JP2020059052A - Joint structure - Google Patents

Joint structure Download PDF

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JP2020059052A
JP2020059052A JP2018192645A JP2018192645A JP2020059052A JP 2020059052 A JP2020059052 A JP 2020059052A JP 2018192645 A JP2018192645 A JP 2018192645A JP 2018192645 A JP2018192645 A JP 2018192645A JP 2020059052 A JP2020059052 A JP 2020059052A
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electrode foil
horn
unevenness
protrusions
metal
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JP6975917B2 (en
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貴之 廣瀬
Takayuki Hirose
貴之 廣瀬
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Panasonic Intellectual Property Management Co Ltd
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Abstract

To provide a joint structure in which metals are joined with each other and which has high joint strength suppressing pealing of joined parts.SOLUTION: A joint structure is such a laminated structure that a metal plate and metal foils are laminated, has a plurality of first irregularities on an interface between the metal plate and the metal foils, and has a plurality of second irregularities corresponding to the plurality of first irregularities also on a side opposite to the interface between the metal foils and the metal plate.SELECTED DRAWING: Figure 4

Description

本発明は金属同士の接合構造体に関する。   The present invention relates to a metal-to-metal bonded structure.

金属同士を接合する方法のひとつとして、超音波接合が知られている。超音波接合では、積層されたワーク（例えば、金属板および金属箔の積層体）をアンビル（固定端）上に配置し、ホーン（加振源）で押圧しながら超音波振動させる。これにより、ワーク（ここでは、金属板および金属箔）を接合し、接合構造体を形成する工法である。   Ultrasonic bonding is known as one of the methods for bonding metals. In ultrasonic bonding, a stacked work (for example, a laminated body of a metal plate and a metal foil) is placed on an anvil (fixed end) and ultrasonically vibrated while being pressed by a horn (excitation source). With this, the work (here, the metal plate and the metal foil) is joined to form a joined structure.

ホーンは一般的に、ワークとの当接面に、所望の位置に配置された複数の突起を有する。このようなホーンを用いてワークを接合させると、ワークのうち、ホーンの突起に接触する部分の厚さが減少したり、ホーンの突起どうしの間に位置する面（本開示では、「突起間底面」とも称する）に接触する部分に応力が集中したりする。したがって、ワークのこのような部分に破れや亀裂が生じやすかった。そして、この部分的な破れや亀裂は、接合構造体の実際の使用中、あるいは組み立て作業中などに、接合部分の剥がれを引き起こし、製品の信頼性に影響を及ぼす可能性がある。   The horn generally has a plurality of protrusions arranged at desired positions on the contact surface with the work. When a work is joined using such a horn, the thickness of the part of the work that comes into contact with the protrusions of the horn is reduced, or the surface located between the protrusions of the horn (in the present disclosure, “interval between protrusions”). The stress concentrates on the part that contacts the bottom surface). Therefore, tears and cracks are likely to occur in such parts of the work. Then, the partial breakage or crack may cause peeling of the joint portion during actual use of the joint structure or during assembly work, which may affect the reliability of the product.

この問題点を解消する方法として、特許文献１では、ワークとの当接面の周縁部に、突起を有さないマージン領域を備えるホーンの使用を提案している。一方、特許文献２では、ホーンの突起間底面を、角部を持たない面からなるようにすることを提案している。   As a method for solving this problem, Patent Document 1 proposes the use of a horn provided with a margin region having no protrusion at the peripheral edge of the contact surface with the work. On the other hand, Patent Document 2 proposes that the bottom surface between the protrusions of the horn is formed of a surface having no corners.

特開２０１２−１２５８０１号公報JP2012-125801A 特開２０１５−１９９０９５号公報JP, 2005-199095, A

しかしながら、特許文献１の方法では、マージン領域がワークに接触することがあり、接合強度に寄与しない過剰な加振を与えることになる。そのため、ワークに破れや亀裂が発生し、この破れや亀裂に起因して、接合構造体の接合部分に剥がれが生じる。また特許文献２のように、ホーンの突起間底面を、角部を持たない面からなるようにしたとしても、ワークが突起間底面に接触すると、ワークの変形が抑制された状態で加振されることになる。そのため、ワークに破れや亀裂が発生し、この破れや亀裂に起因して、接合構造体の接合部分に剥がれが生じる。   However, in the method of Patent Document 1, the margin region may come into contact with the work, and excessive vibration that does not contribute to the bonding strength is given. Therefore, the work is broken or cracked, and due to the break or crack, peeling occurs at the bonded portion of the bonded structure. Further, even if the bottom surface between the protrusions of the horn is made of a surface having no corners as in Patent Document 2, when the work comes into contact with the bottom surface between the protrusions, the work is vibrated in a state in which deformation of the work is suppressed. Will be. Therefore, the work is broken or cracked, and due to the break or crack, peeling occurs at the bonded portion of the bonded structure.

本発明は、上記課題を解決するためになされたものであり、接合部分の剥がれを抑制した、接合強度の大きい接合構造体を提供することを目的とする。   The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a bonded structure that suppresses peeling of a bonded portion and has high bonding strength.

上記目的を達成するために、本開示の接合構造体は、金属板と、前記金属板に積層された金属箔とを備え、前記金属板と前記金属箔との界面に複数の第１凹凸を有し、前記金属箔の前記金属板との界面の反対側に前記複数の第１凹凸と対応する、複数の第２凹凸を有すること、を特徴とする。   In order to achieve the above-mentioned object, a joining structure of the present disclosure comprises a metal plate and a metal foil laminated on the metal plate, and a plurality of first irregularities is provided at an interface between the metal plate and the metal foil. And a plurality of second irregularities corresponding to the plurality of first irregularities on the opposite side of the interface of the metal foil with the metal plate.

本開示によれば、接合部分の剥がれを抑制した、接合強度の大きい接合構造体を提供することができる。   According to the present disclosure, it is possible to provide a bonded structure in which peeling of a bonded portion is suppressed and which has high bonding strength.

本開示の第１実施形態における超音波接合の準備工程を示す模式断面図The schematic cross section which shows the preparation process of the ultrasonic joining in 1st Embodiment of this indication. 本開示の第１実施形態における超音波接合の接合工程を示す模式断面図The schematic cross section which shows the joining process of the ultrasonic joining in 1st Embodiment of this indication. 本開示の第１実施形態に用いるホーンの模式三面図Schematic trihedral view of the horn used in the first embodiment of the present disclosure 本開示の第１実施形態における接合構造体の模式的断面図Schematic cross-sectional view of the bonded structure in the first embodiment of the present disclosure 本開示の第１実施形態における接合構造体の第１凹凸および第２凹凸の断面の一部拡大図Partially enlarged view of a cross section of the first unevenness and the second unevenness of the bonded structure in the first embodiment of the present disclosure. 本開示の第２実施形態における超音波接合の準備工程を示す模式断面図The schematic cross section which shows the preparation process of the ultrasonic joining in 2nd Embodiment of this indication. 本開示の第２実施形態における接合構造体の模式断面図Schematic cross-sectional view of the bonded structure in the second embodiment of the present disclosure 一般的な超音波接合における接合工程を示す模式断面図Schematic cross-sectional view showing the bonding process in general ultrasonic bonding

以下、本開示の実施の形態について、図面を参照しながら説明する。   Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

（第１実施形態）
第１実施形態に係る接合構造体は、金属板と金属箔を積層した積層構造体であって、前記金属板と前記金属箔との界面に、複数の第１凹凸を有し、前記金属箔の前記金属板との界面の反対側にも、前記複数の第１凹凸と対応する複数の第２凹凸を有する。ここで、複数の第１凹凸および複数の第２凹凸が対応するとは、金属板と金属箔との積層面に対して垂直に、かつ複数の第２凹凸の凸部の中心を通るように切断した断面において、第２凹凸の凸部の下方（金属板側）に第１凹凸の凸部が位置し、第２凹凸の凹部の下方に、第１凹凸の凹部の下方（金属板側）に、第１凹凸の凹部が位置することをいう。つまり、当該接合構造体において、第１凹凸および第２凹凸は、同一の周期で形成されている。なお、本開示では便宜上、金属箔側を上方、金属板側を下方とする。 (First embodiment)
The bonded structure according to the first embodiment is a laminated structure in which a metal plate and a metal foil are stacked, and has a plurality of first irregularities at an interface between the metal plate and the metal foil, Also on the opposite side of the interface with the metal plate, there are a plurality of second irregularities corresponding to the plurality of first irregularities. Here, the term “a plurality of first concavities and convexities corresponds to a plurality of second concavities and convexities” means that cutting is performed so as to be perpendicular to the laminated surface of the metal plate and the metal foil and to pass through the centers of the convex portions of the plurality of second concavities and convexities. In the cross section, the convex portion of the first concave and convex is located below the convex portion of the second concave and convex (the metal plate side), below the concave portion of the second concave and convex portion, and below the concave portion of the first concave and convex portion (metal plate side). , That the concave portion of the first unevenness is located. That is, in the bonded structure, the first unevenness and the second unevenness are formed in the same cycle. In the present disclosure, for convenience, the metal foil side is the upper side and the metal plate side is the lower side.

本実施形態の接合構造体の模式断面図の一例を、図４に示す。本実施形態の接合構造体７は、例えば集電板３と電極箔４とを積層した構造体とすることができる。すなわち本実施形態では、金属板として集電板３を例示し、金属箔として電極箔４を例示する。電極箔４は、複数の金属箔の積層物である。また、図４は、集電板３と電極箔４との積層面に垂直に、かつ複数の第２凹凸９の凸部の中心を通るように、接合構造体７を直線状に切断したときの断面図である。   FIG. 4 shows an example of a schematic cross-sectional view of the bonded structure of the present embodiment. The bonded structure 7 of the present embodiment may be, for example, a structure in which the current collector 3 and the electrode foil 4 are laminated. That is, in this embodiment, the current collector plate 3 is exemplified as the metal plate, and the electrode foil 4 is exemplified as the metal foil. The electrode foil 4 is a laminate of a plurality of metal foils. In addition, FIG. 4 shows a case where the bonded structure 7 is cut linearly so as to pass through the centers of the protrusions of the plurality of second unevennesses 9 perpendicularly to the stacking surface of the current collector 3 and the electrode foil 4. FIG.

ここで、電極箔４を構成する各金属箔はアルミニウム合金箔とすることができる。また、集電板３はアルミニウム板とすることができる。この場合、例えば、集電板３はリチウム二次電池におけるアルミニウムリードとすることができ、電極箔４は正極とすることができる。ただし、金属板および金属箔は、集電板３および電極箔４に限られず、超音波接合が可能である金属であれば本開示を適用できる。具体的には、金属箔として、アルミニウムの他に、銅、ニッケル、チタン、ステンレス、マグネシウム、亜鉛等の金属、またはこれらの合金からなる箔を適用することができる。一方、金属板としては、アルミニウム板の他に、銅、チタン、マグネシウム、亜鉛等の金属、またはこれらの合金等を適用することができる。集電板３と電極箔４とは同種の材質であることが望ましいが、異種材料を用いることも可能である。   Here, each metal foil forming the electrode foil 4 can be an aluminum alloy foil. The current collector plate 3 can be an aluminum plate. In this case, for example, the collector plate 3 can be an aluminum lead in a lithium secondary battery, and the electrode foil 4 can be a positive electrode. However, the metal plate and the metal foil are not limited to the collector plate 3 and the electrode foil 4, and the present disclosure can be applied as long as the metal can be ultrasonically bonded. Specifically, as the metal foil, in addition to aluminum, a foil made of a metal such as copper, nickel, titanium, stainless steel, magnesium, zinc, or an alloy thereof can be used. On the other hand, as the metal plate, in addition to the aluminum plate, a metal such as copper, titanium, magnesium, zinc, or the like, or an alloy thereof or the like can be applied. The current collector plate 3 and the electrode foil 4 are preferably made of the same material, but different materials can also be used.

次に、本実施形態の接合構造体７を製造するための方法について説明する。
図１は、第１実施形態の接合構造体７を製造する際の超音波接合の準備工程を示す模式断面図である。当該準備工程では、アンビル１上に、ワーク２を配置し、ワーク２とホーン５とを対向させる。アンビル１は、集電板３と電極箔４とを積層したワーク２を載置するために固定された部材である。ワーク２の集電板３はアンビル１側に、電極箔４はホーン５側に積層（配置）する。ホーン５は、超音波振動を印加することで集電板３と電極箔４とを接合するための装置であり、本体部５ａと、当該本体部５ａの一方の面（ワーク２との対向面）に配置された複数の突起部５ｂと、を少なくとも有する。 Next, a method for manufacturing the bonded structure 7 of the present embodiment will be described.
FIG. 1 is a schematic cross-sectional view showing a preparation step for ultrasonic bonding when manufacturing the bonded structure 7 of the first embodiment. In the preparation step, the work 2 is placed on the anvil 1 and the work 2 and the horn 5 are opposed to each other. The anvil 1 is a member fixed for mounting a work 2 in which a current collector 3 and an electrode foil 4 are laminated. The current collector plate 3 of the work 2 is laminated (arranged) on the anvil 1 side and the electrode foil 4 is laminated on the horn 5 side. The horn 5 is a device for joining the current collector plate 3 and the electrode foil 4 by applying ultrasonic vibration, and includes a main body 5a and one surface of the main body 5a (a surface facing the work 2). ) And a plurality of protrusions 5b arranged in (4).

図２は、第１実施形態の接合構造体７を製造する際の超音波接合の接合工程を示す模式断面図である。当該工程では、ホーン５の突起部５ｂを超音波振動させながら、ワーク２に突起部５ｂを押し込む。すると、集電板３と電極箔４との当接面の酸化膜が剥がれ、集電板３および電極箔４の金属面同士が接合される。   FIG. 2 is a schematic cross-sectional view showing a bonding step of ultrasonic bonding when manufacturing the bonded structure 7 of the first embodiment. In this step, the protrusion 5b of the horn 5 is pushed into the work 2 while ultrasonically vibrating the protrusion 5b. Then, the oxide film on the contact surface between the collector plate 3 and the electrode foil 4 is peeled off, and the metal surfaces of the collector plate 3 and the electrode foil 4 are joined together.

ここで、ワーク２の接合時の課題について説明する。
ホーン５でワーク２を押圧しながら超音波振動を印加すると、ワーク２は、ホーン５側とアンビル１側とで互いに相対運動する。このことにより、電極箔４に塑性流動が生じ、ホーン５がワーク２内に沈み込む。そして、この沈み込み量に相当する体積の電極箔４が、ホーン５の複数の突起部５ｂどうしの間に流れ込む。そして、流れ込んだ部分の電極箔４が、振動方向に対してアンカーの役割をするため、ワーク２（電極箔）がホーン５に把持され、効果的に超音波振動を与えることができる。 Here, a problem at the time of joining the works 2 will be described.
When ultrasonic vibration is applied while pressing the work 2 with the horn 5, the work 2 moves relative to each other on the horn 5 side and the anvil 1 side. As a result, a plastic flow occurs in the electrode foil 4 and the horn 5 sinks into the work 2. Then, the electrode foil 4 having a volume corresponding to this sinking amount flows between the plurality of protrusions 5 b of the horn 5. Then, the part of the electrode foil 4 that has flowed in serves as an anchor in the vibration direction, so that the work 2 (electrode foil) is gripped by the horn 5 and ultrasonic vibration can be effectively applied.

このとき、一般的には、図８に示すように、電極箔４がホーン５の突起部５ｂどうしの間に位置する突起間底面６と接触するまで流れ込む。つまり、電極箔４が本体部５ａと突起部５ｂとの接合部分に当接する。そして、突起間底面６に到達した電極箔４はそれ以上の流動を妨げられることになる。すると、突起間底面６に接触する電極箔４は、変形を抑制された状態で加振されるため、不規則な積層状態となる。また、突起間底面６に接触する電極箔４は、突起間底面６からの超音波振動を受けることで、互いに超音波接合されたりする。その結果、これらに起因する応力集中が発生しやすく、突起間底面６に接触した電極箔４の表面に部分的な破れや亀裂が発生する。さらに、電極箔４の表面の一部がホーン５の本体部５ａに接触するため、これに起因して電極箔４に損傷が生じやすい。また特に本体部５ａの端部に接触する部分には応力が集中しやすい。   At this time, generally, as shown in FIG. 8, the electrode foil 4 flows until it comes into contact with the inter-projection bottom surface 6 located between the projecting portions 5 b of the horn 5. That is, the electrode foil 4 comes into contact with the joint portion between the main body portion 5a and the protruding portion 5b. Then, the electrode foil 4 reaching the inter-protrusion bottom surface 6 is prevented from further flowing. Then, the electrode foil 4 in contact with the bottom surface 6 between the protrusions is vibrated while being restrained from being deformed, so that the electrode foil 4 has an irregular laminated state. Further, the electrode foils 4 in contact with the inter-projection bottom surface 6 are subjected to ultrasonic vibration from the inter-projection bottom surface 6 to be ultrasonically bonded to each other. As a result, stress concentration due to these is likely to occur, and a partial tear or crack is generated on the surface of the electrode foil 4 which is in contact with the bottom surface 6 between the projections. Furthermore, since a part of the surface of the electrode foil 4 contacts the main body portion 5a of the horn 5, the electrode foil 4 is likely to be damaged due to this. In addition, stress is likely to concentrate particularly on the portion that comes into contact with the end portion of the main body portion 5a.

そこで本実施形態では、図２に示すように、ワーク２が突起部５ｂどうしの間にある突起間底面６に接触しないように、ホーン５を制御しながら超音波振動を印加する。これにより、電極箔４と突起間底面６との間に空間が生まれる。したがって、電極箔４と突起間底面６との接触によって生じる応力集中を回避することができる。   Therefore, in this embodiment, as shown in FIG. 2, ultrasonic vibration is applied while controlling the horn 5 so that the work 2 does not contact the inter-projection bottom surface 6 between the projections 5b. As a result, a space is created between the electrode foil 4 and the inter-projection bottom surface 6. Therefore, stress concentration caused by the contact between the electrode foil 4 and the bottom surface 6 between the protrusions can be avoided.

また本実施形態では、ワーク２（電極箔４）がホーン５の本体部５ａの突起間底面６だけでなく、端部等にも接触しないように、ホーン５を制御しながら超音波振動を印加する。これにより、電極箔４の損傷を抑えることができる。これらの効果により、電極箔４の破れや亀裂を抑制することが可能となり、接合部分の剥がれを抑制できる。   Further, in the present embodiment, ultrasonic vibration is applied while controlling the horn 5 so that the work 2 (electrode foil 4) does not contact not only the inter-projection bottom surface 6 of the main body portion 5a of the horn 5 but also the end portion or the like. To do. Thereby, damage to the electrode foil 4 can be suppressed. Due to these effects, it is possible to suppress breakage and cracks of the electrode foil 4, and it is possible to suppress peeling of the bonded portion.

一方で、超音波接合工程において、突起間底面６に対応する接合部分は超音波振動が十分に伝えられないので、その分低下する接合強度を補うことが望ましい。突起部５ｂがアンビル１側に近づいて加振するほど、箔同士のバルク化が進み、ワーク２の接合強度は高くなる。接合強度を高くするために、突起部５ｂを電極箔４のより深い位置に押込む。その結果、電極箔４の一部が集電板３にめり込むように集電板３が変形し、図４に示した第１凹凸８が形成される。そして、複数の突起部５ｂによって、第１凹凸８を複数形成することで、接合強度の向上を図ることができる。   On the other hand, in the ultrasonic bonding process, ultrasonic vibration cannot be sufficiently transmitted to the bonding portion corresponding to the inter-projection bottom surface 6, so it is desirable to compensate for the bonding strength that is reduced by that amount. As the protruding portion 5b approaches the anvil 1 side and is vibrated, the foils are bulked more and the bonding strength of the work 2 is increased. In order to increase the bonding strength, the protrusion 5b is pushed deeper into the electrode foil 4. As a result, the current collector plate 3 is deformed so that a part of the electrode foil 4 is embedded in the current collector plate 3, and the first unevenness 8 shown in FIG. 4 is formed. Then, by forming a plurality of first irregularities 8 by the plurality of protrusions 5b, it is possible to improve the bonding strength.

第１凹凸８の高さは、突起部５ｂの押込み量を変更することで調整することができる。第１凹凸８の高さの変更は、電極箔４の厚さに基づいて行うこともできる。なお、本開示において、第１凹凸８の高さとは、各第１凹凸８の凸部の頂点と凹部の頂点との高低差、とする。ここで、各第１凹凸８の高さが、電極箔４の厚さの１０％を下回ると、箔同士のバルク化が不十分であり、接合強度が低下することがある。一方、第１凹凸８の高さが、電極箔４の厚さの４０％を上回ると、集電板３の変形が大きくなり、後工程で接合構造体７を他部品に組み込めなくなるなどの不具合が生じることがある。したがって、複数の第１凹凸８の高さは、電極箔４の厚さの１０％以上４０％以下の範囲に収めるのがよい。なお、複数の第１凹凸８の高さは、全て均一であってもよく、一部異なっていてもよい。一部の高さが異なる場合、高さの平均値が、上記範囲に収まればよいが、全ての第１凹凸８の高さが、上記範囲に収まることが好ましい。   The height of the first unevenness 8 can be adjusted by changing the pushing amount of the protrusion 5b. The height of the first unevenness 8 can be changed based on the thickness of the electrode foil 4. In the present disclosure, the height of the first unevenness 8 is the height difference between the apex of the convex portion and the apex of the concave portion of each first unevenness 8. Here, if the height of each first unevenness 8 is less than 10% of the thickness of the electrode foil 4, the bulking of the foils is insufficient and the bonding strength may decrease. On the other hand, when the height of the first unevenness 8 exceeds 40% of the thickness of the electrode foil 4, the current collector plate 3 is greatly deformed, and the joint structure 7 cannot be incorporated into other parts in a later process. May occur. Therefore, it is preferable that the height of the plurality of first unevennesses 8 be within the range of 10% or more and 40% or less of the thickness of the electrode foil 4. The heights of the plurality of first unevennesses 8 may be uniform or may be partially different. When some of the heights are different, the average value of the heights may fall within the above range, but it is preferable that the heights of all the first unevennesses 8 fall within the above range.

図３は、第１実施形態に用いるホーン５の模式三面図である。図３（ａ）は正面図であり、図３（ｂ）は平面図（突起部５ｂの形成面の図）であり、図３（ｃ）は側面図である。   FIG. 3 is a schematic trihedral view of the horn 5 used in the first embodiment. 3 (a) is a front view, FIG. 3 (b) is a plan view (a view of the formation surface of the protrusion 5b), and FIG. 3 (c) is a side view.

第１実施形態に用いるホーン５の本体部５ａは直方体状であるが、これに限られない。また、ホーン５の本体部５ａは、例えば、他の装置などと接続されていてもよく、ワーク２との対向面が平坦であれば、他の面は曲面を有していてもよい。また、本体部５ａの端部に接触した電極箔４の損傷を抑制するため、端部を面取りしたり、端部をなくしたりしてもよい。   The main body 5a of the horn 5 used in the first embodiment has a rectangular parallelepiped shape, but is not limited to this. Further, the main body portion 5a of the horn 5 may be connected to, for example, another device or the like, and if the surface facing the work 2 is flat, the other surface may have a curved surface. Further, in order to prevent damage to the electrode foil 4 that comes into contact with the end of the main body 5a, the end may be chamfered or the end may be eliminated.

ホーン５の突起部５ｂは、ワーク２との対向面に複数配置される。複数の突起部５ｂの配列は、図３では簡易的に二行四列としているが、これに限られない。各突起部５ｂの形状は、先端が鋭利でなく、また本体部５ａに向かって断面積が大きくなるような形状であればよい。したがって、本実施形態では四角錘台状であるが、これに限られず、円錐台状、多角錘台状、などであってもよい。円錐状や、多角錘状などであってもよいが、この場合、先端を面取りしたり、角を取ったりすることが好ましい。また、突起部５ｂの高さは、上述のように、突起部５ｂを電極箔４の深い位置に押し込んでも、突起間底面６が金属箔４と接触しない高さであればよい。   A plurality of protrusions 5b of the horn 5 are arranged on the surface facing the work 2. The array of the plurality of protrusions 5b is simply two rows and four columns in FIG. 3, but is not limited to this. The shape of each protrusion 5b may be such that the tip is not sharp and the cross-sectional area increases toward the main body 5a. Therefore, in the present embodiment, the shape is a truncated pyramid, but the shape is not limited to this, and it may be a truncated cone shape, a polygonal truncated cone shape, or the like. It may have a conical shape, a polygonal pyramid shape, or the like, but in this case, it is preferable that the tip be chamfered or chamfered. Further, the height of the protrusions 5b may be such that the inter-projection bottom surface 6 does not come into contact with the metal foil 4 even when the protrusions 5b are pushed deep into the electrode foil 4 as described above.

当該ホーン５では、図３（ｂ）において、縦方向矢印で示す向きを超音波振動方向とすることが好ましい。すなわち、超音波振動方向と、ホーン５の短辺方向とを一致させることが好ましい。これより、突起部５ｂごとの加振ばらつきが小さくなり、接合強度のばらつきを抑制することができる。   In the horn 5, the direction indicated by the vertical arrow in FIG. 3B is preferably the ultrasonic vibration direction. That is, it is preferable to make the ultrasonic vibration direction and the short side direction of the horn 5 coincide with each other. As a result, variation in vibration applied to each protrusion 5b is reduced, and variation in bonding strength can be suppressed.

集電板３と電極箔４とを、上述の接合方法を用いて超音波接合することで、図４に示す接合構造体７が形成される。上述のように、当該接合構造体７は、集電板３と電極箔４の界面に複数の第１凹凸８を有し、集電板３と電極箔４の界面の反対側の電極箔４にも複数の第１凹凸８と対応する複数の第２凹凸９を有する。接合工程において電極箔４が集電板３内に入り込むようにホーンを押し込んで接合することで、集電板３の塑性変形によって***した形状が保たれ、第１凹凸８が形成される。すなわち、各第１凹凸８の凹部は、第２凹凸９の凹部と対向する位置にそれぞれ形成され、各第１凹凸８の凸部は、第２凹凸９の凸部１２とそれぞれ対向する位置に配置される。このように複数の第１凹凸８を配置することで接合強度が高まり、より信頼性の高い接合体を実現することができる。   The joining structure 7 shown in FIG. 4 is formed by ultrasonically joining the current collector plate 3 and the electrode foil 4 using the joining method described above. As described above, the bonded structure 7 has the plurality of first irregularities 8 at the interface between the current collector 3 and the electrode foil 4, and the electrode foil 4 on the opposite side of the interface between the current collector 3 and the electrode foil 4. Also, a plurality of second unevennesses 9 corresponding to the plurality of first unevennesses 8 are provided. In the bonding step, the electrode foil 4 is pressed into the current collector plate 3 so that the electrode foil 4 is pressed into the current collector plate 3 to bond the electrode foil 4 to each other. That is, the concave portions of each first unevenness 8 are formed at positions facing the concave portions of the second unevenness 9, and the convex portions of each first unevenness 8 are formed at the positions facing the convex portions 12 of the second unevenness 9, respectively. Will be placed. By arranging the plurality of first concavities and convexities 8 in this manner, the bonding strength is increased and a more reliable bonded body can be realized.

なお、図４において、第１凹凸８の一部を破線で囲っているが、第１凹凸８は電極箔４と集電板３との界面の一部のみに形成されていてもよく、全体に形成されていてもよい。また、図４において、第２凹凸９の一部を点線で囲っているが、第２凹凸９は電極箔４の全面に形成されていてもよく、一部のみに形成されていてもよい。   In addition, in FIG. 4, a part of the first unevenness 8 is surrounded by a broken line, but the first unevenness 8 may be formed only at a part of the interface between the electrode foil 4 and the current collector plate 3, and the entire structure. It may be formed in. Further, in FIG. 4, a part of the second unevenness 9 is surrounded by a dotted line, but the second unevenness 9 may be formed on the entire surface of the electrode foil 4 or may be formed only on a part thereof.

ここで、本実施形態では、複数の第２凹凸９の凸部１２の先端は、それぞれ曲面で構成される。これは、接合工程においてホーン５の突起間底面６と電極箔４との接触がないため、電極箔４の塑性流動によって***した形状が保たれているからである。塑性流動が妨げられなかった電極箔４は、変形が抑制されず、積層状態が不規則となりにくい。そのため、不規則な積層状態に起因する応力集中が生じにくくなる。つまり、第２凹凸９の凸部１２の先端（凸部１２の頂点およびその近傍）を曲面で構成することで、応力集中による破れや亀裂に起因する、接合構造体７の接合部分の剥がれを抑制することができる。   Here, in the present embodiment, the tips of the protrusions 12 of the plurality of second unevennesses 9 are each formed of a curved surface. This is because there is no contact between the inter-protrusion bottom surface 6 of the horn 5 and the electrode foil 4 in the joining step, so that the shape raised by the plastic flow of the electrode foil 4 is maintained. The electrode foil 4 whose plastic flow is not hindered is not suppressed from being deformed, and the laminated state is unlikely to be irregular. Therefore, stress concentration due to the irregular stacked state is less likely to occur. That is, by forming the tip of the convex portion 12 of the second unevenness 9 (the apex of the convex portion 12 and the vicinity thereof) with a curved surface, peeling of the bonded portion of the bonded structure 7 due to breakage or cracks due to stress concentration can be prevented. Can be suppressed.

図５は、第１実施形態における接合構造体７の第１凹凸８と第２凹凸９の断面の一部拡大図である。本図は、接合構造体７を、電極箔４と集電板３との積層面に対して垂直に、かつ複数の第２凹凸９の凸部の中心を通るように切断したときの断面の一部である。第２凹凸９の凸部１２の先端に含まれる複数の金属箔は、互いに接合されておらず、凸部１２の内部に空間が形成されている。そのため第２凹凸９の凸部１２の先端は、金属箔同士の接合や電極箔４の不規則な積層状態による応力集中が生じにくく、高い信頼性を示すことが可能である。   FIG. 5 is a partially enlarged view of a cross section of the first unevenness 8 and the second unevenness 9 of the bonded structure 7 in the first embodiment. This figure shows a cross section of the bonded structure 7 cut perpendicularly to the laminated surface of the electrode foil 4 and the current collector 3 and through the centers of the projections of the plurality of second unevenness 9. It is a part. The plurality of metal foils included in the tips of the protrusions 12 of the second unevenness 9 are not joined to each other, and spaces are formed inside the protrusions 12. Therefore, at the tip of the convex portion 12 of the second unevenness 9, stress concentration due to the joining of the metal foils and the irregular lamination state of the electrode foil 4 is unlikely to occur, and high reliability can be exhibited.

（第２実施形態）
図６は、第２実施形態における超音波接合の準備工程を示す模式断面図である。なお、第２実施形態では、使用するホーン１５の突起部１５ｂの形状が第１実施形態と相違し、得られる接合構造体の第１凹凸１８および第２凹凸１９の形状が異なる以外は、第１実施形態と同様である。第１実施形態と同様の構成については、第１実施形態と同様の符号を付し、ここでの詳しい説明は省略する。 (Second embodiment)
FIG. 6 is a schematic cross-sectional view showing a preparation step for ultrasonic bonding in the second embodiment. In the second embodiment, the shape of the projection 15b of the horn 15 used is different from that of the first embodiment, and the shapes of the first unevenness 18 and the second unevenness 19 of the obtained bonded structure are different. This is similar to that of the first embodiment. About the same composition as a 1st embodiment, the same numerals as a 1st embodiment are attached, and the detailed explanation here is omitted.

本実施形態では、第１実施形態と異なり、ホーン１５の突起部１５ｂと本体部１５ａとの接合面（以下、「突起接合面１０」）とも称する）の面積が均一でない。   In the present embodiment, unlike the first embodiment, the area of the joint surface between the protrusion 15b of the horn 15 and the main body portion 15a (hereinafter, also referred to as "protrusion joint surface 10") is not uniform.

ホーン１５を用いた接合工程では通常、電極箔４は、隣接する突起部１５ｂを越えて、ホーン１５の周縁部にも広がる挙動を示す。ホーン１５の中心部から周縁部に向かって広がってきた電極箔４は、ホーン１５の周縁部側にある突起部１５ｂどうしの間に流れ込む。さらに、ホーン１５の周縁部側にある突起部１５ｂどうしの間には、ホーン１５より外側にある電極箔４も流れ込む。したがって、ホーン１５の周縁部側にある突起部１５ｂどうしの間には、ホーン１５の中央部側に位置する突起部１５ｂどうしの間と比べ、より多くの電極箔４が流れ込むことになる。   In the joining process using the horn 15, the electrode foil 4 normally exhibits a behavior of spreading beyond the adjacent protrusions 15b to the peripheral portion of the horn 15. The electrode foil 4 spreading from the central portion of the horn 15 toward the peripheral portion flows between the protrusions 15b on the peripheral portion of the horn 15. Further, the electrode foil 4 on the outer side of the horn 15 also flows into between the protrusions 15b on the peripheral side of the horn 15. Therefore, more electrode foil 4 flows between the protrusions 15b on the peripheral side of the horn 15 than between the protrusions 15b on the central side of the horn 15.

そこで、本実施形態では、ホーン１５の周縁部（ここでは、ホーン１５の長手方向の端部側）にある突起部１５ｂどうしの間の体積を、ホーン１５の中心側にある突起部１５ｂどうしの体積より大きくしている。これにより、より多くの電極箔４が突起部１５ｂどうしの間に流れ込んでも、その体積が大きいため、ホーン１５の本体部１５ａに電極箔４が接触しない。したがって、電極箔４の破れや亀裂を抑制することが可能となる。   Therefore, in the present embodiment, the volume between the protrusions 15b on the peripheral portion of the horn 15 (here, the end portion side in the longitudinal direction of the horn 15) is defined as the volume between the protrusions 15b on the center side of the horn 15. It is larger than the volume. Thereby, even if a larger amount of the electrode foil 4 flows between the protrusions 15b, the electrode foil 4 does not contact the main body 15a of the horn 15 because of its large volume. Therefore, it is possible to prevent the electrode foil 4 from breaking or cracking.

上記のように突起部１５ｂ間の体積を大きくするため、第２実施形態では、中央側に位置する突起部１５ｂの突起部接合面１０ｂの面積より、端部側に位置する突起部１５ｂの突起部接合面１０ａの面積のほうが小さく設定されている。また、複数の突起部１５ｂの中心間距離１１、および突起部１５ｂの高さは均一である。   In order to increase the volume between the protrusions 15b as described above, in the second embodiment, the protrusion of the protrusion 15b located on the end side is larger than the area of the protrusion joint surface 10b of the protrusion 15b located on the center side. The area of the joint surface 10a is set smaller. Further, the center-to-center distance 11 of the plurality of protrusions 15b and the height of the protrusions 15b are uniform.

ワーク２の接合強度は、電極箔４と突起部１５ｂとの接触面積が大きいほど高くなる。超音波振動が突起部１５ｂから電極箔４に印加されることにより、電極箔４と突起部１５ｂとの接触している部分が超音波接合されるためである。したがって、突起部接合面１０を小さくすると、電極箔４と突起部１５ｂとの接触面積が小さくなり、接合強度は低下する傾向にある。そのため、周縁部にある突起部１５ｂの突起部接合面１０ａのみ、小さくすることが好ましい。図６は簡易的に、ホーン１５の長手方向の周縁部側に位置する２つの突起部１５ｂの突起部接合面１０ｂの面積を、中心側に位置する突起部１５ｂの突起部接合面１０ａの面積より小さくしているが、これに限られず、突起部１５ｂの数やホーン１５の大きさに合わせて適宜選択することができる。   The bonding strength of the work 2 increases as the contact area between the electrode foil 4 and the protrusion 15b increases. This is because the ultrasonic vibration is applied to the electrode foil 4 from the protrusion 15b, so that the contact portion between the electrode foil 4 and the protrusion 15b is ultrasonically bonded. Therefore, when the projection bonding surface 10 is made smaller, the contact area between the electrode foil 4 and the projection 15b becomes smaller, and the bonding strength tends to decrease. Therefore, it is preferable to reduce only the protrusion joint surface 10a of the protrusion 15b at the peripheral portion. FIG. 6 simply shows the area of the protrusion joint surface 10b of the two protrusions 15b located on the peripheral side in the longitudinal direction of the horn 15 as the area of the protrusion joint surface 10a of the protrusion 15b located on the center side. Although it is made smaller, it is not limited to this and can be appropriately selected according to the number of the projections 15 b and the size of the horn 15.

図７は、第２実施形態における接合構造体１７を示す模式断面図である。図６に示すホーン１５を用いること以外は第１実施形態と同様であり、準備工程や接合工程の手順も同様である。接合構造体７は、集電板３と電極箔４の界面に複数の第１凹凸１８を有し、集電板３と電極箔４との界面の反対側の電極箔４（電極箔４の表面側）にも、複数の第１凹凸１８と対応する複数の第２凹凸１９を有する。なお、図７は、集電板３と電極箔４との積層面に垂直に、かつ複数の第２凹凸１９の凸部の中心を通るように、接合構造体１７の長手方向に平行に切断したときの断面図である。   FIG. 7 is a schematic cross-sectional view showing the bonded structure 17 in the second embodiment. The procedure is the same as that of the first embodiment except that the horn 15 shown in FIG. 6 is used, and the procedure of the preparation step and the joining step is also the same. The bonded structure 7 has a plurality of first irregularities 18 at the interface between the current collector 3 and the electrode foil 4, and the electrode foil 4 (of the electrode foil 4) on the opposite side of the interface between the current collector 3 and the electrode foil 4. The surface side) also has a plurality of second unevennesses 19 corresponding to the plurality of first unevennesses 18. Note that FIG. 7 is cut perpendicularly to the laminated surface of the current collector 3 and the electrode foil 4 and parallel to the longitudinal direction of the bonded structure 17 so as to pass through the centers of the convex portions of the plurality of second irregularities 19. It is sectional drawing when doing.

図７に示すように、当該接合構造体１７では、長手方向と平行な断面を観察したとき、接合構造体１７の中央側に位置する第１凹凸１８の凸部１３の幅１４ｂより、端部側に位置する第１凹凸１８の凸部１３の幅１４ａのほうが大きい。第１凹凸１８の凸部１３の幅が大きいということは、第２凹凸１９の凸部１２の底面積が広がり、第２凹凸１９の凸部１２の体積が大きくなる。すなわち、当該位置における第２凹凸１９の凸部１２に、より多くの金属箔を積層することができることを意味する。   As shown in FIG. 7, in the bonded structure 17, when the cross section parallel to the longitudinal direction is observed, the width 14b of the convex portion 13 of the first unevenness 18 located on the center side of the bonded structure 17 is larger than the end portion. The width 14a of the convex portion 13 of the first unevenness 18 located on the side is larger. The large width of the convex portion 13 of the first concave-convex portion 18 means that the bottom area of the convex portion 12 of the second concave-convex portion 19 increases and the volume of the convex portion 12 of the second concave-convex portion 19 increases. That is, it means that more metal foil can be laminated on the convex portion 12 of the second unevenness 19 at that position.

前述のように、接合構造体では、上述の接合工程において、より多くの電極箔４が端部側に流れ込む。そのため、端部側にある第１凹凸１８の凸部１３の幅１４ａを大きくすることで、第２凹凸１９の凸部１２に、より多くの電極箔４が流れ込んでも、金属箔同士の接合や、電極箔４の不規則な積層状態を抑制することができる。すなわち、このような形状の第２凹凸１９の凸部１２は、応力が集中しにくい。なお、本開示では、各第１凹凸１８の高さの半分となる位置より上側にある部分、すなわち当該位置より、集電板３が電極箔４側に突出した部分を、第１凹凸１８の凸部１３とする。同様に、各第１凹凸１８の高さの半分となる位置より下側にある部分、すなわち当該位置より、電極箔４が集電板３内側に突出した部分を、第１凹凸１８の凹部とする。また、上記第１凹凸１８の凸部１３の幅は、集電板３と電極箔４との積層面に垂直に、かつ複数の第２凹凸１９の凸部１２の中心を通るように切断したときの断面から特定することができる。   As described above, in the bonded structure, a larger amount of the electrode foil 4 flows into the end portion side in the above bonding process. Therefore, by increasing the width 14a of the protrusion 13 of the first unevenness 18 on the end side, even if more electrode foil 4 flows into the protrusion 12 of the second unevenness 19, the metal foils can be joined together or Therefore, it is possible to suppress the irregular laminated state of the electrode foil 4. That is, stress is unlikely to concentrate on the protrusions 12 of the second unevenness 19 having such a shape. In the present disclosure, a portion that is located above a position that is half the height of each first unevenness 18, that is, a portion where the current collector plate 3 protrudes toward the electrode foil 4 side from the position is a portion of the first unevenness 18. The convex portion 13 is formed. Similarly, the portion below the position at which the height of each first unevenness 18 is half, that is, the portion where the electrode foil 4 protrudes inside the current collector 3 from that position is referred to as the concave portion of the first unevenness 18. To do. Further, the width of the convex portion 13 of the first concave and convex portion 18 was cut so as to be perpendicular to the laminated surface of the current collector 3 and the electrode foil 4 and to pass through the center of the convex portion 12 of the plurality of second concave and convex portions 19. It can be specified from the cross section.

以上、第１実施形態および第２実施形態で説明した方法によれば、ワークの部分的な破れや亀裂の拡大進展によって、接合構造体の実際の使用中あるいは組み立て作業中に引き起こされる、接合部分の剥がれを抑制しつつ、接合強度を大きくすることができる。このことで、接合構造体の破損を防いだり、電気抵抗の上昇を生じにくくしたりしつつ、高い接合強度を実現することができる。   As described above, according to the methods described in the first embodiment and the second embodiment, the joint portion, which is caused during the actual use of the joint structure or the assembling work due to the partial breakage or expansion of the crack of the workpiece. It is possible to increase the bonding strength while suppressing the peeling of the. As a result, it is possible to realize high joint strength while preventing damage to the joint structure and preventing an increase in electrical resistance from occurring.

本開示の接合構造体は、特に電池、例えばリチウム二次電池の電極として用いることが可能である。   The joining structure of the present disclosure can be used as an electrode of a battery, for example, a lithium secondary battery, in particular.

１ アンビル
２ ワーク
３ 集電板
４ 電極箔
５、１５ ホーン
５ａ、１５ａ 本体部
５ｂ、１５ｂ 突起部
６ 突起間底面
７、１７ 接合構造体
８、１８ 第１凹凸
９、１９ 第２凹凸
１０、１０ａ、１０ｂ 突起接合面
１１ 突起部の中心間距離
１２ 第２凹凸の凸部
１３ 第１凹凸の凸部
１４ａ、１４ｂ 第１凹凸の凸部の幅 1 Anvil 2 Work 3 Current Collector 4 Electrode Foil 5, 15 Horn 5a, 15a Main Body 5b, 15b Projection 6 Bottom Surface Between Projections 7, 17 Joining Structure 8, 18 First Unevenness 9, 19 Second Unevenness 10, 10a 10b Protrusion joint surface 11 Distance between centers of protrusions 12 Convex portion of second irregularity 13 Convex portion of first irregularity 14a, 14b Width of convex portion of first irregularity

Claims (4)

金属板と、
前記金属板に積層された金属箔と、を備え、
前記金属板と前記金属箔との界面に複数の第１凹凸を有し、
前記金属箔の前記金属板との界面の反対側に前記複数の第１凹凸と対応する、複数の第２凹凸を有する、接合構造体。 A metal plate,
A metal foil laminated on the metal plate,
Having a plurality of first irregularities at the interface between the metal plate and the metal foil,
A bonded structure having a plurality of second concavities and convexities corresponding to the plurality of first concavities and convexities on the opposite side of the interface of the metal foil with the metal plate. 前記第１凹凸の高さは、前記金属箔の厚さの１０％〜４０％である、請求項１に記載の接合構造体。   The joining structure according to claim 1, wherein the height of the first unevenness is 10% to 40% of the thickness of the metal foil. 前記第２凹凸の凸部の先端は曲面で構成される、請求項１または２に記載の接合構造体。   The joining structure according to claim 1 or 2, wherein a tip of the convex portion of the second unevenness is formed of a curved surface. 前記複数の第１凹凸のうち、前記接合構造体の中央側に位置する前記第１凹凸の凸部と、前記接合構造体の端部側に位置する前記第１凹凸の凸部の幅が異なる、請求項１〜３のいずれか１項に記載の接合構造体。   Of the plurality of first irregularities, the width of the convex portion of the first irregularity located on the center side of the bonded structure and the width of the convex portion of the first irregularity located on the end side of the bonded structure are different. The joined structure according to any one of claims 1 to 3.
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