JP2018507537A - 電子物品および電子物品の製造方法 - Google Patents
電子物品および電子物品の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000002834 transmittance Methods 0.000 claims abstract description 10
- 238000005245 sintering Methods 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000002086 nanomaterial Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 230000003746 surface roughness Effects 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 10
- 239000000976 ink Substances 0.000 description 68
- 239000000463 material Substances 0.000 description 18
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 239000004332 silver Substances 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 11
- 238000009713 electroplating Methods 0.000 description 6
- 238000007641 inkjet printing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- XUJNEKJLAYXESH-REOHCLBHSA-N L-Cysteine Chemical compound SC[C@H](N)C(O)=O XUJNEKJLAYXESH-REOHCLBHSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 2
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 2
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- 239000005642 Oleic acid Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 210000001787 dendrite Anatomy 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 2
- 229920000767 polyaniline Polymers 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 235000013878 L-cysteine Nutrition 0.000 description 1
- 239000004201 L-cysteine Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000000935 solvent evaporation Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/364—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith using a particular conducting material, e.g. superconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/08—Means for collapsing antennas or parts thereof
- H01Q1/085—Flexible aerials; Whip aerials with a resilient base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/40—Radiating elements coated with or embedded in protective material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Structure Of Printed Boards (AREA)
- Details Of Aerials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
を含む。
(式1)
δは表皮深さであり、fは周波数であり、μは透過率であり、およびσは伝導率である。これに基づき、銀含有インクを含む焼結伝導性インク105を用いる一態様では、焼結伝導性インク105は0.0001オーム・cm、0.00001オーム・cm又は0.0000017オーム・cmの抵抗率を有する。0.0001オーム・cmの抵抗率を有する焼結伝導性インク105の表皮深さは、1000MHzで23マイクロメートルから3000MHzで10マイクロメートル未満まで、6000MHzで7マイクロメートルまで延在する。0.00001オーム・cmの抵抗率を有する焼結伝導性インク105の表皮深さは、1000MHzで7マイクロメートルから3000MHzで4マイクロメートル未満まで、6000MHzで3マイクロメートルまで延在する。0.0000017オーム・cmの抵抗率を有する焼結伝導性インク105の表皮深さは、1000MHzで3マイクロメートルから3000MHzで2マイクロメートル未満まで、6000MHzで2マイクロメートルまで延在する。
(式2)
R’は単位長さ当たりの抵抗であり、wはトレース幅であり、μは透過率であり、fは周波数であり、σは導体の伝導率であり、Rsは単位長さ当たりの表面粗さ抵抗であり、cは補正係数であり、Δは平均表面粗さであり、δは表皮深さである。更なる態様では、補正係数cは、0.9〜1.1、0.8〜1.2、又はこれらの任意の適当な組み合わせ、これらのサブコンビネーション、これらに含まれる範囲又はサブ範囲である。
84%〜86%、又はこれらの任意の適当な組み合わせ、これらのサブコンビネーション、これらに含まれる範囲又はサブ範囲を含む。
Claims (13)
- 電子物品であって、
非平面領域を有するリジッド基板;および
非平面領域に位置付けられた焼結伝導性インク
を有して成る、電子物品。 - 焼結伝導性インクは6〜20マイクロメートルのトレース深さを有し、好ましくは、焼結伝導性インクは8〜10マイクロメートルのトレース深さを有する、請求項1に記載の電子物品。
- 焼結伝導性インクは、30〜40マイクロメートルのトレース幅を有する、請求項1に記載の電子物品。
- 焼結伝導性インクは、20〜30マイクロメートルのトレース幅を有する、請求項1に記載の電子物品。
- 焼結伝導性インクは10マイクロメートル未満の平均表面粗さを有し、好ましくは、焼結伝導性インクは0.6マイクロメートル未満の平均表面粗さを有する、請求項1に記載の電子物品。
- 焼結伝導性インクは、金属ナノ構造体、有機溶媒およびキャッピング剤を含んで成る、請求項1に記載の電子物品。
- 焼結伝導性インクは3オーム/スクエア未満のシート抵抗を有し、好ましくは、焼結伝導性インクは1オーム/スクエア未満のシート抵抗を有する、請求項1に記載の電子物品。
- 焼結伝導性インクは0.5オーム/スクエア未満のシート抵抗を有し、好ましくは、焼結伝導性インクは0.02オーム/スクエア未満のシート抵抗を有する、請求項1に記載の電子物品。
- リジッド基板に位置付けられる後めっき層、および後めっき層とリジッド基板との間に少なくとも部分的に位置付けられる焼結伝導性インクを更に有して成る、請求項1に記載の電子物品。
- 焼結伝導性インクが66%〜70%の光透過率を有し、焼結伝導性インクが少なくとも80%の光透過率を有する、請求項1に記載の電子物品。
- 電子物品がアンテナである、請求項1に記載の電子物品。
- アンテナであって、
基板;および
基板に位置付けられた伝導性インク
を有して成り、
伝導性インクは、金属ナノ構造体、有機溶媒およびキャッピング剤を有する伝導性インクから形成されており、
伝導性インクは、少なくとも80%の光透過率を有する、アンテナ。 - 焼結伝導性インクを有する電子物品の製造方法であって、
非平面領域を有する基板を位置付けること;
非平面領域に伝導性インクを適用すること;および
非平面領域にて伝導性インクを焼結させ、それによって電子物品に焼結伝導性インクを生じさせること
を含む、製造方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/581,707 US9985344B2 (en) | 2014-12-23 | 2014-12-23 | Electronic article and process of producing an electronic article |
US14/581,707 | 2014-12-23 | ||
PCT/US2015/067179 WO2016106245A1 (en) | 2014-12-23 | 2015-12-21 | Electronic article and process of producing an electronic article |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018507537A true JP2018507537A (ja) | 2018-03-15 |
JP6667531B2 JP6667531B2 (ja) | 2020-03-18 |
Family
ID=55168427
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017533875A Active JP6667531B2 (ja) | 2014-12-23 | 2015-12-21 | 電子物品および電子物品の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9985344B2 (ja) |
EP (1) | EP3238510B1 (ja) |
JP (1) | JP6667531B2 (ja) |
CN (1) | CN107148701B (ja) |
WO (1) | WO2016106245A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6834469B2 (ja) * | 2016-12-27 | 2021-02-24 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
CN111164829A (zh) * | 2017-09-25 | 2020-05-15 | 天传知识产权有限公司 | 用于改善电子装置中的天线性能的***、设备和方法 |
JP2022522599A (ja) * | 2018-11-13 | 2022-04-20 | キャズム アドバンスト マテリアルズ,インク. | 透明導電回路 |
DE102020104038A1 (de) * | 2020-02-17 | 2021-08-19 | Friedrich-Alexander Universität Erlangen-Nürnberg | Verfahren zur Herstellung von hochfrequenztechnischen Funktionsstrukturen |
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- 2015-12-21 EP EP15825730.3A patent/EP3238510B1/en active Active
- 2015-12-21 JP JP2017533875A patent/JP6667531B2/ja active Active
- 2015-12-21 WO PCT/US2015/067179 patent/WO2016106245A1/en active Application Filing
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JP2010165638A (ja) * | 2009-01-19 | 2010-07-29 | Toda Kogyo Corp | 金属微粒子で構成される網目状構造物を内包した透明導電性膜及び透明導電性膜積層基板とその製造方法 |
US20110042125A1 (en) * | 2009-08-19 | 2011-02-24 | Samsung Sdi Co., Ltd. | Conductive ink, method of preparing metal wiring using conductive ink, and printed circuit board prepared using method |
US20120249660A1 (en) * | 2011-04-04 | 2012-10-04 | Israel Schuster | Printing conductive lines |
JP2013207624A (ja) * | 2012-03-29 | 2013-10-07 | Dowa Electronics Materials Co Ltd | ブースターアンテナおよびその製造方法 |
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EP3238510A1 (en) | 2017-11-01 |
US9985344B2 (en) | 2018-05-29 |
CN107148701A (zh) | 2017-09-08 |
JP6667531B2 (ja) | 2020-03-18 |
US20160181689A1 (en) | 2016-06-23 |
CN107148701B (zh) | 2021-05-11 |
EP3238510B1 (en) | 2023-07-26 |
WO2016106245A1 (en) | 2016-06-30 |
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