JP2020145373A - Electronic component module and connector case thereof - Google Patents

Electronic component module and connector case thereof Download PDF

Info

Publication number
JP2020145373A
JP2020145373A JP2019042746A JP2019042746A JP2020145373A JP 2020145373 A JP2020145373 A JP 2020145373A JP 2019042746 A JP2019042746 A JP 2019042746A JP 2019042746 A JP2019042746 A JP 2019042746A JP 2020145373 A JP2020145373 A JP 2020145373A
Authority
JP
Japan
Prior art keywords
connector
substrate
electronic component
accommodating portion
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019042746A
Other languages
Japanese (ja)
Other versions
JP7287796B2 (en
Inventor
龍一 山崎
Ryuichi Yamazaki
龍一 山崎
川越　純
Jun Kawagoe
純 川越
保弘 儘田
Yasuhiro MAMADA
保弘 儘田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mikuni Corp
Hirose Electric Co Ltd
Original Assignee
Mikuni Corp
Hirose Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mikuni Corp, Hirose Electric Co Ltd filed Critical Mikuni Corp
Priority to JP2019042746A priority Critical patent/JP7287796B2/en
Priority to CN202010150560.0A priority patent/CN111668638B/en
Publication of JP2020145373A publication Critical patent/JP2020145373A/en
Application granted granted Critical
Publication of JP7287796B2 publication Critical patent/JP7287796B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting

Landscapes

  • Connector Housings Or Holding Contact Members (AREA)
  • Casings For Electric Apparatus (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

To provide an electronic component module and a connector case thereof that can prevent damage to a board at the time of insertion into the connector case during assembly work and can achieve a good protection function for the board during use.SOLUTION: A board 2 having a board body 3 and a card edge connector 4 is housed in a connector case 6, and the connector case 6 includes a board housing portion 8, a connector fitting portion 7, and a partition wall 10 through which a slit 11 is formed. The connector fitting portion 7 has an opening 7a which is formed at an end opposite to the board housing portion 8 and to which a mating connector 9 is connected, and the board housing portion 8 has an opening 8a into which the board 2 is inserted at the end opposite to the connector fitting portion 7 along the connector fitting direction. A gap between the board 2 and the slit 11 is closed by a first sealing resin 13 in which a first resin agent injected from the opening 7a of the connector fitting portion 7 is cured, and the board body 3 is sealed with a second sealing resin 16 in which a second resin agent injected from the opening 8a of the board housing portion 8 is cured.SELECTED DRAWING: Figure 5

Description

本発明は、電子部品モジュール及びそのコネクタケースに関する。 The present invention relates to an electronic component module and its connector case.

電子部品が実装された基板本体の一側にカードエッジコネクタを設け、これらの基板本体及びカードエッジコネクタからなる基板をコネクタケース内に配置した電子部品モジュールが知られている。 There is known an electronic component module in which a card edge connector is provided on one side of a board body on which electronic components are mounted, and a board composed of the board body and the card edge connector is arranged in a connector case.

例えば特許文献１に記載された電子部品モジュールは、特許文献１の図６に示すように、上下に扁平な箱状をなすコネクタケース１０内に弾性部材２１が配設されて、上方に開口する第１収容部１１と一側方に開口する第２収容部１３とに区画されている。第１収容部１１内には基板本体３が配置され、基板本体３の下面から突出した電子部品５は、第１収容部１１の底壁に形成された凹部１２内に位置して底壁との干渉が防止されている。この状態において、基板２のカードエッジコネクタ８は弾性部材２１に形成されたスリット２１ａに挿入されて第２収容部１３内に突出し、これによりコネクタ嵌合部が構成されて相手側のコネクタを接続可能となっている。第１収容部１１内には樹脂剤が注入され、硬化した封止樹脂２８により基板本体３が封止されることにより保護されている。 For example, in the electronic component module described in Patent Document 1, as shown in FIG. 6 of Patent Document 1, an elastic member 21 is arranged in a connector case 10 having a vertically flat box shape and opens upward. It is divided into a first accommodating portion 11 and a second accommodating portion 13 that opens to one side. The substrate main body 3 is arranged in the first accommodating portion 11, and the electronic component 5 protruding from the lower surface of the substrate main body 3 is located in the recess 12 formed in the bottom wall of the first accommodating portion 11 and is located on the bottom wall. Interference is prevented. In this state, the card edge connector 8 of the substrate 2 is inserted into the slit 21a formed in the elastic member 21 and protrudes into the second accommodating portion 13, whereby the connector fitting portion is formed and the connector on the other side is connected. It is possible. A resin agent is injected into the first accommodating portion 11, and the substrate main body 3 is sealed by the cured sealing resin 28 to protect the substrate body 3.

電子部品モジュール１を組み立てる際には、まず特許文献１の図８に示すように、基板２を上方斜め方向からコネクタケース１０の第１収容部１１内に挿入し、先端のカードエッジコネクタ８を弾性部材２１のスリット２１ａを介して第２収容部１３内に突出させる。次いで、スリット２１ａを支点として基板２を水平姿勢まで回動させると、基板本体３が第１収容部１１内に配置され、基板本体３の下面から突出する電子部品５が凹部１２内に収まる。 When assembling the electronic component module 1, first, as shown in FIG. 8 of Patent Document 1, the substrate 2 is inserted into the first accommodating portion 11 of the connector case 10 from an oblique upward direction, and the card edge connector 8 at the tip is inserted. It is projected into the second accommodating portion 13 through the slit 21a of the elastic member 21. Next, when the substrate 2 is rotated to the horizontal posture with the slit 21a as a fulcrum, the substrate main body 3 is arranged in the first accommodating portion 11, and the electronic component 5 protruding from the lower surface of the substrate main body 3 is accommodated in the recess 12.

その後に第１収容部１１の上方に注入ノズルを配置して樹脂剤を基板本体３の上面に注入すると、樹脂剤は基板本体３の周囲の間隙を経て基板本体３の下側に導かれ、下側に存在していた空気が基板本体３に貫設されたエア抜き孔を経て上方に排出される。注入された樹脂剤は基板本体３を浸漬すると共に、弾性部材２１に堰き止められて第２収容部１３への漏れが防止され、樹脂剤が硬化して封止樹脂２８として基板本体３を封止すると電子部品モジュール１の組立作業が完了する。 After that, when the injection nozzle is arranged above the first accommodating portion 11 and the resin agent is injected into the upper surface of the substrate body 3, the resin agent is guided to the lower side of the substrate body 3 through the gap around the substrate body 3. The air existing on the lower side is discharged upward through the air bleeding hole formed in the substrate main body 3. The injected resin agent is immersed in the substrate body 3 and is blocked by the elastic member 21 to prevent leakage to the second accommodating portion 13, and the resin agent is cured to seal the substrate body 3 as a sealing resin 28. When stopped, the assembly work of the electronic component module 1 is completed.

特開２０１７−１１７９１４号公報JP-A-2017-117914

しかしながら、特許文献１に記載の電子部品モジュール１は、以下に述べる２つの不具合（不具合１，２と称する）があることから改良の余地があった。 However, the electronic component module 1 described in Patent Document 1 has room for improvement because it has the following two defects (referred to as defects 1 and 2).

不具合１は、電子部品モジュール１の組立作業で発生する基板２の保護に関するものであり、第１収容部１１への基板２の斜め挿入により基板２の各部が無理な力を受けて破損する虞がある点である。
詳述すると、弾性部材２１のスリット２１ａへのカードエッジコネクタ８の挿入は、ストッパ等で位置決めされることなく作業者の目分量に委ねられるため、挿入深さに過不足が生じることがある。そして、過度に挿入された場合には先端のカードエッジコネクタ８が第２収容部１３の内壁に接触し、逆に挿入深さが不足した場合には基板本体３が第１収容部１１の側壁に接触し、カードエッジコネクタ８や基板本体３が無理な力を受けて破損してしまう。また、挿入深さに過不足があると、第１収容部１１の凹部１２内に収まるはずの電子部品５が底壁に接触して破損する虞もある。 The defect 1 relates to the protection of the substrate 2 generated in the assembly work of the electronic component module 1, and there is a risk that each part of the substrate 2 will be damaged by an excessive force due to the oblique insertion of the substrate 2 into the first accommodating portion 11. There is a point.
More specifically, the insertion of the card edge connector 8 into the slit 21a of the elastic member 21 is left to the operator's eyes without being positioned by a stopper or the like, so that the insertion depth may be excessive or insufficient. When the card edge connector 8 at the tip is excessively inserted, the card edge connector 8 at the tip contacts the inner wall of the second accommodating portion 13, and conversely, when the insertion depth is insufficient, the substrate body 3 is the side wall of the first accommodating portion 11. The card edge connector 8 and the board body 3 are damaged due to excessive force. Further, if the insertion depth is excessive or insufficient, the electronic component 5 that should fit in the recess 12 of the first accommodating portion 11 may come into contact with the bottom wall and be damaged.

不具合２は、組立後の電子部品モジュール１の使用過程で発生する基板２の保護に関するものであり、基板本体３の上面が封止樹脂２８で封止されただけのため、その保護が不十分な点である。
詳述すると、基板本体３の下面はコネクタケース１０の底壁で保護され、基板本体３の上面は硬化後の封止樹脂２８により保護されている。硬化しているとはいえ、封止樹脂２８は射出成形等で製作されたコネクタケース１０よりも脆弱なため、基板本体３の上面に対する保護は下面に比較して不十分なものとなる。このため電子部品モジュール１に外力が作用した場合等に、封止樹脂２８と共に内部の基板本体３や電子部品５が破損してしまう虞がある。なお、封止樹脂２８の表面を金属板等で覆う対策も考えられるが、部品追加によるコスト高騰等の別の問題が発生してしまう。 The defect 2 relates to the protection of the substrate 2 generated in the process of using the electronic component module 1 after assembly, and the protection is insufficient because the upper surface of the substrate main body 3 is only sealed with the sealing resin 28. It is a point.
More specifically, the lower surface of the substrate body 3 is protected by the bottom wall of the connector case 10, and the upper surface of the substrate body 3 is protected by the cured sealing resin 28. Although it is cured, the sealing resin 28 is weaker than the connector case 10 manufactured by injection molding or the like, so that the protection against the upper surface of the substrate body 3 is insufficient as compared with the lower surface. Therefore, when an external force acts on the electronic component module 1, the internal substrate body 3 and the electronic component 5 may be damaged together with the sealing resin 28. Although it is conceivable to cover the surface of the sealing resin 28 with a metal plate or the like, another problem such as an increase in cost due to the addition of parts will occur.

本発明はこのような問題点を解決するためになされたもので、その目的とするところは、組立作業においてコネクタケースに挿入する際の基板の破損を未然に防止できると共に、使用過程において基板に対する良好な保護機能を達成することができる電子部品モジュール及びそのコネクタケースを提供することにある。 The present invention has been made to solve such a problem, and an object of the present invention is to prevent damage to the substrate when it is inserted into the connector case in the assembly work, and to prevent the substrate from being damaged in the process of use. It is an object of the present invention to provide an electronic component module and its connector case capable of achieving a good protection function.

上記の目的を達成するため、本発明の電子部品モジュールは、電子部品が実装された基板本体及び基板本体の一側縁に設けられたカードエッジコネクタを有する基板と、基板が収容されたコネクタケースとを備え、コネクタケースは、基板本体が収容された基板収容部と、基板収容部に隣接して形成されており、カードエッジコネクタが収容されたコネクタ嵌合部と、カードエッジコネクタが挿通されるスリットが貫通形成されており、基板収容部とコネクタ嵌合部とを区画する隔壁と、を有し、コネクタ嵌合部は、基板収容部とは反対側の端部に、相手側コネクタが接続可能とされている開口部が形成されており、基板収容部は、コネクタ嵌合部とは反対側の端部に、相手側コネクタの嵌合方向に沿って基板が挿入される開口部が形成されており、コネクタ嵌合部の開口部を経て注入された第１樹脂剤が硬化して形成された第１封止樹脂により、基板とスリットとの間の間隙が塞がれており、基板収容部の開口部を経て注入された第２樹脂剤が硬化して形成された第２封止樹脂により、基板本体が封止されている、ことを特徴とする。 In order to achieve the above object, the electronic component module of the present invention includes a substrate body on which electronic components are mounted, a substrate having a card edge connector provided on one side edge of the substrate body, and a connector case in which the substrate is housed. The connector case is formed adjacent to the board accommodating portion in which the substrate main body is accommodated and the substrate accommodating portion, and the connector fitting portion accommodating the card edge connector and the card edge connector are inserted. The slit is formed through and has a partition wall for partitioning the substrate accommodating portion and the connector fitting portion. The connector fitting portion has a mating connector at an end opposite to the substrate accommodating portion. An opening that is connectable is formed, and the board accommodating portion has an opening at the end opposite to the connector fitting portion where the board is inserted along the mating direction of the mating connector. The gap between the substrate and the slit is closed by the first sealing resin formed by curing the first resin agent that has been formed and injected through the opening of the connector fitting portion. The substrate body is sealed by a second sealing resin formed by curing the second resin agent injected through the opening of the substrate accommodating portion.

その他の電子部品モジュールの態様として、基板収容部に、電子部品との干渉を防止する逃げ部を開口部まで連続して形成してもよい。
その他の電子部品モジュールの態様として、相手側コネクタの嵌合方向と直交する基板の幅方向において、基板本体の寸法をカードエッジコネクタの寸法よりも拡大してもよい。 As another aspect of the electronic component module, a relief portion for preventing interference with the electronic component may be continuously formed up to the opening in the substrate accommodating portion.
As another aspect of the electronic component module, the size of the board body may be larger than the size of the card edge connector in the width direction of the board orthogonal to the fitting direction of the mating connector.

その他の電子部品モジュールの態様として、隔壁のコネクタ嵌合部側に、スリットの周囲を取り囲むように封止溝を形成し、第１封止樹脂を封止溝内に形成してもよい。
その他の電子部品モジュールの態様として、基板本体及び電子部品を、基板収容部内に配置することにより全周を基板収容部で包囲してもよい。 As another aspect of the electronic component module, a sealing groove may be formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit, and the first sealing resin may be formed in the sealing groove.
As another aspect of the electronic component module, the substrate main body and the electronic component may be arranged in the substrate accommodating portion to surround the entire circumference with the substrate accommodating portion.

また、本発明の電子部品モジュールのコネクタケースは、電子部品が実装された基板本体及び基板本体の一側縁に設けられたカードエッジコネクタを有する基板が内部に配置される電子部品モジュールのコネクタケースにおいて、基板本体が収容される基板収容部と、基板収容部に隣接して形成されており、カードエッジコネクタが収容されるコネクタ嵌合部と、カードエッジコネクタが挿通されるスリットが貫通形成されており、基板収容部とコネクタ嵌合部とを区画する隔壁と、を有し、コネクタ嵌合部は、基板収容部とは反対側の端部に、硬化により第１封止樹脂を形成して基板とスリットとの間の間隙を塞ぐ第１樹脂剤が注入され、且つ相手側コネクタが接続可能とされている開口部が形成されており、基板収容部は、コネクタ嵌合部とは反対側の端部に、相手側コネクタの嵌合方向に沿って基板が挿入され、且つ硬化により基板本体を封止する第２封止樹脂を形成する第２樹脂剤が注入される開口部が形成されている、ことを特徴とする。 Further, the connector case of the electronic component module of the present invention is a connector case of an electronic component module in which a board body on which electronic components are mounted and a board having a card edge connector provided on one side edge of the board body are arranged inside. In the above, a substrate accommodating portion in which the substrate main body is accommodated and a connector mating portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector and a slit through which the card edge connector is inserted are formed through. It has a partition wall that separates the substrate accommodating portion and the connector fitting portion, and the connector fitting portion forms a first sealing resin by curing at an end portion opposite to the substrate accommodating portion. The first resin agent that closes the gap between the substrate and the slit is injected, and an opening is formed to which the mating connector can be connected, and the substrate accommodating portion is opposite to the connector fitting portion. At the end on the side, an opening is formed in which the substrate is inserted along the mating direction of the mating connector and the second resin agent for forming the second sealing resin that seals the substrate body by curing is injected. It is characterized by being done.

その他の電子部品モジュールのコネクタケースの態様として、基板収容部に、電子部品との干渉を防止する逃げ部を開口部まで連続して形成してもよい。
その他の電子部品モジュールのコネクタケースの態様として、相手側コネクタの嵌合方向と直交する基板の幅方向において、基板収容部の寸法をコネクタ嵌合部の寸法よりも拡大してもよい。 As another aspect of the connector case of the electronic component module, a relief portion for preventing interference with the electronic component may be continuously formed up to the opening in the substrate accommodating portion.
As another aspect of the connector case of the electronic component module, the dimension of the substrate accommodating portion may be larger than the dimension of the connector fitting portion in the width direction of the substrate orthogonal to the fitting direction of the mating connector.

その他の電子部品モジュールのコネクタケースの態様として、隔壁のコネクタ嵌合部側に、スリットの周囲を取り囲むように封止溝を形成し、第１封止樹脂を封止溝内に形成してもよい。
その他の電子部品モジュールのコネクタケースの態様として、基板収容部を、内部に配置された基板本体及び電子部品の全周を包囲する形状に形成してもよい。 As another aspect of the connector case of the electronic component module, a sealing groove may be formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit, and the first sealing resin may be formed in the sealing groove. Good.
As another aspect of the connector case of the electronic component module, the substrate accommodating portion may be formed in a shape that surrounds the entire circumference of the substrate main body and the electronic component arranged inside.

本発明の電子部品モジュール及びそのコネクタケースによれば、組立作業においてコネクタケースに挿入する際の基板の破損を未然に防止できると共に、使用過程において基板に対する良好な保護機能を達成することができる。 According to the electronic component module of the present invention and its connector case, it is possible to prevent the substrate from being damaged when it is inserted into the connector case in the assembly work, and it is possible to achieve a good protective function against the substrate in the process of use.

実施形態の電子部品モジュールと相手側コネクタとを示す斜視図である。It is a perspective view which shows the electronic component module of embodiment and the connector on the other side. コネクタケースと基板とを結合する以前の電子部品モジュールと相手側コネクタとを示す分解斜視図である。It is an exploded perspective view which shows the electronic component module and the mating side connector before connecting the connector case and a board. 図１のＡ矢視図である。It is a view of arrow A of FIG. 図１のＢ矢視図である。It is a B arrow view of FIG. 相手側コネクタを切離したときの電子部品モジュールを示す図１のV-V線断面図である。It is a VV line sectional view of FIG. 1 which shows the electronic component module when the mating side connector is separated. 相手側コネクタを接続したときの電子部品モジュールを示す図５に対応する断面図である。It is sectional drawing corresponding to FIG. 5 which shows the electronic component module when the mating side connector is connected. 図６のVII-VII線断面図である。FIG. 6 is a sectional view taken along line VII-VII of FIG. 図６のＣ部詳細図である。It is a detailed view of part C of FIG. 第１樹脂剤を注入する際のコネクタケースを示す斜視図である。It is a perspective view which shows the connector case at the time of injecting the 1st resin agent. 第２樹脂剤を注入する際のコネクタケースを示す斜視図である。It is a perspective view which shows the connector case at the time of injecting the 2nd resin agent. 基板収容部の上面全体を逃げ部として嵩上げした別例を示す図４に対応する図である。It is a figure corresponding to FIG. 4 which shows another example in which the entire upper surface of the substrate accommodating portion is raised as a relief portion.

以下、本発明を具体化した電子部品モジュール及びそのコネクタケースの一実施形態を説明する。
図１は本実施形態の電子部品モジュールと相手側コネクタとを示す斜視図、図２はコネクタケースと基板とを結合する以前の電子部品モジュールと相手側コネクタとを示す分解斜視図である。 Hereinafter, an embodiment of an electronic component module and its connector case that embody the present invention will be described.
FIG. 1 is a perspective view showing the electronic component module and the mating side connector of the present embodiment, and FIG. 2 is an exploded perspective view showing the electronic component module and the mating side connector before connecting the connector case and the substrate.

電子部品モジュール１は、基板２と、合成樹脂製のコネクタケース６とを有する。電子部品モジュール１の基板２は、基板本体３と、基板本体３の一側縁に設けられたカードエッジコネクタ４とからなる。基板本体３には、複数の電子部品５が実装されている。複数の電子部品５は、図示しない導体パターンを介して互いに接続され、これにより基板本体３上に形成された電気回路がカードエッジコネクタ４と電気的に接続されている。 The electronic component module 1 has a substrate 2 and a connector case 6 made of synthetic resin. The board 2 of the electronic component module 1 includes a board body 3 and a card edge connector 4 provided on one side edge of the board body 3. A plurality of electronic components 5 are mounted on the board body 3. The plurality of electronic components 5 are connected to each other via a conductor pattern (not shown), whereby an electric circuit formed on the substrate body 3 is electrically connected to the card edge connector 4.

電子部品モジュール１は、このような基板２をコネクタケース６内に挿入することにより構成されている。そして詳細は後述するが、コネクタケース６の一側に設けられたコネクタ嵌合部７に相手側コネクタ９を接続すると、内部のカードエッジコネクタ４及び相手側コネクタ９を介して電子部品モジュール１が接続対象となる電気機器と接続される。 The electronic component module 1 is configured by inserting such a substrate 2 into the connector case 6. As will be described in detail later, when the mating connector 9 is connected to the connector fitting portion 7 provided on one side of the connector case 6, the electronic component module 1 is connected via the internal card edge connector 4 and the mating connector 9. It is connected to the electrical equipment to be connected.

本実施形態の電子部品モジュール１は、自動二輪車のエンジン制御用のＥＣＵ（エンジン制御ユニット）として機能する。車両にはエンジンの燃料噴射弁や点火装置、或いは各種センサ類等が搭載されており、これらの電気機器が相手側コネクタ９を介して電子部品モジュール１に接続され、電子部品モジュール１によりエンジンの燃料噴射や点火時期が制御される。 The electronic component module 1 of the present embodiment functions as an ECU (engine control unit) for controlling an engine of a motorcycle. The vehicle is equipped with an engine fuel injection valve, an ignition device, various sensors, and the like. These electric devices are connected to the electronic component module 1 via the mating connector 9, and the electronic component module 1 is used to connect the engine. Fuel injection and ignition timing are controlled.

以下の説明では、図１に示す姿勢に倣って基板本体３の上側の面を上面、下側の面を下面と称し、基板本体３の上下両面と直交する方向を上下方向と称する。また、電子部品モジュール１に相手側コネクタ９が接続される方向をコネクタ嵌合方向と称し、上下方向及びコネクタ嵌合方向とそれぞれ直交する方向を基板幅方向と称する。 In the following description, according to the posture shown in FIG. 1, the upper surface of the substrate body 3 is referred to as an upper surface, the lower surface is referred to as a lower surface, and the direction orthogonal to both the upper and lower surfaces of the substrate body 3 is referred to as a vertical direction. Further, the direction in which the mating connector 9 is connected to the electronic component module 1 is referred to as a connector fitting direction, and the direction orthogonal to the vertical direction and the connector fitting direction is referred to as a substrate width direction.

図３は図１のＡ矢視図、図４は図１のＢ矢視図、図５は相手側コネクタ９を切離したときの電子部品モジュール１を示す図１のV-V線断面図、図６は相手側コネクタ９を接続したときの電子部品モジュール１を示す図５に対応する断面図、図７は図６のVII-VII線断面図である。
図２，４，７に示すように、基板本体３は略正方形の板状をなし、電子部品５は上下両面にそれぞれ実装されている。実装される電子部品５は種々の上下寸法を有するが、例えば図４に示す電解コンデンサ５ａのように上下寸法Ｈ2が大きな電子部品５は、基板本体３の上面に実装されている。 3 is a view taken along the line A of FIG. 1, FIG. 4 is a view taken along the line B of FIG. 1, FIG. 5 is a sectional view taken along line VV of FIG. 1 showing the electronic component module 1 when the mating connector 9 is disconnected, and FIG. Is a cross-sectional view corresponding to FIG. 5 showing an electronic component module 1 when the mating connector 9 is connected, and FIG. 7 is a cross-sectional view taken along the line VII-VII of FIG.
As shown in FIGS. 2, 4 and 7, the substrate main body 3 has a substantially square plate shape, and the electronic components 5 are mounted on both the upper and lower surfaces. The electronic component 5 to be mounted has various vertical dimensions. For example, the electronic component 5 having a large vertical dimension H2 such as the electrolytic capacitor 5a shown in FIG. 4 is mounted on the upper surface of the substrate main body 3.

図５，７に示すように、カードエッジコネクタ４は、基板２の一側縁に導体パターンにより複数の接点４ａを形成して形作られている。詳しくは、各接点４ａは基板２の上下両面でそれぞれ一側縁に沿って列設されており、これらの接点４ａが基板２上の電気回路にそれぞれ電気的に接続されている。 As shown in FIGS. 5 and 7, the card edge connector 4 is formed by forming a plurality of contacts 4a on one side edge of the substrate 2 by a conductor pattern. Specifically, the contacts 4a are arranged in rows along one side edge on both the upper and lower sides of the substrate 2, and these contacts 4a are electrically connected to the electric circuit on the substrate 2.

図３〜５に示すように、基板２が内部に配置されるコネクタケース６は、全体として上下に扁平な筒状をなしている。コネクタケース６は、コネクタ嵌合方向において隣接するコネクタ嵌合部７と基板収容部８とに分けられている。そしてコネクタケース６内には隔壁１０が形成され、コネクタ嵌合部７と基板収容部８とは隔壁１０により区画されると共に、隔壁１０にコネクタ嵌合方向に貫通形成された基板幅方向に延びるスリット１１を介して互いに連通している。 As shown in FIGS. 3 to 5, the connector case 6 in which the substrate 2 is arranged has a vertically flat tubular shape as a whole. The connector case 6 is divided into a connector fitting portion 7 and a substrate accommodating portion 8 that are adjacent to each other in the connector fitting direction. A partition wall 10 is formed in the connector case 6, and the connector fitting portion 7 and the substrate accommodating portion 8 are partitioned by the partition wall 10 and extend in the board width direction formed through the partition wall 10 in the connector fitting direction. They communicate with each other through the slit 11.

コネクタ嵌合部７の基板収容部８とは反対側の端部には開口部７ａが形成され、この開口部７ａに相手側コネクタ９が嵌合するようになっている。また基板収容部８のコネクタ嵌合部７とは反対側の端部には開口部８ａが形成され、この開口部８ａから基板２が挿入されるようになっている。基板収容部８内の基板幅方向の両側にはコネクタ嵌合方向に沿って延びる一対のガイド溝８ｂが形成され、基板２の挿入を案内するようになっている。 An opening 7a is formed at the end of the connector fitting portion 7 on the side opposite to the substrate accommodating portion 8, and the mating connector 9 is fitted into the opening 7a. Further, an opening 8a is formed at the end of the substrate accommodating portion 8 on the side opposite to the connector fitting portion 7, and the substrate 2 is inserted through the opening 8a. A pair of guide grooves 8b extending along the connector fitting direction are formed on both sides of the substrate accommodating portion 8 in the substrate width direction to guide the insertion of the substrate 2.

基板２の基板本体３は、コネクタケース６の基板収容部８内に配置され、基板２のカードエッジコネクタ４は隔壁１０のスリット１１に挿通され、スリット１１を経てコネクタ嵌合部７内に配置されている。スリット１１は基板２の断面形状と対応する形状をなし、基板２を挿入可能な程度の僅かな間隙がスリット１１の内周面と基板２の外周面との間に形成されている。隔壁１０のコネクタ嵌合部７側には、スリット１１の周囲を取り囲むように封止溝１２が形成され、封止溝１２内には第１樹脂剤が注入されて硬化することで第１封止樹脂１３を形成している。この第１封止樹脂１３ により基板２とスリット１１との間に形成されている間隙が塞がれて、基板収容部８とコネクタ嵌合部７とが完全に区画されている。 The substrate body 3 of the substrate 2 is arranged in the substrate accommodating portion 8 of the connector case 6, the card edge connector 4 of the substrate 2 is inserted into the slit 11 of the partition wall 10, and is arranged in the connector fitting portion 7 via the slit 11. Has been done. The slit 11 has a shape corresponding to the cross-sectional shape of the substrate 2, and a slight gap into which the substrate 2 can be inserted is formed between the inner peripheral surface of the slit 11 and the outer peripheral surface of the substrate 2. A sealing groove 12 is formed on the connector fitting portion 7 side of the partition wall 10 so as to surround the periphery of the slit 11, and a first resin agent is injected into the sealing groove 12 to cure the first seal. A stop resin 13 is formed. The gap formed between the substrate 2 and the slit 11 is closed by the first sealing resin 13, and the substrate accommodating portion 8 and the connector fitting portion 7 are completely partitioned.

図４，５に示すように、基板本体３の上面に実装された電子部品５の一つである電解コンデンサ５ａの上下寸法Ｈ2は、基板本体３の上面と基板収容部８の上面８ｃとの間の間隔Ｈ1よりも大きいため、そのままでは電解コンデンサ５ａの上部が基板収容部８の上面８ｃと干渉してしまう。しかし、基板収容部８の上面８ｃには逃げ部１４が突設されて、電解コンデンサ５ａの上下寸法Ｈ2よりも大きな間隔Ｈ3だけ、基板本体３の上面から逃げ部１４が離間している。より具体的には逃げ部１４は、基板幅方向において基板収容部８の上面８ｃの電解コンデンサ５ａと対応する位置に形成されて、上方から電解コンデンサ５ａを覆うと共に、コネクタ嵌合方向においては電解コンデンサ５ａの位置から基板収容部８の開口部８ａまで同一断面形状で連続している。このため、電解コンデンサ５ａの上部と逃げ部１４との干渉が防止され、何ら問題なく基板収容部８内に電解コンデンサ５ａが収められている。 As shown in FIGS. 4 and 5, the vertical dimension H2 of the electrolytic capacitor 5a, which is one of the electronic components 5 mounted on the upper surface of the substrate main body 3, is the upper surface of the substrate main body 3 and the upper surface 8c of the substrate accommodating portion 8. Since the distance between them is larger than H1, the upper part of the electrolytic capacitor 5a interferes with the upper surface 8c of the substrate accommodating portion 8 as it is. However, a relief portion 14 is projected from the upper surface 8c of the substrate accommodating portion 8, and the relief portion 14 is separated from the upper surface of the substrate main body 3 by a distance H3 larger than the vertical dimension H2 of the electrolytic capacitor 5a. More specifically, the relief portion 14 is formed at a position corresponding to the electrolytic capacitor 5a on the upper surface 8c of the substrate accommodating portion 8 in the substrate width direction to cover the electrolytic capacitor 5a from above and electrolyze in the connector fitting direction. From the position of the capacitor 5a to the opening 8a of the substrate accommodating portion 8, it is continuous with the same cross-sectional shape. Therefore, interference between the upper portion of the electrolytic capacitor 5a and the relief portion 14 is prevented, and the electrolytic capacitor 5a is housed in the substrate accommodating portion 8 without any problem.

また図７に示すように、基板幅方向における基板本体３の寸法Ｗ1とカードエッジコネクタ４の寸法Ｗ2とは相違している。詳しくは、基板本体３とカードエッジコネクタ４の間に形成された段差部１５を境界として、基板本体３の寸法Ｗ1はカードエッジコネクタ４の寸法Ｗ2よりも大きい。
図４，５に示すように、基板収容部８内には第２樹脂剤が注入されて内部に隈無く行き渡り、この第２樹脂剤が硬化して形成された第２封止樹脂１６により基板本体３及び各電子部品５が封止され、外部からの水、熱、光或いは振動等から保護されている。
このように、第１封止樹脂１３は基板２とスリット１１との間隙を閉塞し、第２封止樹脂１６は基板本体３及び各電子部品５を封止しており、それぞれの目的を達成できれば、第１及び第２封止樹脂１３，１６としてどのような樹脂を用いても良く、例えば熱硬化性樹脂または紫外線硬化性樹脂等を任意に使用することができる。 Further, as shown in FIG. 7, the dimension W1 of the substrate main body 3 and the dimension W2 of the card edge connector 4 in the width direction of the substrate are different from each other. Specifically, the dimension W1 of the substrate main body 3 is larger than the dimension W2 of the card edge connector 4 with the stepped portion 15 formed between the substrate main body 3 and the card edge connector 4 as a boundary.
As shown in FIGS. 4 and 5, the second resin agent is injected into the substrate accommodating portion 8 and spreads all over the inside, and the substrate is formed by the second sealing resin 16 formed by curing the second resin agent. The main body 3 and each electronic component 5 are sealed and protected from external water, heat, light, vibration, and the like.
In this way, the first sealing resin 13 closes the gap between the substrate 2 and the slit 11, and the second sealing resin 16 seals the substrate body 3 and each electronic component 5, achieving the respective purposes. If possible, any resin may be used as the first and second sealing resins 13 and 16, and for example, a thermosetting resin, an ultraviolet curable resin, or the like can be arbitrarily used.

図８は図６のＣ部 詳細図であり、以下、図５，６，８に基づきコネクタケース６のコネクタ嵌合部７に対する相手側コネクタ９の接続状態を説明する。
上記したようにコネクタケース６のコネクタ嵌合部７は、コネクタ嵌合方向に沿った一側方に開口する上下に扁平な筒状をなしている。コネクタ嵌合部７内の隔壁１０側には嵌合部７ｂが形成され、開口部７ａ側にはシール部７ｃが形成されている。シール部７ｃは嵌合部７ｂよりも上下に拡大された形状をなし、両者７ｂ，７ｃはテーパガイド部７ｄを介して連続している。 FIG. 8 is a detailed view of the C portion of FIG. 6, and the connection state of the mating connector 9 to the connector fitting portion 7 of the connector case 6 will be described below based on FIGS. 5, 6 and 8.
As described above, the connector fitting portion 7 of the connector case 6 has a vertically flat tubular shape that opens to one side along the connector fitting direction. A fitting portion 7b is formed on the partition wall 10 side in the connector fitting portion 7, and a sealing portion 7c is formed on the opening 7a side. The seal portion 7c has a shape that is enlarged vertically from the fitting portion 7b, and both 7b and 7c are continuous via the taper guide portion 7d.

このようなコネクタ嵌合部７に対応して相手側コネクタ９は、コネクタ嵌合部７内に嵌合される接点保持部９ａと、この接点保持部９ａを包囲する外筒９ｂとから構成され、接点保持部９ａと外筒９ｂは合成樹脂材料で一体形成されている。コネクタ嵌合部７に相手側コネクタ９が接続された状態では、相手側コネクタ９の外筒９ｂがコネクタ嵌合部７に外嵌されて図１，２に示すストッパ７ｅにより離脱が防止されると共に、相手側コネクタ９の接点保持部９ａがコネクタ嵌合部７のテーパガイド部７ｄに案内されて嵌合部７ｂ内に嵌め込まれている。そして、接点保持部９ａの外周に設けられたパッキン１７がコネクタ嵌合部７のシール部７ｃの内周に弾性をもって当接することにより、雨水等の侵入が防止されている。 Corresponding to such a connector fitting portion 7, the mating side connector 9 is composed of a contact holding portion 9a fitted in the connector fitting portion 7 and an outer cylinder 9b surrounding the contact holding portion 9a. The contact holding portion 9a and the outer cylinder 9b are integrally formed of a synthetic resin material. In a state where the mating connector 9 is connected to the connector fitting portion 7, the outer cylinder 9b of the mating connector 9 is fitted onto the connector fitting portion 7 and the stopper 7e shown in FIGS. At the same time, the contact holding portion 9a of the mating connector 9 is guided by the taper guide portion 7d of the connector fitting portion 7 and fitted into the fitting portion 7b. The packing 17 provided on the outer circumference of the contact holding portion 9a elastically contacts the inner circumference of the sealing portion 7c of the connector fitting portion 7 to prevent rainwater or the like from entering.

相手側コネクタ９の接点保持部９ａ内には、基板２のカードエッジコネクタ４の各接点４ａと対応するように上下２列の複数の接点９ｃが基板幅方向に沿って列設されている。なお、リテーナ１８は、各接点９ｃを所定位置に保持する。各接点９ｃに接続された配線１９は相手側コネクタ９から外部に延設されて、自動二輪車に搭載された燃料噴射弁や点火装置或いはセンサ類等の電気機器に接続されている。
このような相手側コネクタ９の２列の各接点９ｃによりカードエッジコネクタ４が上下から挟み込まれ、結果としてカードエッジコネクタ４の各接点４ａが相手側コネクタ９の各接点９ｃと接触して導通している。 In the contact holding portion 9a of the mating side connector 9, a plurality of upper and lower rows of contacts 9c are arranged along the board width direction so as to correspond to the respective contacts 4a of the card edge connector 4 of the board 2. The retainer 18 holds each contact 9c at a predetermined position. The wiring 19 connected to each contact 9c extends from the mating connector 9 to the outside and is connected to an electric device such as a fuel injection valve, an ignition device, or sensors mounted on a motorcycle.
The card edge connector 4 is sandwiched from above and below by the two rows of contacts 9c of the mating connector 9, and as a result, the contacts 4a of the card edge connector 4 come into contact with the contacts 9c of the mating connector 9 to conduct conduction. ing.

次に、以上のように構成された電子部品モジュール１の組立作業の手順について説明する。
まず、合成樹脂を材料として射出成型等によりコネクタケース６を製作すると共に、電子部品５やカードエッジコネクタ４を備えた基板２を製作しておく。次いで図２に矢印で示すように、カードエッジコネクタ４側を先端として、基板２をコネクタケース６の基板収容部８内に開口部８ａを経て挿入する。挿入方向はコネクタ嵌合方向に沿ったものとなり、基板２の挿入時、基板２上の電解コンデンサ５ａは基板収容部８の上面８ｃに形成された逃げ部１４内を移動する。そして、カードエッジコネクタ４が隔壁１０のスリット１１を経てコネクタ嵌合部７内に突出し、図７に示すように段差部１５が隔壁１０に当接すると、基板２の挿入が完了する。 Next, the procedure for assembling the electronic component module 1 configured as described above will be described.
First, the connector case 6 is manufactured by injection molding or the like using a synthetic resin as a material, and the substrate 2 provided with the electronic component 5 and the card edge connector 4 is manufactured. Next, as shown by an arrow in FIG. 2, the substrate 2 is inserted into the substrate accommodating portion 8 of the connector case 6 through the opening 8a with the card edge connector 4 side as the tip. The insertion direction is along the connector fitting direction, and when the substrate 2 is inserted, the electrolytic capacitor 5a on the substrate 2 moves in the relief portion 14 formed on the upper surface 8c of the substrate accommodating portion 8. Then, when the card edge connector 4 projects into the connector fitting portion 7 through the slit 11 of the partition wall 10 and the stepped portion 15 comes into contact with the partition wall 10 as shown in FIG. 7, the insertion of the substrate 2 is completed.

このようにコネクタ嵌合方向に沿ってコネクタケース６の基板収容部８内に基板２を挿入している。このため、基板の斜め挿入に起因する特許文献１の不具合１、即ちコネクタケース等の他部材との接触による基板の破損が未然に防止される。 In this way, the substrate 2 is inserted into the substrate accommodating portion 8 of the connector case 6 along the connector fitting direction. Therefore, the defect 1 of Patent Document 1 caused by the oblique insertion of the substrate, that is, the damage of the substrate due to the contact with other members such as the connector case can be prevented.

詳しくは、基板２の挿入過程において、基板収容部８内のガイド溝８ｂに基板２が案内されることにより、基板本体３及び電子部品５は基板収容部８の内壁に接触せずに、無理な力を受けることなく基板収容部８内を移動してそれぞれの所定位置に配置される。 このとき、電解コンデンサ５ａは逃げ部１４の内壁に接触せずに、無理な力を受けることなく逃げ部１４内を移動して所定位置に配置される。また、カードエッジコネクタ４は基板収容部８内を移動した後にスリット１１を経てコネクタ嵌合部７内に突出するが、その際にも基板収容部８の内壁やコネクタ嵌合部７の内壁に接触せず、スリット１１の通過時には軽く摺接するだけである。従って、これらの部材の接触に起因する破損を未然に防止することができる。 Specifically, in the process of inserting the substrate 2, the substrate 2 is guided to the guide groove 8b in the substrate accommodating portion 8, so that the substrate main body 3 and the electronic component 5 do not come into contact with the inner wall of the substrate accommodating portion 8 and cannot be contacted. It moves in the substrate accommodating portion 8 without receiving any force and is arranged at each predetermined position. At this time, the electrolytic capacitor 5a moves in the relief portion 14 and is arranged at a predetermined position without contacting the inner wall of the relief portion 14 and without receiving an excessive force. Further, the card edge connector 4 moves in the substrate accommodating portion 8 and then projects into the connector fitting portion 7 through the slit 11, but also on the inner wall of the substrate accommodating portion 8 and the inner wall of the connector fitting portion 7. There is no contact, and when passing through the slit 11, only light sliding contact is made. Therefore, it is possible to prevent damage caused by contact of these members.

一方、以上のように基板２を基板収容部８側からコネクタケース６に挿入することは、基板本体３に実装される電子部品５の高さに関する制限の緩和にもつながる。ここで、コネクタ嵌合方向に沿った基板２の挿入が、コネクタ嵌合部７側から行われる場合について想定する。カードエッジコネクタ４を含めたコネクタ嵌合部７の仕様は相手側コネクタ９の仕様に対応して自ずと決定されており、相手側コネクタ９が嵌合されるコネクタ嵌合部７の形状に関しても自由に変更できない。 On the other hand, inserting the substrate 2 into the connector case 6 from the substrate accommodating portion 8 side as described above also leads to relaxation of restrictions on the height of the electronic component 5 mounted on the substrate main body 3. Here, it is assumed that the substrate 2 is inserted along the connector fitting direction from the connector fitting portion 7 side. The specifications of the connector fitting portion 7 including the card edge connector 4 are naturally determined according to the specifications of the mating side connector 9, and the shape of the connector fitting portion 7 into which the mating side connector 9 is fitted is also free. Cannot be changed to.

従って、仮に基板２をコネクタ嵌合部７側から挿入する場合には、コネクタ嵌合方向に沿って見たときの電子部品５等を含めた基板２全体の輪郭形状がコネクタ嵌合部７の断面形状により制限される。そして、基板２の輪郭形状がコネクタ嵌合部７の断面形状をはみ出している場合には互いの干渉により挿入不能になるため、基板本体３上に実装される電子部品５の高さが制限されてしまう。 Therefore, if the board 2 is inserted from the connector fitting portion 7, the contour shape of the entire board 2 including the electronic components 5 and the like when viewed along the connector fitting direction is the connector fitting portion 7. Limited by cross-sectional shape. When the contour shape of the board 2 protrudes from the cross-sectional shape of the connector fitting portion 7, it becomes impossible to insert the board 2 due to mutual interference, so that the height of the electronic component 5 mounted on the board body 3 is limited. It ends up.

これに対してコネクタケース６の基板収容部８の断面形状は、相手側コネクタ９の仕様とは何ら関係なく設定できる。このため、電解コンデンサ５ａのような高さが大きい電子部品５を実装する場合には、基板収容部８に逃げ部１４を形成することにより、基板収容部８の断面形状を基板２の輪郭形状に対応させればよい。これにより基板収容部８の周壁に干渉することなく、基板２を基板収容部８内に挿入することができる。従って、基板２上に実装される電子部品５の高さに関する制限を緩和でき、これにより電子部品モジュール１の機能向上を達成することができる。 On the other hand, the cross-sectional shape of the substrate accommodating portion 8 of the connector case 6 can be set regardless of the specifications of the mating connector 9. Therefore, when mounting an electronic component 5 having a large height such as an electrolytic capacitor 5a, by forming a relief portion 14 in the substrate accommodating portion 8, the cross-sectional shape of the substrate accommodating portion 8 is changed to the contour shape of the substrate 2. It should correspond to. As a result, the substrate 2 can be inserted into the substrate accommodating portion 8 without interfering with the peripheral wall of the substrate accommodating portion 8. Therefore, the restrictions on the height of the electronic component 5 mounted on the substrate 2 can be relaxed, and thereby the functional improvement of the electronic component module 1 can be achieved.

加えて、基板収容部８側から基板２を挿入するメリットは、電子部品５の高さに関するものだけではなく、図７に示す基板本体３の基板幅方向の寸法Ｗ1についても得られる。即ち、コネクタ嵌合部７側から基板２を挿入する場合、基板本体３の寸法Ｗ1もコネクタ嵌合部７の断面形状、より具体的には、図７中に示す基板幅方向のコネクタ嵌合部７の寸法Ｗ3により制限される。しかし、基板収容部８側から基板２を挿入する場合には、基板本体３を挿入可能なように基板収容部８の断面形状を設定できるため、所望の寸法Ｗ1を有する基板本体３を挿入可能となる。この場合の基板幅方向の基板収容部８の寸法は基板本体３の寸法Ｗ1と等しく、必然的にコネクタ嵌合部７の寸法Ｗ3よりも大きくなる。 In addition, the merit of inserting the substrate 2 from the substrate accommodating portion 8 side is obtained not only with respect to the height of the electronic component 5 but also with respect to the dimension W1 in the substrate width direction of the substrate main body 3 shown in FIG. That is, when the board 2 is inserted from the connector fitting portion 7, the dimension W1 of the board body 3 is also the cross-sectional shape of the connector fitting portion 7, and more specifically, the connector fitting in the board width direction shown in FIG. It is limited by the dimension W3 of the part 7. However, when the substrate 2 is inserted from the substrate accommodating portion 8, the cross-sectional shape of the substrate accommodating portion 8 can be set so that the substrate main body 3 can be inserted, so that the substrate main body 3 having a desired dimension W1 can be inserted. It becomes. In this case, the dimension of the substrate accommodating portion 8 in the substrate width direction is equal to the dimension W1 of the substrate main body 3 and inevitably larger than the dimension W3 of the connector fitting portion 7.

結果として本実施形態では、相手側コネクタ９の仕様に対応するカードエッジコネクタ４の寸法Ｗ2よりも、基板本体３の寸法Ｗ1を拡大できる。寸法Ｗ1が拡大すれば、電子部品５の実装に利用できる基板本体３上の有効面積も拡大することから、この要因も電子部品モジュールの機能向上に大きく貢献する。 As a result, in the present embodiment, the dimension W1 of the substrate main body 3 can be enlarged more than the dimension W2 of the card edge connector 4 corresponding to the specifications of the mating connector 9. If the dimension W1 is expanded, the effective area on the substrate body 3 that can be used for mounting the electronic component 5 is also expanded, and this factor also greatly contributes to the functional improvement of the electronic component module.

組立作業の説明に戻ると、以上の基板２の挿入作業は、どのようなコネクタケース６の姿勢でも実施できるが、続く第１樹脂剤の注入作業では、図９に示すコネクタ嵌合部７の開口部７ａを上方に向けた姿勢にコネクタケース６を保つ。コネクタ嵌合部７内を上方から見ると、図３に示すように隔壁１０のスリット１１内に嵌り込んだカードエッジコネクタ４を確認でき、カードエッジコネクタ４の周囲は封止溝１２に取り囲まれている。 Returning to the description of the assembly work, the above insertion work of the substrate 2 can be carried out in any posture of the connector case 6, but in the subsequent injection work of the first resin agent, the connector fitting portion 7 shown in FIG. 9 The connector case 6 is held in a posture in which the opening 7a is directed upward. When the inside of the connector fitting portion 7 is viewed from above, the card edge connector 4 fitted in the slit 11 of the partition wall 10 can be confirmed as shown in FIG. 3, and the periphery of the card edge connector 4 is surrounded by the sealing groove 12. ing.

そして、開口部７ａを経てコネクタ嵌合部７内に注入ノズル３１を挿入し、第１樹脂剤を封止溝１２内に注入する。第１樹脂剤は封止溝１２内で硬化して、カードエッジコネクタ４の周囲を取り囲む第１封止樹脂１３を形成する。そして、第１封止樹脂１３により基板２とスリット１１との間の間隙が塞がれることから、基板収容部８とコネクタ嵌合部７とが完全に区画される。 Then, the injection nozzle 31 is inserted into the connector fitting portion 7 through the opening 7a, and the first resin agent is injected into the sealing groove 12. The first resin agent is cured in the sealing groove 12 to form the first sealing resin 13 that surrounds the card edge connector 4. Then, since the gap between the substrate 2 and the slit 11 is closed by the first sealing resin 13, the substrate accommodating portion 8 and the connector fitting portion 7 are completely partitioned.

次いで、図１０に示すようにコネクタケース６を反転させて、基板収容部８の開口部８ａを上方に向けた姿勢にする。図４に示すように基板収容部８内に挿入された基板本体３を確認できる。そして、開口部８ａを経て基板収容部８内に注入ノズル３２を挿入し、第２樹脂剤を基板収容部８内に注入する。第２樹脂剤は基板収容部８内で硬化し、これにより形成された第２封止樹脂１６により基板本体３及び各電子部品５が封止される。 Next, as shown in FIG. 10, the connector case 6 is inverted so that the opening 8a of the substrate accommodating portion 8 faces upward. As shown in FIG. 4, the substrate main body 3 inserted in the substrate accommodating portion 8 can be confirmed. Then, the injection nozzle 32 is inserted into the substrate accommodating portion 8 through the opening 8a, and the second resin agent is injected into the substrate accommodating portion 8. The second resin agent is cured in the substrate accommodating portion 8, and the substrate main body 3 and each electronic component 5 are sealed by the second sealing resin 16 formed thereby.

第１樹脂剤と第２樹脂剤とは、その目的の相違に起因して、以下に述べるように異なる粘度及び注入量に設定されている。
即ち、第１樹脂剤は、基板２とスリット１１との間の間隙の閉塞を目的としている。このため、封止溝１２内に注入されたときに、間隙を経て基板収容部８側に漏れない程度の高い粘性が要求される反面、封止溝１２内で硬化して間隙を閉塞できればよいことから、その注入量はごく僅かでよい。一例として、第２樹脂剤の注入量を40ccとした場合、第１樹脂剤の注入量は0.15cc程度に過ぎない。 The first resin agent and the second resin agent are set to different viscosities and injection amounts as described below due to the difference in their purposes.
That is, the first resin agent is intended to close the gap between the substrate 2 and the slit 11. Therefore, when injected into the sealing groove 12, high viscosity is required so as not to leak to the substrate accommodating portion 8 side through the gap, but on the other hand, it is sufficient that the gap can be closed by hardening in the sealing groove 12. Therefore, the injection amount may be very small. As an example, when the injection amount of the second resin agent is 40 cc, the injection amount of the first resin agent is only about 0.15 cc.

第１樹脂剤を注入する際には、カードエッジコネクタ４の各接点４ａやコネクタ嵌合部７内に露出するシール部７ｃ等への第１樹脂剤の付着を防止する必要がある。接点４ａへの付着は接触不良の要因になり、シール部７ｃへの付着は防水性の低下の要因になるためである。しかしながら、第１樹脂剤の注入量はごく僅かであり、且つ、第１樹脂剤の注入作業時の図９に示すコネクタケース６の姿勢では、コネクタ嵌合方向に沿って重力が作用することから、注入箇所の封止溝１２が 接点４ａやシール部７ｃよりも低所に位置していると見なせる。従って、注入ノズル３１の先端を封止溝１２の直近の高さに保って第１樹脂剤を注入すれば、各接点４ａやシール部７ｃへの付着を容易に回避することができる。
また、第１樹脂剤の粘性の高さは注入速度を低下させる要因になるものの、その注入量はごく僅かである。このため注入作業を遅延させずに簡単且つ短時間で完了でき、効率的に作業を実施することができる。 When injecting the first resin agent, it is necessary to prevent the first resin agent from adhering to each contact 4a of the card edge connector 4, the seal portion 7c exposed in the connector fitting portion 7, and the like. This is because the adhesion to the contact 4a causes poor contact, and the adhesion to the seal portion 7c causes a decrease in waterproofness. However, the injection amount of the first resin agent is very small, and in the posture of the connector case 6 shown in FIG. 9 when the first resin agent is injected, gravity acts along the connector fitting direction. , It can be considered that the sealing groove 12 at the injection point is located lower than the contact 4a and the sealing portion 7c. Therefore, if the first resin agent is injected while keeping the tip of the injection nozzle 31 at the height closest to the sealing groove 12, adhesion to each contact 4a and the seal portion 7c can be easily avoided.
Further, although the high viscosity of the first resin agent causes a decrease in the injection rate, the injection amount is very small. Therefore, the injection work can be completed easily and in a short time without delaying the work, and the work can be carried out efficiently.

ここで、特許文献１ではコネクタケースの第１収容部と第２収容部とを弾性部材で区画している。このような構成を実現するには、弾性部材を成型するための金型が必要になる上に、金型を用いた弾性部材の成型作業を実施する必要が生じる。加えて電子部品モジュールの組立作業では、コネクタケース内に弾性部材を配置する作業が必要になる。これらの事項は全て電子部品モジュールの製造コストを高騰させる要因になってしまう。 Here, in Patent Document 1, the first accommodating portion and the second accommodating portion of the connector case are partitioned by an elastic member. In order to realize such a configuration, a mold for molding the elastic member is required, and it is necessary to carry out the molding work of the elastic member using the mold. In addition, in the assembly work of the electronic component module, it is necessary to arrange the elastic member in the connector case. All of these matters cause the manufacturing cost of the electronic component module to rise.

これに対して本実施形態では、少量の第１樹脂剤を封止溝１２に注入するだけである。上記のように注入作業は簡単且つ短時間で完了し、しかも少量の第１樹脂剤は安価なため、特許文献１に比較して製造コストを低減することができる。 On the other hand, in the present embodiment, only a small amount of the first resin agent is injected into the sealing groove 12. As described above, the injection operation is simple and completed in a short time, and the small amount of the first resin agent is inexpensive, so that the manufacturing cost can be reduced as compared with Patent Document 1.

一方、第２樹脂剤は、基板収容部８内での基板本体３や各電子部品５の封止を目的としており、既に第１封止樹脂１３により基板２とスリット１１との間の間隙が塞がれているため、コネクタ嵌合部７側への漏れに気遣うことなく注入作業を実施可能である。このため上記した注入量の例示のように、基板収容部８内を隈無く満たすことができる注入量が要求される反面、第１樹脂剤に比較して第２樹脂剤をより低粘度化しても何ら問題は生じない。 On the other hand, the second resin agent is intended for sealing the substrate main body 3 and each electronic component 5 in the substrate accommodating portion 8, and the first sealing resin 13 already creates a gap between the substrate 2 and the slit 11. Since it is closed, the injection work can be performed without worrying about leakage to the connector fitting portion 7 side. Therefore, as in the above-mentioned example of the injection amount, the injection amount that can completely fill the inside of the substrate accommodating portion 8 is required, but the viscosity of the second resin agent is made lower than that of the first resin agent. However, no problem occurs.

この第２樹脂剤の注入作業は、特許文献１のコネクタケースの第１収容部への樹脂剤の注入作業に相当するものであるが、作業効率に関して明確な差違がある。
即ち、特許文献１では図３に示すように、上方に開放された第１収容部の大部分の面積が基板本体により塞がれているため、基板本体の下側に直接的に樹脂剤を注入できない。このため基板本体の上面に注入した樹脂剤を、基板本体の周囲に形成されている間隙を経て間接的に下側に流し込むしかなく、極低速でしか注入できない。この問題は、エア抜き孔の開口面積を拡大することで多少は改善できるものの、これと引き換えに、電子部品の実装に利用できる基板本体の有効面積が縮小するという別の問題が発生してしまう。 This second resin agent injection operation corresponds to the resin agent injection operation into the first accommodating portion of the connector case of Patent Document 1, but there is a clear difference in work efficiency.
That is, in Patent Document 1, as shown in FIG. 3, since most of the area of the first accommodating portion opened upward is closed by the substrate main body, the resin agent is directly applied to the lower side of the substrate main body. Cannot be injected. Therefore, the resin agent injected into the upper surface of the substrate body must be indirectly poured downward through the gap formed around the substrate body, and can be injected only at an extremely low speed. This problem can be improved to some extent by increasing the opening area of the air vent hole, but in exchange for this, another problem arises in which the effective area of the board body that can be used for mounting electronic components is reduced. ..

これに対して本実施形態では、第２樹脂剤の注入作業時にコネクタケース６が図１０に示す姿勢に保たれ、重力はコネクタ嵌合方向に沿って作用する。結果として、この姿勢ではコネクタ嵌合方向が実質的な上下方向に相当し、基板収容部８が上方 に開口することから、注入された第２樹脂剤は基板収容部８内の低所から順に滞ることなく貯められていく。また、基板収容部８への第２樹脂剤の注入は、接点４ａやシール部７ｃへの付着防止を配慮する必要がない。さらに、基板２の挿入のために基板収容部８の開口部８ａは開口部７ａと比較して大型化されているため、好適な位置から第２樹脂剤を注入できる。また基板本体３が配置された基板収容部８内は、基板本体３を挟んで図１０に示す上下方向に並列した２つの領域に区画されてそれぞれの領域が上方に開口 しているため、各開口箇所に注入ノズル３２を配置して同時注入も可能である。このように、第２樹脂剤の注入速度を高めるために好適な条件が揃っている。 On the other hand, in the present embodiment, the connector case 6 is maintained in the posture shown in FIG. 10 during the injection operation of the second resin agent, and gravity acts along the connector fitting direction. As a result, in this posture, the connector fitting direction corresponds to the substantially vertical direction, and the substrate accommodating portion 8 opens upward. Therefore, the injected second resin agent is sequentially applied from the lowest place in the substrate accommodating portion 8. It will be stored without delay. Further, when the second resin agent is injected into the substrate accommodating portion 8, it is not necessary to consider prevention of adhesion to the contact 4a and the sealing portion 7c. Further, since the opening 8a of the substrate accommodating portion 8 is larger than the opening 7a for inserting the substrate 2, the second resin agent can be injected from a suitable position. Further, the inside of the substrate accommodating portion 8 in which the substrate main body 3 is arranged is divided into two regions parallel to each other in the vertical direction shown in FIG. 10 with the substrate main body 3 interposed therebetween, and each region opens upward. Simultaneous injection is also possible by arranging the injection nozzle 32 at the opening. As described above, suitable conditions are provided for increasing the injection rate of the second resin agent.

加えて特許文献１では、弾性部材のスリットと基板との間に僅かな間隙が形成される可能性があるが、本実施形態では、硬化した第１封止樹脂１３により基板収容部８とコネクタ嵌合部７とが完全に区画されている。特に隔壁１０に形成された封止溝１２は、第１封止樹脂１３を介した基板２とスリット１１との接合面積を拡大する役割を果たし、基板収容部８とコネクタ嵌合部７との区画を一層完全なものとしている。結果として、注入した第２樹脂剤のコネクタ嵌合部７側への漏れを確実に防止できることから、より低粘度の第２樹脂剤を使用可能となり、この要因も注入速度の向上に大きく貢献する。
従って本実施形態では、高い注入速度によりごく短時間で基板収容部８内への第２樹脂剤の注入作業を完了でき、作業効率の向上により製造コストを低減することができる。 In addition, in Patent Document 1, a slight gap may be formed between the slit of the elastic member and the substrate, but in the present embodiment, the cured first sealing resin 13 is used to form the substrate accommodating portion 8 and the connector. The fitting portion 7 is completely partitioned. In particular, the sealing groove 12 formed in the partition wall 10 plays a role of expanding the bonding area between the substrate 2 and the slit 11 via the first sealing resin 13, and the substrate accommodating portion 8 and the connector fitting portion 7 are formed. The parcels are more complete. As a result, the injected second resin agent can be reliably prevented from leaking to the connector fitting portion 7 side, so that a second resin agent having a lower viscosity can be used, and this factor also greatly contributes to the improvement of the injection speed. ..
Therefore, in the present embodiment, the injection work of the second resin agent into the substrate accommodating portion 8 can be completed in a very short time due to the high injection speed, and the manufacturing cost can be reduced by improving the work efficiency.

一方、以上の組立作業を経て完成した電子部品モジュール１は、図４，６，７から判るように、基板本体３及び各電子部品５がコネクタケース６の基板収容部８内に配置されることにより、上下方向及び基板幅方向を含めた全周を基板収容部８及び第２封止樹脂１６に包囲されて外部から保護されている。また、カードエッジコネクタ４もコネクタケース６のコネクタ嵌合部７内に配置されることにより、上下方向及び基板幅方向を含めた全周をコネクタ嵌合部７に包囲されて外部から保護されている。
なお、基板収容部８の開口部８ａ内に露出した第２封止樹脂１６の内部には、基板本体３の端縁が埋められているが、仮に第２封止樹脂１６が損傷したとしても、外部からの影響を受けるのは基板本体３の端縁だけである。肝心の基板２上の導体パターンや電子部品５は、第２封止樹脂１６に封止された状態に保たれているため何ら損傷を受けない。 On the other hand, in the electronic component module 1 completed through the above assembly work, as can be seen from FIGS. 4, 6 and 7, the substrate body 3 and each electronic component 5 are arranged in the substrate accommodating portion 8 of the connector case 6. As a result, the entire circumference including the vertical direction and the substrate width direction is surrounded by the substrate accommodating portion 8 and the second sealing resin 16 and protected from the outside. Further, since the card edge connector 4 is also arranged in the connector fitting portion 7 of the connector case 6, the entire circumference including the vertical direction and the board width direction is surrounded by the connector fitting portion 7 and protected from the outside. There is.
Although the edge of the substrate main body 3 is buried inside the second sealing resin 16 exposed in the opening 8a of the substrate accommodating portion 8, even if the second sealing resin 16 is damaged. , Only the edge of the substrate body 3 is affected from the outside. The essential conductor pattern and the electronic component 5 on the substrate 2 are kept sealed in the second sealing resin 16 and are not damaged at all.

結果として基板２の重要な全ての箇所が射出成形で製作されたコネクタケース６で保護されることになり、基板本体３の上面を脆弱な封止樹脂で保護している特許文献１の不具合２が解消される。よって、電子部品モジュール１の使用過程において基板２に対する良好な保護機能を達成でき、耐久性の向上により商品としての信頼性を向上することができる。 As a result, all the important parts of the substrate 2 are protected by the connector case 6 manufactured by injection molding, and the upper surface of the substrate body 3 is protected by a fragile sealing resin, which is a defect 2 of Patent Document 1. Is resolved. Therefore, a good protection function for the substrate 2 can be achieved in the process of using the electronic component module 1, and the reliability as a product can be improved by improving the durability.

ところで基板２の保護に関して、特許文献１では封止樹脂の剥離に起因する不具合も存在する。
即ち、特許文献１の図７に示されるように、コネクタケースの第１収容部内に注入された樹脂剤が弾性部材に堰き止められ、基板本体の上面側の領域では、硬化後の封止樹脂が弾性部材の側面に接合されると共に、コネクタケースの上面に対しても接合されている。これらの接合面（以下、界面と称する）は、特許文献１の図２に示された第２収容部と封止樹脂との境界に沿って直線状に連続しており、その直下に基板本体の上面が封止・保護されている。 By the way, regarding the protection of the substrate 2, there is also a problem in Patent Document 1 due to the peeling of the sealing resin.
That is, as shown in FIG. 7 of Patent Document 1, the resin agent injected into the first accommodating portion of the connector case is blocked by the elastic member, and in the region on the upper surface side of the substrate main body, the cured sealing resin is used. Is joined to the side surface of the elastic member and also to the upper surface of the connector case. These joint surfaces (hereinafter referred to as interfaces) are linearly continuous along the boundary between the second accommodating portion and the sealing resin shown in FIG. 2 of Patent Document 1, and the substrate main body is directly below the joint surface. The upper surface of the is sealed and protected.

このような界面が所期の接合状態に保たれていれば、電子部品モジュールに降りかかった雨水等は界面で遮られるため、基板本体は何ら影響を受けない。しかしながら、例えば相手側コネクタの接続時の外力或いは使用過程での振動等を受けて界面が剥離することがあり、その場合には外部と基板本体の上面とが連通してしまう。結果として界面の剥離箇所を経て雨水等が侵入してしまうため、防水性等の基板本体の保護機能の点で問題が生じる。 If such an interface is maintained in the desired bonded state, rainwater or the like that has fallen on the electronic component module is blocked by the interface, so that the substrate body is not affected at all. However, for example, the interface may be peeled off due to an external force at the time of connecting the mating connector or vibration during the use process, and in that case, the outside and the upper surface of the substrate body communicate with each other. As a result, rainwater or the like invades through the peeled portion of the interface, which causes a problem in terms of the protective function of the substrate body such as waterproofness.

以上のような界面は、本実施形態の電子部品モジュール１でも形成される。具体的には、図４に示すように基板収容部８を開口部８ａ側から見ると、基板収容部８の内周と第２封止樹脂１６の外周との間に環状をなして連続する界面が形成される。しかしながら、仮に界面に剥離が生じて雨水等が侵入したとしても、基板本体３及び各電子部品５は第２封止樹脂１６に封止された状態に保たれる。このため雨水等の影響を受けることはなく、この要因も電子部品モジュール１の耐久性の向上に大きく貢献する。 The interface as described above is also formed in the electronic component module 1 of the present embodiment. Specifically, as shown in FIG. 4, when the substrate accommodating portion 8 is viewed from the opening 8a side, the inner circumference of the substrate accommodating portion 8 and the outer circumference of the second sealing resin 16 form an annular shape and are continuous. An interface is formed. However, even if peeling occurs at the interface and rainwater or the like invades, the substrate body 3 and each electronic component 5 are kept sealed in the second sealing resin 16. Therefore, it is not affected by rainwater or the like, and this factor also greatly contributes to the improvement of the durability of the electronic component module 1.

以上で実施形態の説明を終えるが、本発明の態様はこの実施形態に限定されるものではない。例えば上記実施形態では、自動二輪車のエンジン制御用のＥＣＵとして機能する電子部品モジュール１及びそのコネクタケース６に具体化したが、本発明はこれに限るものではなく種々の用途に変更してもよい。 Although the description of the embodiment is completed above, the aspect of the present invention is not limited to this embodiment. For example, in the above embodiment, the electronic component module 1 and its connector case 6 that function as an ECU for controlling an engine of a motorcycle have been embodied, but the present invention is not limited to this and may be changed to various uses. ..

また上記実施形態では、図４に示すように基板収容部８の上面８ｃに局所的に逃げ部１４を形成したが、これに代えて図１１に示すように、基板収容部８の上面８ｃ全体を嵩上げして基板本体３から離間させてもよく、この場合には上面８ｃ全体が逃げ部１４として機能する。無論、この逃げ部１４は基板収容部８の開口部８ａまで連続して形成され、基板２の挿入時には高さが大きい電子部品５との干渉が防止される。例えば、大きい電子部品５の配置が異なる複数種類の基板２を製作する場合であっても、図１１の場合にはコネクタケース６を共用化できる。これに対して図４の場合には、第２樹脂剤の注入量を減少できるという別のメリットを有する。 Further, in the above embodiment, the relief portion 14 is locally formed on the upper surface 8c of the substrate accommodating portion 8 as shown in FIG. 4, but instead, as shown in FIG. 11, the entire upper surface 8c of the substrate accommodating portion 8 is formed. May be raised and separated from the substrate main body 3, and in this case, the entire upper surface 8c functions as a relief portion 14. Of course, the relief portion 14 is continuously formed up to the opening 8a of the substrate accommodating portion 8 to prevent interference with the electronic component 5 having a large height when the substrate 2 is inserted. For example, even when a plurality of types of substrates 2 having different arrangements of large electronic components 5 are manufactured, the connector case 6 can be shared in the case of FIG. On the other hand, in the case of FIG. 4, there is another merit that the injection amount of the second resin agent can be reduced.

１ 電子部品モジュール
２ 基板
３ 基板本体
４ カードエッジコネクタ
５ 電子部品
６ コネクタケース
７ コネクタ嵌合部
７ａ 開口部
８ 基板収容部
８ａ 開口部
９ 相手側コネクタ
１０ 隔壁
１１ スリット
１２ 封止溝
１３ 第１封止樹脂
１４ 逃げ部
１６ 第２封止樹脂 1 Electronic component module 2 Board 3 Board body 4 Card edge connector 5 Electronic component 6 Connector case 7 Connector fitting 7a Opening 8 Board housing 8a Opening 9 Mating connector 10 Partition 11 Slit 12 Sealing groove 13 1st seal Stop resin 14 Relief part 16 Second sealing resin

Claims (10)

電子部品が実装された基板本体及び前記基板本体の一側縁に設けられたカードエッジコネクタを有する基板と、前記基板が収容されたコネクタケースとを備え、
前記コネクタケースは、
前記基板本体が収容された基板収容部と、
前記基板収容部に隣接して形成されており、前記カードエッジコネクタが収容されたコネクタ嵌合部と、
前記カードエッジコネクタが挿通されるスリットが貫通形成されており、前記基板収容部と前記コネクタ嵌合部とを区画する隔壁と、
を有し、
前記コネクタ嵌合部は、前記基板収容部とは反対側の端部に、相手側コネクタが接続可能とされている開口部が形成されており、
前記基板収容部は、前記コネクタ嵌合部とは反対側の端部に、前記相手側コネクタの嵌合方向に沿って前記基板が挿入される開口部が形成されており、
前記コネクタ嵌合部の開口部を経て注入された第１樹脂剤が硬化して形成された第１封止樹脂により、前記基板と前記スリットとの間の間隙が塞がれており、
前記基板収容部の開口部を経て注入された第２樹脂剤が硬化して形成された第２封止樹脂により、前記基板本体が封止されている、
ことを特徴とする電子部品モジュール。 A board having a board body on which electronic components are mounted, a board having a card edge connector provided on one side edge of the board body, and a connector case in which the board is housed are provided.
The connector case is
The substrate accommodating portion in which the substrate main body is accommodated and
A connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector, and a connector fitting portion.
A partition through which the card edge connector is inserted is formed, and a partition wall for partitioning the substrate accommodating portion and the connector fitting portion.
Have,
The connector fitting portion has an opening formed at an end opposite to the substrate accommodating portion to which a mating connector can be connected.
The substrate accommodating portion has an opening at an end opposite to the connector fitting portion into which the substrate is inserted along the mating direction of the mating connector.
The gap between the substrate and the slit is closed by the first sealing resin formed by curing the first resin agent injected through the opening of the connector fitting portion.
The substrate main body is sealed by the second sealing resin formed by curing the second resin agent injected through the opening of the substrate accommodating portion.
An electronic component module characterized by that. 前記基板収容部には、前記電子部品との干渉を防止する逃げ部が前記開口部まで連続して形成されている、
ことを特徴とする請求項１に記載の電子部品モジュール。 A relief portion for preventing interference with the electronic component is continuously formed up to the opening in the substrate accommodating portion.
The electronic component module according to claim 1. 前記相手側コネクタの嵌合方向と直交する前記基板の幅方向において、前記基板本体の寸法が前記カードエッジコネクタの寸法よりも大きい、
ことを特徴とする請求項１または２に記載の電子部品モジュール。 The size of the board body is larger than the size of the card edge connector in the width direction of the board orthogonal to the fitting direction of the mating connector.
The electronic component module according to claim 1 or 2. 前記隔壁のコネクタ嵌合部側には、前記スリットの周囲を取り囲むように封止溝が形成され、
前記第１封止樹脂は、前記封止溝内に形成されている、
ことを特徴とする請求項１乃至３の何れか１項に記載の電子部品モジュール。 A sealing groove is formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit.
The first sealing resin is formed in the sealing groove.
The electronic component module according to any one of claims 1 to 3, wherein the electronic component module is characterized in that. 前記基板本体及び前記電子部品は、前記基板収容部内に配置されることにより全周を前記基板収容部に包囲されている、
ことを特徴とする請求項１乃至４の何れか１項に記載の電子部品モジュール。 The substrate main body and the electronic component are arranged in the substrate accommodating portion so that the entire circumference thereof is surrounded by the substrate accommodating portion.
The electronic component module according to any one of claims 1 to 4, wherein the electronic component module is characterized in that. 電子部品が実装された基板本体及び前記基板本体の一側縁に設けられたカードエッジコネクタを有する基板が内部に配置される電子部品モジュールのコネクタケースにおいて、
前記基板本体が収容される基板収容部と、
前記基板収容部に隣接して形成されており、前記カードエッジコネクタが収容されるコネクタ嵌合部と、
前記カードエッジコネクタが挿通されるスリットが貫通形成されており、前記基板収容部と前記コネクタ嵌合部とを区画する隔壁と、
を有し、
前記コネクタ嵌合部は、前記基板収容部とは反対側の端部に、硬化により第１封止樹脂を形成して前記基板と前記スリットとの間の間隙を塞ぐ第１樹脂剤が注入され、且つ相手側コネクタが接続可能とされている開口部が形成されており、
前記基板収容部は、前記コネクタ嵌合部とは反対側の端部に、前記相手側コネクタの嵌合方向に沿って前記基板が挿入され、且つ硬化により前記基板本体を封止する第２封止樹脂を形成する第２樹脂剤が注入される開口部が形成されている、
ことを特徴とする電子部品モジュールのコネクタケース。 In a connector case of an electronic component module in which a board body on which electronic components are mounted and a board having a card edge connector provided on one side edge of the board body are arranged inside.
A substrate accommodating portion in which the substrate main body is accommodated and
A connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector, and a connector fitting portion.
A partition through which the card edge connector is inserted is formed, and a partition wall for partitioning the substrate accommodating portion and the connector fitting portion.
Have,
The connector fitting portion is injected with a first resin agent that forms a first sealing resin by curing and closes a gap between the substrate and the slit at an end opposite to the substrate accommodating portion. In addition, an opening is formed to which the mating connector can be connected.
The substrate accommodating portion is a second seal in which the substrate is inserted into an end portion on the opposite side of the connector fitting portion along the mating direction of the mating connector, and the substrate main body is sealed by curing. An opening is formed in which the second resin agent forming the stop resin is injected.
A connector case for electronic component modules that features this. 前記基板収容部には、前記電子部品との干渉を防止する逃げ部が前記開口部まで連続して形成されている、
ことを特徴とする請求項６に記載の電子部品モジュールのコネクタケース。 A relief portion for preventing interference with the electronic component is continuously formed up to the opening in the substrate accommodating portion.
The connector case of the electronic component module according to claim 6. 前記相手側コネクタの嵌合方向と直交する前記基板の幅方向において、前記基板収容部の寸法が前記コネクタ嵌合部の寸法よりも大きい、
ことを特徴とする請求項６または７に記載の電子部品モジュールのコネクタケース。 The size of the substrate accommodating portion is larger than the dimension of the connector fitting portion in the width direction of the substrate orthogonal to the fitting direction of the mating connector.
The connector case of the electronic component module according to claim 6 or 7. 前記隔壁のコネクタ嵌合部側には、前記スリットの周囲を取り囲むように封止溝が形成され、
前記第１封止樹脂は、前記封止溝内に形成されている、
ことを特徴とする請求項６乃至８の何れか１項に記載の電子部品モジュールのコネクタケース。 A sealing groove is formed on the connector fitting portion side of the partition wall so as to surround the periphery of the slit.
The first sealing resin is formed in the sealing groove.
The connector case of the electronic component module according to any one of claims 6 to 8, wherein the connector case is characterized. 前記基板収容部は、内部に配置された前記基板本体及び前記電子部品の全周を包囲する形状に形成されている、
ことを特徴とする請求項６乃至９の何れか１項に記載の電子部品モジュールのコネクタケース。 The substrate accommodating portion is formed in a shape that surrounds the entire circumference of the substrate main body and the electronic component arranged inside.
The connector case for an electronic component module according to any one of claims 6 to 9, wherein the connector case is characterized in that.
JP2019042746A 2019-03-08 2019-03-08 Electronic component module and its connector case Active JP7287796B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019042746A JP7287796B2 (en) 2019-03-08 2019-03-08 Electronic component module and its connector case
CN202010150560.0A CN111668638B (en) 2019-03-08 2020-03-06 Electronic component module and connector housing thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019042746A JP7287796B2 (en) 2019-03-08 2019-03-08 Electronic component module and its connector case

Publications (2)

Publication Number Publication Date
JP2020145373A true JP2020145373A (en) 2020-09-10
JP7287796B2 JP7287796B2 (en) 2023-06-06

Family

ID=72354520

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019042746A Active JP7287796B2 (en) 2019-03-08 2019-03-08 Electronic component module and its connector case

Country Status (2)

Country Link
JP (1) JP7287796B2 (en)
CN (1) CN111668638B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49117445U (en) * 1973-02-03 1974-10-07
JPH09512134A (en) * 1994-04-11 1997-12-02 レイケム・コーポレイション Sealed electronic packaging for environmental protection of active electronic devices
JP2017117914A (en) * 2015-12-24 2017-06-29 新電元工業株式会社 Electronic component module
JP2017130591A (en) * 2016-01-22 2017-07-27 日立オートモティブシステムズ株式会社 On-vehicle electronic module, card edge connector, and connector
JP2018125334A (en) * 2017-01-30 2018-08-09 株式会社ケーヒン Electronic control device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5708424B2 (en) * 2011-10-05 2015-04-30 株式会社オートネットワーク技術研究所 Electronic circuit unit with external connection
US10238012B2 (en) * 2013-10-02 2019-03-19 Hitachi Automotive Systems, Ltd Waterproof component-suppressing electronic control device
JP6319665B2 (en) * 2014-08-08 2018-05-09 株式会社オートネットワーク技術研究所 Card edge connector
JP2017162762A (en) * 2016-03-11 2017-09-14 株式会社オートネットワーク技術研究所 Card edge connector

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49117445U (en) * 1973-02-03 1974-10-07
JPH09512134A (en) * 1994-04-11 1997-12-02 レイケム・コーポレイション Sealed electronic packaging for environmental protection of active electronic devices
JP2017117914A (en) * 2015-12-24 2017-06-29 新電元工業株式会社 Electronic component module
JP2017130591A (en) * 2016-01-22 2017-07-27 日立オートモティブシステムズ株式会社 On-vehicle electronic module, card edge connector, and connector
JP2018125334A (en) * 2017-01-30 2018-08-09 株式会社ケーヒン Electronic control device

Also Published As

Publication number Publication date
CN111668638B (en) 2024-04-02
CN111668638A (en) 2020-09-15
JP7287796B2 (en) 2023-06-06

Similar Documents

Publication Publication Date Title
JP6590999B1 (en) Waterproof electronic device and method for manufacturing waterproof electronic device
US9013889B2 (en) Electronic controller
US9093776B2 (en) Electronic control device
US7739791B2 (en) Method of producing an overmolded electronic module with a flexible circuit pigtail
US20210119358A1 (en) Pin, pin combination structure, package body, and method for manufacturing package body
WO2014119379A1 (en) Vehicle-mounted electronic module
KR20130128410A (en) Control module and method for producing same
KR101570222B1 (en) Control unit for a motor vehicle having a connector housing
KR20060050388A (en) Electronic apparatus and lighting device
KR102543956B1 (en) Receptacle Connector
JP6442527B2 (en) Electronic control unit
US20130070426A1 (en) Control device
CN111165081A (en) Electronic control unit
US10396010B2 (en) Onboard control device
US9293857B2 (en) Sealed and un-mated electrical connection system using single insertion press fit pins
US7462077B2 (en) Overmolded electronic assembly
CN110603693B (en) Electronic module and method of manufacture
US20170135210A1 (en) Method for manufacturing electronic device, and electronic device
JP5648527B2 (en) Semiconductor device with connector and manufacturing method thereof
US20150098193A1 (en) Covering device for a contacting portion of a printed circuit board, control system for a mechatronic module and method for assembling a control system
JP2020145373A (en) Electronic component module and connector case thereof
KR102654771B1 (en) Receptacle Connector
JP6366071B2 (en) Electronic equipment
KR102382143B1 (en) Electronic control unit, molding tool, and method for producing an electronic control unit
KR19990082044A (en) Electric device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211110

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20221027

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221116

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20221205

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20221205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A821

Effective date: 20221205

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230112

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230510

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230525

R150 Certificate of patent or registration of utility model

Ref document number: 7287796

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150