JP2020068279A - Circuit board structure - Google Patents
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Abstract
Description
本発明は、回路基板構成体に関するものである。 The present invention relates to a circuit board structure.
特許文献１に開示の絶縁型電力変換装置においては、トランスの一次側及びトランスの二次側のうち電圧が低い方におけるパターンの一部が金属板で構成されるとともに、パターンの他部が金属板より断面積が小さい金属箔で構成され、金属板は基板のパターンに対して半田で実装されている。一次側の巻線は基板に半田で実装され、二次側の巻線は基板に半田で実装され、トランスのコアが挿通された貫通孔の周囲に巻線を構成する金属板が実装される。 In the insulated power converter disclosed in Patent Document 1, a part of the pattern on the primary side of the transformer and the secondary side of the transformer with the lower voltage is formed of a metal plate, and the other part of the pattern is formed of metal. It is composed of a metal foil having a smaller cross-sectional area than the plate, and the metal plate is mounted on the pattern of the board by soldering. The primary winding is mounted on the board with solder, the secondary winding is mounted on the board with solder, and the metal plate that constitutes the winding is mounted around the through hole in which the transformer core is inserted. .
ところで、金属板の実装において位置決めが困難なため、実装がずれる。ずれないようにスルーホールや貫通穴への挿入機構で位置決めできるが、金属板のコスト高となったり、基板スペースの拡大などを招く。 By the way, since the positioning is difficult in mounting the metal plate, the mounting shifts. Positioning can be done with a through-hole or an insertion mechanism into the through-hole so as not to shift, but the cost of the metal plate increases, and the board space increases.
本発明の目的は、金属板を基板に容易に位置決めすることができる回路基板構成体を提供することにある。 It is an object of the present invention to provide a circuit board assembly that can easily position a metal plate on a board.
上記問題点を解決するための回路基板構成体は、導体パターンとレジストとを有する基板と、前記基板の第１導電部と第２導電部にはんだ付けされた金属板と、を備えた回路基板構成体において、前記金属板は、前記第１導電部にはんだ付けされる第１接続部と、前記第２導電部にはんだ付けされる第２接続部と、前記第１接続部から前記第２接続部まで延在する中間部と、を備え、前記導体パターンは、前記第１導電部及び前記第２導電部から離間した位置にて前記レジストの開口部により前記基板上に露出し、前記中間部の一部がはんだ付けされる導体パターン部を有することを要旨とする。 A circuit board structure for solving the above problems includes a circuit board having a conductor pattern and a resist, and a metal plate soldered to the first conductive portion and the second conductive portion of the substrate. In the structure, the metal plate includes a first connecting portion soldered to the first conductive portion, a second connecting portion soldered to the second conductive portion, and the first connecting portion to the second connecting portion. An intermediate portion extending to a connection portion, wherein the conductor pattern is exposed on the substrate through an opening of the resist at a position separated from the first conductive portion and the second conductive portion, and the intermediate portion The gist is that a part of the portion has a conductor pattern portion to be soldered.
これによれば、導体パターン部がレジストの開口部により露出し、はんだ付けの際に、金属板における中間部の一部が導体パターン部を用いたセルフアライン効果により、金属板を基板に容易に位置決めすることができる。 According to this, the conductor pattern portion is exposed through the opening of the resist, and at the time of soldering, a part of the intermediate portion of the metal plate is easily aligned with the substrate by the self-alignment effect using the conductor pattern portion. Can be positioned.
また、回路基板構成体について、前記第１接続部は前記金属板の一端に形成され、前記第１導電部は前記第１接続部と重なる第１重畳部位と、前記金属板の一端から突出する第１突出部位とを有し、前記導体パターン部は、前記中間部と重なる第２重畳部位と、前記第１突出部位の突出方向に対して反対方向に前記中間部から突出する第２突出部位とを有するとよい。 Further, in the circuit board structure, the first connection portion is formed at one end of the metal plate, and the first conductive portion projects from a first overlapping portion overlapping the first connection portion and one end of the metal plate. A second overlapping portion having a first protruding portion, the conductor pattern portion overlapping the intermediate portion, and a second protruding portion protruding from the intermediate portion in a direction opposite to a protruding direction of the first protruding portion. It is good to have and.
また、回路基板構成体について、前記第２接続部は前記金属板の他端に形成され、前記第２導電部は前記第２接続部と重なる第３重畳部位と、前記金属板の他端から突出する第３突出部位とを有し、前記導体パターン部は、前記中間部と重なる第４重畳部位と、前記第３突出部位の突出方向に対して反対方向に前記中間部から突出する第４突出部位とを有するとよい。 Further, in the circuit board structure, the second connecting portion is formed at the other end of the metal plate, and the second conductive portion is formed from a third overlapping portion overlapping the second connecting portion and the other end of the metal plate. A fourth projecting portion having a third projecting portion projecting, and the conductor pattern portion projecting from the intermediate portion in a direction opposite to a projecting direction of the third projecting portion; And a protruding portion.
また、回路基板構成体について、前記導体パターン部は第１導体パターン部と、該第１導体パターン部に対して離間した位置に設けられる第２導体パターン部とを有し、前記第１導体パターン部は、前記第２重畳部位及び前記第２突出部位を有し、前記第２導体パターン部は、前記第４重畳部位及び前記第４突出部位を有するとよい。 Further, in the circuit board structure, the conductor pattern portion has a first conductor pattern portion and a second conductor pattern portion provided at a position separated from the first conductor pattern portion, and the first conductor pattern portion is provided. The part may have the second overlapping part and the second protruding part, and the second conductor pattern part may have the fourth overlapping part and the fourth protruding part.
また、回路基板構成体について、前記導体パターン部の幅は、前記金属板の幅より広いとよい。 Further, in the circuit board structure, the width of the conductor pattern portion may be wider than the width of the metal plate.
本発明によれば、金属板を基板に容易に位置決めすることができる。 According to the present invention, the metal plate can be easily positioned on the substrate.
以下、本発明を具体化した一実施形態を図面に従って説明する。
なお、図面において、水平面を、直交するＸ，Ｙ方向で規定するとともに、上下方向をＺ方向で規定している。
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the drawings, the horizontal plane is defined by the orthogonal X and Y directions, and the vertical direction is defined by the Z direction.
図１（ａ）、図１（ｂ）、図１（ｃ）に示すように、回路基板構成体１０は、金属ベース部材２０と、基板２１と、ターン数「１」のコイルを構成する金属板２２と、ＥＩ型コア２３とを備えている。金属ベース部材２０に基板２１が固定されている。基板２１の上面に、ターン数「１」のコイルを構成する金属板２２が搭載されている。金属板２２は、銅の平板である。基板２１には貫通孔２１ａ，２１ｂ，２１ｃが並んで形成されている。 As shown in FIG. 1A, FIG. 1B, and FIG. 1C, the circuit board structure 10 includes a metal base member 20, a substrate 21, and a metal that constitutes a coil having the number of turns “1”. The board 22 and the EI type core 23 are provided. The substrate 21 is fixed to the metal base member 20. On the upper surface of the substrate 21, a metal plate 22 that constitutes a coil having the number of turns “1” is mounted. The metal plate 22 is a copper flat plate. Through holes 21a, 21b, 21c are formed in the substrate 21 side by side.
ＥＩ型コア２３は、Ｅ型コア２４とＩ型コア２５よりなる。Ｉ型コア２５が金属ベース部材２０の上面に開口する凹部２０ａに挿入されている。Ｅ型コア２４とＩ型コア２５との間に基板２１が位置している。Ｅ型コア２４の３つの脚部２４ａ，２４ｂ，２４ｃが基板２１の貫通孔２１ａ，２１ｂ，２１ｃを貫通してＩ型コア２５と当接している。 The EI type core 23 includes an E type core 24 and an I type core 25. The I-shaped core 25 is inserted into the recess 20 a that opens on the upper surface of the metal base member 20. The substrate 21 is located between the E-shaped core 24 and the I-shaped core 25. The three legs 24 a, 24 b, 24 c of the E-shaped core 24 penetrate the through holes 21 a, 21 b, 21 c of the substrate 21 and are in contact with the I-shaped core 25.
図２、図３（ａ）、図３（ｂ）に示すように、基板２１は、絶縁基板２６と、絶縁基板２６の表面に形成された導体パターンと、絶縁基板２６の表面を覆うレジスト４０を有する。 As shown in FIG. 2, FIG. 3A, and FIG. 3B, the substrate 21 includes an insulating substrate 26, a conductor pattern formed on the surface of the insulating substrate 26, and a resist 40 covering the surface of the insulating substrate 26. Have.
金属板２２は、ターン数が「１」のコイル形状に形成されている。金属板２２の一端部は、基板２１上において回路形成用の第１導電部材５１に、はんだ付けされている。金属板２２の他端部は、基板２１上において回路形成用の第２導電部材５２に、はんだ付けされている。つまり、金属板２２は、基板２１の第１導電部としての第１導電部材５１と第２導電部としての第２導電部材５２にはんだ付けされている。 The metal plate 22 is formed in a coil shape having a number of turns of "1". One end of the metal plate 22 is soldered to the first conductive member 51 for forming a circuit on the substrate 21. The other end of the metal plate 22 is soldered to the second conductive member 52 for forming a circuit on the substrate 21. That is, the metal plate 22 is soldered to the first conductive member 51 as the first conductive portion and the second conductive member 52 as the second conductive portion of the substrate 21.
図５及び図６に示すように、導電部材５１，５２は、銅等の金属部材よりなる。導電部材５１，５２は、それぞれ、板部５３と、板部５３の上面中央部から上方に延びる柱部５４とを有する。柱部５４は基板２１に形成した貫通孔２１ｄ内に挿通される。柱部５４の上面に金属板２２がはんだ付けされている。 As shown in FIGS. 5 and 6, the conductive members 51 and 52 are made of a metal member such as copper. Each of the conductive members 51 and 52 has a plate portion 53 and a column portion 54 extending upward from the central portion of the upper surface of the plate portion 53. The column portion 54 is inserted into the through hole 21d formed in the substrate 21. The metal plate 22 is soldered to the upper surface of the pillar portion 54.
図２に示すように、金属板２２は、第１接続部６１と、第２接続部６２と、中間部６３と、を備える。第１接続部６１は、金属板２２の一端に形成され、回路形成用の第１導電部材５１に、はんだ付けされている。第２接続部６２は、金属板２２の他端に形成され、回路形成用の第２導電部材５２に、はんだ付けされている。中間部６３は、第１接続部６１から第２接続部６２まで延在する。 As shown in FIG. 2, the metal plate 22 includes a first connecting portion 61, a second connecting portion 62, and an intermediate portion 63. The first connecting portion 61 is formed on one end of the metal plate 22 and is soldered to the first conductive member 51 for forming a circuit. The second connecting portion 62 is formed on the other end of the metal plate 22 and is soldered to the second conductive member 52 for forming a circuit. The intermediate portion 63 extends from the first connecting portion 61 to the second connecting portion 62.
金属板２２の中間部６３は、基板２１上において放熱用導電部材５５に、はんだ付けされている。図１（ａ），（ｂ）に示すように、導電部材５５は、銅等の金属部材よりなる。導電部材５５は、板部５３と、板部５３の上面中央部から上方に延びる柱部５４とを有する。柱部５４は基板２１に形成した貫通孔内に挿通される。柱部５４の上面に金属板２２がはんだ付けされている。導電部材５５の板部５３は絶縁性放熱シート８０を介して金属ベース部材２０と熱的に接続されている。金属板２２で発生した熱Ｑは導電部材５５を介して金属ベース部材２０に逃がされる。つまり、金属板２２で発生した熱Ｑは導電部材５５を介して金属ベース部材２０で放熱される。 The intermediate portion 63 of the metal plate 22 is soldered to the heat dissipation conductive member 55 on the substrate 21. As shown in FIGS. 1A and 1B, the conductive member 55 is made of a metal member such as copper. The conductive member 55 includes a plate portion 53 and a column portion 54 that extends upward from the central portion of the upper surface of the plate portion 53. The pillar portion 54 is inserted into the through hole formed in the substrate 21. The metal plate 22 is soldered to the upper surface of the pillar portion 54. The plate portion 53 of the conductive member 55 is thermally connected to the metal base member 20 via the insulating heat dissipation sheet 80. The heat Q generated in the metal plate 22 is released to the metal base member 20 via the conductive member 55. That is, the heat Q generated by the metal plate 22 is radiated by the metal base member 20 via the conductive member 55.
図２、図３（ａ）、図３（ｂ）に示すように、導体パターンは、位置合わせ用の導体パターン部３１，３２，３３，３４，３５，３６，３７，３８を備える。各導体パターン部３１〜３８は、第１導電部材５１及び第２導電部材５２から離間した位置に形成されている。 As shown in FIG. 2, FIG. 3A, and FIG. 3B, the conductor pattern includes conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment. The conductor pattern portions 31 to 38 are formed at positions separated from the first conductive member 51 and the second conductive member 52.
導体パターン部３１及び導体パターン部３２は、金属板２２の中間部６３におけるＹ方向に延びる部位において離間して形成されている。導体パターン部３１及び導体パターン部３２は、金属板２２の中間部６３におけるＹ方向に延びる部位での幅よりも幅広となっている。導体パターン部３３は、金属板２２の中間部６３におけるＸ方向に延びる部位に形成されている。導体パターン部３３は、金属板２２の中間部６３におけるＸ方向に延びる部位での幅よりも幅広となっている。導体パターン部３４及び導体パターン部３５は、金属板２２の中間部６３におけるＹ方向に延びる部位において離間して形成されている。導体パターン部３４及び導体パターン部３５は、金属板２２の中間部６３におけるＹ方向に延びる部位での幅よりも幅広となっている。導体パターン部３６は、金属板２２の中間部６３におけるＸ方向に延びる部位に形成されている。導体パターン部３６は、金属板２２の中間部６３におけるＸ方向に延びる部位での幅よりも幅広となっている。 The conductor pattern portion 31 and the conductor pattern portion 32 are formed so as to be separated from each other in a portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The conductor pattern portion 31 and the conductor pattern portion 32 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The conductor pattern portion 33 is formed on a portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The conductor pattern portion 33 is wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The conductor pattern portion 34 and the conductor pattern portion 35 are formed so as to be separated from each other in a portion of the intermediate portion 63 of the metal plate 22 extending in the Y direction. The conductor pattern portion 34 and the conductor pattern portion 35 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The conductor pattern portion 36 is formed in a portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The conductor pattern portion 36 is wider than the width of the portion extending in the X direction in the intermediate portion 63 of the metal plate 22.
導体パターン部３１と導体パターン部３５とは同じＸ軸上に位置している。導体パターン部３２と導体パターン部３４とは同じＸ軸上に位置している。
金属板２２におけるＸ方向に延びる部位における一端部に導電部材５１が位置しており、この金属板２２におけるＸ方向に延びる部位での角部に導体パターン部３７が形成されている。導体パターン部３７はＸ方向において金属板２２よりも外側に拡がっている。
The conductor pattern portion 31 and the conductor pattern portion 35 are located on the same X axis. The conductor pattern portion 32 and the conductor pattern portion 34 are located on the same X axis.
The conductive member 51 is located at one end of the portion of the metal plate 22 extending in the X direction, and the conductor pattern portion 37 is formed at a corner of the portion of the metal plate 22 extending in the X direction. The conductor pattern portion 37 extends outside the metal plate 22 in the X direction.
金属板２２におけるＸ方向に延びる部位における他端部に導電部材５２が位置しており、この金属板２２におけるＸ方向に延びる部位での角部に導体パターン部３８が形成されている。導体パターン部３８はＸ方向において金属板２２よりも外側に拡がっている。 The conductive member 52 is located at the other end of the portion of the metal plate 22 extending in the X direction, and the conductor pattern portion 38 is formed at the corner of the portion of the metal plate 22 extending in the X direction. The conductor pattern portion 38 extends outside the metal plate 22 in the X direction.
図５及び図６に示すように、基板２１の下面において導体パターン部３９ａ，３９ｂが形成されている。導電部材５１の板部５３は導体パターン部３９ａと、はんだ７５ａにより接合されている（はんだ付けされている）。導電部材５２の板部５３は導体パターン部３９ｂと、はんだ７５ｂにより接合されている（はんだ付けされている）。よって、基板２１の下面において導体パターン部３９ａが導電部材５１を介して基板２１の上面において金属板（コイル）２２の一端と接続されているとともに、基板２１の上面において金属板（コイル）２２の他端が導電部材５２を介して基板２１の下面において導体パターン部３９ｂと接続されている。このようにして金属板（コイル）２２を通した回路が形成されている。導体パターン部３９ａ，３９ｂは、それぞれ、基板２１の下面に配した銅板による配線パターン（図示略）と、はんだ付けにより接続されている。 As shown in FIGS. 5 and 6, conductor pattern portions 39 a and 39 b are formed on the lower surface of the substrate 21. The plate portion 53 of the conductive member 51 is joined (soldered) to the conductor pattern portion 39a by the solder 75a. The plate portion 53 of the conductive member 52 is joined (soldered) to the conductor pattern portion 39b by the solder 75b. Therefore, the conductor pattern portion 39 a is connected to one end of the metal plate (coil) 22 on the upper surface of the substrate 21 via the conductive member 51 on the lower surface of the substrate 21, and the metal plate (coil) 22 is formed on the upper surface of the substrate 21. The other end is connected to the conductor pattern portion 39b on the lower surface of the substrate 21 via the conductive member 52. In this way, a circuit through the metal plate (coil) 22 is formed. Each of the conductor pattern portions 39a and 39b is connected to a wiring pattern (not shown) made of a copper plate arranged on the lower surface of the substrate 21 by soldering.
図２及び図４に示すように、位置合わせ用の導体パターン部３１，３２，３３，３４，３５，３６，３７，３８は、回路形成用の導電部材５１，５２とは電気的に接続されず、レジスト４０の開口部４１，４２，４３，４４，４５，４６，４７，４８により基板２１上に露出している。開口部４１，４２は、金属板２２の中間部６３におけるＹ方向に延びる部位での幅よりも幅広となっている。開口部４３は、金属板２２の中間部６３におけるＸ方向に延びる部位での幅よりも幅広となっている。開口部４４，４５は、金属板２２の中間部６３におけるＹ方向に延びる部位での幅よりも幅広となっている。開口部４６は、金属板２２の中間部６３におけるＸ方向に延びる部位での幅よりも幅広となっている。開口部４７は、金属板２２の中間部６３の角部においてＸ方向において金属板２２よりも外側に拡がっている。開口部４８は、金属板２２の中間部６３の角部においてＸ方向において金属板２２よりも外側に拡がっている。 As shown in FIGS. 2 and 4, the conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment are electrically connected to the conductive members 51, 52 for circuit formation. Instead, it is exposed on the substrate 21 through the openings 41, 42, 43, 44, 45, 46, 47, 48 of the resist 40. The openings 41, 42 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 extending in the Y direction. The opening 43 is wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The openings 44 and 45 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The opening 46 is wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The opening 47 extends outside the metal plate 22 in the X direction at the corner of the intermediate portion 63 of the metal plate 22. The opening 48 extends outside the metal plate 22 in the X direction at the corner of the intermediate portion 63 of the metal plate 22.
金属板２２の中間部６３の一部は、図４に示すように、位置合わせ用の導体パターン部３１，３２，３３，３４，３５，３６，３７，３８に、はんだ７０により接合されている。 As shown in FIG. 4, a part of the intermediate portion 63 of the metal plate 22 is joined to the conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment with solder 70. .
図５及び図６に示すように、第１接続部６１は金属板２２の一端に形成され、第１導電部としての第１導電部材５１は第１接続部６１と重なる第１重畳部位５１ａと、金属板２２の一端から突出する第１突出部位５１ｂとを有する。導体パターン部３７は、中間部６３と重なる第２重畳部位３７ａと、第１突出部位５１ｂの突出方向に対して反対方向に中間部６３から突出する第２突出部位３７ｂとを有する。 As shown in FIGS. 5 and 6, the first connection portion 61 is formed at one end of the metal plate 22, and the first conductive member 51 as the first conductive portion has a first overlapping portion 51 a that overlaps the first connection portion 61. , A first protruding portion 51b protruding from one end of the metal plate 22. The conductor pattern portion 37 has a second overlapping portion 37a that overlaps with the intermediate portion 63, and a second protruding portion 37b that protrudes from the intermediate portion 63 in a direction opposite to the protruding direction of the first protruding portion 51b.
図５及び図６に示すように、第２接続部６２は金属板２２の他端に形成され、第２導電部としての第２導電部材５２は第２接続部６２と重なる第３重畳部位５２ａと、金属板２２の他端から突出する第３突出部位５２ｂとを有する。図２に示すように、導体パターン部３８は、中間部６３と重なる第４重畳部位３８ａと、第３突出部位５２ｂの突出方向に対して反対方向に中間部６３から突出する第４突出部位３８ｂとを有する。 As shown in FIGS. 5 and 6, the second connection portion 62 is formed at the other end of the metal plate 22, and the second conductive member 52 as the second conductive portion overlaps with the second connection portion 62 at the third overlapping portion 52 a. And a third protruding portion 52b protruding from the other end of the metal plate 22. As shown in FIG. 2, the conductor pattern portion 38 includes a fourth overlapping portion 38a overlapping the intermediate portion 63, and a fourth protruding portion 38b protruding from the intermediate portion 63 in a direction opposite to the protruding direction of the third protruding portion 52b. Have and.
図２に示すように、導体パターン部は第１導体パターン部３７と、該第１導体パターン部３７に対して離間した位置に設けられる第２導体パターン部３８とを有する。第１導体パターン部３７は、第２重畳部位３７ａ及び第２突出部位３７ｂを有する。第２導体パターン部３８は、第４重畳部位３８ａ及び第４突出部位３８ｂを有する。 As shown in FIG. 2, the conductor pattern portion has a first conductor pattern portion 37 and a second conductor pattern portion 38 provided at a position separated from the first conductor pattern portion 37. The first conductor pattern portion 37 has a second overlapping portion 37a and a second protruding portion 37b. The second conductor pattern portion 38 has a fourth overlapping portion 38a and a fourth protruding portion 38b.
図４に示すように、位置合わせ用の導体パターン部３１〜３８の幅Ｗ１は、ターン数「１」のコイル形状に形成された金属板２２の幅Ｗ２より広くなっている。
図７（ｃ）において、レジスト開口部４１〜４８の内端と金属板２２の外端との間には、例えば０．２ｍｍ程度の隙間があり、この隙間において、はんだ７０のフィレットが形成されている。
As shown in FIG. 4, the width W1 of the conductor pattern portions 31 to 38 for alignment is wider than the width W2 of the metal plate 22 formed in the coil shape having the number of turns “1”.
In FIG. 7C, there is a gap of, for example, about 0.2 mm between the inner ends of the resist openings 41 to 48 and the outer end of the metal plate 22, and a fillet of the solder 70 is formed in this gap. ing.
次に、作用について説明する。
製造工程において、図７（ａ）に示すように、レジスト４０の開口部４１，４２，４３，４４，４５，４６，４７，４８に、はんだペースト７０ａを塗布する。
Next, the operation will be described.
In the manufacturing process, as shown in FIG. 7A, the solder paste 70a is applied to the openings 41, 42, 43, 44, 45, 46, 47, 48 of the resist 40.
図７（ｂ）に示すように、レジスト４０の開口部４１，４２，４３，４４，４５，４６，４７，４８に配した、はんだペースト７０ａの上に、金属板２２を載置する。
その後、リフロー炉に入れて加熱により、図７（ｃ）に示すように、金属板２２を、はんだ付けする。図７（ｃ）においてレジスト開口部４１〜４８の内端と金属板２２の外端との間には、例えば０．２ｍｍ程度の隙間があり、この隙間において、はんだ７０のフィレットが形成される。
As shown in FIG. 7B, the metal plate 22 is placed on the solder paste 70 a arranged in the openings 41, 42, 43, 44, 45, 46, 47, 48 of the resist 40.
Then, the metal plate 22 is soldered by heating in a reflow furnace as shown in FIG. 7 (c). In FIG. 7C, there is a gap of, for example, about 0.2 mm between the inner ends of the resist openings 41 to 48 and the outer end of the metal plate 22, and a fillet of the solder 70 is formed in this gap. .
ここで、図８（ａ）に示すように、はんだペースト７０ａの上に金属板２２を載置する際に、位置がずれたとする。つまり、図７（ｂ）ではレジスト開口部４１〜４８の中心と金属板２２の中心とが一致していたが、図８（ａ）ではレジスト開口部４１〜４８の中心と金属板２２の中心とがずれている。具体的には、図８（ａ）ではレジスト開口部４１〜４８の中心に対し金属板２２の中心が左側にずれて配置されている。 Here, as shown in FIG. 8A, it is assumed that the position is displaced when the metal plate 22 is placed on the solder paste 70a. That is, in FIG. 7B, the centers of the resist openings 41 to 48 and the center of the metal plate 22 coincide with each other, but in FIG. 8A, the centers of the resist openings 41 to 48 and the center of the metal plate 22. It is out of alignment. Specifically, in FIG. 8A, the center of the metal plate 22 is displaced leftward with respect to the centers of the resist openings 41 to 48.
しかしながら、その後のリフロー炉での加熱により、図８（ｂ）に示すように、溶融したはんだの表面張力（セルフアライン）により、レジスト開口部４１〜４８の外側に金属板２２が飛び出さず、位置が決まり、金属板２２が最適位置に移動して、はんだ付けされる。 However, due to the subsequent heating in the reflow furnace, the metal plate 22 does not jump out of the resist openings 41 to 48 due to the surface tension (self-alignment) of the molten solder, as shown in FIG. 8B. The position is determined, the metal plate 22 moves to the optimum position, and is soldered.
従来では、金属板２２の実装において位置決めが困難なため、実装がずれるので、ずれないようにスルーホールや貫通穴への挿入機構で位置決めできるが、金属板２２のコスト高となったり、基板スペース拡大などを招く。 In the related art, since it is difficult to position the metal plate 22 when mounting it, the mounting is misaligned, so that the metal plate 22 can be positioned by an insertion mechanism into a through hole or a through hole so that the metal plate 22 does not shift. Invites expansion.
本実施形態では、基板２１に備えられた位置合わせ用の導体パターン部３１，３２，３３，３４，３５，３６，３７，３８がレジスト４０の開口部４１，４２，４３，４４，４５，４６，４７，４８により露出している。よって、はんだ付けの際に、ターン数「１」のコイル形状に形成された金属板２２における中間部６３の一部が位置合わせ用の導体パターン部３１，３２，３３，３４，３５，３６，３７，３８を用いたセルフアライン効果により、ターン数「１」のコイル形状に形成された金属板２２を基板２１に容易に位置決めすることができる。 In the present embodiment, the conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment provided on the substrate 21 have openings 41, 42, 43, 44, 45, 46 of the resist 40. , 47, 48 are exposed. Therefore, at the time of soldering, a part of the intermediate portion 63 of the metal plate 22 formed in the coil shape having the number of turns “1” is positioned in the conductive pattern portions 31, 32, 33, 34, 35, 36 for positioning, By the self-alignment effect using 37 and 38, the metal plate 22 formed in the coil shape having the number of turns “1” can be easily positioned on the substrate 21.
つまり、図２に示すように、はんだ付けの際に、表面張力により、金属板２２に対して互いに離間する方向に力Ｆ１ａ，Ｆ１ｂ、力Ｆ２ａ，Ｆ２ｂ、力Ｆ３ａ，Ｆ３ｂ、力Ｆ４ａ，Ｆ４ｂ、力Ｆ５ａ，Ｆ５ｂ、力Ｆ６ａ，Ｆ６ｂ、力Ｆ７ａ，Ｆ７ｂ、力Ｆ８ａ，Ｆ８ｂが作用する。力Ｆ１ａと力Ｆ１ｂとはＸ方向において互いに離間する方向に作用する逆向きの力である。力Ｆ２ａと力Ｆ２ｂとはＸ方向において互いに離間する方向に作用する逆向きの力である。力Ｆ３ａと力Ｆ３ｂとはＹ方向において互いに離間する方向に作用する逆向きの力である。力Ｆ４ａと力Ｆ４ｂとはＸ方向において互いに離間する方向に作用する逆向きの力である。力Ｆ５ａと力Ｆ５ｂとはＸ方向において互いに離間する方向に作用する逆向きの力である。力Ｆ６ａと力Ｆ６ｂとはＹ方向において互いに離間する方向に作用する逆向きの力である。よって、Ｘ方向において金属板２２の両側から力が働くとともにＹ方向において金属板２２の両側から力が働くことにより、金属板２２の中間部６３においてＸ方向及びＹ方向において位置決めされる。 That is, as shown in FIG. 2, at the time of soldering, due to surface tension, forces F1a and F1b, forces F2a and F2b, forces F3a and F3b, forces F4a and F4b, are separated from each other with respect to the metal plate 22. Forces F5a and F5b, forces F6a and F6b, forces F7a and F7b, and forces F8a and F8b act. The force F1a and the force F1b are opposite forces acting in the directions away from each other in the X direction. The force F2a and the force F2b are opposite forces acting in the directions away from each other in the X direction. The force F3a and the force F3b are opposite forces acting in a direction away from each other in the Y direction. The force F4a and the force F4b are opposite forces acting in the directions away from each other in the X direction. The force F5a and the force F5b are opposite forces acting in the directions away from each other in the X direction. The force F6a and the force F6b are opposite forces acting in the directions away from each other in the Y direction. Therefore, the force acts from both sides of the metal plate 22 in the X direction and the force acts from both sides of the metal plate 22 in the Y direction, so that the intermediate portion 63 of the metal plate 22 is positioned in the X direction and the Y direction.
また、力Ｆ７ａは導電部材５１と金属板２２とを導体パターン部３１〜３８のはんだ付けと同時にはんだ付けする際にＸ方向に作用する力である。力Ｆ７ａと力Ｆ７ｂとはＸ方向において互いに離間する方向に作用する逆向きの力である。よって、金属板２２の一端部の導電部材５１に対応する角部に、位置合わせ用の導体パターン部３７を備え、位置合わせ用の導体パターン部３７に、はんだ付けされることにより、Ｘ方向において位置決めされる。 The force F7a is a force that acts in the X direction when the conductive member 51 and the metal plate 22 are soldered simultaneously with the soldering of the conductor pattern portions 31 to 38. The force F7a and the force F7b are opposite forces acting in the directions away from each other in the X direction. Therefore, the conductor pattern portion 37 for alignment is provided in the corner portion corresponding to the conductive member 51 at one end of the metal plate 22, and the conductor pattern portion 37 for alignment is soldered to the conductor pattern portion 37 for alignment, so that in the X direction. Positioned.
同様に、力Ｆ８ａは導電部材５２と金属板２２とを導体パターン部３１〜３８のはんだ付けと同時にはんだ付けする際にＸ方向に作用する力である。力Ｆ８ａと力Ｆ８ｂとはＸ方向において互いに離間する方向に作用する逆向きの力である。よって、金属板２２の他端部の導電部材５２に対応する角部に、位置合わせ用の導体パターン部３８を備え、位置合わせ用の導体パターン部３８に、はんだ付けされることにより、Ｘ方向において位置決めされる。 Similarly, the force F8a is a force that acts in the X direction when the conductive member 52 and the metal plate 22 are soldered simultaneously with the soldering of the conductor pattern portions 31 to 38. The force F8a and the force F8b are opposite forces acting in the directions away from each other in the X direction. Therefore, the corner of the other end of the metal plate 22 corresponding to the conductive member 52 is provided with the conductor pattern portion 38 for alignment, and the conductor pattern portion 38 for alignment is soldered to the X direction. Is positioned at.
詳しくは、図５及び図６に示すように、第１導電部材５１は第１重畳部位５１ａと第１突出部位５１ｂとを有し、導体パターン部３７は第２重畳部位３７ａと第２突出部位３７ｂとを有する。これにより、図３（ｂ）及び図６に示すように、金属板２２の一端にフィレット９０が形成されるときに、第２突出部位３７ｂに形成されるフィレット９１によりバランスすることで位置決め精度の向上が図られる。 Specifically, as shown in FIGS. 5 and 6, the first conductive member 51 has a first overlapping portion 51a and a first protruding portion 51b, and the conductor pattern portion 37 has a second overlapping portion 37a and a second protruding portion. 37b. As a result, as shown in FIGS. 3B and 6, when the fillet 90 is formed on one end of the metal plate 22, the fillet 91 formed on the second projecting portion 37b balances the fillet 90 to improve the positioning accuracy. Improvement is achieved.
これに加え、金属板２２の一端に形成されるフィレットに対してバランスをとるためにその反対側にフィレットが形成されるように開口部４８（導体パターン３８）が設けられる。即ち、図５及び図６に示すように、第２導電部材５２は第３重畳部位５２ａと第３突出部位５２ｂとを有し、図３（ｂ）に示すように、導体パターン部３８は、第４重畳部位３８ａと第４突出部位３８ｂとを有する。よって、図３（ｂ）に示すように、金属板２２の他端にフィレット９２が形成されるときに、第４突出部位３８ｂに形成されるフィレット９３によりバランスすることで、位置決め精度の向上が図られる。その結果、金属板２２の両端に対して同様の処置をすることで、より位置決め精度の向上が図られる。 In addition to this, an opening portion 48 (conductor pattern 38) is provided so that a fillet is formed on the opposite side of the fillet formed on one end of the metal plate 22 in order to balance the fillet. That is, as shown in FIGS. 5 and 6, the second conductive member 52 has a third overlapping portion 52a and a third protruding portion 52b, and as shown in FIG. 3B, the conductor pattern portion 38 is It has a fourth overlapping portion 38a and a fourth protruding portion 38b. Therefore, as shown in FIG. 3B, when the fillet 92 is formed on the other end of the metal plate 22, the positioning accuracy is improved by balancing by the fillet 93 formed on the fourth protruding portion 38b. Planned. As a result, the positioning accuracy can be further improved by performing the same treatment on both ends of the metal plate 22.
このように、ターン数「１」のコイルを構成する金属板２２を基板２１に表面実装する際に、はんだ付け位置精度の向上が図られる。電気的導通部（５１，５２）とは別に位置決め用導体パターン（３１〜３８）を用いた構成とすることでセルフアライメント効果により実装位置精度が向上する。また、基板２１の片面（上面）で実装完結するためスペース効率が良い。さらに、金属板２２について、平板でよく、折り曲げ加工などを行うことなく銅板の簡素化が図られる。 As described above, when the metal plate 22 forming the coil having the number of turns “1” is surface-mounted on the substrate 21, the accuracy of the soldering position can be improved. By using the positioning conductor patterns (31 to 38) separately from the electrically conductive portions (51, 52), the mounting position accuracy is improved by the self-alignment effect. Further, since the mounting is completed on one surface (upper surface) of the substrate 21, space efficiency is good. Further, the metal plate 22 may be a flat plate, and the copper plate can be simplified without bending or the like.
上記実施形態によれば、以下のような効果を得ることができる。
（１）回路基板構成体１０の構成として、導体パターン（３１，３２，３３，３４，３５，３６，３７，３８）とレジスト４０とを有する基板２１と、基板２１の第１導電部としての第１導電部材５１と第２導電部としての第２導電部材５２にはんだ付けされた金属板２２と、を備える。金属板２２は、第１導電部としての第１導電部材５１にはんだ付けされる第１接続部６１と、第２導電部としての第２導電部材５２にはんだ付けされる第２接続部６２と、第１接続部６１から第２接続部６２まで延在する中間部６３と、を備える。導体パターンは、第１導電部としての第１導電部材５１及び第２導電部としての第２導電部材５２から離間した位置にてレジスト４０の開口部４１〜４８により基板２１上に露出し、中間部６３の一部がはんだ付けされる導体パターン部３１〜３８を有する。
According to the above embodiment, the following effects can be obtained.
(1) As a configuration of the circuit board structure 10, a substrate 21 having conductor patterns (31, 32, 33, 34, 35, 36, 37, 38) and a resist 40, and a first conductive portion of the substrate 21 are provided. The first conductive member 51 and the metal plate 22 soldered to the second conductive member 52 as the second conductive portion are provided. The metal plate 22 has a first connecting portion 61 soldered to a first conductive member 51 as a first conductive portion, and a second connecting portion 62 soldered to a second conductive member 52 as a second conductive portion. , An intermediate portion 63 extending from the first connecting portion 61 to the second connecting portion 62. The conductor pattern is exposed on the substrate 21 through the openings 41 to 48 of the resist 40 at a position separated from the first conductive member 51 serving as the first conductive portion and the second conductive member 52 serving as the second conductive portion. Part of the portion 63 has conductor pattern portions 31 to 38 to be soldered.
よって、導体パターン部３１〜３８がレジスト４０の開口部４１〜４８により露出する。そして、はんだ付けの際に、ターン数「１」のコイル形状に形成された金属板２２における中間部６３の一部が導体パターン部３１〜３８を用いたセルフアライン効果により、ターン数「１」のコイル形状に形成された金属板２２を基板２１に容易に位置決めすることができる。 Therefore, the conductor pattern portions 31 to 38 are exposed through the openings 41 to 48 of the resist 40. When soldering, the number of turns is "1" due to the self-alignment effect of a part of the intermediate portion 63 of the metal plate 22 formed in the coil shape having the number of turns of "1" by using the conductor pattern portions 31 to 38. The metal plate 22 formed in the coil shape can be easily positioned on the substrate 21.
（２）図５及び図６に示すように、第１接続部６１は金属板２２の一端に形成され、第１導電部としての第１導電部材５１は第１接続部６１と重なる第１重畳部位５１ａと、金属板２２の一端から突出する第１突出部位５１ｂとを有する。導体パターン部３７は、中間部６３と重なる第２重畳部位３７ａと、第１突出部位５１ｂの突出方向に対して反対方向に中間部６３から突出する第２突出部位３７ｂとを有する。よって、図３（ｂ）及び図６に示すように、金属板２２の一端にフィレット９０が形成される場合に、第２突出部位３７ｂに形成されるフィレット９１によりバランスして、位置決め精度が向上する。 (2) As shown in FIGS. 5 and 6, the first connecting portion 61 is formed at one end of the metal plate 22, and the first conductive member 51 as the first conductive portion overlaps with the first connecting portion 61 in the first superposition. It has a part 51 a and a first protruding part 51 b protruding from one end of the metal plate 22. The conductor pattern portion 37 has a second overlapping portion 37a that overlaps with the intermediate portion 63, and a second protruding portion 37b that protrudes from the intermediate portion 63 in a direction opposite to the protruding direction of the first protruding portion 51b. Therefore, as shown in FIGS. 3B and 6, when the fillet 90 is formed on one end of the metal plate 22, the fillet 91 formed on the second projecting portion 37b is balanced to improve the positioning accuracy. To do.
（３）図５及び図６に示すように、第２接続部６２は金属板２２の他端に形成され、第２導電部としての第２導電部材５２は第２接続部６２と重なる第３重畳部位５２ａと、金属板２２の他端から突出する第３突出部位５２ｂとを有する。図３（ｂ）に示すように、導体パターン部３８は、中間部６３と重なる第４重畳部位３８ａと、第３突出部位５２ｂの突出方向に対して反対方向に中間部６３から突出する第４突出部位３８ｂとを有する。よって、図３（ｂ）に示すように、金属板２２の他端にフィレット９２が形成される場合に、第４突出部位３８ｂに形成されるフィレット９３によりバランスして、位置決め精度が向上する。このようにして、金属板２２の両端に対して同様の処置をすることで、より位置決め精度が向上する。 (3) As shown in FIGS. 5 and 6, the second connecting portion 62 is formed at the other end of the metal plate 22, and the second conductive member 52 as the second conductive portion overlaps with the second connecting portion 62. The overlapping portion 52a and the third protruding portion 52b protruding from the other end of the metal plate 22 are included. As shown in FIG. 3B, the conductor pattern portion 38 has a fourth overlapping portion 38a that overlaps the intermediate portion 63 and a fourth protruding portion 52a that protrudes from the intermediate portion 63 in a direction opposite to the protruding direction of the third protruding portion 52b. And a protruding portion 38b. Therefore, as shown in FIG. 3B, when the fillet 92 is formed on the other end of the metal plate 22, the fillet 93 formed on the fourth protruding portion 38b balances and the positioning accuracy is improved. In this way, the positioning accuracy is further improved by performing the same treatment on both ends of the metal plate 22.
（４）図２に示すように、導体パターン部は第１導体パターン部３７と、該第１導体パターン部３７に対して離間した位置に設けられる第２導体パターン部３８とを有し、第１導体パターン部３７は、第２重畳部位３７ａ及び第２突出部位３７ｂを有し、第２導体パターン部３８は、第４重畳部位３８ａ及び第４突出部位３８ｂを有する。よって、導体パターン部を別々に設けて対処した方が、バランスをとりやすく、位置決め精度が向上する。 (4) As shown in FIG. 2, the conductor pattern portion has a first conductor pattern portion 37 and a second conductor pattern portion 38 provided at a position separated from the first conductor pattern portion 37. The first conductor pattern portion 37 has a second overlapping portion 37a and a second protruding portion 37b, and the second conductor pattern portion 38 has a fourth overlapping portion 38a and a fourth protruding portion 38b. Therefore, it is easier to balance and the positioning accuracy is improved by separately providing the conductor pattern portions.
（５）導体パターン部３１〜３８の幅Ｗ１は、金属板２２の幅Ｗ２より広い。よって、セルフアライン効果をより発揮させることができる。
実施形態は前記に限定されるものではなく、例えば、次のように具体化してもよい。
(5) The width W1 of the conductor pattern portions 31 to 38 is wider than the width W2 of the metal plate 22. Therefore, the self-alignment effect can be further exerted.
The embodiment is not limited to the above, and may be embodied as follows, for example.
○ 回路形成用の導電部は、基板２１を貫通する金属部材（５１，５２）であったが、これに限定されない。例えば、回路形成用の導電部は、基板２１に形成した導体パターンであってもよい。 The conductive portion for forming the circuit was the metal member (51, 52) penetrating the substrate 21, but the present invention is not limited to this. For example, the conductive portion for forming a circuit may be a conductor pattern formed on the substrate 21.
○ 金属板２２はコイルであったが、これに限定されない。例えば、トランスの一次側巻線や二次側巻線等であってもよい。他にも金属板は配線であってもよい。 The metal plate 22 is a coil, but is not limited to this. For example, it may be a primary winding or a secondary winding of a transformer. Alternatively, the metal plate may be wiring.
１０…回路基板構成体、２１…基板、２２…金属板、３２，３３，３４，３５，３６，３７，３８…導体パターン部、３７ａ…第２重畳部位、３７ｂ…第２突出部位、３８ａ…第４重畳部位、３８ｂ…第４突出部位、４０…レジスト、４１，４２，４３，４４，４５，４６，４７，４８…開口部、５１…第１導電部材、５１ａ…第１重畳部位、５１ｂ…第１突出部位、５２…第２導電部材、５２ａ…第３重畳部位、５２ｂ…第３突出部位、６１…第１接続部、６２…第２接続部、６３…中間部、Ｗ１…幅、Ｗ２…幅。 DESCRIPTION OF SYMBOLS 10 ... Circuit board structure, 21 ... Board, 22 ... Metal plate, 32, 33, 34, 35, 36, 37, 38 ... Conductor pattern part, 37a ... 2nd overlapping part, 37b ... 2nd protruding part, 38a ... Fourth overlapping portion, 38b ... Fourth protruding portion, 40 ... Resist, 41, 42, 43, 44, 45, 46, 47, 48 ... Opening portion, 51 ... First conductive member, 51a ... First overlapping portion, 51b ... first protruding portion, 52 ... second conductive member, 52a ... third overlapping portion, 52b ... third protruding portion, 61 ... first connecting portion, 62 ... second connecting portion, 63 ... intermediate portion, W1 ... width, W2 ... width.
Claims (5)
前記基板の第１導電部と第２導電部にはんだ付けされた金属板と、
を備えた回路基板構成体において、
前記金属板は、
前記第１導電部にはんだ付けされる第１接続部と、
前記第２導電部にはんだ付けされる第２接続部と、
前記第１接続部から前記第２接続部まで延在する中間部と、
を備え、
前記導体パターンは、前記第１導電部及び前記第２導電部から離間した位置にて前記レジストの開口部により前記基板上に露出し、前記中間部の一部がはんだ付けされる導体パターン部を有することを特徴とする回路基板構成体。 A substrate having a conductor pattern and a resist,
A metal plate soldered to the first conductive portion and the second conductive portion of the substrate;
In a circuit board structure provided with,
The metal plate is
A first connection portion soldered to the first conductive portion;
A second connection portion soldered to the second conductive portion;
An intermediate portion extending from the first connecting portion to the second connecting portion;
Equipped with
The conductor pattern is a conductor pattern portion exposed on the substrate through the opening of the resist at a position separated from the first conductive portion and the second conductive portion, and a part of the intermediate portion is soldered. A circuit board structure characterized by having.
前記第１導電部は前記第１接続部と重なる第１重畳部位と、前記金属板の一端から突出する第１突出部位とを有し、
前記導体パターン部は、前記中間部と重なる第２重畳部位と、前記第１突出部位の突出方向に対して反対方向に前記中間部から突出する第２突出部位とを有することを特徴とする請求項１に記載の回路基板構成体。 The first connecting portion is formed at one end of the metal plate,
The first conductive portion has a first overlapping portion overlapping the first connecting portion, and a first protruding portion protruding from one end of the metal plate,
The conductor pattern portion has a second overlapping portion that overlaps with the intermediate portion, and a second protruding portion that protrudes from the intermediate portion in a direction opposite to a protruding direction of the first protruding portion. Item 2. A circuit board structure according to item 1.
前記第２導電部は前記第２接続部と重なる第３重畳部位と、前記金属板の他端から突出する第３突出部位とを有し、
前記導体パターン部は、前記中間部と重なる第４重畳部位と、前記第３突出部位の突出方向に対して反対方向に前記中間部から突出する第４突出部位とを有することを特徴とする請求項２に記載の回路基板構成体。 The second connecting portion is formed on the other end of the metal plate,
The second conductive portion has a third overlapping portion overlapping the second connecting portion, and a third protruding portion protruding from the other end of the metal plate,
The conductor pattern portion has a fourth overlapping portion that overlaps the intermediate portion, and a fourth protruding portion that protrudes from the intermediate portion in a direction opposite to a protruding direction of the third protruding portion. Item 3. The circuit board structure according to item 2.
前記第１導体パターン部は、前記第２重畳部位及び前記第２突出部位を有し、
前記第２導体パターン部は、前記第４重畳部位及び前記第４突出部位を有することを特徴とする請求項３に記載の回路基板構成体。 The conductor pattern portion has a first conductor pattern portion and a second conductor pattern portion provided at a position separated from the first conductor pattern portion,
The first conductor pattern portion has the second overlapping portion and the second protruding portion,
The circuit board structure according to claim 3, wherein the second conductor pattern portion has the fourth overlapping portion and the fourth protruding portion.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2000357860A (en) * | 1999-06-16 | 2000-12-26 | Onkyo Corp | Mounting method of surface-mounting component to printed wiring board, and printed wiring board |
| JP2016127035A (en) * | 2014-12-26 | 2016-07-11 | オムロンオートモーティブエレクトロニクス株式会社 | Circuit board module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000357860A (en) * | 1999-06-16 | 2000-12-26 | Onkyo Corp | Mounting method of surface-mounting component to printed wiring board, and printed wiring board |
| JP2016127035A (en) * | 2014-12-26 | 2016-07-11 | オムロンオートモーティブエレクトロニクス株式会社 | Circuit board module |
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