JP2020021781A - Electrode embedding member and manufacturing method thereof - Google Patents

Electrode embedding member and manufacturing method thereof Download PDF

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JP2020021781A
JP2020021781A JP2018142911A JP2018142911A JP2020021781A JP 2020021781 A JP2020021781 A JP 2020021781A JP 2018142911 A JP2018142911 A JP 2018142911A JP 2018142911 A JP2018142911 A JP 2018142911A JP 2020021781 A JP2020021781 A JP 2020021781A
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electrode
conductive member
base material
opening
terminal connection
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JP7125299B2 (en
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淳 土田
Atsushi Tsuchida
淳 土田
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Niterra Co Ltd
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NGK Spark Plug Co Ltd
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Abstract

To provide an electrode embedding member that can increase a distance from a conductive member to the surface of a base material and can prevent a ceramic base material from being cracked even when used for a long time.SOLUTION: An electrode embedding member 1 includes a plate-shaped base material 2, an internal electrode 3 embedded in the base material 2 and having an opening 7 formed therein, a conductive member 4 located on the back surface 2b side of the internal electrode 3 so as to overlap an opening 7 in the thickness direction of the base material 2, and a terminal 6 that is connected to the conductive member 4 and at least a part of which is disposed in a terminal hole 5. The internal electrode 3 includes a planar electrode portion 8 arranged along the surface 2a of the base material 2, and a terminal connecting portion 9 extending from the planar electrode portion 8 toward the conductive member 4 so as not to pass through a region overlapping with the opening 7 in the thickness direction of the base material 2 and conducting to the conductive member 4.SELECTED DRAWING: Figure 1

Description

本発明は、セラミックス製の基材に内部電極が埋設された電極埋設部材に関する。   The present invention relates to an electrode embedding member in which an internal electrode is embedded in a ceramic base material.

従来、セラミックス製の基材に内部電極が埋設された電極埋設部材が知られている（例えば、特許文献１参照）。   2. Description of the Related Art Conventionally, an electrode embedding member in which an internal electrode is embedded in a ceramic base material is known (for example, see Patent Document 1).

特許第４５３１００４号公報Japanese Patent No. 4531004

特許文献１には、セラミックス基体の内部にセラミックス基体の加熱面にほぼ平行に埋設された内部電極を備え、この内部電極に向かう穿設穴がセラミックス基体の裏面に形成された加熱装置が開示されている。この加熱装置では、使用時や穿設穴に挿入される内部電極への給電用のＮｉ端子の取付け取り外し時に生じる応力が内部電極と加熱面との間の薄い誘電体層に伝わることによって誘電体層にクラックが発生することを抑制するために、内部電極を、穿設穴と対向する領域にて穿設穴に向かう円錐台形状の凹部を有する形状としている。   Patent Document 1 discloses a heating device including an internal electrode embedded in a ceramic substrate substantially parallel to a heating surface of the ceramic substrate, and a perforated hole facing the internal electrode is formed on the back surface of the ceramic substrate. ing. In this heating device, the stress generated at the time of use or attachment / detachment of the power supply Ni terminal to / from the internal electrode inserted into the drilled hole is transmitted to the thin dielectric layer between the internal electrode and the heating surface. In order to suppress the occurrence of cracks in the layer, the internal electrode is formed in a shape having a truncated conical recess toward the drilled hole in a region facing the drilled hole.

しかし、特許文献１の技術では、内部電極をプレス成形して変形させることによって、加熱面（表面）とＮｉ端子の距離を離間させ、Ｎｉ端子の押圧力による誘電体層のクラックを抑制する構成としている。しかし、内部電極を変形させるため、変形に限界があることから離間距離はあまり大きくすることはできない。また内部電極がメッシュである場合には、メッシュを構成するワイヤーの目開きの変化が生じ、変形部分で局所的な抵抗増加による弊害の懸念があった。   However, in the technique of Patent Document 1, the distance between the heating surface (surface) and the Ni terminal is increased by press-forming and deforming the internal electrode to suppress cracks in the dielectric layer due to the pressing force of the Ni terminal. And However, since the internal electrodes are deformed, there is a limit to the deformation, so that the separation distance cannot be made too large. Further, when the internal electrode is a mesh, a change in the aperture of the wire constituting the mesh occurs, and there is a concern that a local resistance may increase at the deformed portion.

本発明は、以上の点に鑑み、導電性部材から基材の表面までの距離を大きくでき、長期間使用してもセラミックス製の基材にクラックが入ることを防止できる電極埋設部材を提供することを目的とする。   In view of the above, the present invention provides an electrode-embedded member that can increase the distance from the conductive member to the surface of the substrate and can prevent cracks in the ceramic substrate even when used for a long time. The purpose is to:

［１］上記目的を達成するため、本発明は、
表面及び裏面を有し、セラミックスからなる板状の基材と、
前記基材に埋設され、開口部が形成された内部電極と、
前記内部電極に導通する状態で前記基材に埋設され、前記基材の厚み方向において前記開口部に重なるように前記内部電極よりも前記裏面側に位置する導電性部材と、
前記基材の裏面から前記導電性部材の端面まで連通している端子穴と、
前記端子穴に少なくとも一部が配置され、前記導電性部材に接続される端子と、
を備えた電極埋設部材であって、
前記内部電極は、
前記基材の表面に沿って配置されると共に前記開口部が形成された平面電極部と、
前記基材の厚み方向において前記開口部と重なる領域を通過しないように、前記平面電極部から前記導電性部材側に向って延び、前記導電性部材に導通する端子接続部と、
を備えていることを特徴とする。 [1] To achieve the above object, the present invention provides:
A plate-shaped substrate made of ceramics having a front surface and a back surface,
Embedded in the base material, an internal electrode having an opening formed therein,
A conductive member that is embedded in the base material in a state of being electrically connected to the internal electrode and is located on the back surface side of the internal electrode so as to overlap the opening in the thickness direction of the base material,
Terminal holes communicating from the back surface of the base material to the end surface of the conductive member,
At least a part is arranged in the terminal hole, a terminal connected to the conductive member,
An electrode embedding member comprising:
The internal electrode,
A planar electrode portion arranged along the surface of the base material and having the opening formed therein,
A terminal connection portion that extends from the flat electrode portion toward the conductive member and does not pass through the conductive member, so as not to pass through a region overlapping the opening in the thickness direction of the base material,
It is characterized by having.

本発明によれば、内部電極は、基材の表面に沿って配置されている平面電極部と、基材の厚み方向において開口部と重なる領域を通過しないように、平面電極部から導電性部材側に向って延び、導電性部材に導通する端子接続部とを備えている。このため、平面電極部に直接導電性部材を接続する場合に比較して、基材の厚み方向に沿った端子接続部の距離だけ、導電性部材から基材の表面までの距離を大きくできる。このため、導電性部材と基材の熱膨張係数の差に起因する応力が発生したとしても、平面電極部に直接導電性部材が接続されている場合と比較して、平面電極部よりも基材の表面側を構成する絶縁層に及ぼす応力が小さくなり、基材の表面側の絶縁層のクラックを抑制することができる。   According to the present invention, the internal electrode is formed from the flat electrode portion and the conductive member so as not to pass through a region overlapping the opening in the thickness direction of the base material and the flat electrode portion arranged along the surface of the base material. A terminal connecting portion extending toward the side and electrically connected to the conductive member. For this reason, the distance from the conductive member to the surface of the substrate can be increased by the distance of the terminal connection portion along the thickness direction of the substrate, as compared with the case where the conductive member is directly connected to the flat electrode portion. For this reason, even if a stress due to the difference in thermal expansion coefficient between the conductive member and the base material occurs, the stress is higher than that in the case where the conductive member is directly connected to the flat electrode portion. The stress exerted on the insulating layer constituting the front side of the material is reduced, and cracks in the insulating layer on the front side of the substrate can be suppressed.

［２］また、本発明においては、前記端子接続部は、前記平面電極部に一体に形成され、前記開口部の縁から前記導電性部材側に向って延びていることが好ましい。
本発明によれば、端子接続部は、平面電極部に一体に形成され、開口部の縁から導電性部材側に向って延びているので、導電性部材の位置を、平面電極部から基材の裏面側（導電性部材側）へ離すことができる。結果、導電性部材から基材の表面までの距離を大きくできる。このため、導電性部材と基材の熱膨張係数の差に起因する応力が発生したとしても、平面電極部に直接導電性部材が接続されている場合と比較して、平面電極部よりも基材の表面側を構成する絶縁層に及ぼす応力が小さくなり、基材の表面側の絶縁層のクラックを抑制することができる。 [2] In the present invention, it is preferable that the terminal connection portion is formed integrally with the flat electrode portion and extends from an edge of the opening toward the conductive member.
According to the present invention, since the terminal connection portion is formed integrally with the flat electrode portion and extends from the edge of the opening toward the conductive member, the position of the conductive member can be changed from the flat electrode portion to the base material. To the back side (conductive member side). As a result, the distance from the conductive member to the surface of the substrate can be increased. For this reason, even if a stress due to the difference in thermal expansion coefficient between the conductive member and the base material occurs, the stress is higher than that in the case where the conductive member is directly connected to the flat electrode portion. The stress exerted on the insulating layer constituting the front side of the material is reduced, and cracks in the insulating layer on the front side of the substrate can be suppressed.

さらには、基材の厚み方向に沿った端子接続部の高さを大きくすると、端子接続部に囲まれた部分の基材の体積を大きくできる。結果、導電性部材から受ける熱サイクルによる応力を分散でき、基材のクラックをより抑制することができる。   Further, when the height of the terminal connection portion along the thickness direction of the base material is increased, the volume of the base material in a portion surrounded by the terminal connection portion can be increased. As a result, the stress due to the thermal cycle received from the conductive member can be dispersed, and cracks in the substrate can be further suppressed.

［３］また、本発明においては、前記導電性部材は、前記基材の表面側に位置する第１面と、前記基材の裏面側に位置する第２面とを有し、
前記端子接続部の一部は、前記第１面に対向する先端部を備えていることが好ましい。 [3] Also, in the present invention, the conductive member has a first surface located on the front surface side of the base material, and a second surface located on the back surface side of the base material,
It is preferable that a part of the terminal connection part includes a tip part facing the first surface.

本発明によれば、端子接続部は、前記導電性部材の第１面に対向するので、通電するための面積を十分に確保した上で、導電性部材から基材の表面までの距離を大きくできる。このため、導電性部材と基材の熱膨張係数の差に起因する応力が発生したとしても、平面電極部に直接導電性部材が接続されている場合と比較して、平面電極部よりも基材の表面側を構成する絶縁層に及ぼす応力が小さくなり、基材の表面側の絶縁層のクラックを抑制することができる。   According to the present invention, since the terminal connection portion faces the first surface of the conductive member, the area from the conductive member to the surface of the base member is increased while ensuring a sufficient area for conducting electricity. it can. For this reason, even if a stress due to the difference in thermal expansion coefficient between the conductive member and the base material occurs, the stress is higher than that in the case where the conductive member is directly connected to the flat electrode portion. The stress exerted on the insulating layer constituting the front side of the material is reduced, and cracks in the insulating layer on the front side of the substrate can be suppressed.

［４］また、本発明においては、前記開口部の縁のうち異なる箇所から導電性部材側に向って延びる複数の前記端子接続部を備えていることが好ましい。   [4] Further, in the present invention, it is preferable that a plurality of the terminal connection portions extending toward the conductive member side from different portions of the edge of the opening are provided.

本発明によれば、導電性部材から基材の表面までの距離を大きくすると共に、開口部の縁のうち異なる箇所から導電性部材側に向って延びる複数の端子接続部を備えているので、熱サイクルによって生じる応力を複数の端子接続部が分散して受けて、基材に生じる応力も分散させることができ、基材のクラックを抑制することができる。   According to the present invention, the distance from the conductive member to the surface of the base material is increased, and the terminal includes a plurality of terminal connection portions extending toward the conductive member from different portions of the edge of the opening. The plurality of terminal connection portions receive the stress generated by the thermal cycle in a dispersed manner, so that the stress generated in the base material can also be dispersed, and cracks in the base material can be suppressed.

［５］また、本発明においては、前記開口部の縁のうち異なる箇所に同じ形状及び大きさで設けられている複数の前記端子接続部を備えていることが好ましい。   [5] Further, in the present invention, it is preferable that a plurality of the terminal connection portions provided with the same shape and the same size at different positions in the edge of the opening are provided.

本発明によれば、複数の端子接続部が開口部の縁のうち異なる箇所に同じ形状及び大きさで設けられているので、熱サイクルによって生じる応力を複数の端子接続部が均等に分散して受けて、基材に生じる応力も均等に分散させることができ、基材のクラックを抑制することができる。   According to the present invention, since the plurality of terminal connection portions are provided at different positions on the edge of the opening with the same shape and size, the stress generated by the thermal cycle is evenly distributed by the plurality of terminal connection portions. As a result, the stress generated in the substrate can be evenly dispersed, and cracks in the substrate can be suppressed.

［６］また、本発明においては、前記内部電極となる電極シートの前記開口部となる位置に切り込みを形成する工程と、
前記切り込みの複数の端点を結ぶ折り線に沿って前記電極シートを変形させることにより前記開口部を有する前記平面電極部と、前記開口部の縁から延びる前記端子接続部を有する前記内部電極を作製する工程と、
セラミックス粉末を成形することにより板状の成形体を作製する工程と、
前記板状の成形体に、前記内部電極を重ねることにより、第１中間体を作製する工程と、
前記第１中間体を用いて、前記内部電極及び前記導電性部材が埋設されたセラミックス成形体を作製する工程と、
前記セラミックス成形体を焼成することによって、前記基材を作製する工程と、
を有することが好ましい。 [6] In the present invention, a step of forming a cut at a position to be the opening of the electrode sheet to be the internal electrode;
By deforming the electrode sheet along a folding line connecting a plurality of end points of the cut, the planar electrode portion having the opening and the internal electrode having the terminal connection portion extending from an edge of the opening are formed. The process of
A step of producing a plate-like molded body by molding ceramic powder,
A step of producing a first intermediate by laminating the internal electrode on the plate-like molded body;
Using the first intermediate, a step of producing a ceramic molded body in which the internal electrode and the conductive member are embedded;
Baking the ceramic molded body to produce the base material,
It is preferable to have

上記工程によれば、内部電極となる電極シートの開口部となる位置に切り込みを形成し、切り込みの複数の端点を結ぶ折り線に沿って電極シートを変形させることにより、開口部を有する平面電極部と、開口部の縁から延びる端子接続部を有する内部電極を作製し、この内部電極をセラミックス粉末による板状の成形体に重ね、内部電極及び導電性部材が埋設されたセラミックス成形体を得る。   According to the above process, a notch is formed at a position to be an opening of an electrode sheet serving as an internal electrode, and the electrode sheet is deformed along a folding line connecting a plurality of end points of the notch, whereby a flat electrode having an opening is formed. And an internal electrode having a terminal connection portion extending from the edge of the opening, and laying the internal electrode on a plate-like molded body made of ceramic powder to obtain a ceramic molded body in which the internal electrode and the conductive member are embedded. .

このため、セラミックス成形体に埋設される前の内部電極に端子接続部を形成しているため、端子接続部の長さを容易に調節することができ、ひいては、導電性部材を基材の表面から大きく離すことができる。そのため、導電性部材と基材の熱膨張係数の差に起因する応力が発生したとしても、平面電極部に直接導電性部材が接続されている場合と比較して平面電極部よりも基材の表面側を構成する絶縁層に及ぼす応力が小さくなり、基材の表面側の絶縁層のクラックを抑制することができる。   For this reason, since the terminal connection portion is formed on the internal electrode before being embedded in the ceramic molded body, the length of the terminal connection portion can be easily adjusted. Can be greatly separated from. Therefore, even if a stress due to the difference in thermal expansion coefficient between the conductive member and the base material occurs, the base material is more flat than the flat electrode portion compared to the case where the conductive member is directly connected to the flat electrode portion. Stress applied to the insulating layer constituting the front surface side is reduced, and cracks in the insulating layer on the front surface side of the base material can be suppressed.

［７］また、本発明においては、セラミックス粉末を成形することにより中間絶縁体を作製する工程を備え、
前記第１中間体を作製する工程は、前記開口部内に配置されるように前記中間絶縁体を前記板状の成形体に重ねる工程を含み、
前記内部電極を作製する工程は、前記端子接続部の一部を変形させることにより前記導電性部材と対向することとなる前記端子接続部の先端部を形成する工程を含むことが好ましい。 [7] The present invention further includes a step of forming an intermediate insulator by molding a ceramic powder,
The step of producing the first intermediate includes a step of superimposing the intermediate insulator on the plate-shaped molded body so as to be disposed in the opening,
It is preferable that the step of forming the internal electrode includes a step of forming a tip portion of the terminal connection portion that faces the conductive member by partially deforming the terminal connection portion.

上記工程によれば、導電性部材と端子接続部とを導通させるための面積を十分に確保した上で導電性部材から基材の表面までの距離を大きくでき、先端部を有していない場合と先端部を有する場合との端子接続部の高さを等しくした際、先端部を有していない場合に比較して先端部を有する場合の開口部の面積が大きくなり、端子接続部に囲まれた部分の基材の体積をより大きくできる。結果、導電性部材から受ける熱サイクルによる応力をより分散でき、基材のクラックをより抑制することができる。また、中間絶縁体は例えばカーボン型内で板状の成形体の上に載せて、その上に内部電極を載せることができ、焼成前の一体化が容易に行うことができる。   According to the above process, the distance from the conductive member to the surface of the base material can be increased while ensuring a sufficient area for conducting between the conductive member and the terminal connection portion, and when the terminal portion is not provided. When the height of the terminal connection portion is equal to the height of the terminal connection portion having the tip portion, the area of the opening portion having the tip portion becomes larger than the case of not having the tip portion, and is surrounded by the terminal connection portion. The volume of the base material in the portion that is provided can be increased. As a result, stress due to the thermal cycle received from the conductive member can be further dispersed, and cracks in the base material can be further suppressed. Further, the intermediate insulator can be placed on a plate-like molded body in a carbon mold, for example, and the internal electrode can be placed thereon, so that integration before firing can be easily performed.

［８］また、本発明においては、セラミックス粉末を成形することにより中間絶縁体を作製する工程を備え、
前記第１中間体を作製する工程は、前記開口部内に配置されるように前記中間絶縁体を前記板状の成形体に重ねる工程と、前記導電性部材及び前記端子接続部と導通する導体層となる導電ペーストを前記中間絶縁体の外表面の少なくとも一部に塗布する工程とを有することが好ましい。 [8] The present invention further includes a step of forming an intermediate insulator by molding a ceramic powder,
The step of fabricating the first intermediate includes a step of superimposing the intermediate insulator on the plate-shaped molded body so as to be disposed in the opening, and a conductor layer electrically connected to the conductive member and the terminal connection part. Applying a conductive paste to be applied to at least a part of the outer surface of the intermediate insulator.

上記工程によれば、導電性部材及び端子接続部と導通する導体層となる導電ペーストを中間絶縁体の外表面の少なくとも一部に塗布するので、導電性部材から基材の表面までの距離を大きくでき、基材の表面側の絶縁層のクラックの耐性をより向上させることができる。また、中間絶縁体は例えばカーボン型内で板状の成形体の上に載せて、その上に内部電極を載せることができ、焼成前のセラミックス成形体の一体化を容易に行うことができる。   According to the above process, since the conductive paste that becomes the conductive layer that is conductive to the conductive member and the terminal connection portion is applied to at least a part of the outer surface of the intermediate insulator, the distance from the conductive member to the surface of the base material is reduced. The crack resistance of the insulating layer on the front surface side of the base material can be further improved. In addition, the intermediate insulator can be placed on a plate-like molded body in a carbon mold, for example, and the internal electrode can be placed thereon, so that the ceramic molded body before firing can be easily integrated.

［９］また、本発明においては、前記開口部が形成された前記平面電極部に、前記平面電極部とは別体に設けられた前記端子接続部の一部が折り曲げられた折り曲げ接続部を重ねて前記内部電極を作製する工程と、
セラミックス粉末を成形することにより板状の成形体を作製する工程と、
前記板状の成形体に前記内部電極を重ねることにより第１中間体を作製する工程と、
前記第１中間体を用いて、前記内部電極及び前記導電性部材が埋設されたセラミックス成形体を作製する工程と、
前記セラミックス成形体を焼成することによって、前記基材を作製する工程と、
を有することが好ましい。 [9] Further, in the present invention, a bent connection portion in which a part of the terminal connection portion provided separately from the flat electrode portion is bent is provided on the flat electrode portion having the opening. Producing the internal electrode by overlapping,
A step of producing a plate-like molded body by molding ceramic powder,
Producing a first intermediate by laminating the internal electrode on the plate-shaped molded body;
Using the first intermediate, a step of producing a ceramic molded body in which the internal electrode and the conductive member are embedded;
Baking the ceramic molded body to produce the base material,
It is preferable to have

上記工程によれば、端子接続部を平面電極部と別体にすることで、基材の厚み方向に沿った端子接続部の高さを大きくすることができ、ひいては、導電性部材から基材の表面までの距離を大きくすることができる。そのため、導電性部材と基材の熱膨張係数の差に起因する応力が発生したとしても、平面電極部に直接導電性部材が接続されている場合と比較して平面電極部よりも基材の表面側を構成する絶縁層に及ぼす応力が小さくなり、基材の表面側の絶縁層のクラックを抑制することができる。   According to the above process, the height of the terminal connection portion along the thickness direction of the base material can be increased by separating the terminal connection portion from the flat electrode portion, and thus the base material can be separated from the conductive member. The distance to the surface can be increased. Therefore, even if a stress due to the difference in thermal expansion coefficient between the conductive member and the base material occurs, the base material is more flat than the flat electrode portion compared to the case where the conductive member is directly connected to the flat electrode portion. Stress applied to the insulating layer constituting the front surface side is reduced, and cracks in the insulating layer on the front surface side of the base material can be suppressed.

第１実施形態の電極埋設部材を模式的に示す説明図。Explanatory drawing which shows typically the electrode embedding member of 1st Embodiment. 図２Ａは電極シートに切り込みを入れる工程を説明する図。図２Ｂは端子接続部を形成する工程を説明する図。図２Ｃは中間絶縁体を作製する工程を説明する図。FIG. 2A is a diagram illustrating a step of making a cut in an electrode sheet. FIG. 2B is a diagram illustrating a step of forming a terminal connection portion. FIG. 2C is a diagram illustrating a step of manufacturing an intermediate insulator. 図３Ａはセラミックス成形体を作製する工程を説明する図。図３Ｂは基材に端子穴を加工する工程を説明する図。図３Ｃは端子をロウ付けする工程を説明する図。FIG. 3A is a diagram illustrating a step of producing a ceramic molded body. FIG. 3B is a diagram illustrating a step of processing a terminal hole in a base material. FIG. 3C is a diagram illustrating a step of brazing a terminal. 第２実施形態の電極埋設部材を模式的に示す説明図。Explanatory drawing which shows typically the electrode embedding member of 2nd Embodiment. 図５Ａは中間絶縁体を作製する工程を説明する図。図５Ｂは中間絶縁体にタングステンペーストを塗布する工程を説明する図。FIG. 5A is a diagram illustrating a step of manufacturing an intermediate insulator. FIG. 5B is a diagram illustrating a step of applying a tungsten paste to the intermediate insulator. 第３実施形態の電極埋設部材を模式的に示す説明図。Explanatory drawing which shows typically the electrode embedding member of 3rd Embodiment. 図７Ａは平面電極部に開口部を形成する工程を説明する図。図７Ｂは端子接続部を形成する工程を説明する図。図７Ｃは内部電極を作製する工程を説明する図。図７Ｄは中間絶縁体を作製する工程を説明する図。図７Ｅは中間絶縁体にタングステンペーストを塗布する工程を説明する図。FIG. 7A is a diagram illustrating a step of forming an opening in a planar electrode unit. FIG. 7B is a diagram illustrating a step of forming a terminal connection portion. FIG. 7C is a diagram illustrating a step of manufacturing an internal electrode. FIG. 7D is a diagram illustrating a step of manufacturing an intermediate insulator. FIG. 7E is a diagram illustrating a step of applying a tungsten paste to the intermediate insulator.

［第１実施形態］
図１を参照して、本発明の第１実施形態の電極埋設部材１を説明する。第１実施形態の電極埋設部材１は、ウエハ保持装置であり、セラミックスとして酸化イットリウムを添加した窒化アルミニウムからなる板状の基材２と、基材２の表面２ａに沿って埋設された内部電極３と、内部電極３に導通する状態で基材２に埋設された導電性部材４と、を備えている。なお、電極埋設部材１の構成の明確化のため、図１〜図７において図示される各構成要素はデフォルメされており、実際の寸法とは異なっている。 [First Embodiment]
The electrode embedding member 1 according to the first embodiment of the present invention will be described with reference to FIG. The electrode embedding member 1 of the first embodiment is a wafer holding device, and has a plate-shaped base member 2 made of aluminum nitride to which yttrium oxide is added as ceramics, and an internal electrode embedded along a surface 2a of the base member 2. 3 and a conductive member 4 buried in the base material 2 so as to be electrically connected to the internal electrodes 3. In addition, in order to clarify the configuration of the electrode embedding member 1, each component illustrated in FIGS. 1 to 7 is deformed and is different from an actual size.

基材２の裏面２ｂには、導電性部材４の端面まで連通される端子穴５が形成されており、この端子穴５に少なくとも一部が配置されるようにして端子６が挿入され、端子６の一端が導電性部材４に接続されている。   A terminal hole 5 communicating with the end surface of the conductive member 4 is formed on the back surface 2b of the base member 2, and the terminal 6 is inserted so that at least a part of the terminal hole 5 is disposed in the terminal hole 5. One end of 6 is connected to the conductive member 4.

図１及び図２Ｂに示すように、内部電極３は、基材２の表面２ａに沿って配置されると共に開口部７が形成された平面電極部８と、基材２の厚み方向において開口部７と重なる領域を通過しないように、平面電極部８から導電性部材４側に向って延び、導電性部材４に導通する端子接続部９とを備えている。   As shown in FIG. 1 and FIG. 2B, the internal electrode 3 is arranged along the surface 2 a of the substrate 2 and has a flat electrode portion 8 in which an opening 7 is formed, and an opening in the thickness direction of the substrate 2. A terminal connection portion 9 is provided extending from the flat electrode portion 8 toward the conductive member 4 so as not to pass through a region overlapping with the terminal 7 and is electrically connected to the conductive member 4.

平面電極部８は、基材２の表面２ａから第１所定距離Ｈ１だけ離れて配置されると共に端子６の直径と同等の大きさの開口部７が形成されている。なお、実施形態では、平面電極部８は、基材２の表面２ａから第１所定距離Ｈ１だけ離れて配置されるとしたが、これに限定されず、基材２の表面２ａから平面電極部８までの距離が場所によってばらついたものも含んでも差し支えない。   The flat electrode portion 8 is arranged at a first predetermined distance H <b> 1 from the surface 2 a of the base material 2 and has an opening 7 having a size equal to the diameter of the terminal 6. In the embodiment, the flat electrode portion 8 is arranged at a first predetermined distance H1 from the surface 2a of the base material 2. However, the present invention is not limited to this. The distance up to 8 may vary depending on the location.

端子接続部９は、開口部７の縁から導電性部材４側に立ち上がり、第１所定距離Ｈ１よりも表面２ａからの距離が大きい第２所定距離Ｈ２以上離れた位置で導電性部材４に導通している。さらに、端子接続部９は、平面電極部８に一体に形成され、開口部７の縁から導電性部材４側に向って延び、端子接続部９の一部は、導電性部材４の第１面４ａに対向する先端部９ａを備えている。端子接続部９の先端部９ａは、基材２の厚み方向にみて開口する先端開口部９ｂが形成されている。   The terminal connection portion 9 rises from the edge of the opening 7 toward the conductive member 4 and is electrically connected to the conductive member 4 at a position that is at least a second predetermined distance H2 greater than the first predetermined distance H1 from the surface 2a. are doing. Further, the terminal connection portion 9 is formed integrally with the flat electrode portion 8, extends from the edge of the opening 7 toward the conductive member 4, and a part of the terminal connection portion 9 is formed by the first portion of the conductive member 4. It has a tip portion 9a facing the surface 4a. A distal end portion 9a of the terminal connection portion 9 is formed with a distal end opening portion 9b that opens when viewed in the thickness direction of the base material 2.

基材２は、表面２ａに沿って、表面２ａと平面電極部８との間に板状に形成される板状部２ｃと、この板状部２ｃに突出するように形成された凸部２ｄとを備え、凸部２ｄ上に導電ペーストの塗布と焼成を経て形成される導体層１１を介して導電性部材４が配置されている。   The base material 2 has a plate-like portion 2c formed along the surface 2a between the surface 2a and the flat electrode portion 8, and a convex portion 2d formed so as to protrude from the plate-like portion 2c. The conductive member 4 is disposed on the protrusion 2d via a conductive layer 11 formed by applying and firing a conductive paste.

基材２の表面２ａから平面電極部８の導電性部材４側の面までの距離がＨ１であり、基材２の表面２ａから先端部９ａの導電性部材４側の面までの距離がＨ２である。
また、端子接続部９は、開口部７の縁のうち異なる箇所から導電性部材４側に向って延び、同じ形状及び大きさに形成されている。 The distance from the surface 2a of the base member 2 to the surface of the flat electrode portion 8 on the conductive member 4 side is H1, and the distance from the surface 2a of the base member 2 to the front end portion 9a on the conductive member 4 side is H2. It is.
The terminal connecting portions 9 extend from different portions of the edge of the opening 7 toward the conductive member 4 and have the same shape and size.

導電性部材４は、基材２の表面２ａ側に位置する第１面４ａと、基材２の裏面２ｂ側に位置する第２面４ｂとを有しており、基材２の厚み方向において開口部７に重なるように配置されていると共に内部電極３よりも裏面２ｂ側に位置している。   The conductive member 4 has a first surface 4 a located on the front surface 2 a side of the substrate 2 and a second surface 4 b located on the back surface 2 b side of the substrate 2. It is arranged so as to overlap with the opening 7 and is located closer to the back surface 2 b than the internal electrode 3.

内部電極３と導電性部材４とは導体層１１を介して接合されている。導電性部材４と端子６とはロウ材１２を介して接合されている。   The internal electrode 3 and the conductive member 4 are joined via the conductor layer 11. The conductive member 4 and the terminal 6 are joined via a brazing material 12.

次に電極埋設部材１の製造方法について説明する。   Next, a method for manufacturing the electrode embedding member 1 will be described.

図１〜図３に示すように、電極埋設部材１の製造方法は、内部電極３を作製する工程と、中間絶縁体１３を作製する工程と、板状の成形体１４を作製する工程と、第１中間体２１を得る工程と、第２中間体２２を得る工程と、セラミックス成形体２３を作製する工程と、基材２を作製する工程と、端子穴５を加工する工程と、端子６をロウ付けする工程と、を少なくとも含む。   As shown in FIGS. 1 to 3, the method for manufacturing the electrode embedded member 1 includes a step of manufacturing the internal electrode 3, a step of manufacturing the intermediate insulator 13, and a step of manufacturing the plate-shaped molded body 14. A step of obtaining a first intermediate 21, a step of obtaining a second intermediate 22, a step of forming a ceramics body 23, a step of forming a base material 2, a step of processing a terminal hole 5, and a step of At least.

［切り込み７ａを形成する工程］
図２Ａ、図２Ｂに示すように、切り込み７ａを形成する工程は、内部電極３となる電極シートの開口部７となる位置に２つの直線状の切り込み７ａを交差するように形成する。なお、実施形態では、内部電極３となる電極シートに２つの直線状の切り込み７ａを形成したが、これに限定されず、内部電極３となる電極シートの開口部７となる位置に、一又は複数の曲線状の切込み７ａ、直線と曲線を組み合わせた形状の切り込み７ａを形成してもよい。 [Step of Forming Cut 7a]
As shown in FIG. 2A and FIG. 2B, in the step of forming the cut 7a, two linear cuts 7a are formed so as to intersect at a position to be the opening 7 of the electrode sheet to be the internal electrode 3. In the embodiment, two linear cuts 7a are formed in the electrode sheet serving as the internal electrode 3. However, the present invention is not limited to this. A plurality of curved cuts 7a and cuts 7a having a shape combining a straight line and a curve may be formed.

［内部電極３を作製する工程］
図２Ａ、図２Ｂに示すように、内部電極３を作製する工程は、切り込み７ａの複数の端点を結ぶ折り線に沿って内部電極３となる電極シートを変形させて端子接続部９を作製するとともに、開口部７を有する平面電極部８を作製する。開口部７の縁から延びる端子接続部を有する内部電極３を作製する。 [Step of fabricating internal electrode 3]
As shown in FIGS. 2A and 2B, in the step of manufacturing the internal electrode 3, the terminal sheet 9 is formed by deforming the electrode sheet serving as the internal electrode 3 along a folding line connecting a plurality of end points of the cut 7 a. At the same time, a planar electrode portion 8 having an opening 7 is produced. The internal electrode 3 having a terminal connection portion extending from the edge of the opening 7 is manufactured.

電極シートの一例として具体的には、直径２９０ｍｍのモリブデン製のメッシュ電極を用意する。メッシュ電極は、線径がφ０．１ｍｍ、メッシュサイズが＃５０である。このメッシュ電極としての平面電極部８の想像線で示す開口部７の対角線に切り込み７ａを形成する。切り込み７ａは、１０ｍｍ角の開口部７が形成されるような切り込みである。切り込み７ａを境にして電極シートの一部を切り離し、平面電極部８から突出するようにして端子接続部９を開口部７の縁から立上げる。なお、電極シートとして、箔状の電極を用いてもよい。   Specifically, a molybdenum mesh electrode having a diameter of 290 mm is prepared as an example of the electrode sheet. The mesh electrode has a wire diameter of φ0.1 mm and a mesh size of # 50. A cut 7a is formed in a diagonal line of the opening 7 indicated by an imaginary line of the plane electrode portion 8 as the mesh electrode. The cut 7a is a cut such that the opening 7 of 10 mm square is formed. A part of the electrode sheet is cut off at the cut 7a, and the terminal connection portion 9 is raised from the edge of the opening 7 so as to protrude from the flat electrode portion 8. Note that a foil-like electrode may be used as the electrode sheet.

さらに端子接続部９の一部を変形させることにより導電性部材４と対向することとなる先端部９ａを形成する（先端部９ａを形成する工程）ことで、内部電極３を作製する。このとき、端子接続部９の一部が中間絶縁体１３の導電性部材４側の面に配置されるように、端子接続部９の先端部の一部を変形させる。   Further, by deforming a part of the terminal connecting portion 9 to form a tip 9a facing the conductive member 4 (step of forming the tip 9a), the internal electrode 3 is manufactured. At this time, a part of the distal end of the terminal connection part 9 is deformed so that a part of the terminal connection part 9 is arranged on the surface of the intermediate insulator 13 on the conductive member 4 side.

平面電極部８から一体的に端子接続部９を形成するので、平面電極部８と端子接続部９とを別体に作製する場合に比較して、内部電極３を容易に製造することができる。   Since the terminal connection portion 9 is integrally formed from the flat electrode portion 8, the internal electrode 3 can be easily manufactured as compared with a case where the flat electrode portion 8 and the terminal connection portion 9 are separately manufactured. .

［中間絶縁体１３を作製する工程］
図２Ｃに示すように、中間絶縁体１３を作製する工程は、セラミックス粉末を成形することにより中間絶縁体１３を作製する。例えば、セラミックス粉末の成形体を加工して平行な２面を有する所定形状の中間絶縁体１３を作製する。中間絶縁体１３は、窒化アルミニウム粉末９５質量％、酸化イットリウム粉末５質量％からなる粉末混合物を、圧力１ｔｏｎ／ｃｍ２とするＣＩＰ成形で成形し、成形体のインゴットを得て、このインゴットを機械加工により縦幅１０ｍｍ、横幅１０ｍｍ、高さ３ｍｍの角柱形状にする。 [Step of Manufacturing Intermediate Insulator 13]
As shown in FIG. 2C, in the step of producing the intermediate insulator 13, the intermediate insulator 13 is produced by molding ceramic powder. For example, a formed body of ceramic powder is processed to produce an intermediate insulator 13 having a predetermined shape having two parallel surfaces. The intermediate insulator 13 is formed by molding a powder mixture composed of 95% by mass of aluminum nitride powder and 5% by mass of yttrium oxide powder by CIP molding at a pressure of 1 ton / cm 2 to obtain an ingot of the molded body. It is formed into a prism having a width of 10 mm, a width of 10 mm and a height of 3 mm by processing.

［板状の成形体１４を作製する工程］
図３Ａに示すように、板状の成形体１４を作製する工程では、セラミックス粉末を成形することにより板状の成形体１４を作製する。例えばカーボン型にセラミックス粉末を入れて押し固め、板状の成形体１４を作製する。絶縁層としての板状の成形体１４は、窒化アルミニウム粉末９５質量％、酸化イットリウム粉末５％からなる粉末混合物を得て、これをカーボン型に充填して一軸加圧処理を施すことにより得られ、直径３４０ｍｍ、厚さ５ｍｍの円盤である。 [Step of manufacturing plate-shaped molded body 14]
As shown in FIG. 3A, in the step of producing the plate-shaped molded body 14, the plate-shaped molded body 14 is produced by molding ceramic powder. For example, a ceramic powder is put into a carbon mold and pressed to form a plate-like molded body 14. The plate-like molded body 14 as an insulating layer is obtained by obtaining a powder mixture composed of 95% by mass of aluminum nitride powder and 5% of yttrium oxide powder, filling the mixture in a carbon mold, and performing a uniaxial pressing treatment. , A disk having a diameter of 340 mm and a thickness of 5 mm.

［第１中間体２１を作製する工程］
第１中間体２１を作製する工程では、中間絶縁体１３が開口部７内に配置されるように中間絶縁体１３及び内部電極３を板状の成形体１４に重ねる工程を介して第１中間体２１を得る。 [Step of Manufacturing First Intermediate 21]
In the step of manufacturing the first intermediate body 21, the intermediate body 13 and the internal electrode 3 are stacked on the plate-shaped molded body 14 so that the intermediate insulator 13 is arranged in the opening 7, and the first intermediate body 13 is formed. Obtain body 21.

［第２中間体２２を作製する工程］
第２中間体２２を作製する工程では、端子接続部９の先端部９ａと導電性部材４とをタングステンを含む導電ペースト１５を介して接触させるように第１中間体２１の中間絶縁体１３に導電性部材４を重ね、第２中間体２２を得る。導電性部材４は、タングステンペレットであり、縦幅１０ｍｍ、横幅１０ｍｍ、厚さ０．５ｍｍの角柱形状である。なお、導電ペーストとしては、タングステン以外にモリブデンを含む導電ペーストを用いてもよい。 [Step of manufacturing second intermediate 22]
In the step of fabricating the second intermediate 22, the tip 9a of the terminal connecting portion 9 and the conductive member 4 are brought into contact with the intermediate insulator 13 of the first intermediate 21 so as to be in contact via the conductive paste 15 containing tungsten. The second intermediate body 22 is obtained by stacking the conductive members 4. The conductive member 4 is a tungsten pellet, and has a rectangular column shape with a vertical width of 10 mm, a horizontal width of 10 mm, and a thickness of 0.5 mm. Note that a conductive paste containing molybdenum in addition to tungsten may be used as the conductive paste.

［セラミックス成形体２３を作製する工程］
セラミックス成形体２３を作製する工程では、第１中間体２１を経て作製された第２中間体２２を用いて、内部電極３及び導電性部材４が埋設されたセラミックス成形体２３を作製する。第２中間体２２にセラミックス粉末を供給して当該セラミックス粉末を固め、内部電極３、中間絶縁体１３及び導電性部材４が埋設されたセラミックス成形体２３を作製する。 [Step of manufacturing ceramic molded body 23]
In the step of producing the ceramic molded body 23, the ceramic molded body 23 in which the internal electrode 3 and the conductive member 4 are embedded is produced using the second intermediate body 22 produced through the first intermediate body 21. The ceramic powder is supplied to the second intermediate body 22 to solidify the ceramic powder, thereby producing a ceramic molded body 23 in which the internal electrode 3, the intermediate insulator 13, and the conductive member 4 are embedded.

［基材２を作製する工程］
図３Ｂに示すように、基材２を作製する工程では、セラミックス成形体２３を焼成することによって、少なくとも板状の成形体１４に中間絶縁体１３が一体化された基材２を作製する。具体的には、セラミックス成形体２３を１０ＭＰａの圧力で、焼成温度１８００℃、焼成時間２時間でホットプレス焼成を行い、直径３４０ｍｍ、厚さ３０ｍｍのセラミックス焼結体を得る。その後、得られたセラミックス焼結体の全面に研削、研磨加工を行う。 [Step of manufacturing base material 2]
As shown in FIG. 3B, in the step of manufacturing the base member 2, the base member 2 in which the intermediate insulator 13 is integrated with at least the plate-shaped formed body 14 is manufactured by firing the ceramic formed body 23. Specifically, the ceramic molded body 23 is subjected to hot press firing at a pressure of 10 MPa, a firing temperature of 1800 ° C., and a firing time of 2 hours to obtain a ceramic sintered body having a diameter of 340 mm and a thickness of 30 mm. Thereafter, grinding and polishing are performed on the entire surface of the obtained ceramic sintered body.

［端子穴５を加工する工程］
端子穴５を加工する工程では、基材２の裏面２ｂから導電性部材４まで達する端子穴５を加工する。 [Process of processing terminal hole 5]
In the step of processing the terminal holes 5, the terminal holes 5 extending from the back surface 2b of the base material 2 to the conductive member 4 are processed.

［端子６をロウ付けする工程］
端子６をロウ付けする工程では、端子穴５に端子６に挿入して端子６を導電性部材４にロウ材１２によりロウ付けする。このようにして電極埋設部材１が作製される。導電性部材４は、直径５ｍｍ、厚さ２ｍｍのタングステン製である。また端子６は、直径５ｍｍ、長さ２００ｍｍの円柱状のＮｉ製給電端子である。ロウ材１２は、Ａｕ−Ｎｉ系のロウ材であり、電極埋設部材１を真空炉により１０５０℃に加熱することによりロウ付けする。 [Step of brazing terminal 6]
In the step of brazing the terminal 6, the terminal 6 is inserted into the terminal hole 5 and the terminal 6 is brazed to the conductive member 4 with the brazing material 12. Thus, the electrode embedding member 1 is manufactured. The conductive member 4 is made of tungsten having a diameter of 5 mm and a thickness of 2 mm. The terminal 6 is a cylindrical Ni power supply terminal having a diameter of 5 mm and a length of 200 mm. The brazing material 12 is an Au—Ni-based brazing material, and is brazed by heating the electrode embedding member 1 to 1050 ° C. in a vacuum furnace.

次に、上記構成、製造方法による作用効果を説明する。   Next, the function and effect of the above configuration and manufacturing method will be described.

内部電極３は、基材２の表面２ａに沿って配置されている平面電極部８と、基材２の厚み方向において開口部７と重なる領域を通過しないように、平面電極部８から導電性部材４側に向って延び、導電性部材４に導通する端子接続部９とを備えている。   The internal electrode 3 is electrically conductive from the flat electrode portion 8 so as not to pass through a region overlapping the opening 7 in the thickness direction of the base material 2 with the flat electrode portion 8 arranged along the surface 2 a of the base material 2. A terminal connecting portion extending toward the member and connected to the conductive member;

このため、平面電極部８に直接導電性部材４を接続する場合に比較して、基材２の厚み方向に沿った端子接続部９の距離だけ、導電性部材４から基材２の表面２ａまでの距離を大きくできる。   For this reason, compared with the case where the conductive member 4 is directly connected to the flat electrode portion 8, the distance from the terminal connection portion 9 along the thickness direction of the base material 2 is equal to the distance from the conductive member 4 to the surface 2 a of the base material 2. The distance to can be increased.

このため、平面電極部８に直接導電性部材４が接続されている場合と比較して、導電性部材４と基材２の熱膨張係数の差に起因する応力が発生したとしても、平面電極部８よりも基材２の表面側を構成する板状部２ｃに及ぼす応力が小さくなり、板状部２ｃのクラックを抑制することができる。   For this reason, even if stress due to the difference in the coefficient of thermal expansion between the conductive member 4 and the base material 2 occurs, as compared to the case where the conductive member 4 is directly connected to the flat electrode portion 8, The stress exerted on the plate-like portion 2c constituting the surface side of the base material 2 is smaller than that of the portion 8, and cracks in the plate-like portion 2c can be suppressed.

詳細には、第２所定距離Ｈ２から第１所定距離Ｈ１を引いた差分だけ、導電性部材４から基材２の表面２ａまでの距離を大きくできる。このため、基材２の表面２ａから第１所定距離Ｈ１だけ離れて配置されている平面電極部８に直接導電性部材４が接続されている場合と比較して、導電性部材４と基材２の熱膨張係数の差に起因する応力が発生したとしても、平面電極部８よりも基材２の表面側を構成する板状部２ｃに及ぼす応力が小さくなり、板状部２ｃのクラックを抑制することができる。   Specifically, the distance from the conductive member 4 to the surface 2a of the base member 2 can be increased by a difference obtained by subtracting the first predetermined distance H1 from the second predetermined distance H2. For this reason, compared with the case where the conductive member 4 is directly connected to the plane electrode portion 8 arranged at the first predetermined distance H1 from the surface 2a of the base member 2, the conductive member 4 and the base member Even if stress due to the difference between the thermal expansion coefficients of the two is generated, the stress exerted on the plate-shaped portion 2c constituting the surface side of the base material 2 is smaller than that of the flat electrode portion 8, and cracks in the plate-shaped portion 2c are reduced. Can be suppressed.

さらに、端子接続部９は、平面電極部８に一体に形成され、開口部７の縁から導電性部材４側に向って延びているので、導電性部材４の位置を、平面電極部８から基材２の裏面２ｂ側へ離すことができる。結果、導電性部材４から基材２の表面２ａまでの距離を大きくできる。   Furthermore, since the terminal connection portion 9 is formed integrally with the flat electrode portion 8 and extends from the edge of the opening 7 toward the conductive member 4, the position of the conductive member 4 is moved from the flat electrode portion 8 to the It can be separated to the back surface 2b side of the base material 2. As a result, the distance from the conductive member 4 to the surface 2a of the substrate 2 can be increased.

このため、平面電極部８に直接導電性部材４が接続されている場合と比較して、導電性部材４と基材２の熱膨張係数の差に起因する応力が発生したとしても、平面電極部８よりも基材２の表面側を構成する板状部２ｃに及ぼす応力が小さくなり、板状部２ｃのクラックを抑制することができる。   For this reason, even if stress due to the difference in the coefficient of thermal expansion between the conductive member 4 and the base material 2 occurs, as compared to the case where the conductive member 4 is directly connected to the flat electrode portion 8, The stress exerted on the plate-like portion 2c constituting the surface side of the base material 2 is smaller than that of the portion 8, and cracks in the plate-like portion 2c can be suppressed.

さらには、基材２の厚み方向に沿った端子接続部９の高さを大きくすると、開口部７の面積が大きくなり、端子接続部９に囲まれた部分の基材２の体積を大きくできる。結果、導電性部材４から受ける熱サイクルによる応力を分散でき、基材２のクラックをより抑制することができる。   Furthermore, when the height of the terminal connection portion 9 along the thickness direction of the base material 2 is increased, the area of the opening 7 is increased, and the volume of the base material 2 in a portion surrounded by the terminal connection portion 9 can be increased. . As a result, stress due to the thermal cycle received from the conductive member 4 can be dispersed, and cracks in the substrate 2 can be further suppressed.

さらに、端子接続部９は、導電性部材４の第１面に対向するので、通電するための面積を十分に確保した上で、導電性部材４から基材２の表面２ａまでの距離を大きくできる。このため、平面電極部８に直接導電性部材４が接続されている場合と比較して、導電性部材４と基材２の熱膨張係数の差に起因する応力が発生したとしても、平面電極部８よりも基材２の表面側を構成する板状部２ｃに及ぼす応力が小さくなり、板状部２ｃのクラックを抑制することができる。   Further, since the terminal connection portion 9 faces the first surface of the conductive member 4, the area from the conductive member 4 to the surface 2 a of the base member 2 is increased while ensuring a sufficient area for energizing. it can. For this reason, even if stress due to the difference in the coefficient of thermal expansion between the conductive member 4 and the base material 2 occurs, as compared to the case where the conductive member 4 is directly connected to the flat electrode portion 8, The stress exerted on the plate-like portion 2c constituting the surface side of the base material 2 is smaller than that of the portion 8, and cracks in the plate-like portion 2c can be suppressed.

さらには、先端部９ａを有していない場合と先端部９ａを有する場合との端子接続部９の高さを等しくした際、先端部９ａを有していない場合に比較して先端部９ａを有する場合の開口部７の面積が大きくなり、端子接続部９に囲まれた部分の基材２の体積をより大きくできる。結果、導電性部材４から受ける熱サイクルによる応力をより分散でき、基材２のクラックをより抑制することができる。   Further, when the height of the terminal connection portion 9 is equal between the case where the terminal portion 9a is not provided and the case where the terminal portion 9a is provided, the terminal portion 9a is compared with the case where the terminal portion 9a is not provided. The area of the opening 7 when it is provided is increased, and the volume of the base material 2 in the portion surrounded by the terminal connection portion 9 can be further increased. As a result, stress due to the thermal cycle received from the conductive member 4 can be further dispersed, and cracks in the base material 2 can be further suppressed.

さらに、開口部７の縁のうち異なる箇所から導電性部材４側に向って延びる複数の端子接続部９を備えているので、熱サイクルによって生じる応力を複数の端子接続部９が分散して受けて、基材２に生じる応力も分散させることができ、基材２のクラックを抑制することができる。   Furthermore, since a plurality of terminal connection portions 9 are provided extending from different portions of the edge of the opening 7 toward the conductive member 4, the plurality of terminal connection portions 9 receive stress generated by a thermal cycle in a distributed manner. As a result, the stress generated in the substrate 2 can be dispersed, and cracks in the substrate 2 can be suppressed.

さらに、複数の端子接続部９が開口部７の縁のうち異なる箇所に同じ形状及び大きさで設けられているので、熱サイクルによって生じる応力を複数の端子接続部９が均等に分散して受けて、基材２に生じる応力も均等に分散させることができ、基材２のクラックを抑制することができる。   Furthermore, since the plurality of terminal connection portions 9 are provided at different positions on the edge of the opening 7 with the same shape and size, the plurality of terminal connection portions 9 receive the stress generated by the thermal cycle in an evenly distributed manner. Thus, the stress generated in the substrate 2 can be evenly dispersed, and cracks in the substrate 2 can be suppressed.

さらに、上記工程によれば、セラミックス成形体２３に埋設される前の内部電極３に端子接続部９を形成しているため、端子接続部９の長さを容易に調節することができ、ひいては、端子６が接続される位置を基材の表面２ａから大きく離すことができる。   Furthermore, according to the above process, since the terminal connection portion 9 is formed on the internal electrode 3 before being embedded in the ceramic molded body 23, the length of the terminal connection portion 9 can be easily adjusted, and as a result, The position where the terminal 6 is connected can be largely separated from the surface 2a of the base material.

さらに、上記工程によれば、セラミックス粉末による板状の成形体１４に中間絶縁体１３が一体的に形成され、中間絶縁体１３を内部電極３が覆う形状であるので、平面電極部８に直接導電性部材４が接続されている場合と比較して、導電性部材４の位置から基材載置面（表面２ａ）までの距離を大きくでき、平面電極部８に直接導電性部材４が接続されている場合と比較して板状部２ｃに及ぼす応力が小さくなり、板状部２ｃのクラックを抑制することができる。   Furthermore, according to the above process, the intermediate insulator 13 is integrally formed on the plate-shaped molded body 14 made of the ceramic powder, and the internal insulator 3 covers the intermediate insulator 13. Compared with the case where the conductive member 4 is connected, the distance from the position of the conductive member 4 to the substrate mounting surface (the surface 2a) can be increased, and the conductive member 4 is directly connected to the flat electrode portion 8. The stress exerted on the plate-like portion 2c is smaller than that in the case where the plate-like portion 2c is cracked.

さらに、上記工程によれば、端子接続部９を平面電極部８に一体に形成し、内部電極３を容易に作製すると共に、導電性部材４の位置から基材載置面（表面２ａ）までの距離を大きくして、よりクラックの耐性を増大させることができる。   Furthermore, according to the above process, the terminal connection portion 9 is formed integrally with the flat electrode portion 8 to easily manufacture the internal electrode 3 and to extend from the position of the conductive member 4 to the base material mounting surface (surface 2a). , The crack resistance can be further increased.

また、中間絶縁体１３は例えばカーボン型内で板状の成形体１４の上に載せて、その上に内部電極３を載せることができ、焼成前の一体化が容易に行うことができる。   In addition, the intermediate insulator 13 can be placed on the plate-shaped molded body 14 in a carbon mold, for example, and the internal electrode 3 can be placed thereon, so that integration before firing can be easily performed.

［第２実施形態］
図４を参照して、本発明の第２実施形態の電極埋設部材１を説明する。なお、第１実施形態の電極埋設部材１と同様の構成については、符号を記載して説明を省略する。 [Second embodiment]
An electrode embedding member 1 according to a second embodiment of the present invention will be described with reference to FIG. In addition, about the structure similar to the electrode embedding member 1 of 1st Embodiment, a code | symbol is described and description is abbreviate | omitted.

基材２は、板状部２ｃに突出するように凸部２ｄが形成され、凸部２ｄの導電性部材側の面及びこの面に繋がる側面の少なくとも一部に塗布された導電ペースト１５が焼成された１１が形成されている。導体層１１に導電性部材４が接続されている。   The base member 2 has a convex portion 2d formed so as to protrude from the plate-like portion 2c. 11 is formed. The conductive member 4 is connected to the conductor layer 11.

基材２の表面２ａから平面電極部８の導電性部材４側の面までの距離がＨ１であり、基材２の表面２ａから導体層１１の導電性部材４側の面までの距離がＨ２である。   The distance from the surface 2a of the substrate 2 to the surface of the flat electrode portion 8 on the conductive member 4 side is H1, and the distance from the surface 2a of the substrate 2 to the surface of the conductor layer 11 on the conductive member 4 side is H2. It is.

次に電極埋設部材１の製造方法について説明する。なお、第１実施形態と同様の工程については説明を省略する。   Next, a method for manufacturing the electrode embedding member 1 will be described. The description of the same steps as in the first embodiment is omitted.

［中間絶縁体１３を作製する工程］
図５Ａに示すように、中間絶縁体１３を作製する工程は、セラミックス粉末の成形体を加工して平行な２面を有する所定形状の中間絶縁体１３を作製する。 [Step of Manufacturing Intermediate Insulator 13]
As shown in FIG. 5A, in the step of manufacturing the intermediate insulator 13, the formed body of the ceramic powder is processed to manufacture the intermediate insulator 13 having a predetermined shape having two parallel surfaces.

［第１中間体２１を作製する工程］
図５Ａ、図５Ｂに示すように、第１中間体２１を作製する工程は、開口部７内に配置されるように中間絶縁体１３を板状の成形体１４に重ねる工程と、導電性部材４及び端子接続部９と導通する導体層１１となる導電ペースト１５を中間絶縁体１３の外表面の少なくとも一部に塗布する工程とを有する。例えば、中間絶縁体１３の導電性部材４側の面１３ａ及び面１３ａに繋がる側面１３ｂの少なくとも一部にタングステンのペースト（導電ペースト１５）を塗布する。 [Step of Manufacturing First Intermediate 21]
As shown in FIGS. 5A and 5B, the step of manufacturing the first intermediate body 21 includes a step of superimposing the intermediate insulator 13 on the plate-shaped molded body 14 so as to be disposed in the opening 7, and a step of forming the conductive member. A step of applying a conductive paste 15 to be a conductive layer 11 electrically connected to the terminal 4 and the terminal connection portion 9 to at least a part of the outer surface of the intermediate insulator 13. For example, a paste of tungsten (conductive paste 15) is applied to the surface 13a of the intermediate insulator 13 on the conductive member 4 side and at least a part of the side surface 13b connected to the surface 13a.

図４、図５Ｂに示すように、第１中間体２１を得る工程では、板状の成形体１４（図３Ａ参照）に、中間絶縁体１３が開口部７内に配置された状態で中間絶縁体１３及び内部電極３を重ね、第１中間体２１を得る。端子接続部９は、先端部が曲がらずに導電性部材４側に真っすぐに延びている。   As shown in FIGS. 4 and 5B, in the step of obtaining the first intermediate body 21, the intermediate insulator 13 is placed in the plate-shaped molded body 14 (see FIG. 3A) while the intermediate insulator 13 is disposed in the opening 7. The body 13 and the internal electrode 3 are overlapped to obtain a first intermediate 21. The terminal connection portion 9 extends straight toward the conductive member 4 without bending the tip.

［第２中間体２２を得る工程］
第２中間体２２を得る工程では、導電ペースト１５に導電性部材４が重ねられている。 [Step of Obtaining Second Intermediate 22]
In the step of obtaining the second intermediate 22, the conductive member 4 is overlaid on the conductive paste 15.

［セラミックス成形体２３を作製する工程］
セラミックス成形体２３を作製する工程では、第２中間体２２にセラミックス粉末を供給して当該セラミックス粉末を固め、内部電極３、中間絶縁体１３及び導電性部材４が埋設されたセラミックス成形体２３を作製する。 [Step of manufacturing ceramic molded body 23]
In the step of manufacturing the ceramic molded body 23, the ceramic powder is supplied to the second intermediate body 22 to solidify the ceramic powder, and the ceramic molded body 23 in which the internal electrode 3, the intermediate insulator 13 and the conductive member 4 are embedded is removed. Make it.

次に、上記構成、製造方法による作用効果を説明する。   Next, the function and effect of the above configuration and manufacturing method will be described.

上記工程によれば、導電性部材４及び端子接続部９と導通する導体層１１となる導電ペースト１５を中間絶縁体１３の外表面の少なくとも一部に塗布するので、平面電極部８に直接導電性部材４が接続されている場合と比較して、導電性部材４の位置から基材２の表面２ａまでの距離を大きくでき、板状部２ｃにおいてよりクラックの耐性を向上させることができる。また、第１実施形態と同様例えばカーボン型内での焼成前のセラミックス成形体２３の一体化を容易に行うことができる。   According to the above-described process, the conductive paste 15 that becomes the conductive layer 11 that is electrically connected to the conductive member 4 and the terminal connection portion 9 is applied to at least a part of the outer surface of the intermediate insulator 13. As compared with the case where the conductive member 4 is connected, the distance from the position of the conductive member 4 to the surface 2a of the base member 2 can be increased, and the resistance of the plate-like portion 2c to cracks can be further improved. Further, similarly to the first embodiment, for example, the ceramic molded body 23 before firing in a carbon mold can be easily integrated.

［第３実施形態］
図６を参照して、本発明の第３実施形態の電極埋設部材１を説明する。なお、第２実施形態の電極埋設部材１と同様の構成については、符号を記載して説明を省略する。 [Third embodiment]
The electrode embedding member 1 according to the third embodiment of the present invention will be described with reference to FIG. In addition, about the structure similar to the electrode embedding member 1 of 2nd Embodiment, a code | symbol is described and description is abbreviate | omitted.

内部電極３は、平面電極部８と端子接続部９とが別体に形成されている。端子接続部９の平面電極部８側には、端子接続部９の一端部から突出すると共に折り曲げられた折り曲げ接続部９ｃが一体に形成され、この折り曲げ接続部９ｃが平面電極部８に接続されている。
基材２は、板状部２ｃに突出するように凸部２ｄが形成され、凸部２ｄの導電性部材側の面及びこの面に繋がる側面の少なくとも一部に塗布された導電ペースト１５が焼成された導体層１１が形成されている。導体層１１に導電性部材４が接続されている。 The internal electrode 3 has a flat electrode portion 8 and a terminal connection portion 9 formed separately. On the side of the flat electrode portion 8 of the terminal connection portion 9, a bent connection portion 9 c protruding from one end of the terminal connection portion 9 and bent is integrally formed, and the bent connection portion 9 c is connected to the flat electrode portion 8. ing.
The base member 2 has a protrusion 2d formed so as to protrude from the plate-like portion 2c. The conductive paste 15 applied to at least a part of the surface of the protrusion 2d on the conductive member side and at least a part of the side surface connected to this surface is fired. Conductor layer 11 is formed. The conductive member 4 is connected to the conductor layer 11.

基材２の表面２ａから平面電極部８の導電性部材４側の面までの距離がＨ１であり、基材２の表面２ａから導体層１１の導電性部材４側の面までの距離がＨ２である。   The distance from the surface 2a of the substrate 2 to the surface of the flat electrode portion 8 on the conductive member 4 side is H1, and the distance from the surface 2a of the substrate 2 to the surface of the conductor layer 11 on the conductive member 4 side is H2. It is.

次に電極埋設部材１の製造方法について説明する。なお、第２実施形態と同様の工程については説明を省略する。   Next, a method for manufacturing the electrode embedding member 1 will be described. The description of the same steps as in the second embodiment is omitted.

［内部電極３を作製する工程］
図７Ａに示すように、内部電極３を作製する工程では、平面電極部８の所定の位置に開口部７を形成する。 [Step of fabricating internal electrode 3]
As shown in FIG. 7A, in the step of manufacturing the internal electrode 3, the opening 7 is formed at a predetermined position of the plane electrode unit 8.

図７Ｂに示すように、平面電極部８とは異なる電極で開口部７の縁から立ち上がる端子接続部９を作製する。なお、実施形態では、端子接続部９を平面電極部８の開口部７の縁から立ち上げるような配置としたが、これに限定されず、端子接続部９が平面電極部８から立ち上がるように配置されていれば、開口部７の縁からずれていてもよく、さらには、端子接続部９の立ち上がり位置が開口部７よりも大きい開口部７の外側の位置であってもよい。   As shown in FIG. 7B, a terminal connection portion 9 that rises from the edge of the opening 7 is formed using an electrode different from the flat electrode portion 8. In the embodiment, the terminal connection portion 9 is arranged to rise from the edge of the opening 7 of the flat electrode portion 8. However, the present invention is not limited to this, and the terminal connection portion 9 may rise from the flat electrode portion 8. If it is arranged, it may be shifted from the edge of the opening 7, and further, the rising position of the terminal connection portion 9 may be a position outside the opening 7 that is larger than the opening 7.

図７Ｃに示すように、端子接続部９を筒状に形成し、端子接続部９の一端部から突出する折り曲げ接続部９ｃを折り曲げる。折り曲げ接続部９ｃを、端子接続部９の筒状部が平面電極部８の開口部７に一致するように接続する。   As shown in FIG. 7C, the terminal connection portion 9 is formed in a cylindrical shape, and the bent connection portion 9c protruding from one end of the terminal connection portion 9 is bent. The bent connection portion 9c is connected so that the cylindrical portion of the terminal connection portion 9 matches the opening 7 of the flat electrode portion 8.

［中間絶縁体１３を作製する工程］
図７Ｄに示すように、中間絶縁体１３を作製する工程は、セラミックス粉末の成形体を加工して平行な２面を有する円柱状の中間絶縁体１３を作製する。 [Step of Manufacturing Intermediate Insulator 13]
As shown in FIG. 7D, in the step of manufacturing the intermediate insulator 13, a columnar intermediate insulator 13 having two parallel surfaces is manufactured by processing a formed body of ceramic powder.

図７Ｄ、図７Ｅに示すように、中間絶縁体１３の導電性部材４側の面１３ａ及び面１３ａに繋がる側面１３ｂの少なくとも一部にタングステンペースト（導電ペースト１５）を塗布する。   As shown in FIGS. 7D and 7E, a tungsten paste (conductive paste 15) is applied to the surface 13a of the intermediate insulator 13 on the conductive member 4 side and at least a part of the side surface 13b connected to the surface 13a.

次に、上記構成、製造方法による作用効果を説明する。   Next, the function and effect of the above configuration and manufacturing method will be described.

上記工程によれば、端子接続部９を平面電極部８と別体にすることで、端子接続部９を基材２の厚み方向に長く形成して、導電性部材４の位置から基材載置面（表面２ａ）までの距離を大きくでき、導電性部材４が基材２の表面２ａから第１所定距離Ｈ１だけ離れて配置されている場合と比較して平面電極部８よりも基材２の表面２ａ側を構成する絶縁層（板状部２ｃ）に及ぼす応力が小さくなり、基材２の表面２ａ側の絶縁層のクラックを抑制することができる。   According to the above process, the terminal connection portion 9 is formed separately from the flat electrode portion 8 so that the terminal connection portion 9 is formed to be long in the thickness direction of the base member 2, and the base member is mounted from the position of the conductive member 4. The distance to the mounting surface (surface 2 a) can be increased, and the conductive member 4 is larger than the plane electrode portion 8 in comparison with the case where the conductive member 4 is arranged at a first predetermined distance H1 from the surface 2 a of the substrate 2. The stress exerted on the insulating layer (plate-like portion 2c) constituting the surface 2a side of the substrate 2 is reduced, and cracks in the insulating layer on the surface 2a side of the substrate 2 can be suppressed.

なお、実施形態では、切り込み７ａをクロスするように形成して開口部７を円形状としたが、これに限定されず、切り込み７ａを円弧状や、１辺が抜けた矩形状に形成し、端子接続部を開口部７の縁から立ち上げてもよく、開口部７及び端子接続部９の形状は問わない。   Note that, in the embodiment, the opening 7 is formed in a circular shape by forming the cut 7a so as to cross, but the present invention is not limited to this. The terminal connecting portion may be raised from the edge of the opening 7, and the shapes of the opening 7 and the terminal connecting portion 9 are not limited.

１ 電極埋設部材
２ 基材
２ａ 表面
２ｂ 裏面
３ 内部電極
４ 導電性部材
５ 端子穴
６ 端子
７ 開口部
７ａ 切込み
８ 平面電極部
９ 端子接続部
９ａ 先端部
９ｃ 折り曲げ接続部
１３ 中間絶縁体
１３ａ 面
１３ｂ 側面
１４ 板状の成形体
２１ 第１中間体
２２ 第２中間体
２３ セラミックス成形体 REFERENCE SIGNS LIST 1 electrode embedding member 2 base material 2 a front surface 2 b back surface 3 internal electrode 4 conductive member 5 terminal hole 6 terminal 7 opening 7 a cut 8 plane electrode portion 9 terminal connection portion 9 a tip portion 9 c bending connection portion 13 intermediate insulator 13 a surface 13 b Side surface 14 Plate-shaped molded body 21 First intermediate body 22 Second intermediate body 23 Ceramic molded body

Claims (9)

表面及び裏面を有し、セラミックスからなる板状の基材と、
前記基材に埋設され、開口部が形成された内部電極と、
前記内部電極に導通する状態で前記基材に埋設され、前記基材の厚み方向において前記開口部に重なるように前記内部電極よりも前記裏面側に位置する導電性部材と、
前記基材の裏面から前記導電性部材の端面まで連通している端子穴と、
前記端子穴に少なくとも一部が配置され、前記導電性部材に接続される端子と、
を備えた電極埋設部材であって、
前記内部電極は、
前記基材の表面に沿って配置されると共に前記開口部が形成された平面電極部と、
前記基材の厚み方向において前記開口部と重なる領域を通過しないように、前記平面電極部から前記導電性部材側に向って延び、前記導電性部材に導通する端子接続部と、
を備えていることを特徴とする電極埋設部材。 A plate-shaped substrate made of ceramics having a front surface and a back surface,
Embedded in the base material, an internal electrode having an opening formed therein,
A conductive member that is embedded in the base material in a state of being electrically connected to the internal electrode and is located on the back surface side of the internal electrode so as to overlap the opening in the thickness direction of the base material,
Terminal holes communicating from the back surface of the base material to the end surface of the conductive member,
At least a part is arranged in the terminal hole, a terminal connected to the conductive member,
An electrode embedding member comprising:
The internal electrode,
A planar electrode portion arranged along the surface of the base material and having the opening formed therein,
A terminal connection portion that extends from the flat electrode portion toward the conductive member and does not pass through the conductive member, so as not to pass through a region overlapping the opening in the thickness direction of the base material,
An electrode embedding member, comprising: 請求項１に記載の電極埋設部材であって、
前記端子接続部は、前記平面電極部に一体に形成され、前記開口部の縁から前記導電性部材側に向って延びていることを特徴とする電極埋設部材。 The electrode embedding member according to claim 1,
The electrode embedding member, wherein the terminal connection portion is formed integrally with the flat electrode portion and extends from an edge of the opening toward the conductive member. 請求項１又は請求項２に記載の電極埋設部材であって、
前記導電性部材は、前記基材の表面側に位置する第１面と、前記基材の裏面側に位置する第２面とを有し、
前記端子接続部の一部は、前記第１面に対向する先端部を備えていることを特徴とする電極埋設部材。 It is an electrode embedding member according to claim 1 or claim 2,
The conductive member has a first surface located on the front surface side of the substrate, and a second surface located on the back surface side of the substrate,
An electrode embedding member, wherein a part of the terminal connection portion has a tip portion facing the first surface. 請求項２又は請求項３に記載の電極埋設部材であって、
前記開口部の縁のうち異なる箇所から導電性部材側に向って延びる複数の前記端子接続部を備えていることを特徴とする電極埋設部材。 The electrode burying member according to claim 2 or 3, wherein
An electrode burying member, comprising: a plurality of terminal connection portions extending from different portions of the edge of the opening toward a conductive member. 請求項２〜請求項４のいずれか１項に記載の電極埋設部材であって、
前記開口部の縁のうち異なる箇所に同じ形状及び大きさで設けられている複数の前記端子接続部を備えていることを特徴とする電極埋設部材。 It is an electrode embedding member according to any one of claims 2 to 4,
An electrode embedding member, comprising: a plurality of the terminal connection portions provided in different positions in the edge of the opening with the same shape and size. 請求項１に記載の電極埋設部材の製造方法であって、
前記内部電極となる電極シートの前記開口部となる位置に切り込みを形成する工程と、
前記切り込みの複数の端点を結ぶ折り線に沿って前記電極シートを変形させることにより前記開口部を有する前記平面電極部と、前記開口部の縁から延びる前記端子接続部を有する前記内部電極を作製する工程と、
セラミックス粉末を成形することにより板状の成形体を作製する工程と、
前記板状の成形体に、前記内部電極を重ねることにより、第１中間体を作製する工程と、
前記第１中間体を用いて、前記内部電極及び前記導電性部材が埋設されたセラミックス成形体を作製する工程と、
前記セラミックス成形体を焼成することによって、前記基材を作製する工程と、
を有することを特徴とする電極埋設部材の製造方法。 It is a manufacturing method of the electrode embedding member of Claim 1, Comprising:
Forming a cut at a position to be the opening of the electrode sheet serving as the internal electrode;
By deforming the electrode sheet along a folding line connecting a plurality of end points of the cut, the planar electrode portion having the opening and the internal electrode having the terminal connection portion extending from an edge of the opening are formed. The process of
A step of producing a plate-like molded body by molding ceramic powder,
A step of producing a first intermediate by laminating the internal electrode on the plate-like molded body;
Using the first intermediate, a step of producing a ceramic molded body in which the internal electrode and the conductive member are embedded;
Baking the ceramic molded body to produce the base material,
A method for producing an electrode-embedded member, comprising: 請求項６に記載の電極埋設部材の製造方法であって、
セラミックス粉末を成形することにより中間絶縁体を作製する工程を備え、
前記第１中間体を作製する工程は、前記開口部内に配置されるように前記中間絶縁体を前記板状の成形体に重ねる工程を含み、
前記内部電極を作製する工程は、前記端子接続部の一部を変形させることにより前記導電性部材と対向することとなる前記端子接続部の先端部を形成する工程を含むことを特徴とする電極埋設部材の製造方法。 It is a manufacturing method of the electrode embedding member of Claim 6, Comprising:
Comprising a step of forming an intermediate insulator by molding a ceramic powder,
The step of producing the first intermediate includes a step of superimposing the intermediate insulator on the plate-shaped molded body so as to be disposed in the opening,
The step of manufacturing the internal electrode includes a step of forming a tip portion of the terminal connection portion that faces the conductive member by partially deforming the terminal connection portion. A method for manufacturing a buried member. 請求項６又は請求項７に記載の電極埋設部材の製造方法であって、
セラミックス粉末を成形することにより中間絶縁体を作製する工程を備え、
前記第１中間体を作製する工程は、前記開口部内に配置されるように前記中間絶縁体を前記板状の成形体に重ねる工程と、前記導電性部材及び前記端子接続部と導通する導体層となる導電ペーストを前記中間絶縁体の外表面の少なくとも一部に塗布する工程とを有することを特徴とする電極埋設部材の製造方法。 It is a manufacturing method of the electrode embedding member of Claim 6 or Claim 7, Comprising:
Comprising a step of forming an intermediate insulator by molding a ceramic powder,
The step of fabricating the first intermediate includes a step of superimposing the intermediate insulator on the plate-shaped molded body so as to be disposed in the opening, and a conductor layer electrically connected to the conductive member and the terminal connection part. Applying a conductive paste to be applied to at least a part of the outer surface of the intermediate insulator. 請求項１に記載の電極埋設部材の製造方法であって、
前記開口部が形成された前記平面電極部に、前記平面電極部とは別体に設けられた前記端子接続部の一部が折り曲げられた折り曲げ接続部を重ねて前記内部電極を作製する工程と、
セラミックス粉末を成形することにより板状の成形体を作製する工程と、
前記板状の成形体に前記内部電極を重ねることにより第１中間体を作製する工程と、
前記第１中間体を用いて、前記内部電極及び前記導電性部材が埋設されたセラミックス成形体を作製する工程と、
前記セラミックス成形体を焼成することによって、前記基材を作製する工程と、
を有することを特徴とする電極埋設部材の製造方法。 It is a manufacturing method of the electrode embedding member of Claim 1, Comprising:
A step of forming the internal electrode by superimposing a bent connection part obtained by partially bending the terminal connection part provided separately from the plane electrode part on the plane electrode part in which the opening is formed; ,
A step of producing a plate-like molded body by molding ceramic powder,
Producing a first intermediate by laminating the internal electrode on the plate-shaped molded body;
Using the first intermediate, a step of producing a ceramic molded body in which the internal electrode and the conductive member are embedded;
Baking the ceramic molded body to produce the base material,
A method for producing an electrode-embedded member, comprising:
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004531004A (en) * 2001-06-29 2004-10-07 セキュアー システムズ リミテッド Security system and method for computer
US20070169703A1 (en) * 2006-01-23 2007-07-26 Brent Elliot Advanced ceramic heater for substrate processing

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JP4531004B2 (en) 2006-03-24 2010-08-25 日本碍子株式会社 Heating device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004531004A (en) * 2001-06-29 2004-10-07 セキュアー システムズ リミテッド Security system and method for computer
US20070169703A1 (en) * 2006-01-23 2007-07-26 Brent Elliot Advanced ceramic heater for substrate processing

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