JP2020004950A - 積層型電子部品及びその実装基板 - Google Patents
積層型電子部品及びその実装基板 Download PDFInfo
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- JP2020004950A JP2020004950A JP2019067366A JP2019067366A JP2020004950A JP 2020004950 A JP2020004950 A JP 2020004950A JP 2019067366 A JP2019067366 A JP 2019067366A JP 2019067366 A JP2019067366 A JP 2019067366A JP 2020004950 A JP2020004950 A JP 2020004950A
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- 239000003990 capacitor Substances 0.000 claims abstract description 67
- 238000007747 plating Methods 0.000 claims abstract description 64
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 50
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 17
- 230000005534 acoustic noise Effects 0.000 abstract description 13
- 229910000679 solder Inorganic materials 0.000 description 17
- 239000000919 ceramic Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
110 キャパシタ本体
111 誘電体層
121、122 第1及び第2内部電極
131、132 第1及び第2外部電極
131a、132a 第1及び第2接続部
131b、132b 第1及び第2バンド部
210 チップ本体
211 誘電体層
221、222 第3及び第4内部電極
231、232 第1及び第2外部端子
231a、232a 第3及び第4接続部
231b、232b 第3及び第4バンド部
310 基板
321、322 第1及び第2電極パッド
331、332 半田
Claims (9)
- キャパシタ本体及び前記キャパシタ本体の両端に形成される第1及び第2外部電極を含む積層型キャパシタと、
チップ本体及び前記チップ本体の両端に形成される第3及び第4外部電極を含み、第1及び第2外部端子が前記第1及び第2外部電極にそれぞれ接するように配置されるアルミナチップと、
前記第1外部電極と前記第1外部端子とをカバーする第1めっき層と、
前記第2外部電極と前記第2外部端子とをカバーする第2めっき層と、を含み、
前記第1及び第2めっき層は、外部電極と外部端子上に形成されるニッケルめっき層と、前記ニッケルめっき層上に形成される錫めっき層と、を含む、積層型電子部品。 - 前記アルミナチップの全長が前記積層型キャパシタの全長よりも短く形成される、請求項1に記載の積層型電子部品。
- 前記第1及び第2外部電極を連結する方向に、前記第1外部電極と前記第1外部端子との間、及び前記第2外部電極と前記第2外部端子との間に段部がそれぞれ形成される、請求項1又は2に記載の積層型電子部品。
- 前記アルミナチップの全幅が前記積層型キャパシタの全幅よりも短く形成される、請求項1から3のいずれか1項に記載の積層型電子部品。
- 前記第1及び第2外部電極を連結する方向と交差する方向に、前記第1外部電極と前記第1外部端子との間、及び前記第2外部電極と前記第2外部端子との間に段部がそれぞれ形成される、請求項1から4のいずれか1項に記載の積層型電子部品。
- 前記キャパシタ本体は、複数の誘電体層及び前記誘電体層を挟んで交互に配置される複数の第1及び第2内部電極を含み、互いに対向する第1及び第2面と、前記第1及び第2面と連結され、互いに対向する第3及び第4面と、前記第1及び第2面と連結され、且つ前記第3及び第4面と連結され、互いに対向する第5及び第6面と、を含み、前記第1及び第2内部電極の一端が前記第3及び第4面を介してそれぞれ露出し、
前記チップ本体は、複数の誘電体層及び前記誘電体層を挟んで交互に配置される複数の第3及び第4内部電極を含み、互いに対向する第7及び第8面と、前記第7及び第8面と連結され、互いに対向する第9及び第10面と、前記第7及び第8面と連結され、且つ前記第9及び第10面と連結され、互いに対向する第11及び第12面と、を含み、前記第3及び第4内部電極の一端が前記第9及び第10面を介してそれぞれ露出する、請求項1から5のいずれか1項に記載の積層型電子部品。 - 前記第1及び第2外部電極は、前記キャパシタ本体の前記第3及び第4面にそれぞれ配置される第1及び第2接続部と、前記第1及び第2接続部から前記キャパシタ本体の前記第1面の一部まで延長される第1及び第2バンド部と、をそれぞれ含み、
前記第1及び第2外部端子は、前記チップ本体の前記第9及び第10面にそれぞれ配置される第3及び第4接続部と、前記第3及び第4接続部から上記チップ本体の前記第7及び第8面の一部まで延長される第3及び第4バンド部と、をそれぞれ含む、請求項6に記載の積層型電子部品。 - 前記第1及び第2外部電極と前記第1及び第2外部端子との表面にめっき層がそれぞれさらに形成される、請求項1から7のいずれか1項に記載の積層型電子部品。
- 一面に第1及び第2電極パッドを有する基板と、
前記第1及び第2電極パッド上に第1及び第2外部端子がそれぞれ接続されるように実装される請求項1から請求項8のいずれか一項に記載の積層型電子部品と、を含む、積層型電子部品の実装基板。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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KR20180075792 | 2018-06-29 | ||
KR10-2018-0075792 | 2018-06-29 | ||
KR20180089658 | 2018-08-01 | ||
KR10-2018-0089658 | 2018-08-01 |
Publications (2)
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JP2020004950A true JP2020004950A (ja) | 2020-01-09 |
JP6927532B2 JP6927532B2 (ja) | 2021-09-01 |
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JP2019067366A Active JP6927532B2 (ja) | 2018-06-29 | 2019-03-29 | 積層型電子部品及びその実装基板 |
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US (1) | US10910163B2 (ja) |
JP (1) | JP6927532B2 (ja) |
CN (1) | CN110660587B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20220033178A (ko) * | 2020-09-09 | 2022-03-16 | 삼성전기주식회사 | 전자 부품 및 그 실장 기판 |
JP2022183976A (ja) * | 2021-05-31 | 2022-12-13 | 株式会社村田製作所 | 電子部品 |
JP2022183971A (ja) * | 2021-05-31 | 2022-12-13 | 株式会社村田製作所 | 電子部品 |
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US20200006003A1 (en) | 2020-01-02 |
CN110660587A (zh) | 2020-01-07 |
US10910163B2 (en) | 2021-02-02 |
JP6927532B2 (ja) | 2021-09-01 |
CN110660587B (zh) | 2022-04-19 |
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