JP2018139282A - Positioning device and positioning method - Google Patents

Positioning device and positioning method Download PDF

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JP2018139282A
JP2018139282A JP2017034083A JP2017034083A JP2018139282A JP 2018139282 A JP2018139282 A JP 2018139282A JP 2017034083 A JP2017034083 A JP 2017034083A JP 2017034083 A JP2017034083 A JP 2017034083A JP 2018139282 A JP2018139282 A JP 2018139282A
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positioning
holding
wafer
posture
target object
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祐太 黒澤
Yuta Kurosawa
祐太 黒澤
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Lintec Corp
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Lintec Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a positioning device and a positioning method capable of preventing a positioning target object from returning to its original position when releasing a positioning state by a positioning member.SOLUTION: A positioning device 10 includes: holding means 20 for holding a positioning target object WF by an elastically deforming holding member 25; and positioning means 30 for bringing a positioning member 32 into contact with the positioning target object WF held by the holding member 25 and positioning the positioning target object WF at a predetermined position by the positioning member 32. The holding means 20 includes an attitude restoration means 24 for restoring the attitude of the holding member 25 elastically deformed in a moving direction of the positioning target object WF by the positioning member 32 to the attitude before the elastic deformation in a state where the positioning target object WF is positioned.SELECTED DRAWING: Figure 1

Description

本発明は、位置決め装置および位置決め方法に関する。   The present invention relates to a positioning device and a positioning method.

従来、弾性変形する保持部材で保持された位置決め対象物を位置決め部材で所定の位置に位置決めする板状部品保持装置（位置決め装置）が知られている（例えば、特許文献１参照）。   2. Description of the Related Art Conventionally, a plate-like component holding device (positioning device) that positions a positioning object held by an elastically deforming holding member at a predetermined position by a positioning member is known (for example, see Patent Document 1).

特開２００３−７７９９１号公報JP 2003-77991 A

特許文献１に記載されたような従来の位置決め装置では、ＰＤＰパネル（位置決め対象物）を吸着した状態で、当該位置決め対象物にガイドプレートを介して位置決めピン（位置決め部材）を当接させて位置決めすると、位置決め対象物の移動に伴って吸着パッド（保持部材）が弾性変形するため、位置決め部材による位置決め状態を解除すると、保持部材の復元力（元の位置に戻ろうとする力）により位置決め対象物が元の位置に戻ってしまうという不都合がある。   In the conventional positioning device as described in Patent Document 1, positioning is performed by bringing a positioning pin (positioning member) into contact with the positioning target object via a guide plate in a state where the PDP panel (positioning target object) is adsorbed. Then, since the suction pad (holding member) is elastically deformed with the movement of the positioning object, when the positioning state by the positioning member is released, the positioning object is recovered by the restoring force of the holding member (force to return to the original position). Has the disadvantage of returning to its original position.

本発明の目的は、位置決め部材による位置決め状態を解除した際に、位置決め対象物が元の位置に戻ってしまうことを防止できる位置決め装置および位置決め方法を提供することにある。   An object of the present invention is to provide a positioning device and a positioning method that can prevent a positioning object from returning to its original position when a positioning state by a positioning member is released.

本発明は、各請求項に記載した構成を採用した。   The present invention employs a configuration described in each claim.

本発明によれば、保持部材の姿勢を位置決め対象物が位置決めされた状態のまま弾性変形前の姿勢に復帰させるので、位置決め部材による位置決め状態を解除した際に、位置決め対象物が元の位置に戻ってしまうことを防止することができる。   According to the present invention, since the posture of the holding member is returned to the posture before the elastic deformation while the positioning object is positioned, the positioning target is returned to the original position when the positioning state by the positioning member is released. It can be prevented from returning.

本発明の一実施形態に係る位置決め装置を示す側面図。The side view which shows the positioning device which concerns on one Embodiment of this invention. 位置決め装置の動作説明図。Operation | movement explanatory drawing of a positioning device.

以下、本発明の一実施形態を図面に基づいて説明する。
なお、本実施形態におけるＸ軸、Ｙ軸、Ｚ軸は、それぞれが直交する関係にあり、Ｘ軸およびＹ軸は、所定平面内の軸とし、Ｚ軸は、前記所定平面に直交する軸とする。さらに、本実施形態では、Ｙ軸と平行な図１中手前方向から観た場合を基準とし、方向を示した場合、「上」がＺ軸の矢印方向で「下」がその逆方向、「左」がＸ軸の矢印方向で「右」がその逆方向、「前」がＹ軸と平行な図１中手前方向で「後」がその逆方向とする。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the front side in FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis and “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction.

図１において、位置決め装置１０は、弾性変形する保持部材としての吸着パッド２５で位置決め対象物としての半導体ウエハ（以下、単に「ウエハ」ともいう）ＷＦを保持する保持手段２０と、吸着パッド２５で保持されたウエハＷＦに位置決め部材としての位置決めピン３２を当接させ、位置決めピン３２でウエハＷＦを所定の位置に位置決めする位置決め手段３０と、ウエハＷＦに設けられたノッチやオリエンテーションフラット等の図示しない方位印を検出するカメラや投影機等の撮像手段や、光学センサや超音波センサ等の各種センサ等の検出手段４０とを備えている。   In FIG. 1, a positioning device 10 includes a holding unit 20 that holds a semiconductor wafer (hereinafter, also simply referred to as “wafer”) WF as a positioning object with a suction pad 25 as a holding member that is elastically deformed, and a suction pad 25. Positioning means 30 for abutting positioning pins 32 as positioning members to the held wafer WF and positioning the wafer WF at a predetermined position with the positioning pins 32, and notches and orientation flats, etc. provided on the wafer WF are not shown. An image pickup means such as a camera or a projector for detecting the azimuth mark, and a detection means 40 such as various sensors such as an optical sensor or an ultrasonic sensor are provided.

保持手段２０は、駆動機器としての回動モータ２１の出力軸２１Ａに支持された基台２２と、基台２２にブラケット２２Ａを介して支持されたテーブル２３と、基台２２に支持され、位置決めピン３２によるウエハＷＦの移動方向に弾性変形した吸着パッド２５の姿勢を、ウエハＷＦが位置決めされた状態のまま弾性変形前の姿勢に復帰させる姿勢復帰手段２４と、姿勢復帰手段２４に支持された吸着パッド２５とを備えている。
テーブル２３は、ウエハＷＦを支持可能な支持面２３Ａと、吸着パッド２５が挿入される複数の貫通孔２３Ｂとを備えている。
姿勢復帰手段２４は、基台２２に支持された駆動機器としての直動モータ２４Ａと、その出力軸２４Ｂに支持され、貫通孔２３Ｂの内径よりも大きい外形形状とされ、吸着パッド２５を支持するブラケット２４Ｃとを備えている。直動モータ２４Ａおよびブラケット２４Ｃは、吸着パッド２５毎に設けられている。
吸着パッド２５は、ゴムや樹脂等の弾性部材で形成されるとともに、減圧ポンプや真空エジェクタ等の図示しない減圧手段および当該減圧手段に接続された複数の図示しない開閉弁によってウエハＷＦを吸着保持可能に構成されている。本実施形態の場合、吸着パッド２５は、第１および第２の２つのグループに分けられ、グループ毎にウエハＷＦの吸着および解除ができるようになっている。 The holding means 20 is supported by the base 22 supported by the output shaft 21A of the rotation motor 21 as a drive device, the table 23 supported by the base 22 via the bracket 22A, and the base 22 for positioning. The posture return means 24 for returning the posture of the suction pad 25 elastically deformed in the moving direction of the wafer WF by the pins 32 to the posture before elastic deformation while the wafer WF is positioned, and the posture return means 24 are supported. And a suction pad 25.
The table 23 includes a support surface 23A capable of supporting the wafer WF and a plurality of through holes 23B into which the suction pads 25 are inserted.
The posture returning means 24 is supported by a linear motion motor 24A as a driving device supported by the base 22 and its output shaft 24B, has an outer shape larger than the inner diameter of the through hole 23B, and supports the suction pad 25. Bracket 24C. The direct acting motor 24 </ b> A and the bracket 24 </ b> C are provided for each suction pad 25.
The suction pad 25 is formed of an elastic member such as rubber or resin, and can hold the wafer WF by suction using a decompression unit (not shown) such as a decompression pump or a vacuum ejector and a plurality of opening / closing valves (not shown) connected to the decompression unit It is configured. In the present embodiment, the suction pads 25 are divided into two groups, a first group and a second group, and the wafer WF can be sucked and released for each group.

位置決め手段３０は、駆動機器としての直動モータ３１の出力軸３１Ａに支持された位置決めピン３２を備えている。直動モータ３１および位置決めピン３２は、これらを１組としてテーブル２３の外周に複数並設されている。   The positioning means 30 includes a positioning pin 32 supported by an output shaft 31A of a direct acting motor 31 as a drive device. A plurality of linear motion motors 31 and positioning pins 32 are arranged in parallel on the outer periphery of the table 23 as a set.

以上の位置決め装置１０において、ウエハＷＦを位置決めする手順について説明する。
先ず、各部材が初期位置に配置された図１で示す状態の位置決め装置１０に対し、当該位置決め装置１０の使用者（以下、単に「使用者」という）または、多関節ロボットやベルトコンベア等の図示しない搬送手段により、吸着パッド２５上にウエハＷＦを載置すると、保持手段２０が図示しない減圧手段および図示しない開閉弁を駆動し、吸着パッド２５でウエハＷＦを吸着保持する。この際、吸着パッド２５内の圧力が下ることで、図２（Ａ）に示すように、吸着パッド２５が収縮してテーブル２３にウエハＷＦを引き付ける。 A procedure for positioning the wafer WF in the positioning apparatus 10 will be described.
First, with respect to the positioning device 10 in the state shown in FIG. 1 in which each member is arranged at the initial position, a user of the positioning device 10 (hereinafter simply referred to as “user”), an articulated robot, a belt conveyor, or the like. When the wafer WF is placed on the suction pad 25 by a transfer means (not shown), the holding means 20 drives a decompression means (not shown) and an opening / closing valve (not shown) to hold the wafer WF by the suction pad 25. At this time, as the pressure in the suction pad 25 decreases, the suction pad 25 contracts and attracts the wafer WF to the table 23 as shown in FIG.

次に、位置決め手段３０が直動モータ３１を駆動し、ウエハＷＦの外縁に位置決めピン３２を当接させ、図２（Ａ）中二点鎖線で示すように、当該位置決めピン３２でウエハＷＦを支持面２３Ａに沿って移動させる。これにより、ウエハＷＦの中心ＷＣと回動モータ２１の回転中心軸ＭＣとが合致する。この際、図２（Ｂ）に示すように、吸着パッド２５がウエハＷＦの移動に伴って当該ウエハＷＦの移動方向に弾性変形する。   Next, the positioning means 30 drives the linear motion motor 31 to bring the positioning pins 32 into contact with the outer edge of the wafer WF, and as shown by the two-dot chain line in FIG. It moves along the support surface 23A. As a result, the center WC of the wafer WF matches the rotation center axis MC of the rotation motor 21. At this time, as shown in FIG. 2B, the suction pad 25 is elastically deformed in the moving direction of the wafer WF as the wafer WF moves.

次に、保持手段２０が図示しない開閉弁を駆動し、図２（Ｂ）中右側に示す第１グループの吸着パッド２５によるウエハＷＦの吸着を解除する。そして、保持手段２０が直動モータ２４Ａを駆動し、図２（Ｃ）に示すように、当該吸着パッド２５を下降させた後、図２（Ｄ）に示すように、当該吸着パッド２５を上昇させる。その後、保持手段２０が図示しない開閉弁を駆動し、当該吸着パッド２５でウエハＷＦを再吸着する。これにより、図２（Ｄ）に示すように、第１グループの吸着パッド２５がウエハＷＦの移動方向に弾性変形する前の姿勢に復帰する。その後、保持手段２０が図示しない開閉弁および直動モータ２４Ａを駆動し、上記と同様に、図２（Ｄ）中左側の二点鎖線で示す第２グループの吸着パッド２５を昇降させる。これにより、図２（Ｄ）中実線で示すように、ウエハＷＦが位置決めされた状態のまま、全ての吸着パッド２５が弾性変形前の姿勢に復帰し、ウエハＷＦを吸着保持する。   Next, the holding means 20 drives an on-off valve (not shown) to release the adsorption of the wafer WF by the first group of suction pads 25 shown on the right side in FIG. Then, the holding means 20 drives the linear motor 24A to lower the suction pad 25 as shown in FIG. 2 (C), and then lifts the suction pad 25 as shown in FIG. 2 (D). Let Thereafter, the holding means 20 drives an on-off valve (not shown), and the wafer WF is re-sucked by the suction pad 25. Thereby, as shown in FIG. 2D, the first group of suction pads 25 returns to the posture before elastically deforming in the moving direction of the wafer WF. Thereafter, the holding means 20 drives the on-off valve and the direct acting motor 24A (not shown), and as described above, raises and lowers the second group of suction pads 25 indicated by the two-dot chain line on the left side in FIG. As a result, as shown by the solid line in FIG. 2D, all the suction pads 25 return to the posture before elastic deformation while the wafer WF is positioned, and hold the wafer WF by suction.

次いで、位置決め手段３０が直動モータ３１を駆動し、位置決めピン３２を初期位置に復帰させる。その後、保持手段２０が回動モータ２１を駆動し、テーブル２３を回転させた後、検出手段４０が撮像手段等を駆動し、ウエハＷＦに設けられた図示しない方位印を検出し、当該方位印を所定の方角に向けてテーブル２３を停止させ、ウエハＷＦを所定の姿勢とさせる。次いで、保持手段２０が図示しない減圧手段および図示しない開閉弁の駆動を停止し、吸着パッド２５を初期位置に復帰させる。その後、図示しない搬送手段がウエハＷＦを次工程に搬送し、以降上記同様の動作が繰り返される。   Next, the positioning means 30 drives the linear motor 31 to return the positioning pin 32 to the initial position. Thereafter, after the holding unit 20 drives the rotation motor 21 and rotates the table 23, the detection unit 40 drives the imaging unit and the like, detects an orientation mark (not shown) provided on the wafer WF, and the orientation mark The table 23 is stopped in a predetermined direction to bring the wafer WF into a predetermined posture. Next, the holding means 20 stops driving the decompression means (not shown) and the opening / closing valve (not shown), and the suction pad 25 is returned to the initial position. Thereafter, a transfer means (not shown) transfers the wafer WF to the next process, and thereafter the same operation is repeated.

以上のような実施形態によれば、吸着パッド２５の姿勢をウエハＷＦが位置決めされた状態のまま弾性変形前の姿勢に復帰させるので、位置決めピン３２による位置決め状態を解除した際に、ウエハＷＦが元の位置に戻ってしまうことを防止することができる。   According to the above embodiment, the posture of the suction pad 25 is returned to the posture before elastic deformation while the wafer WF is positioned. Therefore, when the positioning state by the positioning pins 32 is released, the wafer WF It can prevent returning to the original position.

以上のように、本発明を実施するための最良の構成、方法等は、前記記載で開示されているが、本発明は、これに限定されるものではない。すなわち、本発明は、主に特定の実施形態に関して特に図示され、かつ説明されているが、本発明の技術的思想および目的の範囲から逸脱することなく、以上述べた実施形態に対し、形状、材質、数量、その他の詳細な構成において、当業者が様々な変形を加えることができるものである。また、上記に開示した形状、材質などを限定した記載は、本発明の理解を容易にするために例示的に記載したものであり、本発明を限定するものではないから、それらの形状、材質などの限定の一部もしくは全部の限定を外した部材の名称での記載は、本発明に含まれる。   As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

例えば、保持手段２０は、回動モータ２１がなくてもよいし、テーブル２３が減圧ポンプや真空エジェクタ等の減圧手段、メカチャックやチャックシリンダ等の把持手段、クーロン力、接着剤、粘着剤、磁力、ベルヌーイ吸着、駆動機器等で位置決め対象物を支持（保持）する構成を採用してもよいし、テーブル２３がなくてもよい。
姿勢復帰手段２４は、支持面２３Ａが減圧ポンプや真空エジェクタ等の図示しない減圧手段によってウエハＷＦを吸着保持可能な場合、全ての吸着パッド２５を同時に昇降させてもよいし、吸着パッド２５を昇降させることに代えてまたは併用して、テーブル２３を昇降させたり、位置決めピン３２でウエハＷＦを挟持したまま直動モータ３１を昇降させたりして、ウエハＷＦを昇降させてもよい。
吸着パッド２５は、３つ以上のグループに分けてウエハＷＦの吸着および解除ができるように構成されてもよい。
保持部材は、弾性部材内に電極を設け、当該電極に電圧を印加することで位置決め対象物を静電的に保持する構成でもよいし、弾性部材内に磁石を設け、位置決め対象物を磁力によって保持する構成でもよいし、ゴム、樹脂、スポンジ等の弾性部材に接着処理または粘着処理を施し、位置決め対象物を接着保持または粘着保持する構成でもよい。 For example, the holding unit 20 may not have the rotation motor 21, the table 23 may be a decompression unit such as a decompression pump or a vacuum ejector, a gripping unit such as a mechanical chuck or a chuck cylinder, a coulomb force, an adhesive, an adhesive, A configuration that supports (holds) the positioning object with magnetic force, Bernoulli suction, driving equipment, or the like may be employed, or the table 23 may not be provided.
When the support surface 23A can suck and hold the wafer WF by a decompression means (not shown) such as a decompression pump or a vacuum ejector, the posture return means 24 may raise or lower all the suction pads 25 simultaneously. Instead of or in combination, the wafer WF may be raised or lowered by raising or lowering the table 23 or raising or lowering the linear motion motor 31 while holding the wafer WF with the positioning pins 32.
The suction pads 25 may be configured so that the wafer WF can be sucked and released in three or more groups.
The holding member may have a configuration in which an electrode is provided in the elastic member, and the positioning target is electrostatically held by applying a voltage to the electrode, or a magnet is provided in the elastic member so that the positioning target is magnetically applied. The structure which hold | maintains may be sufficient, and the structure which performs an adhesion process or an adhesion process to elastic members, such as rubber | gum, resin, and sponge, and adhere | attaches or hold | maintains the positioning target object may be sufficient.

位置決め手段３０は、直動モータ３１の出力軸３１Ａを位置決め部材とし、当該出力軸３１ＡでウエハＷＦを位置決めしてもよい。   The positioning means 30 may use the output shaft 31A of the linear motion motor 31 as a positioning member and position the wafer WF with the output shaft 31A.

検出手段４０は、方位印の代わりに、ウエハＷＦに刻印された製造番号、回路パターン、カーフ、またはストリート等を検出するものでもよいし、ウエハＷＦ以外の場合でも、所定の法則性をもって位置決め対象物の位置を特定できる目印となるもの検出するものであれば何ら限定されるものではない。   The detection means 40 may detect a manufacturing number, a circuit pattern, a kerf, a street, or the like imprinted on the wafer WF instead of the bearing mark, or may be positioned with a predetermined law even in cases other than the wafer WF. There is no limitation as long as it can detect a mark that can identify the position of an object.

また、本発明における位置決め対象物の材質、種別、形状等は、特に限定されることはない。位置決め対象物としては、例えば、食品、樹脂容器、シリコン半導体ウエハや化合物半導体ウエハ等の半導体ウエハ、回路基板、光ディスク等の情報記録基板、ガラス板、鋼板、陶器、木板または樹脂板等、任意の形態の部材や物品なども対象とすることができる。   Further, the material, type, shape and the like of the positioning object in the present invention are not particularly limited. Examples of positioning objects include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording boards such as optical disks, glass plates, steel plates, ceramics, wood plates, resin plates, etc. Form members and articles can also be targeted.

本発明における手段および工程は、それら手段および工程について説明した動作、機能または工程を果たすことができる限りなんら限定されることはなく、まして、前記実施形態で示した単なる一実施形態の構成物や工程に全く限定されることはない。例えば、位置決め手段は、保持部材で保持された位置決め対象物に位置決め部材を当接させ、位置決め部材で位置決め対象物を所定の位置に位置決め可能なものであれば、出願当初の技術常識に照らし合わせ、その技術範囲内のものであればなんら限定されることはない（他の手段および工程についての説明は省略する）。
また、前記実施形態における駆動機器は、回動モータ、直動モータ、リニアモータ、単軸ロボット、多関節ロボット等の電動機器、エアシリンダ、油圧シリンダ、ロッドレスシリンダおよびロータリシリンダ等のアクチュエータ等を採用することができる上、それらを直接的又は間接的に組み合せたものを採用することもできる（実施形態で例示したものと重複するものもある）。
前記実施形態において、ローラが採用されている場合、各ローラを回転駆動させる駆動機器を備えてもよいし、各ローラの表面をゴムや樹脂等の弾性変形が可能な部材で構成してもよいし、各ローラを弾性変形しない部材で構成してもよいし、押圧ローラや押圧ヘッド等の押圧手段や押圧部材が採用されている場合、上記で例示したものに代えてまたは併用して、ローラ、丸棒、ブレード材、ゴム、樹脂、スポンジ等による押圧部材を採用したり、大気やガス等のエアの吹き付けにより押圧する構成を採用したりしてもよいし、押圧手段や押圧部材の押圧部をゴムや樹脂等の弾性変形が可能な部材で構成してもよいし、弾性変形しない部材で構成してもよいし、剥離手段や剥離部材が採用されている場合は、板状部材、丸棒、ローラ等で構成してもよいし、支持（保持）手段や支持（保持）部材等の被支持部材を支持または保持する構成のものが採用されている場合、クーロン力、接着剤、粘着剤、磁力、ベルヌーイ吸着等で位置決め対象物を支持（保持）する構成を採用してもよいし、切断手段や切断刃が採用されている場合、上記で例示したものに代えてまたは併用して、カッター刃、レーザカッタ、イオンビーム、火力、熱、水圧、電熱線、気体や液体等の吹付け等の切断部材を採用したり、適宜な駆動機器を組み合わせたもので切断部材を移動させて切断するようにしたりしてもよい。 The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the positioning means can bring the positioning member into contact with the positioning object held by the holding member and can position the positioning object at a predetermined position by the positioning member, the positioning means can be compared with the common general technical knowledge at the beginning of the application However, there is no limitation as long as it is within the technical range (the description of other means and steps is omitted).
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a drive device that rotationally drives each roller may be provided, or the surface of each roller may be configured with a member capable of elastic deformation such as rubber or resin. In addition, each roller may be constituted by a member that does not elastically deform, or when a pressing means or pressing member such as a pressing roller or a pressing head is employed, instead of or in combination with those exemplified above, a roller , A pressing member made of a round bar, blade material, rubber, resin, sponge, etc., or a structure of pressing by blowing air such as air or gas, or a pressing means or pressing member The part may be composed of a member that can be elastically deformed, such as rubber or resin, or may be composed of a member that is not elastically deformed, and when a peeling means or a peeling member is employed, a plate-like member, Consists of round bars, rollers, etc. In addition, when a structure that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is adopted, Coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, etc. A configuration for supporting (holding) a positioning object may be employed, and when a cutting means or a cutting blade is employed, a cutter blade, a laser cutter, A cutting member such as ion beam, thermal power, heat, water pressure, heating wire, spraying of gas or liquid, etc. is adopted, or the cutting member is moved with a combination of appropriate driving equipment to cut. Also good.

１０ 位置決め装置
２０ 保持手段
２４ 姿勢復帰手段
２５ 吸着パッド（保持部材）
３０ 位置決め手段
３２ 位置決めピン（位置決め部材）
ＷＦ ウエハ（位置決め対象物） DESCRIPTION OF SYMBOLS 10 Positioning device 20 Holding means 24 Posture return means 25 Suction pad (holding member)
30 Positioning means 32 Positioning pin (positioning member)
WF wafer (positioning object)

Claims (2)

弾性変形する保持部材で位置決め対象物を保持する保持手段と、
前記保持部材で保持された位置決め対象物に位置決め部材を当接させ、前記位置決め部材で前記位置決め対象物を所定の位置に位置決めする位置決め手段とを備え、
前記保持手段は、前記位置決め部材による前記位置決め対象物の移動方向に弾性変形した前記保持部材の姿勢を、前記位置決め対象物が位置決めされた状態のまま弾性変形前の姿勢に復帰させる姿勢復帰手段を備えていることを特徴とする位置決め装置。 Holding means for holding the positioning object with a holding member that is elastically deformed;
Positioning means for abutting a positioning member on a positioning object held by the holding member, and positioning the positioning object at a predetermined position by the positioning member;
The holding means is a posture return means for returning the posture of the holding member elastically deformed in the moving direction of the positioning object by the positioning member to the posture before elastic deformation while the positioning target object is positioned. A positioning device comprising the positioning device. 弾性変形する保持部材で位置決め対象物を保持する保持工程と、
前記保持部材で保持された位置決め対象物に位置決め部材を当接させ、前記位置決め部材で前記位置決め対象物を所定の位置に位置決めする位置決め工程と、
前記位置決め部材による前記位置決め対象物の移動方向に弾性変形した前記保持部材の姿勢を、前記位置決め対象物が位置決めされた状態のまま弾性変形前の姿勢に復帰させる姿勢復帰工程とを備えていることを特徴とする位置決め方法。 A holding step of holding the positioning object with a holding member that is elastically deformed;
A positioning step of bringing a positioning member into contact with the positioning object held by the holding member and positioning the positioning object at a predetermined position by the positioning member;
A posture returning step of returning the posture of the holding member elastically deformed in the moving direction of the positioning object by the positioning member to a posture before elastic deformation while the positioning target is positioned. A positioning method characterized by the above.
JP2017034083A 2017-02-24 2017-02-24 Positioning device and positioning method Pending JP2018139282A (en)

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