JP2019051628A - Thermal head - Google Patents

Thermal head Download PDF

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Publication number
JP2019051628A
JP2019051628A JP2017176114A JP2017176114A JP2019051628A JP 2019051628 A JP2019051628 A JP 2019051628A JP 2017176114 A JP2017176114 A JP 2017176114A JP 2017176114 A JP2017176114 A JP 2017176114A JP 2019051628 A JP2019051628 A JP 2019051628A
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Prior art keywords
insulating substrate
common electrode
thermal head
region
sealing resin
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JP2017176114A
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JP6781125B2 (en
Inventor
直希 ▲高▼田
直希 ▲高▼田
Naoki Takada
範男 山地
Norio Yamaji
範男 山地
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Aoi Electronics Co Ltd
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Aoi Electronics Co Ltd
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Priority to JP2017176114A priority Critical patent/JP6781125B2/en
Priority to CN201811063857.2A priority patent/CN109484036B/en
Publication of JP2019051628A publication Critical patent/JP2019051628A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335—Structure of thermal heads
    • B41J2/33505—Constructional details
    • B41J2/3351—Electrode layers

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Abstract

To provide a thermal head capable of enhancing an adhesion strength of a sealing resin.SOLUTION: A thermal head includes: a common electrode 2 that is formed on an insulating substrate 4 and to which a driving voltage is applied; a plurality of individual electrodes 3 that are formed on each fine region of a heat generator 1 on the insulating substrate and apply the driving voltage to each of the fine regions; driving ICs 6a and 6b that are provided on a circuit board 9 in contact with the insulating substrate and control electric current flowing through each of the plurality of individual electrodes; a protective film 12 covering a protection region including the common electrode and the individual electrodes; and a sealing resin 8 which covers a wire connected to the driving ICs and the driving ICs so as to straddle the insulating substrate and the circuit board, where the plurality of individual electrodes are provided with a connection pad 31 connected to the driving ICs via the wire along the edge of the insulating board, and the protection region includes a region in contact with at least a part of the edge of the insulating substrate between one end of the common electrode and the other end of the common electrode in the region covered with the sealing resin.SELECTED DRAWING: Figure 1

Description

本発明は、サーマルヘッドに関する。   The present invention relates to a thermal head.

従来、封止樹脂によりボンディングワイヤを封止したサーマルヘッドが知られている（例えば、特許文献１）。   Conventionally, a thermal head in which a bonding wire is sealed with a sealing resin is known (for example, Patent Document 1).

特開２００８−６８４０５号公報JP 2008-68405 A

従来技術には、封止樹脂の密着強度が十分でない問題があった。   The prior art has a problem that the adhesion strength of the sealing resin is not sufficient.

本発明の第１の態様によると、サーマルヘッドは、絶縁基板上に形成され駆動電圧が印加される共通電極と、前記絶縁基板上に発熱体の微小領域ごとに形成され、前記微小領域ごとに前記駆動電圧を印加する複数の個別電極と、前記絶縁基板に接して回路基板上に設けられ、前記複数の個別電極の各々に流れる電流を制御する駆動ＩＣと、前記共通電極と前記個別電極を含む保護領域を覆う保護膜と、前記駆動ＩＣに結線されたワイヤおよび前記駆動ＩＣを、前記絶縁基板および前記回路基板を跨いで覆う封止樹脂とを備え、前記複数の個別電極には、前記ワイヤにより前記駆動ＩＣと接続される接続パッドが前記絶縁基板の縁に沿って設けられ、前記保護領域は、前記封止樹脂で覆われている領域のうち、前記共通電極の一端と前記共通電極の他端との間でかつ前記絶縁基板の前記縁の少なくとも一部に接する領域を含む。   According to the first aspect of the present invention, the thermal head is formed on the insulating substrate and applied to the common electrode to which the driving voltage is applied, and is formed on the insulating substrate for each minute region of the heating element. A plurality of individual electrodes for applying the driving voltage; a driving IC provided on the circuit board in contact with the insulating substrate; for controlling a current flowing through each of the plurality of individual electrodes; the common electrode and the individual electrodes; A protective film that covers the protective region, a wire that is connected to the drive IC, and a sealing resin that covers the drive IC across the insulating substrate and the circuit board, and the plurality of individual electrodes include A connection pad connected to the drive IC by a wire is provided along an edge of the insulating substrate, and the protective region is one of the common electrode and the common electrode in a region covered with the sealing resin. And between the other end of the at least partially in contact with the region of the edge of the insulating substrate.

本発明によれば、封止樹脂の密着強度を高めることができる。   According to the present invention, the adhesion strength of the sealing resin can be increased.

第１の実施の形態に係るサーマルヘッドの構成を示す平面図The top view which shows the structure of the thermal head which concerns on 1st Embodiment 図１のＩ−Ｉ線断面を模式的に示す図The figure which shows the II sectional view typically of FIG. 第２の実施の形態に係るサーマルヘッドの構成を示す平面図The top view which shows the structure of the thermal head which concerns on 2nd Embodiment. 図３のＩ−Ｉ線断面を模式的に示す図The figure which shows the II sectional view typically of FIG. 一の変形例に係るサーマルヘッドの構成を示す平面図The top view which shows the structure of the thermal head which concerns on one modification. 一の変形例に係るサーマルヘッドの構成を示す平面図The top view which shows the structure of the thermal head which concerns on one modification.

（第１の実施の形態）
図１は、本発明の第１の実施の形態に係るサーマルヘッドの構成を示す平面図である。図２は、図１のＩ−Ｉ線断面を模式的に示す図である。サーマルヘッド１００は、支持板５上に固定された絶縁基板４および回路基板９を備える。絶縁基板４および回路基板９は、粘着層１１によって支持板５上に固定されている。 (First embodiment)
FIG. 1 is a plan view showing the configuration of the thermal head according to the first embodiment of the present invention. FIG. 2 is a diagram schematically showing a cross section taken along line II of FIG. The thermal head 100 includes an insulating substrate 4 and a circuit board 9 fixed on the support plate 5. The insulating substrate 4 and the circuit board 9 are fixed on the support plate 5 by the adhesive layer 11.

絶縁基板４は、セラミックなどの絶縁体によって形成される。本実施の形態では、絶縁基板４は、セラミック基板４ａの上にアンダーグレーズ層４ｂを設けて構成されている。絶縁基板４上には、例えば金などの導体をフォトリソグラフィ法を用いて、不要な部分をエッチングにより除去することで、共通電極基部２１および複数の個別電極３が形成されている。共通電極２および複数の個別電極３の上方（図１の紙面上方向）には、例えば厚膜印刷により、帯状の発熱体１が形成されている。絶縁基板４の全体のうちの一部の領域（後に詳述）は、図１および図２に斜線で示す保護膜１２により被覆される。保護膜１２は、例えばガラス等により構成される。   The insulating substrate 4 is formed of an insulator such as ceramic. In the present embodiment, the insulating substrate 4 is configured by providing an underglaze layer 4b on a ceramic substrate 4a. A common electrode base 21 and a plurality of individual electrodes 3 are formed on the insulating substrate 4 by removing unnecessary portions by etching a conductor such as gold using a photolithography method. Above the common electrode 2 and the plurality of individual electrodes 3 (upward in the drawing in FIG. 1), a belt-like heating element 1 is formed by, for example, thick film printing. A part of the entire insulating substrate 4 (described in detail later) is covered with a protective film 12 indicated by hatching in FIGS. The protective film 12 is made of, for example, glass.

プリント配線板等である回路基板９には、ドライバＩＣ６ａ、ドライバＩＣ６ｂ、および接続端子１０が設けられている。ドライバＩＣ６ａ、ドライバＩＣ６ｂはそれぞれ、複数の個別電極３に接続されて各発熱体１に流れる電流の通電、非通電を制御する駆動ＩＣである。以下の説明において、ドライバＩＣ６ａおよびドライバＩＣ６ｂをドライバＩＣ６と総称する。なお、ドライバＩＣ６は、実際には接続端子１０から信号を受け取ってドライバＩＣ６を制御するための入力電極パッドがあるが、図上では省略して記載している。   A circuit board 9 such as a printed wiring board is provided with a driver IC 6a, a driver IC 6b, and a connection terminal 10. Each of the driver IC 6a and the driver IC 6b is a drive IC that is connected to the plurality of individual electrodes 3 and controls energization and de-energization of the current flowing through each heating element 1. In the following description, the driver IC 6a and the driver IC 6b are collectively referred to as the driver IC 6. The driver IC 6 actually has an input electrode pad for receiving a signal from the connection terminal 10 and controlling the driver IC 6, but is omitted from the drawing.

接続端子１０は、印字制御等を行う外部機器にサーマルヘッド１００を接続するための接続部である。接続端子１０は、回路基板９の図１における下部に、すなわち回路基板９の絶縁基板４側とは逆側の縁に、一列に並べて複数配置されている。各々の個別電極３の一端は、ドライバＩＣ６にワイヤ７ｃで接続されている。ワイヤ７ｃは、個別電極３とドライバＩＣ６とを電気的に接続する、金線等の金属線である。   The connection terminal 10 is a connection unit for connecting the thermal head 100 to an external device that performs print control or the like. A plurality of connection terminals 10 are arranged in a line at the lower part of the circuit board 9 in FIG. 1, that is, on the edge opposite to the insulating substrate 4 side of the circuit board 9. One end of each individual electrode 3 is connected to the driver IC 6 by a wire 7c. The wire 7 c is a metal wire such as a gold wire that electrically connects the individual electrode 3 and the driver IC 6.

共通電極２は、共通電極基部２１および複数の共通電極延在部２０を有する。共通電極基部２１は、矩形の絶縁基板４が有する４辺のうち、回路基板９に面した１辺を除く３つの辺に沿って、発熱体１を取り囲むように形成されている。複数の共通電極延在部２０は、図１において発熱体１と平行に延在する共通電極基部２１の一領域から副走査方向４２（図１の紙面上下方向）に沿って延在する。後述するように、発熱体１の延在方向は主走査方向である。   The common electrode 2 has a common electrode base 21 and a plurality of common electrode extensions 20. The common electrode base 21 is formed so as to surround the heating element 1 along three sides of the four sides of the rectangular insulating substrate 4 except for one side facing the circuit board 9. The plurality of common electrode extending portions 20 extend from a region of the common electrode base portion 21 extending in parallel with the heating element 1 in FIG. 1 along the sub-scanning direction 42 (up and down direction in FIG. 1). As will be described later, the extending direction of the heating element 1 is the main scanning direction.

共通電極基部２１の一方の端部２１ａは、複数のワイヤ７ａにより、回路基板９に設けられた配線パターン１３ａと電気的に接続される。配線パターン１３ａは、接続端子１０と電気的に接続されている。共通電極基部２１の他方の端部２１ｂは、複数のワイヤ７ｂにより、回路基板９に設けられた配線パターン１３ｂと電気的に接続されている。配線パターン１３ｂは、接続端子１０の他方側と電気的に接続されている。   One end 21a of the common electrode base 21 is electrically connected to a wiring pattern 13a provided on the circuit board 9 by a plurality of wires 7a. The wiring pattern 13 a is electrically connected to the connection terminal 10. The other end 21b of the common electrode base 21 is electrically connected to a wiring pattern 13b provided on the circuit board 9 by a plurality of wires 7b. The wiring pattern 13 b is electrically connected to the other side of the connection terminal 10.

複数の個別電極３はそれぞれ、接続部３２、個別電極延在部３０、および接続パッド３１を有する。個別電極延在部３０は、共通電極２の一対の共通電極延在部２０の間に位置し副走査方向４２に沿って延在する。接続部３２は、個別電極延在部３０の端部から副走査方向４２に延在する。   Each of the plurality of individual electrodes 3 includes a connection portion 32, an individual electrode extension portion 30, and a connection pad 31. The individual electrode extension part 30 is located between the pair of common electrode extension parts 20 of the common electrode 2 and extends along the sub-scanning direction 42. The connection portion 32 extends in the sub-scanning direction 42 from the end portion of the individual electrode extension portion 30.

接続パッド３１は、接続部３２の他端、すなわち個別電極延在部３０とは反対側の接続部３２の端部に設けられている。つまり、接続部３２の一端には個別電極延在部３０が設けられ、他端には接続パッド３１が設けられている。換言すると、個別電極延在部３０と接続パッド３１は接続部３２で接続されている。   The connection pad 31 is provided at the other end of the connection portion 32, that is, at the end portion of the connection portion 32 opposite to the individual electrode extension portion 30. That is, the individual electrode extension part 30 is provided at one end of the connection part 32, and the connection pad 31 is provided at the other end. In other words, the individual electrode extension portion 30 and the connection pad 31 are connected by the connection portion 32.

複数の共通電極延在部２０と複数の個別電極延在部３０は、交互に対向してかみ合うように形成されている。発熱体１は、複数の共通電極延在部２０と複数の個別電極延在部３０に跨がって、言い換えると横断して形成され、共通電極延在部２０と個別電極延在部３０の配列方向である主走査方向４１（図１の紙面左右方向）に延設されている。   The plurality of common electrode extending portions 20 and the plurality of individual electrode extending portions 30 are formed so as to alternately face each other. The heating element 1 is formed across the plurality of common electrode extension portions 20 and the plurality of individual electrode extension portions 30, in other words, across the common electrode extension portion 20 and the individual electrode extension portion 30. It extends in the main scanning direction 41 (the horizontal direction in FIG. 1), which is the arrangement direction.

複数の接続パッド３１は、絶縁基板４の回路基板９側の縁部４ｘ（図１，図２）に沿って、すなわち主走査方向４１に沿って、所定ピッチで一列に配列されている。ドライバＩＣ６は、上面視が細長い矩形形状（全体として細長い四角柱）であり、長手方向を回路基板９側の縁部４ｘの延在方向に整列させて回路基板９にダイボンディングされている。ドライバＩＣ６の上面には、絶縁基板４に対向する縁部に沿って、すなわち主走査方向４１に沿って、複数のＩＣ電極パッド６０が形成されている。複数の接続パッド３１は、複数のＩＣ電極パッド６０と同一のピッチで配列されている。１つのＩＣ電極パッド６０には、１つの接続パッド３１が対応する。各々の接続パッド３１は、ワイヤ７ｃによって、対応するＩＣ電極パッド６０と電気的に接続されている。   The plurality of connection pads 31 are arranged in a line at a predetermined pitch along the edge 4x (FIGS. 1 and 2) of the insulating substrate 4 on the circuit board 9 side, that is, along the main scanning direction 41. The driver IC 6 has an elongated rectangular shape (as a whole, an elongated rectangular column) when viewed from above, and is die-bonded to the circuit board 9 with the longitudinal direction aligned with the extending direction of the edge 4x on the circuit board 9 side. A plurality of IC electrode pads 60 are formed on the upper surface of the driver IC 6 along the edge facing the insulating substrate 4, that is, along the main scanning direction 41. The plurality of connection pads 31 are arranged at the same pitch as the plurality of IC electrode pads 60. One connection pad 31 corresponds to one IC electrode pad 60. Each connection pad 31 is electrically connected to the corresponding IC electrode pad 60 by a wire 7c.

ドライバＩＣ６は、共通電極２から発熱体１を介して各々の個別電極３に流れる電流を制御する。これにより、共通電極延在部２０と個別電極延在部３０とが交互に対向してかみ合う様に形成された部分の間にある発熱体１の微小領域に電流が流れ、その部分が発熱する。この熱を感熱紙などの印字媒体に与えることで印字が行われる。   The driver IC 6 controls the current flowing from the common electrode 2 to each individual electrode 3 via the heating element 1. As a result, a current flows in a minute region of the heating element 1 between the portions formed so that the common electrode extending portions 20 and the individual electrode extending portions 30 are alternately opposed to each other, and the portions generate heat. . Printing is performed by applying this heat to a printing medium such as thermal paper.

なお、図１では、作図の都合上、個別電極３を実際よりも少なく簡略化して図示している。そのため、共通電極延在部２０の個数、個別電極延在部３０の個数、接続パッド３１の個数、ＩＣ電極パッド６０の個数なども、実際よりも少なく図示している。また、接続パッド３１は、ＩＣ電極パッド６０と同一のピッチであるが、必ずしも主走査方向４１に沿って同列上に配置する必要はなく、２列や３列であってもよい。   In FIG. 1, for convenience of drawing, the individual electrodes 3 are illustrated in a simplified manner less than actual. For this reason, the number of common electrode extending portions 20, the number of individual electrode extending portions 30, the number of connection pads 31, the number of IC electrode pads 60, and the like are also shown smaller than actual. Further, although the connection pads 31 have the same pitch as the IC electrode pads 60, they need not necessarily be arranged on the same row along the main scanning direction 41, and may be two rows or three rows.

絶縁基板４の一部領域は、図１に斜線で示す保護膜１２により被覆される。保護膜１２により保護される領域には、発熱体１と、共通電極２の少なくとも共通電極延在部２０を含む大部分と、個別電極３のうち接続パッド３１を除く部分（すなわち個別電極延在部３０および接続部３２の大部分）と、が含まれる。換言すると、これらの部材が保護膜１２で保護される。   A partial region of the insulating substrate 4 is covered with a protective film 12 shown by hatching in FIG. In the region protected by the protective film 12, the heating element 1, most of the common electrode 2 including at least the common electrode extension 20, and the part of the individual electrode 3 excluding the connection pad 31 (that is, the individual electrode extension) Most of the portion 30 and the connecting portion 32). In other words, these members are protected by the protective film 12.

封止樹脂８は、エポキシ系の樹脂をキュアさせることで、ドライバＩＣ６、ワイヤ７ａ、ワイヤ７ｂ、ワイヤ７ｃを含む、絶縁基板４と回路基板９との境界の領域を平面的に絶縁基板４、回路基板９の、発熱体１と直角方向の両縁部までの範囲で封止する。封止樹脂８は、ワイヤ７ａ、ワイヤ７ｂ、ワイヤ７ｃなどが、外部からの接触や衝撃により破断ないし剥離することを防止する。封止樹脂８には、絶縁基板４の表面や、絶縁基板４に形成された共通電極２および個別電極３の表面には固着しにくく、保護膜１２の表面にはそれらよりも固着しやすい性質がある。構成材料の相性以外にも、絶縁基板４、共通電極２および個別電極３、保護膜１２の各表面粗さ、Ｒａが、概略、０．０２５μｍ、０．０２５μｍ、０．０７９μｍであり、保護膜１２の表面粗さ、Ｒａが、絶縁基板４や共通電極２および個別電極３に比べて、３倍以上の値となっている。この結果、アンカー効果としても保護膜１２の方が固着しやすくなることがわかる。   The sealing resin 8 cures an epoxy-based resin so that the boundary region between the insulating substrate 4 and the circuit substrate 9 including the driver IC 6, the wire 7a, the wire 7b, and the wire 7c is planarly insulated. The circuit board 9 is sealed in a range up to both edges in a direction perpendicular to the heating element 1. The sealing resin 8 prevents the wire 7a, the wire 7b, the wire 7c, and the like from being broken or peeled off due to external contact or impact. The sealing resin 8 is less likely to adhere to the surface of the insulating substrate 4, the surfaces of the common electrode 2 and the individual electrode 3 formed on the insulating substrate 4, and more easily adheres to the surface of the protective film 12. There is. In addition to the compatibility of the constituent materials, the surface roughness Ra of the insulating substrate 4, the common electrode 2 and the individual electrode 3, and the protective film 12 is approximately 0.025 μm, 0.025 μm, and 0.079 μm. 12 has a surface roughness Ra of 3 times or more compared to the insulating substrate 4, the common electrode 2, and the individual electrode 3. As a result, it can be seen that the protective film 12 is more easily fixed as an anchor effect.

接続端子１０には、例えばフレキシブルプリントケーブル（ＦＰＣ）が半田等により接続される。接続端子１０へのＦＰＣへの接続は、例えばＦＰＣ上からヒーター等により熱を加えることで、半田等を溶融させることにより行う。その際、絶縁基板４や回路基板９、封止樹脂８等に熱が伝わり、これらの部分が膨張する。絶縁基板４や回路基板９、封止樹脂８等は、異なる熱膨張率を有しているので、熱によって、封止樹脂８が絶縁基板４および回路基板９から剥がれてしまう恐れがある。
本実施の形態では、発熱体１、共通電極２、および個別電極３を保護する保護膜１２を、できるだけ絶縁基板４の回路基板９側の縁部４ｘまで延伸させている。具体的には下記（１）〜（３）の領域において、保護膜１２を、図１の点線で示す線１２Ｐ（従来の保護膜１２の領域線）から縁部４ｘまで延伸されている。
（１）共通電極２の端部２１ａとドライバＩＣ６ａに対応する複数の接続パッド３１との間の領域Ｒ１
（２）共通電極２の端部２１ｂとドライバＩＣ６ｂに対応する複数の接続パッド３１との間の領域Ｒ２
（３）ドライバＩＣ６ａに対応する複数の接続パッド３１とドライバＩＣ６ｂに対応する複数の接続パッド３１との間の領域Ｒ３
これらの領域Ｒ１〜Ｒ３は、いずれも、共通電極２の一方の端部２１ａと共通電極２の他方の端部２１ｂの間に位置しており、かつ、絶縁基板４の縁部４ｘに接触している。
このように、保護膜１２と封止樹脂８とが接する面積をできるだけ大きくしたので、封止樹脂８はより確実に固着し、熱によって剥がれてしまいにくくなる。 For example, a flexible printed cable (FPC) is connected to the connection terminal 10 by soldering or the like. The connection to the FPC to the connection terminal 10 is performed, for example, by melting the solder or the like by applying heat from above the FPC with a heater or the like. At that time, heat is transmitted to the insulating substrate 4, the circuit substrate 9, the sealing resin 8, etc., and these portions expand. Since the insulating substrate 4, the circuit substrate 9, the sealing resin 8, and the like have different coefficients of thermal expansion, the sealing resin 8 may be peeled off from the insulating substrate 4 and the circuit substrate 9 due to heat.
In the present embodiment, the protective film 12 that protects the heating element 1, the common electrode 2, and the individual electrode 3 is extended as much as possible to the edge 4 x of the insulating substrate 4 on the circuit board 9 side. Specifically, in the following areas (1) to (3), the protective film 12 is extended from a line 12P (area line of the conventional protective film 12) indicated by a dotted line in FIG. 1 to the edge 4x.
(1) Region R1 between the end 21a of the common electrode 2 and the plurality of connection pads 31 corresponding to the driver IC 6a
(2) Region R2 between the end 21b of the common electrode 2 and the plurality of connection pads 31 corresponding to the driver IC 6b
(3) Region R3 between the plurality of connection pads 31 corresponding to the driver IC 6a and the plurality of connection pads 31 corresponding to the driver IC 6b
All of these regions R1 to R3 are located between one end 21a of the common electrode 2 and the other end 21b of the common electrode 2 and are in contact with the edge 4x of the insulating substrate 4. ing.
As described above, since the area where the protective film 12 and the sealing resin 8 are in contact with each other is made as large as possible, the sealing resin 8 is more reliably fixed and hardly peeled off by heat.

絶縁基板４と回路基板９との境界部からは、時間の経過と共に、空気中の水分が少しずつ侵入することがある。また、封止樹脂８と密着面との界面に異物が存在すると、異物が水分を吸収し膨潤することで、封止樹脂８の密着が阻害され、封止樹脂８が絶縁基板４および回路基板９から剥がれてしまう恐れがある。
本実施の形態では、上述したように、共通電極２の端部２１ａ，２１ｂ、およびドライバＩＣ６ａ，６ｂに対応する複数の接続パッド３１との間の絶縁基板４の表面に区画した領域Ｒ１〜Ｒ３において、保護膜１２が、縁部４ｘまで延伸されている。このように、保護膜１２と封止樹脂８とが接する面積をできるだけ大きくしたので、封止樹脂８はより確実に固着し、吸湿によって剥がれてしまいにくくなる。 From the boundary between the insulating substrate 4 and the circuit board 9, moisture in the air may enter little by little as time passes. In addition, if there is a foreign substance at the interface between the sealing resin 8 and the close contact surface, the foreign substance absorbs moisture and swells, thereby inhibiting the close contact of the sealing resin 8, and the sealing resin 8 becomes the insulating substrate 4 and the circuit board. There is a risk of peeling from 9.
In the present embodiment, as described above, the regions R1 to R3 partitioned on the surface of the insulating substrate 4 between the end portions 21a and 21b of the common electrode 2 and the plurality of connection pads 31 corresponding to the driver ICs 6a and 6b. The protective film 12 is extended to the edge 4x. As described above, since the area where the protective film 12 and the sealing resin 8 are in contact with each other is made as large as possible, the sealing resin 8 is more reliably fixed and is less likely to be peeled off due to moisture absorption.

上述した実施の形態によれば、次の作用効果が得られる。
（１）封止樹脂８は、ドライバＩＣ６に結線されたワイヤ７ｃおよびドライバＩＣ６を、絶縁基板４および回路基板９を跨いで覆う。保護膜１２は、共通電極２および個別電極３を覆うと共に、封止樹脂８で覆われている領域のうち、共通電極２の一方の端部２１ａと共通電極２の他方の端部２１ｂとの間でかつ絶縁基板４の縁部４ｘの少なくとも一部に接する領域を覆う。このようにしたので、封止樹脂８の密着強度をより高めることができ、熱や吸湿によって封止樹脂８が剥がれる可能性を低減することができる。
（２）封止樹脂８で覆う範囲は平面的に絶縁基板４、回路基板９の、発熱体１と直角方向の両縁部までの範囲であり、支持板５まで延伸していないので、支持板５上で封止樹脂８の塗布領域が不要となり、サーマルヘッド１００の主走査方向４１の長さを短くでき小型化が可能となる。 According to the embodiment described above, the following operational effects can be obtained.
(1) The sealing resin 8 covers the wires 7 c and the driver IC 6 connected to the driver IC 6 across the insulating substrate 4 and the circuit substrate 9. The protective film 12 covers the common electrode 2 and the individual electrode 3, and includes one end 21 a of the common electrode 2 and the other end 21 b of the common electrode 2 in the region covered with the sealing resin 8. A region in contact with at least a part of the edge 4x of the insulating substrate 4 is covered. Since it did in this way, the adhesive strength of sealing resin 8 can be raised more, and possibility that sealing resin 8 will peel by heat | fever or moisture absorption can be reduced.
(2) The range covered with the sealing resin 8 is a range up to both edges of the insulating substrate 4 and the circuit board 9 in the direction perpendicular to the heating element 1 and does not extend to the support plate 5. The application region of the sealing resin 8 is not necessary on the plate 5, and the length of the thermal head 100 in the main scanning direction 41 can be shortened and the size can be reduced.

（第２の実施の形態）
図３は、本発明の第２の実施の形態に係るサーマルヘッドの構成を示す平面図である。図４は、図３のＩ−Ｉ線断面を模式的に示す図である。以下、本実施の形態に係るサーマルヘッド１００の、第１の実施の形態に係るサーマルヘッド１００との違いについて述べる。 (Second Embodiment)
FIG. 3 is a plan view showing the configuration of the thermal head according to the second embodiment of the present invention. FIG. 4 is a diagram schematically showing a cross section taken along line II of FIG. Hereinafter, differences between the thermal head 100 according to the present embodiment and the thermal head 100 according to the first embodiment will be described.

図３および図４に示す本実施の形態のサーマルヘッド１００は、保護膜１２が覆う領域を、第１の実施の形態よりも大きく拡げている。具体的には、絶縁基板４の回路基板９側の縁部４ｘを、保護膜１２が覆っている。つまり、ワイヤ７ａ、７ｂ、７ｃの下方の領域Ｒ４まで、保護膜１２が覆っている。この領域Ｒ４は、共通電極２の一方の端部２１ａと共通電極２の他方の端部２１ｂの間に位置しており、かつ、絶縁基板４の縁部４ｘに接触している。   In the thermal head 100 of the present embodiment shown in FIGS. 3 and 4, the region covered by the protective film 12 is expanded more than in the first embodiment. Specifically, the protective film 12 covers the edge 4x of the insulating substrate 4 on the circuit board 9 side. That is, the protective film 12 covers the region R4 below the wires 7a, 7b, and 7c. The region R4 is located between one end portion 21a of the common electrode 2 and the other end portion 21b of the common electrode 2, and is in contact with the edge portion 4x of the insulating substrate 4.

このように、本実施の形態に係るサーマルヘッド１００では、保護膜１２と封止樹脂８が接する範囲をより大きくしたので、封止樹脂８の密着強度が第１の実施の形態よりも更に高まる。   As described above, in the thermal head 100 according to the present embodiment, since the range in which the protective film 12 and the sealing resin 8 are in contact with each other is increased, the adhesion strength of the sealing resin 8 is further increased as compared with the first embodiment. .

次のような変形も本発明の範囲内であり、変形例の一つ、もしくは複数を上述の実施形態と組み合わせることも可能である。
（変形例１）
保護膜１２が被覆する範囲は、上述した各実施の形態と異なっていてもよい。
図５は、一の変形例に係るサーマルヘッド１００の構成を示す平面図である。図５に示すサーマルヘッド１００は、図１に示した領域Ｒ１〜Ｒ３を覆っていないが、絶縁基板４の回路基板９側の縁部４ｘ、すなわち図３に示す領域Ｒ４を覆っている。このように構成されたサーマルヘッド１００も、従来よりも高い封止樹脂８の密着強度を有する。 The following modifications are also within the scope of the present invention, and one or a plurality of modifications can be combined with the above-described embodiment.
(Modification 1)
The range covered by the protective film 12 may be different from the above-described embodiments.
FIG. 5 is a plan view showing a configuration of a thermal head 100 according to one modification. The thermal head 100 shown in FIG. 5 does not cover the regions R1 to R3 shown in FIG. 1, but covers the edge 4x of the insulating substrate 4 on the circuit board 9 side, that is, the region R4 shown in FIG. The thermal head 100 configured as described above also has a higher adhesion strength of the sealing resin 8 than the conventional one.

図６は、一の変形例に係るサーマルヘッド１００の構成を示す平面図である。図６に示すサーマルヘッド１００は、ＩＣ電極パッド６０の配列ピッチが上述した各実施の形態よりも広い。そのため、個別電極３の接続パッド３１の配列ピッチも、上述した各実施の形態よりも広くなっている。この場合、図１に領域Ｒ１〜Ｒ３と示した面積が狭いので保護膜１２を延伸するための十分なスペースが存在しない。
このような場合には、保護膜１２が領域Ｒ１〜Ｒ３を覆うことは難しいが、絶縁基板４の回路基板９側の縁部４ｘの領域Ｒ４を覆うことは可能である。このように構成されたサーマルヘッド１００も、従来よりも高い封止樹脂８の密着強度を有する。 FIG. 6 is a plan view showing a configuration of a thermal head 100 according to one modification. In the thermal head 100 shown in FIG. 6, the arrangement pitch of the IC electrode pads 60 is wider than that in each of the embodiments described above. For this reason, the arrangement pitch of the connection pads 31 of the individual electrodes 3 is also wider than in the above-described embodiments. In this case, since the areas indicated by the regions R1 to R3 in FIG. 1 are narrow, there is no sufficient space for extending the protective film 12.
In such a case, it is difficult for the protective film 12 to cover the regions R1 to R3, but it is possible to cover the region R4 of the edge 4x of the insulating substrate 4 on the circuit board 9 side. The thermal head 100 configured as described above also has a higher adhesion strength of the sealing resin 8 than the conventional one.

その他、図１において、保護膜１２が領域Ｒ１〜Ｒ３のいずれか１つだけを覆う構成や、領域Ｒ１〜Ｒ３のいずれか２つだけを覆う構成などについても、同様の効果を奏することができる。このように、従来よりも密着性が改善される種々の態様が本発明の範囲に含まれる。   In addition, in FIG. 1, the same effect can be achieved with a configuration in which the protective film 12 covers only one of the regions R1 to R3 or a configuration that covers only two of the regions R1 to R3. . As described above, various aspects in which the adhesion is improved as compared with the prior art are included in the scope of the present invention.

（変形例２）
ドライバＩＣ６の個数は２個でなくてもよい。例えば、ドライバＩＣ６を１個だけにしてもよいし、ドライバＩＣ６を３個以上用いてもよい。ドライバＩＣ６が３個以上存在する場合、各ドライバＩＣ６間の領域のうち、任意の領域を保護膜１２により覆ってよい。このようにした場合であっても、上述の実施の形態と同様の効果を得ることができる。 (Modification 2)
The number of driver ICs 6 need not be two. For example, only one driver IC 6 may be used, or three or more driver ICs 6 may be used. When there are three or more driver ICs 6, any region among the driver ICs 6 may be covered with the protective film 12. Even in this case, the same effects as those of the above-described embodiment can be obtained.

上記では、種々の実施の形態および変形例を説明したが、本発明はこれらの内容に限定されるものではない。本発明の技術的思想の範囲内で考えられるその他の態様も本発明の範囲内に含まれる。   Although various embodiments and modifications have been described above, the present invention is not limited to these contents. Other embodiments conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention.

１００…サーマルヘッド、１…発熱体、２…共通電極、３…個別電極、４…絶縁基板、６、６ａ、６ｂ…ドライバＩＣ、７ａ、７ｂ、７ｃ…ワイヤ、８…封止樹脂、９…回路基板、１２…保護膜 DESCRIPTION OF SYMBOLS 100 ... Thermal head, 1 ... Heat generating body, 2 ... Common electrode, 3 ... Individual electrode, 4 ... Insulating substrate, 6, 6a, 6b ... Driver IC, 7a, 7b, 7c ... Wire, 8 ... Sealing resin, 9 ... Circuit board, 12 ... Protective film

Claims (7)

絶縁基板上に形成され駆動電圧が印加される共通電極と、
前記絶縁基板上に発熱体の微小領域ごとに形成され、前記微小領域ごとに前記駆動電圧を印加する複数の個別電極と、
前記絶縁基板に接して回路基板上に設けられ、前記複数の個別電極の各々に流れる電流を制御する駆動ＩＣと、
前記共通電極と前記個別電極を含む保護領域を覆う保護膜と、
前記駆動ＩＣに結線されたワイヤおよび前記駆動ＩＣを、前記絶縁基板および前記回路基板を跨いで覆う封止樹脂とを備え、
前記複数の個別電極には、前記ワイヤにより前記駆動ＩＣと接続される接続パッドが前記絶縁基板の縁に沿って設けられ、
前記保護領域は、前記封止樹脂で覆われている領域のうち、前記共通電極の一端と前記共通電極の他端との間でかつ前記絶縁基板の前記縁の少なくとも一部に接する領域を含むサーマルヘッド。 A common electrode formed on an insulating substrate and applied with a driving voltage;
A plurality of individual electrodes formed on the insulating substrate for each minute region of the heating element and applying the driving voltage to each minute region;
A driving IC provided on the circuit board in contact with the insulating substrate and controlling a current flowing through each of the plurality of individual electrodes;
A protective film covering a protective region including the common electrode and the individual electrodes;
A wire connected to the driving IC and a sealing resin that covers the driving IC across the insulating substrate and the circuit board;
The plurality of individual electrodes are provided with connection pads connected to the driving IC by the wires along the edge of the insulating substrate,
The protective region includes a region that is between one end of the common electrode and the other end of the common electrode and is in contact with at least a part of the edge of the insulating substrate among the regions covered with the sealing resin. Thermal head. 請求項１に記載のサーマルヘッドにおいて、
前記保護領域は、前記共通電極の一端と複数の前記接続パッドとの間に拡がる前記絶縁基板の領域を含むサーマルヘッド。 The thermal head according to claim 1,
The protective area includes a region of the insulating substrate that extends between one end of the common electrode and the plurality of connection pads. 請求項１または請求項２に記載のサーマルヘッドにおいて、
前記保護領域は、複数の前記接続パッドの一部と複数の前記接続パッドの他の一部との間に拡がる前記絶縁基板の領域を含むサーマルヘッド。 The thermal head according to claim 1 or 2,
The protective region includes a region of the insulating substrate that extends between a part of the plurality of connection pads and another part of the plurality of connection pads. 請求項１から請求項３までのいずれか一項に記載のサーマルヘッドにおいて、
前記保護領域は、前記共通電極の一端と前記縁との間に拡がる前記絶縁基板の領域を含むサーマルヘッド。 In the thermal head according to any one of claims 1 to 3,
The protective region includes a region of the insulating substrate that extends between one end of the common electrode and the edge. 請求項１から請求項４までのいずれか一項に記載のサーマルヘッドにおいて、
前記保護領域は、複数の前記接続パッドと前記縁との間に拡がる前記絶縁基板の領域を含むサーマルヘッド。 In the thermal head according to any one of claims 1 to 4,
The protection area includes a region of the insulating substrate that extends between a plurality of the connection pads and the edge. 請求項１から請求項５までのいずれか一項に記載のサーマルヘッドにおいて、
前記封止樹脂は、前記共通電極の両端と前記回路基板上に設けられた配線パターンとを電気的に接続するワイヤを更に封止するサーマルヘッド。 In the thermal head according to any one of claims 1 to 5,
The sealing resin is a thermal head for further sealing a wire for electrically connecting both ends of the common electrode and a wiring pattern provided on the circuit board. 請求項１から請求項６までのいずれか一項に記載のサーマルヘッドにおいて、
前記封止樹脂は、前記保護膜の表面に対しては、前記絶縁基板の表面、前記共通電極の表面、および前記個別電極の表面に対してよりも固着しやすいサーマルヘッド。
In the thermal head according to any one of claims 1 to 6,
The sealing resin is a thermal head that is more easily fixed to the surface of the protective film than the surface of the insulating substrate, the surface of the common electrode, and the surface of the individual electrode.
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