JP2018043308A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2018043308A JP2018043308A JP2016178860A JP2016178860A JP2018043308A JP 2018043308 A JP2018043308 A JP 2018043308A JP 2016178860 A JP2016178860 A JP 2016178860A JP 2016178860 A JP2016178860 A JP 2016178860A JP 2018043308 A JP2018043308 A JP 2018043308A
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- Prior art keywords
- cutting
- blade
- air
- cleaning water
- supply nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 54
- 238000004140 cleaning Methods 0.000 claims abstract description 40
- 238000001514 detection method Methods 0.000 claims description 26
- 239000002699 waste material Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 abstract description 21
- 230000009545 invasion Effects 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
6 チャックテーブル
32 切削ユニット
38 切削ブレード
42 加工室ケーシング
44 加工室
46 非接触セットアップ機構(ブレード端部検出機構)
62 取り付け部材
63 ブレード侵入部
64 発光部
65 光学センサ
66 受光部
68 洗浄水供給ノズル
70 エアー供給ノズル
84 光源
86 光電変換部
88 基準電圧設定部
90 電圧比較部
92 端部位置検出部
Claims (2)
- 被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を切削ブレードで切削する切削ユニットと、該切削ブレードの先端位置を検出する検出手段と、少なくとも該チャックテーブル、該切削ユニット及び該検出手段を制御する制御手段と、を備えた切削装置であって、
該検出手段は、
U形状ブレード侵入部と、該ブレード侵入部の一方の側に配設された発光部と、該発光部からの光を受光する該ブレード侵入部の他方の側に配設された受光部と、該発光部及び該受光部の端面に洗浄水を供給し該端面への切削屑の付着を防止する洗浄水ノズルと、を含み、
該制御手段は、
該切削ブレードの先端位置を検出する検出動作時は、該洗浄水供給ノズルからの洗浄水の供給を停止し、該検出動作時以外の待機時は、洗浄水を該端面に間欠的に供給し該端面に付着した切削屑を除去することを特徴とする切削装置。 - 該検出手段は、該発光部及び該受光部の該端面にエアーを供給するエアー供給ノズルを更に含み、
該制御手段は、該待機時に、該エアー供給ノズルから該端面にエアーを間欠的に供給し、水とエアーとで該端面に付着した切削屑を除去することを特徴とする請求項1記載の切削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016178860A JP6800520B2 (ja) | 2016-09-13 | 2016-09-13 | 切削装置 |
TW106127553A TWI755419B (zh) | 2016-09-13 | 2017-08-15 | 切割裝置 |
KR1020170113130A KR102302579B1 (ko) | 2016-09-13 | 2017-09-05 | 절삭 장치 |
CN201710805534.5A CN107813436B (zh) | 2016-09-13 | 2017-09-08 | 切削装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016178860A JP6800520B2 (ja) | 2016-09-13 | 2016-09-13 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018043308A true JP2018043308A (ja) | 2018-03-22 |
JP6800520B2 JP6800520B2 (ja) | 2020-12-16 |
Family
ID=61600915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016178860A Active JP6800520B2 (ja) | 2016-09-13 | 2016-09-13 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6800520B2 (ja) |
KR (1) | KR102302579B1 (ja) |
CN (1) | CN107813436B (ja) |
TW (1) | TWI755419B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108878128A (zh) * | 2018-07-03 | 2018-11-23 | 福建晟哲自动化科技有限公司 | 一种分条刀片用的纳米影像检测机构及其检测方法 |
JP2021098243A (ja) * | 2019-12-20 | 2021-07-01 | 株式会社ディスコ | 加工装置 |
CN114571340A (zh) * | 2022-05-09 | 2022-06-03 | 杭州荆鑫机械有限公司 | 一种机械精加工用抛光装置及抛光方法 |
TWI834199B (zh) * | 2021-08-04 | 2024-03-01 | 日商Towa股份有限公司 | 加工裝置、及加工品的製造方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114453956B (zh) * | 2022-01-18 | 2024-03-12 | 甘肃酒钢集团宏兴钢铁股份有限公司 | 一种闪光焊机光整刀冷却清洗装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05140972A (ja) * | 1991-11-22 | 1993-06-08 | Toshitaka Matsuo | 節水弁 |
JPH11350571A (ja) * | 1998-04-08 | 1999-12-21 | Toto Ltd | 局部洗浄装置 |
JP2001298001A (ja) * | 2000-04-12 | 2001-10-26 | Disco Abrasive Syst Ltd | 切削装置の切削ブレード検出機構 |
JP2005130924A (ja) * | 2003-10-28 | 2005-05-26 | Toshiba Corp | 食器洗浄機 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11214334A (ja) | 1998-01-29 | 1999-08-06 | Disco Abrasive Syst Ltd | ブレードのセットアップ装置 |
JP2003211354A (ja) * | 2002-01-18 | 2003-07-29 | Disco Abrasive Syst Ltd | 切削装置 |
JP5415219B2 (ja) | 2009-10-09 | 2014-02-12 | 株式会社ディスコ | 切削装置 |
CN102785297A (zh) * | 2012-08-20 | 2012-11-21 | 上海日进机床有限公司 | 一种多线切割方法及设备 |
JP6237181B2 (ja) * | 2013-12-06 | 2017-11-29 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN104308045B (zh) * | 2014-10-24 | 2016-09-28 | 沈阳建筑大学 | 基于光电传感器输出给定长度钢筋的钢筋切断机 |
JP2016159376A (ja) * | 2015-02-27 | 2016-09-05 | 株式会社ディスコ | 切削装置 |
KR20150105938A (ko) * | 2015-08-31 | 2015-09-18 | 원광대학교산학협력단 | 석판 재단장치 |
CN205497165U (zh) * | 2016-04-12 | 2016-08-24 | 安徽雷默模具制造有限公司 | 一种用于冲床模具加工的数控自动研磨机 |
-
2016
- 2016-09-13 JP JP2016178860A patent/JP6800520B2/ja active Active
-
2017
- 2017-08-15 TW TW106127553A patent/TWI755419B/zh active
- 2017-09-05 KR KR1020170113130A patent/KR102302579B1/ko active IP Right Grant
- 2017-09-08 CN CN201710805534.5A patent/CN107813436B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05140972A (ja) * | 1991-11-22 | 1993-06-08 | Toshitaka Matsuo | 節水弁 |
JPH11350571A (ja) * | 1998-04-08 | 1999-12-21 | Toto Ltd | 局部洗浄装置 |
JP2001298001A (ja) * | 2000-04-12 | 2001-10-26 | Disco Abrasive Syst Ltd | 切削装置の切削ブレード検出機構 |
JP2005130924A (ja) * | 2003-10-28 | 2005-05-26 | Toshiba Corp | 食器洗浄機 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108878128A (zh) * | 2018-07-03 | 2018-11-23 | 福建晟哲自动化科技有限公司 | 一种分条刀片用的纳米影像检测机构及其检测方法 |
JP2021098243A (ja) * | 2019-12-20 | 2021-07-01 | 株式会社ディスコ | 加工装置 |
TWI834199B (zh) * | 2021-08-04 | 2024-03-01 | 日商Towa股份有限公司 | 加工裝置、及加工品的製造方法 |
CN114571340A (zh) * | 2022-05-09 | 2022-06-03 | 杭州荆鑫机械有限公司 | 一种机械精加工用抛光装置及抛光方法 |
CN114571340B (zh) * | 2022-05-09 | 2022-09-16 | 杭州荆鑫机械有限公司 | 一种机械精加工用抛光装置及抛光方法 |
Also Published As
Publication number | Publication date |
---|---|
CN107813436A (zh) | 2018-03-20 |
CN107813436B (zh) | 2021-06-11 |
JP6800520B2 (ja) | 2020-12-16 |
TWI755419B (zh) | 2022-02-21 |
KR20180029876A (ko) | 2018-03-21 |
TW201820434A (zh) | 2018-06-01 |
KR102302579B1 (ko) | 2021-09-14 |
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