitting elements. Further, the first wiring pattern has a pair of first protrusions extending linearly from the outside of the second region through the second region to the first region, and the first wiring pattern and the second The wiring pattern of is arranged outside the second region except for the first protrusion. Thereby, the light emitting device can reduce the unevenness of illumination. Further, since more light emitting elements can be arranged on the mounting area to be the light emitting surface, the illumination by the light emitting device becomes brighter.
上述の実施形態は、いずれも本発明を実施するにあたっての具体化の例を示したものに過ぎず、これらによって本発明の技術的範囲が限定的に解釈されてはならない。すなわち、本発明はその技術思想、又はその主要な特徴から逸脱することなく、様々な形で実施することができる。 The above-described embodiments are merely examples of implementation in carrying out the present invention, and the technical scope of the present invention should not be construed in a limited manner by these. That is, the present invention can be implemented in various forms without departing from the technical idea or its main features.
発光装置１は、外部電源から電圧を印加する第１〜第３の複数の発光素子３の各系統の組み合わせを変えて、発光装置１による照明の色を調整してもよい。例えば、発光装置１は、電極５１Ａ、５１Ｂに電圧が印加されると、第１の領域２０１に配置された第１の複数の発光素子３が、色温度の低い第１の白色光を発する。更に、発光装置１は、発光装置１の電極５２Ａ、５２Ｂに電圧が印加されると、第２の領域２０２に配置された第２の複数の発光素子３が、より色温度の高い第２の白色光を発する。更に、発光装置１は、発光装置１の電極５３Ａ、５３Ｂに電圧が印加されると、第３の領域２０３に配置された第３の複数の発光素子３が、更に色温度の高い第３の白色光を発する。 The light emitting device 1 may adjust the color of the illumination by the light emitting device 1 by changing the combination of each system of the first to third plurality of light emitting elements 3 to which a voltage is applied from an external power source. For example, in the light emitting device 1, when a voltage is applied to the electrodes 51A and 51B, the first plurality of light emitting elements 3 arranged in the first region 201 emit first white light having a low color temperature. Further, in the light emitting device 1, when a voltage is applied to the electrodes 52A and 52B of the light emitting device 1, the second plurality of light emitting elements 3 arranged in the second region 202 have a second higher color temperature. It emits white light. Further, in the light emitting device 1, when a voltage is applied to the electrodes 53A and 53B of the light emitting device 1, the third plurality of light emitting elements 3 arranged in the third region 203 have a third light emitting device 3 having a higher color temperature. It emits white light.
また、図８は、発光装置１の変形例であって、別の実施形態に係る発光装置１ｄを模式的に示す上面図である。図８に示す発光装置１ｄは、図１に示した発光装置１と比べて、第１の突出部７１Ａ、７１Ｂ、及び第２の突出部７２Ａ、７２Ｂのうちの、第１の突出部７１Ａ、７１Ｂのみを有している点で異なる。また、これに伴い、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂ、６３Ａ、６３Ｂのレイアウトと、ボンディングワイヤ４の接続方法が異なる。その他については、発光装置１ｄは、図１に示した発光装置１と同じであるため、説明は省略する。 Further, FIG. 8 is a top view which is a modification of the light emitting device 1 and schematically shows the light emitting device 1d according to another embodiment. Compared with the light emitting device 1 shown in FIG. 1, the light emitting device 1d shown in FIG. 8 has a first protruding portion 71A, 71B of the first protruding portions 71A, 71B, and the second protruding portions 72A, 72B. It differs in that it has only 71B. Further, along with this, the layout of the wiring patterns 61A, 61B, 62A, 62B, 63A, 63B and the connection method of the bonding wire 4 are different. Since the light emitting device 1d is the same as the light emitting device 1 shown in FIG. 1, the description thereof will be omitted.
第１〜第３の複数の発光素子３を、ボンディングワイヤ４によって第１〜第３の系統ごとに配線しやすくするためには、図１に示した発光装置１のように、２対の第１の突出部７１Ａ、７１Ｂ、及び第２の突出部７２Ａ、７２Ｂの両方を有することが好ましい。しかし、１対の第１の突出部７１Ａ、７１Ｂのみを有する構成でも、例えば、図８に示す発光装置１ｄのように、第１〜第３の複数の発光素子３を、第１〜第３の系統ごとにボンディングワイヤ４によって配線することができる。この場合、発光装置１の発光面となる実装領域２００上により多くの発光素子３を配置することができるため、発光装置１による照明が明るくなる。 In order to facilitate wiring of the first to third light emitting elements 3 for each of the first to third systems by the bonding wire 4, two pairs of light emitting devices 1 are shown as shown in FIG. It is preferable to have both the protrusions 71A and 71B of 1 and the protrusions 72A and 72B of the second. However, even in a configuration having only a pair of first projecting portions 71A and 71B, for example, as in the light emitting device 1d shown in FIG. 8, the first to third plurality of light emitting elements 3 can be attached to the first to third light emitting elements 3. Each system can be wired by the bonding wire 4. In this case, since more light emitting elements 3 can be arranged on the mounting area 200 which is the light emitting surface of the light emitting device 1, the illumination by the light emitting device 1 becomes brighter.
また、図９は、発光装置１の変形例であって、更に別の実施形態に係る発光装置１ｅを模式的に示す上面図である。図９に示す発光装置１ｅは、図１に示した発光装置１と比べて、独立に制御可能な発光領域の系統数が、３系統から、第１の領域２０１と第２の領域２０２の２系統に少なくなっている点で異なる。また、これに伴い、配線パターン６１Ａ、６１Ｂ、６２Ａ、６２Ｂのレイアウトと、ボンディングワイヤ４の接続方法が異なる。その他については、発光装置１ｅは、図１に示した発光装置１と同じであるため、説明は省略する。 Further, FIG. 9 is a top view schematically showing a light emitting device 1e according to still another embodiment, which is a modified example of the light emitting device 1. Compared to the light emitting device 1 shown in FIG. 1, the light emitting device 1e shown in FIG. 9 has a number of systems of light emitting regions that can be controlled independently from 3 systems to 2 of the first region 201 and the second region 202. It differs in that it is reduced in the system. Further, along with this, the layout of the wiring patterns 61A, 61B, 62A, 62B and the connection method of the bonding wire 4 are different. Since the light emitting device 1e is the same as the light emitting device 1 shown in FIG. 1, the description thereof will be omitted.
例えば、図９に示す発光装置１ｅでは、第１の複数の発光素子３は、ボンディングワイヤ４により互いに直列に電気的に接続され、基板２上の第１の領域２０１内の左右にそれぞれ並列に配置される。また、第２の複数の発光素子３は、ボンディングワイヤ４により互いに直列に電気的に接続され、基板２上の第１の領域２０１を取り囲む第２の領域２０２内の左右にそれぞれ並列に配置される。 For example, in the light emitting device 1e shown in FIG. 9, the first plurality of light emitting elements 3 are electrically connected to each other in series by a bonding wire 4, and are parallel to the left and right in the first region 201 on the substrate 2. Be placed. Further, the second plurality of light emitting elements 3 are electrically connected to each other in series by the bonding wire 4, and are arranged in parallel on the left and right sides in the second region 202 surrounding the first region 201 on the substrate 2. To.
また、図９に示す発光装置１ｅでは、配線パターン６１Ａ、６１Ｂは、実装領域２００の外縁部に沿った回路基板２１上に設けられ、第１の複数の発光素子３に電圧を供給する電極５１Ａ、５１Ｂと第１の複数の発光素子３とを電気的に接続する。また、配線パターン６２Ａ、６２Ｂは、実装領域２００の外縁部に沿った回路基板２１上に設けられ、第２の複数の発光素子３に電圧を供給する電極５２Ａ、５２Ｂと第２の複数の発光素子３とを電気的に接続する。 Further, in the light emitting device 1e shown in FIG. 9, the wiring patterns 61A and 61B are provided on the circuit board 21 along the outer edge portion of the mounting region 200, and the electrodes 51A that supply voltage to the first plurality of light emitting elements 3 are provided. , 51B and the first plurality of light emitting elements 3 are electrically connected. Further, the wiring patterns 62A and 62B are provided on the circuit board 21 along the outer edge of the mounting region 200, and the electrodes 52A and 52B and the second plurality of light emitting elements that supply voltage to the second plurality of light emitting elements 3 are emitted. It is electrically connected to the element 3.
配線パターン６１Ａ、６１Ｂは、第２の領域２０２の外側の互いに反対の方向から第２の領域２０２を通り第１の領域２０１へ直線状に延びる一対の第１の突出部７１Ａ、７１Ｂを有する。そして、配線パターン６１Ａ、６１Ｂ及び配線パターン６２Ａ、６２Ｂは、第１の突出部７１Ａ、７１Ｂを除いて、第２の領域２０２より外側に配置される。 The wiring patterns 61A and 61B have a pair of first protrusions 71A and 71B extending linearly from the outer side of the second region 202 in opposite directions through the second region 202 to the first region 201. The wiring patterns 61A and 61B and the wiring patterns 62A and 62B are arranged outside the second region 202 except for the first protrusions 71A and 71B.
このように、独立に制御可能な発光領域が２系統である場合でも、図１に示した独立に制御可能な発光領域が３系統の場合と同様の効果が得られる。 As described above, even when there are two independently controllable light emitting regions, the same effect as in the case where the independently controllable light emitting regions shown in FIG. 1 are three systems can be obtained.
１、１ｂ〜１ｅ 発光装置
２ 基板
３ 発光素子
４ ボンディングワイヤ
８ 保護素子
９ 配光レンズ
２０ 実装基板
２１ 回路基板
２２ 樹脂枠
２３ 封止樹脂
５１Ａ〜５３Ａ 電極
５１Ｂ〜５３Ｂ 電極
６１Ａ〜６３Ａ 配線パターン
６１Ｂ〜６３Ｂ 配線パターン
６４ 暗部
７１Ａ、７１Ｂ 第１の突出部
７２Ａ、７２Ｂ 第２の突出部
２００ 実装領域
２０１ 第１の領域
２０２ 第２の領域
２０３ 第３の領域
1, 1b to 1e Light emitting device 2 Board 3 Light emitting element 4 Bonding wire 8 Protective element 9 Light distribution lens 20 Mounting board 21 Circuit board 22 Resin frame 23 Sealing resin 51A to 53A Electrodes 51B to 53B Electrodes 61A to 63A Wiring pattern 61B to 63B Wiring pattern 64 Dark parts 71A, 71B First protruding parts 72A, 72B Second protruding parts 200 Mounting area 201 First area 202 Second area 203 Third area
Claims (6)
前記基板上の前記第１の領域を取り囲む第２の領域に配置され、ボンディングワイヤにより互いに直列に電気的に接続された第２の複数の発光素子と、
前記基板上に設けられ、前記第１の複数の発光素子に電圧を供給する第１の電極と前記第１の複数の発光素子とを電気的に接続する第１の配線パターンと、
前記基板上に設けられ、前記第２の複数の発光素子に電圧を供給する第２の電極と前記第２の複数の発光素子とを電気的に接続する第２の配線パターンと、を有し、
前記第１の配線パターンは、前記第２の領域の外側から前記第２の領域を通り前記第１の領域へ直線状に延びる一対の第１の突出部を有し、
前記第１の配線パターン及び前記第２の配線パターンは、前記第１の突出部を除いて、前記第２の領域より外側に配置される、
ことを特徴とする発光装置。 A plurality of first light emitting elements arranged in a first region on the substrate and electrically connected in series with each other by bonding wires.
A plurality of second light emitting elements arranged in a second region surrounding the first region on the substrate and electrically connected in series with each other by bonding wires.
A first wiring pattern provided on the substrate and electrically connecting the first electrode for supplying a voltage to the first plurality of light emitting elements and the first plurality of light emitting elements.
It has a second electrode provided on the substrate and supplying a voltage to the second plurality of light emitting elements, and a second wiring pattern for electrically connecting the second plurality of light emitting elements. ,
The first wiring pattern has a pair of first protrusions that linearly extend from the outside of the second region through the second region to the first region.
The first wiring pattern and the second wiring pattern are arranged outside the second region except for the first protrusion.
A light emitting device characterized by that.
請求項１に記載の発光装置。 The first wiring pattern and the second wiring pattern each have a pair of wiring patterns that supply positive and negative potentials that are connected to each other via a protective element outside the second region.
The light emitting device according to claim 1.
請求項１又は２に記載の発光装置。 The light emitted by the second plurality of light emitting elements arranged in the optical path of the light emitted by the first plurality of light emitting elements and the second plurality of light emitting elements and arranged in the second region is emitted. Further having a light distribution lens that distributes light wider than the light emitted by the first plurality of light emitting elements arranged in the first region.
The light emitting device according to claim 1 or 2.
前記封止樹脂は、前記第１の複数の発光素子及び前記第２の複数の発光素子が発する光を吸収してより長波長の光を発する蛍光体を含み、
前記第１の複数の発光素子を封止する前記封止樹脂と前記第１の複数の発光素子とで構成される第１の発光部は、前記第１の複数の発光素子が発する光と前記蛍光体が発する光とを混色して、第１の白色光を発し、
前記第２の複数の発光素子を封止する前記封止樹脂と前記第２の複数の発光素子とで構成される第２の発光部は、前記第２の複数の発光素子が発する光と前記蛍光体が発する光とを混色して、前記第１の白色光とは異なる第２の白色光を発する、
請求項１から３のいずれか一項に記載の発光装置。 Further having a sealing resin for sealing the first plurality of light emitting elements and the second plurality of light emitting elements.
The sealing resin contains a phosphor that absorbs the light emitted by the first plurality of light emitting elements and the second plurality of light emitting elements and emits light having a longer wavelength.
The first light emitting unit composed of the sealing resin for sealing the first plurality of light emitting elements and the first plurality of light emitting elements includes the light emitted by the first plurality of light emitting elements and the said. The first white light is emitted by mixing with the light emitted by the phosphor.
The second light emitting unit composed of the sealing resin for sealing the second plurality of light emitting elements and the second plurality of light emitting elements includes the light emitted by the second plurality of light emitting elements and the said. The light emitted by the phosphor is mixed to emit a second white light different from the first white light.
The light emitting device according to any one of claims 1 to 3.
前記第２の複数の発光素子は、異なる単色光を発する発光素子を組み合わせて前記第１の白色光とは異なる第２の白色光を発する、
請求項１から３のいずれか一項に記載の発光装置。 The first plurality of light emitting elements emit a first white light by combining light emitting elements that emit different monochromatic light.
The second plurality of light emitting elements combine light emitting elements that emit different monochromatic light to emit a second white light different from the first white light.
The light emitting device according to any one of claims 1 to 3.
前記基板上に設けられ、前記第３の複数の発光素子に電圧を供給する第３の電極と前記第３の複数の発光素子とを電気的に接続する第３の配線パターンと、を更に有し、
前記第１の配線パターンは、前記第３の領域の外側から前記第３の領域及び前記第２の領域を通り前記第１の領域へ直線状に延びる一対の前記第１の突出部を有し、
前記第２の配線パターンは、前記第３の領域の外側から前記第３の領域を通り前記第２の領域へ直線状に延びる一対の第２の突出部を有し、
前記第１の配線パターン、前記第２の配線パターン、及び前記第３の配線パターンは、前記第１の突出部及び前記第２の突出部を除いて、前記第３の領域より外側に配置される、
請求項１から５のいずれか一項に記載の発光装置。 A plurality of third light emitting elements arranged in a third region surrounding the second region on the substrate and electrically connected in series with each other by bonding wires.
It further has a third electrode provided on the substrate and supplying a voltage to the third plurality of light emitting elements and a third wiring pattern for electrically connecting the third plurality of light emitting elements. And
The first wiring pattern has a pair of the first protrusions extending linearly from the outside of the third region through the third region and the second region to the first region. ,
The second wiring pattern has a pair of second protrusions that linearly extend from the outside of the third region through the third region to the second region.
The first wiring pattern, the second wiring pattern, and the third wiring pattern are arranged outside the third region except for the first protrusion and the second protrusion. ,
The light emitting device according to any one of claims 1 to 5.
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