JP2019126746A - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP2019126746A JP2019126746A JP2018007981A JP2018007981A JP2019126746A JP 2019126746 A JP2019126746 A JP 2019126746A JP 2018007981 A JP2018007981 A JP 2018007981A JP 2018007981 A JP2018007981 A JP 2018007981A JP 2019126746 A JP2019126746 A JP 2019126746A
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- waste liquid
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- acid
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/10—Arrangements for cooling or lubricating tools or work
- B23Q11/1069—Filtration systems specially adapted for cutting liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/08—Means for treating work or cutting member to facilitate cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by ultrasonic cutting
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- C—CHEMISTRY; METALLURGY
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- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
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- C02F1/32—Treatment of water, waste water, or sewage by irradiation with ultraviolet light
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- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/72—Treatment of water, waste water, or sewage by oxidation
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
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- Mechanical Engineering (AREA)
- Toxicology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Water Supply & Treatment (AREA)
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Hydrology & Water Resources (AREA)
- Forests & Forestry (AREA)
- Dicing (AREA)
- Physical Water Treatments (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
4 金属枠体(リードフレーム)
6a,6b,6c デバイス領域
8 分割予定ライン
10 デバイスチップ搭載部
12 電極
14 モールド樹脂層
24 ウォーターカバー
26 テーブルベース
30 蛇腹
54 切削ブレード
60 ウォーターケース
70 排液口
72 切削送り機構
82 排液管
84,84A 廃液処理機構
90 LEDランプ
Claims (2)
- 被加工物を保持する保持手段と、該保持手段に保持された被加工物を加工する加工手段とを備えた加工装置であって、
該保持手段に保持された被加工物を該加工手段で加工する際に少なくとも被加工物に酸化剤を含む加工液を供給する加工液供給手段と、
該加工液供給手段から被加工物に供給された該加工液を含む加工廃液を回収する加工廃液回収部と、
該加工廃液回収部から該加工廃液を該加工装置外へと排出する排出路と、
該排出路中に配設され、該加工廃液が該排出路中を流れる間に該加工廃液に含まれる該加工液を分解する廃液処理手段と、
を更に備えたことを特徴とする加工装置。 - 該酸化剤は過酸化水素であり、該廃液処理手段は該加工廃液に対して紫外線を照射する紫外線照射手段を含む請求項1記載の切削装置。
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JP2018007981A JP2019126746A (ja) | 2018-01-22 | 2018-01-22 | 加工装置 |
KR1020190003902A KR20190089731A (ko) | 2018-01-22 | 2019-01-11 | 가공 장치 |
CN201910042945.2A CN110071056A (zh) | 2018-01-22 | 2019-01-17 | 加工装置 |
US16/252,023 US10930558B2 (en) | 2018-01-22 | 2019-01-18 | Processing apparatus |
TW108101901A TWI781280B (zh) | 2018-01-22 | 2019-01-18 | 加工裝置 |
DE102019200730.9A DE102019200730B4 (de) | 2018-01-22 | 2019-01-22 | Bearbeitungsvorrichtung |
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JP2019136844A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社ディスコ | 加工装置 |
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JP2016131954A (ja) * | 2015-01-21 | 2016-07-25 | 株式会社ディスコ | 純水精製装置 |
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JPH0975993A (ja) * | 1995-09-19 | 1997-03-25 | Taiyo Kagaku Kogyo Kk | 有機物含有廃水の処理方法及びその装置 |
JPH11226387A (ja) * | 1998-02-13 | 1999-08-24 | Karasawa Fine:Kk | 流体による処理方法および装置 |
JP3914842B2 (ja) * | 2001-10-23 | 2007-05-16 | 有限会社ユーエムエス | 有機被膜の除去方法および除去装置 |
JP2011040542A (ja) | 2009-08-10 | 2011-02-24 | Disco Abrasive Syst Ltd | パッケージ基板の分割方法 |
JP5461918B2 (ja) * | 2009-08-19 | 2014-04-02 | 株式会社ディスコ | 加工廃液処理装置 |
JP6274926B2 (ja) * | 2014-03-17 | 2018-02-07 | 株式会社ディスコ | 切削方法 |
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JP2007319974A (ja) * | 2006-05-31 | 2007-12-13 | Nomura Micro Sci Co Ltd | 半導体研磨用スラリーの回収方法及び回収システム並びに再生方法及び再生システム |
JP2010269234A (ja) * | 2009-05-20 | 2010-12-02 | Disco Abrasive Syst Ltd | 紫外線分解装置 |
JP2016131954A (ja) * | 2015-01-21 | 2016-07-25 | 株式会社ディスコ | 純水精製装置 |
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JP2019136844A (ja) * | 2018-02-14 | 2019-08-22 | 株式会社ディスコ | 加工装置 |
JP7150390B2 (ja) | 2018-02-14 | 2022-10-11 | 株式会社ディスコ | 加工装置 |
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KR20190089731A (ko) | 2019-07-31 |
DE102019200730A1 (de) | 2019-07-25 |
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US20190229018A1 (en) | 2019-07-25 |
TW201933514A (zh) | 2019-08-16 |
TWI781280B (zh) | 2022-10-21 |
US10930558B2 (en) | 2021-02-23 |
DE102019200730B4 (de) | 2023-06-15 |
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