JP2020050701A - Thermally conductive putty composition, and thermally conductive sheet and battery module including the same - Google Patents
Thermally conductive putty composition, and thermally conductive sheet and battery module including the same Download PDFInfo
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Abstract
Description
本発明は、熱伝導性パテ組成物、並びにそれを用いた熱伝導性シート及び電池モジュールに関する。 The present invention relates to a heat conductive putty composition, and a heat conductive sheet and a battery module using the same.
二次電池モジュールの高エネルギー化や電子・電気回路基板の素子の高密度化に伴い、それら二次電池モジュール、電子・電気回路基板等の発熱する物品から発生する熱量が多くなり、その熱を効率的に放熱させる手段として、熱伝導シートが用いられている。 With the increase in the energy of secondary battery modules and the density of elements on electronic and electric circuit boards, the amount of heat generated from heat-generating articles such as secondary battery modules, electronic and electric circuit boards, etc. As means for efficiently dissipating heat, a heat conductive sheet is used.
一方、寒冷地などで使用される二次電池モジュール、電子・電気回路基板等に対しては、二次電池モジュール、電子・電気回路基板を作動させる前に、一旦温めることが必要になり、その場合、外部（ヒータ等）から熱を効率よく二次電池モジュール、電子・電気回路基板に与える必要がある。 On the other hand, for secondary battery modules and electronic / electric circuit boards used in cold regions, etc., it is necessary to warm up the secondary battery modules and electronic / electric circuit boards before operating them. In this case, it is necessary to efficiently supply heat from the outside (such as a heater) to the secondary battery module and the electronic / electric circuit board.
そうした中、近年、二次電池モジュールや電子・電気回路基板の表面との接触面積を大きくして熱伝導性（放熱性、与熱性）を高めるため、熱伝導シートの柔軟性を向上させる開発が進められている（例えば特許文献１及び２）。 Under these circumstances, in recent years, there has been a development to improve the flexibility of the heat conductive sheet in order to increase the contact area with the surface of the secondary battery module or the electronic / electric circuit board to increase the heat conductivity (heat dissipation, heat-generating property). (For example, Patent Documents 1 and 2).
本発明の課題は、表面形状に追随して変形することにより高い熱伝導性（放熱性、与熱性）を得ることができる熱伝導性パテ組成物を提供することである。 An object of the present invention is to provide a thermally conductive putty composition that can obtain high thermal conductivity (heat dissipation and heat-generating properties) by being deformed following the surface shape.
本発明は、液状ポリマーと、水酸化アルミニウムと、ベントナイトとを含有し、前記水酸化アルミニウムの含有量が前記液状ポリマー１００質量部に対して１５０質量部以上１０００質量部以下であり、且つ前記ベントナイトの含有量が前記液状ポリマー１００質量部に対して５質量部以上２０質量部以下である熱伝導性パテ組成物である。 The present invention includes a liquid polymer, aluminum hydroxide, and bentonite, wherein the content of the aluminum hydroxide is 150 parts by mass or more and 1000 parts by mass or less based on 100 parts by mass of the liquid polymer, and the bentonite Is a heat conductive putty composition having a content of 5 to 20 parts by mass with respect to 100 parts by mass of the liquid polymer.
本発明は、本発明の熱伝導パテ性組成物をシート状に成形した熱伝導性シートである。また、本発明は、本発明の熱伝導性シートを有する電池モジュールである。 The present invention is a heat conductive sheet obtained by molding the heat conductive putty composition of the present invention into a sheet. Further, the present invention is a battery module having the heat conductive sheet of the present invention.
本発明によれば、所望する物品に接触させるとき、その表面形状に追随して変形させることができるので、広い面積で物品に接触することとなり、それにより高い熱伝導性（放熱性、与熱性）を得ることができる。 According to the present invention, when a desired article is brought into contact, the article can be deformed following the surface shape thereof, so that the article comes into contact with a wide area, thereby achieving high thermal conductivity (heat dissipation, heat-generating property). ) Can be obtained.
以下、実施形態について詳細に説明する。 Hereinafter, embodiments will be described in detail.
実施形態に係る熱伝導性パテ組成物は、液状ポリマーと、水酸化アルミニウムと、ベントナイトとを含有する。水酸化アルミニウム及びベントナイトは、液状ポリマー中に分散している。 The heat conductive putty composition according to the embodiment contains a liquid polymer, aluminum hydroxide, and bentonite. Aluminum hydroxide and bentonite are dispersed in the liquid polymer.
本出願における「液状ポリマー」とは、常温・常圧（２５℃、１気圧）で液状であるポリマーをいう。液状ポリマーとしては、例えば、液状ポリブタジエン、液状ポリイソプレン、液状ポリブテン、液状エチレンプロピレン共重合体などの液状ポリオレフィン；液状シリコーン；液状アクリル；液状ウレタン等が挙げられる。液状ポリマーは、これらのうちの１種又は２種以上を含むことが好ましく、液状ポリオレフィンを含むことがより好ましい。液状ポリマーは、燃焼時のハロゲンガスの発生を防ぐ観点から、分子中にハロゲン元素を含まないことが好ましい。 The “liquid polymer” in the present application refers to a polymer that is liquid at normal temperature and normal pressure (25 ° C., 1 atm). Examples of the liquid polymer include liquid polyolefins such as liquid polybutadiene, liquid polyisoprene, liquid polybutene, and liquid ethylene propylene copolymer; liquid silicone; liquid acrylic; liquid urethane, and the like. The liquid polymer preferably contains one or more of these, and more preferably contains a liquid polyolefin. The liquid polymer preferably does not contain a halogen element in the molecule from the viewpoint of preventing generation of halogen gas during combustion.
液状ポリマーは、液状ポリブタジエンを含むことが好ましく、液状ポリブタジエンのみで構成されていてもよい。また、液状ポリマーは、比較的低粘度の液状ポリブタジエンと高粘度の液状ポリブテンとの混合物を含むことが好ましく、それらの液状ポリブタジエンと液状ポリブテンとの混合物のみで構成されていてもよい。液状ポリマーが液状ポリブタジエンと液状ポリブテンとの混合物を含む場合、液状ポリブタジエンの含有量の液状ポリブテンの含有量に対する質量比（液状ポリブタジエンの含有量／液状ポリブテンの含有量）は、難燃性を高めるとともに、粘着性を付与して物品との密着性を高める観点から、好ましくは２０／８０以上９９／１以下、より好ましくは３０／７０以上６０／４０以下である。 The liquid polymer preferably contains liquid polybutadiene, and may be composed of only liquid polybutadiene. Further, the liquid polymer preferably contains a mixture of relatively low-viscosity liquid polybutadiene and high-viscosity liquid polybutene, and may be composed of only a mixture of those liquid polybutadiene and liquid polybutene. When the liquid polymer contains a mixture of liquid polybutadiene and liquid polybutene, the mass ratio of the content of the liquid polybutadiene to the content of the liquid polybutene (the content of the liquid polybutadiene / the content of the liquid polybutene) increases the flame retardancy. From the viewpoint of imparting adhesiveness and enhancing the adhesion to the article, the ratio is preferably 20/80 or more and 99/1 or less, more preferably 30/70 or more and 60/40 or less.
水酸化アルミニウムは、熱伝導性パテ組成物に難燃性を付与する粒状物である。実施形態に係る熱伝導性パテ組成物の難燃性の指標の酸素指数は、好ましくは５０以上、より好ましくは６５以上である。水酸化アルミニウムの平均粒径は、熱伝導性とともに軟度を高める観点から、好ましくは０．５μｍ以上１００μｍ以下、より好ましくは１５μｍ以上６０μｍ以下である。 Aluminum hydroxide is a particulate material that imparts flame retardancy to the thermally conductive putty composition. The oxygen index of the flame retardancy index of the thermally conductive putty composition according to the embodiment is preferably 50 or more, more preferably 65 or more. The average particle size of the aluminum hydroxide is preferably 0.5 μm or more and 100 μm or less, more preferably 15 μm or more and 60 μm or less, from the viewpoint of enhancing the softness as well as the thermal conductivity.
水酸化アルミニウムの粒度分布は、熱伝導性とともに液状ポリマーへの分散性及び難燃性を高める観点から、複数のピークを有することが好ましい。したがって、水酸化アルミニウムは、平均粒径が異なる複数種を含むことが好ましい。具体的には、例えば、水酸化アルミニウムは、平均粒径が１０μｍよりも大きく１００μｍ以下の水酸化アルミニウムＡと、平均粒径１０μｍ以下の水酸化アルミニウムＢとを、水酸化アルミニウムＡ１００質量部に対して、水酸化アルミニウムＢ５０質量部以上２００質量部以下の割合で含み、粒度分布が、平均粒径が１０μｍよりも大きく１００μｍ以下の第１ピークと、平均粒径１０μｍ以下の第２ピークとを有していてもよい。また、水酸化アルミニウムは、平均粒径が０．５μｍ以上１０μｍ未満の水酸化アルミニウムＸ、平均粒径が１０μｍ以上３０μｍ未満の水酸化アルミニウムＹ、及び平均粒径が３０μｍ以上１００μｍ以下の水酸化アルミニウムＺのうちの２種以上を、水酸化アルミニウムＹ及びＺ１００質量部に対して水酸化アルミニウムＸ５０質量部以上２００質量部以下の割合で含み、粒度分布が、平均粒径が３０μｍ以上１００μｍ以下の第１ピークと、平均粒径０．５μｍ以上３０μｍ未満の第２ピークとを有していてもよい。 The particle size distribution of the aluminum hydroxide preferably has a plurality of peaks from the viewpoint of enhancing thermal conductivity, dispersibility in a liquid polymer, and flame retardancy. Therefore, the aluminum hydroxide preferably contains a plurality of types having different average particle sizes. Specifically, for example, aluminum hydroxide has an average particle diameter of aluminum hydroxide A having an average particle diameter of greater than 10 μm and 100 μm or less and aluminum hydroxide B having an average particle diameter of 10 μm or less with respect to 100 parts by mass of aluminum hydroxide A. And containing aluminum hydroxide B in a proportion of 50 parts by mass or more and 200 parts by mass or less, and having a particle size distribution having a first peak having an average particle size of more than 10 μm and 100 μm or less and a second peak having an average particle size of 10 μm or less. It may be. Aluminum hydroxide is aluminum hydroxide X having an average particle size of 0.5 μm or more and less than 10 μm, aluminum hydroxide Y having an average particle size of 10 μm or more and less than 30 μm, and aluminum hydroxide having an average particle size of 30 μm or more and 100 μm or less. Two or more kinds of Z are contained in aluminum hydroxide Y and 100 parts by mass of aluminum hydroxide at a ratio of 50 parts by mass or more and 200 parts by mass or less of aluminum hydroxide X, and the particle size distribution has an average particle size of 30 μm or more and 100 μm or less. It may have one peak and a second peak having an average particle size of 0.5 μm or more and less than 30 μm.
実施形態に係る熱伝導性パテ組成物における水酸化アルミニウムの含有量は、熱伝導性とともに加工性を高める観点から、液状ポリマー１００質量部に対して、１５０質量部以上１０００質量部以下であり、好ましくは４００質量部以上７００質量部以下、より好ましくは４５０質量部以上６５０質量部以下である。 The content of aluminum hydroxide in the thermally conductive putty composition according to the embodiment is, from the viewpoint of enhancing the processability along with the thermal conductivity, with respect to 100 parts by mass of the liquid polymer, from 150 parts by mass to 1,000 parts by mass, Preferably it is 400 to 700 parts by mass, more preferably 450 to 650 parts by mass.
ベントナイトは、ＳｉＯ２とＡｌ２Ｏ３を主成分とする各種のモンモリロン石（例えば、モンモリロン石、マグネシアンモンモリロン石、テツモンモリロン石、テツマグネシアンモンモリロン石、バイデライト、アルミニアンバイデライト、ノントロン石、アルミニアンノントロナイト、サボー石、アルミニアンサボー石、ヘクトライト、ソーコナイト、ボルコンスコアイト等）を主成分とした粘土類である。ベントナイトは、モンモリロン石以外に、タンパク石、セキエイチョウ石、フッ石、火山ガラス等を含んでいてもよい。また、ベントナイトは、液状ポリマーへの分散性を高める観点から、Ｎａ、Ｃａ、Ｍｇ等の交換性塩基が有機アミンで置換されて有機化処理された有機ベントナイトを含むことが好ましい。 Bentonite is a type of montmorillonite mainly composed of SiO 2 and Al 2 O 3 (for example, montmorillonite, magnesia montmorillonite, tetmontmorillonite, tetmagnesian montmorillonite, beidellite, aluminian beidellite, nontron) Stone, aluminian nontronite, saboite, aluminian saboite, hectorite, sauconite, bolconite, etc.). The bentonite may include protein stone, buffalo stone, fluorite, volcanic glass and the like in addition to montmorillonite. In addition, from the viewpoint of enhancing dispersibility in a liquid polymer, the bentonite preferably contains organic bentonite that has been subjected to an organic treatment by replacing an exchangeable base such as Na, Ca, or Mg with an organic amine.
実施形態に係る熱伝導性パテ組成物におけるベントナイトの含有量は、熱伝導性とともに軟度を高める観点から、液状ポリマー１００質量部に対して、５質量部以上２０質量部以下であり、好ましくは７質量部以上１５質量部以下、より好ましくは９質量部以上１３質量部以下である。 The content of bentonite in the thermally conductive putty composition according to the embodiment is from 5 parts by mass to 20 parts by mass with respect to 100 parts by mass of the liquid polymer, from the viewpoint of increasing the softness together with the thermal conductivity, preferably It is from 7 parts by mass to 15 parts by mass, more preferably from 9 parts by mass to 13 parts by mass.
実施形態に係る熱伝導性パテ組成物のＪＩＳ Ｈ７９０３：２００８に準じて測定される熱伝導度（一方向熱流定常比較法（ＳＣＨＦ） 測定温度：３３℃）は、好ましくは０．５Ｗ／ｍ・Ｋ以上、より好ましくは２．０Ｗ／ｍ・Ｋ以上、更に好ましくは３．０Ｗ／ｍ・Ｋ以上である。 The thermal conductivity of the thermally conductive putty composition according to the embodiment, which is measured in accordance with JIS H7903: 2008 (unidirectional heat flow steady-state comparison method (SCHF) measurement temperature: 33 ° C.), is preferably 0.5 W / m ·. K or more, more preferably 2.0 W / m · K or more, still more preferably 3.0 W / m · K or more.
実施形態に係る熱伝導性パテ組成物の軟度の指標としてのＪＩＳ Ａ５７５２：１９９４に準じて測定される針入量（測定温度：２３±３℃）は、好ましくは５０ｍｍ以上、より好ましくは７５ｍｍ以上であり、好ましくは１１０ｍｍ以下である。 The penetration amount (measurement temperature: 23 ± 3 ° C.) measured according to JIS A5752: 1994 as an index of the softness of the thermally conductive putty composition according to the embodiment is preferably 50 mm or more, more preferably 75 mm. And preferably 110 mm or less.
このような実施形態に係る熱伝導性パテ組成物は、ニーダー等の混練機に、液状ポリマー、水酸化アルミニウム、及びベントナイトを投入し、混練加工温度を２０℃以上８０℃以下に管理しつつ、混練加工時間を３０分以上６０分間以下として混錬することにより作製することができる。 The heat conductive putty composition according to such an embodiment is a kneader such as a kneader, the liquid polymer, aluminum hydroxide, and bentonite are charged, and the kneading temperature is controlled at 20 ° C or higher and 80 ° C or lower, It can be produced by kneading with a kneading time of 30 minutes to 60 minutes.
以上の構成の実施形態に係る熱伝導性パテ組成物によれば、液状ポリマーと、水酸化アルミニウムと、ベントナイトとを含有し、水酸化アルミニウムの含有量が液状ポリマー１００質量部に対して１５０質量部以上１０００質量部以下であり、且つベントナイトの含有量が液状ポリマー１００質量部に対して５質量部以上２０質量部以下であることにより、所望する物品に接触させるとき、その表面形状に追随して変形させることができるので、広い面積で物品に接触することとなり、それにより高い放熱性（又は与熱性）を得ることができる。加えて、水酸化アルミニウムは難燃剤としても機能することから、実施形態に係る熱伝導性パテ組成物は高いノンハロ難燃性（酸素指数６５以上）を得ることができる。 According to the heat conductive putty composition according to the embodiment having the above configuration, the liquid polymer, aluminum hydroxide, and bentonite are contained, and the content of aluminum hydroxide is 150 parts by mass relative to 100 parts by mass of the liquid polymer. To 1000 parts by mass and the content of bentonite is 5 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the liquid polymer. As a result, the article comes into contact with the article over a wide area, and thus high heat dissipation (or heat-imparting property) can be obtained. In addition, since aluminum hydroxide also functions as a flame retardant, the thermally conductive putty composition according to the embodiment can achieve high non-halo flame retardancy (oxygen index of 65 or more).
実施形態に係る熱伝導性パテ組成物からは、これを押出機による押出し成形やプレス機によるプレス成形等の公知の成形方法でシート状に成形することにより熱伝導性シートを作製することができる。このような熱伝導性シートは、物品に応じた適当な大きさに切り出し、所望する物品の表面に貼設するとともに適当な荷重を与えてやると、物品の表面形状に追随して変形し、広い面積で物品の表面に接触して高い放熱性（又は与熱性）を示す。熱伝導性シートの厚さは、好ましくは２ｍｍ以上、より好ましくは３ｍｍ以上で、好ましくは２０ｍｍ以下、より好ましくは１０ｍｍ以下である。 From the thermally conductive putty composition according to the embodiment, a thermally conductive sheet can be produced by molding the composition into a sheet by a known molding method such as extrusion molding with an extruder or press molding with a press machine. . Such a heat conductive sheet is cut out to an appropriate size according to the article, attached to a desired article surface and given an appropriate load, and deformed to follow the surface shape of the article, It exhibits high heat dissipation (or heat-generating property) by contacting the surface of the article over a wide area. The thickness of the heat conductive sheet is preferably 2 mm or more, more preferably 3 mm or more, preferably 20 mm or less, more preferably 10 mm or less.
ここで、物品としては、例えば、二次電池モジュールや電子・電気回路基板等が挙げられる。 Here, examples of the article include a secondary battery module and an electronic / electric circuit board.
図１Ａ及びＢは、二次電池モジュール１０を示す。この二次電池モジュール１０は、モジュール本体１１と、実施形態に係る熱伝導性パテ組成物をシート状に成形した第１及び第２の熱伝導性シート１２とを有する。モジュール本体１１は、複数本の二次電池１１１と、一対の電池ホルダー１１２とを有する。
1A and 1B show a
複数本の二次電池１１１は、それぞれが円柱状に形成されており、相互に間隔をおいて並行に設けられている。一対の電池ホルダー１１２は、それぞれがプレート状に形成されており、一方が複数本の二次電池１１１の一端側及び他方がそれらの他端側にそれぞれ設けられている。各電池ホルダー１１２は、複数本の二次電池１１１のそれぞれに対応するように有底円筒孔状の電池保持部１１２ａが形成されており、その電池保持部１１２ａに二次電池１１１の端部を嵌合保持するように構成されている。各電池保持部１１２ａの底面部の中央には丸孔１１２ｂが形成されており、その丸孔１１２ｂを介して二次電池１１１に電線が接続されるように構成されている。
Each of the plurality of
第１の熱伝導性シート１２は、並行に設けられた複数本の二次電池１１１の外側の凹凸表面を覆うように設けられている。第１の熱伝導性シート１２は、その取付時に外側から押圧されることにより、図２に示すように、複数本の二次電池１１１の表面形状に追随して変形してモジュール内部の相互に隣接する二次電池１１１間に流入し、それにより広い面積で二次電池１１１に接触することとなって高い放熱性（又は与熱性）を得ることができる。
The first heat
第２の熱伝導性シート１２は、一対の電池ホルダー１１２のそれぞれの外側の凹凸表面に貼設するように設けられている。第２熱伝導性シート１２は、その取付時に外側から押圧されることにより、図３に示すように、電池ホルダー１１２の表面形状に追随して変形して丸孔１１２ｂに流入し、それにより二次電池１１１に接触することとなって高い放熱性（又は与熱性）を得ることができる。
The second heat
電子・電気回路基板の凹凸表面としては、例えば、抵抗、コンデンサー、半導体素子、ＬＥＤなどの素子や配線が高密度に設けられた素子側表面や多数のはんだ付跡が設けられた裏面側表面等が挙げられる。そのような電子・電気回路基板の凹凸表面に上記熱伝導性シートを貼設することにより、高い放熱性（又は与熱性）を得ることができる。 As the uneven surface of the electronic / electric circuit board, for example, an element side surface on which elements such as resistors, capacitors, semiconductor elements, LEDs, and wiring are provided at a high density, and a back side surface on which a large number of traces of soldering are provided. Is mentioned. By adhering the heat conductive sheet on the uneven surface of such an electronic / electric circuit board, high heat dissipation (or heat application) can be obtained.
（熱伝導性パテ組成物）
＜実施例１＞
液状ポリブタジエン５０質量部と液状ブテン５０質量部との混合物を液状ポリマーとし、この液状ポリマー１００質量部に対して、水酸化アルミニウムとして、平均粒径が８μｍの水酸化アルミニウムＸ １７０質量部、平均粒径２７μｍの水酸化アルミニウムＹ １７０質量部、及び平均粒径５５μｍの水酸化アルミニウムＺ １１０質量部を配合するとともに、交換性塩基が有機アミンで置換されて有機化処理された有機ベントナイト１１質量部を配合し、容量２Ｌのニーダーで、混練加工温度を２０℃以上８０℃以下に管理しつつ、混練加工時間を４０分として混錬することにより調製した熱伝導性パテ組成物を実施例１とした。
(Thermal conductive putty composition)
<Example 1>
A mixture of 50 parts by mass of liquid polybutadiene and 50 parts by mass of liquid butene was used as a liquid polymer. With respect to 100 parts by mass of the liquid polymer, 170 parts by mass of aluminum hydroxide having an average particle size of 8 μm and 170 parts by mass of aluminum hydroxide were used. A mixture of 170 parts by mass of aluminum hydroxide Y having a diameter of 27 μm and 110 parts by mass of aluminum hydroxide Z having an average particle size of 55 μm, and 11 parts by mass of an organic bentonite that has been subjected to an organic treatment by replacing an exchangeable base with an organic amine is used. A heat conductive putty composition prepared by mixing and kneading with a kneader having a capacity of 2 L and kneading with a kneading time of 40 minutes while controlling the kneading temperature at 20 ° C. to 80 ° C. was used as Example 1. .
＜実施例２＞
水酸化アルミニウムＺを液状ポリマー１００質量部に対して３１０質量部配合したことを除いて実施例１と同様にして調製した熱伝導性パテ組成物を実施例２とした。
<Example 2>
A thermally conductive putty composition prepared in the same manner as in Example 1 except that 310 parts by weight of aluminum hydroxide Z was blended with respect to 100 parts by weight of the liquid polymer was used as Example 2.
＜実施例３＞
液状ポリブタジエン３０質量部と液状ブテン７０質量部との混合物を液状ポリマーとしたことを除いて実施例１と同様にして調製した熱伝導性パテ組成物を実施例３とした。
<Example 3>
A heat conductive putty composition prepared in the same manner as in Example 1 except that a mixture of 30 parts by weight of liquid polybutadiene and 70 parts by weight of liquid butene was used as a liquid polymer was used as Example 3.
＜実施例４＞
液状ポリブタジエン７０質量部と液状ブテン３０質量部との混合物を液状ポリマーとしたことを除いて実施例１と同様にして調製した熱伝導性パテ組成物を実施例４とした。
<Example 4>
A heat conductive putty composition prepared in the same manner as in Example 1 except that a mixture of 70 parts by weight of liquid polybutadiene and 30 parts by weight of liquid butene was used as a liquid polymer was used as Example 4.
＜実施例５＞
液状ポリブタジエン１００質量部を液状ポリマーとしたことを除いて実施例１と同様にして調製した熱伝導性パテ組成物を実施例５とした。
<Example 5>
A thermally conductive putty composition prepared in the same manner as in Example 1 except that 100 parts by mass of liquid polybutadiene was used as a liquid polymer was used as Example 5.
＜実施例６＞
液状ポリブタジエン１００質量部を液状ポリマーとしたことを除いて実施例２と同様にして調製した熱伝導性パテ組成物を実施例６とした。
<Example 6>
A heat conductive putty composition prepared in the same manner as in Example 2 except that 100 parts by mass of liquid polybutadiene was used as a liquid polymer was used as Example 6.
＜実施例７＞
水酸化アルミニウムとして、水酸化アルミニウムＺのみを液状ポリマー１００質量部に対して５００質量部配合したことを除いて実施例５と同様にして調製した熱伝導性パテ組成物を実施例７とした。
<Example 7>
A heat conductive putty composition prepared in the same manner as in Example 5 except that 500 parts by mass of aluminum hydroxide Z alone was blended with respect to 100 parts by mass of the liquid polymer as aluminum hydroxide was used as Example 7.
＜比較例１＞
ベントナイトを配合していないことを除いて実施例１と同様にして調製した熱伝導性パテ組成物を比較例１とした。
<Comparative Example 1>
A thermally conductive putty composition prepared in the same manner as in Example 1 except that bentonite was not blended was used as Comparative Example 1.
＜比較例２＞
水酸化アルミニウムを配合していないことを除いて実施例１と同様にして調製した熱伝導性パテ組成物を比較例２とした。
<Comparative Example 2>
A thermally conductive putty composition prepared in the same manner as in Example 1 except that aluminum hydroxide was not blended was used as Comparative Example 2.
（試験方法）
＜加工性＞
実施例１〜７及び比較例１〜２のそれぞれについて、押出機により押出し成形し、厚さ３ｍｍの熱伝導性シートが得られた場合をＡ判定とし、得られなかった場合をＢ判定とした。
(Test method)
<Workability>
Each of Examples 1 to 7 and Comparative Examples 1 and 2 was extruded by an extruder, and a case where a heat conductive sheet having a thickness of 3 mm was obtained was determined as A, and a case where it was not obtained was determined as B. .
＜熱伝導度＞
実施例１〜７及び比較例１〜２のそれぞれについて、ＪＩＳ Ｈ７９０３：２００８に準じて、一方向熱流定常比較法（ＳＣＨＦ）により熱伝導度（測定温度：３３℃）を測定した。
<Thermal conductivity>
For each of Examples 1 to 7 and Comparative Examples 1 and 2, the thermal conductivity (measuring temperature: 33 ° C.) was measured by the one-way steady-state heat flow comparison method (SCHF) according to JIS H7903: 2008.
＜軟度＞
実施例１〜７及び比較例１〜２のそれぞれについて、ＪＩＳ Ａ５７５２：１９９４に準じて、軟度の指標として針入量（測定温度：２３±３℃）を測定した。
<Softness>
For each of Examples 1 to 7 and Comparative Examples 1 and 2, the penetration amount (measurement temperature: 23 ± 3 ° C.) was measured as an index of softness according to JIS A5752: 1994.
（試験結果）
試験結果を表２に示す。
(Test results)
Table 2 shows the test results.
表２によれば、実施例１〜７は、厚さ３ｍｍの熱伝導性シートが得られるとともに、熱伝導度及び軟度のいずれも高い水準であることが分かる。一方、比較例１は、厚さ３ｍｍの熱伝導性シートが得られず、熱伝導度及び軟度のいずれも測定すらできなかった。比較例２は、厚さ３ｍｍの熱伝導性シートが得られ、十分な軟度を有するものの、熱伝導度の水準が低いことが分かる。 According to Table 2, in Examples 1 to 7, a heat conductive sheet having a thickness of 3 mm was obtained, and it was found that both the heat conductivity and the softness were at a high level. On the other hand, in Comparative Example 1, a heat conductive sheet having a thickness of 3 mm was not obtained, and neither the heat conductivity nor the softness could be measured. In Comparative Example 2, a heat conductive sheet having a thickness of 3 mm was obtained, and although it had sufficient softness, it was found that the level of heat conductivity was low.
本発明は、熱伝導性パテ組成物、並びにそれを用いた熱伝導性シート及び電池モジュールについて有用である。 INDUSTRIAL APPLICABILITY The present invention is useful for a thermally conductive putty composition, and a thermally conductive sheet and a battery module using the same.
１０ 二次電池モジュール
１１ モジュール本体
１１１ 二次電池
１１２ 電池ホルダー
１１２ａ 電池保持部
１１２ｂ 丸孔
１２ 熱伝導性シート
DESCRIPTION OF
Claims (7)
前記液状ポリマーが、液状ポリブタジエン、又は、液状ポリブタジエンと液状ポリブテンとの混合物を含む熱伝導性パテ組成物。 The thermally conductive putty composition according to claim 1,
A thermally conductive putty composition, wherein the liquid polymer comprises liquid polybutadiene or a mixture of liquid polybutadiene and liquid polybutene.
前記水酸化アルミニウムの平均粒径が０．５μｍ以上１００μｍ以下である熱伝導性パテ組成物。 The heat conductive putty composition according to claim 1 or 2,
A thermally conductive putty composition wherein the average particle size of the aluminum hydroxide is 0.5 μm or more and 100 μm or less.
前記水酸化アルミニウムの粒度分布が複数のピークを有する熱伝導性パテ組成物。 The thermally conductive putty composition according to any one of claims 1 to 3,
A thermally conductive putty composition wherein the particle size distribution of the aluminum hydroxide has a plurality of peaks.
前記ベントナイトが、交換性塩基が有機アミンで置換されて有機化処理された有機ベントナイトを含む熱伝導性パテ組成物。 The thermally conductive putty composition according to any one of claims 1 to 4,
A thermally conductive putty composition, wherein the bentonite comprises an organic bentonite in which an exchangeable base is replaced with an organic amine and the organic bentonite is treated.
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| JP2018178763A JP7075323B2 (en) | 2018-09-25 | 2018-09-25 | Thermally conductive putty composition, and thermally conductive sheet and battery module using it |
| TW108133520A TW202022083A (en) | 2018-09-25 | 2019-09-18 | Thermoconductive putty composition, and thermoconductive sheet and heat dissipation structure in which same is used |
| PCT/JP2019/036468 WO2020066766A1 (en) | 2018-09-25 | 2019-09-18 | Thermoconductive putty composition, and thermoconductive sheet and heat dissipation structure in which same is used |
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