CN111668638A - Electronic component module and connector housing thereof - Google Patents
Electronic component module and connector housing thereof Download PDFInfo
- Publication number
- CN111668638A CN111668638A CN202010150560.0A CN202010150560A CN111668638A CN 111668638 A CN111668638 A CN 111668638A CN 202010150560 A CN202010150560 A CN 202010150560A CN 111668638 A CN111668638 A CN 111668638A
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- China
- Prior art keywords
- substrate
- connector
- electronic component
- housing
- main body
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- 239000000758 substrate Substances 0.000 claims abstract description 250
- 229920005989 resin Polymers 0.000 claims abstract description 112
- 239000011347 resin Substances 0.000 claims abstract description 112
- 238000007789 sealing Methods 0.000 claims abstract description 60
- 230000013011 mating Effects 0.000 claims abstract description 33
- 238000005192 partition Methods 0.000 claims abstract description 22
- 238000000034 method Methods 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 59
- 238000009751 slip forming Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 4
- 238000002347 injection Methods 0.000 description 30
- 239000007924 injection Substances 0.000 description 30
- 239000003990 capacitor Substances 0.000 description 12
- 238000003780 insertion Methods 0.000 description 9
- 230000037431 insertion Effects 0.000 description 9
- 230000006870 function Effects 0.000 description 8
- 239000004020 conductor Substances 0.000 description 3
- 239000000446 fuel Substances 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 229920003002 synthetic resin Polymers 0.000 description 3
- 239000000057 synthetic resin Substances 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009993 protective function Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/502—Bases; Cases composed of different pieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
- H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
Landscapes
- Connector Housings Or Holding Contact Members (AREA)
- Casings For Electric Apparatus (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
An electronic component module and a connector housing thereof, which can prevent a substrate from being damaged when the substrate is inserted into the connector housing in an assembling operation and can realize a good protection function for the substrate in a using process. The electronic component module has: a substrate having a substrate body and a card edge connector; and a connector housing accommodating the substrate. The connector housing has: a substrate accommodating portion; a connector fitting portion; and a partition wall through which a slit is formed. The connector fitting portion has an opening portion to which a mating connector is connected, and the substrate accommodating portion has an opening portion into which a substrate is inserted along a connector fitting direction. The gap between the substrate and the slit is closed by a first sealing resin formed by curing a first resin material injected from an opening of the connector fitting portion, and the substrate main body is sealed by a second sealing resin formed by curing a second resin material injected from an opening of the substrate housing portion.
Description
Technical Field
The invention relates to an electronic component module and a connector housing thereof.
Background
An electronic component module is known in which a card edge connector is provided on one side of a substrate main body on which an electronic component is mounted, and a substrate constituted by the substrate main body and the card edge connector is disposed in a connector housing.
For example, in an electronic component module described in japanese patent application laid-open No. 2017-117914, as shown in fig. 6 of japanese patent laid-open No. 2017-117914, an elastic member 21 is disposed in a connector housing 10 having a box shape that is flat in the vertical direction, and is divided into a first receiving portion 11 that opens upward and a second receiving portion 13 that opens to one side. The substrate body 3 is disposed in the first housing portion 11, and the electronic component 5 protruding from the lower surface of the substrate body 3 is positioned in the recess 12 formed in the bottom wall of the first housing portion 11, thereby preventing interference with the bottom wall. In this state, the card edge connector 8 of the substrate 2 is inserted into the slit 21a formed in the elastic member 21 and projects into the second housing portion 13, thereby constituting a connector fitting portion to which a connector on the other side can be connected. The resin agent is injected into the first housing portion 11, and the substrate body 3 is sealed with the cured sealing resin 28, thereby protecting the substrate body 3.
When the electronic component module 1 is assembled, as shown in fig. 8 of jp 2017 a-117914, the substrate 2 is first inserted into the first receiving portion 11 of the connector housing 10 from obliquely above, and the card edge connector 8 at the front end is projected into the second receiving portion 13 through the slit 21a of the elastic member 21. Next, when the substrate 2 is rotated in a horizontal posture with the slit 21a as a fulcrum, the substrate main body 3 is disposed in the first housing portion 11, and the electronic component 5 protruding from the lower surface of the substrate main body 3 is housed in the recess 12.
Thereafter, when an injection nozzle is disposed above the first housing portion 11 and the resin agent is injected onto the upper surface of the substrate body 3, the resin agent is guided to the lower side of the substrate body 3 through a gap around the substrate body 3, and air existing on the lower side is discharged upward through an air extraction hole provided through the substrate body 3. The injected resin agent impregnates the substrate body 3 and is blocked by the elastic member 21 to prevent leakage to the second receiving portion 13, and when the resin agent is cured and seals the substrate body 3 as the sealing resin 28, the assembly work of the electronic element module 1 is completed.
However, the electronic component module 1 described in japanese patent application laid-open No. 2017-117914 has two problems (referred to as problems 1 and 2) as described below, and thus has room for improvement.
The failure 1 relates to protection of the substrate 2 generated in the assembly operation of the electronic component module 1, and there is a possibility that each part of the substrate 2 is damaged by excessive force due to the substrate 2 being inserted into the first housing portion 11 in an inclined manner.
More specifically, since the card edge connector 8 is inserted into the slit 21a of the elastic member 21 without being positioned by a stopper or the like and entrusted to the operator to measure with eyes, the insertion depth may be excessive or insufficient. In addition, when the card edge connector 8 at the tip end is excessively inserted, the card edge connector 8 comes into contact with the inner wall of the second receiving portion 13, whereas when the insertion depth is insufficient, the board body 3 comes into contact with the side wall of the first receiving portion 11, and the card edge connector 8 and the board body 3 are damaged by excessive force. In addition, if the insertion depth is excessive or insufficient, the electronic component 5 to be accommodated in the recess 12 of the first accommodation portion 11 may be damaged by contact with the bottom wall.
The problem 2 is related to the protection of the substrate 2 generated during the use of the assembled electronic component module 1, and the protection is insufficient because the upper surface of the substrate main body 3 is sealed only by the sealing resin 28.
More specifically, the lower surface of the substrate main body 3 is protected by the bottom wall of the connector housing 10, and the upper surface of the substrate main body 3 is protected by the cured sealing resin 28. Although cured, the sealing resin 28 is more fragile than the connector housing 10 manufactured by injection molding or the like, and therefore the protection of the upper surface of the substrate main body 3 is insufficient compared to the lower surface. Therefore, when an external force acts on the electronic component module 1, the substrate main body 3 and the electronic component 5 inside may be damaged together with the sealing resin 28. Further, although a countermeasure for covering the surface of the sealing resin 28 with a metal plate or the like is conceivable, another problem such as an increase in cost occurs due to the additional member.
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component module and a connector housing thereof, which can prevent a substrate from being damaged when the substrate is inserted into the connector housing in an assembling operation and can realize a good protection function for the substrate during use.
In order to achieve the above object, an electronic component module of the present invention includes: a substrate having a substrate main body on which electronic components are mounted and a card edge connector provided at one side edge of the substrate main body; and a connector housing that accommodates the substrate, the connector housing including: a substrate housing portion housing a substrate main body; a connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector; and a partition wall that penetrates a slit through which the card edge connector is inserted and that divides the board housing section and the connector fitting section, wherein the connector fitting section has an opening section formed at an end section opposite to the board housing section, the opening section being capable of connecting a mating connector, the board housing section has an opening section formed at an end section opposite to the connector fitting section, the opening section being configured to allow the board to be inserted in a fitting direction of the mating connector, a gap between the board and the slit is closed by a first sealing resin, the first sealing resin being formed by curing a first resin agent injected through the opening section of the connector fitting section, the board main body being closed by a second sealing resin, the second sealing resin being formed by curing a second resin agent injected through the opening section of the board housing section.
As another aspect of the electronic component module, a relief portion that prevents interference with the electronic component may be formed continuously to the opening portion on the substrate housing portion.
In another embodiment of the electronic component module, the size of the board main body may be larger than the size of the card edge connector in a width direction of the board orthogonal to the fitting direction of the mating connector.
As another aspect of the electronic component module, a seal groove may be formed in the partition wall on the connector fitting portion side so as to surround the slit, and the first sealing resin may be formed in the seal groove.
In another embodiment of the electronic component module, the substrate main body and the electronic component may be arranged in the substrate housing portion so as to be surrounded by the substrate housing portion over the entire circumference.
In addition, a connector housing of an electronic component module according to the present invention is a connector housing of an electronic component module in which a substrate having a substrate main body on which an electronic component is mounted and a card edge connector provided on one side edge of the substrate main body is arranged, the connector housing including: a substrate housing portion housing a substrate main body; a connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector; and a partition wall that penetrates a slit through which the card edge connector is inserted and that divides the substrate housing section and the connector fitting section, wherein the connector fitting section has an opening formed in an end portion on an opposite side to the substrate housing section, the opening allowing the first resin agent to be injected and the counterpart connector to be connected, the first resin agent forms a first sealing resin by curing, thereby closing a gap between the substrate and the slit, the substrate housing section has an opening formed in an end portion on an opposite side to the connector fitting section, the opening allowing the substrate to be inserted in a fitting direction of the counterpart connector and allowing the second resin agent to be injected, and the second resin agent forms a second sealing resin that seals the substrate main body by curing.
In another embodiment of the connector housing of the electronic component module, a relief portion that prevents interference with the electronic component may be formed continuously to the opening portion in the substrate housing portion.
In another embodiment of the connector housing of the electronic component module, the board housing portion may have a dimension larger than a dimension of the connector fitting portion in a width direction of the board orthogonal to a fitting direction of the mating connector.
In another embodiment of the connector housing of the electronic component module, a seal groove may be formed in the partition wall on the connector fitting portion side so as to surround the slit, and the first sealing resin may be formed in the seal groove.
In another embodiment of the connector housing of the electronic component module, the substrate housing portion may be formed in a shape surrounding the entire circumference of the electronic component and the substrate main body disposed inside.
According to the electronic component module and the connector housing thereof of the present invention, it is possible to prevent the substrate from being damaged when the substrate is inserted into the connector housing in the assembling work and to realize a good protection function for the substrate during use.
Drawings
Fig. 1 is a perspective view showing an electronic component module and a mating connector according to an embodiment.
Fig. 2 is an exploded perspective view showing the electronic component module and the mating connector before the connector housing and the board are joined.
Fig. 3 is a view from direction a of fig. 1.
Fig. 4 is a view from direction B of fig. 1.
Fig. 5 is a cross-sectional view taken along line V-V of fig. 1 showing the electronic component module when the mating connector is disconnected.
Fig. 6 is a cross-sectional view corresponding to fig. 5 showing the electronic component module when the mating connector is connected.
Fig. 7 is a sectional view taken along line VII-VII of fig. 6.
Fig. 8 is a detailed view of portion C of fig. 6.
Fig. 9 is a perspective view showing the connector housing when the first resin agent is injected.
Fig. 10 is a perspective view showing the connector housing when the second resin agent is injected.
Fig. 11 is a view corresponding to fig. 4, in which the entire upper surface of the substrate accommodating portion is raised as another example of the escape portion.
(symbol description)
1 electronic component module
2 base plate
3 substrate body
4-card edge connector
5 electronic component
6 connector shell
7 connector fitting part
7a opening part
8 substrate accommodating part
8a opening part
9 opposite side connector
10 partition wall
11 slit
12 seal groove
13 first sealing resin
14 escape part
16 second sealing resin
Detailed Description
Hereinafter, an electronic component module embodying the present invention and an embodiment of a connector housing of the electronic component module will be described.
Fig. 1 is a perspective view showing an electronic component module and a mating connector according to the present embodiment, and fig. 2 is an exploded perspective view showing the electronic component module and the mating connector before the connector housing is coupled to the substrate.
The electronic component module 1 includes a substrate 2 and a connector housing 6 made of synthetic resin. The board 2 of the electronic component module 1 is composed of a board main body 3 and a card edge connector 4 provided on one side edge of the board main body 3. A plurality of electronic components 5 are mounted on the substrate body 3. The plurality of electronic components 5 are connected to each other via a conductor pattern, not shown, and thus a circuit formed on the substrate body 3 is electrically connected to the card edge connector 4.
The electronic component module 1 is configured by inserting the substrate 2 into the connector housing 6. As will be described in detail later, when the mating connector 9 is connected to the connector fitting portion 7 provided on one side of the connector housing 6, the electronic component module 1 is connected to the electrical device to be connected via the card edge connector 4 and the mating connector 9 inside.
The electronic component module 1 of the present embodiment functions as an ECU (engine control unit) for controlling the engine of the motorcycle. The vehicle is equipped with a fuel injection valve, an ignition device, various sensors, and the like of the engine, and the electrical equipment is connected to the electronic component module 1 via the mating connector 9, and the fuel injection and ignition timing of the engine is controlled by the electronic component module 1.
In the following description, in the posture shown in fig. 1, the upper surface of the substrate body 3 is referred to as an upper surface, the lower surface is referred to as a lower surface, and a direction perpendicular to both the upper and lower surfaces of the substrate body 3 is referred to as a vertical direction. The direction in which the electronic component module 1 is connected to the mating connector 9 is referred to as a connector fitting direction, and the direction perpendicular to the vertical direction and the connector fitting direction is referred to as a board width direction.
Fig. 3 is a view taken along the direction a of fig. 1, fig. 4 is a view taken along the direction B of fig. 1, fig. 5 is a sectional view taken along the line V-V of fig. 1 showing the electronic component module 1 when the counter side connector 9 is disconnected, fig. 6 is a sectional view corresponding to fig. 5 showing the electronic component module 1 when the counter side connector 9 is connected, and fig. 7 is a sectional view taken along the line VII-VII of fig. 6.
As shown in fig. 2, 4, and 7, the board body 3 has a substantially square plate shape, and the electronic components 5 are mounted on both upper and lower surfaces. Although the electronic components 5 to be mounted have various vertical dimensions, the electronic components 5 having a large vertical dimension H2, such as the electrolytic capacitor 5a, are mounted on the upper surface of the substrate main body 3, as shown in fig. 4.
As shown in fig. 5 and 7, a plurality of contacts 4a are formed by a conductor pattern at one side edge of the substrate 2, thereby forming the card edge connector 4. Specifically, the contacts 4a are arranged along one side edge on both the upper and lower surfaces of the substrate 2, and the contacts 4a are electrically connected to the circuit on the substrate 2.
As shown in fig. 3 to 5, the connector housing 6 having the substrate 2 disposed therein has a vertically flat cylindrical shape as a whole. The connector housing 6 is divided into a connector fitting portion 7 and a substrate accommodating portion 8 adjacent to each other in the connector fitting direction. A partition wall 10 is formed in the connector housing 6, and the connector fitting portion 7 and the substrate accommodating portion 8 are partitioned by the partition wall 10 and communicate with each other via a slit 11 extending in the substrate width direction, the slit 11 being formed through the partition wall 10 in the connector fitting direction.
An opening 7a is formed in an end of the connector fitting portion 7 opposite to the board housing portion 8, and a mating connector 9 is fitted into the opening 7 a. An opening 8a is formed in the end of the substrate housing portion 8 opposite to the connector fitting portion 7, and the substrate 2 is inserted through the opening 8 a. A pair of guide grooves 8b extending along the connector fitting direction are formed on both sides in the substrate width direction in the substrate accommodating portion 8 to guide the insertion of the substrate 2.
The board main body 3 of the board 2 is disposed in the board housing portion 8 of the connector housing 6, and the card edge connector 4 of the board 2 is inserted through the slit 11 of the partition wall 10 and disposed in the connector fitting portion 7 through the slit 11. The slit 11 has a shape corresponding to the cross-sectional shape of the substrate 2, and a small gap into which the substrate 2 can be inserted is formed between the inner peripheral surface of the slit 11 and the outer peripheral surface of the substrate 2. A seal groove 12 is formed on the connector fitting portion 7 side of the partition wall 10 so as to surround the slit 11, and a first sealing resin 13 is formed by injecting and curing a first resin agent into the seal groove 12. The gap formed between the substrate 2 and the slit 11 is closed by the first sealing resin 13, and the substrate accommodating portion 8 and the connector fitting portion 7 are completely separated.
As shown in fig. 4 and 5, since the vertical dimension H2 of the electrolytic capacitor 5a, which is one of the electronic components 5 mounted on the upper surface of the substrate main body 3, is larger than the interval H1 between the upper surface of the substrate main body 3 and the upper surface 8c of the substrate accommodating portion 8, the upper portion of the electrolytic capacitor 5a interferes with the upper surface 8c of the substrate accommodating portion 8 in this state. However, the relief portion 14 is provided so as to protrude from the upper surface 8c of the substrate accommodating portion 8, and the relief portion 14 is separated from the upper surface of the substrate main body 3 by an interval H3 larger than the vertical dimension H2 of the electrolytic capacitor 5 a. More specifically, the relief portion 14 is formed at a position corresponding to the electrolytic capacitor 5a on the upper surface 8c of the substrate housing portion 8 in the substrate width direction, covers the electrolytic capacitor 5a from above, and continues from the position of the electrolytic capacitor 5a to the opening portion 8a of the substrate housing portion 8 in the connector fitting direction with the same cross-sectional shape. Therefore, interference between the upper portion of the electrolytic capacitor 5a and the relief portion 14 is prevented, and the electrolytic capacitor 5a is accommodated in the substrate accommodating portion 8 without any problem.
As shown in fig. 7, the dimension W1 of the substrate main body 3 is different from the dimension W2 of the card edge connector 4 in the substrate width direction. In detail, the dimension W1 of the substrate main body 3 is larger than the dimension W2 of the card edge connector 4 with the step 15 formed between the substrate main body 3 and the card edge connector 4 as a boundary.
As shown in fig. 4 and 5, the second resin agent is injected into the substrate housing portion 8 so as to spread over the inside, and the substrate main body 3 and each electronic component 5 are sealed with the second sealing resin 16 formed by curing the second resin agent, so as to be protected from water, heat, light, vibration, or the like from the outside.
In this way, the first sealing resin 13 closes the gap between the substrate 2 and the slit 11, and the second sealing resin 16 seals the substrate main body 3 and each electronic component 5, and if each of the above-described objects can be achieved, any resin may be used as the first sealing resin 13 and the second sealing resin 16, and for example, a thermosetting resin, an ultraviolet curable resin, or the like may be used as desired.
Fig. 8 is a detailed view of the portion C of fig. 6, and the connection state of the counterpart connector 9 to the connector fitting portion 7 of the connector housing 6 will be described below based on fig. 5, 6, and 8.
As described above, the connector fitting portion 7 of the connector housing 6 has a cylindrical shape which is open on one side in the connector fitting direction and is flat in the vertical direction. A fitting portion 7b is formed on the partition wall 10 side in the connector fitting portion 7, and a seal portion 7c is formed on the opening portion 7a side. The sealing portion 7c is formed to be enlarged in the vertical direction from the fitting portion 7b, and the fitting portion 7b and the sealing portion 7c are continuous via a tapered guide portion 7 d.
The mating connector 9 is constituted by a contact holding portion 9a fitted into the connector fitting portion 7 and an outer cylinder 9b surrounding the contact holding portion 9a, corresponding to the connector fitting portion 7, and the contact holding portion 9a and the outer cylinder 9b are integrally formed of a synthetic resin material. In a state where the mating connector 9 is connected to the connector fitting portion 7, the outer cylinder 9b of the mating connector 9 is externally fitted to the connector fitting portion 7 and is disengaged by the stopper 7e shown in fig. 1 and 2, and the contact holding portion 9a of the mating connector 9 is guided by the tapered guide portion 7d of the connector fitting portion 7 and is fitted into the fitting portion 7 b. Further, the seal 17 provided on the outer periphery of the contact holding portion 9a elastically abuts against the inner periphery of the seal portion 7c of the connector fitting portion 7, thereby preventing rainwater and the like from entering.
In the contact holding portion 9a of the mating connector 9, a plurality of contacts 9c in two rows above and below are arranged in the substrate width direction so as to correspond to the contacts 4a of the card edge connector 4 of the substrate 2. The holder 18 holds the contacts 9c at predetermined positions. The wiring 19 connected to each contact 9c extends from the mating connector 9 to the outside and is connected to an electric device such as a fuel injection valve, an ignition device, or a sensor mounted on the motorcycle.
As a result of the two rows of contacts 9c of the mating connector 9 being inserted into the card edge connector 4 from above and below, the contacts 4a of the card edge connector 4 come into contact with the contacts 9c of the mating connector 9 and are electrically connected.
Next, a procedure of assembling the electronic component module 1 configured as described above will be described.
First, the connector housing 6 is manufactured by injection molding or the like using a synthetic resin as a material, and the substrate 2 including the electronic component 5, the card edge connector 4 is manufactured. Next, as shown by the arrow in fig. 2, the board 2 is inserted into the board housing portion 8 of the connector housing 6 through the opening 8a with the card edge connector 4 side as the tip. The insertion direction is along the connector fitting direction, and when the substrate 2 is inserted, the electrolytic capacitor 5a on the substrate 2 moves in the relief portion 14 formed on the upper surface 8c of the substrate accommodating portion 8. Then, as shown in fig. 7, when the card edge connector 4 protrudes into the connector fitting portion 7 via the slit 11 of the partition wall 10 and the step portion 15 abuts against the partition wall 10, the insertion of the substrate 2 is completed.
In this way, the substrate 2 is inserted into the substrate accommodating portion 8 of the connector housing 6 along the connector fitting direction. Therefore, it is possible to prevent in advance the failure 1 of japanese patent application laid-open No. 2017-117914 caused by the oblique insertion of the substrate, that is, the breakage of the substrate caused by the contact with another member such as the connector housing.
Specifically, in the process of inserting the substrate 2, the substrate 2 is guided to the guide groove 8b in the substrate housing portion 8, so that the substrate body 3 and the electronic component 5 move in the substrate housing portion 8 without contacting the inner wall of the substrate housing portion 8 and without receiving an excessive force, and are arranged at respective predetermined positions. At this time, the electrolytic capacitor 5a moves in the escape portion 14 without contacting the inner wall of the escape portion 14 and without receiving an excessive force, and is disposed at a predetermined position. The card edge connector 4, which has moved in the board housing portion 8 and then protrudes into the connector fitting portion 7 through the slit 11, does not come into contact with the inner wall of the board housing portion 8 or the inner wall of the connector fitting portion 7 at this time, and only slightly slides when passing through the slit 11. Therefore, the damage due to the contact of the members can be prevented in advance.
On the other hand, as described above, inserting the substrate 2 into the connector housing 6 from the substrate accommodating portion 8 side also relaxes the restriction on the height of the electronic component 5 mounted on the substrate main body 3. Here, assume a case where the substrate 2 is inserted from the connector fitting portion 7 side along the connector fitting direction. The specification of the connector fitting portion 7 including the card edge connector 4 is automatically determined in accordance with the specification of the mating connector 9, and the shape of the connector fitting portion 7 into which the mating connector 9 is fitted cannot be freely changed.
Therefore, when the substrate 2 is inserted from the connector fitting portion 7 side, the outline shape of the entire substrate 2 including the electronic component 5 and the like as viewed along the connector fitting direction is limited by the cross-sectional shape of the connector fitting portion 7. Further, when the outline shape of the substrate 2 exceeds the cross-sectional shape of the connector fitting portion 7, the insertion is not possible due to the mutual interference, and therefore, the height of the electronic component 5 mounted on the substrate main body 3 is limited.
In contrast, the cross-sectional shape of the board housing portion 8 of the connector housing 6 can be set regardless of the specification of the mating connector 9. Therefore, when mounting the electronic component 5 having a large height such as the electrolytic capacitor 5a, the relief portion 14 may be formed in the substrate housing portion 8 so that the cross-sectional shape of the substrate housing portion 8 corresponds to the outline shape of the substrate 2. This allows the substrate 2 to be inserted into the substrate accommodating portion 8 without interfering with the peripheral wall of the substrate accommodating portion 8. Therefore, the restriction on the height of the electronic component 5 mounted on the substrate 2 can be relaxed, and the function improvement of the electronic component module 1 can be realized.
In addition, the advantage of inserting the substrate 2 from the substrate accommodating portion 8 side is not only in the height of the electronic component 5 but also in the dimension W1 in the substrate width direction of the substrate main body 3 shown in fig. 7. That is, when the board 2 is inserted from the connector fitting portion 7 side, the dimension W1 of the board main body 3 is also limited by the sectional shape of the connector fitting portion 7, more specifically, by the dimension W3 in the board width direction of the connector fitting portion 7 shown in fig. 7. However, when the substrate 2 is inserted from the substrate accommodating portion 8 side, the substrate main body 3 having the desired dimension W1 can be inserted because the cross-sectional shape of the substrate accommodating portion 8 can be set so that the substrate main body 3 can be inserted. In this case, the dimension of the substrate accommodating portion 8 in the substrate width direction is equal to the dimension W1 of the substrate main body 3, and is inevitably larger than the dimension W3 of the connector fitting portion 7.
As a result, in the present embodiment, the dimension W1 of the substrate main body 3 may be larger than the dimension W2 of the card edge connector 4 corresponding to the specification of the opposite side connector 9. If the dimension W1 is increased, the effective area of the substrate main body 3 available for mounting the electronic component 5 is also increased, and therefore this factor also contributes greatly to the improvement of the function of the electronic component module.
Returning to the explanation of the assembly operation, the above insertion operation of the board 2 can be performed in an arbitrary posture of the connector housing 6, but in the next injection operation of the first resin agent, the connector housing 6 is held in a posture in which the opening 7a of the connector fitting portion 7 shown in fig. 9 is directed upward. When the inside of the connector fitting portion 7 is viewed from above, the card edge connector 4 fitted into the slit 11 of the partition wall 10 as shown in fig. 3 is confirmed, and the periphery of the card edge connector 4 is surrounded by the seal groove 12.
Next, the injection nozzle 31 is inserted into the connector fitting portion 7 through the opening portion 7a, and the first resin agent is injected into the seal groove 12. The first resin agent is cured in the sealing groove 12 and forms a first sealing resin 13 surrounding the periphery of the card edge connector 4. Further, the gap between the substrate 2 and the slit 11 is closed by the first sealing resin 13, and the substrate accommodating portion 8 and the connector fitting portion 7 are completely separated.
Next, as shown in fig. 10, the connector housing 6 is turned upside down to be set in a posture in which the opening 8a of the substrate housing portion 8 is directed upward. As shown in fig. 4, the substrate body 3 inserted into the substrate housing portion 8 can be confirmed. Next, the injection nozzle 32 is inserted into the substrate accommodating portion 8 through the opening 8a, and the second resin agent is injected into the substrate accommodating portion 8. The second resin agent is cured in the substrate housing portion 8, and the substrate main body 3 and each electronic component 5 are sealed with the second sealing resin 16 formed thereby.
The first resin agent and the second resin agent are set to different viscosities and injection amounts as described below, because of different purposes.
That is, the first resin agent is intended to close the gap between the substrate 2 and the slit 11. Therefore, when the sealing groove 12 is filled, a high viscosity is required to a degree that does not leak to the substrate housing portion 8 side through the gap, but the filling amount is only required to be very small as long as the gap can be cured and closed in the sealing groove 12. As an example, when the injection amount of the second resin agent is 40cc, the injection amount of the first resin agent is only about 0.15 cc.
When the first resin agent is injected, it is necessary to prevent the first resin agent from adhering to each contact 4a of the card edge connector 4, the sealing portion 7c exposed in the connector fitting portion 7, and the like. This is because adhesion to the contact 4a is a cause of poor contact, and adhesion to the sealing portion 7c is a cause of lowering of waterproofness. However, since the injection amount of the first resin agent is very small and gravity acts in the connector fitting direction in the posture of the connector housing 6 shown in fig. 9 at the time of the injection operation of the first resin agent, it is considered that the seal groove 12 of the injection portion is located at a position lower than the contact 4a and the seal portion 7 c. Therefore, the first resin agent can be easily prevented from adhering to the contacts 4a and the seal portion 7c by injecting the first resin agent while keeping the tip of the injection nozzle 31 at the height closest to the seal groove 12.
Further, although the viscosity of the first resin agent is high or low, which is a factor of lowering the injection speed, the injection amount is very small. Therefore, the injection operation can be completed simply and in a short time without delay, and the operation can be performed efficiently.
Here, in japanese patent application laid-open No. 2017-117914, the first receiving portion and the second receiving portion of the connector housing are divided by an elastic member. In order to realize the above structure, a mold for molding the elastic member is required, and a molding operation of the elastic member using the mold is also required. In addition, in the assembly work of the electronic component module, a work of disposing the elastic member in the connector housing is required. All of the above increases the manufacturing cost of the electronic component module.
In contrast, in the present embodiment, only a small amount of the first resin agent is injected into the seal groove 12. Since the injection operation can be completed simply and in a short time as described above and a small amount of the first resin agent is inexpensive, the production cost can be reduced as compared with japanese patent laid-open No. 2017-117914.
On the other hand, the second resin agent is intended to seal the substrate main body 3 and the electronic components 5 in the substrate housing portion 8, and the gap between the substrate 2 and the slit 11 is closed by the first sealing resin 13, so that the injection work can be performed without worrying about leakage to the connector fitting portion 7 side. Therefore, as exemplified by the above injection amount, an injection amount that can completely fill the substrate accommodating portion 8 is required, but even if the second resin agent is made to have a lower viscosity than the first resin agent, no problem arises.
The injection operation of the second resin agent corresponds to the injection operation of the resin agent into the first receiving portion of the connector housing disclosed in japanese patent laid-open publication No. 2017-117914, but there is a significant difference in operation efficiency.
That is, in japanese patent application laid-open No. 2017-117914, as shown in fig. 3, since most of the area of the first housing portion which is opened upward is closed by the substrate main body, the resin agent cannot be directly injected to the lower side of the substrate main body. Therefore, the resin agent injected into the upper surface of the substrate main body can be injected only at an extremely low speed by only indirectly flowing the resin agent into the lower side through the gap formed around the substrate main body. Although the above-described problem can be somewhat improved by enlarging the opening area of the suction hole, on the other hand, there arises another problem of reducing the effective area of the substrate main body available for mounting of the electronic component.
In contrast, in the present embodiment, during the injection work of the second resin agent, the connector housing 6 is held in the posture shown in fig. 10, and the gravity acts along the connector fitting direction. As a result, in the above-described posture, the connector fitting direction substantially corresponds to the vertical direction, and the substrate accommodating portion 8 opens upward, so that the injected second resin agent is stored without delay from a lower position in the substrate accommodating portion 8. Further, when the second resin agent is injected into the substrate housing portion 8, it is not necessary to consider prevention of adhesion to the contact 4a and the sealing portion 7 c. Further, since the opening 8a of the substrate housing portion 8 is larger than the opening 7a for inserting the substrate 2, the second resin agent can be injected from an appropriate position. Further, since the substrate housing portion 8 in which the substrate main body 3 is disposed is divided into two regions arranged in the vertical direction as shown in fig. 10 by sandwiching the substrate main body 3 therebetween, and each region is opened upward, the injection nozzle 32 can be disposed at each opening portion and injection can be performed at the same time. In this way, suitable conditions for increasing the injection speed of the second resin agent are achieved.
In addition, although in japanese patent application laid-open No. 2017-117914, there is a possibility that a slight gap may be formed between the slit of the elastic member and the substrate, in the present embodiment, the substrate accommodating portion 8 and the connector fitting portion 7 are completely separated by the cured first sealing resin 13. In particular, the sealing groove 12 formed in the partition wall 10 functions to enlarge the bonding area where the substrate 2 and the slit 11 are bonded via the first sealing resin 13, and further completely separates the substrate accommodating portion 8 and the connector fitting portion 7. As a result, since the injected second resin agent can be reliably prevented from leaking to the connector fitting portion 7 side, the second resin agent having a lower viscosity can be used, and the above-described factors also contribute greatly to the improvement of the injection speed.
Therefore, in the present embodiment, the work of injecting the second resin agent into the substrate accommodating portion 8 can be completed in a short time by a high injection speed, and the manufacturing cost can be reduced by improving the work efficiency.
On the other hand, as is clear from fig. 4, 6, and 7, in the electronic component module 1 completed by the above assembly work, the board main body 3 and each electronic component 5 are arranged in the board housing portion 8 of the connector housing 6, and are surrounded by the board housing portion 8 and the second sealing resin 16 over the entire circumference including the vertical direction and the board width direction, thereby being protected from the outside. The card edge connector 4 is also arranged in the connector fitting portion 7 of the connector housing 6, and is surrounded by the connector fitting portion 7 over the entire circumference including the vertical direction and the substrate width direction, thereby being protected from external influences.
Although the edge of the substrate body 3 is embedded in the second sealing resin 16 exposed to the opening 8a of the substrate housing portion 8, even if the second sealing resin 16 is damaged, only the edge of the substrate body 3 is affected by the external force. The important conductor pattern on the substrate 2 and the electronic component 5 are not damaged because they are kept in a state sealed by the second sealing resin 16.
As a result, all important portions of the substrate 2 are protected by the connector housing 6 manufactured by injection molding, and the problem 2 of japanese patent application laid-open No. 2017-117914 that the upper surface of the substrate main body 3 is protected by a weak sealing resin is eliminated. Therefore, a good protection function for the substrate 2 can be achieved in using the electronic element module 1, and reliability as a commercial product can be improved by improving durability.
Regarding the protection of the substrate 2, japanese patent laid-open No. 2017-117914 also has a problem caused by peeling of the sealing resin.
That is, as shown in fig. 7 of japanese patent laid-open publication No. 2017-117914, the resin agent injected into the first receiving portion of the connector housing is blocked by the elastic member, and in the region on the upper surface side of the substrate main body, the cured sealing resin is bonded to the side surface of the elastic member and also bonded to the upper surface of the connector housing. The bonding surface (hereinafter, referred to as an interface) is linearly continuous along the boundary between the second housing portion and the sealing resin shown in fig. 2 of japanese patent application laid-open No. 2017-117914, and the upper surface of the substrate main body is sealed and protected immediately below.
If the interface is maintained in a desired bonded state, rainwater and the like falling onto the electronic component module are blocked by the interface, and thus the substrate main body is not affected at all. However, the interface may be peeled off by an external force when the mating connector is connected or vibration during use, for example, and in this case, the outside communicates with the upper surface of the substrate main body. As a result, since rainwater or the like enters through the peeled portion of the interface, a problem arises in terms of the protective function of the substrate main body such as water repellency.
The above-described interface is also formed in the electronic component module 1 of the present embodiment. Specifically, as shown in fig. 4, when the substrate housing portion 8 is viewed from the opening 8a side, an annular and continuous interface is formed between the inner periphery of the substrate housing portion 8 and the outer periphery of the second sealing resin 16. However, even if peeling occurs at the interface and rainwater or the like enters, the substrate main body 3 and each electronic component 5 are kept in a state sealed by the second sealing resin 16. Therefore, the above factors also contribute greatly to improvement of durability of the electronic component module 1 without being affected by rainwater or the like.
The above description of the embodiments is completed, but the embodiments of the present invention are not limited to the above embodiments. For example, although the electronic component module 1 functioning as an ECU for controlling the engine of a motorcycle and the connector housing 6 of the electronic component module 1 are embodied in the above-described embodiment, the present invention is not limited thereto, and various applications may be adopted.
In the above embodiment, as shown in fig. 4, the relief portion 14 is partially formed on the upper surface 8c of the substrate accommodating portion 8, and in addition to this, as shown in fig. 11, the upper surface 8c of the substrate accommodating portion 8 may be entirely raised to be apart from the substrate main body 3, in which case the entire upper surface 8c functions as the relief portion 14. Of course, the relief portion 14 is continuously formed to the opening 8a of the substrate accommodating portion 8, thereby preventing interference with the electronic component 5 having a large height when the substrate 2 is inserted. For example, even when a plurality of kinds of substrates 2 having different arrangements of large electronic components 5 are manufactured, the connector housing 6 can be shared in the case of fig. 11. In contrast, in the case of fig. 4, there are other advantages such as the injection amount of the second resin agent can be reduced.
Claims (10)
1. An electronic component module, characterized in that,
the method comprises the following steps: a substrate having a substrate main body on which electronic components are mounted and a card edge connector provided at one side edge of the substrate main body; and a connector housing accommodating the substrate,
the connector housing has:
a substrate housing portion that houses the substrate main body;
a connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector; and
a partition wall having a slit through which the card edge connector is inserted, the partition wall dividing the board housing portion and the connector fitting portion,
the connector fitting portion has an opening portion formed at an end portion opposite to the substrate accommodating portion, to which a mating connector can be connected,
an opening is formed in the substrate housing portion at an end portion opposite to the connector fitting portion, and the substrate is inserted into the opening along a fitting direction of the mating connector,
closing a gap between the substrate and the slit with a first sealing resin formed by curing a first resin agent injected through an opening of the connector fitting portion,
the substrate main body is closed with a second sealing resin formed by curing a second resin agent injected through an opening of the substrate housing portion.
2. The electronic component module of claim 1,
in the substrate housing portion, a relief portion that prevents interference with the electronic component is continuously formed to the opening portion.
3. The electronic component module of claim 1,
the size of the board main body is larger than the size of the card edge connector in the width direction of the board orthogonal to the fitting direction of the mating connector.
4. The electronic component module of claim 1,
a seal groove is formed on the connector fitting portion side of the partition wall so as to surround the slit,
the first sealing resin is formed in the sealing groove.
5. The electronic component module of claim 1,
the substrate body and the electronic component are arranged in the substrate housing portion so as to be surrounded by the substrate housing portion over the entire circumference.
6. A connector housing for an electronic component module,
a connector housing of an electronic component module, which is provided with a substrate having a substrate main body on which an electronic component is mounted and a card edge connector provided on one side edge of the substrate main body, and which has:
a substrate housing portion that houses the substrate main body;
a connector fitting portion formed adjacent to the substrate accommodating portion and accommodating the card edge connector; and
a partition wall having a slit through which the card edge connector is inserted, the partition wall dividing the board housing portion and the connector fitting portion,
the connector fitting portion has an opening portion formed at an end portion opposite to the substrate accommodating portion, into which a first resin agent is injected and to which a counterpart connector can be connected, the first resin agent forming a first sealing resin by curing to close a gap between the substrate and the slit,
the substrate housing portion has an opening formed in an end portion on the opposite side of the connector fitting portion, the opening allowing the substrate to be inserted in the fitting direction of the mating connector and allowing a second resin agent to be injected, and the second resin agent forms a second sealing resin for sealing the substrate main body by curing.
7. The connector housing of an electronic component module according to claim 6,
in the substrate housing portion, a relief portion that prevents interference with the electronic component is continuously formed to the opening portion.
8. The connector housing of an electronic component module according to claim 6,
the dimension of the board housing portion is larger than the dimension of the connector fitting portion in the width direction of the board orthogonal to the fitting direction of the mating connector.
9. The connector housing of an electronic component module according to claim 6,
a seal groove is formed on the connector fitting portion side of the partition wall so as to surround the slit,
the first sealing resin is formed in the sealing groove.
10. The connector housing of an electronic component module according to claim 6,
the substrate housing portion is formed in a shape surrounding the entire circumference of the substrate main body and the electronic component arranged inside.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-042746 | 2019-03-08 | ||
| JP2019042746A JP7287796B2 (en) | 2019-03-08 | 2019-03-08 | Electronic component module and its connector case |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111668638A true CN111668638A (en) | 2020-09-15 |
| CN111668638B CN111668638B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010150560.0A Active CN111668638B (en) | 2019-03-08 | 2020-03-06 | Electronic component module and connector housing thereof |
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| Country | Link |
|---|---|
| JP (1) | JP7287796B2 (en) |
| CN (1) | CN111668638B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103858286A (en) * | 2011-10-05 | 2014-06-11 | 株式会社自动网络技术研究所 | Electronic circuit unit capable of external connection |
| CN105594067A (en) * | 2013-10-02 | 2016-05-18 | 日立汽车***株式会社 | Electronic control device |
| CN106663889A (en) * | 2014-08-08 | 2017-05-10 | 株式会社自动网络技术研究所 | Card edge connector and method for manufacturing same |
| JP2017130591A (en) * | 2016-01-22 | 2017-07-27 | 日立オートモティブシステムズ株式会社 | On-vehicle electronic module, card edge connector, and connector |
| CN108780960A (en) * | 2016-03-11 | 2018-11-09 | 株式会社自动网络技术研究所 | Bayonet connector |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5427572Y2 (en) * | 1973-02-03 | 1979-09-07 | ||
| IL113065A (en) * | 1994-04-11 | 2000-06-01 | Raychem Corp | Sealed electronic packaging and a method for environmental protection of active electronics |
| JP6523158B2 (en) * | 2015-12-24 | 2019-05-29 | 新電元工業株式会社 | Electronic component module |
| JP6745228B2 (en) * | 2017-01-30 | 2020-08-26 | 株式会社ケーヒン | Electronic control unit |
-
2019
- 2019-03-08 JP JP2019042746A patent/JP7287796B2/en active Active
-
2020
- 2020-03-06 CN CN202010150560.0A patent/CN111668638B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103858286A (en) * | 2011-10-05 | 2014-06-11 | 株式会社自动网络技术研究所 | Electronic circuit unit capable of external connection |
| CN105594067A (en) * | 2013-10-02 | 2016-05-18 | 日立汽车***株式会社 | Electronic control device |
| CN106663889A (en) * | 2014-08-08 | 2017-05-10 | 株式会社自动网络技术研究所 | Card edge connector and method for manufacturing same |
| JP2017130591A (en) * | 2016-01-22 | 2017-07-27 | 日立オートモティブシステムズ株式会社 | On-vehicle electronic module, card edge connector, and connector |
| CN108780960A (en) * | 2016-03-11 | 2018-11-09 | 株式会社自动网络技术研究所 | Bayonet connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111668638B (en) | 2024-04-02 |
| JP2020145373A (en) | 2020-09-10 |
| JP7287796B2 (en) | 2023-06-06 |
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