JP2019513115A - 腐食防止剤が塗布された表面 - Google Patents
腐食防止剤が塗布された表面 Download PDFInfo
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- JP2019513115A JP2019513115A JP2018548723A JP2018548723A JP2019513115A JP 2019513115 A JP2019513115 A JP 2019513115A JP 2018548723 A JP2018548723 A JP 2018548723A JP 2018548723 A JP2018548723 A JP 2018548723A JP 2019513115 A JP2019513115 A JP 2019513115A
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- silane
- mol
- cement
- molecular weight
- cement structure
- Prior art date
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- 230000007797 corrosion Effects 0.000 title claims abstract description 88
- 238000005260 corrosion Methods 0.000 title claims abstract description 88
- 239000003112 inhibitor Substances 0.000 title claims abstract description 49
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 169
- 229910000077 silane Inorganic materials 0.000 claims abstract description 169
- 239000004568 cement Substances 0.000 claims abstract description 149
- 239000000203 mixture Substances 0.000 claims abstract description 135
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 61
- 239000010959 steel Substances 0.000 claims abstract description 61
- 239000008393 encapsulating agent Substances 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 43
- 238000007789 sealing Methods 0.000 claims abstract description 38
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000000126 substance Substances 0.000 claims abstract description 21
- 239000002904 solvent Substances 0.000 claims abstract description 13
- 239000003566 sealing material Substances 0.000 claims abstract 3
- -1 alkyl acetamides Chemical class 0.000 claims description 65
- 239000004567 concrete Substances 0.000 claims description 37
- 229910019142 PO4 Inorganic materials 0.000 claims description 29
- 239000010452 phosphate Substances 0.000 claims description 27
- 239000000565 sealant Substances 0.000 claims description 27
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 claims description 25
- ALVYUZIFSCKIFP-UHFFFAOYSA-N triethoxy(2-methylpropyl)silane Chemical compound CCO[Si](CC(C)C)(OCC)OCC ALVYUZIFSCKIFP-UHFFFAOYSA-N 0.000 claims description 22
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 claims description 17
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 15
- HRKAMJBPFPHCSD-UHFFFAOYSA-N Tri-isobutylphosphate Chemical compound CC(C)COP(=O)(OCC(C)C)OCC(C)C HRKAMJBPFPHCSD-UHFFFAOYSA-N 0.000 claims description 15
- 150000001412 amines Chemical class 0.000 claims description 15
- 229940113088 dimethylacetamide Drugs 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 150000003839 salts Chemical class 0.000 claims description 13
- TVDSBUOJIPERQY-UHFFFAOYSA-N prop-2-yn-1-ol Chemical compound OCC#C TVDSBUOJIPERQY-UHFFFAOYSA-N 0.000 claims description 11
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 claims description 10
- YGUFXEJWPRRAEK-UHFFFAOYSA-N dodecyl(triethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OCC)(OCC)OCC YGUFXEJWPRRAEK-UHFFFAOYSA-N 0.000 claims description 10
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 claims description 10
- RSKGMYDENCAJEN-UHFFFAOYSA-N hexadecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OC)(OC)OC RSKGMYDENCAJEN-UHFFFAOYSA-N 0.000 claims description 10
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical group CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004570 mortar (masonry) Substances 0.000 claims description 10
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 claims description 10
- UWSYCPWEBZRZNJ-UHFFFAOYSA-N trimethoxy(2,4,4-trimethylpentyl)silane Chemical compound CO[Si](OC)(OC)CC(C)CC(C)(C)C UWSYCPWEBZRZNJ-UHFFFAOYSA-N 0.000 claims description 10
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical group CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 claims description 10
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 9
- SCPWMSBAGXEGPW-UHFFFAOYSA-N dodecyl(trimethoxy)silane Chemical compound CCCCCCCCCCCC[Si](OC)(OC)OC SCPWMSBAGXEGPW-UHFFFAOYSA-N 0.000 claims description 9
- 239000011574 phosphorus Substances 0.000 claims description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims description 9
- 229920000570 polyether Polymers 0.000 claims description 9
- HXOGQBSDPSMHJK-UHFFFAOYSA-N triethoxy(6-methylheptyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCCCC(C)C HXOGQBSDPSMHJK-UHFFFAOYSA-N 0.000 claims description 9
- XYJRNCYWTVGEEG-UHFFFAOYSA-N trimethoxy(2-methylpropyl)silane Chemical compound CO[Si](OC)(OC)CC(C)C XYJRNCYWTVGEEG-UHFFFAOYSA-N 0.000 claims description 9
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims description 7
- 150000003918 triazines Chemical class 0.000 claims description 7
- QXIVQIQPZWALGC-UHFFFAOYSA-N 9-methyl-2-phenoxydecanoic acid Chemical compound CC(C)CCCCCCC(Oc1ccccc1)C(O)=O QXIVQIQPZWALGC-UHFFFAOYSA-N 0.000 claims description 6
- NCXUIEDQTCQZRK-UHFFFAOYSA-L disodium;decanedioate Chemical compound [Na+].[Na+].[O-]C(=O)CCCCCCCCC([O-])=O NCXUIEDQTCQZRK-UHFFFAOYSA-L 0.000 claims description 6
- AJFDBNQQDYLMJN-UHFFFAOYSA-N n,n-diethylacetamide Chemical compound CCN(CC)C(C)=O AJFDBNQQDYLMJN-UHFFFAOYSA-N 0.000 claims description 6
- NJGCRMAPOWGWMW-UHFFFAOYSA-N octylphosphonic acid Chemical compound CCCCCCCCP(O)(O)=O NJGCRMAPOWGWMW-UHFFFAOYSA-N 0.000 claims description 6
- FZQMJOOSLXFQSU-UHFFFAOYSA-N 3-[3,5-bis[3-(dimethylamino)propyl]-1,3,5-triazinan-1-yl]-n,n-dimethylpropan-1-amine Chemical compound CN(C)CCCN1CN(CCCN(C)C)CN(CCCN(C)C)C1 FZQMJOOSLXFQSU-UHFFFAOYSA-N 0.000 claims description 5
- BAAAEEDPKUHLID-UHFFFAOYSA-N decyl(triethoxy)silane Chemical compound CCCCCCCCCC[Si](OCC)(OCC)OCC BAAAEEDPKUHLID-UHFFFAOYSA-N 0.000 claims description 5
- WRKCIHRWQZQBOL-UHFFFAOYSA-N octyl dihydrogen phosphate Chemical compound CCCCCCCCOP(O)(O)=O WRKCIHRWQZQBOL-UHFFFAOYSA-N 0.000 claims description 5
- 239000012466 permeate Substances 0.000 abstract 1
- 235000021317 phosphate Nutrition 0.000 description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 8
- 239000012738 dissolution medium Substances 0.000 description 8
- 239000011396 hydraulic cement Substances 0.000 description 8
- 230000002787 reinforcement Effects 0.000 description 8
- 239000011398 Portland cement Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 6
- 150000004756 silanes Chemical group 0.000 description 6
- OYGYKEULCAINCL-UHFFFAOYSA-N triethoxy(hexadecyl)silane Chemical compound CCCCCCCCCCCCCCCC[Si](OCC)(OCC)OCC OYGYKEULCAINCL-UHFFFAOYSA-N 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 239000004576 sand Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 231100000676 disease causative agent Toxicity 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- 239000002893 slag Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical group CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 3
- FBXFOZZBULDQCV-UHFFFAOYSA-N 2-cyclohexylethyl(diethoxy)silane Chemical compound CCO[SiH](OCC)CCC1CCCCC1 FBXFOZZBULDQCV-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- SJJCABYOVIHNPZ-UHFFFAOYSA-N cyclohexyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C1CCCCC1 SJJCABYOVIHNPZ-UHFFFAOYSA-N 0.000 description 3
- RTYZQVDVGVAXSW-UHFFFAOYSA-N cyclohexylmethyl(diethoxy)silane Chemical compound CCO[SiH](OCC)CC1CCCCC1 RTYZQVDVGVAXSW-UHFFFAOYSA-N 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- ZMAPKOCENOWQRE-UHFFFAOYSA-N diethoxy(diethyl)silane Chemical compound CCO[Si](CC)(CC)OCC ZMAPKOCENOWQRE-UHFFFAOYSA-N 0.000 description 3
- VSYLGGHSEIWGJV-UHFFFAOYSA-N diethyl(dimethoxy)silane Chemical compound CC[Si](CC)(OC)OC VSYLGGHSEIWGJV-UHFFFAOYSA-N 0.000 description 3
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 3
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 3
- 230000036571 hydration Effects 0.000 description 3
- 238000006703 hydration reaction Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- 150000003014 phosphoric acid esters Chemical class 0.000 description 3
- 230000010287 polarization Effects 0.000 description 3
- 239000011150 reinforced concrete Substances 0.000 description 3
- 230000008439 repair process Effects 0.000 description 3
- 229920006395 saturated elastomer Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000012855 volatile organic compound Substances 0.000 description 3
- XMTYMJRPVFGBIM-UHFFFAOYSA-N 2-ethoxyethoxysilane Chemical compound CCOCCO[SiH3] XMTYMJRPVFGBIM-UHFFFAOYSA-N 0.000 description 2
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 235000019738 Limestone Nutrition 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- 241000233855 Orchidaceae Species 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 235000011941 Tilia x europaea Nutrition 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- NLANKNMPZSGGEF-UHFFFAOYSA-N butyl(triethyl)silane Chemical compound CCCC[Si](CC)(CC)CC NLANKNMPZSGGEF-UHFFFAOYSA-N 0.000 description 2
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 2
- 239000000920 calcium hydroxide Substances 0.000 description 2
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 2
- 235000011116 calcium hydroxide Nutrition 0.000 description 2
- 235000012241 calcium silicate Nutrition 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- XFWJKVMFIVXPKK-UHFFFAOYSA-N calcium;oxido(oxo)alumane Chemical compound [Ca+2].[O-][Al]=O.[O-][Al]=O XFWJKVMFIVXPKK-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- QEPVYYOIYSITJK-UHFFFAOYSA-N cyclohexyl-ethyl-dimethoxysilane Chemical compound CC[Si](OC)(OC)C1CCCCC1 QEPVYYOIYSITJK-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- HOOWDPSAHIOHCC-UHFFFAOYSA-N dialuminum tricalcium oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[Al+3].[Al+3].[Ca++].[Ca++].[Ca++] HOOWDPSAHIOHCC-UHFFFAOYSA-N 0.000 description 2
- BCAARMUWIRURQS-UHFFFAOYSA-N dicalcium;oxocalcium;silicate Chemical compound [Ca+2].[Ca+2].[Ca]=O.[O-][Si]([O-])([O-])[O-] BCAARMUWIRURQS-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- CWAFVXWRGIEBPL-UHFFFAOYSA-N ethoxysilane Chemical group CCO[SiH3] CWAFVXWRGIEBPL-UHFFFAOYSA-N 0.000 description 2
- 239000010440 gypsum Substances 0.000 description 2
- 229910052602 gypsum Inorganic materials 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 239000004571 lime Substances 0.000 description 2
- 239000006028 limestone Substances 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000011404 masonry cement Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011412 natural cement Substances 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 235000019976 tricalcium silicate Nutrition 0.000 description 2
- 229910021534 tricalcium silicate Inorganic materials 0.000 description 2
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 2
- JWZZKOKVBUJMES-UHFFFAOYSA-N (+-)-Isoprenaline Chemical compound CC(C)NCC(O)C1=CC=C(O)C(O)=C1 JWZZKOKVBUJMES-UHFFFAOYSA-N 0.000 description 1
- UVDDHYAAWVNATK-VGKOASNMSA-L (z)-4-[dibutyl-[(z)-4-oxopent-2-en-2-yl]oxystannyl]oxypent-3-en-2-one Chemical compound CC(=O)\C=C(C)/O[Sn](CCCC)(CCCC)O\C(C)=C/C(C)=O UVDDHYAAWVNATK-VGKOASNMSA-L 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- JZGPNMKIIPNQMH-UHFFFAOYSA-N 2,2-dimethylpropyl(triethoxy)silane Chemical compound CCO[Si](CC(C)(C)C)(OCC)OCC JZGPNMKIIPNQMH-UHFFFAOYSA-N 0.000 description 1
- WBRUCSICGDSGEV-UHFFFAOYSA-N 2,2-dimethylpropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CC(C)(C)C WBRUCSICGDSGEV-UHFFFAOYSA-N 0.000 description 1
- URDAVQKDFNDILU-UHFFFAOYSA-N 2,2-dimethylpropyl-tris(2-ethoxyethoxy)silane Chemical compound C(C(C)(C)C)[Si](OCCOCC)(OCCOCC)OCCOCC URDAVQKDFNDILU-UHFFFAOYSA-N 0.000 description 1
- YKKMMPJUYUYBKY-UHFFFAOYSA-N 2,2-dimethylpropyl-tris(2-methoxyethoxy)silane Chemical compound C(C(C)(C)C)[Si](OCCOC)(OCCOC)OCCOC YKKMMPJUYUYBKY-UHFFFAOYSA-N 0.000 description 1
- NHBXDSYTVRGKAV-UHFFFAOYSA-N 2-cyclohexylethyl-bis(2-ethoxyethoxy)silane Chemical compound C1(CCCCC1)CC[SiH](OCCOCC)OCCOCC NHBXDSYTVRGKAV-UHFFFAOYSA-N 0.000 description 1
- GNXJLFJVULVOIC-UHFFFAOYSA-N 2-cyclohexylethyl-bis(2-methoxyethoxy)silane Chemical compound C1(CCCCC1)CC[SiH](OCCOC)OCCOC GNXJLFJVULVOIC-UHFFFAOYSA-N 0.000 description 1
- JLMKCWZTLGYULD-UHFFFAOYSA-N 2-ethoxyethoxy(trihexadecyl)silane Chemical compound C(CCCCCCCCCCCCCCC)[Si](OCCOCC)(CCCCCCCCCCCCCCCC)CCCCCCCCCCCCCCCC JLMKCWZTLGYULD-UHFFFAOYSA-N 0.000 description 1
- MASJQKCHJPRBCT-UHFFFAOYSA-N 2-ethoxyethoxy(trihexyl)silane Chemical compound CCCCCC[Si](CCCCCC)(CCCCCC)OCCOCC MASJQKCHJPRBCT-UHFFFAOYSA-N 0.000 description 1
- QXFMGPZJCKOKTK-UHFFFAOYSA-N 2-ethoxyethoxy(trimethyl)silane Chemical compound CCOCCO[Si](C)(C)C QXFMGPZJCKOKTK-UHFFFAOYSA-N 0.000 description 1
- ADUACEATWPGKHZ-UHFFFAOYSA-N 2-ethoxyethoxy(trioctyl)silane Chemical compound C(CCCCCCC)[Si](OCCOCC)(CCCCCCCC)CCCCCCCC ADUACEATWPGKHZ-UHFFFAOYSA-N 0.000 description 1
- FRTDUGKCDWKQOP-UHFFFAOYSA-N 2-ethoxyethoxy(tripentyl)silane Chemical compound C(CCCC)[Si](OCCOCC)(CCCCC)CCCCC FRTDUGKCDWKQOP-UHFFFAOYSA-N 0.000 description 1
- PKLMTNAOMMXVFP-UHFFFAOYSA-N 2-ethoxyethoxy-[2,3,4-tri(nonyl)phenyl]silane Chemical class C(CCCCCCCC)C1=C(C(=C(C=C1)[SiH2]OCCOCC)CCCCCCCCC)CCCCCCCCC PKLMTNAOMMXVFP-UHFFFAOYSA-N 0.000 description 1
- WMRVTRYWYHUEEC-UHFFFAOYSA-N 2-ethoxyethoxy-tri(nonyl)silane Chemical compound C(CCCCCCCC)[Si](OCCOCC)(CCCCCCCCC)CCCCCCCCC WMRVTRYWYHUEEC-UHFFFAOYSA-N 0.000 description 1
- KGGQDDLNUVYEFI-UHFFFAOYSA-N 2-ethoxyethoxy-tri(propan-2-yl)silane Chemical compound C(C)(C)[Si](OCCOCC)(C(C)C)C(C)C KGGQDDLNUVYEFI-UHFFFAOYSA-N 0.000 description 1
- VCUWWLPCGBUPAQ-UHFFFAOYSA-N 2-ethoxyethoxy-tri(tetradecyl)silane Chemical compound C(CCCCCCCCCCCCC)[Si](OCCOCC)(CCCCCCCCCCCCCC)CCCCCCCCCCCCCC VCUWWLPCGBUPAQ-UHFFFAOYSA-N 0.000 description 1
- RGEGLNUQENRULU-UHFFFAOYSA-N 2-ethoxyethoxy-tri(undecyl)silane Chemical compound C(CCCCCCCCCC)[Si](OCCOCC)(CCCCCCCCCCC)CCCCCCCCCCC RGEGLNUQENRULU-UHFFFAOYSA-N 0.000 description 1
- MRGNUQWBHUKWSP-UHFFFAOYSA-N 2-ethoxyethoxy-tris(3-methylbutyl)silane Chemical compound C(CC(C)C)[Si](OCCOCC)(CCC(C)C)CCC(C)C MRGNUQWBHUKWSP-UHFFFAOYSA-N 0.000 description 1
- JSJUSBGCJCFNFI-UHFFFAOYSA-N 2-ethoxyethoxy-tris(4-methylpentyl)silane Chemical compound C(CCC(C)C)[Si](OCCOCC)(CCCC(C)C)CCCC(C)C JSJUSBGCJCFNFI-UHFFFAOYSA-N 0.000 description 1
- UPZBRGXIYHQVKK-UHFFFAOYSA-N 2-ethoxyethoxy-tris(6-methylheptyl)silane Chemical compound C(CCCCC(C)C)[Si](OCCOCC)(CCCCCC(C)C)CCCCCC(C)C UPZBRGXIYHQVKK-UHFFFAOYSA-N 0.000 description 1
- UJMZZAZBRIPOHZ-UHFFFAOYSA-N 2-ethylhexan-1-ol;titanium Chemical compound [Ti].CCCCC(CC)CO UJMZZAZBRIPOHZ-UHFFFAOYSA-N 0.000 description 1
- HRDKXAGASFLTCG-UHFFFAOYSA-N 2-methoxyethoxy(trimethyl)silane Chemical compound COCCO[Si](C)(C)C HRDKXAGASFLTCG-UHFFFAOYSA-N 0.000 description 1
- UVMVNBCAEIPMNL-UHFFFAOYSA-N 2-methoxyethoxy(trioctadecyl)silane Chemical compound C(CCCCCCCCCCCCCCCCC)[Si](OCCOC)(CCCCCCCCCCCCCCCCCC)CCCCCCCCCCCCCCCCCC UVMVNBCAEIPMNL-UHFFFAOYSA-N 0.000 description 1
- YDYSZZWQOLQYMA-UHFFFAOYSA-N 2-methoxyethoxy(trioctyl)silane Chemical compound C(CCCCCCC)[Si](OCCOC)(CCCCCCCC)CCCCCCCC YDYSZZWQOLQYMA-UHFFFAOYSA-N 0.000 description 1
- DUFVMVQDPQCQKI-UHFFFAOYSA-N 2-methoxyethoxy(tripentyl)silane Chemical compound C(CCCC)[Si](OCCOC)(CCCCC)CCCCC DUFVMVQDPQCQKI-UHFFFAOYSA-N 0.000 description 1
- ZQONFWJXVGHRQN-UHFFFAOYSA-N 2-methoxyethoxy(triphenyl)silane Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(OCCOC)C1=CC=CC=C1 ZQONFWJXVGHRQN-UHFFFAOYSA-N 0.000 description 1
- QLPQKMODLFZLIA-UHFFFAOYSA-N 2-methoxyethoxy(tripropyl)silane Chemical compound C(CC)[Si](OCCOC)(CCC)CCC QLPQKMODLFZLIA-UHFFFAOYSA-N 0.000 description 1
- LFKAMYJJDYRFAP-UHFFFAOYSA-N 2-methoxyethoxy-[2,3,4-tri(nonyl)phenyl]silane Chemical compound C(CCCCCCCC)C1=C(C(=C(C=C1)[SiH2]OCCOC)CCCCCCCCC)CCCCCCCCC LFKAMYJJDYRFAP-UHFFFAOYSA-N 0.000 description 1
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- LIRFHMCNMHIIKF-UHFFFAOYSA-N tris(2,2-dimethylpropyl)-methoxysilane Chemical compound CC(C)(C)C[Si](OC)(CC(C)(C)C)CC(C)(C)C LIRFHMCNMHIIKF-UHFFFAOYSA-N 0.000 description 1
- DSGVXRKGISBSOY-UHFFFAOYSA-N tris(2-ethoxyethoxy)-(2-methylpropyl)silane Chemical compound C(C(C)C)[Si](OCCOCC)(OCCOCC)OCCOCC DSGVXRKGISBSOY-UHFFFAOYSA-N 0.000 description 1
- BYXYWQUPBZPKCM-UHFFFAOYSA-N tris(2-ethoxyethoxy)-(2-nonylphenyl)silane Chemical compound C(CCCCCCCC)C1=C(C=CC=C1)[Si](OCCOCC)(OCCOCC)OCCOCC BYXYWQUPBZPKCM-UHFFFAOYSA-N 0.000 description 1
- HBGMELLDDOTDBC-UHFFFAOYSA-N tris(2-ethoxyethoxy)-(3-methylbutyl)silane Chemical compound C(CC(C)C)[Si](OCCOCC)(OCCOCC)OCCOCC HBGMELLDDOTDBC-UHFFFAOYSA-N 0.000 description 1
- PUMRXZLAGZFRGO-UHFFFAOYSA-N tris(2-ethoxyethoxy)-ethylsilane Chemical compound CCOCCO[Si](CC)(OCCOCC)OCCOCC PUMRXZLAGZFRGO-UHFFFAOYSA-N 0.000 description 1
- IDWZYNQNCOGXFQ-UHFFFAOYSA-N tris(2-ethoxyethoxy)-heptylsilane Chemical compound C(CCCCCC)[Si](OCCOCC)(OCCOCC)OCCOCC IDWZYNQNCOGXFQ-UHFFFAOYSA-N 0.000 description 1
- VANGAJOIEXQKCH-UHFFFAOYSA-N tris(2-ethoxyethoxy)-hexadecylsilane Chemical compound C(CCCCCCCCCCCCCCC)[Si](OCCOCC)(OCCOCC)OCCOCC VANGAJOIEXQKCH-UHFFFAOYSA-N 0.000 description 1
- XRIGRMQZCUNLLR-UHFFFAOYSA-N tris(2-ethoxyethoxy)-icosylsilane Chemical compound C(CCCCCCCCCCCCCCCCCCC)[Si](OCCOCC)(OCCOCC)OCCOCC XRIGRMQZCUNLLR-UHFFFAOYSA-N 0.000 description 1
- NDPSWPCMEKRQBJ-UHFFFAOYSA-N tris(2-ethoxyethoxy)-methylsilane Chemical compound CCOCCO[Si](C)(OCCOCC)OCCOCC NDPSWPCMEKRQBJ-UHFFFAOYSA-N 0.000 description 1
- FLQFWJCNSZAZDZ-UHFFFAOYSA-N tris(2-ethoxyethoxy)-nonylsilane Chemical compound C(CCCCCCCC)[Si](OCCOCC)(OCCOCC)OCCOCC FLQFWJCNSZAZDZ-UHFFFAOYSA-N 0.000 description 1
- OGCFYNGDFKUGDR-UHFFFAOYSA-N tris(2-ethoxyethoxy)-octadecylsilane Chemical compound C(CCCCCCCCCCCCCCCCC)[Si](OCCOCC)(OCCOCC)OCCOCC OGCFYNGDFKUGDR-UHFFFAOYSA-N 0.000 description 1
- XBZVKHQIEKNONC-UHFFFAOYSA-N tris(2-ethoxyethoxy)-octylsilane Chemical compound C(CCCCCCC)[Si](OCCOCC)(OCCOCC)OCCOCC XBZVKHQIEKNONC-UHFFFAOYSA-N 0.000 description 1
- BYSATHGRAXVRAX-UHFFFAOYSA-N tris(2-ethoxyethoxy)-phenylsilane Chemical compound CCOCCO[Si](OCCOCC)(OCCOCC)C1=CC=CC=C1 BYSATHGRAXVRAX-UHFFFAOYSA-N 0.000 description 1
- VIACZTFUDYJBFL-UHFFFAOYSA-N tris(2-ethoxyethoxy)-propylsilane Chemical compound CCOCCO[Si](CCC)(OCCOCC)OCCOCC VIACZTFUDYJBFL-UHFFFAOYSA-N 0.000 description 1
- SEWAHEUTLDOYQH-UHFFFAOYSA-N tris(2-ethoxyethoxy)-tetradecylsilane Chemical compound C(CCCCCCCCCCCCC)[Si](OCCOCC)(OCCOCC)OCCOCC SEWAHEUTLDOYQH-UHFFFAOYSA-N 0.000 description 1
- ZRWJADIDYKMRKF-UHFFFAOYSA-N tris(2-methoxyethoxy)-(2-methylpropyl)silane Chemical compound [H]C([H])C(C([H])([H])[H])C([H])([H])[Si](OC([H])([H])C([H])([H])OC([H])([H])[H])(OC([H])([H])C([H])([H])OC([H])([H])[H])OC([H])([H])C([H])([H])OC([H])([H])[H] ZRWJADIDYKMRKF-UHFFFAOYSA-N 0.000 description 1
- DCYGBFGEKORWLR-UHFFFAOYSA-N tris(2-methoxyethoxy)-(2-nonylphenyl)silane Chemical compound C(CCCCCCCC)C1=C(C=CC=C1)[Si](OCCOC)(OCCOC)OCCOC DCYGBFGEKORWLR-UHFFFAOYSA-N 0.000 description 1
- UVSIWHOTEQEQPC-UHFFFAOYSA-N tris(2-methoxyethoxy)-(3-methylbutyl)silane Chemical compound C(CC(C)C)[Si](OCCOC)(OCCOC)OCCOC UVSIWHOTEQEQPC-UHFFFAOYSA-N 0.000 description 1
- COLZEXRBKHSQIW-UHFFFAOYSA-N tris(2-methoxyethoxy)-(4-methylpentyl)silane Chemical compound C(CCC(C)C)[Si](OCCOC)(OCCOC)OCCOC COLZEXRBKHSQIW-UHFFFAOYSA-N 0.000 description 1
- PYWGEMGNUVXCTQ-UHFFFAOYSA-N tris(2-methoxyethoxy)-(6-methylheptyl)silane Chemical compound C(CCCCC(C)C)[Si](OCCOC)(OCCOC)OCCOC PYWGEMGNUVXCTQ-UHFFFAOYSA-N 0.000 description 1
- OLTVTFUBQOLTND-UHFFFAOYSA-N tris(2-methoxyethoxy)-methylsilane Chemical compound COCCO[Si](C)(OCCOC)OCCOC OLTVTFUBQOLTND-UHFFFAOYSA-N 0.000 description 1
- WMWRFTCPUUQHLT-UHFFFAOYSA-N tris(2-methoxyethoxy)-nonylsilane Chemical compound C(CCCCCCCC)[Si](OCCOC)(OCCOC)OCCOC WMWRFTCPUUQHLT-UHFFFAOYSA-N 0.000 description 1
- WDWQURYXUCLBHM-UHFFFAOYSA-N tris(2-methoxyethoxy)-octadecylsilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OCCOC)(OCCOC)OCCOC WDWQURYXUCLBHM-UHFFFAOYSA-N 0.000 description 1
- LPPVYLWWCCCYMV-UHFFFAOYSA-N tris(2-methoxyethoxy)-octylsilane Chemical compound CCCCCCCC[Si](OCCOC)(OCCOC)OCCOC LPPVYLWWCCCYMV-UHFFFAOYSA-N 0.000 description 1
- OZYUAUZLPMQRPF-UHFFFAOYSA-N tris(2-methoxyethoxy)-pentylsilane Chemical compound C(CCCC)[Si](OCCOC)(OCCOC)OCCOC OZYUAUZLPMQRPF-UHFFFAOYSA-N 0.000 description 1
- DBXDLSPMDNQBBQ-UHFFFAOYSA-N tris(2-methoxyethoxy)-phenylsilane Chemical compound COCCO[Si](OCCOC)(OCCOC)C1=CC=CC=C1 DBXDLSPMDNQBBQ-UHFFFAOYSA-N 0.000 description 1
- SSZBHSXTJWOAJR-UHFFFAOYSA-N tris(2-methoxyethoxy)-propylsilane Chemical compound COCCO[Si](CCC)(OCCOC)OCCOC SSZBHSXTJWOAJR-UHFFFAOYSA-N 0.000 description 1
- GVUQPJNWZQJIHB-UHFFFAOYSA-N tris(2-methoxyethoxy)-tetradecylsilane Chemical compound C(CCCCCCCCCCCCC)[Si](OCCOC)(OCCOC)OCCOC GVUQPJNWZQJIHB-UHFFFAOYSA-N 0.000 description 1
- GKBDEFQRSSEPCK-UHFFFAOYSA-N tris(2-methoxyethoxy)-undecylsilane Chemical compound C(CCCCCCCCCC)[Si](OCCOC)(OCCOC)OCCOC GKBDEFQRSSEPCK-UHFFFAOYSA-N 0.000 description 1
- GRTWKACPRBETIF-UHFFFAOYSA-N tris(ethenyl)-(2-ethoxyethoxy)silane Chemical compound C(=C)[Si](OCCOCC)(C=C)C=C GRTWKACPRBETIF-UHFFFAOYSA-N 0.000 description 1
- FBGNFSBDYRZOSE-UHFFFAOYSA-N tris(ethenyl)-ethoxysilane Chemical compound CCO[Si](C=C)(C=C)C=C FBGNFSBDYRZOSE-UHFFFAOYSA-N 0.000 description 1
- JYTZMGROHNUACI-UHFFFAOYSA-N tris(ethenyl)-methoxysilane Chemical compound CO[Si](C=C)(C=C)C=C JYTZMGROHNUACI-UHFFFAOYSA-N 0.000 description 1
- IZEDMQKOIOCTND-UHFFFAOYSA-N tritert-butyl(2-ethoxyethoxy)silane Chemical compound C(C)(C)(C)[Si](OCCOCC)(C(C)(C)C)C(C)(C)C IZEDMQKOIOCTND-UHFFFAOYSA-N 0.000 description 1
- UOBRGDVALGJMBH-UHFFFAOYSA-N tritert-butyl(2-methoxyethoxy)silane Chemical compound C(C)(C)(C)[Si](OCCOC)(C(C)(C)C)C(C)(C)C UOBRGDVALGJMBH-UHFFFAOYSA-N 0.000 description 1
- QYEFZDZJOXNQNW-UHFFFAOYSA-N tritert-butyl(ethoxy)silane Chemical compound CCO[Si](C(C)(C)C)(C(C)(C)C)C(C)(C)C QYEFZDZJOXNQNW-UHFFFAOYSA-N 0.000 description 1
- IEVQSSVQJPNPJB-UHFFFAOYSA-N tritert-butyl(methoxy)silane Chemical compound CO[Si](C(C)(C)C)(C(C)(C)C)C(C)(C)C IEVQSSVQJPNPJB-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 239000011850 water-based material Substances 0.000 description 1
- 239000010969 white metal Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
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Abstract
Description
腐食は、物質(通常、金属)の劣化またはその環境との反応の結果としてのその特性として一般に定義される自然発生現象である。地震または極端な気象擾乱などの他の自然災害と同様に、腐食は、廃水システム、パイプライン、橋梁、道路および公共建築物に危険かつ高価な損害を引き起こす可能性がある。
セメント基材のための封止材組成物、この封止材組成物で封止されたセメント構造物、および鉄骨鉄筋セメント構造物を封止する方法のための封止材組成物が提供される。封止材組成物は、第一シランと、第一シランよりも高い分子量を有する第二シランと、シランに可溶であり、溶媒希釈シランに可溶であり、水に少なくとも部分的に可溶である腐食防止剤との実質的に非水性のブレンドを含む。セメント構造物は、セメント基材およびこの基材の表面に塗布されて、この基材に少なくとも部分的に浸透している前述の封止材を含む。腐食原因物質の侵入から鉄骨鉄筋セメント構造物を封止する方法は、封止材を鉄骨鉄筋セメント基材の表面に塗布して、封止材組成物を基材に浸透させることを含む。
第一シランと;
この第一シランよりも高い分子量を有する第二シランと;
シランに可溶であり、溶媒希釈シランに可溶であり、水に少なくとも部分的に可溶である少なくとも1種の腐食防止剤と
の実質的に非水性のブレンドを含む、セメント基材のための封止材組成物が提供される。
(R1)a−Si−(OR2)b (I)
によって表すことができ、式中、R1は、同じか、または異なってよく、1個〜20個の炭素原子を含む飽和もしくは不飽和の、分岐状もしくは非分岐状の、環式もしくは非環式のアルキル基またはアルケニル基、または6個〜20個の炭素原子を含むアリール基またはアルキルアリール基で表され、
R2は、同じか、または異なってよく、1個〜6個までの炭素原子を含む分岐状もしくは非分岐状のアルキル基、または2個〜6個の炭素原子を含むエーテル基で表され、
aおよびbは、それぞれ1〜3の整数であるが、ただし、a+b=4である。R1は、a=2またはa=3である場合に同じか、または異なってよく、R2は、b=2またはb=3である場合に同じか、または異なってよい。
ブチルメチル−ビス−(2−メトキシエトキシ)シラン、ブチルエチル−ビス−(2−メトキシエトキシ)シラン、ブチルプロピル−ビス−(2−メトキシエトキシ)シラン、ジ−n−ペンチル−ビス−(2−メトキシエトキシ)シラン、ジ−イソペンチル−ビス−(2−メトキシエトキシ)シラン、ジ−ネオペンチル−ビス−(2−メトキシエトキシ)シラン、ジ−n−ヘキシル−ビス−(2−メトキシエトキシ)シラン、ジ−イソヘキシル−ビス−(2−メトキシエトキシ)シラン、ジ−シクロヘキシル−ビス−(2−メトキシエトキシ)シラン、シクロヘキシルメチル−ビス−(2−メトキシエトキシ)シラン、シクロヘキシルエチル−ビス−(2−メトキシエトキシ)シラン、ヘキシルメチル−ビス−(2−メトキシエトキシ)シラン、ヘキシルエチル−ビス−(2−メトキシエトキシ)シラン、ジヘプチル−ビス−(2−メトキシエトキシ)シラン、ジ−n−オクチル−ビス−(2−メトキシエトキシ)シラン、ジ−イソオクチル−ビス−(2−メトキシエトキシ)シラン、ジノニル−ビス−(2−メトキシエトキシ)シラン、ジ−デシル−ビス−(2−メトキシエトキシ)シラン、ジ−ウンデシル−ビス−(2−メトキシエトキシ)シラン、ジ−ドデシル−ビス−(2−メトキシエトキシ)シラン、ジ−テトラデシル−ビス−(2−メトキシエトキシ)シラン、ジ−ヘキサデシル−ビス−(2−メトキシエトキシ)シラン、ジ−オクタデシル−ビス−(2−メトキシエトキシ)シラン、ジ−イコシル−ビス−(2−メトキシエトキシ)シラン、ジ−アリル−ビス−(2−メトキシエトキシ)シラン、ジ−ビニル−ビス−(2−メトキシエトキシ)シラン、ジ−フェニル−ビス−(2−メトキシエトキシ)シラン、ジ−ノニルフェニル−ビス−(2−メトキシエトキシ)シラン、ジメチル−ビス−(2−エトキシエトキシ)シラン、ジエチル−ビス−(2−エトキシエトキシ)シラン、ジ−n−プロピル−ビス−(2−エトキシエトキシ)シラン、ジ−イソプロピル−ビス−(2−エトキシエトキシ)シラン、ジ−n−ブチル−ビス−(2−エトキシエトキシ)シラン、ジ−イソブチル−ビス−(2−エトキシエトキシ)シラン、ジ−sec−ブチル−ビス−(2−エトキシエトキシ)シラン、ジ−tert−ブチル−ビス−(2−エトキシエトキシ)シラン、ブチルメチル−ビス−(2−エトキシエトキシ)シラン、ブチルエチル−ビス−(2−エトキシエトキシ)シラン、ブチルプロピル−ビス−(2−エトキシエトキシ)シラン、ジ−n−ペンチル−ビス−(2−エトキシエトキシ)シラン、ジ−イソペンチル−ビス−(2−エトキシエトキシ)シラン、ジ−ネオペンチル−ビス−(2−エトキシエトキシ)シラン、ジ−n−ヘキシル−ビス−(2−エトキシエトキシ)シラン、ジ−イソヘキシル−ビス−(2−エトキシエトキシ)シラン、ジ−シクロヘキシル−ビス−(2−エトキシエトキシ)シラン、シクロヘキシルメチル−ビス−(2−エトキシエトキシ)シラン、シクロヘキシルエチル−ビス−(2−エトキシエトキシ)シラン、ヘキシルメチル−ビス−(2−エトキシエトキシ)シラン、ヘキシルエチル−ビス−(2−エトキシエトキシ)シラン、ジヘプチル−ビス−(2−エトキシエトキシ)シラン、ジ−n−オクチル−ビス−(2−エトキシエトキシ)シラン、ジ−イソオクチル−ビス−(2−エトキシエトキシ)シラン、ジノニル−ビス−(2−エトキシエトキシ)シラン、ジ−デシル−ビス−(2−エトキシエトキシ)シラン、ジ−ウンデシル−ビス−(2−エトキシエトキシ)シラン、ジ−ドデシル−ビス−(2−エトキシエトキシ)シラン、ジ−テトラデシル−ビス−(2−エトキシエトキシ)シラン、ジ−ヘキサデシル−ビス−(2−エトキシエトキシ)シラン、ジ−オクタデシル−ビス−(2−エトキシエトキシ)シラン、ジ−イコシル−ビス−(2−エトキシエトキシ)シラン、ジ−アリル−ビス−(2−エトキシエトキシ)シラン、ジ−ビニル−ビス−(2−エトキシエトキシ)シラン、ジ−フェニル−ビス−(2−エトキシエトキシ)シラン、ジ−ノニルフェニル−ビス−(2−エトキシエトキシ)シラン、トリメチルメトキシシラン、トリエチルメトキシシラン、トリ−n−プロピルメトキシシラン、トリ−イソプロピルメトキシシラン、トリ−n−ブチルメトキシシラン、トリ−イソブチルメトキシシラン、トリ−sec−ブチルメトキシシラン、トリ−tert−ブチルメトキシシラン、トリ−n−ペンチルメトキシシラン、トリ−イソペンチルメトキシシラン、トリ−ネオペンチルメトキシシラン、トリ−n−ヘキシルメトキシシラン、トリ−イソヘキシルメトキシシラン、トリ−シクロヘキシルメトキシシラン、トリ−ヘプチルメトキシシラン、トリ−n−オクチルメトキシシラン、トリ−イソオクチルメトキシシラン、トリ−ノニルメトキシシラン、トリ−デシルメトキシシラン、トリ−ウンデシルメトキシシラン、トリ−ドデシルメトキシシラン、トリ−テトラデシルメトキシシラン、トリ−ヘキサデシルメトキシシラン、トリ−オクタデシルメトキシシラン、トリ−イコシルメトキシシラン、トリ−アリルメトキシシラン、トリ−ビニルメトキシシラン、トリ−フェニルメトキシシラン、トリ−ノニルフェニルメトキシシラン、トリメチルエトキシシラン、トリエチルエトキシシラン、トリ−n−プロピルエトキシシラン、トリ−イソプロピルエトキシシラン、トリ−n−ブチルエトキシシラン、トリ−イソブチルエトキシシラン、トリ−sec−ブチルエトキシシラン、トリ−tert−ブチルエトキシシラン、トリ−n−ペンチルエトキシシラン、トリ−イソペンチルエトキシシラン、トリ−ネオペンチルエトキシシラン、トリ−n−ヘキシルエトキシシラン、トリ−イソヘキシルエトキシシラン、トリ−シクロヘキシルエトキシシラン、トリ−ヘプチルエトキシシラン、トリ−n−オクチルエトキシシラン、トリ−イソオクチルエトキシシラン、トリ−ノニルエトキシシラン、トリ−デシルエトキシシラン、トリ−ウンデシルエトキシシラン、トリ−ドデシルエトキシシラン、トリ−テトラデシルエトキシシラン、トリ−ヘキサデシルエトキシシラン、トリ−オクタデシルエトキシシラン、トリ−イコシルエトキシシラン、トリ−アリルエトキシシラン、トリ−ビニルエトキシシラン、トリ−フェニルエトキシシラン、トリ−ノニルフェニルエトキシシラン、トリメチル−(2−メトキシエトキシ)シラン、トリエチル−(2−メトキシエトキシ)シラン、トリ−n−プロピル−(2−メトキシエトキシ)シラン、トリ−イソプロピル−(2−メトキシエトキシ)シラン、トリ−n−ブチル−(2−メトキシエトキシ)シラン、トリ−イソブチル−(2−メトキシエトキシ)シラン、トリ−sec−ブチル−(2−メトキシエトキシ)シラン、トリ−tert−ブチル−(2−メトキシエトキシ)シラン、トリ−n−ペンチル−(2−メトキシエトキシ)シラン、トリ−イソペンチル−(2−メトキシエトキシ)シラン、トリ−ネオペンチル−(2−メトキシエトキシ)シラン、トリ−n−ヘキシル−(2−メトキシエトキシ)シラン、トリ−イソヘキシル−(2−メトキシエトキシ)シラン、トリ−シクロヘキシル−(2−メトキシエトキシ)シラン、トリ−ヘプチル−(2−メトキシエトキシ)シラン、トリ−n−オクチル−(2−メトキシエトキシ)シラン、トリ−イソオクチル−(2−メトキシエトキシ)シラン、トリ−ノニル−(2−メトキシエトキシ)シラン、トリ−デシル−(2−メトキシエトキシ)シラン、トリ−ウンデシル−(2−メトキシエトキシ)シラン、トリ−ドデシル−(2−メトキシエトキシ)シラン、トリ−テトラデシル−(2−メトキシエトキシ)シラン、トリ−ヘキサデシル−(2−メトキシエトキシ)シラン、トリ−オクタデシル−(2−メトキシエトキシ)シラン、トリ−イコシル−(2−メトキシエトキシ)シラン、トリ−アリル−(2−メトキシエトキシ)シラン、トリ−ビニル−(2−メトキシエトキシ)シラン、トリ−フェニル−(2−メトキシエトキシ)シラン、トリ−ノニルフェニル−(2−メトキシエトキシ)シラン、トリメチル−(2−エトキシエトキシ)シラン、トリエチル−(2−エトキシエトキシ)シラン、トリ−n−プロピル−(2−エトキシエトキシ)シラン、トリ−イソプロピル−(2−エトキシエトキシ)シラン、トリ−n−ブチル−(2−エトキシエトキシ)シラン、トリ−イソブチル−(2−エトキシエトキシ)シラン、トリ−sec−ブチル−(2−エトキシエトキシ)シラン、トリ−tert−ブチル−(2−エトキシエトキシ)シラン、トリ−n−ペンチル−(2−エトキシエトキシ)シラン、トリ−イソペンチル−(2−エトキシエトキシ)シラン、トリ−ネオペンチル−(2−エトキシエトキシ)シラン、トリ−n−ヘキシル−(2−エトキシエトキシ)シラン、トリ−イソヘキシル−(2−エトキシエトキシ)シラン、トリ−シクロヘキシル−(2−エトキシエトキシ)シラン、トリ−ヘプチル−(2−エトキシエトキシ)シラン、トリ−n−オクチル−(2−エトキシエトキシ)シラン、トリ−イソオクチル−(2−エトキシエトキシ)シラン、トリ−ノニル−(2−エトキシエトキシ)シラン、トリ−デシル−(2−エトキシエトキシ)シラン、トリ−ウンデシル−(2−エトキシエトキシ)シラン、トリ−ドデシル−(2−エトキシエトキシ)シラン、トリ−テトラデシル−(2−エトキシエトキシ)シラン、トリ−ヘキサデシル−(2−エトキシエトキシ)シラン、トリ−オクタデシル−(2−エトキシエトキシ)シラン、トリ−イコシル−(2−エトキシエトキシ)シラン、トリ−アリル−(2−エトキシエトキシ)シラン、トリ−ビニル−(2−エトキシエトキシ)シラン、トリ−フェニル−(2−エトキシエトキシ)シラン、およびトリ−ノニルフェニル−(2−エトキシエトキシ)シランから選択される。
この封止材は、
第一シランと;
この第一シランよりも高い分子量を有する第二シランと;
シランに可溶であり、溶媒希釈シランに可溶であり、水に少なくとも部分的に可溶である少なくとも1種の腐食防止剤と
の実質的に非水性のブレンドを含み、
この封止材は、前述のセメント基材の表面に塗布されて、この基材に少なくとも部分的に浸透している、セメント構造物が提供される。
1.超速硬セメント、例えば高いアルミナ含有量を有するもの。
2.ケイ酸二カルシウムおよび四カルシウムアルミノフェライトの高い割合と、ケイ酸三カルシウムおよびアルミン酸三カルシウムの低い割合を特徴とする低熱セメント。
3.ケイ酸三カルシウムおよびケイ酸二カルシウムの異常に高い割合と、アルミン酸三カルシウムおよび四カルシウムアルミノフェライトの異常に低い割合を特徴とする、耐硫酸塩セメント。
4.ポルトランドセメントクリンカーと水砕スラグの混合物を含むポルトランド高炉セメント。
5.組積造セメント、例えばポルトランドセメントと以下のもの:消石灰、水砕スラグ、粉末石灰岩、コロイド粘土、ケイソウ土またはその他の微粉化形態のシリカ、ステアリン酸カルシウムおよびパラフィンの1つまたは複数の混合物。
6.アメリカ合衆国リーハイバレーの鉱床から得られた材料であることを特徴とする天然セメント。
7.ある程度の粘土質材料を含むか、含まないかにかかわらず、カルシウムの酸化物をその純粋または不純物の形態で含む石灰セメント。
8.5%〜10%のパリ石膏を石灰に添加することを特徴とする、セレナイトセメント。
9.ポゾラン、ポルトランドセメント、水酸化カルシウム、水、トラスケイソウ土(trass kieselguhr)、軽石、トゥファ、サントリン土または水砕スラグと石灰モルタルとの混合物を含む、ポゾランセメント。
10.硫酸カルシウムの水和に依存する、およびパリ石膏、キーンスセメントおよびパリアンセメントを含むことを特徴とする、硫酸カルシウムセメント。
第一シランと;
この第一シランよりも高い分子量を有する第二シランと;
シランに可溶であり、溶媒希釈シランに可溶であり、水に少なくとも部分的に可溶である少なくとも1種の腐食防止剤と
の実質的に非水性のブレンドを含む浸透性の封止材を、鉄骨鉄筋セメント基材の表面に塗布して、封止材組成物を基材に浸透させることを含む方法が提供される。
以下の例は、浸透性の封止材組成物、この浸透性の封止材組成物で封止されたセメント組成物、およびこの浸透性の封止材組成物で鉄骨鉄筋セメント構造物を封止する方法の単なる例示にすぎない。例示的な例は、浸透性の封止材組成物、この浸透性封止材組成物で封止されたセメント組成物、および/またはこの浸透性の封止材組成物で鉄骨鉄筋セメント構造物を封止する方法を対象とする請求項の範囲をいかなる方法によっても限定するものではなく、かつ限定するものと解釈されるべきではない。
Claims (58)
- セメント基材のための封止材組成物であって、
第一シランと;
該第一シランよりも高い分子量を有する第二シランと;
シランに可溶であり、溶媒希釈シランに可溶であり、水に少なくとも部分的に可溶である少なくとも1種の腐食防止剤と
の実質的に非水性のブレンドを含む、前記封止材組成物。 - 前記第一シランの分子量は、約100g/mol〜約270g/molである、請求項1記載の封止材組成物。
- 前記第二シランの分子量は、約270g/mol〜約575g/molである、請求項1記載の封止材組成物。
- 前記第一シランの分子量は、約104g/mol〜約270g/molであり、前記第二シランの分子量は、約270g/mol〜約576g/molである、請求項1記載の封止材組成物。
- 前記第一シランの分子量は、約150g/mol〜約250g/molであり、前記第二シランの分子量は、約270g/mol〜約400g/molである、請求項1記載の封止材組成物。
- 前記第一シランの分子量は、約170g/mol〜約240g/molであり、前記第二シランの分子量は、約270g/mol〜約300g/molである、請求項1記載の封止材組成物。
- 前記第一シランは、アルキルトリアルコキシシラン、ジアルキルジアルコキシシラン、およびトリアルキルアルコキシシランからなる群から選択される、請求項4記載の封止材組成物。
- 前記第一シランは、メチルトリメトキシシラン、エチルトリメトキシシラン、n−ブチルトリメトキシシラン、イソブチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、n−ブチルトリエトキシシラン、およびイソブチルトリエトキシシランからなる群から選択される、請求項7記載の封止材組成物。
- 前記第一シランは、メチルトリエトキシシランおよびイソブチルトリエトキシシランからなる群から選択される、請求項8記載の封止材組成物。
- 前記第二シランは、アルキルトリアルコキシシラン、ジアルキルジアルコキシシラン、およびトリアルキルアルコキシシランからなる群から選択される、請求項4記載の封止材組成物。
- 前記第二シランは、n−オクチルトリメトキシシラン、イソオクチルトリメトキシシラン、ドデシルトリメトキシシラン、ヘキサデシルトリメトキシシラン、n−オクチルトリエトキシシラン、イソオクチルトリエトキシシラン、ドデシルトリエトキシシラン、およびヘキサデシルトリエトキシシランからなる群から選択される、請求項10記載の封止材組成物。
- 前記第二シランは、n−オクチルトリエトキシシランを含む、請求項11記載の封止材組成物。
- 前記第一シランは、イソブチルトリエトキシシランを含み、前記第二シランは、n−オクチルトリエトキシシランを含む、請求項4記載の封止材組成物。
- 前記セメント基材は、コンクリート、組積造、およびモルタルからなる群から選択される、請求項4記載の封止材組成物。
- 前記セメント基材は、コンクリートを含む、請求項14記載の封止材組成物。
- 前記腐食防止剤は、アルキルアセトアミド、アルキルカルボン酸およびその塩、アルコキシカルボン酸およびその塩、アルコキシレート、リン含有化合物、トリアジン、およびその混合物からなる群から選択される、請求項4記載の封止材組成物。
- 前記腐食防止剤は、ジメチルアセトアミド、ジエチルアセトアミド、セバシン酸二ナトリウム、イソノニルフェノキシ酢酸、エチニルカルビノールアルコキシレート、オクタンホスホン酸、モノ−n−オクチルリン酸エステル、アミンブロックされたC6〜C10アルキルリン酸モノエステル、トリイソブチルホスフェート、ポリエーテルホスフェート、1,3,5−トリス[3−(ジメチルアミノ)プロピル]ヘキサヒドロ−1,3,5−トリアジン、およびその混合物からなる群から選択される、請求項16記載の封止材組成物。
- 前記腐食防止剤は、エチニルカルビノールアルコキシレートとアミンブロックされたC6〜C10アルキルリン酸モノエステルのブレンドを含む、請求項17記載の封止材組成物。
- 前記腐食防止剤は、ジメチルアセトアミドとトリイソブチルホスフェートのブレンドを含む、請求項17記載の封止材組成物。
- 前記腐食防止剤は、ジメチルアセトアミドとトリイソブチルホスフェートのブレンドを含む、請求項13記載の封止材組成物。
- セメント基材;および浸透性の封止材を含むセメント構造物であって、
該封止材は、
第一シランと;
該第一シランよりも高い分子量を有する第二シランと;
シランに可溶であり、溶媒希釈シランに可溶であり、水に少なくとも部分的に可溶である少なくとも1種の腐食防止剤と
の実質的に非水性のブレンドを含み、
該封止材は、前記セメント基材の表面に塗布されて、該基材に少なくとも部分的に浸透している、前記セメント構造物。 - 前記セメント基材は、コンクリート基材、組積造基材、およびモルタル基材からなる群から選択される、請求項21記載のセメント構造物。
- 前記セメント基材は、コンクリート基材および組積造基材からなる群から選択される、請求項22記載のセメント構造物。
- 前記セメント基材は、コンクリート基材を含む、請求項23記載のセメント構造物。
- 前記第一シランの分子量は、約100g/mol〜約270g/molである、請求項24記載のセメント構造物。
- 前記第二シランの分子量は、約270g/mol〜約575g/molである、請求項24記載のセメント構造物。
- 前記第一シランの分子量は、約100g/mol〜約270g/molであり、前記第二シランの分子量は、約270g/mol〜約575g/molである、請求項24記載のセメント構造物。
- 前記第一シランの分子量は、約150g/mol〜約250g/molであり、前記第二シランの分子量は、約270g/mol〜約400g/molである、請求項24記載のセメント構造物。
- 前記第一シランの分子量は、約170g/mol〜約240g/molであり、前記第二シランの分子量は、約270g/mol〜約300g/molである、請求項24記載のセメント構造物。
- 前記第一シランは、メチルトリメトキシシラン、エチルトリメトキシシラン、n−ブチルトリメトキシシラン、イソブチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、n−ブチルトリエトキシシラン、およびイソブチルトリエトキシシランからなる群から選択される、請求項27記載のセメント構造物。
- 前記第一シランは、メチルトリエトキシランおよびイソブチルトリエトキシシランからなる群から選択される、請求項30記載のセメント構造物。
- 前記第二シランは、n−オクチルトリメトキシシラン、イソオクチルトリメトキシシラン、ドデシルトリメトキシシラン、ヘキサデシルトリメトキシシラン、n−オクチルトリエトキシシラン、イソオクチルトリエトキシシラン、ドデシルトリエトキシシラン、およびヘキサデシルトリエトキシランからなる群から選択される、請求項27記載のセメント構造物。
- 前記第二シランは、n−オクチルトリエトキシシランを含む、請求項32記載のセメント構造物。
- 前記第一シランは、イソブチルトリエトキシシランを含み、前記第二シランは、n−オクチルトリエトキシシランを含む、請求項27記載のセメント構造物。
- 前記腐食防止剤は、アルキルアセトアミド、アルキルカルボン酸およびその塩、アルコキシカルボン酸およびその塩、アルコキシレート、リン含有化合物、トリアジン、およびその混合物からなる群から選択される、請求項27記載のセメント構造物。
- 前記腐食防止剤は、ジメチルアセトアミド、ジエチルアセトアミド、セバシン酸二ナトリウム、イソノニルフェノキシ酢酸、エチニルカルビノールアルコキシレート、オクタンホスホン酸、モノ−n−オクチルリン酸エステル、アミンブロックされたC6〜C10アルキルリン酸モノエステル、トリイソブチルホスフェート、ポリエーテルホスフェート、1,3,5−トリス[3−(ジメチルアミノ)プロピル]ヘキサヒドロ−1,3,5−トリアジン、およびその混合物からなる群から選択される、請求項35記載のセメント構造物。
- 前記腐食防止剤は、エチニルカルビノールアルコキシレートとアミンブロックされたC6〜C10アルキルリン酸モノエステルのブレンドを含む、請求項36記載のセメント構造物。
- 前記腐食防止剤は、ジメチルアセトアミドとトリイソブチルホスフェートのブレンドを含む、請求項36記載のセメント構造物。
- 前記腐食防止剤は、ジメチルアセトアミドとトリイソブチルホスフェートのブレンドを含む、請求項34記載のセメント構造物。
- 腐食原因物質の侵入から鉄骨鉄筋セメント構造物を封止する方法であって、
第一シランと;
該第一シランよりも高い分子量を有する第二シランと;
シランに可溶であり、溶媒希釈シランに可溶であり、水に少なくとも部分的に可溶である少なくとも1種の腐食防止剤と
の実質的に非水性のブレンドを含む浸透性の封止材を、封止される前記鉄骨鉄筋セメント基材の表面に塗布して、前記封止材組成物を前記基材に浸透させることを含む、前記方法。 - 前記セメント基材は、コンクリート基材、組積造基材、およびモルタル基材からなる群から選択される、請求項40記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記セメント基材は、コンクリート基材および組積造基材からなる群から選択される、請求項41記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記セメント基材は、コンクリート基材を含む、請求項42記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第一シランの分子量は、約100g/mol〜約270g/molである、請求項43記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第二シランの分子量は、約270g/mol〜約575g/molである、請求項43記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第一シランの分子量は、約100g/mol〜約270g/molであり、前記第二シランの分子量は、約270g/mol〜約575g/molである、請求項43記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第一シランの分子量は、約150g/mol〜約250g/molであり、前記第二シランの分子量は、約270g/mol〜約400g/molである、請求項43記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第一シランの分子量は、約170g/mol〜約240g/molであり、前記第二シランの分子量は、約270g/mol〜約300g/molである、請求項43記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第一シランは、メチルトリメトキシシラン、エチルトリメトキシシラン、n−ブチルトリメトキシシラン、イソブチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、n−ブチルトリエトキシシラン、およびイソブチルトリエトキシシランからなる群から選択される、請求項46記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第一シランは、メチルトリエトキシシランおよびイソブチルトリエトキシシランからなる群から選択される、請求項49記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第二シランは、n−オクチルトリメトキシシラン、イソオクチルトリメトキシシラン、ドデシルトリメトキシシラン、ヘキサデシルトリメトキシシラン、n−オクチルトリエトキシシラン、イソオクチルトリエトキシシラン、ドデシルトリエトキシシラン、およびヘキサデシルトリエトキシシランからなる群から選択される、請求項46記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第二シランは、n−オクチルトリエトキシシランを含む、請求項51記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記第一シランは、イソブチルトリエトキシシランを含み、前記第二シランは、n−オクチルトリエトキシシランを含む、請求項46記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記腐食防止剤は、アルキルアセトアミド、アルキルカルボン酸およびその塩、アルコキシカルボン酸およびその塩、アルコキシレート、リン含有化合物、トリアジン、およびその混合物からなる群から選択される、請求項46記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記腐食防止剤は、ジメチルアセトアミド、ジエチルアセトアミド、セバシン酸二ナトリウム、イソノニルフェノキシ酢酸、エチニルカルビノールアルコキシレート、オクタンホスホン酸、モノ−n−オクチルリン酸エステル、アミンブロックされたC6〜C10アルキルリン酸モノエステル、トリイソブチルホスフェート、ポリエーテルホスフェート、1,3,5−トリス[3−(ジメチルアミノ)プロピル]ヘキサヒドロ−1,3,5−トリアジン、およびその混合物からなる群から選択される、請求項54記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記腐食防止剤は、エチニルカルビノールアルコキシレートとアミンブロックされたC6〜C10アルキルリン酸モノエステルのブレンドを含む、請求項55記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記腐食防止剤は、ジメチルアセトアミドとトリイソブチルホスフェートのブレンドを含む、請求項55記載の鉄骨鉄筋セメント構造物を封止する方法。
- 前記腐食防止剤は、ジメチルアセトアミドとトリイソブチルホスフェートのブレンドを含む、請求項53記載の鉄骨鉄筋セメント構造物を封止する方法。
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JP2003155582A (ja) * | 2001-11-05 | 2003-05-30 | Degussa Ag | 鉄筋の腐食から鉄筋コンクリートを保護する薬剤、鉄筋コンクリート中の鉄筋における腐食を防止する方法、オルガノシラン、オルガノシロキサン、またはこれらを含有する薬剤の使用、および保護されたコンクリート |
US20040099845A1 (en) * | 2002-10-10 | 2004-05-27 | Simendinger William H. | Anti-corrosion composition |
JP2006524749A (ja) * | 2003-05-05 | 2006-11-02 | シーカ・テクノロジー・アーゲー | 強化コンクリートのための腐食防止剤としての、アルコキシ基含有リン‐酸素酸エステル類の使用 |
JP2009515038A (ja) * | 2005-11-04 | 2009-04-09 | シーカ・テクノロジー・アーゲー | 腐食を低減するための使用および方法 |
JP2008001549A (ja) * | 2006-06-21 | 2008-01-10 | Sakakibara Yasuhiro | コンクリート構造物保護剤、その製造方法及びコンクリート構造物の保護方法 |
US20080131594A1 (en) * | 2006-11-30 | 2008-06-05 | Korea Electric Power Corporation | Method for repairing aged reinforced concrete structure using surface-penetration reinforcing agent |
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WO2017157836A1 (en) | 2017-09-21 |
AU2017233909A1 (en) | 2018-09-27 |
AU2017233909B2 (en) | 2021-06-24 |
MX2024001188A (es) | 2024-02-27 |
CN109071366B (zh) | 2022-05-10 |
MX2018011218A (es) | 2018-11-22 |
RU2744612C2 (ru) | 2021-03-11 |
CN109071366A (zh) | 2018-12-21 |
US20210214564A1 (en) | 2021-07-15 |
JP6968087B2 (ja) | 2021-11-17 |
RU2018135838A (ru) | 2020-04-16 |
US20190092948A1 (en) | 2019-03-28 |
RU2018135838A3 (ja) | 2020-07-17 |
SA518400012B1 (ar) | 2022-02-15 |
BR112018068488A2 (pt) | 2019-01-22 |
EP3429980A1 (en) | 2019-01-23 |
CA3015272A1 (en) | 2017-09-21 |
US11001716B2 (en) | 2021-05-11 |
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