JP2020027906A - Board mounting structure, mounting board, and voltage measurement unit - Google Patents

Board mounting structure, mounting board, and voltage measurement unit Download PDF

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Publication number
JP2020027906A
JP2020027906A JP2018152995A JP2018152995A JP2020027906A JP 2020027906 A JP2020027906 A JP 2020027906A JP 2018152995 A JP2018152995 A JP 2018152995A JP 2018152995 A JP2018152995 A JP 2018152995A JP 2020027906 A JP2020027906 A JP 2020027906A
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Prior art keywords
substrate
conductive plate
board
electronic component
mounting structure
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JP2018152995A
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JP6887974B2 (en
Inventor
光輝 柴田
Mitsuteru Shibata
光輝 柴田
宣明 河合
Yoshiaki Kawai
宣明 河合
拓人 鷹箸
Takuto Takahashi
拓人 鷹箸
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Yokogawa Electric Corp
Yokogawa Test and Measurement Corp
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Yokogawa Electric Corp
Yokogawa Test and Measurement Corp
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Priority to JP2018152995A priority Critical patent/JP6887974B2/en
Priority to CN201910680836.3A priority patent/CN110839317B/en
Publication of JP2020027906A publication Critical patent/JP2020027906A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

To provide a substrate mounting structure that can realize stable operation.SOLUTION: A board mounting structure includes an electronic component 11 having terminals 114a and 114b, a first conductive plate 12 connected to the terminals 114a and 114b and mounted on a substrate 20, and a second conductive plate 13 mounted on the substrate 20 while surrounding the terminals 114a and 114b at intervals, and the terminals 114a and 114b are arranged between the substrate 20 and the second conductive plate 13.SELECTED DRAWING: Figure 4

Description

本開示は、基板実装構造、実装基板、及び電圧測定部に関する。   The present disclosure relates to a board mounting structure, a mounting board, and a voltage measurement unit.

従来、端子を有する電子部品と、端子に接着されるとともに基板に実装される第１導電板と、を備える基板実装構造が知られている（例えば、特許文献１参照）。   2. Description of the Related Art Conventionally, a board mounting structure including an electronic component having terminals and a first conductive plate bonded to the terminals and mounted on a board is known (for example, see Patent Document 1).

特開２０１５−１２２１０号公報JP-A-2005-12210

特許文献１には、電子部品としての抵抗２と、第１導電板としての部品保持機構３と、が開示されている。このような基板実装構造によれば、第１導電板によって電子部品を基板に保持することができる。しかし、実装基板のより安定した動作を実現できる構造を提案できれば望ましい。   Patent Document 1 discloses a resistor 2 as an electronic component and a component holding mechanism 3 as a first conductive plate. According to such a substrate mounting structure, the electronic component can be held on the substrate by the first conductive plate. However, it is desirable to propose a structure that can realize more stable operation of the mounting board.

そこで、本開示は、安定した動作を実現できる基板実装構造、実装基板、及び電圧測定部を提供することにある。   Therefore, the present disclosure is to provide a board mounting structure, a mounting board, and a voltage measurement unit that can realize a stable operation.

幾つかの実施形態に係る基板実装構造は、端子を有する電子部品と、前記端子に接続されるとともに基板に実装される第１導電板と、前記端子を間隔を空けて包囲するとともに前記基板に実装される第２導電板と、を備える。
このように、第１導電板を電子部品の端子に接続するとともに基板に実装することにより、電子部品を基板に保持することができる。また、第２導電板を端子に間隔を空けて包囲するように配置することで、シールドケースがなくても第１導電板に接続された端子を第２導電板によって外部との接触等から物理的に保護することができる。 The board mounting structure according to some embodiments includes an electronic component having a terminal, a first conductive plate connected to the terminal and mounted on the board, and surrounding the terminal at an interval and providing the board with A second conductive plate to be mounted.
In this way, by connecting the first conductive plate to the terminal of the electronic component and mounting it on the substrate, the electronic component can be held on the substrate. In addition, by arranging the second conductive plate so as to surround the terminal with a space therebetween, the terminal connected to the first conductive plate can be physically protected from contact with the outside by the second conductive plate even without a shield case. Can be protected.

一実施形態において、前記電子部品は、前記基板の切欠きにより支持されてもよい。
このように、電子部品が基板の切欠きにより支持されることにより、電子部品が振動などの衝撃を受けても切欠きにより支持されるため、電子部品が傾いたり、電子部品のリード端子が折れたりする問題の発生を抑制することができる。 In one embodiment, the electronic component may be supported by a notch in the substrate.
As described above, since the electronic component is supported by the notch of the substrate, and the electronic component is supported by the notch even when subjected to shock such as vibration, the electronic component tilts or the lead terminal of the electronic component is broken. Or the occurrence of a problem can be suppressed.

一実施形態において、前記電子部品は板形状を有し、前記切欠きは前記電子部品の両端部と嵌合してもよい。
このような構成によれば、電子部品を基板に安定して保持することができる。 In one embodiment, the electronic component may have a plate shape, and the notch may be fitted to both ends of the electronic component.
According to such a configuration, the electronic component can be stably held on the substrate.

一実施形態において、前記端子は、前記基板及び前記第２導電板の間に配置されてもよい。
このような構成によれば、電子部品を基板の片面に実装した場合よりも基板実装構造を薄型化することができる。 In one embodiment, the terminal may be arranged between the substrate and the second conductive plate.
According to such a configuration, the board mounting structure can be made thinner than when the electronic component is mounted on one side of the board.

一実施形態において、基板実装構造は、前記電子部品を接続する接続部をさらに備え、前記電子部品は、前記第１導電板に接続される第１端子と、前記接続部に接続される第２端子と、を備えてもよい。
このように、第１導電板及び接続部を設けることにより、電子部品の端子を基板から離れた所定の位置に固定することができる。 In one embodiment, the board mounting structure further includes a connection portion for connecting the electronic component, wherein the electronic component has a first terminal connected to the first conductive plate and a second terminal connected to the connection portion. And a terminal.
Thus, by providing the first conductive plate and the connection portion, the terminal of the electronic component can be fixed at a predetermined position away from the substrate.

一実施形態において、前記電子部品は抵抗であり、前記第１導電板及び前記第２導電板により、前記抵抗に並列に接続された空気コンデンサが形成されてもよい。
このように、抵抗及び空気コンデンサの並列接続を構成することにより、入力電圧を測定することができる。 In one embodiment, the electronic component may be a resistor, and the first conductive plate and the second conductive plate may form an air capacitor connected in parallel to the resistor.
As described above, by configuring the parallel connection of the resistor and the air capacitor, the input voltage can be measured.

一実施形態において、基板実装構造は、前記電子部品、前記第１導電板、及び前記第２導電板を覆うシールドケースを備えてもよい。
このように、シールドケースを設け、電子部品、第１導電板、及び第２導電板を覆うことにより、外部からの放射ノイズによる基板実装構造への影響と、基板実装構造からの放射ノイズによる外部への影響と、の両方を低減することができる。 In one embodiment, the substrate mounting structure may include a shield case that covers the electronic component, the first conductive plate, and the second conductive plate.
Thus, by providing the shield case and covering the electronic component, the first conductive plate, and the second conductive plate, the influence of the external radiation noise on the substrate mounting structure and the external noise due to the radiation noise from the substrate mounting structure are reduced. And the effect on both can be reduced.

一実施形態において、前記第１導電板及び前記第２導電板の少なくともいずれかは、金属板であってよい。
このような構成によれば、実装基板のより安定した動作を可能にすることができる。 In one embodiment, at least one of the first conductive plate and the second conductive plate may be a metal plate.
According to such a configuration, more stable operation of the mounting substrate can be enabled.

幾つかの実施形態に係る実装基板は、前記基板実装構造と、前記基板と、を備える。
このような構成によれば、安定した動作を実現できる実装基板を得ることができる。 A mounting board according to some embodiments includes the board mounting structure and the board.
According to such a configuration, it is possible to obtain a mounting board that can realize a stable operation.

一実施形態において、前記基板は、前記第１導電板を配置するための基板穴と前記第２導電板を配置するための基板穴との間にスリットを有してもよい。
このように、基板にスリットを設けることにより、上記基板穴の間の沿面距離（基板上の道のり）を稼ぎ、１導電板と第２導電板との間に基板が存在することによるコンデンサの特性への影響を、低減することができる。 In one embodiment, the substrate may have a slit between a substrate hole for disposing the first conductive plate and a substrate hole for disposing the second conductive plate.
As described above, by providing the slit in the substrate, the creeping distance (the distance on the substrate) between the substrate holes is increased, and the characteristics of the capacitor due to the presence of the substrate between the first conductive plate and the second conductive plate are obtained. , Can be reduced.

幾つかの実施形態に係る電圧測定部は、前記実装基板を備える。
このような構成によれば、安定した動作を実現できる電圧測定部を得ることができる。 A voltage measuring unit according to some embodiments includes the mounting board.
According to such a configuration, it is possible to obtain a voltage measuring unit that can realize a stable operation.

本開示によれば、安定した動作を実現できる基板実装構造、実装基板、及び電圧測定部を提供することができる。   According to the present disclosure, it is possible to provide a board mounting structure, a mounting board, and a voltage measurement unit that can realize stable operation.

一実施形態に係る基板実装構造を備える実装基板を示す斜視図である。It is a perspective view showing the mounting board provided with the board mounting structure concerning one embodiment. 図１に示した実装基板の分解図である。FIG. 2 is an exploded view of the mounting board shown in FIG. 1. 図１に示した基板の平面図である。FIG. 2 is a plan view of the substrate shown in FIG. 1. 図１に示した実装基板のＡ−Ａ断面図である。FIG. 2 is a sectional view taken along line AA of the mounting board shown in FIG. 1. 図４に示した実装基板のＢ−Ｂ断面図である。FIG. 5 is a sectional view taken along line BB of the mounting board shown in FIG. 4. 一実施形態に係る基板実装構造を備える電圧測定部の第１の回路構成を示す図である。FIG. 3 is a diagram illustrating a first circuit configuration of a voltage measurement unit including a substrate mounting structure according to one embodiment. 一実施形態に係る基板実装構造を備える電圧測定部の第２の回路構成を示す図である。It is a figure showing the 2nd circuit composition of the voltage measurement part provided with the substrate mounting structure concerning one embodiment. 一実施形態に係る基板実装構造の第１の変形例を示す図である。It is a figure showing the 1st modification of the substrate mounting structure concerning one embodiment. 一実施形態に係る基板実装構造の第２の変形例を示す図である。It is a figure showing the 2nd modification of the board mounting structure concerning one embodiment. 基板実装構造を備える実装基板の一例を示す斜視図である。It is a perspective view showing an example of a mounting board provided with a substrate mounting structure. 図９に示した実装基板の分解図である。FIG. 10 is an exploded view of the mounting board shown in FIG. 9. 図９に示した実装基板のＡ−Ａ断面図である。FIG. 10 is a cross-sectional view taken along the line AA of the mounting board shown in FIG. 9. 図１１に示した実装基板のＢ−Ｂ断面図である。FIG. 12 is a cross-sectional view taken along line BB of the mounting board shown in FIG. 11.

以下、本発明を実施するための形態について、図面を参照しながら説明する。各図中、同一符号は、同一の構成要素を示している。   Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the respective drawings, the same reference numerals indicate the same components.

基板実装構造を備える実装基板の一例について、図９から図１２を参照して説明する。図９は基板実装構造６０を基板７０に実装した実装基板の斜視図であり、図１０は図９に示した実装基板の分解図である。基板実装構造６０は、抵抗６１と、第１導電板６２と、第２導電板６３と、ホルダ６４と、シールドケース６５，６６とを備える。   An example of a mounting board having a board mounting structure will be described with reference to FIGS. FIG. 9 is a perspective view of a mounting board in which the board mounting structure 60 is mounted on the board 70, and FIG. 10 is an exploded view of the mounting board shown in FIG. The board mounting structure 60 includes a resistor 61, a first conductive plate 62, a second conductive plate 63, a holder 64, and shield cases 65 and 66.

図１１は図９に示した実装基板のＡ−Ａ断面図であり、図１２は図１１に示した実装基板のＢ−Ｂ断面図である。ホルダ６４は、溝６４１，６４２を有しており、図１１，１２に示すように抵抗６１の側面の一方の端部６１１が溝６４１に挿入されるとともに、抵抗６１の側面の他方の端部６１２が溝６４２に挿入されることにより、抵抗６１の姿勢が固定される。また、ホルダ６４は、係着部６４３を有しており、図１１，１２に示すように第１導電板６２の係止穴６２１に係着部６４３を係着することにより、第１導電板６２の姿勢が固定される。シールドケース６５，６６は、外部からの放射ノイズによる基板実装構造６０への影響と、基板実装構造６０からの放射ノイズによる外部への影響と、の両方を低減する。   FIG. 11 is a cross-sectional view taken along line AA of the mounting board shown in FIG. 9, and FIG. 12 is a cross-sectional view taken along line BB of the mounting board shown in FIG. The holder 64 has grooves 641 and 642. As shown in FIGS. 11 and 12, one end 611 of the side surface of the resistor 61 is inserted into the groove 641, and the other end of the side surface of the resistor 61. By inserting 612 into groove 642, the posture of resistor 61 is fixed. The holder 64 has an engaging portion 643, and the engaging portion 643 is engaged with the locking hole 621 of the first conductive plate 62 as shown in FIGS. The posture of 62 is fixed. The shield cases 65 and 66 reduce both the influence of the radiation noise from the outside on the board mounting structure 60 and the influence of the radiation noise from the board mounting structure 60 on the outside.

第１導電板６２及び第２導電板６３は、樹脂製のホルダ６４によって絶縁され、かつ適正な間隔に位置決めされることで、空気コンデンサの電極を形成する。空気コンデンサは耐電圧特性が高いため、高電圧測定での使用が可能であり、他のコンデンサに比べて小型化できる。また、空気コンデンサは電極の形状や離間距離などの設計の自由度が高い。   The first conductive plate 62 and the second conductive plate 63 are insulated by a resin holder 64 and are positioned at appropriate intervals to form electrodes of an air capacitor. Since the air capacitor has high withstand voltage characteristics, it can be used for high voltage measurement, and can be made smaller than other capacitors. In addition, the air capacitor has a high degree of freedom in design such as the shape of the electrode and the separation distance.

基板実装構造６０は、上述したように、部品の位置決め、固定、及び絶縁のために樹脂製のホルダ６４を使用している。しかし、湿度の高い状態で使用されると、吸湿によって樹脂部品であるホルダ６４の表面抵抗値が変化するため、空気コンデンサの容量が変化してしまう。また、樹脂が吸湿によって膨らんだり、半田付けの際に熱で変形したりすると、第１導電板６２及び第２導電板６３の離間距離、及び第１導電板６２及び第２導電板６３とシールドケース６５，６６との離間距離が変わる。そして、電極間にある物質の特性や電極の離間距離が変化すると、空気コンデンサの特性も変化するため、基板実装構造６０を電圧測定装置に使用した場合には、電圧測定結果の確度が低下してしまう。   As described above, the board mounting structure 60 uses the resin holder 64 for positioning, fixing, and insulating components. However, when used in a high humidity state, the surface resistance of the holder 64, which is a resin component, changes due to moisture absorption, so that the capacity of the air capacitor changes. When the resin expands due to moisture absorption or deforms due to heat during soldering, the distance between the first conductive plate 62 and the second conductive plate 63 and the distance between the first conductive plate 62 and the second conductive plate 63 and the shield are increased. The distance between the cases 65 and 66 changes. When the characteristics of the substance between the electrodes and the distance between the electrodes change, the characteristics of the air capacitor also change. Therefore, when the substrate mounting structure 60 is used in a voltage measurement device, the accuracy of the voltage measurement result decreases. Would.

また、基板実装構造６０は、各部品が基板７０の片面に実装され、さらに各部品間に絶縁距離の確保が必要なため、図９に示すｚ方向（垂直方向）の寸法が大きくなり、基板実装構造６０を薄型の装置に適用することが困難となる。   Further, in the board mounting structure 60, since the components are mounted on one surface of the board 70, and furthermore, it is necessary to secure an insulation distance between the components, the dimension in the z direction (vertical direction) shown in FIG. It becomes difficult to apply the mounting structure 60 to a thin device.

そこで、本発明の一実施形態では、ホルダを設けないで電子部品を基板に保持することが可能な薄型の基板実装構造を提案する。本発明の一実施形態に係る基板実装構造について、図１から図６を用いて例示説明する。   Therefore, in one embodiment of the present invention, a thin substrate mounting structure capable of holding an electronic component on a substrate without providing a holder is proposed. A substrate mounting structure according to an embodiment of the present invention will be described by way of example with reference to FIGS.

図１は、本発明の一実施形態に係る基板実装構造を備える実装基板を示す斜視図である。図１に示すように、基板実装構造１０は基板２０に実装される。   FIG. 1 is a perspective view showing a mounting board having a board mounting structure according to one embodiment of the present invention. As shown in FIG. 1, the board mounting structure 10 is mounted on a board 20.

図２は、図１に示した実装基板の分解図である。図２に示すように、基板実装構造１０は、電子部品１１と、第１導電板１２と、第２導電板１３と、接続部１４と、シールドケース１５，１６とを備える。本実施形態では、電子部品１１は、長方形の板状の形状を有している。電子部品１１は、例えば抵抗である。   FIG. 2 is an exploded view of the mounting board shown in FIG. As shown in FIG. 2, the board mounting structure 10 includes an electronic component 11, a first conductive plate 12, a second conductive plate 13, a connection part 14, and shield cases 15, 16. In the present embodiment, the electronic component 11 has a rectangular plate shape. The electronic component 11 is, for example, a resistor.

図３は、基板２０の平面図である。基板２０は、開口部２１と、部品を配置するための基板穴２２，２３，２４，２５，２６，２７，２８，２９とを有する。開口部２１は、凸部２１１と、凹部２１２と、切欠き２１３，２１４と、スリット２１５，２１６とを有する。第１導電板１２、第２導電板１３、及び接続部１４は、それぞれ基板２０により配置位置が決定され、部品間の距離が維持される。   FIG. 3 is a plan view of the substrate 20. The board 20 has an opening 21 and board holes 22, 23, 24, 25, 26, 27, 28, 29 for disposing components. The opening 21 has a convex portion 211, a concave portion 212, notches 213, 214, and slits 215, 216. The arrangement positions of the first conductive plate 12, the second conductive plate 13, and the connection portion 14 are determined by the substrate 20, and the distance between components is maintained.

電子部品１１は、部品本体１１１と、リード面１１２の一端に配置されたリード端子（第１端子）１１４ａ，１１４ｂと、リード面１１２の他端に配置されたリード端子（第２端子）１１３とを有する。なお、本実施形態の電子部品１１は計３本のリード端子を有するが、このような電子部品１１に替えて、リード面１１２の一端と他端に１本ずつの計２本のリード端子を有する電子部品を用いてもよい。   The electronic component 11 includes a component body 111, lead terminals (first terminals) 114 a and 114 b disposed at one end of a lead surface 112, and a lead terminal (second terminal) 113 disposed at the other end of the lead surface 112. Having. The electronic component 11 of the present embodiment has a total of three lead terminals. Instead of such an electronic component 11, two lead terminals, one each at one end and the other end of the lead surface 112, are provided. May be used.

第１導電板１２は、上面板１２１と、前面板１２２と、後面板１２３とを有する。上面板１２１と前面板１２２と後面板１２３とは、それぞれ平板状をなす。上面板１２１と前面板１２２とは互いに垂直に延在しており、上面板１２１と後面板１２３とは互いに垂直に延在する。本実施形態では第１導電板１２は断面形状がＵ字状に形成されるが、第１導電板１２の形状に制約はなく、Ｕ字以外の形状でもよい。第１導電板１２は、導電性を有する素材であればよく、例えば第１導電板１２は素材が黄銅の金属板である。なお、説明の便宜上、図２における前方を前、後方を後、上方を上とする。上面板１２１には、電子部品１１のリード端子１１４ａ，１１４ｂを挿通させるための挿通口１２４が設けられる。第１導電板１２は、前面板１２２の爪１２５及び後面板１２３の爪１２６を、それぞれ基板穴２４，２５に挿入して半田付けすることにより、基板２０に実装される。   The first conductive plate 12 has an upper surface plate 121, a front surface plate 122, and a rear surface plate 123. The upper surface plate 121, the front surface plate 122, and the rear surface plate 123 each have a flat plate shape. The top plate 121 and the front plate 122 extend perpendicular to each other, and the top plate 121 and the rear plate 123 extend perpendicular to each other. In the present embodiment, the first conductive plate 12 is formed in a U-shaped cross section, but the shape of the first conductive plate 12 is not limited and may be a shape other than the U-shape. The first conductive plate 12 may be any material having conductivity. For example, the first conductive plate 12 is a metal plate made of brass. For convenience of description, the front in FIG. 2 is referred to as front, the rear is referred to as rear, and the upper is referred to as upper. The upper surface plate 121 is provided with an insertion hole 124 through which the lead terminals 114a and 114b of the electronic component 11 are inserted. The first conductive plate 12 is mounted on the substrate 20 by inserting the claws 125 of the front plate 122 and the claws 126 of the rear plate 123 into the board holes 24 and 25 and soldering the same.

第２導電板１３は、上面板１３１と、前面板１３２と、後面板１３３とを有する。上面板１３１と前面板１３２と後面板１３３とは、それぞれ平板状をなす。上面板１３１と前面板１３２とは互いに垂直に延在しており、上面板１３１と後面板１３３とは互いに垂直に延在する。本実施形態では第２導電板１３は断面形状がＵ字状に形成されるが、第２導電板１３の形状に制約はなく、Ｕ字以外の形状でもよい。第２導電板１３は、導電性を有する素材であればよく、例えば第２導電板１３は素材が黄銅の金属板である。上面板１３１には、第２導電板１３を基板２０の裏面側から開口部２１を通してｚ方向に引き上る際に、凹部２１２と接触しないようにするために開口部１３４が設けられる。第２導電板１３は、前面板１３２の爪１３５，１３６及び後面板１３３の爪１３７，１３８をそれぞれ基板穴２６，２７，２８，２９に挿入して半田付けすることにより、電子部品１１のリード端子１１３，１１４ａ，１１４ｂを間隔を空けて包囲するように、基板２０に実装される。   The second conductive plate 13 has an upper surface plate 131, a front surface plate 132, and a rear surface plate 133. The upper plate 131, the front plate 132, and the rear plate 133 each have a flat plate shape. The top plate 131 and the front plate 132 extend perpendicular to each other, and the top plate 131 and the rear plate 133 extend perpendicular to each other. In the present embodiment, the second conductive plate 13 has a U-shaped cross section, but the shape of the second conductive plate 13 is not limited and may be a shape other than the U-shape. The second conductive plate 13 may be any material having conductivity. For example, the second conductive plate 13 is a metal plate made of brass. The upper plate 131 is provided with an opening 134 to prevent the second conductive plate 13 from coming into contact with the concave portion 212 when the second conductive plate 13 is pulled up from the rear surface side of the substrate 20 in the z direction through the opening 21. The second conductive plate 13 is inserted into the holes 26, 27, 28, 29 of the front plate 132 and the claws 137, 138 of the rear plate 133, respectively, and soldered to form the leads of the electronic component 11. The terminals 113, 114a, and 114b are mounted on the substrate 20 so as to surround the terminals at intervals.

基板２０のスリット２１５，２１６は必須ではないが、基板穴２４及び基板穴２８の間にスリット２１５を設け、基板穴２５及び基板穴２９の間にスリット２１６を設けることにより、基板穴２４及び基板穴２８の沿面距離と、基板穴２５及び基板穴２９の沿面距離を稼ぎ、第１導電板１２と第２導電板１３との間に基板２０が存在することによるコンデンサの特性への影響を低減することができる。   Although the slits 215 and 216 of the substrate 20 are not essential, the slit 215 is provided between the substrate hole 24 and the substrate hole 28, and the slit 216 is provided between the substrate hole 25 and the substrate hole 29. The creepage distance of the hole 28 and the creepage distance of the substrate hole 25 and the substrate hole 29 are increased, and the influence on the characteristics of the capacitor due to the presence of the substrate 20 between the first conductive plate 12 and the second conductive plate 13 is reduced. can do.

接続部１４は、上面板１４１と、前面板１４２と、後面板１４３とを有する。上面板１４１と前面板１４２と後面板１４３とは、それぞれ平板状をなす。上面板１４１と前面板１４２とは互いに垂直に延在しており、上面板１４１と後面板１４３とは互いに垂直に延在する。本実施形態では接続部１４は断面形状がＵ字状に形成されるが、接続部１４の形状に制約はなく、Ｕ字以外の形状でもよい。接続部１４は、導電性を有する素材であればよく、例えば接続部１４は素材が黄銅の金属板である。上面板１４１には、電子部品１１のリード端子１１３を挿通させるための挿通口１４４が設けられる。接続部１４は、前面板１４２の爪１４５及び後面板１４３の爪１４６を、それぞれ基板穴２２，２３に挿入して半田付けすることにより、基板２０に実装される。   The connection portion 14 includes an upper surface plate 141, a front surface plate 142, and a rear surface plate 143. The upper plate 141, the front plate 142, and the rear plate 143 each have a flat plate shape. The top plate 141 and the front plate 142 extend perpendicular to each other, and the top plate 141 and the rear plate 143 extend perpendicular to each other. In the present embodiment, the connecting portion 14 is formed in a U-shaped cross section, but the shape of the connecting portion 14 is not limited and may be a shape other than the U-shape. The connecting portion 14 may be any material having conductivity, for example, the connecting portion 14 is a metal plate made of brass. The upper surface plate 141 is provided with an insertion port 144 through which the lead terminal 113 of the electronic component 11 is inserted. The connecting portion 14 is mounted on the board 20 by inserting the claws 145 of the front plate 142 and the claws 146 of the rear plate 143 into the board holes 22 and 23 and soldering the same.

電子部品１１は、リード端子１１４ａ，１１４ｂを第１導電板１２の上面板１２１の挿通口１２４に挿通して、第１導電板１２の上面板１２１と接続される。また、電子部品１１は、リード端子１１３を接続部１４の上面板１４１の挿通口１４４に挿通して、接続部１４の上面板１４１と接続される。接続の方法は、溶接や差込でもよいが、半田付けにより接着させることにより、電子部品１１をより確実に固定することができる。   The electronic component 11 is connected to the upper surface plate 121 of the first conductive plate 12 by inserting the lead terminals 114 a and 114 b into the insertion holes 124 of the upper surface plate 121 of the first conductive plate 12. Further, the electronic component 11 is connected to the upper surface plate 141 of the connection portion 14 by inserting the lead terminals 113 into the insertion holes 144 of the upper surface plate 141 of the connection portion 14. The connection method may be welding or insertion, but by bonding by soldering, the electronic component 11 can be more securely fixed.

シールドケース１５，１６は、電子部品１１、第１導電板１２、及び第２導電板１３を覆うようにして基板２０に取り付けられる。シールドケース１５，１６は、電子部品１１を包囲することにより、外部との接触等から電子部品１１を保護し、実装基板の安定した動作を可能にすることができる。シールドケース１５，１６は、前述したノイズの低減のために、基板２０の基準電位用の導体パターンに接続される。   The shield cases 15 and 16 are attached to the substrate 20 so as to cover the electronic component 11, the first conductive plate 12, and the second conductive plate 13. The shield cases 15 and 16 surround the electronic component 11, thereby protecting the electronic component 11 from contact with the outside and the like, and enabling a stable operation of the mounting board. The shield cases 15 and 16 are connected to a conductor pattern for reference potential on the substrate 20 to reduce the above-described noise.

図４は図１に示した実装基板のＡ−Ａ断面図であり、図５は図４に示した実装基板のＢ−Ｂ断面図である。図４，５に示すように、電子部品１１のリード端子１１４ａ，１１４ｂは、第２導電板１３の上面板１３１と、前面板１３２及び後面板１３３における基板２０から上方に突出した部分と、により、間隔を空けて包囲される。したがって、リード端子１１４ａ，１１４ｂは、シールドケース１５のみによって包囲される場合よりもさらに確実に、外部との接触等から物理的に保護される。また、電子部品１１のリード端子１１３，１１４ａ，１１４ｂは、基板２０及び第２導電板１３の間に配置される。すなわち、図９から図１２に示した基板実装構造６０では、抵抗６１のリード端子が基板７０表面に接するように配置されるところ、基板実装構造１０においては電子部品１１のリード端子１１４ａ，１１４ｂが基板２０と垂直方向に所定の距離だけ離れた第１導電板１２の上面板１２１に接するように配置される。また、電子部品１１のリード端子１１３は基板２０と垂直方向に所定の距離だけ離れた接続部１４の上面板１４１に接するように配置され、リード端子１１３及び接続部１４は、第２導電板１３と基板２０で覆われた空間の外部に配置される。なお、第１導電板１２及び接続部１４は、それぞれ基板２０に実装した際に、基板２０から第１導電板１２の上面板１２１までの距離と、基板２０から接続部１４の上面板１４１までの距離とが等しくなるように設計されてもよい。   FIG. 4 is a cross-sectional view taken along line AA of the mounting board shown in FIG. 1, and FIG. 5 is a cross-sectional view taken along line BB of the mounting board shown in FIG. As shown in FIGS. 4 and 5, the lead terminals 114 a and 114 b of the electronic component 11 are formed by the upper plate 131 of the second conductive plate 13 and the portions of the front plate 132 and the rear plate 133 projecting upward from the substrate 20. , Surrounded at intervals. Therefore, the lead terminals 114a and 114b are more reliably physically protected from contact with the outside than the case where the lead terminals 114a and 114b are surrounded only by the shield case 15. Further, the lead terminals 113, 114 a, 114 b of the electronic component 11 are arranged between the substrate 20 and the second conductive plate 13. That is, in the board mounting structure 60 shown in FIGS. 9 to 12, the lead terminals of the resistor 61 are arranged so as to be in contact with the surface of the board 70, but in the board mounting structure 10, the lead terminals 114a and 114b of the electronic component 11 are The first conductive plate 12 is disposed so as to be in contact with the upper surface plate 121 of the first conductive plate 12 which is vertically separated from the substrate 20 by a predetermined distance. The lead terminal 113 of the electronic component 11 is disposed so as to be in contact with the upper surface plate 141 of the connection portion 14 which is vertically separated from the substrate 20 by a predetermined distance. And the outside of the space covered by the substrate 20. When the first conductive plate 12 and the connecting portion 14 are mounted on the substrate 20, respectively, the distance from the substrate 20 to the upper surface plate 121 of the first conductive plate 12 and the distance from the substrate 20 to the upper surface plate 141 of the connecting portion 14 are different. May be designed to be equal to each other.

また、電子部品１１は、基板２０に設けられた切欠き２１３，２１４によって支持される。例えば、電子部品１１が板形状を有する場合、電子部品１１は両端部が切欠き２１３，２１４と嵌合し、基板２０と垂直に保持される。そのため、振動により電子部品１１が傾いたり、電子部品１１のリード端子１１３，１１４ａ，１１４ｂが折れたりする問題の発生を抑制することができ、部品の位置決め、固定、絶縁のためのホルダが無くても電子部品１１の耐衝撃性を得ることができる。   Further, the electronic component 11 is supported by notches 213 and 214 provided in the substrate 20. For example, when the electronic component 11 has a plate shape, both ends of the electronic component 11 are fitted into the notches 213 and 214, and are held perpendicular to the substrate 20. Therefore, it is possible to suppress the occurrence of the problem that the electronic component 11 is tilted by the vibration or the lead terminals 113, 114a, and 114b of the electronic component 11 are broken, and there is no holder for positioning, fixing, and insulating the component. Also, the impact resistance of the electronic component 11 can be obtained.

図４に示すように、第１導電板１２の上面板１２１及び第２導電板１３の上面板１３１は間隔を空けて対向する。また、図５に示すように、第１導電板１２の前面板１２２及び第２導電板１３の前面板１３２は間隔を空けて対向し、第１導電板１２の後面板１２３及び第２導電板１３の後面板１３３は間隔を空けて対向する。また、電子部品１１のリード端子１１４ａ，１１４ｂ及び第１導電板１２が電気的に接続され、電子部品１１のリード端子１１３及び第２導電板１３が接続部１４を介して電気的に接続される。したがって、電子部品１１が抵抗である場合には、第１導電板１２及び第２導電板１３は、抵抗１１に並列に接続された空気コンデンサ３０の電極として機能することができる。また、このような抵抗１１及び空気コンデンサ３０を用いて電圧測定部を構成することができる。このような電圧測定部は、例えば電圧測定装置の入力回路として使用することができる。   As shown in FIG. 4, the upper surface plate 121 of the first conductive plate 12 and the upper surface plate 131 of the second conductive plate 13 face each other at an interval. As shown in FIG. 5, the front plate 122 of the first conductive plate 12 and the front plate 132 of the second conductive plate 13 face each other with an interval therebetween, and the rear plate 123 and the second conductive plate 123 of the first conductive plate 12. The 13 rear plates 133 face each other at intervals. Further, the lead terminals 114 a and 114 b of the electronic component 11 are electrically connected to the first conductive plate 12, and the lead terminals 113 and the second conductive plate 13 of the electronic component 11 are electrically connected via the connection portion 14. . Therefore, when the electronic component 11 is a resistor, the first conductive plate 12 and the second conductive plate 13 can function as electrodes of the air capacitor 30 connected in parallel with the resistor 11. Further, a voltage measuring unit can be configured using such a resistor 11 and the air capacitor 30. Such a voltage measurement unit can be used, for example, as an input circuit of a voltage measurement device.

図６は、基板実装構造１０を備える電圧測定部の回路構成例を示す図である。図６Ａは電圧測定部の第１の例である電圧測定部５０の回路構成を示しており、電圧測定部５０では抵抗１１に直列に抵抗４１が接続され、抵抗４１の一端は接地される。図６Ｂは電圧測定部の第２の例である電圧測定部５１の回路構成を示しており、電圧測定部５１では、抵抗１１に直列にオペアンプ４２が接続され、オペアンプ４２の非反転入力端子（＋）と出力端子との間に抵抗４３が接続され、オペアンプ４２の反転入力端子（−）は接地される。いずれの例においても、電子部品１１及び空気コンデンサ３０は並列接続している。低周波帯域は抵抗１１で分圧を行い、さらに空気コンデンサ３０を並列接続することで高周波帯域までカバーすることができる。   FIG. 6 is a diagram illustrating an example of a circuit configuration of a voltage measurement unit including the board mounting structure 10. FIG. 6A shows a circuit configuration of a voltage measuring unit 50 which is a first example of the voltage measuring unit. In the voltage measuring unit 50, a resistor 41 is connected in series with the resistor 11, and one end of the resistor 41 is grounded. FIG. 6B shows a circuit configuration of a voltage measurement unit 51 which is a second example of the voltage measurement unit. In the voltage measurement unit 51, an operational amplifier 42 is connected in series to the resistor 11, and a non-inverting input terminal ( A resistor 43 is connected between (+) and the output terminal, and an inverting input terminal (−) of the operational amplifier 42 is grounded. In each case, the electronic component 11 and the air capacitor 30 are connected in parallel. The low frequency band is divided by the resistor 11 and the air capacitor 30 is connected in parallel to cover the high frequency band.

＜第１の変形例＞
次に、基板実装構造１０の変形例について説明する。図７は、基板実装構造１０の第１の変形例である基板実装構造１０−１を示す図である。基板実装構造１０−１は、基板実装構造１０と比較して、接続部１４に代えて接続部１４’を使用する点が相違する。接続部１４’はテストピンである。電子部品１１のリード端子１１３は、折り曲げて接続部１４’と接触させて半田付けすることにより、接続部１４’と接続される。このように、基板実装構造１０−１では、接続部の構成を簡略化することができる。 <First Modification>
Next, a modified example of the substrate mounting structure 10 will be described. FIG. 7 is a diagram showing a board mounting structure 10-1 which is a first modification of the board mounting structure 10. As shown in FIG. The board mounting structure 10-1 is different from the board mounting structure 10 in that a connecting portion 14 'is used instead of the connecting portion 14. The connection part 14 'is a test pin. The lead terminal 113 of the electronic component 11 is connected to the connecting portion 14 'by bending and contacting with the connecting portion 14' and soldering. Thus, in the board mounting structure 10-1, the configuration of the connection portion can be simplified.

＜第２の変形例＞
基板実装構造１０の第１導電板１２及び第２導電板１３は、必要な表面積及び絶縁距離を保っていれば、形状を変更することが可能である。図８に、基板実装構造１０の第２の変形例として、第１導電板１２及び第２導電板１３の形状を変形した基板実装構造１０−２を示す。すなわち、基板実装構造１０−２は、基板実装構造１０と比較して、第１導電板１２及び第２導電板１３に代えて第１導電板１２’及び第２導電板１３’を使用する点が相違する。図８は、シールドケースの図示を省略している。図８に示す例では、第１導電板１２’は側面板１２７を有しており、第１導電板１２と比較して側面板１２７の面積が増加する分、空気コンデンサの容量を変えることなく、基板２０の裏面側に突き出る部分を削除又は低減することができる。同様に、第２導電板１３’は側面板１３８を有しており、第２導電板１３と比較して側面板１３８の面積が増加する分、空気コンデンサの容量を変えることなく、基板２０の裏面側に突き出る部分を削除又は低減することができる。その結果、基板実装構造１０−２は、基板実装構造１０よりも高さ（図１に示すｚ方向の寸法）を短くすることができる。 <Second Modification>
The shapes of the first conductive plate 12 and the second conductive plate 13 of the substrate mounting structure 10 can be changed as long as necessary surface areas and insulating distances are maintained. FIG. 8 shows a substrate mounting structure 10-2 in which the shapes of the first conductive plate 12 and the second conductive plate 13 are modified as a second modification of the substrate mounting structure 10. That is, the board mounting structure 10-2 is different from the board mounting structure 10 in that the first conductive plate 12 'and the second conductive plate 13' are used instead of the first conductive plate 12 and the second conductive plate 13. Are different. FIG. 8 omits illustration of the shield case. In the example shown in FIG. 8, the first conductive plate 12 ′ has the side plate 127, and the area of the side plate 127 is increased as compared with the first conductive plate 12 without changing the capacity of the air capacitor. In addition, the portion protruding toward the back surface of the substrate 20 can be eliminated or reduced. Similarly, the second conductive plate 13 ′ has a side plate 138, and the area of the side plate 138 increases as compared with the second conductive plate 13, so that the capacity of the substrate 20 is not changed without changing the capacity of the air capacitor. The portion protruding to the back side can be eliminated or reduced. As a result, the height (dimension in the z direction shown in FIG. 1) of the board mounting structure 10-2 can be shorter than that of the board mounting structure 10.

以上説明したように、本実施形態では、基板実装構造１０は、電子部品（抵抗）１１と、電子部品１１に接続されるとともに基板２０に実装される第１導電板１２と、電子部品１１のリード端子１１３，１１４ａ，１１４ｂを間隔を空けて包囲するとともに基板２０に実装される第２導電板１３とを備える。かかる構成により、電子部品を保持する樹脂製のホルダを削減し、省スペース化及びコストダウンを実現することが可能となる。また、熱による変形の恐れがある樹脂部品が無いため、半田付けが容易になり、組立作業性が向上する。   As described above, in the present embodiment, the board mounting structure 10 includes the electronic component (resistance) 11, the first conductive plate 12 connected to the electronic component 11 and mounted on the board 20, and the electronic component 11. A second conductive plate mounted on the substrate and surrounding the lead terminals; With this configuration, it is possible to reduce the number of resin holders that hold the electronic components, thereby achieving space saving and cost reduction. In addition, since there is no resin component that may be deformed by heat, soldering is facilitated and assembly workability is improved.

また、第１導電板１２及び第２導電板１３を空気コンデンサ３０の電極として機能させることができ、空気コンデンサ３０の高さを基板２０の両面に分散することで、より薄型の装置で使用可能となる。また、樹脂部品が無くなり周囲環境が変化してもコンデンサ容量が安定するため、基板実装構造１０を備える電圧測定部は、確度の高い電圧測定を実現することが可能となる。   In addition, the first conductive plate 12 and the second conductive plate 13 can function as electrodes of the air capacitor 30, and the height of the air capacitor 30 is dispersed on both surfaces of the substrate 20, so that it can be used in a thinner device. Becomes In addition, since the capacitance of the capacitor is stabilized even if the resin component disappears and the surrounding environment changes, the voltage measurement unit including the board mounting structure 10 can realize highly accurate voltage measurement.

また、特許文献１に開示された基板実装構造では、一対の部品保持機構３の挟持部が空気コンデンサの電極として機能するが、電極間の距離が抵抗の幅の制約を受ける。また、電極間に抵抗が存在するため、例えば抵抗の表面に埃が付着した場合にはコンデンサの特性が不安定となる。その点、本実施形態の基板実装構造１０では、第１導電板１２及び第２導電板１３の電極間距離の設定には自由度があるため、電極間距離を広くすることで、より高電圧に耐えうるコンデンサとすることができる。また、基板実装構造１０では、電極間に部品が配置されないため、コンデンサの特性を安定化させることが可能となる。   Further, in the board mounting structure disclosed in Patent Document 1, the holding portions of the pair of component holding mechanisms 3 function as electrodes of the air capacitor, but the distance between the electrodes is limited by the width of the resistor. Further, since a resistor exists between the electrodes, for example, when dust adheres to the surface of the resistor, the characteristics of the capacitor become unstable. In this regard, in the board mounting structure 10 of the present embodiment, since the distance between the electrodes of the first conductive plate 12 and the second conductive plate 13 can be freely set, a higher voltage can be obtained by increasing the distance between the electrodes. It can be a capacitor that can endure. Further, in the board mounting structure 10, since no components are arranged between the electrodes, the characteristics of the capacitor can be stabilized.

以上、本発明の実施形態について、図面を参照して説明してきたが、具体的な構成はこの実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲においての種々の変更も含まれる。   The embodiment of the present invention has been described with reference to the drawings. However, the specific configuration is not limited to this embodiment, and includes various modifications without departing from the spirit of the present invention. It is.

１０，１０−１，１０−２ 基板実装構造
１１，４１，４３ 電子部品（抵抗）
１２，１２’ 第１導電板
１３，１３’ 第２導電板
１４，１４’ 接続部
１５，１６ シールドケース
２０ 基板
２１，１３４ 開口部
２２，２３，２４，２５，２６，２７，２８，２９ 基板穴
３０ 空気コンデンサ
４２ オペアンプ
５０，５１ 電圧測定部
１１１ 部品本体
１１２ リード面
１１３，１１４ａ，１１４ｂ リード端子
１２１，１３１，１４１ 上面板
１２２，１３２，１４２ 前面板
１２３，１３３，１４３ 後面板
１２４，１４４ 挿通口
１２５，１２６，１３５，１３６，１３７，１３８，１４５，１４６ 爪
１２７，１３８ 側面板
２１１ 凸部
２１２ 凹部
２１３，２１４ 切欠き
２１５，２１６ スリット 10, 10-1, 10-2 Board mounting structure 11, 41, 43 Electronic component (resistance)
12, 12 'First conductive plate 13, 13' Second conductive plate 14, 14 'Connection part 15, 16 Shield case 20 Substrate 21, 134 Opening 22, 22, 23, 24, 25, 26, 27, 28, 29 Substrate Hole 30 Air condenser 42 Operational amplifier 50, 51 Voltage measuring unit 111 Component body 112 Lead surface 113, 114a, 114b Lead terminal 121, 131, 141 Top plate 122, 132, 142 Front plate 123, 133, 143 Rear plate 124, 144 Insertion Mouth 125, 126, 135, 136, 137, 138, 145, 146 Claw 127, 138 Side plate 211 Convex part 212 Concave part 213, 214 Notch 215, 216 Slit

Claims (9)

端子を有する電子部品と、
前記端子に接続されるとともに基板に実装される第１導電板と、
前記端子を間隔を空けて包囲するとともに前記基板に実装される第２導電板と、
を備えることを特徴とする基板実装構造。 An electronic component having terminals;
A first conductive plate connected to the terminal and mounted on a substrate;
A second conductive plate that surrounds the terminals at intervals and is mounted on the substrate;
A substrate mounting structure comprising: 前記電子部品は、前記基板の切欠きにより支持されることを特徴とする、請求項１に記載の基板実装構造。   The board mounting structure according to claim 1, wherein the electronic component is supported by a notch of the board. 前記電子部品は板形状を有し、前記切欠きは前記電子部品の両端部と嵌合することを特徴とする、請求項２に記載の基板実装構造。   The board mounting structure according to claim 2, wherein the electronic component has a plate shape, and the notch is fitted with both ends of the electronic component. 前記端子は、前記基板及び前記第２導電板の間に配置されることを特徴とする、請求項１から３のいずれか一項に記載の基板実装構造。   The substrate mounting structure according to any one of claims 1 to 3, wherein the terminal is arranged between the substrate and the second conductive plate. 前記電子部品を接続する接続部をさらに備え、
前記電子部品は、前記第１導電板に接続される第１端子と、前記接続部に接続される第２端子と、を備えることを特徴とする、請求項１から４のいずれか一項に記載の基板実装構造。 A connection unit that connects the electronic component,
5. The electronic component according to claim 1, wherein the electronic component includes a first terminal connected to the first conductive plate, and a second terminal connected to the connection unit. 6. The board mounting structure described. 前記電子部品は抵抗であり、
前記第１導電板及び前記第２導電板により、前記抵抗に並列に接続された空気コンデンサが形成されることを特徴とする、請求項１から５のいずれか一項に記載の基板実装構造。 The electronic component is a resistor,
The substrate mounting structure according to any one of claims 1 to 5, wherein the first conductive plate and the second conductive plate form an air capacitor connected in parallel with the resistor. 請求項１から６のいずれか一項に記載の基板実装構造と、
前記基板と、
を備えることを特徴とする実装基板。 A board mounting structure according to any one of claims 1 to 6,
Said substrate;
A mounting substrate, comprising: 前記基板は、前記第１導電板を配置するための基板穴と前記第２導電板を配置するための基板穴との間にスリットを有することを特徴とする、請求項７に記載の実装基板。   The mounting substrate according to claim 7, wherein the substrate has a slit between a substrate hole for disposing the first conductive plate and a substrate hole for disposing the second conductive plate. . 請求項８に記載の実装基板を備える電圧測定部。   A voltage measurement unit comprising the mounting board according to claim 8.
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JP2015012210A (en) * 2013-07-01 2015-01-19 日置電機株式会社 Component holding mechanism, mounting circuit board and measuring apparatus
JP2015010973A (en) * 2013-07-01 2015-01-19 日置電機株式会社 Resistor-holding mechanism, mounting circuit board, and measurement device
JP2016114562A (en) * 2014-12-17 2016-06-23 日置電機株式会社 Structure for compensating for frequency characteristics of voltage input resistor unit, component mounting circuit board, and measurement device
JP2016114561A (en) * 2014-12-17 2016-06-23 日置電機株式会社 Structure for compensating for frequency characteristics of voltage input resistor unit

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JP6110233B2 (en) * 2013-07-01 2017-04-05 日置電機株式会社 Resistance holding mechanism, mounting board and measuring device

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Publication number Priority date Publication date Assignee Title
JP2014055848A (en) * 2012-09-12 2014-03-27 Hioki Ee Corp Frequency characteristic correction structure heat discharge structure of voltage input resistance part in voltage measurement device
JP2015012210A (en) * 2013-07-01 2015-01-19 日置電機株式会社 Component holding mechanism, mounting circuit board and measuring apparatus
JP2015010973A (en) * 2013-07-01 2015-01-19 日置電機株式会社 Resistor-holding mechanism, mounting circuit board, and measurement device
JP2016114562A (en) * 2014-12-17 2016-06-23 日置電機株式会社 Structure for compensating for frequency characteristics of voltage input resistor unit, component mounting circuit board, and measurement device
JP2016114561A (en) * 2014-12-17 2016-06-23 日置電機株式会社 Structure for compensating for frequency characteristics of voltage input resistor unit

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