JP2018056489A - Electronic component - Google Patents
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- JP2018056489A JP2018056489A JP2016193738A JP2016193738A JP2018056489A JP 2018056489 A JP2018056489 A JP 2018056489A JP 2016193738 A JP2016193738 A JP 2016193738A JP 2016193738 A JP2016193738 A JP 2016193738A JP 2018056489 A JP2018056489 A JP 2018056489A
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- 239000000853 adhesive Substances 0.000 claims abstract description 144
- 230000001070 adhesive effect Effects 0.000 claims abstract description 141
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000009835 boiling Methods 0.000 claims abstract description 23
- 238000010521 absorption reaction Methods 0.000 claims abstract description 18
- 239000011521 glass Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 238000005304 joining Methods 0.000 claims description 3
- 239000011247 coating layer Substances 0.000 claims description 2
- 230000008859 change Effects 0.000 abstract description 2
- 239000002184 metal Substances 0.000 description 102
- 229910052751 metal Inorganic materials 0.000 description 102
- 238000010438 heat treatment Methods 0.000 description 20
- 230000000052 comparative effect Effects 0.000 description 16
- 230000007423 decrease Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000000758 substrate Substances 0.000 description 14
- 239000012298 atmosphere Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 8
- 239000006249 magnetic particle Substances 0.000 description 8
- 229910001004 magnetic alloy Inorganic materials 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000000696 magnetic material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coils Of Transformers For General Uses (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
Description
本発明は各種電子機器等に用いる電子部品に関する。 The present invention relates to an electronic component used for various electronic devices.
コイル部品は、コイル状に巻回された導体が接続する電極部（以下、外部電極部）のほかに、実装のために回路には接続しない電極部（以下、ダミー電極部）を有することがある。ダミー電極部は電極板となる金属片を接着剤を用いて磁性コアに、接着される。外部電極部についても、強度向上などの理由で電極板となる金属片を接着剤を用いて磁性コアに、接着されることもある。どちらの電極部でも磁性コアが空隙を有する材質である場合、接着剤が磁性コア内にしみこむことによって、接着力不足となる問題が発生する。このため、磁性コアの表面全体、もしくは、接着される部分を被覆することで、磁性コア表面部およびその近傍部の空隙を塞ぐ対策が取られている。磁性コアが被覆されている場合はその被覆部を介して金属片を接着剤を用いて磁性コアに接着することで固定できる。
The coil component may have an electrode portion (hereinafter referred to as a dummy electrode portion) that is not connected to a circuit for mounting in addition to an electrode portion (hereinafter referred to as an external electrode portion) to which a conductor wound in a coil shape is connected. is there. The dummy electrode part is bonded to a magnetic core using a metal piece as an electrode plate with an adhesive. Also for the external electrode part, a metal piece serving as an electrode plate may be bonded to the magnetic core using an adhesive for reasons such as strength improvement. When the magnetic core is made of a material having a gap in any of the electrode portions, there is a problem that the adhesive force is insufficient due to the adhesive penetrating into the magnetic core. For this reason, a measure is taken to cover the entire surface of the magnetic core or the portion to be bonded, thereby closing the gap on the surface of the magnetic core and its vicinity. When the magnetic core is covered, the metal piece can be fixed by adhering to the magnetic core using an adhesive through the covering portion.
特許文献３には鉄（Ｆｅ）を主成分とする軟磁性合金粉末による磁性コアに接着剤を用いた電極部の接着について述べている。特許文献４は磁性コア同士の接着において、少なくとも一方の磁性コアにガラス層を施し、接着させたコイル部品について述べている。 Patent Document 3 describes adhesion of an electrode portion using an adhesive to a magnetic core made of a soft magnetic alloy powder containing iron (Fe) as a main component. Patent Document 4 describes a coil component obtained by applying a glass layer to at least one magnetic core and bonding the magnetic cores together.
特許文献１に開示される技術では、ダミー端子を接着剤によらず、磁性粉末とバインダーからなる磁性コアの成形時に一体で成形している。この技術では、焼結による磁性コアを製造する場合には適用できず、ダミー端子を粉末と同時に成形するために、型閉じ不良が起こりやすく、成形バリ等の発生要因になっていた。
特許文献２に開示される技術では、ダミー端子を接着テープにより磁性コアに接着している。この技術では、接着テープの接着強度が接着剤使用時よりも低く、またテープ基材の厚みが接着層厚みに加わってしまうため低背部品に向かないこと等が問題となっていた。
In the technique disclosed in Patent Document 1, the dummy terminals are integrally formed at the time of forming a magnetic core made of a magnetic powder and a binder without using an adhesive. This technique cannot be applied to the case of manufacturing a magnetic core by sintering, and since the dummy terminal is formed simultaneously with the powder, a mold closing defect is likely to occur, which causes a generation burr and the like.
In the technology disclosed in Patent Document 2, the dummy terminal is bonded to the magnetic core with an adhesive tape. In this technique, the adhesive strength of the adhesive tape is lower than when an adhesive is used, and the thickness of the tape base material is added to the thickness of the adhesive layer, so that it is not suitable for low-profile parts.
特許文献３に開示される従来技術では、磁性コアは鉄（Ｆｅ）を主成分とする軟磁性合金粉末からなっており、この磁性コアは内部の空隙が大きい。このような内部に空隙の多い磁性コアの表面に直接接着剤を用いて電極部を接着した場合、接着剤が吸湿した状態でリフロー処理をおこなうと、接着剤内部の水分がリフロー処理の熱により接着剤から排出される現象が起こるが磁性コアの内部の空隙からその水分が大気中に放出されるため、接着強度の低下は起こらない。しかし、接着剤が磁性コアにしみこむことによる強度低下問題は解決されない。一方、軟磁性合金粉末どうしの結着材としてガラス質の物質を用いている場合は、磁性コアは鉄（Ｆｅ）を主成分とする軟磁性合金粉末とガラス質の物質によって空隙なく形成される。このため、磁性コアの表面に存在するガラス層を介して電極部を接着剤で接着することとなり、接着剤は透湿性のないガラス層および電極部で挟まれていることになる。この場合、接着剤が磁性コアにしみこむことは解消されているが、接着剤から排出される水分は磁性コア内部へ入らなくなっている。これにより、発生した水分がリフロー処理による熱により磁性コアと電極部の間で急激に膨張し、その応力により電極部の接着強度を低下させるという問題があった。 In the prior art disclosed in Patent Document 3, the magnetic core is made of a soft magnetic alloy powder containing iron (Fe) as a main component, and the magnetic core has a large internal void. When the electrode part is directly bonded to the surface of the magnetic core having a lot of voids inside such an adhesive, if the reflow process is performed while the adhesive absorbs moisture, the moisture inside the adhesive is caused by the heat of the reflow process. Although the phenomenon of being discharged from the adhesive occurs, the moisture is released from the voids inside the magnetic core into the atmosphere, so that the adhesive strength does not decrease. However, the problem of strength reduction due to penetration of the adhesive into the magnetic core is not solved. On the other hand, when a glassy material is used as a binder between the soft magnetic alloy powders, the magnetic core is formed without voids by the soft magnetic alloy powder mainly composed of iron (Fe) and the glassy material. . For this reason, an electrode part will be adhere | attached with an adhesive agent through the glass layer which exists in the surface of a magnetic core, and an adhesive agent will be pinched | interposed with the glass layer and electrode part which do not have moisture permeability. In this case, penetration of the adhesive into the magnetic core is eliminated, but moisture discharged from the adhesive does not enter the magnetic core. As a result, the generated moisture rapidly expands between the magnetic core and the electrode portion due to heat generated by the reflow treatment, and the stress of the electrode portion decreases due to the stress.
特許文献４に開示される従来技術では、透湿性のないガラス層で被覆した２つのコアを接着剤にて接着したときに、接着剤が吸湿した状態でリフローなどの熱処理をおこなうと接着剤からリフロー処理の熱により排出される水分が、両方のガラス層により挟まれているために、大気中に放出されないため、リフロー処理の熱により急激に膨張し、その応力により接着力が低下するという問題があった。 In the prior art disclosed in Patent Document 4, when two cores coated with a non-moisture permeable glass layer are bonded with an adhesive, heat treatment such as reflow is performed from the adhesive when the adhesive absorbs moisture. Since the moisture discharged by the heat of the reflow process is sandwiched between both glass layers, it is not released into the atmosphere, so it expands rapidly due to the heat of the reflow process, and the adhesive strength decreases due to the stress. was there.
このため、急激な温度変化が生じた場合でも、電極部の接着強度の低下など生じることのない電子部品を提供するものである。
For this reason, even when a sudden temperature change occurs, an electronic component that does not cause a decrease in the adhesive strength of the electrode portion or the like is provided.
本発明者らが研究し、検討した結果、以下の内容の本発明を完成した。 As a result of studies and studies by the present inventors, the present invention having the following contents was completed.
電子部品は、磁性素体と、
前記磁性素体の内部に収容されるコイル部と、前記磁性素体の表面に設けられた電極部と、
前記磁性素体と前記電極部を接合する接着剤と、を有し、前記接着剤の煮沸吸水率が０．８重量パーセント以下である。
Electronic components are magnetic elements,
A coil part housed inside the magnetic element body, an electrode part provided on the surface of the magnetic element body,
An adhesive for joining the magnetic element body and the electrode portion, and the boiling water absorption of the adhesive is 0.8 weight percent or less.
電子部品は、磁性素体と、
前記磁性素体の内部に収容されるコイル部と、前記磁性素体の表面に設けられた電極部と、
前記磁性素体と前記電極部を接合する接着剤と、を有し、前記磁性素体と前記電極部を前記電極部の前記磁性素体に対向している面および側面部で接合していてもよい。
Electronic components are magnetic elements,
A coil part housed inside the magnetic element body, an electrode part provided on the surface of the magnetic element body,
An adhesive that joins the magnetic element body and the electrode part, and the magnetic element body and the electrode part are joined at a surface and a side part of the electrode part facing the magnetic element body. Also good.
電子部品は、磁性素体と、
前記磁性素体の内部に収容されるコイル部と、前記磁性素体の表面に設けられた電極部と、
前記磁性素体と前記電極部を接合する接着剤と、を有し、前記磁性素体と前記電極部を前記磁性素体に対向している面を含まず側面部で接合していてもよい。
Electronic components are magnetic elements,
A coil part housed inside the magnetic element body, an electrode part provided on the surface of the magnetic element body,
An adhesive that joins the magnetic element body and the electrode part, and the magnetic element body and the electrode part may be joined by a side part not including a surface facing the magnetic element body. .
本発明は、接着剤を用いて電極部を接着した電子部品において、リフローなどの熱処理を行なっても、接着力の変化を抑制でき、環境変化による影響を受けない電極部の脱離することのない電子部品を得ることができる。
The present invention is capable of suppressing changes in adhesive force even when heat treatment such as reflow is performed on an electronic component having an electrode part bonded using an adhesive, and the electrode part that is not affected by environmental changes can be detached. You can get no electronic components.
以下、図面を参照しながら本発明を詳述する。但し、本発明は図示された態様に限定されるわけでない。また、図面においては発明の特徴的な部分を強調して表現することがあるので、図面各部において縮尺の正確性は必ずしも担保されていない。 Hereinafter, the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the illustrated embodiment. In the drawings, since characteristic portions of the invention are sometimes emphasized and expressed, the accuracy of the scale is not necessarily ensured in each part of the drawings.
図１は本発明の実施例の電子部品の一例の模式斜視図、図２は本発明の実施例の電子部品の一例の模式外観図であり、図２（ａ）はダミー電極固着面、図２（ｂ）は外部電極引き出し面、図２（ｃ）は側面、図２（ｄ）は実装面と対抗する上面、図２（ｅ）は実装面より見た図であり、図３は本発明の電子部品の一例の模式透視図であり、図３（ａ）は外部電極面、図３（ｂ）は側面、図３（ｃ）は上面より透視した図である。本発明の電子部品は磁性素体と電極部、接着剤部とを少なくとも備える。図１から図３の各図には、磁性素体１０１、磁性素体１０１の内部で周回しているコイル１０５、コイルに接続された外部電極部１０３、そしてコイルに接続されていないダミー電極部１０２、磁性素体１０１とダミー電極部１０２の間の接着剤１０４、が描写されている。（コイル巻き線断面の詳細は模式図であるので省略して、慣例により断面外形の対角線を表示して巻き線であることを表示している。） FIG. 1 is a schematic perspective view of an example of an electronic component according to an embodiment of the present invention, FIG. 2 is a schematic external view of an example of an electronic component according to an embodiment of the present invention, and FIG. 2 (b) is an external electrode drawing surface, FIG. 2 (c) is a side surface, FIG. 2 (d) is a top surface facing the mounting surface, FIG. 2 (e) is a view seen from the mounting surface, and FIG. 3A and 3B are schematic perspective views of an example of the electronic component of the invention, in which FIG. 3A is a perspective view from an external electrode surface, FIG. 3B is a side view, and FIG. The electronic component of the present invention includes at least a magnetic element body, an electrode portion, and an adhesive portion. 1 to 3, the magnetic element body 101, a coil 105 that circulates inside the magnetic element body 101, an external electrode part 103 connected to the coil, and a dummy electrode part that is not connected to the coil 102, the adhesive 104 between the magnetic element body 101 and the dummy electrode portion 102 is depicted. (Details of the coil winding cross section are schematic views and are omitted, and the diagonal of the cross sectional outline is displayed by convention to indicate that it is a winding.)
本発明の実施例の電子部品の一例では、磁性素体は合金磁性材料からなる。磁性素体は、もともとは独立していた多数の合金磁性粒子どうしが結合してなる集合体である。磁性素体は、多数の合金磁性粒子からなる圧粉体であるということもできる。少なくとも一部の合金磁性粒子にはその周囲の少なくとも一部、好ましくは概ね全体にわたって酸化膜が形成されていて、この酸化膜により磁性素体の絶縁性が確保される。合金磁性粒子は、鉄（Ｆｅ）を主成分とし、さらには、珪素(Ｓｉ)、アルミニウム(Ａｌ)、クロム（Ｃｒ）、ジルコン(Ｚｒ)、チタン(Ｔｉ)、ニッケル(Ｎｉ)の一つ又は二つ以上の元素を含む。 In an example of the electronic component according to the embodiment of the present invention, the magnetic element body is made of an alloy magnetic material. The magnetic element body is an aggregate formed by combining a number of magnetic alloy particles that were originally independent. It can also be said that the magnetic element is a green compact composed of a large number of alloy magnetic particles. At least some of the alloy magnetic particles have an oxide film formed on at least a part of the periphery of the magnetic particles, preferably almost the whole, and this oxide film ensures the insulation of the magnetic element body. The alloy magnetic particles are mainly composed of iron (Fe), and further, one of silicon (Si), aluminum (Al), chromium (Cr), zircon (Zr), titanium (Ti), nickel (Ni) or Contains two or more elements.
個々の合金磁性粒子の少なくとも一部には、その周囲の少なくとも一部に酸化膜が形成されている。酸化膜は磁性素体を形成する前の原料粒子の段階で形成されていてもよいし、原料粒子の段階では酸化膜が存在しないか極めて少なく存在していて、磁性素体の成形過程において酸化膜を生成させてもよい。好ましくは、酸化膜は合金磁性粒子それ自体が酸化したものからなる。酸化膜の存在により磁性素体全体としての絶縁性が担保される。 An oxide film is formed on at least a part of the periphery of at least a part of each alloy magnetic particle. The oxide film may be formed at the raw material particle stage before forming the magnetic element body, or at the raw material particle stage, the oxide film is not present or very little, and is oxidized during the forming process of the magnetic element body. A film may be generated. Preferably, the oxide film is formed by oxidizing the alloy magnetic particles themselves. The presence of the oxide film ensures the insulation of the entire magnetic element body.
磁性素体の態様および製造方法は従来技術を適宜参照することができる。例えば、スパイラル状の絶縁導線を合金磁性粒子で埋め込んだ後に加熱加圧することによって磁性素体を得てもよい。別の態様によれば、合金磁性粒子を含むグリーンシート上に導体粒子を含むペーストを所定パターンにて印刷して、印刷済みのグリーンシートを積層、加圧、加熱することにより積層インダクタを構成してもよく、その場合は、合金磁性粒子に由来して生成した絶縁体部分が磁性素体であると解釈することができる。 The prior art can be referred to as appropriate for the form and manufacturing method of the magnetic element. For example, the magnetic element body may be obtained by embedding a spiral insulated conductor with alloy magnetic particles and then applying heat and pressure. According to another aspect, a paste including conductive particles is printed in a predetermined pattern on a green sheet including magnetic alloy particles, and the printed green sheet is stacked, pressurized, and heated to form a multilayer inductor. In this case, the insulator portion generated from the alloy magnetic particles can be interpreted as a magnetic element.
本発明の一形態においては、磁性素体はガラス、もしくは例えばエポキシ系、シリコン系等の樹脂によって形成された被覆部を有していてもよい。被覆部は磁性素体に一構成部分として含まれる。被覆部は磁性素体の表面の少なくとも一部で足り、好ましくは、磁性素体の表面全部が被覆部であってもよい。被覆部の形成は後述の電極部の接着に先立って行われる。言い換えると、電極部接着前の電子部品には既にガラス、もしくは例えばエポキシ系、シリコン系等の樹脂により磁性素体の表面は被覆されている。被覆手段は特に限定は無く、従来公知の方法を適宜取り入れることができる。 In one embodiment of the present invention, the magnetic element body may have a covering portion formed of glass or a resin such as an epoxy resin or a silicon resin. The covering portion is included as a component in the magnetic element body. The covering portion may be at least part of the surface of the magnetic element body. Preferably, the entire surface of the magnetic element body may be the covering portion. The covering portion is formed prior to the adhesion of the electrode portion described later. In other words, the surface of the magnetic element body is already covered with glass or a resin such as an epoxy resin or a silicon resin on the electronic component before the electrode portion is bonded. The coating means is not particularly limited, and a conventionally known method can be appropriately adopted.
本発明の一形態においては、磁性素体の表面に、電極部としての金属片が接着される。本発明によれば、電極部の金属片は、接着剤を中間部として磁性素体と直接的に接着される形態であっても良いし、磁性素体に接着剤が固着され、その接着剤が電極部の金属片を固着することで、結果的に接着されていても良い。電極部の金属片は、金属板であっても、金属棒であっても、箔状の金属であってもよく、形状は任意とできる。電極部の数は制限されない。電極部は外部電極部であってもダミー電極部であっても良い。電極部の金属片の材質については、リン青銅、黄銅、ステンレス等特に制限されない。防錆、半田濡れ、接着剤との濡れ等のために金属片に表面処理、もしくは被覆が施されていてもよい。電極部の金属片は、半田実装時の溶融半田との濡れ性と、接着時の接着剤との濡れ性をもって選ばれる。 In one embodiment of the present invention, a metal piece as an electrode portion is bonded to the surface of the magnetic element body. According to the present invention, the metal piece of the electrode portion may be directly bonded to the magnetic element body with an adhesive as an intermediate part, or the adhesive is fixed to the magnetic element body. May be bonded as a result by fixing the metal piece of the electrode part. The metal piece of the electrode part may be a metal plate, a metal bar, or a foil-like metal, and the shape can be arbitrary. The number of electrode parts is not limited. The electrode part may be an external electrode part or a dummy electrode part. The material of the metal piece of the electrode part is not particularly limited, such as phosphor bronze, brass, stainless steel. A surface treatment or coating may be applied to the metal piece for rust prevention, solder wetting, wetting with an adhesive, or the like. The metal piece of the electrode part is selected based on wettability with the molten solder at the time of solder mounting and wettability with the adhesive at the time of bonding.
本発明の一形態においては、磁性素体に電極部の金属片を接着する接着剤は、煮沸吸水率が０．８重量％以下である。煮沸吸水率はＪＩＳ Ｋ７２０９によって評価できる。接着剤に含まれている成分中に、親水性のモノマー/ポリマー等の高分子化合物、親水性の粘度調整剤、親水性の充填材、その他親水性の成分等が多量に含まれると、その接着剤に含まれ得る水分量は大きくなり煮沸吸水率も大きくなる。接着剤の成分とその配合比を適宜選定することより、任意の煮沸吸水率の接着剤を得ることができる。 In one form of this invention, the adhesive which adhere | attaches the metal piece of an electrode part on a magnetic element | base_body has a boiling water absorption rate of 0.8 weight% or less. The boiling water absorption can be evaluated according to JIS K7209. If the component contained in the adhesive contains a large amount of a polymer compound such as a hydrophilic monomer / polymer, a hydrophilic viscosity modifier, a hydrophilic filler, and other hydrophilic components, The amount of water that can be contained in the adhesive increases and the boiling water absorption rate also increases. An adhesive having an arbitrary boiling water absorption can be obtained by appropriately selecting the components of the adhesive and the mixing ratio thereof.
接着剤の煮沸吸水率を０．８重量％以下に保つことで、たとえ磁性素体に金属片が接着された状態でリフローなどの熱処理時に接着剤から水分が発生しても、その発生量が少なくなる。発生した水分の影響は最小限となり、膨張応力として外部に影響を与えないようにできる。このため、本発明において、磁性素体に金属片を電極部として接着されたコイル部品に、リフローなどの熱処理を行なっても電極の接着強度の低下による剥離は生じない。 By keeping the boiling water absorption rate of the adhesive at 0.8% by weight or less, even if moisture is generated from the adhesive during heat treatment such as reflow with a metal piece adhered to the magnetic element, the amount of generation is reduced. Less. The influence of the generated moisture is minimized, and it is possible to prevent the expansion stress from affecting the outside. For this reason, in this invention, even if it heat-processes reflow etc. to the coil components which adhere | attached the metal piece on the magnetic element body as an electrode part, peeling by the fall of the adhesive strength of an electrode does not arise.
本発明の一形態においては、電極部として接着される金属片は、その固着面の一部に開口部が開いている。固着面とは、電極部が磁性素体に接着されている面である。図５ではダミー電極部２０２として接着される金属片は、その固着面の一部に開口部２０６が開いることが示されており、図４では固着面は、ダミー電極部１０２が接着剤１０４によって磁性素体１０１に接着されるており、固着面部分は１０２ａとして示されている。１０２ｂ、１０２ｂ１で示されている部分のように接着されていない金属片部分は、固着面ではない。開口部の形と数は任意に設定できる。好ましくは固着面の面積に対し開口部の面積が３０％以上である。固着面の面積とは、電極部として接着される金属片の、磁性素体の表面に固着された部分、すなわち図５において２０２ａで示されている金属片が磁性素体に固着されている部分の面積と、開口部の面積、すなわち図５においては、２箇所示されている開口部２０６の面積、の合計と定義する。接着剤はこの開口部に充填される。 In one embodiment of the present invention, the metal piece to be bonded as the electrode portion has an opening at a part of its fixing surface. The fixed surface is a surface where the electrode portion is bonded to the magnetic element body. FIG. 5 shows that the metal piece to be bonded as the dummy electrode portion 202 has an opening 206 in a part of its fixing surface. In FIG. 4, the dummy electrode portion 102 is bonded to the adhesive 104 on the fixing surface. Is attached to the magnetic element body 101, and the fixed surface portion is shown as 102a. The metal piece portions that are not bonded, such as the portions indicated by 102b and 102b1, are not fixed surfaces. The shape and number of openings can be set arbitrarily. Preferably, the area of the opening is 30% or more with respect to the area of the fixing surface. The area of the fixing surface is the portion of the metal piece to be bonded as the electrode portion that is fixed to the surface of the magnetic element body, that is, the portion where the metal piece indicated by 202a in FIG. 5 is fixed to the magnetic element body. And the area of the opening, that is, the area of the opening 206 shown in two places in FIG. Adhesive fills this opening.
接着剤はこの開口部の部分では、電極部として接着される金属片に覆われず、大気中に露出することになる。これによって、リフローなどの熱処理時に接着剤内部より発生する水分を大気中に放出することが可能となり、膨張応力として外部に影響を与えないようにできる。
このように、本発明の形態においては、磁性素体の表面に、金属片を電極部として接着されたコイル部品にリフローなどの熱処理を行なっても、電極部の金属片の開口部の部分より露出された接着剤部分から、接着剤内部に発生した水分を大気中に放出することにより、全体としての接着強度の低下による電極部の剥離を生じさせない。
The adhesive is not covered with the metal piece to be bonded as the electrode portion in the opening portion, and is exposed to the atmosphere. As a result, moisture generated from the inside of the adhesive during heat treatment such as reflow can be released into the atmosphere, and the expansion stress can be prevented from being affected externally.
As described above, in the embodiment of the present invention, even if a heat treatment such as reflow is performed on the coil component bonded with the metal piece as an electrode portion on the surface of the magnetic element body, the opening portion of the metal piece of the electrode portion is used. By releasing the moisture generated in the adhesive from the exposed adhesive part into the atmosphere, peeling of the electrode part due to a decrease in the adhesive strength as a whole is not caused.
本発明の一形態においては、電極部として接着される金属片は、その側面部が直線的な面のみではなく、一部がへこんだ曲面、すなわちくびれた側面部となっている。このくびれた側面部とは、金属片の幅の部分がその部分が他の部分より細くなっている部分をいう。
図６で説明すると接着された電極部として、ダミー電極３０２はくびれた領域３０７を有している。くびれた領域の形と数は任意に設定できる。好ましくは、固着面の面積に対してくびれた領域の面積は３０％以上である。固着面の面積とは、電極部として接着される金属片の、磁性素体の表面に固着された部分、すなわち図６において３０２ａで示されている金属片が磁性素体に固着されている部分の面積と、くびれた領域の面積、すなわち図６においては、４箇所示されているであるくびれた領域３０７の面積、の合計と定義する。接着剤は、このくびれた側面部が直線的な側面部の延長された部分との間で作る、くびれた領域にも充填される。
In one embodiment of the present invention, the metal piece to be bonded as the electrode portion has not only a linear surface but also a partially curved surface, that is, a constricted side surface. The constricted side surface portion is a portion where the width of the metal piece is thinner than the other portion.
As shown in FIG. 6, the dummy electrode 302 has a constricted region 307 as the bonded electrode portion. The shape and number of constricted areas can be set arbitrarily. Preferably, the area of the constricted area with respect to the area of the fixing surface is 30% or more. The area of the fixing surface refers to the portion of the metal piece to be bonded as the electrode portion that is fixed to the surface of the magnetic element body, that is, the portion to which the metal piece indicated by 302a in FIG. 6 is fixed to the magnetic element body. And the area of the constricted region, that is, the area of the constricted region 307 shown in four places in FIG. The adhesive is also filled into the constricted area that this constricted side creates between the extended portion of the straight side.
接着剤はこのくびれた領域の部分では、電極部として接着される金属片に覆われず、大気中に露出することになる。これによって、リフローなどの熱処理時に接着剤内部より発生する水分を大気中に放出することが可能となり、膨張応力として外部に影響を与えないようにできる。
このように、本発明の形態によっても、磁性素体の表面に、金属片を電極部として接着されたコイル部品にリフローなどの熱処理を行なっても、電極部の金属片のくびれた領域の部分より露出された接着剤部分から、接着剤内部に発生した水分を大気中に放出することにより、全体としての接着強度の低下による電極部の剥離を生じさせない。
In this constricted region, the adhesive is not covered with the metal piece to be bonded as the electrode portion, and is exposed to the atmosphere. As a result, moisture generated from the inside of the adhesive during heat treatment such as reflow can be released into the atmosphere, and the expansion stress can be prevented from being affected externally.
As described above, even if the heat treatment such as reflow is performed on the coil part bonded with the metal piece as the electrode part on the surface of the magnetic element body according to the embodiment of the present invention, the constricted region part of the metal piece of the electrode part By releasing the moisture generated inside the adhesive from the more exposed adhesive part into the atmosphere, peeling of the electrode part due to a decrease in the adhesive strength as a whole is not caused.
本発明の一形態においては、電極部としての金属片を、磁性素体の表面に接着する接着剤は、電極部としての金属片を磁性素体と接着剤とで挟み込むような形状となっている。
図７で説明すると、接着された電極部としてのダミー電極部１０２の金属片を、磁性素体１０１の表面に接着する接着剤１０４は、ダミー電極部１０２としての金属片を磁性素体１０１と接着剤１０４とで挟み込むような形状となっている。
従来の形態では、接着剤は、電極部としての金属片と磁性素体の中間部にのみに存在する。このため製造上のはみだし等をのぞけば、接着された金属片の側面には接着剤は存在しない。
しかし本発明の一形態においては、接着剤は、電極部としての金属片と磁性素体との中間部には存在せず、その電極部としての金属片の側面および磁性素体の表面とは反対側表面に存在する。
In one embodiment of the present invention, the adhesive that bonds the metal piece as the electrode part to the surface of the magnetic element body has a shape that sandwiches the metal piece as the electrode part between the magnetic element body and the adhesive. Yes.
Referring to FIG. 7, the adhesive 104 that bonds the metal piece of the dummy electrode portion 102 as the bonded electrode portion to the surface of the magnetic element body 101 is the same as the adhesive 104 that bonds the metal piece as the dummy electrode portion 102 to the magnetic element body 101. The shape is such that it is sandwiched between the adhesive 104.
In the conventional form, the adhesive exists only in the intermediate part between the metal piece as the electrode part and the magnetic element body. For this reason, there is no adhesive on the side surfaces of the bonded metal pieces except for the protrusions in production.
However, in one embodiment of the present invention, the adhesive does not exist in the intermediate portion between the metal piece as the electrode portion and the magnetic element body, and the side surface of the metal piece as the electrode portion and the surface of the magnetic element body Present on the opposite surface.
図7(a)では、接着剤１０４は、接着された電極部としてのダミー電極部１０２としての金属片の側面および磁性素体１０１の表面とは反対側表面に存在することが示されている。図７（ｂ）に示すように金属片の固着面の一部に開口部１０６を有し、そこに接着剤１０４が充填されていてもよく、図７（ｃ）に示すように金属片にくびれた側面を有し、それが形成するくびれた領域１０７に接着剤１０４が充填されていてもよい。接着剤１０４は図７(a)に示すように接着された電極部としてのダミー電極部１０２の金属片の両側面を経て、磁性素体１０１の表面との反対面にてつながった形状とすることも、図７（ｄ）に示すようにつながっていないで分離した形状とすることもできる。 FIG. 7A shows that the adhesive 104 exists on the side surface of the metal piece as the dummy electrode portion 102 as the bonded electrode portion and on the surface opposite to the surface of the magnetic element body 101. . As shown in FIG. 7 (b), an opening 106 may be formed in a part of the fixing surface of the metal piece, and the adhesive 104 may be filled there, and the metal piece is attached to the metal piece as shown in FIG. 7 (c). It may have a constricted side surface, and the constricted region 107 formed by it may be filled with the adhesive 104. As shown in FIG. 7A, the adhesive 104 has a shape connected to the opposite surface of the magnetic element body 101 through both side surfaces of the metal piece of the dummy electrode portion 102 as the bonded electrode portion. Alternatively, as shown in FIG. 7 (d), it is possible to have a separated shape without being connected.
本形態における、電極部の金属片の固着面の面積は、電極部として接着される金属片の、磁性素体の表面に固着された部分と、開口部およびくびれた領域の面積の合計と定義する。このとき、接着剤にて２箇所以上がつながっていないで分離した形状で固着されている場合でも、接着剤に挟まれた電極部の金属片の領域を、両方の接着剤によって固着されているとみなして、電極部の金属片の固着面の面積の一部とする。
本発明の一形態においては、金属片の側からみて、その金属片の側面、もしくは金属片の磁性素体の表面との反対側面に接着剤が視認できる。
In this embodiment, the area of the fixing surface of the metal piece of the electrode part is defined as the sum of the area of the metal piece bonded as the electrode part, the part fixed to the surface of the magnetic element body, and the opening and the constricted area. To do. At this time, even when two or more places are not connected by an adhesive and are fixed in a separated shape, the metal piece region of the electrode part sandwiched between the adhesives is fixed by both adhesives. As a part of the area of the fixing surface of the metal piece of the electrode part.
In one embodiment of the present invention, the adhesive can be visually recognized on the side surface of the metal piece or the side surface opposite to the surface of the magnetic element body of the metal piece as viewed from the metal piece side.
本発明の形態によっても、磁性素体の表面に、金属片を電極部として接着されたコイル部品にリフローなどの熱処理を行なっても、電極部の金属片の接着剤部分は、磁性素体の表面との反対面に存在するから、接着剤内部に発生した水分は、大気中に放出されることにより、全体としての接着強度の低下による電極部の剥離を生じさせない。 Even in the form of the present invention, even if a heat treatment such as reflow is performed on the surface of the magnetic element body and the coil part bonded with the metal piece as an electrode part, the adhesive part of the metal piece of the electrode part is Since it exists on the surface opposite to the surface, the moisture generated inside the adhesive is released into the atmosphere and does not cause peeling of the electrode part due to a decrease in the adhesive strength as a whole.
本発明の効果を、実施例を交えて述べる。 The effect of the present invention will be described with examples.
煮沸吸水率はＪＩＳ Ｋ７２０９準拠で測定を行った。熱硬化性エポキシ系接着剤を幅２．５ｍｍ、長さ１００ｍｍ、厚さ１ｍｍの寸法に塗布した後に熱硬化し、乾燥剤を入れたデシケーターで２４時間以上放置した後、重さを量り初期重量とした。この接着剤硬化物を沸騰水中に６０分間放置後、室温の流水中に１０分間放置して冷却し、表面の水分を拭き取り、重さを量り煮沸後重量とした。煮沸吸水率は（煮沸後重量―初期重量）／初期重量をパーセントで表した。 The boiling water absorption was measured according to JIS K7209. After applying thermosetting epoxy adhesive to 2.5mm width, 100mm length and 1mm thickness, heat cure, leave it in a desiccator with desiccant for more than 24 hours, weigh and weigh the initial weight It was. The cured adhesive was allowed to stand in boiling water for 60 minutes, then left in room temperature flowing water for 10 minutes to cool, wipe off surface moisture, and weighed to determine the weight after boiling. The boiling water absorption was expressed as (weight after boiling-initial weight) / initial weight in percent.
図１から図３に示されるコイル部品で、表面をガラスにより被覆した軟磁性合金からなる磁性素体１０１を用い、接着剤１０４に煮沸吸水率がそれぞれ０．３ 、０．６、０．８、１．０、１．２、１，５重量パーセントの接着剤Ａ、接着剤Ｂ、接着剤Ｃ、接着剤Ｄ、接着剤Ｅ、接着剤Ｆを用いて、黄銅製で、幅３ｍｍ×長さ１５ｍｍ×厚み０．１ｍｍの金属片を長さ５ｍｍの部分で９０度に折り曲げたダミー電極１０２を幅３ｍｍ×長さ４ｍｍの部分に接着剤を塗布し、接着後１５０℃２０分乾燥したコイル部品１００を作成、これを各接着剤の条件で２０個ずつ、側面より見て図８に示すように基板に実装した。
各接着剤の条件について５個ずつコイル部品の固着強度を測定し、初期固着強度とした。又、初期固着強度を測定していない残余の別のコイル部品１００について各接着剤の条件１５個ずつを、８５℃８５％の高温高湿環境の試験槽内で１６８時間放置し、試験槽から取り出して直ちに最高温度２６７℃のリフロー処理に投入した。リフロー処理後に室温に戻った基板に実装したコイル部品の固着強度を熱湿後固着強度として各接着剤の条件５個ずつ測定した。
さらにリフロー処理後に室温に戻った基板に実装したコイル部品で熱湿後固着強度測定していない残余の別のコイル部品１００を、各接着剤の条件１０個ずつ、図８で矢印にて示されたｚ方向、２０Ｇの振動試験に投入し、ダミー電極部の剥離した割合を集計した。
各々の試験の結果は、図９に示す。
In the coil component shown in FIGS. 1 to 3, a magnetic element body 101 made of a soft magnetic alloy whose surface is covered with glass is used, and the boiling water absorption rate of the adhesive 104 is 0.3, 0.6, 0.8, respectively. 1.0, 1.2, 1, 5 weight percent adhesive A, adhesive B, adhesive C, adhesive D, adhesive E, adhesive F, made of brass, width 3 mm x length A coil in which a dummy electrode 102 in which a metal piece having a length of 15 mm and a thickness of 0.1 mm is bent at 90 ° at a portion of 5 mm is coated with an adhesive on a portion having a width of 3 mm and a length of 4 mm and then dried at 150 ° C. for 20 minutes. A component 100 was prepared, and 20 pieces thereof were mounted on the substrate as shown in FIG.
For each adhesive condition, the fixing strength of five coil components was measured and used as the initial fixing strength. In addition, the remaining 15 coil components 100 for which the initial adhesion strength was not measured were allowed to stand for 168 hours in a test tank of 85 ° C. and 85% high temperature and humidity environment for 15 hours. Immediately after taking out, it was put into a reflow process at a maximum temperature of 267 ° C. The fixing strength of the coil component mounted on the substrate that had returned to room temperature after the reflow treatment was measured as five fixing conditions for each adhesive as the fixing strength after heat and humidity.
Further, the remaining coil components 100 that have not been measured for adhesion strength after heat and humidity are mounted on a substrate that has returned to room temperature after the reflow process, and are indicated by arrows in FIG. In the z-direction and 20G vibration test, the ratio of peeling of the dummy electrode portion was tabulated.
The results of each test are shown in FIG.
図９の表中に示されている実験番号１〜３が本実施例、実験番号４〜６が比較例である。煮沸吸水率が０．８重量パーセント以下の接着剤を使用した本実施例では、熱湿後固着強度の初期固着強度からの低下がないが、煮沸吸水率が１．０重量パーセント以上の接着剤を使用した比較例では、熱湿後固着強度の初期固着強度からの低下が発生している。さらに、煮沸吸水率が０．８重量パーセント以下の接着剤を使用した本実施例では、振動試験によるダミー電極部の剥離は発生しなかったが、煮沸吸水率が１．０重量パーセント以上の接着剤を使用した比較例では、振動試験によるダミー電極部の剥離が発生し、熱湿後固着強度の初期固着強度からの低下が発生している。 The experiment numbers 1 to 3 shown in the table of FIG. 9 are this example, and the experiment numbers 4 to 6 are comparative examples. In this example using an adhesive having a boiling water absorption of 0.8 weight percent or less, the adhesive strength after boiling was not reduced from the initial fixing strength, but the boiling water absorption was 1.0 weight percent or more. In the comparative example using No., a decrease in the fixing strength after heat and humidity from the initial fixing strength occurs. Further, in this example using an adhesive having a boiling water absorption rate of 0.8 weight percent or less, the dummy electrode portion was not peeled by the vibration test, but the boiling water absorption rate was 1.0 weight percent or more. In the comparative example using the agent, peeling of the dummy electrode portion was caused by the vibration test, and the fixing strength after heat and humidity was lowered from the initial fixing strength.
このことより、煮沸給水率が０．８重量パーセント以下の接着剤を使用することで、リフローなどの熱処理時に接着剤から水分が発生しても、その影響を接着材部内に吸収して最小限とし、膨張応力として外部に影響を与えないようにできる。
また、リフローなどの熱処理後のダミー電極部の磁性体表面からの剥離を防止することができる。
Therefore, by using an adhesive with a boiling water supply rate of 0.8% by weight or less, even if moisture is generated from the adhesive during heat treatment such as reflow, the influence is absorbed into the adhesive part and minimized. It is possible to prevent the expansion stress from affecting the outside.
Further, it is possible to prevent the dummy electrode portion from being peeled off from the magnetic surface after the heat treatment such as reflow.
図１０に示されるコイル部品で、ダミー電極部２０２の固着面に、各々形状が異なる開口部２０６が開いた、図１１（ａ）に接着される部分の模式図が、図１１（ｂ）に側面より見た全体模式図が示されている金属片２０a〜２０ｈを用いて、接着剤に煮沸吸水率が１．０重量パーセントの接着剤Ｄを用いて、それぞれを接着したコイル部品２００を作成した。ダミー電極部は、材質および形状は、開口部を有する以外は実施例１と同等である。磁性素体の表面にある被覆部の所望する位置にあらかじめ接着剤を塗布しておき、金属片を接着剤に押し当てることにより、開口部２０６に接着剤を充填することができる。接着後の乾燥条件は実施例１と同様である。さらに、ダミー電極部の金属片２ｂについては、接着剤に煮沸吸水率が０．３、１．５重量パーセントの接着剤Ａ、接着剤Ｆを用いたそれぞれを接着したコイル部品２００を同様の条件と手順にてあわせて作成し、全ての開口部形状および接着剤の条件について各条件２０個ずつ基板に実装した。
各開口部形状および接着剤の条件について５個ずつコイル部品の固着強度を測定し、初期固着強度とした。又、初期固着強度を測定していない残余の別のコイル部品２００について各開口部形状および接着剤の条件１５個ずつを、８５℃８５％の高温高湿環境の試験槽内で１６８時間放置し、試験槽から取り出して直ちに最高温度２６７℃のリフロー処理に投入した。リフロー処理後に室温に戻った基板に実装したコイル部品の固着強度を熱湿後固着強度として各開口部形状および接着剤の条件５個ずつ測定した。
さらにリフロー処理後に室温に戻った基板に実装したコイル部品で熱湿後固着強度測定していない残余の別のコイル部品２００を、各開口部形状および接着剤の条件１０個ずつ、図８で矢印にて示されたｚ方向、２０Ｇのｚ方向の振動試験に投入し、ダミー電極部の剥離した割合を集計した。
各々の試験の結果は、図１２に示す。
In the coil component shown in FIG. 10, a schematic diagram of a portion to be bonded to FIG. 11A in which openings 206 having different shapes are opened on the fixing surface of the dummy electrode portion 202 is shown in FIG. Using the metal pieces 20a to 20h shown in the schematic view from the side, the adhesive D having a boiling water absorption rate of 1.0 weight percent is used as the adhesive, and the coil component 200 is prepared by adhering each of them. did. The material and shape of the dummy electrode portion are the same as those of the first embodiment except that the dummy electrode portion has an opening. The opening 206 can be filled with an adhesive by applying an adhesive in advance to a desired position of the covering portion on the surface of the magnetic element body and pressing a metal piece against the adhesive. The drying conditions after bonding are the same as in Example 1. Further, for the metal piece 2b of the dummy electrode portion, the coil component 200 in which the boiling water absorption is 0.3, 1.5% by weight, and the coil component 200 is bonded under the same conditions. And 20 steps for each opening shape and adhesive condition were mounted on the substrate.
For each opening shape and adhesive conditions, the fixing strength of the coil component was measured five by five to obtain the initial fixing strength. Further, for each remaining coil component 200 whose initial adhesion strength was not measured, each of the opening shape and the adhesive condition of 15 pieces was left in a test chamber in a high temperature and high humidity environment of 85 ° C. and 85% for 168 hours. The sample was taken out from the test tank and immediately put into a reflow process at a maximum temperature of 267 ° C. The fixing strength of the coil component mounted on the substrate returned to room temperature after the reflow treatment was measured as the fixing strength after heat and humidity for each of the five openings and the adhesive conditions.
Further, the remaining coil components 200 that have not been measured for the bonding strength after heat and humidity are mounted on the substrate that has returned to room temperature after the reflow treatment, and each of the opening shape and the adhesive conditions are 10 in FIG. The z-direction and 20G z-direction vibration tests shown in FIG.
The results of each test are shown in FIG.
図１２の表中に示されている実験番号１０〜１６が本実施例、実験番号１７〜１９が比較例である。ダミー電極部の金属片の固着面の開口部の面積が３０パーセント以上の金属片を使用した本実施例では、熱湿後固着強度の初期固着強度からの低下がないが、ダミー電極部の金属片の固着面の開口部の面積が３０パーセント未満の金属片を使用した比較例では、熱湿後固着強度の初期固着強度からの低下が発生している。さらに、ダミー電極部の金属片の固着面の開口部の面積が３０パーセント以上の金属片を使用した本実施例では、振動試験によるダミー電極部の剥離は発生しなかったが、ダミー電極部の金属片の固着面の開口部の面積が３０パーセント未満の金属片を使用した比較例では、振動試験によるダミー電極部の剥離が発生し、熱湿後固着強度の初期固着強度からの低下が発生している。 The experiment numbers 10 to 16 shown in the table of FIG. 12 are the present example, and the experiment numbers 17 to 19 are the comparative examples. In the present embodiment using the metal piece having an opening area of 30% or more of the fixing surface of the metal piece of the dummy electrode portion, there is no decrease from the initial fixing strength after heat and humidity, but the metal of the dummy electrode portion In the comparative example using a metal piece having an opening area of less than 30% on the fixing surface of the piece, the fixing strength after heat and humidity is lowered from the initial fixing strength. Further, in this example using a metal piece having an area of the opening portion of the fixing surface of the dummy electrode portion of 30% or more, peeling of the dummy electrode portion by the vibration test did not occur. In a comparative example using a metal piece with an opening area of less than 30% on the fixing surface of the metal piece, the dummy electrode part was peeled off by a vibration test, and the sticking strength after heat and humidity was lowered from the initial fixing strength. doing.
さらに、同じダミー電極部の金属片の固着面の開口部の面積が３０パーセントの金属片を使用し、煮沸水分率がそれぞれ０．３、１．０、１．５重量パーセントである接着剤Ａ、接着剤Ｄ、接着剤Ｆを用いた場合においても、熱湿後固着強度の初期固着強度からの低下および、振動試験によるダミー電極部の剥離は発生しない。 Further, an adhesive A using a metal piece with an area of the opening of the fixing surface of the metal piece of the same dummy electrode portion of 30 percent and having a boiling moisture content of 0.3, 1.0, and 1.5 weight percent, respectively. Even in the case of using the adhesive D and the adhesive F, neither the decrease in the initial fixing strength after the heat and humidity nor the peeling of the dummy electrode portion due to the vibration test occurs.
これらのことより、ダミー電極部の金属片の固着面に開口部を設けることで、リフローなどの熱処理時に接着剤から水分が発生しても、その発生した水分を金属片の開口部に露出している接着剤部分より放出し、膨張応力として外部に影響を与えないようにでき、リフローなどの熱処理後のダミー電極部の磁性体表面からのはがれを防止することができる。
金属片の開口部が固着面面積の３０パーセント以上であれば、その発生した水分を放出することで、膨張応力として外部に影響を与えないようにでき、リフローなどの熱処理後のダミー電極部の磁性体表面からの剥離を防止することができる。
For these reasons, by providing an opening in the fixing surface of the metal piece of the dummy electrode portion, even if moisture is generated from the adhesive during heat treatment such as reflow, the generated moisture is exposed to the opening of the metal piece. It can be released from the adhesive part that is present, and can be prevented from affecting the outside as an expansion stress, and peeling of the dummy electrode part after the heat treatment such as reflow from the surface of the magnetic material can be prevented.
If the opening of the metal piece is 30% or more of the fixed surface area, the generated moisture can be released so that the expansion stress does not affect the outside, and the dummy electrode portion after the heat treatment such as reflow can be prevented. Peeling from the magnetic material surface can be prevented.
図１３に示されるコイル部品は、ダミー電極部３０２として接着される金属片について、その金属片の側面部が直線的な面ではなく、一部がへこんだ曲がった面、すなわちくびれた面となっており、このくびれた面が直線的な面の延長された部分との間で作る、くびれた領域３０７を有する。図１４（ａ）に接着される部分の模式図が、図１４（ｂ）に側面より見た全体模式図が示されている金属片３０a〜３０ｇを用いて、接着剤に煮沸吸水率が１．０重量パーセントの接着剤Ｄを用いて、それぞれを接着したコイル部品３００を作成し、これらの各くびれた領域の形状の条件２０個ずつ基板に実装した。ダミー電極部は、材質および形状は、くびれた領域を有する以外は実施例１と同等である。磁性素体の表面の被覆層の所望する位置にあらかじめ接着剤を塗布しておき、金属片を接着剤に押し当てることにより、くびれた領域３０７に接着剤を充填することができる。接着後の乾燥条件は実施例１と同様である。
各くびれた領域の形状の条件について５個ずつコイル部品の固着強度を測定し、初期固着強度とした。又、初期固着強度を測定していない残余の別のコイル部品３００について各くびれた領域の形状の条件１５個ずつを、８５℃８５％の高温高湿環境の試験槽内で１６８時間放置し、試験槽から取り出して直ちに最高温度２６７℃のリフロー処理に投入した。リフロー処理後に室温に戻った基板に実装したコイル部品の固着強度を熱湿後固着強度として各くびれた領域の形状の条件５個ずつ測定した。
さらにリフロー処理後に室温に戻った基板に実装したコイル部品で熱湿後固着強度測定していない残余の別のコイル部品３００を、各くびれた領域の形状の条件１０個ずつ、図８で矢印にて示された２０Ｇのｚ方向の振動試験に投入し、ダミー電極部の剥離した割合を集計した。
各々の試験の結果は、図１５に示す。
In the coil component shown in FIG. 13, with respect to the metal piece to be bonded as the dummy electrode portion 302, the side surface portion of the metal piece is not a straight surface, but a curved surface with a part of it, that is, a constricted surface. And has a constricted region 307 that forms between the constricted surface and an extended portion of a straight surface. The schematic diagram of the part to be bonded to Fig. 14 (a) uses the metal pieces 30a to 30g whose entire schematic diagram is shown from the side in Fig. 14 (b), and the boiling water absorption is 1 for the adhesive. Using 0.0 weight percent of the adhesive D, the coil parts 300 bonded to each other were prepared, and 20 pieces of the conditions of the shape of each constricted region were mounted on the substrate. The dummy electrode portion has the same material and shape as those of the first embodiment except that the dummy electrode portion has a constricted region. By applying an adhesive in advance to a desired position of the coating layer on the surface of the magnetic element body and pressing a metal piece against the adhesive, the constricted region 307 can be filled with the adhesive. The drying conditions after bonding are the same as in Example 1.
With respect to the conditions of the shape of each constricted region, the fixing strength of five coil parts was measured and used as the initial fixing strength. In addition, 15 pieces of constricted region shape conditions for the remaining another coil component 300 for which the initial adhesion strength was not measured were left in a test bath in a high-temperature and high-humidity environment at 85 ° C. and 85% for 168 hours. The sample was taken out from the test tank and immediately put into a reflow treatment at a maximum temperature of 267 ° C. Five conditions of the shape of each constricted region were measured as the fixing strength after heating and humidifying the fixing strength of the coil component mounted on the substrate returned to room temperature after the reflow treatment.
Further, the remaining 10 coil components 300 which have not been measured after heat-humidity and are not mounted on the coil component mounted on the substrate that has returned to room temperature after the reflow treatment are subjected to the arrows in FIG. The 20G z-direction vibration test shown in FIG.
The results of each test are shown in FIG.
図１５の表中に示されている実験番号２０〜２３が本実施例、実験番号２４〜２６が比較例である。ダミー電極部の金属片の側面がくびれた面をとなっており、このくびれた面が直線的な面の延長された部分との間で作る、いわゆるくびれた領域の面積が、ダミー電極部の固着面といわゆるくびれた領域を合わせた面積の３０パーセント以上の金属片を使用した本実施例では、熱湿後固着強度の初期固着強度からの低下がないが、ダミー電極部の金属片のいわゆるくびれた領域の面積が、ダミー電極部の固着面といわゆるくびれた領域を合わせた面積の３０パーセント未満の金属片を使用した比較例では、熱湿後固着強度の初期固着強度からの低下が発生している。さらに、ダミー電極部の金属片のいわゆるくびれた領域の面積が、ダミー電極部の固着面といわゆるくびれた領域を合わせた面積の３０パーセント以上の金属片を使用した本実施例では、振動試験によるダミー電極部の剥離は発生しなかったが、ダミー電極部の金属片のいわゆるくびれた領域の面積が、ダミー電極部の固着面といわゆるくびれた領域を合わせた面積の３０パーセント未満の金属片を使用した比較例では、振動試験によるダミー電極部の剥離が発生し、やはり熱湿後固着強度の初期固着強度からの低下が発生している。 The experiment numbers 20 to 23 shown in the table of FIG. 15 are the present examples, and the experiment numbers 24 to 26 are the comparative examples. The side surface of the metal piece of the dummy electrode part has a constricted surface, and the area of the so-called constricted area formed between the constricted surface and the extended part of the linear surface is In the present embodiment using a metal piece of 30% or more of the combined area of the fixing surface and the so-called constricted area, the fixing strength after heat and humidity does not decrease from the initial fixing strength. In the comparative example using a metal piece whose constricted area is less than 30% of the area where the constricted area of the dummy electrode portion and the constricted area are combined, a decrease in the initial adhering strength after heat and humidity occurs. doing. Furthermore, in the present embodiment using a metal piece whose area of the so-called constricted region of the metal piece of the dummy electrode portion is 30% or more of the combined area of the fixing surface of the dummy electrode portion and the so-called constricted region, the vibration test is performed. Although the peeling of the dummy electrode portion did not occur, a metal piece having a so-called constricted area of the metal piece of the dummy electrode portion having a metal piece of less than 30% of an area obtained by combining the fixing surface of the dummy electrode portion and the so-called constricted area. In the comparative example used, peeling of the dummy electrode portion due to the vibration test occurred, and the sticking strength after heat and humidity also decreased from the initial sticking strength.
これらのことより、ダミー電極部の金属片の固着面にいわゆるくびれた領域を設けることで、リフローなどの熱処理時に接着剤から水分が発生しても、その発生した水分を金属片のいわゆるくびれた領域に露出している接着剤部分より放出し、膨張応力として外部に影響を与えないようにでき、リフローなどの熱処理後のダミー電極部の磁性体表面からのはがれを防止することができる。
この場合、金属片のいわゆるくびれた領域の面積が、ダミー電極部の固着面といわゆるくびれた領域を合わせた面積の３０パーセント以上であれば、その発生した水分を放出することで、膨張応力として外部に影響を与えないようにでき、リフローなどの熱処理後のダミー電極部の磁性体表面からの剥離を防止することができる。
Therefore, by providing a so-called constricted area on the fixing surface of the metal piece of the dummy electrode portion, even if water is generated from the adhesive during heat treatment such as reflow, the generated water is constricted. It can be released from the adhesive portion exposed in the region and can not affect the outside as an expansion stress, and the peeling of the dummy electrode portion after the heat treatment such as reflow from the surface of the magnetic material can be prevented.
In this case, if the area of the so-called constricted region of the metal piece is 30% or more of the combined area of the fixing surface of the dummy electrode portion and the so-called constricted region, the generated moisture is released, so that the expansion stress is obtained. It is possible to prevent the outside from being affected, and it is possible to prevent the dummy electrode portion after the heat treatment such as reflow from being separated from the surface of the magnetic material.
図１６のコイル部品で、ダミー電極部４０２として接着される金属片について、図１６（ａ）は、開口部や、くびれた領域がない実施例１と同じ金属片を、図１６（ｂ）は開口部４０６を有する実施例２と同じ金属片２０ｂを、図１６（ｃ）はくびれた領域４０７を有する実施例３と同じ金属片３０ｅを、それぞれ用い、接着剤４０４として煮沸吸水率が１．０重量パーセントの接着剤Ｄを用いて、金属片の固着部の両側面部とそれに連続して金属片の磁性素体４０１とは反対側の表面に接着剤を塗布したものをそれぞれ磁性素体４０１に接着したコイル部品４００を作成し、これらを各接着剤塗布形状および金属片の形状条件２０個ずつ基板に実装した。
各接着剤塗布形状および金属片の形状条件について５個ずつコイル部品の固着強度を測定し、初期固着強度とした。又、初期固着強度を測定していない残余の別のコイル部品４００について各接着剤塗布形状および金属片の形状条件１５個ずつを、８５℃８５％の高温高湿環境の試験槽内で１６８時間放置し、試験槽から取り出して直ちに最高温度２６７℃のリフロー処理に投入した。リフロー処理後に室温に戻った基板に実装したコイル部品の固着強度を熱湿後固着強度として各接着剤塗布形状および金属片の形状条件５個ずつ測定した。さらにリフロー処理後に室温に戻った基板に実装したコイル部品で熱湿後固着強度測定していない残余の別のコイル部品４００を、各接着剤塗布形状および金属片の形状条件１０個ずつ、図８で矢印にて示された２０Ｇのｚ方向の振動試験に投入し、ダミー電極部の剥離した割合を集計した。
各々の試験の結果は、図１７に示す。
With respect to the metal piece to be bonded as the dummy electrode portion 402 in the coil component of FIG. 16, FIG. 16 (a) shows the same metal piece as in Example 1 having no opening or constricted area, and FIG. The same metal piece 20b as in Example 2 having the opening 406, and the same metal piece 30e as in Example 3 having the constricted region 407 in FIG. 16C are used, respectively. The magnetic element body 401 is formed by applying an adhesive agent to both sides of the fixed portion of the metal piece and the surface opposite to the magnetic element body 401 of the metal piece using 0 weight percent of the adhesive D. The coil component 400 adhered to the substrate was prepared, and these were mounted on the substrate by 20 adhesive application shapes and 20 metal piece shape conditions.
For each of the adhesive application shape and the metal piece shape condition, the adhesion strength of the coil components was measured five by five to obtain the initial adhesion strength. Further, for the remaining another coil component 400 for which the initial fixing strength was not measured, each of the adhesive application shape and the metal piece shape condition of 15 pieces was subjected to 168 hours in a test chamber in a high temperature and high humidity environment of 85 ° C. and 85%. It was left to stand, taken out from the test tank, and immediately put into a reflow process at a maximum temperature of 267 ° C. The adhesive strength of the coil component mounted on the substrate that had returned to room temperature after the reflow treatment was measured as the adhesive strength after heat and humidity, and for each of the adhesive application shape and the metal piece shape conditions. Further, the remaining coil components 400 that have not been measured for the bonding strength after heat and humidity are mounted on the substrate that has returned to room temperature after the reflow treatment, and each of the adhesive application shape and the metal piece shape conditions are 10 pieces, respectively, as shown in FIG. Was put into a vibration test in the z direction of 20 G indicated by an arrow, and the ratio of peeling of the dummy electrode portion was tabulated.
The results of each test are shown in FIG.
図１７の表中に示されている実験番号３０〜３２が本実施例、実験番号３３〜３５が比較例である。ダミー電極部の金属片の開口部面積、くびれた領域の面積、側面部に接着剤のある領域の合計された接着部面積が、ダミー電極部の固着面の面積の５５パーセント以上の金属片を使用した本実施例では、熱湿後固着強度の初期固着強度からの低下がないが、ダミー電極部の金属片の開口部面積、くびれた領域の面積、側面部に接着剤のある領域の合計された接着部面積が、ダミー電極部の固着面の面積の５５パーセント未満の金属片を使用した比較例では、熱湿後固着強度の初期固着強度からの低下が発生している。さらに、本実施例では、振動試験によるダミー電極部の剥離は発生しなかったが、比較例では、振動試験によるダミー電極部の剥離が発生し、やはり熱湿後固着強度の初期固着強度からの低下が発生している。 The experiment numbers 30 to 32 shown in the table of FIG. 17 are this example, and the experiment numbers 33 to 35 are comparative examples. A metal piece having an opening area of the metal piece of the dummy electrode portion, an area of the constricted region, and a total adhesion portion area of the region having the adhesive on the side surface portion is 55% or more of the area of the fixing surface of the dummy electrode portion. In this example used, there is no decrease from the initial fixing strength of the fixing strength after heat and humidity, but the total area of the opening area of the metal piece of the dummy electrode part, the area of the constricted area, and the area with the adhesive on the side surface part In the comparative example using a metal piece having a bonded area of less than 55% of the area of the fixing surface of the dummy electrode portion, the fixing strength after heat and humidity is reduced from the initial fixing strength. Furthermore, in this example, peeling of the dummy electrode portion due to the vibration test did not occur, but in the comparative example, peeling of the dummy electrode portion due to the vibration test occurred, and again from the initial sticking strength of the sticking strength after heat and humidity. A decline has occurred.
これらのことより、ダミー電極部の金属片の固着面を両側面および磁性素体と反対側表面より接着剤で磁性素体に接着固定することで、リフローなどの熱処理時に接着剤から水分が発生しても、その発生した水分を露出している接着剤部分より放出し、膨張応力として外部に影響を与えないようにでき、リフローなどの熱処理後のダミー電極部の磁性体表面からのはがれを防止することができる。この場合、固着する接着剤の塗布面積は、金属片の開口部面積、もしくは、くびれた領域の面積が、ダミー電極部の固着面と開口部、もしくは、いわゆるくびれた領域を合わせた面積の５５パーセント以上であることが、固着力の観点から望ましく、フローなどの熱処理後のダミー電極部の磁性体表面からの剥離を防止することができる。
Therefore, moisture is generated from the adhesive during heat treatment such as reflow by attaching and fixing the metal electrode fixing surface of the dummy electrode part to the magnetic element with adhesive from both sides and the surface opposite to the magnetic element. However, it is possible to release the generated moisture from the exposed adhesive part so that the expansion stress does not affect the outside, and the dummy electrode part after the heat treatment such as reflow is peeled off from the magnetic surface. Can be prevented. In this case, the application area of the adhesive to be fixed is 55, which is the opening area of the metal piece or the area of the constricted area, which is the sum of the adhering surface of the dummy electrode part and the opening or the so-called constricted area. The percentage or more is desirable from the viewpoint of the adhesion force, and the peeling of the dummy electrode portion after the heat treatment such as the flow from the surface of the magnetic material can be prevented.
１０１、２０１、３０１，４０１…磁性素体、
１０２、２０２、３０２、４０２…ダミー電極部、
１０３、１０３ａ、１０３ｂ、２０２ａ、２０２ｂ、３０２ａ、３０２ｂ、４０２ａ、４０２ｂ…電極部、
１０４、４０４…接着剤、
１０５・・・コイル部
１０６、２０６、３０６、４０６…開口部
１０７、２０７、３０７、４０７…くびれた領域
１１０・・・半田 １１２・・・基板
101, 201, 301, 401 ... magnetic element,
102, 202, 302, 402 ... dummy electrode part,
103, 103a, 103b, 202a, 202b, 302a, 302b, 402a, 402b ... electrode part,
104, 404 ... adhesive,
105 ... Coil portions 106, 206, 306, 406 ... Openings 107, 207, 307, 407 ... Constricted region 110 ... Solder 112 ... Substrate
Claims (9)
前記磁性素体の内部に収容されるコイル部と、
前記磁性素体の表面に設けられた電極部と、
前記磁性素体と前記電極部を接合する煮沸吸水率が０．８重量パーセント以下接着剤と、
を有する電子部品 A magnetic element;
A coil portion housed inside the magnetic element body;
An electrode portion provided on the surface of the magnetic element body;
An adhesive having a boiling water absorption rate of 0.8 weight percent or less for joining the magnetic element body and the electrode part;
Electronic parts with
前記磁性素体の内部に収容されるコイル部と、
前記磁性素体の表面に設けられた電極部と
前記磁性素体と前記電極部を前記電極部の前記磁性素体に対向している面および側面部で接合する接着剤と、
を有する電子部品。 A magnetic element;
A coil portion housed inside the magnetic element body;
An electrode part provided on a surface of the magnetic element body, an adhesive for joining the magnetic element body and the electrode part at a surface and a side part of the electrode part facing the magnetic element body;
Having electronic components.
前記磁性素体の内部に収容されるコイル部と、
前記磁性素体の表面に設けられた電極部と
前記磁性素体と前記電極部を前記磁性素体に対向している面を含まず側面部で接合する接着剤と、
を有する電子部品。 A magnetic element;
A coil portion housed inside the magnetic element body;
An electrode part provided on a surface of the magnetic element body, an adhesive that joins the magnetic element body and the electrode part at a side surface part not including a surface facing the magnetic element body;
Having electronic components.
前記開口部部分の面積は、前記電極部の接合部の面積、即ち前記電極部の前記開口部部分を含み前記接着剤により固定されている面であって、前記磁性素体に対向している面の面積に対して、３０％以上である請求項１から３の一に記載の電子部品。 The electrode portion has an opening filled with the adhesive and exposed,
The area of the opening portion is the area of the joint portion of the electrode portion, that is, the surface including the opening portion of the electrode portion and fixed by the adhesive, and is opposed to the magnetic element body. The electronic component according to claim 1, wherein the electronic component is 30% or more with respect to the area of the surface.
前記第１の電極部と絶縁された第２の電極部とよりなり、
前記接着剤は、前記第２の電極部と前記磁性素体を接合している請求項１から８の一に記載の電子部品。 A pair of first electrode portions in which the electrode portions are led out from both ends of the coil portion;
The first electrode portion and the insulated second electrode portion;
The electronic component according to claim 1, wherein the adhesive joins the second electrode portion and the magnetic element body.
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| JP2018186243A (en) * | 2017-04-27 | 2018-11-22 | 太陽誘電株式会社 | Coil component |
| WO2023163168A1 (en) * | 2022-02-28 | 2023-08-31 | パナソニックＩｐマネジメント株式会社 | Inductor |
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