JP2018051945A - ダイヤモンドツール及びそのスクライブ方法 - Google Patents
ダイヤモンドツール及びそのスクライブ方法 Download PDFInfo
- Publication number
- JP2018051945A JP2018051945A JP2016191079A JP2016191079A JP2018051945A JP 2018051945 A JP2018051945 A JP 2018051945A JP 2016191079 A JP2016191079 A JP 2016191079A JP 2016191079 A JP2016191079 A JP 2016191079A JP 2018051945 A JP2018051945 A JP 2018051945A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- scribing
- point
- diamond tool
- top surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
- C03B33/105—Details of cutting or scoring means, e.g. tips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/10—Glass-cutting tools, e.g. scoring tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Dicing (AREA)
Abstract
Description
11 ベース
12 上面(ガイド面)
12a〜12d 頂点
13a〜13d 外周面
14,15 等分線
14a,14b,15a,15b 切片
16a〜16d 天面
17a〜17h 傾斜面
18a〜18d 稜線
P1〜P4 ポイント
Claims (5)
- 上面とこれに垂直な複数の外周面を含む角柱形のベースと、
前記角柱の上面の各角に、上面の当該角を含み、上面を等分する等分線に垂直な線が切片となるように上面から傾斜した天面と、当該角を含む隣接する2つの外周面から当該頂点に向けて傾斜した一対の傾斜面と、を具備し、前記上面をガイド面とし、前記一対の傾斜面と前記天面との交点をポイントとするダイヤモンドツール。 - 前記ガイド面の長さが0.8mm以上である請求項1記載のダイヤモンドツール。
- 前記角柱形のベースは四角柱であり、前記上面が正方形であって、前記上面の一辺の長さが0.7mm以上である請求項1記載のダイヤモンドツール。
- 請求項1記載のダイヤモンドツールを用いたスクライブ方法であって、
前記ダイヤモンドツールのポイントが最下位となるようにスクライブヘッドに保持し、
基板の外側で前記ポイントが前記基板の上面より下方となるようにスクライブヘッドを押し下げ、
前記スクライブヘッドを基板の面に平行に移動させることによって基板の端部に前記ガイド面を接触させ、前記基板端部において前記ガイド面が所定距離摺動した後で前記天面が前記基板端部に接触して外切りスクライブを開始するスクライブ方法。 - 基板の端部までスクライブし、前記稜線の一部が基板の端部を押圧しながら離れることでスクライブを終了するようにする請求項4に記載のスクライブ方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016191079A JP2018051945A (ja) | 2016-09-29 | 2016-09-29 | ダイヤモンドツール及びそのスクライブ方法 |
TW106127235A TW201815540A (zh) | 2016-09-29 | 2017-08-11 | 鑽石工具及其劃線方法 |
KR1020170116148A KR20180035668A (ko) | 2016-09-29 | 2017-09-11 | 다이아몬드 툴 및 이의 스크라이빙 방법 |
CN201710839501.2A CN107877716A (zh) | 2016-09-29 | 2017-09-15 | 金刚石刀具及其划线方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016191079A JP2018051945A (ja) | 2016-09-29 | 2016-09-29 | ダイヤモンドツール及びそのスクライブ方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2018051945A true JP2018051945A (ja) | 2018-04-05 |
Family
ID=61780689
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016191079A Ceased JP2018051945A (ja) | 2016-09-29 | 2016-09-29 | ダイヤモンドツール及びそのスクライブ方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2018051945A (ja) |
KR (1) | KR20180035668A (ja) |
CN (1) | CN107877716A (ja) |
TW (1) | TW201815540A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200180994A1 (en) * | 2018-12-06 | 2020-06-11 | Schott Ag | Glass element with cut edge and method of producing same |
WO2020261552A1 (en) * | 2019-06-28 | 2020-12-30 | Nec Corporation | Spoofing detection apparatus, spoofing detection method, and computer-readable storage medium |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5718647U (ja) * | 1980-07-04 | 1982-01-30 | ||
JPH11314928A (ja) * | 1997-09-25 | 1999-11-16 | Beldex:Kk | スクライブ装置および方法 |
JP2001322824A (ja) * | 2000-05-10 | 2001-11-20 | Mitsuboshi Diamond Industrial Co Ltd | スクライブ法およびこれに基づくスクライブ装置 |
US20070089304A1 (en) * | 2005-10-05 | 2007-04-26 | Loomis James W | Automatic tool tilting apparatus for a scribe tool |
JP2015063020A (ja) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | スクライブヘッド、スクライブ装置およびスクライブ方法 |
JP2016132181A (ja) * | 2015-01-20 | 2016-07-25 | 三星ダイヤモンド工業株式会社 | マルチポイントダイヤモンドツール |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100410196C (zh) * | 2001-11-08 | 2008-08-13 | 夏普株式会社 | 切割玻璃基体的方法和装置、液晶板以及制造液晶板的装置 |
CN1668431B (zh) * | 2002-07-18 | 2010-06-09 | 三星钻石工业股份有限公司 | 脆性材料的划线方法、划线头及带有该划线头的划线装置 |
KR20070103188A (ko) * | 2006-04-18 | 2007-10-23 | 주식회사 탑 엔지니어링 | 기판 스크라이브 장치 |
JP2011088382A (ja) * | 2009-10-23 | 2011-05-06 | Mitsuboshi Diamond Industrial Co Ltd | ブレイク装置およびブレイク方法 |
JP2011155151A (ja) * | 2010-01-27 | 2011-08-11 | Mitsuboshi Diamond Industrial Co Ltd | 薄膜太陽電池用スクライブ装置 |
TWI498293B (zh) * | 2011-05-31 | 2015-09-01 | Mitsuboshi Diamond Ind Co Ltd | 劃線方法、鑽石尖、劃線裝置 |
CN203487032U (zh) * | 2013-09-18 | 2014-03-19 | 永润应用材料股份有限公司 | 用于光学玻璃的切割设备及其钻石刀 |
CN203639329U (zh) * | 2013-11-08 | 2014-06-11 | 蚌埠朝阳玻璃机械有限公司 | 一种玻璃切割机刀盒 |
-
2016
- 2016-09-29 JP JP2016191079A patent/JP2018051945A/ja not_active Ceased
-
2017
- 2017-08-11 TW TW106127235A patent/TW201815540A/zh unknown
- 2017-09-11 KR KR1020170116148A patent/KR20180035668A/ko not_active Application Discontinuation
- 2017-09-15 CN CN201710839501.2A patent/CN107877716A/zh not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5718647U (ja) * | 1980-07-04 | 1982-01-30 | ||
JPH11314928A (ja) * | 1997-09-25 | 1999-11-16 | Beldex:Kk | スクライブ装置および方法 |
JP2001322824A (ja) * | 2000-05-10 | 2001-11-20 | Mitsuboshi Diamond Industrial Co Ltd | スクライブ法およびこれに基づくスクライブ装置 |
US20070089304A1 (en) * | 2005-10-05 | 2007-04-26 | Loomis James W | Automatic tool tilting apparatus for a scribe tool |
JP2015063020A (ja) * | 2013-09-24 | 2015-04-09 | 三星ダイヤモンド工業株式会社 | スクライブヘッド、スクライブ装置およびスクライブ方法 |
JP2016132181A (ja) * | 2015-01-20 | 2016-07-25 | 三星ダイヤモンド工業株式会社 | マルチポイントダイヤモンドツール |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20200180994A1 (en) * | 2018-12-06 | 2020-06-11 | Schott Ag | Glass element with cut edge and method of producing same |
US11851361B2 (en) * | 2018-12-06 | 2023-12-26 | Schott Ag | Glass element with cut edge and method of producing same |
WO2020261552A1 (en) * | 2019-06-28 | 2020-12-30 | Nec Corporation | Spoofing detection apparatus, spoofing detection method, and computer-readable storage medium |
Also Published As
Publication number | Publication date |
---|---|
TW201815540A (zh) | 2018-05-01 |
KR20180035668A (ko) | 2018-04-06 |
CN107877716A (zh) | 2018-04-06 |
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