JP2019136805A - Grinding device - Google Patents

Grinding device Download PDF

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Publication number
JP2019136805A
JP2019136805A JP2018020936A JP2018020936A JP2019136805A JP 2019136805 A JP2019136805 A JP 2019136805A JP 2018020936 A JP2018020936 A JP 2018020936A JP 2018020936 A JP2018020936 A JP 2018020936A JP 2019136805 A JP2019136805 A JP 2019136805A
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Prior art keywords
grinding
holding
grinding wheel
workpiece
holding means
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JP7045212B2 (en
Inventor
太一 伊藤
Taichi Ito
太一 伊藤
二郎 現王園
Jiro Genoen
二郎 現王園
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2018020936A priority Critical patent/JP7045212B2/en
Priority to KR1020190008578A priority patent/KR102662485B1/en
Priority to TW108103799A priority patent/TWI779164B/en
Priority to CN201910102784.1A priority patent/CN110125792B/en
Publication of JP2019136805A publication Critical patent/JP2019136805A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Abstract

To provide a grinding device, which is configured to cool a grindstone to prevent grinding failures such as tear from being caused on a surface to be ground, when grinding a work-piece.SOLUTION: A grinding device 1 comprises: holding means 3 having a holding surface 30a for holding a work-piece W; grinding means 7 that rotates a grinding wheel 74 with a center of a grinding wheel 74 having grindstones 740 annularly arranged therein as a shaft and grinds the work-piece W with grinding surfaces of the grindstones 740; and moving means 35 that moves relatively the holding means 3 and the grinding means 7 in a direction of the holding surface 30a, which further comprises a cooling nozzle 60 in a circular arc shape that corresponds to the grinding surfaces of the grindstones 740 which are performing grinding, protruded from the work-piece W held by the holding means 3, when performing grinding while positioning the holding means 3 at a grinding position at which the grindstones 740 pass through the center of the holding surface 30a by the movement means 35, and cools the grinding surfaces of the grindstones 740 by a cooling nozzle 6 during grinding.SELECTED DRAWING: Figure 3

Description

本発明は、半導体ウェーハ等の被加工物を研削する研削装置に関する。   The present invention relates to a grinding apparatus for grinding a workpiece such as a semiconductor wafer.

保持テーブルが保持したウェーハを研削砥石で研削する研削装置（例えば、特許文献１参照）では、研削中の研削砥石に加工熱を蓄熱させないようにするため、研削砥石とウェーハとの接触箇所に研削水を供給して、除熱と、研削屑の除去とを行っている。   In a grinding apparatus that grinds a wafer held by a holding table with a grinding wheel (for example, refer to Patent Document 1), grinding is performed at a contact point between the grinding wheel and the wafer so as not to store processing heat in the grinding wheel being ground. Water is supplied to remove heat and remove grinding debris.

特許５０３７２５５号公報Japanese Patent No. 5037255

しかし、研削対象が例えばモールドされた樹脂面を備えるウェーハである場合、樹脂面を研削する際の加工熱の発生が大きく、その加工熱が研削砥石に蓄熱され、被研削面である樹脂面にむしれ（ささくれ）が生じて、被研削面が粗くなってしまうという問題がある。
よって、研削装置で被加工物を研削する場合には、研削砥石を冷却して被研削面にむしれ等の研削不良を生じさせないようにするという課題がある。 However, when the object to be ground is, for example, a wafer having a molded resin surface, a large amount of processing heat is generated when the resin surface is ground, and the processing heat is stored in the grinding wheel so that the resin surface to be ground is There is a problem that peeling occurs and the surface to be ground becomes rough.
Therefore, when the workpiece is ground by the grinding apparatus, there is a problem that the grinding wheel is cooled to prevent grinding defects such as peeling on the surface to be ground.

上記課題を解決するための本発明は、被加工物を保持する保持面を有する保持手段と、環状に研削砥石を配設した研削ホイールの中心を軸に該研削ホイールを回転させ該研削砥石の研削面で被加工物を研削する研削手段と、該保持手段と該研削手段とを該保持面方向に相対的に移動させる移動手段と、を備える研削装置であって、該移動手段で該保持手段を該研削砥石が該保持面中心を通過する研削位置に位置づけて研削を行う際に、該保持手段が保持する被加工物からはみ出した研削加工中の該研削砥石の研削面に対応する円弧状の冷却ノズルを備え、研削加工中に該研削面を該冷却ノズルで冷却することを特徴とする研削装置である。   In order to solve the above-mentioned problems, the present invention provides a holding means having a holding surface for holding a workpiece, and the grinding wheel is rotated about the center of a grinding wheel in which the grinding wheel is annularly arranged. A grinding apparatus comprising: a grinding means for grinding a workpiece by a grinding surface; and a moving means for relatively moving the holding means and the grinding means in the direction of the holding surface, the holding means holding the holding means. A circle corresponding to the grinding surface of the grinding wheel during grinding that protrudes from the workpiece held by the holding means when performing grinding with the grinding wheel positioned at a grinding position where the grinding wheel passes through the center of the holding surface. An arc-shaped cooling nozzle is provided, and the grinding surface is cooled by the cooling nozzle during grinding.

前記冷却ノズルを前記保持手段に配設すると好ましい。   Preferably, the cooling nozzle is disposed on the holding means.

前記冷却ノズルは、前記研削面に対向させて複数の水供給口が円弧状に配設されていると好ましい。   It is preferable that the cooling nozzle has a plurality of water supply ports arranged in an arc shape so as to face the grinding surface.

本発明に係る研削装置は、移動手段で保持手段を研削砥石が保持面中心を通過する研削位置に位置づけて研削を行う際に、保持手段が保持する被加工物からはみ出した研削加工中の研削砥石の研削面に対応する円弧状の冷却ノズルを備えることで、研削加工中に研削砥石と被加工物との接触箇所以外でも研削砥石の研削面を冷却ノズルで効率よく十分に冷却することが可能となるため、被加工物の被研削面に研削砥石の蓄熱を原因としたむしれ等の研削不良が生じてしまうことを防ぐことができる。   In the grinding apparatus according to the present invention, when the holding means is positioned by the moving means at a grinding position where the grinding wheel passes through the center of the holding surface and grinding is performed, the grinding during the grinding process that protrudes from the workpiece held by the holding means is performed. By providing an arc-shaped cooling nozzle corresponding to the grinding surface of the grinding wheel, the grinding surface of the grinding wheel can be efficiently and sufficiently cooled by the cooling nozzle at other than the contact point between the grinding wheel and the workpiece during grinding. Therefore, it is possible to prevent the occurrence of grinding defects such as peeling due to heat storage of the grinding wheel on the surface to be ground of the workpiece.

冷却ノズルを保持手段に配設するものとすることで、研削中に保持手段が保持する被加工物からはみ出した研削砥石の研削面の凡そ全てに冷却水を供給し冷却することができ、従来よりも冷却効率を向上させることができる。   By disposing the cooling nozzle on the holding means, cooling water can be supplied and cooled to almost all of the grinding surface of the grinding wheel that protrudes from the workpiece held by the holding means during grinding. As a result, the cooling efficiency can be improved.

冷却ノズルが、研削砥石の研削面に対向させて複数の水供給口が円弧状に配設されていることで、研削中に保持手段が保持する被加工物からはみ出した研削砥石の研削面の凡そ全てに水供給口から冷却水を供給して冷却することができ、従来よりも冷却効率を向上させることができる。   The cooling nozzle is opposed to the grinding surface of the grinding wheel, and the plurality of water supply ports are arranged in an arc shape, so that the grinding surface of the grinding wheel protruding from the workpiece held by the holding means during grinding can be obtained. Cooling water can be supplied to almost all from the water supply port for cooling, and the cooling efficiency can be improved as compared with the prior art.

研削装置の一例を示す斜視図である。It is a perspective view which shows an example of a grinding device. 保持手段及び円弧状の冷却ノズルの一例を示す平面図である。It is a top view which shows an example of a holding means and an arc-shaped cooling nozzle. 研削加工中の研削砥石の研削面に円弧状の冷却ノズルから冷却水を供給している状態を示す側面図である。It is a side view which shows the state which is supplying the cooling water from the circular-arc-shaped cooling nozzle to the grinding surface of the grinding wheel in grinding. 移動手段としてターンテーブルを備える研削装置において、研削加工中の研削砥石の研削面に円弧状の冷却ノズルから冷却水を供給している状態を示す側面図である。In a grinding device provided with a turntable as a moving means, it is a side view showing the state where cooling water is supplied from a circular-arc-like cooling nozzle to the grinding surface of a grinding wheel in grinding. 移動手段が新たな被加工物を保持する保持手段を公転させて研削手段の下方に位置づけている状態を示す側面図である。It is a side view which shows the state in which the moving means revolves the holding means holding a new workpiece, and is positioned below the grinding means. 移動手段が新たな被加工物を保持する保持手段を研削手段の下方の所定の位置に位置づけ、さらに、冷却ノズルが下降して所定の高さ位置に位置づけられた状態を示す側面図である。FIG. 5 is a side view showing a state in which the moving means holds the holding means for holding a new workpiece at a predetermined position below the grinding means, and the cooling nozzle is lowered and positioned at a predetermined height position.

図１に示す研削装置１は、保持手段３上に保持された被加工物Ｗを研削手段７によって研削する装置である。研削装置１のベース１０上の前方（−Ｙ方向側）は、保持手段３に対して被加工物Ｗの着脱が行われる領域であり、ベース１０上の後方（＋Ｙ方向側）は、研削手段７によって保持手段３上に保持された被加工物Ｗの研削が行われる領域である。   The grinding apparatus 1 shown in FIG. 1 is an apparatus for grinding the workpiece W held on the holding means 3 by the grinding means 7. The front (−Y direction side) on the base 10 of the grinding apparatus 1 is an area where the workpiece W is attached to and detached from the holding means 3, and the rear (+ Y direction side) on the base 10 is the grinding means. 7 is a region where the workpiece W held on the holding means 3 is ground by 7.

保持手段３は、円形板状のポーラス部材等からなり被加工物Ｗを吸着する吸着部３０と、吸着部３０を支持する枠体３１と、枠体３１を側方から囲むカバー３９とを備える。吸着部３０は、真空発生装置等の図示しない吸引源に連通し、吸引源が吸引することで生み出された吸引力が、吸着部３０の露出面である保持面３０ａに伝達されることで、保持手段３は保持面３０ａ上で被加工物Ｗを吸引保持できる。また、保持手段３は、Ｚ軸方向の軸心周りに回転可能となっている。   The holding means 3 includes a suction part 30 made of a circular plate-like porous member or the like, which sucks the workpiece W, a frame body 31 that supports the suction part 30, and a cover 39 that surrounds the frame body 31 from the side. . The suction unit 30 communicates with a suction source (not shown) such as a vacuum generator, and the suction force generated by suction of the suction source is transmitted to the holding surface 30a that is the exposed surface of the suction unit 30. The holding means 3 can suck and hold the workpiece W on the holding surface 30a. The holding means 3 is rotatable around the axis in the Z-axis direction.

保持面３０ａは、保持手段３の回転中心を頂点とする極めて緩やか傾斜を備える円錐面に形成されている。
また、保持手段３の下方には、カップリング等を介して傾き調節機構３７が配設されている。傾き調節機構３７は、保持手段３の保持面３０ａの水平面に対する傾き（研削手段７の研削砥石７４０の研削面に対する傾き）を調節することができる。 The holding surface 30a is formed in a conical surface having a very gentle slope with the center of rotation of the holding means 3 as a vertex.
Further, an inclination adjusting mechanism 37 is disposed below the holding means 3 via a coupling or the like. The inclination adjusting mechanism 37 can adjust the inclination of the holding surface 30a of the holding means 3 with respect to the horizontal plane (the inclination of the grinding means 7 with respect to the grinding surface of the grinding wheel 740).

保持手段３及びカバー３９に連結された蛇腹カバー３９ａの下方（ベース１０内部）には、保持手段３を保持面方向（Ｙ軸方向）に移動させる移動手段３５が配設されている。移動手段３５は、Ｙ軸方向の軸心を有するボールネジ３５０と、ボールネジ３５０と平行に配設された一対のガイドレール３５１と、ボールネジ３５０に連結しボールネジ３５０を回動させるモータ３５２と、内部に備えるナットがボールネジ３５０に螺合しガイドレール３５１上を摺動する図示しない可動板とを備えており、モータ３５２がボールネジ３５０を回動させると、これに伴い図示しない可動板がガイドレール３５１にガイドされてＹ軸方向に往復移動し、可動板上に固定された保持手段３がＹ軸方向に移動する。蛇腹カバー３９ａは保持手段３の移動に伴ってＹ軸方向に伸縮する。   Below the bellows cover 39a connected to the holding means 3 and the cover 39 (inside the base 10), moving means 35 for moving the holding means 3 in the holding surface direction (Y-axis direction) is disposed. The moving means 35 includes a ball screw 350 having an axis in the Y-axis direction, a pair of guide rails 351 disposed in parallel to the ball screw 350, a motor 352 connected to the ball screw 350 and rotating the ball screw 350, and The nut provided is provided with a movable plate (not shown) that is screwed onto the ball screw 350 and slides on the guide rail 351. When the motor 352 rotates the ball screw 350, the movable plate (not shown) is attached to the guide rail 351. Guided and reciprocated in the Y-axis direction, the holding means 3 fixed on the movable plate moves in the Y-axis direction. The bellows cover 39a expands and contracts in the Y-axis direction as the holding means 3 moves.

研削領域には、コラム１１が立設されており、コラム１１の前面には研削手段７を保持手段３に対して離間又は接近するＺ軸方向（鉛直方向）に研削送りする研削送り手段５が配設されている。研削送り手段５は、鉛直方向の軸心を有するボールネジ５０と、ボールネジ５０と平行に配設された一対のガイドレール５１と、ボールネジ５０の上端に連結しボールネジ５０を回動させるモータ５２と、内部のナットがボールネジ５０に螺合し側部がガイドレール５１に摺接する昇降板５３とを備えており、モータ５２がボールネジ５０を回動させると、これに伴い昇降板５３がガイドレール５１にガイドされてＺ軸方向に往復移動し、昇降板５３に固定された研削手段７がＺ軸方向に研削送りされる。   In the grinding region, a column 11 is erected, and on the front surface of the column 11, a grinding feed means 5 for grinding and feeding the grinding means 7 in the Z-axis direction (vertical direction) that is separated from or approaches the holding means 3 is provided. It is arranged. The grinding feed means 5 includes a ball screw 50 having a vertical axis, a pair of guide rails 51 arranged in parallel to the ball screw 50, a motor 52 connected to the upper end of the ball screw 50 and rotating the ball screw 50, There is provided an elevating plate 53 in which an internal nut is screwed to the ball screw 50 and a side portion is in sliding contact with the guide rail 51, and when the motor 52 rotates the ball screw 50, the elevating plate 53 is attached to the guide rail 51. The grinding means 7 guided and reciprocated in the Z-axis direction and fixed to the lifting plate 53 is ground and fed in the Z-axis direction.

保持手段３に保持された被加工物Ｗを研削加工する研削手段７は、軸方向がＺ軸方向である回転軸７０と、回転軸７０を回転可能に支持するハウジング７１と、回転軸７０を回転駆動するモータ７２と、回転軸７０の下端に接続された円環状のマウント７３と、マウント７３の下面に着脱可能に装着された研削ホイール７４と、ハウジング７１を支持し研削送り手段５の昇降板５３にその側面が固定されたホルダ７５とを備える。   The grinding means 7 for grinding the workpiece W held by the holding means 3 includes a rotary shaft 70 whose axial direction is the Z-axis direction, a housing 71 that rotatably supports the rotary shaft 70, and the rotary shaft 70. A motor 72 that rotates, an annular mount 73 connected to the lower end of the rotating shaft 70, a grinding wheel 74 that is detachably attached to the lower surface of the mount 73, and a lift of the grinding feed means 5 that supports the housing 71 A holder 75 having a side surface fixed to the plate 53 is provided.

研削ホイール７４は、ホイール基台７４１と、ホイール基台７４１の底面に環状に配置された略直方体形状の複数の研削砥石７４０とを備える。研削砥石７４０は、例えば、レジンボンドやメタルボンド等でダイヤモンド砥粒等が固着されて成形されている。
回転軸７０の軸心線上には研削ホイール７４の回転中心（研削砥石７４０の回転中心）が位置しており、回転軸７０が回転することで、研削ホイール７４は研削ホイール７４の中心を軸にしてＺ軸方向の軸心周りに回転する。 The grinding wheel 74 includes a wheel base 741 and a plurality of grinding wheels 740 having a substantially rectangular parallelepiped shape arranged in an annular shape on the bottom surface of the wheel base 741. The grinding wheel 740 is formed by fixing diamond abrasive grains or the like with, for example, a resin bond or a metal bond.
The rotation center of the grinding wheel 74 (rotation center of the grinding wheel 740) is located on the axis of the rotation shaft 70. The rotation of the rotation shaft 70 causes the grinding wheel 74 to be centered on the grinding wheel 74. Rotate around the axis in the Z-axis direction.

回転軸７０の内部には、図示しない研削水供給源に連通し研削水の通り道となる流路７０ａが、回転軸７０の軸方向（Ｚ軸方向）に貫通して設けられており、流路７０ａは、さらにマウント７３を通り、ホイール基台７４１の底面において研削砥石７４０に向かって研削水を噴出できるように開口している。   Inside the rotary shaft 70, a flow path 70a that communicates with a grinding water supply source (not shown) and serves as a path for grinding water is provided so as to penetrate in the axial direction (Z-axis direction) of the rotary shaft 70. 70 a further passes through the mount 73 and is open so that grinding water can be jetted toward the grinding wheel 740 on the bottom surface of the wheel base 741.

以下に、図１に示す研削装置１により保持手段３に保持された被加工物Ｗを研削する場合の、研削装置１の動作について説明する。図１に示す被加工物Ｗは、例えば、外形が円形板状の半導体ウェーハであり、被加工物Ｗの上面Ｗｂが、研削加工が施される被研削面となる。該上面Ｗｂは例えばＰＣＢ等の樹脂でモールドされているが、樹脂でモールドされていないシリコン面等であってもよい。   Below, the operation | movement of the grinding apparatus 1 in the case of grinding the workpiece W hold | maintained at the holding means 3 with the grinding apparatus 1 shown in FIG. 1 is demonstrated. The workpiece W shown in FIG. 1 is, for example, a semiconductor wafer having a circular plate shape, and the upper surface Wb of the workpiece W is a workpiece surface to be ground. The upper surface Wb is molded with a resin such as PCB, but may be a silicon surface that is not molded with a resin.

まず、研削装置１の着脱領域内において、被加工物Ｗが保持手段３の保持面３０ａ上に載置され、図示しない吸引源が作動して生み出された吸引力が保持面３０ａに伝達されることにより、保持手段３が保持面３０ａ上で被加工物Ｗの下面Ｗａを吸引保持する。被加工物Ｗの中心と保持面３０ａの中心とは略合致した状態になる。   First, the workpiece W is placed on the holding surface 30a of the holding means 3 in the attachment / detachment region of the grinding apparatus 1, and a suction force generated by operating a suction source (not shown) is transmitted to the holding surface 30a. Thus, the holding means 3 sucks and holds the lower surface Wa of the workpiece W on the holding surface 30a. The center of the workpiece W and the center of the holding surface 30a are substantially matched.

移動手段３５が、被加工物Ｗを保持した保持手段３を研削手段７の下まで移動して、研削砥石７４０と被加工物Ｗとの位置合わせがなされる。位置合わせは、例えば、図２に示すように、研削砥石７４０の回転中心が保持面３０ａの回転中心（被加工物Ｗの回転中心）に対して所定の距離だけ−Ｙ方向にずれ、研削砥石７４０の回転軌道７４０ａが保持面３０ａの回転中心を通るように行われる。また、緩やかな円錐面である保持面３０ａが研削砥石７４０の研削面（下面）に対して平行になるように、傾き調節機構３７によって保持手段３の傾きが調整されることで、円錐面である保持面３０ａにならって吸引保持されている被加工物Ｗの上面Ｗｂが、研削砥石７４０の研削面に対して平行になる（図３参照）。   The moving means 35 moves the holding means 3 holding the workpiece W to below the grinding means 7 so that the grinding wheel 740 and the workpiece W are aligned. For example, as shown in FIG. 2, the center of rotation of the grinding wheel 740 is shifted in the −Y direction by a predetermined distance from the center of rotation of the holding surface 30a (the center of rotation of the workpiece W). The rotation trajectory 740a of 740 passes through the rotation center of the holding surface 30a. Further, the inclination of the holding means 3 is adjusted by the inclination adjusting mechanism 37 so that the holding surface 30a, which is a gentle conical surface, is parallel to the grinding surface (lower surface) of the grinding wheel 740. The upper surface Wb of the workpiece W sucked and held following a certain holding surface 30a is parallel to the grinding surface of the grinding wheel 740 (see FIG. 3).

図２、３に示すように、研削砥石７４０と被加工物Ｗとの位置合わせが行われた後、図１に示すモータ７２により回転軸７０が回転駆動されるのに伴って、例えば、研削砥石７４０が＋Ｚ方向側からみて反時計周り方向に回転する。また、図３に示す研削送り手段５が研削手段７を−Ｚ方向へと降下させていき、研削砥石７４０が被加工物Ｗの上面Ｗｂに当接することで研削加工が行われる。研削加工中は、保持手段３が＋Ｚ方向側からみて反時計周り方向に回転するのに伴って被加工物Ｗも回転するので、研削砥石７４０が被加工物Ｗの上面Ｗｂの全面の研削加工を行う。例えば、研削加工中は、研削水を回転軸７０中の流路７０ａ（図１参照）を通して研削砥石７４０と被加工物Ｗとの接触部位に対して供給して、接触部位を冷却・洗浄する。
なお、被加工物Ｗは保持手段３の緩やかな円錐面である保持面３０ａにならって吸引保持されているため、図２に示す研削砥石７４０の回転軌道７４０ａ中の矢印Ｒで示す範囲内において、研削砥石７４０は回転する被加工物Ｗの上面Ｗｂに当接し研削を行う。 As shown in FIGS. 2 and 3, after the grinding wheel 740 and the workpiece W are aligned, the rotation shaft 70 is driven to rotate by the motor 72 shown in FIG. The grindstone 740 rotates counterclockwise as viewed from the + Z direction side. Further, the grinding feed means 5 shown in FIG. 3 lowers the grinding means 7 in the −Z direction, and the grinding wheel 740 comes into contact with the upper surface Wb of the workpiece W to perform grinding. During the grinding process, the workpiece W also rotates as the holding means 3 rotates counterclockwise as viewed from the + Z direction side, so that the grinding wheel 740 grinds the entire upper surface Wb of the workpiece W. I do. For example, during grinding, the grinding water is supplied to the contact portion between the grinding wheel 740 and the workpiece W through the flow path 70a (see FIG. 1) in the rotating shaft 70, and the contact portion is cooled and cleaned. .
Since the workpiece W is sucked and held in accordance with the holding surface 30a which is a gentle conical surface of the holding means 3, the workpiece W is within the range indicated by the arrow R in the rotation track 740a of the grinding wheel 740 shown in FIG. The grinding wheel 740 makes contact with the upper surface Wb of the rotating workpiece W and performs grinding.

研削装置１は、研削加工中の研削砥石７４０の研削面を冷却する円弧状の冷却ノズル６０を備えている。上記のように、移動手段３５で保持手段３を研削砥石７４０が保持手段３の保持面３０ａ中心を通過する研削位置に位置づけて研削を行う際に、冷却ノズル６０は、保持手段３が保持する被加工物Ｗから＋Ｙ方向側にはみ出した研削加工中の研削砥石７４０の研削面を冷却する。   The grinding apparatus 1 includes an arc-shaped cooling nozzle 60 that cools the grinding surface of the grinding wheel 740 being ground. As described above, the cooling means 60 is held by the holding means 3 when the holding means 3 is positioned by the moving means 35 at a grinding position where the grinding wheel 740 passes the center of the holding surface 30a of the holding means 3. The grinding surface of the grinding wheel 740 during the grinding process that protrudes from the workpiece W to the + Y direction side is cooled.

図１〜３に示すように、本実施形態においては、冷却ノズル６０は、例えば、研削砥石７４０のはみ出した部分に対応する半円弧状の外形を有する基部６００と、基部６００の上面に開口する複数の水供給口６０１と、を備えており、保持手段３のカバー３９上に後述するノズル昇降手段６３（図１には不図示）を介して配設されている。基部６００の曲率は、研削砥石７４０の回転軌道７４０ａの径に合わせて設定されている。   As shown in FIGS. 1 to 3, in the present embodiment, the cooling nozzle 60 opens to the upper surface of the base 600 having a semicircular arc shape corresponding to the protruding portion of the grinding wheel 740, for example. And a plurality of water supply ports 601, which are disposed on the cover 39 of the holding means 3 via a nozzle elevating means 63 (not shown in FIG. 1) described later. The curvature of the base 600 is set in accordance with the diameter of the rotation track 740a of the grinding wheel 740.

各水供給口６０１は、図２に示すように、例えば丸穴状に形成され、基部６００の上面に周方向に等間隔を空けて複数円弧状に配設されていると好ましいが、これに限定されるものではない。例えば、各水供給口は、細幅のスリット状に形成されており、基部６００の上面に周方向に等間隔を空けて複数円弧状に配設されていてもよい。または、基部６００の上面に一本連続的に円弧状に延びる細幅のスリットに水供給口は形成されていてもよい。   As shown in FIG. 2, each water supply port 601 is preferably formed in a round hole shape, for example, and is preferably arranged in a plurality of arcs at equal intervals in the circumferential direction on the upper surface of the base 600. It is not limited. For example, each water supply port is formed in a narrow slit shape, and may be arranged in a plurality of arcs at equal intervals in the circumferential direction on the upper surface of the base portion 600. Alternatively, the water supply port may be formed in a narrow slit that continuously extends in an arc shape on the upper surface of the base 600.

図３に示すように、各水供給口６０１は、例えば、基部６００の内部に形成された流路６００ｂに各下端が合流している。基部６００の内部に延びる流路６００ｂは、例えば、その一端が基部６００の外側面に開口しており、冷却ノズル６０に冷却水を供給する冷却水源６９に連通している。   As shown in FIG. 3, each water supply port 601 has, for example, each lower end joined to a flow path 600 b formed inside the base portion 600. For example, one end of the flow path 600 b extending inside the base 600 is open to the outer surface of the base 600 and communicates with a cooling water source 69 that supplies cooling water to the cooling nozzle 60.

図２、３に示すノズル昇降手段６３は、例えば、カバー３９の上面に立設されその側面に図示しないガイドレールを備えるガイド柱６３０と、ガイド柱６３０と平行にＺ軸方向に延在するボールネジ６３１と、ボールネジ６３１に連結されボールネジ６３１を回動させるモータ６３４と、内部のナットがボールネジ６３１に螺合し側部がガイド柱６３０のガイドレールに摺接する昇降部材６３２と、昇降部材６３２から両側方に延在し冷却ノズル６０の基部６００の内周面に一端が固定された支持ブリッジ６３３とを備えており、モータ６３４がボールネジ６３１を回動させると、これに伴い昇降部材６３２がガイド柱６３０のガイドレールにガイドされてＺ軸方向に移動し、昇降部材６３２に支持ブリッジ６３３を介して支持される冷却ノズル６０を所定の高さ位置に位置づけることができる。
ノズル昇降手段６３は、電動シリンダー又はエアシリンダー等であってもよい。 2 and 3 includes, for example, a guide column 630 that is provided upright on the upper surface of the cover 39 and includes a guide rail (not shown) on its side surface, and a ball screw that extends in the Z-axis direction parallel to the guide column 630 631, a motor 634 connected to the ball screw 631 and rotating the ball screw 631, an elevating member 632 whose inner nut is screwed into the ball screw 631 and whose side is in sliding contact with the guide rail of the guide column 630, and both sides from the elevating member 632 And a support bridge 633 having one end fixed to the inner peripheral surface of the base 600 of the cooling nozzle 60. When the motor 634 rotates the ball screw 631, the elevating member 632 is moved along the guide column. The cooling rail is guided by the guide rail 630 and moves in the Z-axis direction, and is supported by the elevating member 632 via the support bridge 633. You can position the Le 60 to a predetermined height position.
The nozzle raising / lowering means 63 may be an electric cylinder or an air cylinder.

なお、研削装置１はノズル昇降手段６３を備えていなくてもよく、冷却ノズル６０は、作業者によって手動で上下動可能となっていてもよい。この場合には、例えば、冷却ノズル６０は、保持手段３の枠体３１の側面にその両端が摺動可能に取り付けられていてもよい。即ち、例えば、枠体３１の側面にガイドレールが形成されており、冷却ノズル６０の両端はガイドレール上を摺動でき、作業者が所定の高さ位置に冷却ノズルを手作業で位置づけてから、固定ボルト、クランプ、ピン等で該高さ位置で冷却ノズル６０が固定される。   The grinding device 1 may not include the nozzle lifting / lowering means 63, and the cooling nozzle 60 may be manually movable up and down by an operator. In this case, for example, the cooling nozzle 60 may be slidably attached to the side surface of the frame 31 of the holding means 3. That is, for example, a guide rail is formed on the side surface of the frame 31, both ends of the cooling nozzle 60 can slide on the guide rail, and the operator manually positions the cooling nozzle at a predetermined height position. The cooling nozzle 60 is fixed at the height position with fixing bolts, clamps, pins, and the like.

図３に示すように、研削加工中において、冷却ノズル６０は、保持手段３が保持する被加工物Ｗから＋Ｙ方向側にはみ出した研削加工中の研削砥石７４０の研削面に対向しており、さらに、ノズル昇降手段６３が冷却ノズル６０をＺ軸方向に移動させて、各水供給口６０１と研削砥石７４０との間に隙間（例えば、幅２ｍｍの隙間）を設けた状態で、冷却ノズル６０が所定の高さ位置に位置づけられる。冷却ノズル６０の高さ位置は、例えば、被加工物Ｗを所望の厚さまで研削した際に下降する研削砥石７４０が水供給口６０１に接触してしまうことが無く、かつ、水供給口６０１と回転する研削砥石７４０の研削面との間の隙間に後述する負圧が生じる高さ位置とすると好ましい。   As shown in FIG. 3, during the grinding process, the cooling nozzle 60 faces the grinding surface of the grinding wheel 740 during the grinding process that protrudes from the workpiece W held by the holding means 3 to the + Y direction side. Further, the nozzle raising / lowering means 63 moves the cooling nozzle 60 in the Z-axis direction so that a gap (for example, a gap of 2 mm in width) is provided between each water supply port 601 and the grinding wheel 740. Is positioned at a predetermined height position. The height of the cooling nozzle 60 is such that, for example, the grinding wheel 740 that descends when the workpiece W is ground to a desired thickness does not come into contact with the water supply port 601 and the water supply port 601 It is preferable to set the height position at which a negative pressure described later is generated in the gap between the grinding wheel 740 and the grinding surface rotating.

冷却水源６９が、冷却水を例えば１．０Ｌ／分の供給量で冷却ノズル６０に供給する。該冷却水は、基部６００の内部に延びる流路６００ｂを通り各水供給口６０１から流れ出る。ここで、冷却ノズル６０の上方では、研削砥石７４０が高速で回転しているため、水供給口６０１と研削砥石７４０との間の隙間の空気は放射方向に高速で流れて行き該隙間から放出される。その結果、水供給口６０１から流出した冷却水を研削砥石７４０の研削面に引きつける負圧が該隙間に生成され、この負圧によって冷却水が研削砥石７４０の研削面に引き寄せられて接触し研削面が冷却される。研削砥石７４０の研削面に付着し冷却を行った冷却水は、回転する研削砥石７４０から受ける遠心力によって径方向外側に排出され、その後、ベース１０上に形成される図示しない排水口等に流れ込む。
なお、冷却水の供給量は、冷却水が上記のように負圧で研削砥石７４０の研削面に引き寄せられて接触するような供給量とすると少ない冷却水量で効率的に研削面を冷却する事ができる。
このように、冷却ノズル６０による研削砥石７４０の冷却を行いつつ、被加工物Ｗの上面Ｗｂを所定量研削した後、研削送り手段５が研削手段７を上方に移動させて、研削砥石７４０を被加工物Ｗの上面Ｗｂから離間させる。 The cooling water source 69 supplies the cooling water to the cooling nozzle 60 at a supply rate of 1.0 L / min, for example. The cooling water flows out from each water supply port 601 through a flow path 600 b extending inside the base portion 600. Here, since the grinding wheel 740 rotates at a high speed above the cooling nozzle 60, the air in the gap between the water supply port 601 and the grinding wheel 740 flows at a high speed in the radial direction and is discharged from the gap. Is done. As a result, a negative pressure that attracts the cooling water flowing out from the water supply port 601 to the grinding surface of the grinding wheel 740 is generated in the gap, and the cooling water is attracted to and contacts the grinding surface of the grinding wheel 740 by this negative pressure. The surface is cooled. Cooling water that adheres to the grinding surface of the grinding wheel 740 and cools it is discharged radially outward by centrifugal force received from the rotating grinding wheel 740 and then flows into a drain port (not shown) formed on the base 10. .
Note that if the cooling water is supplied such that the cooling water is attracted to and comes into contact with the grinding surface of the grinding wheel 740 with a negative pressure as described above, the grinding surface can be efficiently cooled with a small amount of cooling water. Can do.
In this way, after the grinding wheel 740 is cooled by the cooling nozzle 60 and the upper surface Wb of the workpiece W is ground by a predetermined amount, the grinding feed means 5 moves the grinding means 7 upward, and the grinding wheel 740 is moved. The workpiece W is separated from the upper surface Wb.

本発明に係る研削装置１は、移動手段３５で保持手段３を研削砥石７４０が保持手段３の保持面３０ａ中心を通過する研削位置に位置づけて研削を行う際に、保持手段３が保持する被加工物Ｗからはみ出した研削加工中の研削砥石７４０の研削面に対応する円弧状の冷却ノズル６０を備えることで、研削加工中に研削砥石７４０と被加工物Ｗとの接触箇所以外でも研削砥石７４０の研削面を冷却ノズル６０で効率よく十分に冷却することが可能となる。即ち、従来よりも、研削砥石７４０の研削面に対してより広範囲で冷却水を接触させることができ、また、冷却水が研削砥石７４０の研削面に接触している時間も長くなるので、冷却効果をより高めることができる。さらに、例えば、高圧の冷却水が水供給口６１０から噴射され研削砥石７４０の研削面に勢い良く接触することで、研削屑等のコンタミが研削面に埋め込まれることもあるが、上記のような冷却水の供給量の制御がされ、研削砥石７４０の回転により生じる負圧で研削砥石７４０の研削面に冷却水が引き寄せられて接触する場合には、研削屑等のコンタミが研削面に埋め込まれないことにより目詰まりが防がれる。よって、被加工物Ｗの被研削面に研削砥石７４０の蓄熱を原因とするむしれ等の研削不良が生じてしまうことを防ぐことができる。   In the grinding apparatus 1 according to the present invention, the holding means 3 is held by the holding means 3 when the holding means 3 is positioned by the moving means 35 at a grinding position where the grinding wheel 740 passes through the center of the holding surface 30a of the holding means 3. By providing an arc-shaped cooling nozzle 60 corresponding to the grinding surface of the grinding wheel 740 during grinding that protrudes from the workpiece W, the grinding wheel can be applied to any part other than the contact point between the grinding wheel 740 and the workpiece W during grinding. The ground surface 740 can be efficiently and sufficiently cooled by the cooling nozzle 60. That is, the cooling water can be brought into contact with the grinding surface of the grinding wheel 740 in a wider range than before, and the time during which the cooling water is in contact with the grinding surface of the grinding wheel 740 becomes longer. The effect can be further enhanced. Furthermore, for example, high-pressure cooling water is injected from the water supply port 610 and vigorously contacts the grinding surface of the grinding wheel 740, so that contamination such as grinding debris may be embedded in the grinding surface. When the cooling water supply amount is controlled and the cooling water is attracted and brought into contact with the grinding surface of the grinding wheel 740 by the negative pressure generated by the rotation of the grinding wheel 740, contamination such as grinding debris is embedded in the grinding surface. This prevents clogging. Therefore, it is possible to prevent the occurrence of grinding defects such as burrs caused by the heat accumulation of the grinding wheel 740 on the surface to be ground of the workpiece W.

また、冷却ノズル６０を保持手段３に配設するものとすることで、研削中に保持手段３が保持する被加工物Ｗからはみ出した研削砥石７４０の研削面の凡そ全てに冷却水を供給し冷却することができ、従来よりも冷却効率を向上させることができる。   Further, by providing the cooling nozzle 60 in the holding means 3, cooling water is supplied to almost all of the grinding surface of the grinding wheel 740 protruding from the workpiece W held by the holding means 3 during grinding. It can cool and can improve cooling efficiency rather than before.

冷却ノズル６０が、研削砥石７４０の研削面に対向させて複数の水供給口６０１が円弧状に基部６００に配設されていることで、研削中に保持手段３が保持する被加工物Ｗからはみ出した研削砥石７４０の研削面の凡そ全てに水供給口６０１から冷却水を供給して冷却することができ、従来よりも冷却効率を向上させることができる。   Since the cooling nozzle 60 faces the grinding surface of the grinding wheel 740 and the plurality of water supply ports 601 are disposed in the base 600 in an arc shape, the workpiece W held by the holding means 3 during grinding is removed. Cooling water can be supplied from the water supply port 601 to almost all of the ground grinding surface of the grinding wheel 740 that protrudes, and cooling efficiency can be improved as compared with the prior art.

本発明に係る研削装置は上記実施形態に限定されるものではなく、本発明の効果を発揮できる範囲内で適宜変更可能である。
例えば、本発明に係る研削装置は、上記実施形態のように保持手段３がＹ軸方向に直動して研削手段７の直下に位置づけられる研削装置１ではなく、図４〜図６に示すような、ベース１０上に設置された移動手段１８（ターンテーブル１８）が回転することで、研削手段７の直下に保持手段３が位置づけられる構成の研削装置１Ａであってもよい。 The grinding apparatus according to the present invention is not limited to the above embodiment, and can be appropriately changed within a range in which the effects of the present invention can be exhibited.
For example, the grinding apparatus according to the present invention is not the grinding apparatus 1 in which the holding means 3 moves linearly in the Y-axis direction and is positioned directly below the grinding means 7 as in the above embodiment, as shown in FIGS. Alternatively, the grinding device 1 </ b> A may be configured such that the holding unit 3 is positioned directly below the grinding unit 7 by rotating the moving unit 18 (turn table 18) installed on the base 10.

移動手段１８の上面には、複数（例えば３つ）の保持手段３が周方向に等間隔を空けて配設されている。移動手段１８は、Ｚ軸方向の軸心周りに回転可能となっており、移動手段１８が回転することで、各保持手段３をＸ軸Ｙ軸平面上で公転させ、各保持手段３を研削手段７の直下に順次移動させることができる。   On the upper surface of the moving means 18, a plurality of (for example, three) holding means 3 are arranged at equal intervals in the circumferential direction. The moving means 18 can rotate around the axis in the Z-axis direction. When the moving means 18 rotates, each holding means 3 revolves on the X-axis Y-axis plane, and each holding means 3 is ground. It can be sequentially moved directly below the means 7.

研削装置１Ａにおいて、冷却ノズル６０は図４に示すノズル昇降手段６３Ａによって上下動可能となっている。ノズル昇降手段６３Ａは、ベース１０上に立設されその側面にガイドレール６３０ａを備えるガイド柱６３０と、ガイド柱６３０と平行にＺ軸方向に延在するボールネジ６３１と、ボールネジ６３１に連結されボールネジ６３１を回動させるモータ６３４と、ナット６３２ａがボールネジ６３１に螺合し側部がガイドレール６３０ａに摺接する昇降部材６３２と、昇降部材６３２と一体的に形成され冷却ノズル６０に連結されたアーム６３５とを備えており、モータ６３４がボールネジ６３１を回動させると、これに伴い昇降部材６３２がガイドレール６３０ａにガイドされてＺ軸方向に移動し、アーム６３５で支持される冷却ノズル６０を所定の高さ位置に位置づけることができる。   In the grinding apparatus 1A, the cooling nozzle 60 can be moved up and down by nozzle lifting means 63A shown in FIG. The nozzle elevating means 63A is provided on the base 10 and has a guide column 630 provided with a guide rail 630a on its side surface, a ball screw 631 extending in the Z-axis direction parallel to the guide column 630, and a ball screw 631 connected to the ball screw 631 , A lifting member 632 whose nut 632a is screwed into the ball screw 631 and whose side portion is in sliding contact with the guide rail 630a, and an arm 635 formed integrally with the lifting member 632 and connected to the cooling nozzle 60. When the motor 634 rotates the ball screw 631, the elevating member 632 is guided by the guide rail 630 a and moves in the Z-axis direction, and the cooling nozzle 60 supported by the arm 635 is moved to a predetermined height. It can be positioned in the position.

図４に示す研削装置１Ａにより保持手段３に保持された被加工物Ｗを研削する場合には、移動手段１８が例えば＋Ｚ方向から見て反時計回り方向に自転することで、被加工物Ｗを吸引保持した状態の保持手段３が公転し、研削手段７の研削砥石７４０が被加工物Ｗの回転中心を通るように保持手段３が位置づけられる。また、傾き調節機構３７によって保持手段３の傾きが調整されることで、円錐面である保持面３０ａにならって吸引保持されている被加工物Ｗの上面Ｗｂが、研削砥石７４０の研削面に対して平行になる。   When grinding the workpiece W held on the holding means 3 by the grinding apparatus 1A shown in FIG. 4, the moving means 18 rotates counterclockwise as viewed from the + Z direction, for example, so that the workpiece W is rotated. The holding means 3 in the state of sucking and holding revolves, and the holding means 3 is positioned so that the grinding wheel 740 of the grinding means 7 passes through the rotation center of the workpiece W. Further, by adjusting the inclination of the holding means 3 by the inclination adjusting mechanism 37, the upper surface Wb of the workpiece W sucked and held following the holding surface 30 a which is a conical surface becomes the grinding surface of the grinding stone 740. Parallel to it.

上記移動手段１８による保持手段３の位置づけに際しては、例えば、冷却ノズル６０がノズル昇降手段６３Ａによって予め保持手段３よりも上側に位置づけられており、保持手段３が冷却ノズル６０に衝突しないようになっている。そして、保持手段３が研削手段７の下方の位置に位置づけられると、ノズル昇降手段６３Ａが冷却ノズル６０を下降させて、各水供給口６０１と研削砥石７４０との間に隙間（例えば、幅２ｍｍの隙間）を設けるように、冷却ノズル６０が所定の高さ位置に位置づけられる。   When the holding unit 3 is positioned by the moving unit 18, for example, the cooling nozzle 60 is positioned in advance above the holding unit 3 by the nozzle lifting / lowering unit 63 </ b> A so that the holding unit 3 does not collide with the cooling nozzle 60. ing. When the holding means 3 is positioned at a position below the grinding means 7, the nozzle raising / lowering means 63 </ b> A lowers the cooling nozzle 60, and a gap (for example, a width of 2 mm) is formed between each water supply port 601 and the grinding wheel 740. The cooling nozzle 60 is positioned at a predetermined height position so as to provide a gap.

研削送り手段５が研削手段７を下降させ、研削砥石７４０が＋Ｚ方向側からみて反時計周り方向に回転しつつ被加工物Ｗの上面Ｗｂに当接することで研削加工が行われる。研削加工中は、保持手段３が＋Ｚ方向側からみて反時計周り方向に移動手段１８上で回転するのに伴って被加工物Ｗも回転するので、研削砥石７４０が被加工物Ｗの上面Ｗｂの全面の研削加工を行う。さらに、冷却水源６９が、冷却水を例えば１．０Ｌ／分の供給量で冷却ノズル６０に供給し、水供給口６０１から流出した冷却水が研削砥石７４０の研削面に負圧によって引き寄せられて接触し研削面が冷却される。   The grinding feed means 5 lowers the grinding means 7, and the grinding wheel 740 contacts the upper surface Wb of the workpiece W while rotating counterclockwise as viewed from the + Z direction side. During the grinding process, the workpiece W also rotates as the holding unit 3 rotates on the moving unit 18 in the counterclockwise direction as viewed from the + Z direction side, so that the grinding wheel 740 has the upper surface Wb of the workpiece W. Grind the entire surface. Furthermore, the cooling water source 69 supplies cooling water to the cooling nozzle 60 at a supply rate of 1.0 L / min, for example, and the cooling water flowing out from the water supply port 601 is attracted to the grinding surface of the grinding wheel 740 by negative pressure. Contact and the ground surface is cooled.

冷却ノズル６０による研削砥石７４０の冷却を行いつつ、被加工物Ｗの上面Ｗｂを所定量研削した後、研削送り手段５が回転する研削手段７を上方に移動させて、研削砥石７４０を被加工物Ｗの上面Ｗｂから離間させる。これと同時に、冷却ノズル６０がノズル昇降手段６３Ａによって上昇して保持手段３よりも上側に位置づけられる。   While the grinding wheel 740 is cooled by the cooling nozzle 60, the upper surface Wb of the workpiece W is ground by a predetermined amount, and then the grinding means 7 rotated by the grinding feed means 5 is moved upward to process the grinding wheel 740. The object W is separated from the upper surface Wb. At the same time, the cooling nozzle 60 is raised by the nozzle lifting and lowering means 63A and positioned above the holding means 3.

移動手段１８が例えば＋Ｚ方向から見て反時計回り方向に自転することで、研削加工前の新たな被加工物Ｗを吸引保持した状態の別の保持手段３が公転し、研削手段７の研削砥石７４０が被加工物Ｗの回転中心を通るように保持手段３が位置づけられる。冷却ノズル６０は保持手段３よりも上方に位置づけられているため、保持手段３に冷却ノズル６０が衝突してしまうことはない。
なお、新たな被加工物Ｗを保持する保持手段３が移動手段１８により研削手段７の下方に位置づけされている最中に、回転している状態の研削手段７及び冷却ノズル６０が上昇した高さ位置で、冷却水源６９から冷却ノズル６０に冷却水を供給させ、水供給口６０１から流出した冷却水が研削砥石７４０の研削面に負圧によって引き寄せられて接触し研削面が冷却されていてもよい。 When the moving means 18 rotates counterclockwise as viewed from the + Z direction, for example, another holding means 3 in a state of sucking and holding a new workpiece W before grinding revolves, and the grinding means 7 performs grinding. The holding means 3 is positioned so that the grindstone 740 passes through the center of rotation of the workpiece W. Since the cooling nozzle 60 is positioned above the holding unit 3, the cooling nozzle 60 does not collide with the holding unit 3.
In addition, while the holding means 3 holding the new workpiece W is positioned below the grinding means 7 by the moving means 18, the rotating grinding means 7 and the cooling nozzle 60 are raised. At this position, the cooling water is supplied from the cooling water source 69 to the cooling nozzle 60, and the cooling water flowing out from the water supply port 601 is attracted by the negative pressure to the grinding surface of the grinding wheel 740 to come into contact with the grinding surface to be cooled. Also good.

移動手段１８の回転が停止して、新たな被加工物Ｗを保持する保持手段３が所定位置に位置づけられて研削手段７による研削が可能な状態になる。そして、例えば、研削送り手段５が研削手段７を下降させる前に、ノズル昇降手段６３Ａが冷却ノズル６０を下降させて、各水供給口６０１と研削砥石７４０との間に隙間（例えば、幅２ｍｍの隙間）を設けるように、冷却ノズル６０が所定の高さ位置に位置づけられる。その後、先ほどと同様に新たな被加工物Ｗが研削されていく。   The rotation of the moving means 18 is stopped, and the holding means 3 for holding a new workpiece W is positioned at a predetermined position so that the grinding means 7 can perform grinding. For example, before the grinding feed means 5 lowers the grinding means 7, the nozzle lifting / lowering means 63 </ b> A lowers the cooling nozzle 60, and a gap (for example, a width of 2 mm) between each water supply port 601 and the grinding wheel 740. The cooling nozzle 60 is positioned at a predetermined height position so as to provide a gap. Thereafter, a new workpiece W is ground as before.

１：研削装置 １０：ベース １１：コラム
３：保持手段 ３０：吸着部 ３０ａ：保持面 ３１：枠体 ３７：傾き調節機構 ３９：カバー ３５：移動手段
５：研削送り手段 ５０：ボールネジ ５１：ガイドレール ５２：モータ ５３：昇降板
７：研削手段 ７０：回転軸 ７０ａ：流路 ７１：ハウジング ７２：モータ ７３：マウント ７４：研削ホイール ７４０：研削砥石 ７４１：ホイール基台 ７５：ホルダ
６０：冷却ノズル ６００：基部 ６０１：水供給口 ６９：冷却水源
６３：ノズル昇降手段
Ｗ：ウェーハ
１Ａ：研削装置 ６３Ａ：ノズル昇降手段 1: Grinding device 10: Base 11: Column 3: Holding means 30: Suction part 30a: Holding surface 31: Frame body 37: Tilt adjusting mechanism 39: Cover 35: Moving means
5: Grinding feed means 50: Ball screw 51: Guide rail 52: Motor 53: Lift plate
7: Grinding means 70: Rotating shaft 70a: Flow path 71: Housing 72: Motor 73: Mount 74: Grinding wheel 740: Grinding wheel 741: Wheel base 75: Holder 60: Cooling nozzle 600: Base 601: Water supply port 69 : Cooling water source 63: Nozzle lifting / lowering means
W: Wafer 1A: Grinding device 63A: Nozzle lifting / lowering means

Claims (3)

被加工物を保持する保持面を有する保持手段と、環状に研削砥石を配設した研削ホイールの中心を軸に該研削ホイールを回転させ該研削砥石の研削面で被加工物を研削する研削手段と、該保持手段と該研削手段とを該保持面方向に相対的に移動させる移動手段と、を備える研削装置であって、
該移動手段で該保持手段を該研削砥石が該保持面中心を通過する研削位置に位置づけて研削を行う際に、該保持手段が保持する被加工物からはみ出した研削加工中の該研削砥石の研削面に対応する円弧状の冷却ノズルを備え、
研削加工中に該研削面を該冷却ノズルで冷却することを特徴とする研削装置。 A holding means having a holding surface for holding the workpiece, and a grinding means for rotating the grinding wheel about the center of the grinding wheel in which the grinding wheel is annularly arranged and grinding the workpiece on the grinding surface of the grinding wheel And a moving means for relatively moving the holding means and the grinding means in the direction of the holding surface,
When the grinding means performs the grinding by positioning the holding means at the grinding position where the grinding wheel passes through the center of the holding surface by the moving means, the grinding wheel in the grinding process that protrudes from the workpiece held by the holding means. It has an arc-shaped cooling nozzle corresponding to the grinding surface,
A grinding apparatus, wherein the grinding surface is cooled by the cooling nozzle during grinding. 前記冷却ノズルを前記保持手段に配設する請求項１記載の研削装置。   The grinding apparatus according to claim 1, wherein the cooling nozzle is disposed in the holding means. 前記冷却ノズルは、前記研削面に対向させて複数の水供給口が円弧状に配設された請求項１または請求項２記載の研削装置。   The grinding apparatus according to claim 1 or 2, wherein the cooling nozzle has a plurality of water supply ports arranged in an arc shape so as to face the grinding surface.
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