JP2020043153A - Electronic component transfer device and electronic component transfer method - Google Patents

Electronic component transfer device and electronic component transfer method Download PDF

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JP2020043153A
JP2020043153A JP2018167416A JP2018167416A JP2020043153A JP 2020043153 A JP2020043153 A JP 2020043153A JP 2018167416 A JP2018167416 A JP 2018167416A JP 2018167416 A JP2018167416 A JP 2018167416A JP 2020043153 A JP2020043153 A JP 2020043153A
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nozzle
electronic component
distance
camera
component
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JP7164365B2 (en
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敬宏 古賀
Takahiro Koga
敬宏 古賀
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New Japan Radio Co Ltd
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Abstract

To suck an electronic component by moving a nozzle by an appropriate amount of movement following the variation in the thickness of the electronic components and the wear of the nozzle, and measure an appropriate nozzle-to-component distance of the nozzle to the electronic component in a short time to achieve high production capacity.SOLUTION: Nozzles 1 and 2 and an electronic component 4 illuminated by an illuminating device 10 are photographed by a camera 6 from the side and a nozzle-component distance L from the tip of the nozzle 2 to a suction portion of the electronic component 4 is measured on the basis of the obtained image, and the amount of movement of the nozzle 2 is controlled on the basis of the distance L. It is preferable that the measurement of the distance L is performed for each single transfer or for each multiple transfer, and the image is measured as a binarized image. At the time of start-up or the like, the area of the electronic component 4 in the image is measured, and the position of the nozzle 1, 2 or the camera 6 is adjusted such that the area is minimized.SELECTED DRAWING: Figure 1

Description

本発明は電子部品搬送装置及び電子部品搬送方法、特に半導体チップ等の電子部品をノズルに吸着して搬送する搬送装置及び搬送方法に関する。   The present invention relates to an electronic component transport apparatus and an electronic component transport method, and more particularly to a transport apparatus and a transport method for attracting and transporting electronic components such as semiconductor chips by nozzles.

従来の電子部品等の製造では、半導体チップ等の電子部品をノズルに吸着して搬送することが行われる。   2. Description of the Related Art In the manufacture of conventional electronic components and the like, electronic components such as semiconductor chips are suctioned to nozzles and transported.

図５に、例えばエンボステーピング装置での電子部品の搬送が示されており、図５のピックアップノズル１と搬送ノズル２は、バキュームポンプ（吸引装置）に接続される。図５（Ａ）のように、ピックアップノズル１は、ダイシング済のウェハー３から個片化された電子部品（例えば半導体チップ）４を先端に吸着してピックアップすると、図５（Ｂ）のように、下向きから上向きに反転した後、電子部品４は上方から下降した搬送ノズル２に受け渡される。
そして、図５（Ｃ）のように、搬送ノズル２に吸着保持された電子部品４は、エンボスキャリアテープのポケット５まで搬送され、その中に挿入される。 FIG. 5 shows, for example, the transport of electronic components by an emboss taping device. The pickup nozzle 1 and the transport nozzle 2 in FIG. 5 are connected to a vacuum pump (suction device). As shown in FIG. 5A, the pickup nozzle 1 picks up an electronic component (for example, a semiconductor chip) 4 that has been singulated from the diced wafer 3 by picking it up at the tip, as shown in FIG. 5B. After the electronic component 4 is inverted from the downward direction to the upward direction, the electronic component 4 is delivered to the transport nozzle 2 descending from above.
Then, as shown in FIG. 5C, the electronic component 4 sucked and held by the transfer nozzle 2 is transferred to the pocket 5 of the embossed carrier tape and inserted therein.

特許６２６１１６３号公報Japanese Patent No. 6261163 特開平１１−１０２９３６号公報JP-A-11-102936 特開２０１７−１５７７６６号公報JP 2017-157766 A

ところで、従来の電子部品搬送において、図５（Ｂ）のように、ピックアップノズル１に保持した電子部品４を搬送ノズル２に受け渡しする際に、搬送ノズル２が下降する移動量（下降の高さ）が適切に設定される必要がある。   By the way, in the conventional electronic component transport, as shown in FIG. 5B, when the electronic component 4 held by the pickup nozzle 1 is transferred to the transport nozzle 2, the moving amount of the transport nozzle 2 descending (the descending height). ) Needs to be set appropriately.

例えば、図６（Ａ）に示されるように、搬送ノズル２の下降の移動量が適切な量より大きい場合は電子部品４が破損したり、電子部品４にダメージを与えたりし、図６（Ｂ）に示されるように、搬送ノズル２の下降の移動量が小さい場合は電子部品４が落下したりして受け渡しミスが発生するという問題があった。   For example, as shown in FIG. 6A, when the moving amount of the downward movement of the transport nozzle 2 is larger than an appropriate amount, the electronic component 4 is damaged or the electronic component 4 is damaged, and As shown in (B), when the moving amount of the downward movement of the transport nozzle 2 is small, there is a problem that the electronic component 4 falls or a delivery error occurs.

一方、従来の電子部品搬送での搬送ノズル２の下降の高さは、予め計測により決定されており、例えばバキュームポンプ側に吸引量を検知するバキュームセンサーを設け、受け渡し時にこのバキュームセンサーで所定の吸引力（吸着に必要な力）が検知される位置に設定される。   On the other hand, the height of the lowering of the transfer nozzle 2 in the conventional electronic component transfer is determined in advance by measurement, and for example, a vacuum sensor for detecting the suction amount is provided on the vacuum pump side, and a predetermined amount is provided by the vacuum sensor at the time of delivery. It is set at a position where a suction force (a force required for suction) is detected.

図７には、ノズル下降の高さの自動調整方法の様子が示されており、この自動調整方法は、搬送ノズル２を１パルスずつ下降させて、バキュームセンサーが所定の吸引力を検知（ＯＮ）したときに、下降の高さを自動的に確定するようになっている。   FIG. 7 shows a state of an automatic adjusting method of the nozzle descent height. In this automatic adjusting method, the conveying nozzle 2 is lowered one pulse at a time, and the vacuum sensor detects a predetermined suction force (ON). ), The height of the descent is automatically determined.

また、その他には、ノズル下降の高さを拡大鏡等を用いて目視の確認で決めたり、受け渡し時に電子部品に掛かる荷重をノズルにより検知して決めたりすることが行われる。   In addition, the height of the nozzle descent is determined by visual confirmation using a magnifying glass or the like, or the load applied to the electronic component at the time of delivery is detected and determined by the nozzle.

しかしながら、上記の下降の高さの決定方法では、搬送する電子部品４の厚みのバラツキやノズル１，２の摩耗に追従することができず、下降の高さの調整を頻繁にする必要が生じる。しかも、この調整には時間がかかるという問題がある。   However, the above-described method of determining the descending height cannot follow variations in the thickness of the electronic component 4 to be conveyed and wear of the nozzles 1 and 2, and it is necessary to adjust the descending height frequently. . In addition, there is a problem that this adjustment takes time.

また、図７で説明したような、ノズル２を１パルスずつ下降させる自動調整を電子部品２の搬送毎に行うことも可能であるが、この自動調整には、１電子部品の搬送につき数秒〜数十秒かかるため、装置の能力、生産能力が低下することになる。   Further, the automatic adjustment for lowering the nozzle 2 one pulse at a time as described with reference to FIG. 7 can also be performed every time the electronic component 2 is transported. Since it takes several tens of seconds, the capacity of the apparatus and the production capacity are reduced.

本発明は上記問題点に鑑みてなされたものであり、その目的は、電子部品の厚みのバラツキやノズルの摩耗に追従した適切な移動量でノズルを移動させて電子部品を吸着することができ、また電子部品に対するノズルの適切なノズル−部品間距離を短時間に測定して高い生産能力を実現する電子部品搬送装置及び電子部品搬送方法を提供することにある。   The present invention has been made in view of the above problems, and an object of the present invention is to make it possible to adsorb an electronic component by moving a nozzle by an appropriate movement amount that follows variations in the thickness of the electronic component and wear of the nozzle. It is another object of the present invention to provide an electronic component transport apparatus and an electronic component transport method which realize a high production capacity by measuring an appropriate nozzle-component distance of a nozzle with respect to an electronic component in a short time.

上記目的を達成するために、請求項１の発明は、電子部品をノズルに吸着して搬送する電子部品搬送装置において、上記ノズル及び電子部品を側面方向から撮影するカメラと、このカメラで得られた画像に基づき上記ノズルの先端から上記電子部品の吸着部までのノズル−部品間距離を測定する計測部と、この計測部で測定されたノズル−部品間距離に基づいて上記ノズルの移動量を制御する制御部と、を設けたことを特徴とする。
請求項２の発明に係る電子部品搬送装置は、上記計測部では、上記電子部品の１搬送毎又は複数搬送毎に上記ノズル−部品間距離を測定し、上記制御部では１搬送毎又は複数搬送毎に得られたノズル−部品間距離にて上記ノズルの移動量を調整することを特徴とする。
請求項３の発明に係る電子部品搬送装置は、上記計測部では、上記カメラで得られた画像の上記電子部品の面積を測定し、上記制御部では上記電子部品の面積が最小となるように上記電子部品又はカメラの位置を調整することを特徴とする。
請求項４の発明に係る電子部品搬送装置は、上記カメラによる撮影時に上記ノズル及び電子部品を照らす照明装置を設け、上記計測部では、撮影された画像の上記ノズル若しくは電子部品のエッジ強度又は上記ノズル若しくは電子部品と背景のコントラストを測定し、上記コントラスト又はエッジ強度が所定の状態になるように上記照明装置の照度を調整することを特徴とする。
請求項５の発明に係る電子部品搬送装置は、上記カメラで撮影した二値化した画像により、上記計測部でノズル−部品間距離の測定を行うことを特徴とする。 In order to achieve the above object, the invention of claim 1 provides an electronic component transporting apparatus that transports an electronic component by suctioning the nozzle to a nozzle, and a camera for photographing the nozzle and the electronic component from a side direction, and a camera obtained by the camera. A measuring unit that measures the distance between the nozzle and the component from the tip of the nozzle to the suction part of the electronic component based on the image obtained by the nozzle, and the movement amount of the nozzle based on the distance between the nozzle and the component measured by the measuring unit. And a control unit for controlling.
In the electronic component transport device according to the invention of claim 2, the measuring unit measures the distance between the nozzle and the component for each one or a plurality of transports of the electronic component, and the control unit transports the nozzle for each or a plurality of transports. The amount of movement of the nozzle is adjusted based on the nozzle-to-part distance obtained for each.
In the electronic component transport device according to the third aspect of the present invention, the measuring unit measures an area of the electronic component in an image obtained by the camera, and the control unit minimizes an area of the electronic component. The position of the electronic component or the camera is adjusted.
The electronic component transporting device according to a fourth aspect of the present invention is provided with an illuminating device that illuminates the nozzle and the electronic component when the image is captured by the camera. The contrast of the nozzle or the electronic component and the background is measured, and the illuminance of the illuminating device is adjusted so that the contrast or the edge strength is in a predetermined state.
According to a fifth aspect of the present invention, there is provided the electronic component transport device, wherein the measurement unit measures the distance between the nozzle and the component based on the binarized image captured by the camera.

請求項６の発明は、電子部品をノズルに吸着して搬送する電子部品搬送方法において、カメラで上記ノズル及び電子部品を側面方向から撮影し、撮影された画像に基づき上記ノズルの先端から上記電子部品の吸着部までのノズル−部品間距離を上記電子部品の１搬送毎又は複数搬送毎に測定し、測定されたノズル−部品間距離に基づいて上記ノズルの移動量を制御することを特徴とする。
請求項７の発明に係る電子部品搬送方法は、上記カメラで得られた画像の上記電子部品の面積を測定し、この面積が最小となるように上記電子部品又はカメラの位置を調整した後、上記ノズル−部品間距離を測定することを特徴とする。 According to a sixth aspect of the present invention, in the electronic component transporting method for transporting an electronic component by attracting the nozzle to the nozzle, the camera captures the nozzle and the electronic component from a lateral direction, and the electronic component is moved from the tip of the nozzle based on the captured image. The distance between the nozzle and the component to the suction part of the component is measured for each one or a plurality of conveyances of the electronic component, and the amount of movement of the nozzle is controlled based on the measured distance between the nozzle and the component. I do.
The electronic component transport method according to claim 7 measures the area of the electronic component in the image obtained by the camera, and after adjusting the position of the electronic component or the camera so that the area is minimized, The nozzle-to-part distance is measured.

上記の構成によれば、カメラ画像に基づきノズルの先端から電子部品の吸着部までのノズル−部品間距離が測定され、このノズル−部品間距離に基づいてノズルの移動量が制御されるので、ノズルによる電子部品の吸着・保持が短時間かつ簡単に行われる。
しかも、このノズル−部品間距離の測定を立上げ時だけでなく、電子部品の１搬送毎又は複数搬送毎に行うことで、より正確なノズル動作が可能となる。 According to the above configuration, the distance between the nozzle and the component from the tip of the nozzle to the suction part of the electronic component is measured based on the camera image, and the amount of movement of the nozzle is controlled based on the distance between the nozzle and the component. Suction and holding of the electronic component by the nozzle can be performed easily in a short time.
In addition, by performing the measurement of the distance between the nozzle and the component not only at the time of startup, but also for each one or a plurality of conveyances of the electronic component, a more accurate nozzle operation can be performed.

また、立ち上げ時又は調整時に、カメラ画像の電子部品の面積を測定し、この面積が最小となるように電子部品又はカメラの位置を調整すれば、電子部品の吸着面の位置を側面方向から正確に撮影することができ、ノズル−部品間距離の測定精度の低下がなくなる。
また、照明装置にてノズル及び電子部品を照らすようにすれば、明暗のある画像を撮影でき、更には撮影した画像を二値化することによって、ノズル及び電子部品の陰影やエッジが明確となる。この照明においては、ノズル又は電子部品のエッジ強度やノズル又は電子部品と背景のコントラスト（明るさの差）によって、照度を調節することにより、ノズル−部品間距離の測定精度を向上させることができる。 Also, at the time of start-up or adjustment, if the area of the electronic component in the camera image is measured and the position of the electronic component or the camera is adjusted so that this area is minimized, the position of the suction surface of the electronic component can be changed from the side. Accurate photographing can be performed, and the measurement accuracy of the distance between the nozzle and the component does not decrease.
Further, if the nozzle and the electronic component are illuminated by the lighting device, a bright and dark image can be photographed, and furthermore, the binarized image can make the shadows and edges of the nozzle and the electronic component clear. . In this illumination, the measurement accuracy of the distance between the nozzle and the component can be improved by adjusting the illuminance according to the edge strength of the nozzle or the electronic component or the contrast (brightness difference) between the nozzle or the electronic component and the background. .

本発明によれば、電子部品の厚さのバラツキやノズルの摩耗に追従した適切な移動量でノズルを移動させ、電子部品を確実に吸着することができるので、電子部品にダメージを与えることがなく、電子部品の受け渡しミスの発生も防止することが可能となる。
また、電子部品に対するノズルの適切なノズル−部品間距離を短時間に測定することができ、装置の能力を高め、かつ高い生産能力を実現することが可能となる。 ADVANTAGE OF THE INVENTION According to this invention, since a nozzle can be moved by an appropriate movement amount following the thickness variation of an electronic component and the abrasion of a nozzle, and an electronic component can be reliably adsorbed, it can damage an electronic component. In addition, it is possible to prevent the occurrence of an electronic component delivery error.
In addition, it is possible to measure an appropriate nozzle-to-part distance of the nozzle with respect to the electronic part in a short time, and it is possible to increase the capacity of the apparatus and realize a high production capacity.

本発明の実施例に係る電子部品搬送装置の構成を示す図である。FIG. 1 is a diagram illustrating a configuration of an electronic component transport device according to an embodiment of the present invention. 実施例の電子部品及びノズルとカメラの配置［図（Ａ）］、電子部品の受け渡し時の様子［図（Ｂ）］を示す図である。It is a figure which shows the arrangement | positioning of the electronic component of Example, a nozzle, and a camera (FIG. (A)), and the state at the time of delivery of an electronic component (FIG. (B)). 実施例の電子部品搬送装置で得られる二値化画像を示す図である。FIG. 5 is a diagram illustrating a binarized image obtained by the electronic component transport device according to the embodiment. 実施例の電子部品搬送装置の動作を示す説明図である。FIG. 5 is an explanatory diagram illustrating an operation of the electronic component transport device according to the embodiment. 従来の搬送装置での電子部品の搬送の様子を示す説明図である。It is an explanatory view showing a state of conveyance of an electronic component in a conventional conveyance device. 従来の搬送装置での電子部品の受渡し時の様子を示す説明図である。It is an explanatory view showing a situation at the time of delivery of electronic parts in a conventional conveyance device. 従来の搬送装置での搬送ノズルの下降の高さを決めるときの動作を示す説明図である。It is an explanatory view showing an operation when determining the height of descent of a transport nozzle in a conventional transport device.

図１に、実施例の電子部品搬送装置の構成が示されており、図の符号の１は第１ノズル（ピックアップノズル）、２は第２ノズル（搬送ノズル）、４は電子部品で、この図１では、図５で説明したように、第１ノズル１が吸着した電子部品４を反転させ、第２ノズル２にて電子部品４を受け渡すときの状態を示している。   FIG. 1 shows the configuration of an electronic component transport apparatus according to an embodiment. In the figure, reference numeral 1 denotes a first nozzle (pickup nozzle), 2 denotes a second nozzle (transport nozzle), and 4 denotes an electronic component. FIG. 1 shows a state in which the electronic component 4 sucked by the first nozzle 1 is turned over and the electronic component 4 is delivered by the second nozzle 2 as described with reference to FIG.

図１において、符号の６は第１及び第２ノズル１，２及び電子部品４を側面（第２ノズル２が下降する軌道に垂直な方向）から撮影するカメラ、７は計測部であり、上記カメラ６は、電子的な画像データを得る撮像素子（イメージセンサ）等を用いて構成される。上記計測部７は、カメラ６で撮像された画像に基づき、詳細は後述するが、ノズル−部品間距離、電子部品４の面積、第１及び第２ノズル１，２や電子部品４のエッジ強度、ノズル１，２や電子部品４と背景のコントラスト等を画像処理により測定する。   In FIG. 1, reference numeral 6 denotes a camera for photographing the first and second nozzles 1 and 2 and the electronic component 4 from the side (in a direction perpendicular to the trajectory where the second nozzle 2 descends), and 7 denotes a measuring unit. The camera 6 is configured using an image sensor (image sensor) for obtaining electronic image data. The measuring unit 7 is based on an image captured by the camera 6, and will be described in detail later. However, the distance between the nozzle and the component, the area of the electronic component 4, the edge strength of the first and second nozzles 1 and 2 and the electronic component 4 , The contrast between the nozzles 1 and 2 and the electronic component 4 and the background are measured by image processing.

符号の８，９は、第１ノズル１、第２ノズル２を駆動する駆動部であり、駆動部８により第１ノズル１は、例えば先端に電子部品４を吸着して１８０度反転し、カメラ６を設置した受け渡しを行う位置に移動する。一方、駆動部９により、第２ノズル２は第１ノズル１から電子部品４を受け取り、エンボステープまで移動する。また、これら駆動部８，９にはバキュームポンプ等からなる吸引装置が含まれ、これによって第１ノズル１、第２ノズル２の先端部にて電子部品４を吸着し保持できるようになっている。   Reference numerals 8 and 9 denote driving units for driving the first nozzle 1 and the second nozzle 2, and the driving unit 8 inverts the first nozzle 1 by, for example, adsorbing the electronic component 4 at the tip and inverting it 180 degrees. 6 is moved to the position where delivery is performed. On the other hand, the second nozzle 2 receives the electronic component 4 from the first nozzle 1 by the driving unit 9 and moves to the embossed tape. In addition, these driving units 8 and 9 include a suction device such as a vacuum pump or the like, so that the electronic components 4 can be sucked and held by the distal ends of the first nozzle 1 and the second nozzle 2. .

図１の符号の１０は、第１ノズル１、第２ノズル２及び電子部品４を側面から照らす照明装置で、面発光となるエッジライト型照明、ダイレクト型に拡散板を組み合わせた照明、有機ＥＬ照明等が使用される。そして、制御部１２は、第１ノズル１、第２ノズル２の駆動制御、照明装置１０の制御、計測部７で得られた測定データに基づく各種の制御を実行する。或いはさらに、カメラ６の位置を制御するように構成してもよい。   Reference numeral 10 in FIG. 1 denotes an illumination device that illuminates the first nozzle 1, the second nozzle 2, and the electronic component 4 from the side surface, and includes an edge light type illumination that emits surface light, a direct type illumination combined with a diffusion plate, and an organic EL. Lighting or the like is used. Then, the control unit 12 performs drive control of the first nozzle 1 and the second nozzle 2, control of the illumination device 10, and various controls based on the measurement data obtained by the measurement unit 7. Alternatively, the position of the camera 6 may be controlled.

実施例は以上の構成からなり、以下にその動作を説明する。
図２（Ａ）に、第１ノズル１で電子部品４を反転させたときの状態が示されており、このときの状態はその側面からカメラ６にて撮影される。
このときの第１ノズル１、第２ノズル２及び電子部品４は、カメラ６の反対側に配置した照明装置１０で照らされており、これによって各部材の輪郭（エッジ）を明確に写し出せるようになっている。 The embodiment has the above configuration, and its operation will be described below.
FIG. 2A shows a state when the electronic component 4 is inverted by the first nozzle 1, and the state at this time is photographed by the camera 6 from the side.
At this time, the first nozzle 1, the second nozzle 2, and the electronic component 4 are illuminated by the illumination device 10 arranged on the opposite side of the camera 6, so that the outline (edge) of each member can be clearly displayed. It has become.

図３には、カメラ６で得られる白黒の２値化画像を示しており、第１及び第２ノズル１，２及び電子部品４の陰影やエッジを明瞭にした上で、各種の測定を行うことができる。
上述のように、カメラ６で撮影された画像（データ）を入力した計測部７は、電子部品４の上面（吸着面）と第２ノズル２の先端との距離（ノズル−部品間距離）Ｌを測定し、この距離Ｌのデータを制御部１２へ供給することにより、制御部１２では下降すべき移動量（距離、下降の高さ）にて、図２（Ｂ）のように第２ノズル２を下降させ、電子部品４を吸着する。 FIG. 3 shows a black-and-white binary image obtained by the camera 6, and performs various measurements after clarifying the shadows and edges of the first and second nozzles 1 and 2 and the electronic component 4. be able to.
As described above, the measuring unit 7 to which the image (data) photographed by the camera 6 is input, sets the distance (nozzle-component distance) L between the upper surface (adsorption surface) of the electronic component 4 and the tip of the second nozzle 2. Is measured, and the data of the distance L is supplied to the control unit 12, so that the control unit 12 determines the amount of movement (distance, height of descent) to be lowered by the second nozzle as shown in FIG. Then, the electronic component 4 is sucked.

実施例では、このようなノズル−部品間距離Ｌの測定を１つの電子部品の１搬送毎に行っており、１搬送毎に得られた距離データに基づいて第２ノズル２の下降距離（下降の高さ）を制御・駆動することで、電子部品４の受け渡しミス等をなくすことができる。
カメラ６にイメージセンサを用いた場合、１電子部品の搬送につき、数十ｍｓｅｃの時間で測定が可能であり、１搬送毎の計測でも装置の能力を低下させることはない。なお、このノズル−部品間距離Ｌの計測は、電子部品４の所定数の搬送毎に実行するようにしてもよい。 In the embodiment, such a measurement of the nozzle-component distance L is performed for each transport of one electronic component, and the descending distance (the descending distance) of the second nozzle 2 is determined based on the distance data obtained for each transport. By controlling and driving the height of the electronic component 4, it is possible to eliminate a mistake in delivery of the electronic component 4.
When an image sensor is used for the camera 6, measurement can be performed in several tens of msec for transporting one electronic component, and measurement of each transport does not reduce the performance of the apparatus. The measurement of the nozzle-component distance L may be performed every time a predetermined number of electronic components 4 are conveyed.

次に、計測の精度を向上・維持させるために、装置の立上げ時又は調整時に行う動作を図４に基づいて説明する。
図４（Ａ）は、カメラ６で得られた画像から電子部品４の面積を測定し、この電子部品４の面積が最小となるように第１ノズル１を上下移動させ、電子部品４の位置を調整するものである。図４（Ａ）の左側のように電子部品４が傾いて表示される場合は、カメラ６が電子部品４の斜め上方から撮影している状態となっている。そこで、第１ノズル１を上方へ移動させ、図４（Ａ）の右側のように表示されるように調整する。なお、第１ノズル１の移動の代わりに、カメラ６を上下移動可能に構成してカメラ６側を移動させるようにしてもよい。 Next, an operation performed when starting up or adjusting the apparatus in order to improve and maintain the accuracy of measurement will be described with reference to FIG.
FIG. 4A shows an example in which the area of the electronic component 4 is measured from the image obtained by the camera 6 and the first nozzle 1 is moved up and down so that the area of the electronic component 4 is minimized. Is to adjust. When the electronic component 4 is displayed in an inclined manner as shown on the left side of FIG. 4A, the camera 6 is capturing an image from obliquely above the electronic component 4. Therefore, the first nozzle 1 is moved upward and adjusted so as to be displayed as shown on the right side of FIG. Note that, instead of moving the first nozzle 1, the camera 6 may be configured to be able to move up and down so as to move the camera 6 side.

図４（Ｂ）は、カメラ６で得られた画像の第１ノズル１、電子部品４等のエッジ強度を測定し、このエッジ強度が所定の状態になるように照明装置１０の照度を調整するものである。図４（Ｂ）の左側のように、第１ノズル１、電子部品４のエッジが不鮮明の場合には、図４（Ｂ）の右側のようにエッジが鮮明となる。
図４（Ｃ）は、カメラ６で得られた画像の第１ノズル１、電子部品４等と背景のコントラストを測定し、コントラスト（明るさの差）が良好となる所定の値となるように照明装置１０の照度を調整するものである。図４（Ｂ）の左側のように、第１ノズル１、電子部品４のコントラストが低い場合でも、図４（Ｂ）の右側のようにコントラストが高くなる。 FIG. 4B measures the edge intensity of the first nozzle 1, the electronic component 4, and the like of the image obtained by the camera 6, and adjusts the illuminance of the illumination device 10 so that the edge intensity is in a predetermined state. Things. When the edge of the first nozzle 1 and the electronic component 4 is unclear as shown on the left side of FIG. 4B, the edge becomes sharp as shown on the right side of FIG. 4B.
FIG. 4 (C) measures the contrast between the first nozzle 1, the electronic component 4, etc. of the image obtained by the camera 6 and the background, and adjusts the contrast (brightness difference) to a predetermined value at which the contrast is good. The illuminance of the illumination device 10 is adjusted. Even when the contrast of the first nozzle 1 and the electronic component 4 is low as shown on the left side of FIG. 4B, the contrast becomes high as shown on the right side of FIG. 4B.

図４（Ｄ）は、治具を使って画像の寸法の確からしさを検証する状態を示している。図４（Ｄ）のように、第２ノズル２等に校正寸法を有する治具１４を装着し、得られた画像の治具１４の寸法Ｒを測定し、実際の治具寸法との相関を確認することができる。これにより、計測されるノズル−部品間距離Ｌの確からしさを検証し、校正・調整することが可能となる。   FIG. 4D shows a state in which the accuracy of the dimensions of the image is verified using a jig. As shown in FIG. 4D, a jig 14 having a calibrated dimension is attached to the second nozzle 2 or the like, the dimension R of the jig 14 in the obtained image is measured, and the correlation with the actual jig dimension is determined. You can check. This makes it possible to verify the accuracy of the measured distance L between the nozzle and the component, and perform calibration and adjustment.

図４（Ｅ）は、第２ノズル２等を移動させて画像の寸法の確からしさを検証する状態が示されており、図４（Ｅ）のように、第２ノズル２を予め決められた距離だけ移動させ、得られた画像から測定された距離Ｌ０と実際の距離との相関を確認する。これによっても、計測されるノズル−部品間距離Ｌの確からしさを検証し、校正・調整することが可能となる。 FIG. 4E shows a state in which the second nozzle 2 and the like are moved to verify the certainty of the image size. As shown in FIG. 4E, the second nozzle 2 is determined in advance. distance moved, to check the correlation between the actual distance and the distance L 0 measured from the obtained image. This also makes it possible to verify, calibrate, and adjust the likelihood of the measured nozzle-part distance L.

図３では、画像を２値化画像として計測を行うことを説明したが、通常の画像でノズル−部品間距離等の測定を行ってもよい。   In FIG. 3, the measurement is performed using the image as a binarized image. However, the measurement of the distance between the nozzle and the component may be performed using a normal image.

１…第１ノズル（又はピックアップノズル）、
２…第２ノズル（又は搬送ノズル）、
４…電子部品、 ６…カメラ、
７…計測部、 ８，９…駆動部、
１０…照明装置、 １２…制御部、
１４…治具。 1. 1st nozzle (or pickup nozzle),
2nd nozzle (or transport nozzle)
4 ... Electronic components 6 ... Cameras
7… Measurement unit, 8, 9… Drive unit,
10 lighting device 12 control unit
14 ... Jig.

Claims (7)

電子部品をノズルに吸着して搬送する電子部品搬送装置において、
上記ノズル及び電子部品を側面方向から撮影するカメラと、
このカメラで得られた画像に基づき上記ノズルの先端から上記電子部品の吸着部までのノズル−部品間距離を測定する計測部と、
この計測部で測定されたノズル−部品間距離に基づいて上記ノズルの移動量を制御する制御部と、を設けたことを特徴とする電子部品搬送装置。 In an electronic component transport device that sucks and transports electronic components to a nozzle,
A camera for photographing the nozzle and the electronic component from a side direction,
A measuring unit for measuring a distance between the nozzle and the component from the tip of the nozzle to the suction unit of the electronic component based on an image obtained by the camera,
An electronic component transport device, comprising: a control unit that controls the amount of movement of the nozzle based on the distance between the nozzle and the component measured by the measurement unit. 上記計測部は、上記電子部品の１搬送毎又は複数搬送毎に上記ノズル−部品間距離を測定し、上記制御部では１搬送毎又は複数搬送毎に得られたノズル−部品間距離にて上記ノズルの移動量を調整することを特徴とする請求項１記載の電子部品搬送装置。   The measuring unit measures the distance between the nozzle and the component for each one or a plurality of conveyances of the electronic component, and the control unit calculates the distance between the nozzle and the component obtained for each one or a plurality of conveyances. 2. The electronic component conveying device according to claim 1, wherein the moving amount of the nozzle is adjusted. 上記計測部は、上記カメラで得られた画像の上記電子部品の面積を測定し、上記制御部では上記電子部品の面積が最小となるように上記電子部品又はカメラの位置を調整することを特徴とする請求項１記載の電子部品搬送装置。   The measuring unit measures an area of the electronic component in an image obtained by the camera, and the control unit adjusts a position of the electronic component or the camera such that an area of the electronic component is minimized. The electronic component conveying device according to claim 1, wherein 上記カメラによる撮影時に上記ノズル及び電子部品を照らす照明装置を設け、
上記計測部では、撮影された画像の上記ノズル若しくは電子部品のエッジ強度又は上記ノズル若しくは電子部品と背景のコントラストを測定し、上記コントラスト又はエッジ強度が所定の状態になるように上記照明装置の照度を調整することを特徴とする請求項１記載の電子部品搬送装置。 Providing an illuminating device that illuminates the nozzle and electronic components when photographing with the camera,
The measuring unit measures the edge intensity of the nozzle or the electronic component or the contrast between the nozzle or the electronic component and the background of the captured image, and adjusts the illuminance of the illumination device so that the contrast or the edge intensity is in a predetermined state. 2. The electronic component conveying device according to claim 1, wherein the electronic component conveying device is adjusted. 上記カメラで撮影した二値化した画像により、上記計測部でノズル−部品間距離の測定を行うことを特徴とする請求項１乃至４のいずれかに記載の電子部品搬送装置。   The electronic component transport device according to claim 1, wherein the measurement unit measures the distance between the nozzle and the component based on the binarized image captured by the camera. 電子部品をノズルに吸着して搬送する電子部品搬送方法において、
カメラで上記ノズル及び電子部品を側面方向から撮影し、
撮影された画像に基づき上記ノズルの先端から上記電子部品の吸着部までのノズル−部品間距離を上記電子部品の１搬送毎又は複数搬送毎に測定し、
測定されたノズル−部品間距離に基づいて上記ノズルの移動量を制御することを特徴とする電子部品搬送方法。 In an electronic component transport method of sucking and transporting an electronic component to a nozzle,
Use a camera to shoot the nozzle and electronic components from the side,
The distance between the nozzle and the component from the tip of the nozzle to the suction part of the electronic component based on the captured image is measured for each transport or for each transport of the electronic component,
An electronic component conveying method, comprising: controlling a movement amount of the nozzle based on the measured nozzle-component distance. 上記カメラで得られた画像の上記電子部品の面積を測定し、この面積が最小となるように上記電子部品又はカメラの位置を調整した後、上記ノズル−部品間距離を測定することを特徴とする請求項６記載の電子部品搬送方法。   Measuring the area of the electronic component of the image obtained by the camera, adjusting the position of the electronic component or the camera so that this area is minimized, and then measuring the nozzle-component distance. 7. The electronic component conveying method according to claim 6, wherein:
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