JP2018129491A - Pressure-sensitive adhesive sheet, and method of manufacturing semiconductor chip or semiconductor component using the same - Google Patents
Pressure-sensitive adhesive sheet, and method of manufacturing semiconductor chip or semiconductor component using the same Download PDFInfo
- Publication number
- JP2018129491A JP2018129491A JP2017023573A JP2017023573A JP2018129491A JP 2018129491 A JP2018129491 A JP 2018129491A JP 2017023573 A JP2017023573 A JP 2017023573A JP 2017023573 A JP2017023573 A JP 2017023573A JP 2018129491 A JP2018129491 A JP 2018129491A
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- pressure
- adhesive sheet
- base film
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 84
- 239000004065 semiconductor Substances 0.000 title claims description 43
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000010410 layer Substances 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 21
- 239000012948 isocyanate Substances 0.000 claims abstract description 15
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 12
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 claims abstract description 11
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 239000000853 adhesive Substances 0.000 claims description 58
- 230000001070 adhesive effect Effects 0.000 claims description 58
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- 239000003999 initiator Substances 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 239000004848 polyfunctional curative Substances 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 37
- -1 polyethylene Polymers 0.000 description 23
- 235000012431 wafers Nutrition 0.000 description 19
- 239000000178 monomer Substances 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 8
- 239000005056 polyisocyanate Substances 0.000 description 8
- 229920001228 polyisocyanate Polymers 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- 150000001805 chlorine compounds Chemical group 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 244000028419 Styrax benzoin Species 0.000 description 5
- 235000000126 Styrax benzoin Nutrition 0.000 description 5
- 235000008411 Sumatra benzointree Nutrition 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 5
- 229960002130 benzoin Drugs 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 235000019382 gum benzoic Nutrition 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 229920000554 ionomer Polymers 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 4
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000058 polyacrylate Polymers 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 3
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 125000005442 diisocyanate group Chemical group 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 239000012748 slip agent Substances 0.000 description 3
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 3
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 2
- ROHUXHMNZLHBSF-UHFFFAOYSA-N 1,4-bis(isocyanatomethyl)cyclohexane Chemical compound O=C=NCC1CCC(CN=C=O)CC1 ROHUXHMNZLHBSF-UHFFFAOYSA-N 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- ZCLIABJNNBEIBM-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)-n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1OCC1CO1 ZCLIABJNNBEIBM-UHFFFAOYSA-N 0.000 description 2
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- NJWGQARXZDRHCD-UHFFFAOYSA-N 2-methylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC=C3C(=O)C2=C1 NJWGQARXZDRHCD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 2
- 241001050985 Disco Species 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- XQAVYBWWWZMURF-UHFFFAOYSA-N OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO XQAVYBWWWZMURF-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 2
- 150000008062 acetophenones Chemical class 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 150000004056 anthraquinones Chemical class 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000004305 biphenyl Substances 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- QWUWMCYKGHVNAV-UHFFFAOYSA-N 1,2-dihydrostilbene Chemical group C=1C=CC=CC=1CCC1=CC=CC=C1 QWUWMCYKGHVNAV-UHFFFAOYSA-N 0.000 description 1
- ZGDSDWSIFQBAJS-UHFFFAOYSA-N 1,2-diisocyanatopropane Chemical compound O=C=NC(C)CN=C=O ZGDSDWSIFQBAJS-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- UFXYYTWJETZVHG-UHFFFAOYSA-N 1,3-diisocyanatobutane Chemical compound O=C=NC(C)CCN=C=O UFXYYTWJETZVHG-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
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- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
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- QGLRLXLDMZCFBP-UHFFFAOYSA-N 1,6-diisocyanato-2,4,4-trimethylhexane Chemical compound O=C=NCC(C)CC(C)(C)CCN=C=O QGLRLXLDMZCFBP-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- BOCJQSFSGAZAPQ-UHFFFAOYSA-N 1-chloroanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl BOCJQSFSGAZAPQ-UHFFFAOYSA-N 0.000 description 1
- GZBSIABKXVPBFY-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GZBSIABKXVPBFY-UHFFFAOYSA-N 0.000 description 1
- CERJZAHSUZVMCH-UHFFFAOYSA-N 2,2-dichloro-1-phenylethanone Chemical compound ClC(Cl)C(=O)C1=CC=CC=C1 CERJZAHSUZVMCH-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- LHNAURKRXGPVDW-UHFFFAOYSA-N 2,3-diisocyanatobutane Chemical compound O=C=NC(C)C(C)N=C=O LHNAURKRXGPVDW-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
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- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
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- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
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- 239000005977 Ethylene Substances 0.000 description 1
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- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- RJLZSKYNYLYCNY-UHFFFAOYSA-N ethyl carbamate;isocyanic acid Chemical group N=C=O.CCOC(N)=O RJLZSKYNYLYCNY-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 229920006244 ethylene-ethyl acrylate Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- KXAVXHYIOCQWIB-UHFFFAOYSA-N n-(dimethylaminooxy)-n-methylmethanamine Chemical compound CN(C)ON(C)C KXAVXHYIOCQWIB-UHFFFAOYSA-N 0.000 description 1
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid group Chemical group S(N)(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Dicing (AREA)
Abstract
Description
本発明は、粘着シート及びそれを用いた半導体チップ又は半導体部品の製造方法に関する。 The present invention relates to an adhesive sheet and a method for manufacturing a semiconductor chip or a semiconductor component using the adhesive sheet.
半導体ウエハ又は基板は、以下の工程を経て製造されることが、通例である。ウエハに粘着シートを貼合後、チップに切断(ダイシング)、粘着シートの延伸(エキスパンディング)、紫外線および/又は電子線などの活性光線を照射し、粘着シートの粘着層を硬化させた後に、粘着シートからのチップの剥離(ピックアップ)などの各工程を経て製造される。これらの工程で使用される粘着シートの粘着層として、活性光線に対し透過性を有し、紫外線等により重合硬化反応による三次元網状化しうる、分子内に光重合性不飽和二重結合を有する化合物(多官能性オリゴマー)を含有する材料が、開示されている(特許文献1および特許文献2)。
このような材料を使用することにより、ダイシング工程ではチップをせん断する際には充分な粘着力を有しながら、ピックアップ工程時には糊残りのない程度に粘着力が低下する粘着シートが得られる。
The semiconductor wafer or substrate is usually manufactured through the following steps. After sticking the adhesive sheet to the wafer, after cutting the chip (dicing), stretching the adhesive sheet (expanding), irradiating active rays such as ultraviolet rays and / or electron beams, and curing the adhesive layer of the adhesive sheet, Manufactured through various steps such as chip peeling (pickup) from the adhesive sheet. As the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet used in these steps, it has transparency to actinic rays and can be formed into a three-dimensional network by a polymerization curing reaction with ultraviolet rays or the like, and has a photopolymerizable unsaturated double bond in the molecule. Materials containing compounds (polyfunctional oligomers) have been disclosed (Patent Document 1 and Patent Document 2).
By using such a material, it is possible to obtain an adhesive sheet that has sufficient adhesive force when shearing the chip in the dicing process, but has an adhesive force that is reduced to the extent that no adhesive residue remains in the pickup process.
しかし、近年の半導体ウエハ又は基板は、数μmから数100μmのバンプを有することが多く、粘着シートのバンプ追従性が悪いとダイシングの際にチップ飛びが発生することがある。また、ピックアップは、通常、基材フィルム背面(下面)側からピン(ピックアップニードル)を使って半導体ウエハ又は基板を1個ずつ突き上げて、粘着シートから半導体ウエハ又は基板を剥離することによって得るが、この方法では、半導体ウエハの1個ずつに対して行うので、効率が悪い。
また、紫外線などの活性光線を照射し、粘着シートの粘着層を硬化させる際、粘着シートから臭気が発生することが課題になっている。
However, recent semiconductor wafers or substrates often have bumps of several μm to several hundred μm, and chip skipping may occur during dicing if the adhesive sheet has poor bump followability. In addition, the pickup is usually obtained by pushing up the semiconductor wafer or substrate one by one from the back side (lower surface) side of the base film using a pin (pickup needle), and peeling the semiconductor wafer or substrate from the adhesive sheet. This method is not efficient because it is performed for each semiconductor wafer.
Moreover, when irradiating actinic rays, such as an ultraviolet-ray, and hardening the adhesive layer of an adhesive sheet, it has become a subject that an odor generate | occur | produces from an adhesive sheet.
本発明は前記問題点に鑑みなされたものであり、その目的は、粘着シートの半導体ウエハ又は基板へのバンプ追従性が良好で、紫外線などの活性光線を照射した際の臭気が少なく、ピックアップを基材フィルム下面側から冶具等で擦ることにより達成できる粘着シート、及びそれを用いた半導体チップ又は半導体部品の製造方法を提供することにある。 The present invention has been made in view of the above-mentioned problems, and its purpose is that the adhesive sheet has good bump followability to a semiconductor wafer or substrate, has low odor when irradiated with actinic rays such as ultraviolet rays, and the like. An object of the present invention is to provide a pressure-sensitive adhesive sheet that can be achieved by rubbing with a jig or the like from the lower surface side of a base film, and a method for manufacturing a semiconductor chip or a semiconductor component using the same.
本発明は上記の課題を解決するために、下記の手段を採用する。
(1)基材フィルムの一方の面に紫外線硬化型粘着剤層を積層してなる粘着シートであって、
前記紫外線硬化型粘着剤層が、(メタ)アクリル酸エステル共重合体100質量部、光重合性化合物40〜150質量部、多官能イソシアネート硬化剤0.1〜10質量部及び光重合開始剤0.1〜10質量部を含み、
前記基材フィルムの他方の面の動摩擦係数が0.1〜0.8、且つ前記粘着シートのショアD硬度が25〜45であることを特徴とする粘着シート。
(2)前記粘着シートの基材フィルム下面から、紫外線を150mJ/cm2照射後、照射10分後の、臭気値が1,000以下であることを特徴とする、(1)に記載の粘着シート。
(3)前記粘着シートがダイシングテープであって、
(a)半導体ウエハ又は基板とリングフレームとを(1)又は(2)に記載の粘着シートで貼り付ける貼付工程、
(b)半導体ウエハ又は基板をダイシングして半導体チップ又は半導体部品に加工するダイシング工程、
(c)粘着シートの基材フィルム面に紫外線を照射する紫外線照射工程、
(d)粘着シートの基材フィルム下面を擦って前記半導体チップ又は前記半導体部品を剥離する剥離工程、
とを有する半導体チップ又は半導体部品の製造方法。
The present invention employs the following means in order to solve the above problems.
(1) An adhesive sheet obtained by laminating an ultraviolet curable adhesive layer on one surface of a substrate film,
The UV-curable pressure-sensitive adhesive layer is composed of 100 parts by weight of a (meth) acrylic acid ester copolymer, 40 to 150 parts by weight of a photopolymerizable compound, 0.1 to 10 parts by weight of a polyfunctional isocyanate curing agent, and a photopolymerization initiator 0. 1 to 10 parts by weight,
The pressure-sensitive adhesive sheet is characterized in that the other surface of the base film has a coefficient of dynamic friction of 0.1 to 0.8 and the pressure-sensitive adhesive sheet has a Shore D hardness of 25 to 45.
(2) The pressure-sensitive adhesive according to (1), characterized in that an odor value after irradiation of 150 mJ / cm 2 of ultraviolet light and 10 minutes after irradiation is 1,000 or less from the lower surface of the base film of the pressure-sensitive adhesive sheet. Sheet.
(3) The adhesive sheet is a dicing tape,
(A) An attaching step of attaching the semiconductor wafer or substrate and the ring frame with the adhesive sheet according to (1) or (2),
(B) a dicing process in which a semiconductor wafer or substrate is diced to be processed into a semiconductor chip or a semiconductor component;
(C) an ultraviolet irradiation step of irradiating the base film surface of the adhesive sheet with ultraviolet rays;
(D) a peeling step of peeling the semiconductor chip or the semiconductor component by rubbing the lower surface of the base film of the pressure-sensitive adhesive sheet;
A method for manufacturing a semiconductor chip or a semiconductor component.
本発明は、粘着シートの導体ウエハ又は基板へのバンプ追従性が良好で、紫外線などの活性光線を照射した際の臭気が少なく、ピックアップを基材フィルム下面側から冶具等で擦ることにより達成できる、粘着シート、及びそれを用いた半導体チップ又は半導体部品の製造方法を提供できる。 The present invention has good bump followability to the conductive wafer or substrate of the pressure-sensitive adhesive sheet, has less odor when irradiated with actinic rays such as ultraviolet rays, and can be achieved by rubbing the pickup from the lower surface side of the base film with a jig or the like. , A pressure-sensitive adhesive sheet, and a method of manufacturing a semiconductor chip or a semiconductor component using the same can be provided.
以下、本発明を実施するための好適な形態について説明する。本発明は、基材フィルム上に紫外線硬化型粘着剤層を積層してなる粘着シートであって、基材フィルム面の動摩擦係数が0.1〜0.8、且つ前記粘着シートのショアD硬度が25〜45であることを特徴とする。 Hereinafter, preferred embodiments for carrying out the present invention will be described. The present invention is a pressure-sensitive adhesive sheet obtained by laminating an ultraviolet curable pressure-sensitive adhesive layer on a base film, wherein the dynamic friction coefficient of the base film surface is 0.1 to 0.8, and the Shore D hardness of the pressure-sensitive adhesive sheet Is 25 to 45.
<粘着シート>
本発明の粘着シートは、基材フィルム上に紫外線硬化型粘着剤層を積層してなる粘着シートであり、ショアD硬度が25以上45以下であり、好ましくは30〜40が良い。ショアD硬度が25未満では基材フィルムと粘着剤が付着した糊残りが発生し、45を超過するとバンプに対する追従性が低下する。
<Adhesive sheet>
The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet obtained by laminating an ultraviolet curable pressure-sensitive adhesive layer on a base film, and has a Shore D hardness of 25 or more and 45 or less, preferably 30 to 40. When the Shore D hardness is less than 25, a paste residue with the base film and the adhesive attached is generated. When the Shore D hardness exceeds 45, the followability with respect to the bump decreases.
<基材フィルム>
本発明の基材フィルムは、ポリ塩化ビニル、エチレン−酢酸ビニル共重合体、エチレン−アクリル酸−アクリル酸エステルフィルム、エチレン−エチルアクリレート共重合体、ポリエチレン、ポリプロピレン、プロピレン系共重合体、エチレン−アクリル酸共重合体、および、エチレン−(メタ)アクリル酸共重合体やエチレン−(メタ)アクリル酸−(メタ)アクリル酸エステル共重合体等を金属イオンで架橋したアイオノマ樹脂などが挙げられる。基材フィルムは、これら樹脂の混合物又は共重合体であってよく、これら樹脂からなるフィルムやシートの積層体であってもよい。基材フィルムの動摩擦係数が0.1以上0.8以下であり、好ましくは0.2以上0.4以下である。この範囲であれば、粘着シートの基材フィルム下面を擦って半導体チップ又は前記半導体部品を剥離する際、良好に剥離できる。
基材フィルムの動摩擦係数が0.1未満では粘着シートをロール状で巻く際に巻きズレが発生し易く、半導体ウエハや基板に貼付けし難く、バンプ追従性が悪くなる場合がある。また、基材フィルムの動摩擦係数が0.8を超過すると、剥離性が低下する。
<Base film>
The base film of the present invention is made of polyvinyl chloride, ethylene-vinyl acetate copolymer, ethylene-acrylic acid-acrylic ester film, ethylene-ethyl acrylate copolymer, polyethylene, polypropylene, propylene-based copolymer, ethylene- Examples thereof include an acrylic acid copolymer and an ionomer resin obtained by crosslinking an ethylene- (meth) acrylic acid copolymer or an ethylene- (meth) acrylic acid- (meth) acrylic acid ester copolymer with a metal ion. The base film may be a mixture or copolymer of these resins, and may be a laminate of films or sheets made of these resins. The dynamic friction coefficient of the base film is 0.1 or more and 0.8 or less, preferably 0.2 or more and 0.4 or less. If it is this range, it can peel favorably, when rubbing the base film lower surface of an adhesive sheet and peeling a semiconductor chip or the said semiconductor component.
When the dynamic friction coefficient of the base film is less than 0.1, winding deviation tends to occur when the pressure-sensitive adhesive sheet is wound in a roll shape, and it is difficult to attach the adhesive sheet to a semiconductor wafer or substrate, and the bump followability may be deteriorated. Moreover, if the dynamic friction coefficient of a base film exceeds 0.8, peelability will fall.
基材フィルムはアイオノマ樹脂を用いることが好ましい。アイオノマ樹脂の中でも、エチレン単位、メタアクリル酸単位、及び(メタ)アクリル酸アルキルエステル単位を有する共重合体をNa+、K+、Zn2+等の金属イオンで架橋したアイオノマ樹脂を用いると、切削屑抑制効果が顕著であり、好適に用いられる。 It is preferable to use an ionomer resin for the base film. Among ionomer resins, if an ionomer resin obtained by crosslinking a copolymer having an ethylene unit, a methacrylic acid unit, and a (meth) acrylic acid alkyl ester unit with a metal ion such as Na + , K + , or Zn 2+ is used, cutting is performed. The dust suppressing effect is remarkable and is preferably used.
基材フィルムの厚さは50〜200μmが好ましく、更に好ましくは70〜150μmである。 The thickness of the base film is preferably 50 to 200 μm, more preferably 70 to 150 μm.
基材フィルムには、帯電防止処理を施すことが好ましい。帯電防止処理としては、基材フィルムに帯電防止剤を配合する処理、基材フィルム表面に帯電防止剤を塗布する処理がある。 The base film is preferably subjected to an antistatic treatment. As the antistatic treatment, there are a treatment of adding an antistatic agent to the base film and a treatment of applying the antistatic agent to the surface of the base film.
帯電防止剤としては、例えば四級アミン塩単量体などを用いることができる。四級アミン塩単量体としては、例えばジメチルアミノエチル(メタ)アクリレート四級塩化物、ジエチルアミノエチル(メタ)アクリレート四級塩化物、メチルエチルアミノエチル(メタ)アクリレート四級塩化物、p−ジメチルアミノスチレン四級塩化物、およびp−ジエチルアミノスチレン四級塩化物が挙げられる。このうち、ジメチルアミノエチルメタクリレート四級塩化物が好ましい。 As the antistatic agent, for example, a quaternary amine salt monomer can be used. Examples of the quaternary amine salt monomer include dimethylaminoethyl (meth) acrylate quaternary chloride, diethylaminoethyl (meth) acrylate quaternary chloride, methylethylaminoethyl (meth) acrylate quaternary chloride, p-dimethyl. Examples include aminostyrene quaternary chloride and p-diethylaminostyrene quaternary chloride. Of these, dimethylaminoethyl methacrylate quaternary chloride is preferred.
基材フィルムの片面に紫外線硬化型粘着剤を積層し、他方の面は平均表面粗さ(Ra)が0.1〜1.5μmのエンボス面とすることが可能である。エンボス面を有することにより、エキスパンド工程で基材フィルムを容易に拡張することができる。 An ultraviolet curable pressure-sensitive adhesive can be laminated on one side of the base film, and the other side can be an embossed surface having an average surface roughness (Ra) of 0.1 to 1.5 μm. By having the embossed surface, the base film can be easily expanded in the expanding step.
エキスパンド性を向上させるために、基材フィルムに滑り剤を施したり、基材フィルムに滑り剤を練り込むことができる。 In order to improve the expandability, a slip agent can be applied to the base film, or a slip agent can be kneaded into the base film.
滑り剤は、粘着シートとエキスパンド装置の摩擦係数を低下させる物質であれば特に限定されず、例えばシリコーン樹脂や(変性)シリコーン油等のシリコーン化合物、フッ素樹脂、六方晶ボロンナイトライド、カーボンブラック、及び二硫化モリブデン等が挙げられる。これらの摩擦低減剤は複数の成分を混合してもよい。電子部品の製造はクリーンルームで行われるため、シリコーン化合物又はフッ素樹脂を用いることが好ましい。シリコーン化合物の中でも特にシリコーンマクロモノマ単位を有する共重合体は帯電防止層との相溶性が良く、帯電防止性とエキスパンド性のバランスが図れるため、好適に用いられる。 The slip agent is not particularly limited as long as it is a substance that reduces the friction coefficient of the pressure-sensitive adhesive sheet and the expanding device. For example, silicone compounds such as silicone resins and (modified) silicone oils, fluororesins, hexagonal boron nitride, carbon black, And molybdenum disulfide. These friction reducing agents may mix a plurality of components. Since manufacture of an electronic component is performed in a clean room, it is preferable to use a silicone compound or a fluororesin. Among silicone compounds, a copolymer having a silicone macromonomer unit is particularly preferred because it has good compatibility with the antistatic layer and can achieve a balance between antistatic properties and expandability.
<紫外線硬化型粘着剤層>
紫外線硬化型粘着剤層は、(メタ)アクリル酸エステル共重合体、光重合性化合物、多官能イソシアネート硬化剤及び光重合開始剤を含み、有機溶剤で希釈して基材フィルムに塗布、乾燥して得られる。
((メタ)アクリル酸エステル共重合体)
本発明で使用される(メタ)アクリル酸エステル共重合体は、アクリル酸、メタクリル酸及びそれらのエステルモノマーを重合させたポリマー、これらモノマーと共重合可能な不飽和単量体(例えば、酢酸ビニル、スチレン、アクリロニトリル)とを共重合させたコポリマーがある。本発明の紫外線硬化型粘着剤層を構成する紫外線硬化型粘着剤は、粘着力を調整しやすいアクリル重合体がよく、硬化剤を含有することによって、粘着力をより精密に調整することができる。
<UV curable adhesive layer>
The UV-curable pressure-sensitive adhesive layer contains a (meth) acrylic acid ester copolymer, a photopolymerizable compound, a polyfunctional isocyanate curing agent and a photopolymerization initiator, diluted with an organic solvent, applied to a substrate film, and dried. Obtained.
((Meth) acrylic acid ester copolymer)
The (meth) acrylic acid ester copolymer used in the present invention is a polymer obtained by polymerizing acrylic acid, methacrylic acid and ester monomers thereof, and an unsaturated monomer copolymerizable with these monomers (for example, vinyl acetate). , Styrene, and acrylonitrile). The ultraviolet curable pressure-sensitive adhesive constituting the ultraviolet curable pressure-sensitive adhesive layer of the present invention is preferably an acrylic polymer that easily adjusts the adhesive strength, and the adhesive strength can be adjusted more precisely by containing a curing agent. .
本発明の(メタ)アクリル重合体の主単量体としては、例えば、n−ブチル(メタ)アクリレート、2−ブチル(メタ)アクリレート、t−ブチル(メタ)アクリレート、ペンチル(メタ)アクリレート、オクチル(メタ)アクリレート、2−エチルヘキシル(メタ)アクリレート、ノニル(メタ)アクリレート、デシル(メタ)アクリレート、ラウリル(メタ)アクリレート、メチル(メタ)アクリレート、エチル(メタ)アクリレート、イソプロピル(メタ)アクリレート、トリデシル(メタ)アクリレート、ミリスチル(メタ)アクリレート、セチル(メタ)アクリレート、ステアリル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート等の(メタ)アクリル単量体が挙げられる。 Examples of the main monomer of the (meth) acrylic polymer of the present invention include n-butyl (meth) acrylate, 2-butyl (meth) acrylate, t-butyl (meth) acrylate, pentyl (meth) acrylate, and octyl. (Meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, tridecyl Examples include (meth) acrylic monomers such as (meth) acrylate, myristyl (meth) acrylate, cetyl (meth) acrylate, stearyl (meth) acrylate, cyclohexyl (meth) acrylate, and benzyl (meth) acrylate.
この(メタ)アクリル単量体としては、特に、少なくとも一部に官能基を含有する単量体を有するものが好ましい。この官能基を含有する単量体としては、ヒドロキシル基、カルボキシル基、エポキシ基、アミド基、アミノ基、メチロール基、スルホン酸基、スルファミン酸基、亜リン酸エステル基が好ましい。そして、これらの中でも、特に、これらの官能基を有するビニル化合物がよく、好ましくはヒドロキシル基を有するビニル化合物がよい。なお、ここでいうビニル化合物には、アクリレートが含まれるものとする。 As this (meth) acrylic monomer, one having a monomer containing a functional group at least in part is particularly preferable. The monomer containing this functional group is preferably a hydroxyl group, a carboxyl group, an epoxy group, an amide group, an amino group, a methylol group, a sulfonic acid group, a sulfamic acid group, or a phosphite group. Of these, vinyl compounds having these functional groups are particularly preferable, and vinyl compounds having hydroxyl groups are particularly preferable. The vinyl compound here includes acrylate.
ヒドロキシル基を有する有単量体としては、例えば2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、及び2−ヒドロキシブチル(メタ)アクリレートがある。 Examples of the monomer having a hydroxyl group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, and 2-hydroxybutyl (meth) acrylate.
カルボキシル基を有する単量体としては、例えば(メタ)アクリル酸、クロトン酸、マレイン酸、無水マレイン酸、イタコン酸、フマール酸、アクリルアミドN−グリコール酸、及びケイ皮酸等が挙げられる。 Examples of the monomer having a carboxyl group include (meth) acrylic acid, crotonic acid, maleic acid, maleic anhydride, itaconic acid, fumaric acid, acrylamide N-glycolic acid, and cinnamic acid.
エポキシ基を有する単量体としては、例えばアリルグリシジルエーテル、及び(メタ)アクリル酸グリシジルエーテル等が挙げられる。 Examples of the monomer having an epoxy group include allyl glycidyl ether and (meth) acrylic acid glycidyl ether.
アミド基を有する単量体としては、例えば(メタ)アクリルアミド、N,N−ジメチルアミノエチル(メタ)アクリレート等が挙げられる。 Examples of the monomer having an amide group include (meth) acrylamide, N, N-dimethylaminoethyl (meth) acrylate and the like.
メチロール基を有する単量体としては、例えばN−メチロールアクリルアミド等が挙げられる。 Examples of the monomer having a methylol group include N-methylolacrylamide.
(光重合性化合物)
光重合性化合物としては、例えば、トリメチロールプロパントリアクリレート、テトラメチロールメタンテトラアクリレート、ペンタエリスリトールトリアクリレート、ペンタエリスリトールテトラアクリレート、ジペンタエリスリトールペンタアクリレート、ジペンタエリスリトールヘキサアクリレート、1,4−ブチレングリコールジアクリレート、1,6−ヘキサンジオールジアクリレート、ポリエチレングリコールジアクリレート、シアヌル酸トリエチルアクリレート、市販のオリゴエステルアクリレートなどが用いられる。
(Photopolymerizable compound)
Examples of the photopolymerizable compound include trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diester. Examples include acrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, cyanuric acid triethyl acrylate, and commercially available oligoester acrylate.
光重合性化合物として、上記アクリレート系化合物の他に、ウレタンアクリレートオリゴマーを用いることもできる。ウレタンアクリレートオリゴマーは、ポリエステル型又はポリエーテル型などのポリオール化合物と多価イソシアネート化合物とを反応させて得られる末端イソシアネートウレタンプレポリマーに、ヒドロキシ基を有する(メタ)アクリレートを反応させて得られる。 As the photopolymerizable compound, a urethane acrylate oligomer can be used in addition to the acrylate compound. The urethane acrylate oligomer is obtained by reacting a (meth) acrylate having a hydroxyl group with a terminal isocyanate urethane prepolymer obtained by reacting a polyol compound such as polyester type or polyether type with a polyvalent isocyanate compound.
多価イソシアネート化合物には、例えば、2,4−トリレンジイソシアネート、2,6−トリレンジイソシアネート、1,3−キシレンジイソシアネート、1,4−キシレンジイソシアネート、ジフェニルメタン4,4−ジイソシアネート、トリメチルヘキサメチレンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネートなどが用いらえる。また、ヒドロキシ基を有する(メタ)アクリレートには、例えば、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、ポリエチレングリコール(メタ)アクリレート、ペンタエリスリトールトリアクリレート、グリシドールジ(メタ)アクリレート、ジペンタエリスリトールペンタアクリレートなどが用いられる。 Examples of the polyvalent isocyanate compound include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane 4,4-diisocyanate, and trimethylhexamethylene diisocyanate. , Hexamethylene diisocyanate, isophorone diisocyanate and the like can be used. Examples of the (meth) acrylate having a hydroxy group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, polyethylene glycol (meth) acrylate, pentaerythritol triacrylate, and glycidol di (meth). Acrylate, dipentaerythritol pentaacrylate and the like are used.
光重合性化合物としては、炭素−炭素二重結合を4個以上有するウレタンアクリレートオリゴマーが、紫外線等の照射後の粘着剤の硬化が良好である点で好ましい。 As the photopolymerizable compound, a urethane acrylate oligomer having 4 or more carbon-carbon double bonds is preferable in that the adhesive is cured after irradiation with ultraviolet rays or the like.
光重合性化合物の配合量は、(メタ)アクリル酸エステル共重合体100質量部に対して40質量部以上150質量部以下であり、好ましくは60質量部以上110質量部以下が良い。光重合性化合物の配合量が40質量部未満では紫外線照射後の粘着シートの剥離性が低下し、150質量部を超過するとチップ側面に糊残りが発生する。 The compounding quantity of a photopolymerizable compound is 40 to 150 mass parts with respect to 100 mass parts of (meth) acrylic acid ester copolymers, Preferably 60 to 110 mass parts is good. When the blending amount of the photopolymerizable compound is less than 40 parts by mass, the peelability of the pressure-sensitive adhesive sheet after UV irradiation is lowered, and when it exceeds 150 parts by mass, adhesive residue is generated on the side surface of the chip.
(多官能イソシアネート硬化剤)
本発明の多官能イソシアネート硬化剤の配合は、(メタ)アクリル重合体100質量部に対し、0.1質量部以上10質量部以下であり、好ましくは2質量部以上7重量部以下が良い。硬化剤の配合比が0.1質量部未満の場合はチップ側面に糊残りが発生し、10質量部超過の場合はバンプへの追従性が低下する。
(Multifunctional isocyanate curing agent)
The blend of the polyfunctional isocyanate curing agent of the present invention is 0.1 parts by mass or more and 10 parts by mass or less, and preferably 2 parts by mass or more and 7 parts by mass or less with respect to 100 parts by mass of the (meth) acrylic polymer. When the blending ratio of the curing agent is less than 0.1 parts by mass, adhesive residue is generated on the side surface of the chip, and when it exceeds 10 parts by mass, the followability to the bumps decreases.
多官能イソシアネート硬化剤としては、例えば芳香族ポリイソシアネート硬化剤、脂肪族ポリイソシアネート硬化剤、多官能エポキシ硬化剤、脂環族ポリイソシアネート硬化剤がある。また、好ましくは、脂肪族ポリイソシアネート硬化剤、特にそのうちのキサメチレンジイソシアネート硬化剤がよい。このイソシアネート硬化剤が良いのは、粘着剤に柔軟性を付与することができ、凹凸のある被着体にも有効だからである。 Examples of the polyfunctional isocyanate curing agent include an aromatic polyisocyanate curing agent, an aliphatic polyisocyanate curing agent, a polyfunctional epoxy curing agent, and an alicyclic polyisocyanate curing agent. In addition, an aliphatic polyisocyanate curing agent, particularly a xamethylene diisocyanate curing agent among them is preferable. The reason why this isocyanate curing agent is good is that it can impart flexibility to the pressure-sensitive adhesive and is also effective for an adherend having irregularities.
芳香族ポリイソシアネートは特に限定されず、例えば1,3−フェニレンジイソシアネート、4,4’−ジフェニルジイソシアネート、1,4−フェニレンジイソシアネート、4,4’−ジフェニルメタンジイソシアネート、2,4−トリレンジイソシアネート、2,6−トリレンジイソシアネート、4,4’−トルイジンジイソシアネート、2,4,6−トリイソシアネートトルエン、1,3,5−トリイソシアネートベンゼン、ジアニシジンジイソシアネート、4,4’−ジフェニルエーテルジイソシアネート、4,4’,4”−トリフェニルメタントリイソシアネート、ω,ω’−ジイソシアネート−1,3−ジメチルベンゼン、ω,ω’−ジイソシアネート−1,4−ジメチルベンゼン、ω,ω’−ジイソシアネート−1,4−ジエチルベンゼン、1,4−テトラメチルキシリレンジイソシアネート、及び1,3−テトラメチルキシリレンジイソシアネート等が挙げられる。 The aromatic polyisocyanate is not particularly limited, and for example, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2 , 6-tolylene diisocyanate, 4,4'-toluidine diisocyanate, 2,4,6-triisocyanate toluene, 1,3,5-triisocyanate benzene, dianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4 ', 4 "-triphenylmethane triisocyanate, ω, ω'-diisocyanate-1,3-dimethylbenzene, ω, ω'-diisocyanate-1,4-dimethylbenzene, ω, ω'-diisocyanate-1,4- Diethyl Benzene, 1,4-tetramethylxylylene diisocyanate, and 1,3-tetramethylxylylene diisocyanate and the like.
脂肪族ポリイソシアネートは特に限定されず、例えばトリメチレンジイソシアネート、テトラメチレンジイソシアネート、ヘキサメチレンジイソシアネート、ペンタメチレンジイソシアネート、1,2−プロピレンジイソシアネート、2,3−ブチレンジイソシアネート、1,3−ブチレンジイソシアネート、ドデカメチレンジイソシアネート、及び2,4,4−トリメチルヘキサメチレンジイソシアネート等が挙げられる。 The aliphatic polyisocyanate is not particularly limited. For example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene. Examples thereof include diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate.
脂環族ポリイソシアネートは特に限定されず、例えば3−イソシアネートメチル−3,5,5−トリメチルシクロヘキシルイソシアネート、1,3−シクロペンタンジイソシアネート、1,3−シクロヘキサンジイソシアネート、1,4−シクロヘキサンジイソシアネート、メチル−2,4−シクロヘキサンジイソシアネート、メチル−2,6−シクロヘキサンジイソシアネート、4,4’−メチレンビス(シクロヘキシルイソシアネート)、1,4−ビス(イソシアネートメチル)シクロヘキサン、及び1,4−ビス(イソシアネートメチル)シクロヘキサンがある。 The alicyclic polyisocyanate is not particularly limited. For example, 3-isocyanate methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl -2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylenebis (cyclohexyl isocyanate), 1,4-bis (isocyanatomethyl) cyclohexane, and 1,4-bis (isocyanatomethyl) cyclohexane There is.
ポリイソシアネートのうち、1,3−フェニレンジイソシアネート、4,4’−ジフェニルジイソシアネート、1,4−フェニレンジイソシアネート、4,4’−ジフェニルメタンジイソシアネート、2,4−トリレンジイソシアネート、2,6−トリレンジイソシアネート、4,4’−トルイジンジイソシアネート、ヘキサメチレンジイソシアネートが好適に用いられる。 Among polyisocyanates, 1,3-phenylene diisocyanate, 4,4′-diphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4′-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate 4,4'-toluidine diisocyanate and hexamethylene diisocyanate are preferably used.
多官能エポキシ硬化剤は、主にエポキシ基を2個以上、第3級窒素原子を1個以上有する化合物をいい、N・N−グリシジルアニリン、N・N−グリシジルトルイジン、m−N・N−グリシジルアミノフェニルグリシジルエーテル、p−N・N−グリシジルアミノフェニルグリシジルエーテル、トリグリシジルイソシアヌレート、N・N・N’・N’−テトラグリシジルジアミノジフェニルメタン、N・N・N’・N’−テトラグリシジル−m−キシリレンジアミン、N・N・N’・N’・N’’−ペンタグリシジルジエチレントリアミンなどが挙げられる。 The polyfunctional epoxy curing agent mainly refers to a compound having two or more epoxy groups and one or more tertiary nitrogen atoms, such as N.N-glycidylaniline, N.N-glycidyltoluidine, mN.N-N-. Glycidylaminophenyl glycidyl ether, pN · N-glycidylaminophenyl glycidyl ether, triglycidyl isocyanurate, N · N · N '· N'-tetraglycidyldiaminodiphenylmethane, N · N · N' · N'-tetraglycidyl -M-xylylenediamine, N · N · N ′ · N ′ · N ″ -pentaglycidyldiethylenetriamine and the like.
(光重合開始剤)
光重合開始剤には、ベンゾイン、ベンゾインアルキルエーテル類、アセトフェノン類、アントラキノン類、チオキサントン類、ケタール類、ベンゾフェノン類またはキサントン類などが用いられる。
(Photopolymerization initiator)
As the photopolymerization initiator, benzoin, benzoin alkyl ethers, acetophenones, anthraquinones, thioxanthones, ketals, benzophenones or xanthones are used.
ベンゾインとしては、例えばベンゾイン、ベンゾインメチルエーテル、ベンゾインエチルエーテル、ベンゾインプロピルエーテルなどがある。
アセトフェノン類としては、例えばベンゾインアルキルエーテル類、アセトフェノン、2,2−ジメトキシ−2−アセトフェノン、2,2−ジエトキシ−2−アセトフェノン、1,1−ジクロロアセトフェノン、2−ヒロドキシ−1−{4−[4−(2−ヒドロキシ−2−メチル−プロピオニル)−ベンジル]フェニル}−2−メチル−プロパン−1−オン、1−ヒドロキシ−シクロヘキシル−フェニル−ケトンなどがある。
アントラキノン類としては、2−メチルアントラキノン、2−エチルアントラキノン、2−ターシャリブチルアントラキノン、1−クロロアントラキノンなどがある。
チオキサントン類としては、例えば2,4−ジメチルチオキサントン、2,4−ジイソプロピルチオキサントン、2−クロロチオキサントン、2,4−ジイソプロピルチオキサントンなどがある。
ケタール類としては、例えばアセトフェノンジメチルケタール、ベンジルジメチルメタール、ベンジルジフエニルサルフアイド、テトラメチルチウラムモノサルフアイド、アゾビスイソブチロニトリル、ジベンジル、ジアセチル、β−クロールアンスラキノンなどがある。
Examples of benzoin include benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin propyl ether.
Examples of the acetophenones include benzoin alkyl ethers, acetophenone, 2,2-dimethoxy-2-acetophenone, 2,2-diethoxy-2-acetophenone, 1,1-dichloroacetophenone, 2-hydroxy-1- {4- [ 4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone and the like.
Anthraquinones include 2-methylanthraquinone, 2-ethylanthraquinone, 2-tertiarybutylanthraquinone, 1-chloroanthraquinone and the like.
Examples of thioxanthones include 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone.
Examples of ketals include acetophenone dimethyl ketal, benzyldimethylmethal, benzyldiphenylsulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, dibenzyl, diacetyl, and β-chloranthraquinone.
光重合開始剤の配合量は、(メタ)アクリル酸エステル共重合体100質量部、光重合性化合物40〜150質量部、多官能イソシアネート硬化剤0.1〜10質量部に対して、0.1〜10質量部である。この配合かつ粘着シートのショアD硬度25〜45であるように調整することにより、紫外線照射後の粘着シートの剥離性を良好にでき、紫外線照射後の粘着シートの臭気を一定以下にすることができる。0.1質量部未満では紫外線照射後の粘着シートの剥離性が低下し、10質量部超過では紫外線硬化後の臭気が高くなる。 The compounding quantity of a photoinitiator is 0.00 with respect to 100 mass parts of (meth) acrylic acid ester copolymers, 40-150 mass parts of photopolymerizable compounds, and 0.1-10 mass parts of polyfunctional isocyanate hardening | curing agents. 1 to 10 parts by mass. By adjusting this blending and the Shore D hardness of the pressure-sensitive adhesive sheet to be 25 to 45, the peelability of the pressure-sensitive adhesive sheet after ultraviolet irradiation can be improved, and the odor of the pressure-sensitive adhesive sheet after ultraviolet irradiation can be kept below a certain level. it can. If it is less than 0.1 parts by mass, the peelability of the pressure-sensitive adhesive sheet after irradiation with ultraviolet rays is reduced, and if it exceeds 10 parts by mass, the odor after ultraviolet curing becomes high.
光重合開始剤には、必要に応じて従来公知の光重合促進剤を1種または2種以上を組合せて併用してもよい。光重合促進剤には、安息香酸系や第三級アミンなどを用いることができる。第三級アミンとしては、トリエチルアミン、テトラエチルペンタアミン、ジメチルアミノエーテルなどが挙げられる。 In the photopolymerization initiator, conventionally known photopolymerization accelerators may be used alone or in combination of two or more as required. A benzoic acid type | system | group, a tertiary amine, etc. can be used for a photoinitiator. Examples of the tertiary amine include triethylamine, tetraethylpentamine, dimethylamino ether and the like.
紫外線硬化型粘着剤層の組成物には、例えば、粘着付与樹脂、軟化剤、老化防止剤、充填剤、導電剤、紫外線吸収剤、及び光安定剤等の各種添加剤を添加してもよい。 Various additives such as a tackifier resin, a softener, an anti-aging agent, a filler, a conductive agent, an ultraviolet absorber, and a light stabilizer may be added to the composition of the ultraviolet curable pressure-sensitive adhesive layer. .
紫外線硬化型粘着剤層の厚みは、1μm以上50μmが好ましく、5μm以上35μm以下が特に好ましい。紫外線硬化型粘着剤層が厚過ぎると粘着力が高くなり過ぎ、ピックアップ性が低下する。また、紫外線硬化型粘着剤層が薄過ぎると粘着力が低くなり過ぎ、ダイシング時のチップ保持性が低下し、リングフレームとシートとの間で剥離が生じる場合がある。 The thickness of the ultraviolet curable pressure-sensitive adhesive layer is preferably from 1 μm to 50 μm, particularly preferably from 5 μm to 35 μm. If the ultraviolet curable pressure-sensitive adhesive layer is too thick, the adhesive strength becomes too high and the pick-up property is lowered. On the other hand, if the ultraviolet curable pressure-sensitive adhesive layer is too thin, the adhesive force becomes too low, the chip retention during dicing is lowered, and peeling may occur between the ring frame and the sheet.
<粘着シートの製造>
基材フィルム上に紫外線硬化型粘着剤層を形成して粘着シートとする方法としては、例えばグラビアコーター、コンマコーター、バーコーター、ナイフコーター又はロールコーターといったコーターで基材フィルム上に紫外線硬化型粘着剤を直接塗布する方法や、剥離フィルムに粘着剤を塗布/乾燥後に基材フィルムに貼り合わせる方法がある。凸板印刷、凹板印刷、平板印刷、フレキソ印刷、オフセット印刷、又はスクリーン印刷等で基材フィルム上に粘着剤を印刷してよい。
<Manufacture of adhesive sheet>
As a method for forming an ultraviolet curable pressure-sensitive adhesive layer on a base film to form an adhesive sheet, for example, an ultraviolet curable adhesive is applied on the base film with a coater such as a gravure coater, comma coater, bar coater, knife coater or roll coater. There are a method of directly applying an agent, and a method of applying an adhesive to a release film and affixing it to a substrate film after drying. The adhesive may be printed on the base film by convex plate printing, concave plate printing, flat plate printing, flexographic printing, offset printing, screen printing, or the like.
<半導体チップ又は半導体部品の製造方法>
本発明に係る電子部品の製造方法の具体的な工程を順に説明する。
<Manufacturing method of semiconductor chip or semiconductor component>
Specific steps of the electronic component manufacturing method according to the present invention will be described in order.
(1)貼付工程
貼付工程において、粘着シートを基板(又は半導体ウエハ)とリングフレームに貼り付ける。基板は、樹脂でチップを封止したパッケージ基板、LEDパッケージ基板などの汎用の基板であってよい。半導体ウエハはシリコンウエハおよびガリウムナイトライドウエハ、炭化ケイ素ウエハ、サファイアウエハなどの従来汎用のウエハであってよい。
(1) Affixing process In the affixing process, the adhesive sheet is affixed to the substrate (or semiconductor wafer) and the ring frame. The substrate may be a general-purpose substrate such as a package substrate in which a chip is sealed with a resin or an LED package substrate. The semiconductor wafer may be a conventional wafer such as a silicon wafer and a gallium nitride wafer, a silicon carbide wafer, or a sapphire wafer.
(2)ダイシング工程
ダイシング工程では、パッケージ基板等をダイシングして半導体チップ又は半導体部品に加工する。
(2) Dicing process In the dicing process, the package substrate or the like is diced and processed into a semiconductor chip or a semiconductor component.
(3)紫外線照射工程
紫外線照射工程では、基材フィルム側から紫外線硬化型粘着剤層に紫外線等の活性光線を照射する。紫外線の光源としては、低圧水銀灯、高圧水銀灯、超高圧水銀灯、メタルハライドランプを用いることができる。また、紫外線に替えて電子線を用いてもよく、電子線の光源としてはα線、β線、γ線を用いることができる。
(3) Ultraviolet irradiation step In the ultraviolet irradiation step, an actinic ray such as ultraviolet rays is applied to the ultraviolet curable pressure-sensitive adhesive layer from the base film side. As the ultraviolet light source, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high pressure mercury lamp, or a metal halide lamp can be used. In addition, an electron beam may be used instead of ultraviolet rays, and α-rays, β-rays, and γ-rays can be used as a light source for the electron beams.
紫外線により紫外線硬化型粘着剤層は三次元網状化して硬化し、紫外線硬化型粘着剤層の粘着力が低下する。この際、上述したように、本発明に係る粘着シートは加温してもウエハ等に過度に密着することがないため、紫外線等の照射により十分な接着力の低下が得られる。 The ultraviolet curable pressure-sensitive adhesive layer is three-dimensionally reticulated and cured by ultraviolet rays, and the adhesive strength of the ultraviolet curable pressure-sensitive adhesive layer is reduced. At this time, as described above, since the pressure-sensitive adhesive sheet according to the present invention does not excessively adhere to a wafer or the like even when heated, a sufficient decrease in adhesive force can be obtained by irradiation with ultraviolet rays or the like.
(4)剥離工程
粘着シートの基材フィルム1下面に剥離用冶具4を図1のとおり、押し付け、擦ることにより、半導体チップ又は半導体部品を剥離する。
(4) Peeling process The peeling jig 4 is pressed against the lower surface of the base film 1 of the pressure-sensitive adhesive sheet as shown in FIG.
以下に、この発明の好適な実施例を例示的に詳しく説明する。但し、この実施例に記載されている材料や配合量等は、特に限定的な記載がない限りは、この発明の範囲をそれらのみに限定する趣旨ではなく、単なる説明例に過ぎない。 Hereinafter, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in this example are merely illustrative examples, and are not intended to limit the scope of the present invention only to those unless otherwise specified.
<実施例>
表1、2に示す配合に従って粘着シートを調製した。紫外線硬化型粘着剤層は、(メタ)アクリル酸エステル共重合体等を混合させて得た紫外線硬化型粘着剤をポリエチレンテレフタレート製のセパレーターフィルム上に、乾燥後の紫外線硬化型粘着層の厚みが20μmとなるように塗工することにより、得た。この紫外線硬化型粘着層を基材フィルムに積層し、40℃で7日間熟成し、粘着シートを得た。
<Example>
Adhesive sheets were prepared according to the formulations shown in Tables 1 and 2. The UV-curable pressure-sensitive adhesive layer has a thickness of the UV-curable pressure-sensitive adhesive layer after drying an ultraviolet-curable pressure-sensitive adhesive obtained by mixing a (meth) acrylic acid ester copolymer on a polyethylene terephthalate separator film. It obtained by coating so that it might be set to 20 micrometers. This ultraviolet curable pressure-sensitive adhesive layer was laminated on a base film and aged at 40 ° C. for 7 days to obtain a pressure-sensitive adhesive sheet.
[紫外線硬化型粘着剤]
((メタ)アクリル酸エステル共重合体)
A−1:日本ゼオン社製アクリルゴムAR53L;エチルアクリレート54%、ブチルアクリレート19%、メトキシエチルアクリレート24%の共重合体、乳化重合により得られる。
A−2:綜研化学社製SKダイン1496;2−エチルヘキシルアクリレート96%、2−ヒドロキシエチルアクリレート4%の共重合体、溶液重合により得られる。
(光重合性化合物)
B−1:根上工業社製UN−3320HS;イソシアネート骨格:イソホロンジイソシアネート三量体、(メタ)アクリレート:ペンタエリスリトールペンタアクリレートを反応させて得られる光重合化合物、重量平均分子量5,000、炭素−炭素二重結合数:15。
B−2:根上工業社製UN−904M;イソシアネート骨格:ヘキサメチレンジイソシアネート、(メタ)アクリレート:ペンタエリスリトールペンタアクリレートを反応させて得られる光重合化合物、重量平均分子量4,900、炭素−炭素二重結合数:10。
(多官能イソシアネート硬化剤)
C−1:日本ポリウレタン社製コロネートL−45E;2,4−トリレンジイソシアネートのトリメチロールプロパンアダクト体。
(光重合開始剤)
D−1:BASFジャパン社製IRGACURE651;ベンジルジメチルケタール。
D−2:BASFジャパン社製IRGACURE127;2-ヒロドキシ-1-{4-[4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル]フェニル}-2-メチル-プロパン-1-オン
D−3:BASFジャパン社製IRGACURE184;1−ヒドロキシ−シクロヘキシル−フェニル−ケトン
〔基材フィルム〕
基材フィルムは、アイオノマ樹脂(三井・デュポンポリケミカル社製、品番:HM1855)をTダイ押出しにより150μmに成膜することにより、得た。基材フィルムの表面粗さ(Ra)は、基材フィルム下面を表面粗さ計(東京精密製 ハンディサーフE−30A)を用い、測長4mm、速度0.6mm/sにて測定することによって、得た。
E−1:基材フィルム下面側の表面粗さRaが1.0μm
E−2:基材フィルム下面側の表面粗さRaが1.3μm
E−3:基材フィルム下面側の表面粗さRaが0.5μm
E−4:基材フィルム下面側の表面粗さRaが1.5μm
E−5:基材フィルム下面側の表面粗さRaが0.2μm
[UV curable adhesive]
((Meth) acrylic acid ester copolymer)
A-1: Acrylic rubber AR53L manufactured by Nippon Zeon Co., Ltd .; a copolymer of ethyl acrylate 54%, butyl acrylate 19%, methoxyethyl acrylate 24%, obtained by emulsion polymerization.
A-2: SK dyne 1496 manufactured by Soken Chemical Co., Ltd .; a copolymer of 96% 2-ethylhexyl acrylate and 4% 2-hydroxyethyl acrylate, obtained by solution polymerization.
(Photopolymerizable compound)
B-1: UN-3320HS manufactured by Negami Kogyo Co., Ltd .; isocyanate skeleton: isophorone diisocyanate trimer, (meth) acrylate: photopolymerized compound obtained by reacting pentaerythritol pentaacrylate, weight average molecular weight 5,000, carbon-carbon Number of double bonds: 15.
B-2: UN-904M manufactured by Negami Kogyo Co., Ltd .; isocyanate skeleton: hexamethylene diisocyanate, (meth) acrylate: photopolymerized compound obtained by reacting pentaerythritol pentaacrylate, weight average molecular weight 4,900, carbon-carbon double Number of bonds: 10.
(Multifunctional isocyanate curing agent)
C-1: Coronate L-45E manufactured by Nippon Polyurethane Co .; Trimethylolpropane adduct of 2,4-tolylene diisocyanate.
(Photopolymerization initiator)
D-1: IRGACURE651 manufactured by BASF Japan Ltd .; benzyldimethyl ketal.
D-2: IRGACURE127 manufactured by BASF Japan Ltd .; 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one D- 3: IRSFACURE 184 manufactured by BASF Japan; 1-hydroxy-cyclohexyl-phenyl-ketone [base film]
The base film was obtained by depositing an ionomer resin (manufactured by Mitsui DuPont Polychemical Co., Ltd., product number: HM1855) to 150 μm by T-die extrusion. The surface roughness (Ra) of the base film is determined by measuring the lower surface of the base film with a surface roughness meter (Handy Surf E-30A, manufactured by Tokyo Seimitsu) at a length measurement of 4 mm and a speed of 0.6 mm / s. ,Obtained.
E-1: Surface roughness Ra on the lower surface side of the base film is 1.0 μm
E-2: Surface roughness Ra on the lower surface side of the base film is 1.3 μm
E-3: Surface roughness Ra on the lower surface side of the base film is 0.5 μm
E-4: Surface roughness Ra on the lower surface side of the base film is 1.5 μm
E-5: Surface roughness Ra on the lower surface side of the base film is 0.2 μm
各種評価は、以下のとおり実施した。
(1)基材フィルム面の動摩擦係数の測定方法
粘着シートを以下の手順で調整し、JIS K7125「プラスチック−フィルム及びシート−摩擦係数試験方法」に準拠し、摩擦測定器(東洋精機製作所製 TR−2)によって、SUS304との基材フィルムの動摩擦係数を測定した。
1)試験台上に粘着シートを敷き、その上にSUS304板(200g、63mm×63mm)を載せる。
2)引張速度100mm/minにて粘着シートを移動させる。
3)測定したデータから、動摩擦係数を算出した。
Various evaluations were performed as follows.
(1) Method for measuring the dynamic friction coefficient of the base film surface Adjust the pressure-sensitive adhesive sheet according to the following procedure, and conform to JIS K7125 “Plastic-Film and Sheet-Friction Coefficient Test Method”. -2), the dynamic friction coefficient of the base film with SUS304 was measured.
1) An adhesive sheet is laid on a test stand, and a SUS304 plate (200 g, 63 mm × 63 mm) is placed thereon.
2) The adhesive sheet is moved at a pulling speed of 100 mm / min.
3) The dynamic friction coefficient was calculated from the measured data.
(2)粘着シートのショアD硬度の測定方法
粘着シートを以下の手順で調整し、JIS K 7215「プラスチックのデュロメータ硬さ試験方法」に準拠し、定圧荷重器(高分子計器社製 CL−150)によって、粘着シートのショアD硬度を測定した。
1)粘着シートを数枚程度積層し、厚み10mmの試験片を作製する。
2)圧子の先端を粘着シートの基材フィルム下面から押し付け、3秒後の値をショアD硬度とした。
(2) Measuring method of Shore D hardness of pressure-sensitive adhesive sheet The pressure-sensitive adhesive sheet is adjusted according to the following procedure, and in accordance with JIS K 7215 “Plastic Durometer Hardness Test Method”, a constant pressure loader (CL-150 manufactured by Kobunshi Keiki Co., Ltd.) ), The Shore D hardness of the adhesive sheet was measured.
1) About several pressure-sensitive adhesive sheets are laminated to prepare a test piece having a thickness of 10 mm.
2) The tip of the indenter was pressed from the lower surface of the base film of the pressure-sensitive adhesive sheet, and the value after 3 seconds was taken as Shore D hardness.
(3)粘着シートの追従性の評価方法
縦1mm、横50mmのバンプを横方向に46mmで等間隔で配置した基板(バンプ高さ100μm)に、粘着シートの粘着層面をシリンダー圧0.4MPaのローラで貼り合せ完全に追従させた後、5分後のバンプの端から、粘着シートが剥がれている距離を測定することにより、粘着シートの追従性を評価した。
◎(優):バンプの端から、剥がれている距離が400μm未満の場合
○(良):バンプの端から、剥がれている距離が400μm以上600μm未満の場合
×(不可):バンプの端から、剥がれている距離が600μm以上の場合
(3) Evaluation method of followability of pressure-sensitive adhesive sheet A pressure-sensitive adhesive layer surface of a pressure-sensitive adhesive sheet with a cylinder pressure of 0.4 MPa is placed on a substrate (bump height of 100 μm) having 1 mm vertical and 50 mm horizontal bumps arranged at equal intervals of 46 mm in the horizontal direction. After being bonded with a roller and allowed to completely follow, the followability of the pressure sensitive adhesive sheet was evaluated by measuring the distance at which the pressure sensitive adhesive sheet was peeled off from the end of the bump after 5 minutes.
◎ (excellent): When the distance peeled from the edge of the bump is less than 400 μm ○ (Good): When the distance peeled from the edge of the bump is 400 μm or more and less than 600 μm × (impossible): From the edge of the bump When the peeled distance is 600 μm or more
(4)剥離性及びチップ側面糊残りの評価方法
前記(3)で基板が貼り合わされた粘着シートのダイシングを、下記条件にて行った。
ダイシング装置:DISCO社製DAD341
ダイシングブレード:DISCO社製P1A861SDC240N75BR597
ダイシングブレード形状:外径56mm、刃幅300μm、内径40mm
ダイシングブレード回転数:30、000rpm
ダイシングブレード送り速度:25mm/秒
ダイシングサイズ:2.0mm角
粘着シートへの切り込み量:70μm
切削水温度:25℃
切削水量:1.0リットル/分
(4) Evaluation method of peelability and chip side adhesive residue Dicing of the pressure-sensitive adhesive sheet on which the substrate was bonded in the above (3) was performed under the following conditions.
Dicing machine: DAD341 manufactured by DISCO
Dicing blade: P1A861SDC240N75BR597 manufactured by DISCO
Dicing blade shape: outer diameter 56mm, blade width 300μm, inner diameter 40mm
Dicing blade rotation speed: 30,000 rpm
Dicing blade feed speed: 25 mm / sec. Dicing size: 2.0 mm square cutting depth: 70 μm
Cutting water temperature: 25 ° C
Cutting water volume: 1.0 l / min
(4−1)半導体チップ剥離性の評価方法
チップ化された粘着シートの基材フィルム下面から紫外線(波長365nm)を150mJ/cm2照射した後、剥離冶具を角度90度で荷重0.15MPaにて押し付け、0.3m/sで、擦ることによりチップを剥離し、剥離できた割合を評価した。剥離に使用した冶具は、幅30mm、長さ60mm、厚み3mmで材質はSUS304とした。
◎(優):剥離できたチップの割合が95%以上
○(良):剥離できたチップの割合85%以上95%未満
×(不可):剥離できたチップの割合が85%未満
(4-1) Evaluation Method of Semiconductor Chip Peelability After irradiating UV (wavelength 365 nm) with 150 mJ / cm 2 from the lower surface of the base film of the pressure-sensitive adhesive sheet formed into a chip, the peeling jig is loaded at a load of 0.15 MPa at an angle of 90 degrees. The chip was peeled off by rubbing at 0.3 m / s, and the rate at which the chip could be peeled was evaluated. The jig used for peeling was 30 mm wide, 60 mm long, 3 mm thick, and the material was SUS304.
◎ (excellent): The percentage of chips that can be peeled is 95% or more ○ (good): The percentage of chips that can be peeled 85% or more and less than 95% x (not possible): The percentage of chips that can be peeled is less than 85%
(4−2)チップ側面糊残りの評価方法
チップ側面の糊残りは、剥離したチップの任意の50個選択し、チップの側面を500倍の顕微鏡にて観察し、チップ側面に付着した粘着剤の有無について以下の基準により評価した。
◎(優):チップ側面に粘着剤の付着が3%未満
○(良):チップ側面に粘着剤の付着が3%以上5%未満
×(不可):チップ側面に粘着剤の付着が5%以上
(4-2) Evaluation Method of Chip Side Adhesive Residue As for the adhesive residue on the chip side, any 50 peeled chips are selected, the side of the chip is observed with a 500 × microscope, and the adhesive adhered to the chip side The presence or absence of was evaluated according to the following criteria.
◎ (Excellent): Adhesive adherence on chip side less than 3% ○ (Good): Adhesive adherence on chip side less than 3% and less than 5% x (Not possible): Adhesive adherence on chip side that's all
(5)粘着シートの臭気値
臭気値は、セパレーター付き粘着シートを8インチの大きさに調整し、基材フィルム面から紫外線(波長365nm)を150mJ/cm2照射後、セパレーター剥離直後に、幅340mm、長さ480mmのチャック式袋に入れ10分間精置後に、23℃の条件で、におい測定装置(株式会社カルモア製、KALMOR−Σ)にて500mL/minの速度で吸引した時の最大値から得た。におい測定装置の数値が1,000以下の場合を良好とし、数値が1,000超過1,300以下の場合、臭気は若干感じるが不快にはならない程度であり、数値が1,300を超過する場合は臭気による不快感であるので、不可とする。
(5) Odor Value odor value of the pressure-sensitive adhesive sheet, by adjusting the separator-attached pressure-sensitive adhesive sheet to a size 8 inch, after 150 mJ / cm 2 ultraviolet rays (wavelength 365 nm) from the substrate film surface, immediately after the separator peeling width Maximum value when sucked at a rate of 500 mL / min with an odor measuring device (Calmore Co., Ltd., KALMOR-Σ) at 23 ° C. after placing in a chuck type bag of 340 mm and length of 480 mm for 10 minutes. Obtained from. When the numerical value of the odor measuring device is 1,000 or less, it is considered good. When the numerical value is over 1,000 and 1,300 or less, the odor is slightly felt but not uncomfortable, and the numerical value exceeds 1,300. In some cases, discomfort due to odor is not possible.
表1、2の結果から、本発明の実施例の粘着シートは、紫外線などの活性光線を照射した際の臭気が少なく、ダイシング時のチップ側面への糊残りを防止するとともに、バンプ追従性、チップ化された粘着シートの基材フィルム下面を冶具で擦る剥離工程において、チップ剥離性に優れることが分かった。
<比較例1>
光重合化合物の配合量が少ないため、紫外線照射後の紫外線硬化型粘着剤の架橋密度が低く、剥離性に不良が生じたと考えられる。
<比較例2>
光重合化合物の配合量が多いため、チップ側面の糊残りに不良が生じたと考えられる。
<比較例3>
多官能イソシアネート硬化剤の配合量が少ないため、紫外線硬化型粘着剤の架橋密度が低く、チップ側面の糊残りに不良が生じたと考えられる。
<比較例4>
多官能イソシアネート硬化剤の配合量が多いため、紫外線硬化型粘着剤の架橋密度が高く、追従性に不良を生じたと考えられる。
<比較例5、7、9>
光重合開始剤の配合量が少ないため、紫外線照射後の紫外線硬化型粘着剤の架橋密度が低く、剥離性に不良が生じたと考えられる。
<比較例6、8、10>
光重合開始剤の配合量が多いため、紫外線照射後の臭気が高く、臭気に不良が生じたと考えられる。
<比較例11>
基材フィルムの動摩擦係数が低いため、粘着シートが貼付けし難くバンプへの追従性が低下したものと考えられる。
<比較例12>
基材フィルムの動摩擦係数が高いため、粘着シートが滑りにくく、剥離性が低下したものと考えられる。
<比較例13>
粘着シートのショアD硬度が低いため、チップ側面に糊残りが生じたものと考えられる。
<比較例14>
粘着シートのショアD硬度が高いため、バンプへの追従性が低下したものと考えられる。
From the results of Tables 1 and 2, the pressure-sensitive adhesive sheets of the examples of the present invention have less odor when irradiated with actinic rays such as ultraviolet rays, and prevent adhesive residue on the chip side surface during dicing, as well as bump followability, It was found that in the peeling step of rubbing the bottom surface of the base film of the pressure-sensitive adhesive sheet made into a chip with a jig, the chip peelability is excellent.
<Comparative Example 1>
Since the blending amount of the photopolymerizable compound is small, it is considered that the crosslink density of the ultraviolet curable pressure-sensitive adhesive after the ultraviolet irradiation is low, resulting in poor peelability.
<Comparative example 2>
It is thought that a defect occurred in the adhesive residue on the side surface of the chip because the amount of the photopolymerization compound was large.
<Comparative Example 3>
Since the blending amount of the polyfunctional isocyanate curing agent is small, it is considered that the crosslink density of the ultraviolet curable pressure-sensitive adhesive is low, and the adhesive residue on the side surface of the chip is defective.
<Comparative example 4>
Since the compounding amount of the polyfunctional isocyanate curing agent is large, the crosslinking density of the ultraviolet curable pressure-sensitive adhesive is high, and it is considered that the followability is poor.
<Comparative Examples 5, 7, 9>
Since the blending amount of the photopolymerization initiator is small, it is considered that the crosslink density of the ultraviolet curable pressure-sensitive adhesive after irradiation with ultraviolet rays is low, resulting in poor peelability.
<Comparative Examples 6, 8, 10>
Since the blending amount of the photopolymerization initiator is large, the odor after ultraviolet irradiation is high, and it is considered that the odor is defective.
<Comparative Example 11>
Since the dynamic friction coefficient of the base film is low, it is considered that the adhesive sheet is difficult to affix and the followability to the bumps is reduced.
<Comparative Example 12>
Since the dynamic friction coefficient of the base film is high, it is considered that the pressure-sensitive adhesive sheet is difficult to slip and the peelability is lowered.
<Comparative Example 13>
Since the Shore D hardness of the pressure-sensitive adhesive sheet is low, it is considered that an adhesive residue was generated on the side surface of the chip.
<Comparative example 14>
Since the Shore D hardness of the pressure-sensitive adhesive sheet is high, it is considered that the followability to the bumps is lowered.
1・・・基材フィルム
2・・・紫外線硬化型粘着剤層
3・・・ダイシングされた半導体ウエハ又は基板
4・・・剥離用冶具
DESCRIPTION OF SYMBOLS 1 ... Base film 2 ... Ultraviolet curable adhesive layer 3 ... Dicing semiconductor wafer or substrate 4 ... Peeling jig
Claims (3)
前記紫外線硬化型粘着剤層が、(メタ)アクリル酸エステル共重合体100質量部、光重合性化合物40〜150質量部、多官能イソシアネート硬化剤0.1〜10質量部及び光重合開始剤0.1〜10質量部を含み、
前記基材フィルムの他方の面の動摩擦係数が0.1〜0.8、且つ前記粘着シートのショアD硬度が25〜45であることを特徴とする粘着シート。 A pressure-sensitive adhesive sheet obtained by laminating an ultraviolet curable pressure-sensitive adhesive layer on one surface of a base film,
The UV-curable pressure-sensitive adhesive layer is composed of 100 parts by weight of a (meth) acrylic acid ester copolymer, 40 to 150 parts by weight of a photopolymerizable compound, 0.1 to 10 parts by weight of a polyfunctional isocyanate curing agent, and a photopolymerization initiator 0. 1 to 10 parts by weight,
The pressure-sensitive adhesive sheet is characterized in that the other surface of the base film has a coefficient of dynamic friction of 0.1 to 0.8 and the pressure-sensitive adhesive sheet has a Shore D hardness of 25 to 45.
(a)半導体ウエハ又は基板とリングフレームとを請求項1又は2に記載の粘着シートで貼り付ける貼付工程、
(b)半導体ウエハ又は基板をダイシングして半導体チップ又は半導体部品に加工するダイシング工程、
(c)粘着シートの基材フィルム面に紫外線を照射する紫外線照射工程、
(d)粘着シートの基材フィルム下面を擦って前記半導体チップ又は前記半導体部品を剥離する剥離工程、
とを有する半導体チップ又は半導体部品の製造方法。
The adhesive sheet is a dicing tape,
(A) an attaching step of attaching the semiconductor wafer or substrate and the ring frame with the adhesive sheet according to claim 1,
(B) a dicing process in which a semiconductor wafer or substrate is diced to be processed into a semiconductor chip or a semiconductor component;
(C) an ultraviolet irradiation step of irradiating the base film surface of the adhesive sheet with ultraviolet rays;
(D) a peeling step of peeling the semiconductor chip or the semiconductor component by rubbing the lower surface of the base film of the pressure-sensitive adhesive sheet;
A method for manufacturing a semiconductor chip or a semiconductor component.
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