JP2018504779A - 電子装置の液浸転写 - Google Patents
電子装置の液浸転写 Download PDFInfo
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- H—ELECTRICITY
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
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- B44C1/1758—Decalcomanias applied under pressure only, e.g. provided with a pressure sensitive layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
- B44C1/175—Transfer using solvent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21Y2115/10—Light-emitting diodes [LED]
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
箔提供段階で、箔(本明細書では「転写フィルム」とも呼ぶ)、特に固体担体に箔を提供するステップと、
電子装置提供段階で、箔に電子配線(「導体トラック」)及び電子構成要素のうちの1つ以上、特に電子配線及び電子構成要素の両方を提供して、前記電子装置を提供するステップと、
液体付与段階で、(任意選択の)固体担体を除去し、箔を液体上又は液体中に配するステップと、
転写段階で、特に3Dオブジェクトを液体に少なくとも部分的に浸漬することによって、電子配線及び電子構成要素のうちの1つ以上を3Dオブジェクトに転写するステップとを含む、液浸転写プロセスを提供する。
1.例えばポリビニルアルコールなど、液体溶解性のプリント箔から開始する。
2.この箔を剛性担体にテープ留めする。
3.例えば導電性インクのインクジェット又はグラビアコーティングによって箔に回路を印刷する。
4.インクを例えば120℃で焼結して、導電性を保証する。
5.例えば分注又はスクリーン印刷によって、導電性接着剤を塗布する。
6.導電性接着剤内に電気構成要素を配置する。
7.導電性接着剤を例えば120℃で硬化させて、電気的接触を保証する。
8.担体を取り除く。
9.箔を例えば水などの液体表面に浮遊させる。特に、回路及び構成要素は上向きにし、水溶性層は水側に向ける。
10.活性剤(溶媒に溶かした柔軟剤)を箔の印刷側に噴霧して、インクを軟化させる。
11.例えば下塗り(例えばオブジェクトがプラスチックオブジェクト部分を含む場合には市販のKunstoffプライマを用いる)によって3Dオブジェクトを事前処理して接着性を向上させる。
12.3Dオブジェクトをフィルムを介して水中に浸漬する。回路及び構成要素を備えた印刷層が、3Dオブジェクトに巻き付き、これに付着する。
13.3Dオブジェクトの外側に残っている溶解性高分子を濯ぎ落とす。
14.生成物を乾燥させる。
15.外部の線を微小配線に接続することによって電気的接続を仕上げる。
16.任意選択で、例えば溶射被覆によって、透明な(光透過性の)トップコートを塗布する(例えばアクリル、ウレタン、エポキシ、ポリエステル、及びシリコーンのコーティングのうちの1つ又は複数を溶射被覆又は浸漬被覆する。このようなコーティングは、透明であっても着色されていてもよい)。
Claims (15)
- 3Dオブジェクト上に電子装置を付与する液浸転写プロセスであって、前記液浸転写プロセスは、
箔提供段階で、固体担体に箔を提供するステップと、
電子装置提供段階で、前記箔に電子配線及び電子構成要素を提供して、前記電子装置を提供するステップと、
液体付与段階で、前記固体担体を除去し、前記箔を液体上又は液体中に配するステップと、
転写段階で、前記電子装置を前記3Dオブジェクトに転写するステップとを含む、液浸転写プロセス。 - 前記液体が、水性液体を含み、前記箔が、液溶性材料を含む、請求項1に記載の液浸転写プロセス。
- 前記箔提供段階及び電子装置提供段階のうちの1つ以上が、前記箔にプリントデザインを提供することも含む、請求項1又は2に記載の液浸転写プロセス。
- 前記プリントデザインが、アクリルインクを含み、液溶性材料が、ポリビニルアルコール(PVA)を含む、請求項3に記載の液浸転写プロセス。
- 前記電子装置提供段階が、前記箔上に前記電子配線を印刷又はコーティングするステップを含む、請求項1乃至4のいずれか一項に記載の液浸転写プロセス。
- ペースト、インク、及び箔ストリップのうちの1つ又は複数を付与するステップを含み、前記ペースト、前記インク、及び前記箔ストリップのうちの前記1つ又は複数が、銀を含む硬化性材料、及び銅を含む硬化性材料のうちの1つ以上を含む、請求項5に記載の液浸転写プロセス。
- 前記電子装置提供段階が、導電性コネクタ材料を局所的に前記箔に分注又は印刷するステップと、前記電子構成要素を前記箔に配するステップとを含み、前記導電性コネクタ材料が、前記電気構成要素と前記電子配線とを機能的に接続し、前記導電性材料が、導電性接着剤を含む、請求項1乃至6のいずれか一項に記載の液浸転写プロセス。
- 前記液体付与段階及び前記転写段階のうちの1つ以上が、(i)インクを含むプリントデザインを軟化させるステップ、及び(ii)前記3Dオブジェクトの少なくとも一部を事前処置するステップのうちの1つ以上をさらに含む、請求項1乃至7のいずれか一項に記載の液浸転写プロセス。
- 前記転写段階で、前記3Dオブジェクトが、転写の前に少なくとも部分的に前記液体中に沈み、前記転写が、前記3Dオブジェクトを前記電子装置の下から前記液体の上の位置まで移動させることによって行われる、請求項1乃至8のいずれか一項に記載の液浸転写プロセス。
- 前記転写段階の後に、前記液浸転写プロセスが、(i)前記電子配線を硬化させるステップを含む硬化段階、及び(ii)前記電子装置を含む前記3Dオブジェクトの少なくとも一部にトップコーティングを塗布するステップを含むコーティング段階のうちの1つ以上をさらに含む、請求項1乃至9のいずれか一項に記載の液浸転写プロセス。
- 前記電子構成要素が、固体光源、センサ、電子太陽電池、及び電子タッチボタンのうちの1つ又は複数を含む、請求項1乃至10のいずれか一項に記載の液浸転写プロセス。
- 前記液浸転写プロセスが、最終3Dオブジェクトの仮想3Dモデルから前記箔上の前記電子装置の2Dデザインを導出するステップと、前記2Dデザインに一致した前記液浸転写プロセスを実行するステップとをさらに含む、請求項1乃至11のいずれか一項に記載の液浸転写プロセス。
- 非平坦な3Dオブジェクト部分と、前記非平坦な3Dオブジェクト部分に取り付けられる層構造とを含む3Dオブジェクトであって、前記層構造が、(i)トップコーティング、(ii)電子装置、及び(iii)プリントデザインを含み、前記電子装置及び前記プリントデザインが、前記非平坦な3Dオブジェクト部分と前記トップコーティングとの間に構成され、前記電子装置が、電子配線及び電子構成要素を含む、3Dオブジェクト。
- 前記非平坦な3Dオブジェクト部分が、1つ又は複数の湾曲部を含み、前記電子構成要素が、固体光源、センサ、及び電子太陽電池のうちの1つ又は複数を含み、前記非平坦な3Dオブジェクト部分及び前記トップコーティングのうちの1つ以上が、光に対して透過性であり、前記3Dオブジェクトが、前記電子装置を電源に電子的に接続するための2つ以上のコネクタをさらに含む、請求項13に記載の3Dオブジェクト。
- 電子装置提供段階で電子配線及び電子構成要素を含む電子装置を箔に付与する電子装置アプリケータと、
転写段階で前記電子装置を液体中の3Dオブジェクトに転写する液浸転写装置と、
前記3Dオブジェクトの少なくとも一部にトップコーティングを付与する浸漬後処置装置とを含む、システム。
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PCT/EP2015/077790 WO2016110362A1 (en) | 2015-01-06 | 2015-11-26 | Liquid immersion transfer of electronics |
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EP (1) | EP3042784B1 (ja) |
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KR101975459B1 (ko) * | 2016-10-25 | 2019-05-08 | 에스엘 주식회사 | 차량용 램프 |
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US20210153345A1 (en) | 2017-03-09 | 2021-05-20 | Yissum Research Development Company Of The Hebrew University Of Jerusalem Ltd. | Process for fabricating conductive patterns on 3-dimensional surfaces by hydro-printing |
WO2019107558A1 (ja) * | 2017-11-30 | 2019-06-06 | 住友理工株式会社 | トランスデューサ及びその製造方法 |
DE102018205265B3 (de) | 2018-04-09 | 2019-06-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum herstellen einer elektrischen leiteranordnung |
DE102020206769B3 (de) | 2020-05-29 | 2021-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mikroelektronische anordnung und verfahren zur herstellung derselben |
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WO2016110362A1 (en) | 2016-07-14 |
CN107107656A (zh) | 2017-08-29 |
US9961778B2 (en) | 2018-05-01 |
EP3042784B1 (en) | 2018-01-10 |
EP3042784A1 (en) | 2016-07-13 |
RU2017127923A (ru) | 2019-02-07 |
RU2694923C2 (ru) | 2019-07-18 |
US20160198577A1 (en) | 2016-07-07 |
RU2017127923A3 (ja) | 2019-05-20 |
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