JP2018041899A - Electronic circuit device and method for manufacturing electronic circuit device - Google Patents

Electronic circuit device and method for manufacturing electronic circuit device Download PDF

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JP2018041899A
JP2018041899A JP2016176472A JP2016176472A JP2018041899A JP 2018041899 A JP2018041899 A JP 2018041899A JP 2016176472 A JP2016176472 A JP 2016176472A JP 2016176472 A JP2016176472 A JP 2016176472A JP 2018041899 A JP2018041899 A JP 2018041899A
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frame
plate
substrate
resin
mold
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JP6672113B2 (en
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竹内　慎
Shin Takeuchi
慎 竹内
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Towa Corp
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Towa Corp
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Priority to KR1020170084626A priority patent/KR101945109B1/en
Priority to CN201710550212.0A priority patent/CN107808854A/en
Priority to TW106126087A priority patent/TWI643270B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To manufacture an electronic circuit device having a configuration shielded by elastic deformation of a bent portion.SOLUTION: A method for manufacturing an electronic circuit device which manufactures an electronic circuit device having such a configuration that an electronic component 3 is shielded by a shielding member by resin-molding a substrate 2 mounted with the electronic component 3 using a molding die having a first mold 13 and a second mold 14 arranged so as to face the first mold 13 includes: a step of preparing a conductive plate-like member 19 and a conductive frame-like member 11 having a bent portion 12 of which at least one end is bent to be elastically deformable as shielding members; and a resin molding step of mold closing the first mold 13 and the second mold 14 in a state where the substrate 2, the frame-like member 11 and the plate-like member 19 are arranged in this order between the first mold 13 and the second mold 14, and the bent portion 12 is arranged on at least one side of the substrate 2 and the plate-like member 19, elastically deforming the bent portion 12, and performing resin molding.SELECTED DRAWING: Figure 3

Description

本発明は、シールド用部材により電磁シールドされた構造を有する電子回路装置及び電子回路装置の製造方法に関するものである。   The present invention relates to an electronic circuit device having a structure electromagnetically shielded by a shielding member and a method for manufacturing the electronic circuit device.

従来から、携帯電話やスマートフォンなどの通信機器に用いられる回路モジュールにおいては、回路部品から発生する電磁波の漏洩を防止する、あるいは外部から侵入する電磁波を遮断するために、回路部品の周囲を電磁シールドする技術が広く用いられている。例えば、回路部品を、絶縁樹脂層の中に埋設させて枠状の側面シールド板と絶縁樹脂層の上面に形成されたシールド層とによって覆う技術が開示されている（特許文献１参照）。   Conventionally, in a circuit module used in a communication device such as a mobile phone or a smartphone, an electromagnetic shield is provided around the circuit component in order to prevent leakage of electromagnetic waves generated from the circuit components or to block electromagnetic waves entering from the outside. This technique is widely used. For example, a technique is disclosed in which a circuit component is embedded in an insulating resin layer and covered with a frame-shaped side shield plate and a shield layer formed on the upper surface of the insulating resin layer (see Patent Document 1).

特開２００７−１５７８９１号公報JP 2007-157891 A

しかしながら、特許文献１に開示された回路モジュールには次のような課題がある。特許文献１の図５に示されるように、まず、モジュール基板１において、全ての回路部品４を包み込むように絶縁樹脂層２０を形成する。絶縁樹脂層２０を形成することにより、回路部品４および側面シールド板５を絶縁樹脂層２０の中に埋設させる。次に、絶縁樹脂層２０の上面を研磨して側面シールド板５の上端部を露出させる。このことによって、側面シールド板５の上端部の酸化されていない新鮮な断面を露出させる。次に、研磨後の絶縁樹脂層２０の上面に上面シールド層２１を形成して、側面シールド板５と上面シールド層２１とを接続する。このように、回路モジュールを製造するために、絶縁樹脂層２０を形成する樹脂成形装置、絶縁樹脂層２０の上面を研磨する研磨装置、及び絶縁樹脂層２０の上面に上面シールド層２１を形成する蒸着装置など多くの製造装置を使用する。したがって、回路モジュールの製造コストが増大するという問題がある。   However, the circuit module disclosed in Patent Document 1 has the following problems. As shown in FIG. 5 of Patent Document 1, first, an insulating resin layer 20 is formed on the module substrate 1 so as to wrap all the circuit components 4. By forming the insulating resin layer 20, the circuit component 4 and the side shield plate 5 are embedded in the insulating resin layer 20. Next, the upper surface of the side shield plate 5 is exposed by polishing the upper surface of the insulating resin layer 20. This exposes a fresh, unoxidized cross section at the upper end of the side shield plate 5. Next, the upper shield layer 21 is formed on the upper surface of the insulating resin layer 20 after polishing, and the side shield plate 5 and the upper shield layer 21 are connected. Thus, in order to manufacture the circuit module, a resin molding apparatus that forms the insulating resin layer 20, a polishing apparatus that polishes the upper surface of the insulating resin layer 20, and the upper shield layer 21 is formed on the upper surface of the insulating resin layer 20. Many manufacturing equipment such as vapor deposition equipment is used. Therefore, there is a problem that the manufacturing cost of the circuit module increases.

本発明は上記の課題を解決するもので、シールド用部材に設けられた折り曲げ部を弾性変形させてシールドされた構造の電子回路装置を製造することができ、かつ製造コストを低減することができる電子回路装置及び電子回路装置の製造方法を提供することを目的とする。   The present invention solves the above-described problems, and can produce an electronic circuit device having a shielded structure by elastically deforming a bent portion provided in a shielding member, and can reduce the manufacturing cost. An object of the present invention is to provide an electronic circuit device and a method for manufacturing the electronic circuit device.

上記の課題を解決するために、本発明に係る電子回路装置の製造方法は、第１型と第１型に対向して配置される第２型とを有する成形型を用いて、電子部品が装着された基板に対して樹脂成形して、電子部品がシールド用部材によりシールドされた構造の電子回路装置を製造する電子回路装置の製造方法であって、シールド用部材として、導電性の板状部材と、少なくとも一方の端部が折り曲げられて弾性変形可能とされた折り曲げ部を備える導電性の枠状部材とを準備する工程と、第１型と第２型との間に、基板と枠状部材と板状部材とがこの順にて、基板及び板状部材の少なくとも一方側に折り曲げ部が配置された状態において、第１型と第２型とを型締めして、折り曲げ部を弾性変形させて樹脂成形を行う樹脂成形工程とを含む。   In order to solve the above-described problems, an electronic circuit device manufacturing method according to the present invention uses a molding die having a first die and a second die arranged to face the first die, and the electronic component is An electronic circuit device manufacturing method for manufacturing an electronic circuit device having a structure in which an electronic component is shielded by a shielding member by resin-molding the mounted substrate, and the conductive member is used as the shielding member. A substrate and a frame between a first mold and a second mold, and a step of preparing a member and a conductive frame-like member having a bent portion in which at least one end is bent and elastically deformable The first and second molds are clamped and the bent portion is elastically deformed in a state where the bent member and the plate-like member are arranged in this order and the bent portion is disposed on at least one side of the substrate and the plate-like member. And a resin molding step of performing resin molding.

上記の課題を解決するために、本発明に係る電子回路装置は、基板に装着された電子部品と、電子部品をシールドする導電性の枠状部材と、枠状部材の基板とは反対側に配置され、枠状部材と電気的に接続された導電性の板状部材と、少なくとも基板と板状部材との間に配置された封止樹脂とを備え、基板及び板状部材の少なくとも一方側において枠状部材の端部が折り曲げられた折り曲げ部が設けられており、枠状部材が弾性変形可能な材質であり、基板及び板状部材の少なくとも一方と折り曲げ部との間に、封止樹脂が存在する部分と封止樹脂が存在しない部分とが存在する。   In order to solve the above-described problems, an electronic circuit device according to the present invention includes an electronic component mounted on a substrate, a conductive frame member that shields the electronic component, and an opposite side of the substrate of the frame member. A conductive plate-shaped member disposed and electrically connected to the frame-shaped member; and at least one side of the substrate and the plate-shaped member, and a sealing resin disposed between the substrate and the plate-shaped member The frame-shaped member is bent at its end, and the frame-shaped member is made of an elastically deformable material, and a sealing resin is provided between at least one of the substrate and the plate-shaped member and the bent portion. There are a part where the sealing resin is present and a part where the sealing resin is not present.

上記の課題を解決するために、本発明に係る電子回路装置は、基板に装着された電子部品と、電子部品をシールドする導電性の枠状部材と、枠状部材の基板とは反対側に配置され、枠状部材と電気的に接続された導電性の板状部材と、少なくとも基板と板状部材との間に配置された封止樹脂とを備え、基板及び板状部材の少なくとも一方側において枠状部材の端部が折り曲げられた折り曲げ部が設けられており、枠状部材が弾性変形可能な材質であり、基板及び板状部材の少なくとも一方と折り曲げ部との間に異方導電性部材が介在する。   In order to solve the above-described problems, an electronic circuit device according to the present invention includes an electronic component mounted on a substrate, a conductive frame member that shields the electronic component, and an opposite side of the substrate of the frame member. A conductive plate-shaped member disposed and electrically connected to the frame-shaped member; and at least one side of the substrate and the plate-shaped member, and a sealing resin disposed between the substrate and the plate-shaped member The frame-shaped member is bent at the end thereof, and the frame-shaped member is made of an elastically deformable material, and anisotropically conductive between at least one of the substrate and the plate-shaped member and the bent portion. A member is interposed.

本発明によれば、シールド用部材に設けられた折り曲げ部を弾性変形させてシールドされた構造の電子回路装置を製造することができ、かつ電子回路装置の製造コストを低減することができる。   ADVANTAGE OF THE INVENTION According to this invention, the electronic circuit apparatus of the structure shielded by elastically deforming the bending part provided in the member for shielding can be manufactured, and the manufacturing cost of an electronic circuit apparatus can be reduced.

実施形態１に係る電子回路装置において使用される封止前基板を示す概略図であり、（ａ）は平面図、（ｂ）はＡ−Ａ線断面図である。It is the schematic which shows the board | substrate before sealing used in the electronic circuit device which concerns on Embodiment 1, (a) is a top view, (b) is an AA sectional view. 図１で示した封止前基板の接地電極に枠状部材を接続した状態を示す概略図であり、（ａ）は平面図、（ｂ）はＢ−Ｂ線断面図である。It is the schematic which shows the state which connected the frame-shaped member to the ground electrode of the board | substrate before sealing shown in FIG. 1, (a) is a top view, (b) is a BB sectional drawing. （ａ）〜（ｃ）は、実施形態１において、封止前基板を樹脂封止することによって枠状部材と板状部材とを接続する工程を示す概略断面図である。(A)-(c) is a schematic sectional drawing which shows the process of connecting a frame-shaped member and a plate-shaped member by resin-sealing the board | substrate before sealing in Embodiment 1. FIG. （ａ）〜（ｃ）は、実施形態１において、樹脂封止された樹脂成形品を個片化して電子回路装置を製造する工程を示す概略断面図である。(A)-(c) is a schematic sectional drawing which shows the process of manufacturing the electronic circuit device by dividing the resin molded product resin-sealed into pieces in Embodiment 1. FIG. （ａ）は、実施形態１において製造された電子回路装置を示す概略断面図、（ｂ）は、枠状部材と板状部材との接続部を示す拡大図、(c)は、枠状部材に設けられた様々な折り曲げ部の断面形状を示す概略図である。(A) is schematic sectional drawing which shows the electronic circuit device manufactured in Embodiment 1, (b) is an enlarged view which shows the connection part of a frame-shaped member and a plate-shaped member, (c) is a frame-shaped member It is the schematic which shows the cross-sectional shape of the various bending parts provided in FIG. 実施形態２において使用される封止前基板の接地電極に枠状部材を接続した状態を示す概略図であり、（ａ）は平面図、（ｂ）はＣ−Ｃ線断面図である。It is the schematic which shows the state which connected the frame-shaped member to the ground electrode of the board | substrate before sealing used in Embodiment 2, (a) is a top view, (b) is CC sectional view taken on the line. （ａ）〜（ｃ）は、実施形態２において、封止前基板を樹脂封止することによって枠状部材と板状部材とを接続する工程を示す概略断面図である。(A)-(c) is a schematic sectional drawing which shows the process of connecting a frame-shaped member and a plate-shaped member by resin-sealing the board | substrate before sealing in Embodiment 2. FIG. （ａ）〜（ｃ）は、実施形態２において、樹脂封止された樹脂成形品を個片化して電子回路装置を製造する工程を示す概略断面図である。(A)-(c) is a schematic sectional drawing which shows the process of manufacturing the electronic circuit device by dividing the resin molded product resin-sealed into pieces in Embodiment 2. FIG. 実施形態３において使用される封止前基板を示す概略図であり、（ａ）は平面図、（ｂ）はＤ−Ｄ線断面図である。It is the schematic which shows the board | substrate before sealing used in Embodiment 3, (a) is a top view, (b) is DD sectional view taken on the line. 実施形態３において使用される枠状部材を示す概略図であり、（ａ）は平面図、（ｂ）はＥ−Ｅ線断面図である。It is the schematic which shows the frame-shaped member used in Embodiment 3, (a) is a top view, (b) is the EE sectional view taken on the line. （ａ）〜（ｃ）は、実施形態３において、封止前基板を樹脂封止することによって板状部材と枠状部材と接地電極とを接続する工程を示す概略断面図である。(A)-(c) is a schematic sectional drawing which shows the process of connecting a plate-shaped member, a frame-shaped member, and a ground electrode by resin-sealing the board | substrate before sealing in Embodiment 3. FIG. （ａ）〜（ｃ）は、実施形態３において、樹脂封止された電子回路装置を取り出す工程を示す概略断面図である。(A)-(c) is a schematic sectional drawing which shows the process of taking out the resin-sealed electronic circuit device in Embodiment 3. FIG. （ａ）〜（ｂ）は、実施形態４において、電子部品と枠状部材と板状部材とを樹脂成形する工程を示す概略断面図である。(A)-(b) is a schematic sectional drawing which shows the process of resin-molding an electronic component, a frame-shaped member, and a plate-shaped member in Embodiment 4. FIG. （ａ）〜（ｃ）は、実施形態５において製造された様々な電子回路装置を示す概略断面図である。(A)-(c) is a schematic sectional drawing which shows the various electronic circuit apparatuses manufactured in Embodiment 5. FIG.

以下、本発明に係る実施形態について、図面を参照して説明する。本出願書類におけるいずれの図についても、わかりやすくするために、適宜省略し又は誇張して模式的に描かれている。同一の構成要素については、同一の符号を付して説明を適宜省略する。なお、本出願書類において、「電子部品」とは、樹脂等によって封止されていない所謂半導体チップ、および半導体チップの少なくとも一部が樹脂等によって封止された形態のものを含む。また、「電子回路装置」とは、少なくとも一つの電子部品がシールド用部材によってシールドされた構造のものであって、単一の枠状部材によってシールドされた構造のものも、複数の枠状部材によってシールドされた構造のものも含む。
〔実施形態１〕 Hereinafter, embodiments according to the present invention will be described with reference to the drawings. Any figure in the present application document is schematically omitted or exaggerated as appropriate for easy understanding. About the same component, the same code | symbol is attached | subjected and description is abbreviate | omitted suitably. In the present application document, the “electronic component” includes a so-called semiconductor chip that is not sealed with a resin or the like, and a semiconductor chip in which at least a part of the semiconductor chip is sealed with a resin or the like. The “electronic circuit device” is a structure in which at least one electronic component is shielded by a shielding member, and a structure in which a single frame-shaped member is shielded is also a plurality of frame-shaped members. Including a structure shielded by the above.
Embodiment 1

（封止前基板の構成）
本発明に係る実施形態１の電子回路装置において使用される封止前基板の構成について、図１〜２を参照して説明する。 (Configuration of substrate before sealing)
The configuration of the pre-sealing substrate used in the electronic circuit device according to the first embodiment of the present invention will be described with reference to FIGS.

図１（ａ）に示されるように、封止前基板１は、基板を格子状の複数の領域に仮想的に区画し、それぞれの領域に電子部品を装着した基板である。本実施形態においては、電子部品として複数の半導体チップを装着した封止前基板を示す。封止前基板１は、基板２と基板２の上に装着された複数の半導体チップ３とを備える。基板２としては、例えば、ガラスエポキシ積層板、プリント基板、セラミックス基板などが使用される。半導体チップ３としては、例えば、マイクロプロセッサ、高周波デバイス、パワーデバイスなどが装着される。図１においては、半導体チップ３における回路が形成された主面が上を向くようにして、基板２の上に半導体チップ３が装着される。   As shown in FIG. 1A, the pre-sealing substrate 1 is a substrate in which the substrate is virtually partitioned into a plurality of lattice-shaped regions, and electronic components are mounted in each region. In the present embodiment, a pre-sealing substrate on which a plurality of semiconductor chips are mounted as electronic components is shown. The pre-sealing substrate 1 includes a substrate 2 and a plurality of semiconductor chips 3 mounted on the substrate 2. As the board | substrate 2, a glass epoxy laminated board, a printed circuit board, a ceramic substrate etc. are used, for example. As the semiconductor chip 3, for example, a microprocessor, a high frequency device, a power device, or the like is mounted. In FIG. 1, the semiconductor chip 3 is mounted on the substrate 2 so that the main surface of the semiconductor chip 3 on which the circuit is formed faces upward.

基板２の表面には複数の基板電極４が設けられる。図示を省略するが、基板電極４は、基板２の表面に設けられた配線及び基板２の内部に設けられたビア配線を介して基板２の裏面に設けられた外部電極にそれぞれ接続される。基板電極４、配線、ビア配線及び外部電極は、例えば、電気抵抗率が小さい銅（Ｃｕ）やアルミニウム（Ａｌ）などを用いることが好ましい。図１（ｂ）に示されるように、複数の基板電極４は、半導体チップ３に形成されたパッド電極５にそれぞれ電気的に接続される。基板電極４とパッド電極５とは、金線又は銅線からなるボンディングワイヤ６を介してそれぞれ接続される。   A plurality of substrate electrodes 4 are provided on the surface of the substrate 2. Although not shown, the substrate electrode 4 is connected to an external electrode provided on the back surface of the substrate 2 via a wiring provided on the surface of the substrate 2 and a via wiring provided inside the substrate 2. For the substrate electrode 4, the wiring, the via wiring, and the external electrode, for example, copper (Cu), aluminum (Al), or the like having a low electrical resistivity is preferably used. As shown in FIG. 1B, the plurality of substrate electrodes 4 are electrically connected to pad electrodes 5 formed on the semiconductor chip 3, respectively. The substrate electrode 4 and the pad electrode 5 are connected to each other through bonding wires 6 made of a gold wire or a copper wire.

複数の基板電極４のうち、特定の電極は半導体チップ３の電位を接地電位にするための接地電極（グランド電極）７を構成する。図１（ａ）に示されるように、接地電極７は、半導体チップ３及び複数の基板電極４の周囲を取り囲む枠状の配線パターンを含む。本実施形態においては、半導体チップ３が装着された各領域において、接地電極７のボンディングワイヤ６が直接接続された部分と最外周に形成される枠状の配線パターンとを含めて接地電極７という。枠状の接地電極７はパターン幅Ｗを有する。   Among the plurality of substrate electrodes 4, a specific electrode constitutes a ground electrode (ground electrode) 7 for setting the potential of the semiconductor chip 3 to the ground potential. As shown in FIG. 1A, the ground electrode 7 includes a frame-like wiring pattern surrounding the semiconductor chip 3 and the plurality of substrate electrodes 4. In the present embodiment, in each region where the semiconductor chip 3 is mounted, the ground electrode 7 includes a portion where the bonding wire 6 of the ground electrode 7 is directly connected and a frame-like wiring pattern formed on the outermost periphery. . The frame-shaped ground electrode 7 has a pattern width W.

基板２の表面には、基板電極４及び接地電極７の表面を除いて、絶縁性樹脂被膜であるソルダレジスト８が設けられる。   A solder resist 8 that is an insulating resin film is provided on the surface of the substrate 2 except for the surfaces of the substrate electrode 4 and the ground electrode 7.

封止前基板１には、基板２を格子状の複数の領域に区画して、それぞれの領域を切断するための切断線９がＸ方向及びＹ方向（図１（ａ）において横方向及び縦方向に示す破線）に沿ってそれぞれ設けられる。複数の切断線９によって囲まれる各領域１０が、それぞれシールド用部材によって電磁シールドされる電子回路装置となる領域に相当する。   In the substrate 1 before sealing, the substrate 2 is partitioned into a plurality of lattice-shaped regions, and cutting lines 9 for cutting each region are provided in the X direction and the Y direction (in FIG. 1A, the horizontal direction and the vertical direction). Provided along the broken line in the direction). Each region 10 surrounded by a plurality of cutting lines 9 corresponds to a region to be an electronic circuit device that is electromagnetically shielded by a shielding member.

図２に示されるように、基板２に複数の半導体チップ３を装着した後に、基板２に導電性を有する枠状部材１１が装着される。枠状部材１１は、半導体チップ３の周囲を取り囲み半導体チップ３をシールド（遮蔽）するためのシールド用部材である。枠状部材１１の各面には、樹脂成形する際に流動性樹脂を流動しやすくするための開口部を適宜設けることができる。   As shown in FIG. 2, after mounting a plurality of semiconductor chips 3 on the substrate 2, a frame-like member 11 having conductivity is mounted on the substrate 2. The frame-shaped member 11 is a shielding member that surrounds the semiconductor chip 3 and shields (shields) the semiconductor chip 3. Each surface of the frame-shaped member 11 can be appropriately provided with an opening for facilitating the flow of the fluid resin during resin molding.

枠状部材１１には、弾性変形可能な材質を用いる。弾性変形可能な材質としては、金属を用いることができ、例えば、Ｆｅ、Ｃｕ、Ａｌ又はこれらのうち少なくも一つを含む合金（ステンレス、ベリリウム銅、パーマロイ等）を用いることができる。なお、後述する実施形態２〜５においても、特に説明していない限り、枠状部材の材質及び枠状部材に適用可能な材料等は本実施形態と同じである。   The frame member 11 is made of an elastically deformable material. As the elastically deformable material, a metal can be used, for example, Fe, Cu, Al, or an alloy containing at least one of them (stainless steel, beryllium copper, permalloy, etc.) can be used. In Embodiments 2 to 5 described later, the material of the frame-shaped member, the material applicable to the frame-shaped member, and the like are the same as in the present embodiment unless otherwise described.

図２（ｂ）に示されるように、枠状部材１１は、基板２に設けられた接地電極７の上に、例えば、導電性接着剤又は半田などによって接続される。枠状部材１１は端部に弾性変形可能な複数の折り曲げ部１２を有する。図２においては、枠状部材１１の上端に折り曲げ部１２を設けた場合を示す。枠状部材１１の上端に設けられた折り曲げ部１２は、半導体チップ３及びボンディングワイヤ６よりも高い位置に設けられる。折り曲げ部１２は、枠状部材１１の上端及び下端の双方に設けてもよい。折り曲げ部１２は、図２では内側（半導体チップ３側）に折り曲げられたものを示しているが、外側（半導体チップ３とは反対側）に折り曲げられてもよく、複数存在する場合には内側に折り曲げられるものと外側に折り曲げられるものとが混在してもよい。   As shown in FIG. 2B, the frame-shaped member 11 is connected to the ground electrode 7 provided on the substrate 2 by, for example, a conductive adhesive or solder. The frame-shaped member 11 has a plurality of bent portions 12 that can be elastically deformed at the ends. In FIG. 2, the case where the bending part 12 is provided in the upper end of the frame-shaped member 11 is shown. The bent portion 12 provided at the upper end of the frame-shaped member 11 is provided at a position higher than the semiconductor chip 3 and the bonding wire 6. The bent portion 12 may be provided on both the upper end and the lower end of the frame-shaped member 11. In FIG. 2, the bent portion 12 is shown bent toward the inner side (semiconductor chip 3 side), but may be bent to the outer side (opposite side of the semiconductor chip 3). Those that can be bent to the outside and those that can be bent to the outside may be mixed.

図２（ａ）に示されるように、枠状部材１１に設けられた複数の折り曲げ部１２は、例えば、平面視して接地電極７に重なるようにして設けられる。図２（ａ）において、複数の折り曲げ部１２の長さＬは、接地電極７のパターン幅Ｗ（図１（ａ）参照）と同じ程度に形成される。折り曲げ部１２の長さＬは、接地電極７のパターン幅Ｗよりも大きくてもよいし、小さくてもよい。   As shown in FIG. 2A, the plurality of bent portions 12 provided in the frame-shaped member 11 are provided so as to overlap the ground electrode 7 in a plan view, for example. In FIG. 2A, the length L of the plurality of bent portions 12 is formed to the same extent as the pattern width W of the ground electrode 7 (see FIG. 1A). The length L of the bent portion 12 may be larger or smaller than the pattern width W of the ground electrode 7.

図２（ａ）においては、複数の折り曲げ部１２を各辺にそれぞれ３箇所設けた場合を示した。これに限らず、複数の折り曲げ部１２の数は、電子回路装置の大きさ（各領域１０の大きさ）によって任意に設定することができる。なお、折り曲げ部１２の断面形状については後述する（図５（ｃ）参照）。   FIG. 2A shows a case where a plurality of bent portions 12 are provided at three positions on each side. Not limited to this, the number of the bent portions 12 can be arbitrarily set according to the size of the electronic circuit device (the size of each region 10). The cross-sectional shape of the bent portion 12 will be described later (see FIG. 5C).

図２（ａ）において、上段に示す領域１０ａは、接地電極７と枠状部材１１と折り曲げ部１２とを実線で図示している。下段に示す領域１０ｂは、枠状部材１１の折り曲げ部１２の平面形状をわかりやすくするために、枠状部材１１と折り曲げ部１２とを実線で図示し、接地電極７の図示を省略している。   In FIG. 2A, the region 10 a shown in the upper stage illustrates the ground electrode 7, the frame-shaped member 11, and the bent portion 12 with solid lines. In the lower region 10b, the frame-like member 11 and the bent portion 12 are shown by solid lines and the ground electrode 7 is not shown in order to make the planar shape of the bent portion 12 of the frame-like member 11 easier to understand. .

（圧縮成形型の構成）
図３を参照して、例えば、圧縮成形法を用いた樹脂成形装置において使用される成形型の構成について説明する。 (Composition of compression mold)
With reference to FIG. 3, the structure of the shaping | molding die used in the resin molding apparatus using the compression molding method is demonstrated, for example.

図３（ａ）に示されるように、圧縮成形法を用いた樹脂成形装置において、成形型は、上型１３と上型１３に対向して配置される下型１４とを備える。下型１４は、底面部材１５と底面部材１５の周囲を取り囲むようにして設けられる枠状の側面部材１６とを備える。底面部材１５は側面部材１６の内周面に沿って昇降することができる。言い換えれば、底面部材１５と側面部材１６とは相対的に上下方向に移動する。側面部材１６の内周面と底面部材１５の上面とによって囲まれる空間が、下型１４におけるキャビティ１７を構成する。   As shown in FIG. 3A, in the resin molding apparatus using the compression molding method, the molding die includes an upper die 13 and a lower die 14 disposed to face the upper die 13. The lower mold 14 includes a bottom surface member 15 and a frame-shaped side surface member 16 provided so as to surround the periphery of the bottom surface member 15. The bottom member 15 can move up and down along the inner peripheral surface of the side member 16. In other words, the bottom member 15 and the side member 16 move relatively in the vertical direction. A space surrounded by the inner peripheral surface of the side member 16 and the upper surface of the bottom member 15 forms a cavity 17 in the lower mold 14.

（樹脂成形工程及び個片化工程）
図３〜４を参照して、図２に示した封止前基板１を樹脂成形して封止済基板を作製し、封止済基板を個片化して電子回路装置を製造する工程を説明する。 (Resin molding process and individualization process)
With reference to FIGS. 3 to 4, a process for manufacturing an electronic circuit device by manufacturing a sealed substrate by resin-molding the pre-sealing substrate 1 shown in FIG. 2 and separating the sealed substrate into individual pieces will be described. To do.

図３（ａ）に示されるように、最初に、上型１３と下型１４とを型開きした状態としておく。次に、基板搬送機構（図示なし）を使用して、図２に示した封止前基板１（半導体チップ３と枠状部材１１とを装着済み）を上型１３の下方の所定位置に搬送する。   As shown in FIG. 3A, first, the upper mold 13 and the lower mold 14 are opened. Next, using a substrate transport mechanism (not shown), the substrate 1 before sealing shown in FIG. 2 (with the semiconductor chip 3 and the frame-like member 11 mounted) is transported to a predetermined position below the upper mold 13. To do.

次に、基板搬送機構を使用して封止前基板１を上昇させて、吸着又はクランプ（図示なし）によって上型１３の型面に封止前基板１を固定する。封止前基板１は、半導体チップ３と枠状部材１１とを装着した面が下側に向くようにして上型１３の型面に固定される。   Next, the substrate 1 before sealing is lifted using the substrate transport mechanism, and the substrate 1 before sealing is fixed to the mold surface of the upper mold 13 by suction or clamping (not shown). The substrate 1 before sealing is fixed to the mold surface of the upper mold 13 such that the surface on which the semiconductor chip 3 and the frame-shaped member 11 are mounted faces downward.

次に、離型フィルム供給機構（図示なし）を使用して、下型１４に離型フィルム１８を供給する。下型１４に設けられた吸着機構（図示なし）を使用してキャビティ１７における下型１４の型面に沿うように離型フィルム１８を吸着する。離型フィルム１８としては、短冊状にカットされた離型フィルム又は長尺状の離型フィルムのいずれかを使用することができる。また、樹脂材料によっては離型フィルム１８を使用しない場合もある。   Next, the release film 18 is supplied to the lower mold 14 using a release film supply mechanism (not shown). Using a suction mechanism (not shown) provided in the lower mold 14, the release film 18 is sucked along the mold surface of the lower mold 14 in the cavity 17. As the release film 18, either a release film cut into a strip shape or a long release film can be used. Depending on the resin material, the release film 18 may not be used.

次に、材料搬送機構（図示なし）を使用して、下型１４に設けられたキャビティ１７に導電性を有する板状部材１９を供給する。具体的には、キャビティ１７に供給された離型フィルム１８の上に板状部材１９を供給する。板状部材１９は、半導体チップ３の上面を覆い半導体チップ３をシールドするためのシールド用部材である。板状部材１９には、金属を用いることができ、例えば、Ｆｅ、Ｃｕ、Ａｌ又はこれらのうち少なくも一つを含む合金（ステンレス、ベリリウム銅、パーマロイ等）を用いることができる。なお、後述する実施形態２〜５においても、特に説明していない限り、板状部材に適用可能な材料等は本実施形態と同じである。   Next, a plate member 19 having conductivity is supplied to a cavity 17 provided in the lower mold 14 using a material transport mechanism (not shown). Specifically, the plate member 19 is supplied onto the release film 18 supplied to the cavity 17. The plate-like member 19 is a shielding member for covering the upper surface of the semiconductor chip 3 and shielding the semiconductor chip 3. A metal can be used for the plate-like member 19, for example, Fe, Cu, Al, or an alloy (stainless steel, beryllium copper, permalloy, etc.) containing at least one of them can be used. In Embodiments 2 to 5 described later, materials and the like that can be applied to the plate-like member are the same as in this embodiment unless otherwise described.

板状部材１９は、キャビティ１７の大きさとほぼ同じ大きさに形成される。したがって、板状部材１９は、キャビティ１７の底面、言い換えれば、底面部材１５の上面に供給された離型フィルム１８の上にほぼぴったりと配置される。この状態で、板状部材１９はキャビティ１７内において水平（左右）に動くことがないように配置される。   The plate-like member 19 is formed to have approximately the same size as the cavity 17. Accordingly, the plate-like member 19 is arranged almost exactly on the release film 18 supplied to the bottom surface of the cavity 17, in other words, the top surface of the bottom member 15. In this state, the plate-like member 19 is arranged so as not to move horizontally (left and right) in the cavity 17.

次に、樹脂搬送機構（図示なし）を使用して、下型１４に設けられたキャビティ１７に所定量の樹脂材料２０を供給する。樹脂材料２０としては、粉末状、顆粒状、シート状などの樹脂、又は、常温で液状の樹脂などを使用することができる。本実施形態においては、樹脂材料２０として顆粒状の樹脂（顆粒状樹脂）２０を供給する例を示す。具体的には、顆粒状樹脂２０は板状部材１９の上に供給される。   Next, a predetermined amount of the resin material 20 is supplied to the cavity 17 provided in the lower mold 14 using a resin transport mechanism (not shown). As the resin material 20, it is possible to use a resin such as powder, granule, or sheet, or a resin that is liquid at room temperature. In the present embodiment, an example in which a granular resin (granular resin) 20 is supplied as the resin material 20 is shown. Specifically, the granular resin 20 is supplied onto the plate-like member 19.

ここでは、板状部材１９と樹脂材料２０とを別々の搬送機構を用いて、下型１４に搬送する例について説明したが、これに限定されない。例えば、予め板状部材１９上に樹脂材料２０が配置された状態とし、この状態で共通の搬送機構を用いて、下型１４のキャビティ１７内に配置することができる。この際、搬送前の状態において、予めカットされた離型フィルム１８を、板状部材１９の下方から樹脂材料２０の側方を囲うように配置しておいてもよい。   Although the example which conveys the plate-shaped member 19 and the resin material 20 to the lower mold | type 14 using a separate conveyance mechanism was demonstrated here, it is not limited to this. For example, it is possible to place the resin material 20 on the plate-like member 19 in advance and place the resin material 20 in the cavity 17 of the lower mold 14 using a common transport mechanism in this state. At this time, the release film 18 that has been cut in advance may be disposed so as to surround the side of the resin material 20 from below the plate-like member 19 in a state before conveyance.

次に、下型１４に設けられたヒータ（図示なし）によって顆粒状樹脂２０を加熱する。加熱することによって顆粒状樹脂２０を溶融し流動性樹脂２１を生成する。なお、樹脂材料としてキャビティ１７に液状樹脂を供給した場合には、その液状樹脂自体が流動性樹脂２１に相当する。   Next, the granular resin 20 is heated by a heater (not shown) provided in the lower mold 14. By heating, the granular resin 20 is melted to produce a fluid resin 21. When a liquid resin is supplied to the cavity 17 as a resin material, the liquid resin itself corresponds to the fluid resin 21.

次に、図３（ｂ）に示されるように、型締機構（図示なし）によって下型１４を上昇させ、上型１３と下型１４とを型締めする。型締めすることによって、封止前基板１に装着された半導体チップ３と枠状部材１１とを、キャビティ１７内で溶融した流動性樹脂２１に浸漬させる。この状態においては、枠状部材１１の端部（上端）に設けられた折り曲げ部１２と板状部材１９とはまだ接触していない。   Next, as shown in FIG. 3B, the lower mold 14 is raised by a mold clamping mechanism (not shown), and the upper mold 13 and the lower mold 14 are clamped. By clamping the mold, the semiconductor chip 3 and the frame member 11 mounted on the pre-sealing substrate 1 are immersed in the fluid resin 21 melted in the cavity 17. In this state, the bent portion 12 provided at the end (upper end) of the frame-like member 11 and the plate-like member 19 are not yet in contact with each other.

封止前基板１が流動性樹脂２１に浸漬することによって、キャビティ１７内で溶融した流動性樹脂２１はキャビティ１７内において流動する。枠状部材１１の各面に複数の開口部を設けた場合には、流動性樹脂２１がこれらの開口部を通過してキャビティ１７内を流動する。したがって、枠状部材１１の各面に開口部を設けることにより、型締めした際にキャビティ１７内において流動性樹脂２１を安定して流動させることができる。   When the substrate 1 before sealing is immersed in the fluid resin 21, the fluid resin 21 melted in the cavity 17 flows in the cavity 17. When a plurality of openings are provided on each surface of the frame-shaped member 11, the fluid resin 21 flows through the openings 17 through these openings. Therefore, by providing an opening on each surface of the frame-shaped member 11, the fluid resin 21 can be stably flowed in the cavity 17 when the mold is clamped.

次に、下型１４を更に上昇させることによって、封止前基板１を側面部材１６によりクランプした状態で底面部材１５のみを上昇させる。このことによって、枠状部材１１の上端に設けられた折り曲げ部１２と板状部材１９とを接触させる。更に、板状部材１９によって折り曲げ部１２を押圧することにより折り曲げ部１２を弾性変形させる。折り曲げ部１２を弾性変形させた状態で、キャビティ１７内の流動性樹脂２１に所定の樹脂圧力を加える。   Next, by further raising the lower mold 14, only the bottom member 15 is raised with the pre-sealing substrate 1 clamped by the side member 16. As a result, the bent portion 12 provided at the upper end of the frame-like member 11 and the plate-like member 19 are brought into contact with each other. Further, the bent portion 12 is elastically deformed by pressing the bent portion 12 with the plate-like member 19. A predetermined resin pressure is applied to the fluid resin 21 in the cavity 17 in a state where the bent portion 12 is elastically deformed.

次に、図３（ｃ）に示されるように、下型１４に設けられたヒータ（図示なし）を使用して、流動性樹脂２１を硬化させるために必要な時間だけ、流動性樹脂２１を加熱する。流動性樹脂２１を硬化させて硬化樹脂２２を成形する。このことによって、封止前基板１に装着された半導体チップ３と枠状部材１１とを、キャビティ１７の形状に対応して成形された硬化樹脂（封止樹脂）２２によって樹脂封止する。   Next, as shown in FIG. 3C, the flowable resin 21 is removed for a time necessary to cure the flowable resin 21 using a heater (not shown) provided in the lower mold 14. Heat. The fluid resin 21 is cured to form the cured resin 22. As a result, the semiconductor chip 3 and the frame-shaped member 11 mounted on the substrate 1 before sealing are resin-sealed with a cured resin (sealing resin) 22 formed corresponding to the shape of the cavity 17.

この状態で、枠状部材１１と板状部材１９とは弾性変形した折り曲げ部１２を介して接続され、板状部材１９は硬化樹脂２２に固着される。枠状部材１１の上端に複数の折り曲げ部１２を設けることによって、枠状部材１１と板状部材１９とを電気的に安定して接続することが可能となる。したがって、板状部材１９と折り曲げ部１２と枠状部材１１と接地電極７とを電気的に導通させることができる。このことにより、それぞれの半導体チップ３を枠状部材１１と折り曲げ部１２と板状部材１９とによって電磁シールドすることができる。   In this state, the frame-like member 11 and the plate-like member 19 are connected via the bent portion 12 that is elastically deformed, and the plate-like member 19 is fixed to the cured resin 22. By providing a plurality of bent portions 12 at the upper end of the frame-shaped member 11, the frame-shaped member 11 and the plate-shaped member 19 can be electrically connected stably. Therefore, the plate-shaped member 19, the bent portion 12, the frame-shaped member 11, and the ground electrode 7 can be electrically connected. Thus, each semiconductor chip 3 can be electromagnetically shielded by the frame-shaped member 11, the bent portion 12, and the plate-shaped member 19.

次に、図４（ａ）に示されるように、硬化樹脂２２を成形した後に、型締機構（図示なし）を使用して上型１３と下型１４とを型開きする。上型１３の型面には樹脂封止された樹脂成形品（封止済基板）２３が固定されている。次に、基板搬送機構（図示なし）を使用して樹脂成形品２３を成形型から取り出す。   Next, as shown in FIG. 4A, after the cured resin 22 is molded, the upper mold 13 and the lower mold 14 are opened using a mold clamping mechanism (not shown). A resin molded product (sealed substrate) 23 sealed with resin is fixed to the mold surface of the upper mold 13. Next, the resin molded product 23 is taken out of the mold using a substrate transport mechanism (not shown).

なお、上型１３と下型１４と型締めする工程において、真空引き機構（図示なし）を使用してキャビティ１７内を吸引して減圧することが好ましい。このことによって、キャビティ１７内に残留する空気や流動性樹脂２１中に含まれる気泡などを成形型の外部に排出することができる。   In the step of clamping the upper mold 13 and the lower mold 14, it is preferable to reduce the pressure by sucking the inside of the cavity 17 using a vacuuming mechanism (not shown). As a result, air remaining in the cavity 17 or bubbles contained in the fluid resin 21 can be discharged to the outside of the mold.

次に、図４（ｂ）に示されるように、例えば、回転刃２４を有する切断装置を使用して樹脂成形品２３を切断する。回転刃２４を使用して、樹脂成形品２３に設けられた切断線９（図１（ａ）参照）に沿って樹脂成形品２３を切断する。   Next, as illustrated in FIG. 4B, the resin molded product 23 is cut using, for example, a cutting device having a rotary blade 24. Using the rotary blade 24, the resin molded product 23 is cut along a cutting line 9 (see FIG. 1A) provided on the resin molded product 23.

図４（ｃ）に示されるように、樹脂成形品２３を切断して個片化することによって電子回路装置２５がそれぞれ製造される。電子回路装置２５は、半導体チップ３が枠状部材１１と折り曲げ部１２と板状部材１９とによって取り囲まれて電磁シールド可能な構造となっている。   As shown in FIG. 4C, the electronic circuit device 25 is manufactured by cutting the resin molded product 23 into individual pieces. The electronic circuit device 25 has a structure in which the semiconductor chip 3 is surrounded by the frame-shaped member 11, the bent portion 12, and the plate-shaped member 19 and can be electromagnetically shielded.

（折り曲げ部と板状部材との接続）
図５を参照して、枠状部材１１の上端に設けられた折り曲げ部１２と板状部材１９との接続状態について説明する。 (Connection between bent part and plate-like member)
With reference to FIG. 5, the connection state of the bending part 12 provided in the upper end of the frame-shaped member 11 and the plate-shaped member 19 is demonstrated.

枠状部材１１の上端に設けられた折り曲げ部１２と板状部材１９との接続状態は、図５（ａ）の領域Ｓ１及びＳ２（細い円で囲む領域）に示されるような接続状態となる。実際には、図３及び図４で示したように折り曲げ部１２の全面が板状部材１９に接続している状態ではない。折り曲げ部１２の断面形状によって折り曲げ部１２と板状部材１９との接続状態は異なる。   The connection state between the bent portion 12 provided at the upper end of the frame-like member 11 and the plate-like member 19 is a connection state as shown in regions S1 and S2 (regions surrounded by a thin circle) in FIG. . Actually, as shown in FIGS. 3 and 4, the entire surface of the bent portion 12 is not connected to the plate-like member 19. The connection state between the bent portion 12 and the plate-like member 19 differs depending on the cross-sectional shape of the bent portion 12.

図５（ｃ）に示されるように、枠状部材１１の上端に設けられる折り曲げ部の断面形状は、様々な断面形状が考えられる。例えば、折り曲げ部は、１２ａ〜１２ｅで示すような断面形状にして用いることができる。本実施形態においては、折り曲げ部の断面形状として１２ａで示す断面形状を用いた。したがって、折り曲げ部１２と板状部材１９との接続状態は、図５（ａ）に示したような接続状態となっている。   As shown in FIG. 5C, the cross-sectional shape of the bent portion provided at the upper end of the frame-shaped member 11 can be various cross-sectional shapes. For example, the bent portion can be used in a cross-sectional shape as indicated by 12a to 12e. In this embodiment, the cross-sectional shape indicated by 12a is used as the cross-sectional shape of the bent portion. Therefore, the connection state between the bent portion 12 and the plate-like member 19 is a connection state as shown in FIG.

図５（ｂ）に示されるように、折り曲げ部１２と板状部材１９とは、接触部２６ａ及び２６ｂを介して接続される。折り曲げ部１２が弾性変形することによって、接触部２６ａ及び２６ｂを介して折り曲げ部１２と板状部材１９とが接続される。したがって、折り曲げ部１２と板状部材１９との間（接触部２６ａと接触部２６ｂとの間）には、樹脂が充填された状態のわずかな隙間２７が生じる。   As shown in FIG. 5B, the bent portion 12 and the plate-like member 19 are connected via the contact portions 26a and 26b. When the bent portion 12 is elastically deformed, the bent portion 12 and the plate member 19 are connected via the contact portions 26a and 26b. Therefore, a slight gap 27 filled with resin is generated between the bent portion 12 and the plate-like member 19 (between the contact portion 26a and the contact portion 26b).

封止前基板１を樹脂成形する際に、板状部材１９と折り曲げ部１２との間の隙間２７にも流動性樹脂２１が侵入する。侵入した流動性樹脂２１は硬化することによって硬化樹脂（封止樹脂）２２ａを成形する。したがって、板状部材１９と折り曲げ部１２との間には、硬化樹脂２２ａが存在する部分（具体的には隙間２７に成形された硬化樹脂２２ａに相当する）と硬化樹脂２２ａが存在しない部分（具体的には接触部２６ａ及び２６ｂに相当する）とが存在する。なお、図５（ａ）、（ｂ）には、後述の図５（ｃ）の１２ａで示す断面形状の折り曲げ部が、上型１３と下型１４との型締めにより、弾性変形した一例の様子を示している。   When the pre-sealing substrate 1 is resin-molded, the fluid resin 21 also enters the gap 27 between the plate-like member 19 and the bent portion 12. The infiltrating fluid resin 21 is cured to form a cured resin (sealing resin) 22a. Therefore, a portion where the cured resin 22a exists (specifically, corresponds to the cured resin 22a formed in the gap 27) and a portion where the cured resin 22a does not exist (between the plate member 19 and the bent portion 12). Specifically, it corresponds to the contact portions 26a and 26b). 5A and 5B show an example in which a bent portion having a cross-sectional shape indicated by 12a in FIG. 5C described later is elastically deformed by clamping the upper mold 13 and the lower mold 14. FIG. It shows a state.

折り曲げ部１２と板状部材１９との接続状態は、図５（ｃ）に示されるような折り曲げ部１２の断面形状によって異なる。例えば、折り曲げ部１２ａ、１２ｂ、１２ｃのような断面形状であれば、折り曲げ部が弾性変形することにより１箇所又は２箇所で接続される。折り曲げ部１２ｄ、１２ｅのような断面形状であれば、折り曲げ部が弾性変形することにより１箇所で接続される。いずれの場合においても、折り曲げ部１２が弾性変形することによって、板状部材１９と折り曲げ部１２とは電気的に接続する。   The connection state between the bent portion 12 and the plate-like member 19 differs depending on the cross-sectional shape of the bent portion 12 as shown in FIG. For example, in the case of a cross-sectional shape such as the bent portions 12a, 12b, and 12c, the bent portions are connected at one or two locations by elastic deformation. If it is a cross-sectional shape like the bending parts 12d and 12e, it will be connected in one place by elastically deforming a bending part. In any case, the bent portion 12 is elastically deformed, so that the plate member 19 and the bent portion 12 are electrically connected.

図５（ｃ）において、折り曲げ部１２ａ〜１２ｅのいずれも、板状部材１９とは平行とはならない部分を備えていて、上型１３と下型１４との型締めにより、板状部材１９とは角度をなして接触するような形状である。   In FIG. 5C, each of the bent portions 12a to 12e includes a portion that is not parallel to the plate member 19, and the plate member 19 and the lower die 14 are clamped by clamping the upper member 13 and the lower die 14. Is a shape that makes contact at an angle.

折り曲げ部１２ａ及び１２ｃは、上型１３と下型１４との型締めにより、その先端の角部が板状部材１９と接触してから弾性変形することになる。この際、折り曲げ部１２ａ及び１２ｃの先端が板状部材１９に食い込むことにより、より確実に板状部材１９と折り曲げ部１２とは電気的に接続することができる。より確実に、折り曲げ部１２ａ及び１２ｃの先端を板状部材１９に食い込ませるには、折り曲げ部１２ａ及び１２ｃの先端を尖らせておけばよい。   The bent portions 12 a and 12 c are elastically deformed after the upper corner 13 and the lower die 14 are clamped so that the corners at the tips contact the plate-like member 19. At this time, the ends of the bent portions 12a and 12c bite into the plate-like member 19, whereby the plate-like member 19 and the bent portion 12 can be electrically connected more reliably. In order to bite the tips of the bent portions 12a and 12c into the plate member 19 more reliably, the tips of the bent portions 12a and 12c may be sharpened.

折り曲げ部１２ｄ及び１２ｅは、上型１３と下型１４との型締めにより、枠状部材１１との接続部分と先端との間の中間部分が板状部材１９と接触してから弾性変形することになる。   The bent portions 12d and 12e are elastically deformed after the intermediate portion between the connecting portion and the tip of the frame-shaped member 11 comes into contact with the plate-shaped member 19 by clamping the upper die 13 and the lower die 14. become.

折り曲げ部１２ｂは、上型１３と下型１４との型締めにより、枠状部材１１との接続部分か先端かのいずれかが接触してから弾性変形することになる。   The bent portion 12b is elastically deformed after the upper mold 13 and the lower mold 14 are clamped, either at the connecting portion with the frame member 11 or at the tip.

図示はしないが、折り曲げ部の形態としては、平坦な折り曲げ部の一部を変形させて板状部材側に突出させたり、平坦な折り曲げ部の一部を打ち抜き加工して板状部材側にばり状部が突き出るようにするなど、様々な形状を用いることができる。   Although not shown, as a form of the bent portion, a part of the flat bent portion is deformed and protruded to the plate-like member side, or a part of the flat bent portion is punched and applied to the plate-like member side. Various shapes can be used, such as a protruding portion.

いずれの形状にせよ、板状部材と折り曲げ部との間には、封止樹脂が存在する部分と封止樹脂が存在しない部分とが存在する。   Regardless of the shape, a portion where the sealing resin exists and a portion where the sealing resin does not exist exist between the plate-like member and the bent portion.

なお、後述する実施形態２〜５においても、特に説明していない限り、折り曲げ部の形状等は本実施形態と同じである。   Note that, in Embodiments 2 to 5 to be described later, the shape and the like of the bent portion are the same as in this embodiment unless otherwise described.

（作用効果）
本実施形態の電子回路装置の製造方法は、第１型である上型１３と上型１３に対向して配置される第２型である下型１４とを有する成形型を用いて、電子部品である半導体チップ３が装着された基板２に対して樹脂成形して、半導体チップ３がシールド用部材によりシールドされた構造の電子回路装置２５を製造する電子回路装置の製造方法であって、シールド用部材として、導電性の板状部材１９と、少なくとも一方の端部が折り曲げられて弾性変形可能とされた折り曲げ部１２を備える導電性の枠状部材１１とを準備する工程と、上型１３と下型１４との間に、基板２と枠状部材１１と板状部材１９とがこの順にて、基板２及び板状部材１９の少なくとも一方側に折り曲げ部１２が配置された状態において、上型１３と下型１４とを型締めして、折り曲げ部１２を弾性変形させて樹脂成形を行う樹脂成形工程とを含む。 (Function and effect)
The method of manufacturing an electronic circuit device according to the present embodiment uses a molding die having an upper die 13 that is a first die and a lower die 14 that is a second die disposed to face the upper die 13. An electronic circuit device manufacturing method for manufacturing an electronic circuit device 25 having a structure in which a semiconductor chip 3 is resin-molded on a substrate 2 on which a semiconductor chip 3 is mounted and the semiconductor chip 3 is shielded by a shielding member. A step of preparing a conductive plate-like member 19 and a conductive frame-like member 11 having a bent portion 12 which is bent at least at one end to be elastically deformed, and an upper mold 13 In the state in which the substrate 2, the frame-shaped member 11, and the plate-shaped member 19 are arranged in this order between the substrate 2 and the lower mold 14, and the bent portion 12 is disposed on at least one side of the substrate 2 and the plate-shaped member 19 Clamp the mold 13 and the lower mold 14 To, and a resin molding step the bent portion 12 is elastically deformed performing resin molding.

この方法によれば、樹脂成形することにより、枠状部材１１に設けられた折り曲げ部１２を弾性変形させて板状部材１９と枠状部材１１とを電気的に接続することができる。したがって、電子回路装置２５を枠状部材１１と板状部材１９とによって電磁シールドすることができる。かつ、基板２と枠状部材１１と板状部材１９とをこの順に配置して樹脂成形することにより電子回路装置２５を電磁シールドすることができる。したがって、電子回路装置２５の製造コストを低減することができる。   According to this method, the plate-shaped member 19 and the frame-shaped member 11 can be electrically connected by elastically deforming the bent portion 12 provided on the frame-shaped member 11 by resin molding. Therefore, the electronic circuit device 25 can be electromagnetically shielded by the frame-like member 11 and the plate-like member 19. Moreover, the electronic circuit device 25 can be electromagnetically shielded by arranging the substrate 2, the frame-shaped member 11, and the plate-shaped member 19 in this order and performing resin molding. Therefore, the manufacturing cost of the electronic circuit device 25 can be reduced.

本実施形態の電子回路装置２５は、基板２に装着された電子部品である半導体チップ３と、半導体チップ３をシールドする導電性の枠状部材１１と、枠状部材１１の基板２とは反対側に配置され、枠状部材１１と電気的に接続された導電性の板状部材１９と、少なくとも基板２と板状部材１９との間に配置された封止樹脂である硬化樹脂２２とを備え、基板２及び板状部材１９の少なくとも一方側において枠状部材１１の端部が折り曲げられた折り曲げ部１２が設けられており、折り曲げ部１２を含む枠状部材１１が弾性変形可能な材質であり、基板２及び板状部材１９の少なくとも一方と折り曲げ部１２との間に、硬化樹脂２２ａが存在する部分である隙間２７と硬化樹脂２２ａが存在しない部分である接触部２６ａ、２６ｂとが存在する構成としている。   The electronic circuit device 25 of the present embodiment is opposite to the semiconductor chip 3 that is an electronic component mounted on the substrate 2, the conductive frame member 11 that shields the semiconductor chip 3, and the substrate 2 of the frame member 11. A conductive plate member 19 disposed on the side and electrically connected to the frame member 11, and a cured resin 22 which is a sealing resin disposed at least between the substrate 2 and the plate member 19. A bent portion 12 is provided by bending the end of the frame-like member 11 on at least one side of the substrate 2 and the plate-like member 19, and the frame-like member 11 including the bent portion 12 is made of a material that can be elastically deformed. Yes, between at least one of the substrate 2 and the plate-like member 19 and the bent portion 12, there is a gap 27 that is a portion where the cured resin 22a exists and contact portions 26a and 26b that are portions where the cured resin 22a does not exist. Do We are trying to be.

この構成によれば、枠状部材１１に設けられた折り曲げ部１２を弾性変形させて板状部材１９と枠状部材１１とを接続する。板状部材１９と折り曲げ部１２との間に硬化樹脂２２ａが存在しない部分である接触部２６ａ、２６ｂが存在し、これらの接触部２６ａ、２６ｂにおいて板状部材１９と枠状部材１１とを電気的に接続することができる。したがって、電子回路装置２５を枠状部材１１と板状部材１９とによって電磁シールドすることができる。   According to this structure, the bending part 12 provided in the frame-shaped member 11 is elastically deformed to connect the plate-shaped member 19 and the frame-shaped member 11. Contact portions 26a and 26b, which are portions where the cured resin 22a does not exist, exist between the plate-like member 19 and the bent portion 12, and the plate-like member 19 and the frame-like member 11 are electrically connected to each other at these contact portions 26a and 26b. Can be connected. Therefore, the electronic circuit device 25 can be electromagnetically shielded by the frame-like member 11 and the plate-like member 19.

本実施形態によれば、封止前基板１に設けられた接地電極７の上に導電性の枠状部材１１を接続する。枠状部材１１は端部（上端）に弾性変形可能な折り曲げ部１２を有する。圧縮成形法による成形型において、上型１３に半導体チップ３と枠状部材１１とが装着された封止前基板１を供給する。下型１４に導電性の板状部材１９と樹脂材料（顆粒状樹脂）２０とを供給する。上型１３と下型１４とを型締めして樹脂成形することによって、折り曲げ部１２を弾性変形させて板状部材１９と枠状部材１１とを電気的に接続する。このことにより、樹脂成形された電子回路装置２５を枠状部材１１と板状部材１９とによって電磁シールドすることができる。   According to this embodiment, the conductive frame-like member 11 is connected to the ground electrode 7 provided on the substrate 1 before sealing. The frame-shaped member 11 has a bent portion 12 that can be elastically deformed at an end portion (upper end). In the molding die by the compression molding method, the substrate 1 before sealing in which the semiconductor chip 3 and the frame member 11 are mounted on the upper die 13 is supplied. A conductive plate member 19 and a resin material (granular resin) 20 are supplied to the lower mold 14. The upper mold 13 and the lower mold 14 are clamped and resin-molded, whereby the bent portion 12 is elastically deformed to electrically connect the plate-shaped member 19 and the frame-shaped member 11. Thus, the resin-molded electronic circuit device 25 can be electromagnetically shielded by the frame-like member 11 and the plate-like member 19.

本実施形態によれば、枠状部材１１の上端に弾性変形可能な折り曲げ部１２を設ける。折り曲げ部１２を板状部材１９に接触させ押圧することによって折り曲げ部１２を弾性変形させる。このことによって、折り曲げ部１２を介して、板状部材１９と枠状部材１１とを電気的に接続することができる。したがって、板状部材１９と折り曲げ部１２と枠状部材１１と接地電極７とを電気的に導通させることができる。このことにより、電子回路装置２５を枠状部材１１と折り曲げ部１２と板状部材１９とによって電磁シールドすることができる。   According to the present embodiment, the bent portion 12 that is elastically deformable is provided at the upper end of the frame-shaped member 11. The bent portion 12 is elastically deformed by bringing the bent portion 12 into contact with the plate-like member 19 and pressing it. As a result, the plate-like member 19 and the frame-like member 11 can be electrically connected via the bent portion 12. Therefore, the plate-shaped member 19, the bent portion 12, the frame-shaped member 11, and the ground electrode 7 can be electrically connected. As a result, the electronic circuit device 25 can be electromagnetically shielded by the frame-shaped member 11, the bent portion 12, and the plate-shaped member 19.

本実施形態によれば、上型１３に半導体チップ３と枠状部材１１とが装着された封止前基板１を供給する。下型１４に導電性の板状部材１９と樹脂材料（顆粒状樹脂）２０とを供給する。上型１３と下型１４との間に、封止前基板１と枠状部材１１と板状部材１９とをこの順に配置して型締めする。樹脂成形することにより、折り曲げ部１２を弾性変形させて板状部材１９と枠状部材１１とを電気的に接続することができる。したがって、シ−ルド構造の電子回路装置２５を製造する製造コストを低減することができる。   According to the present embodiment, the pre-sealing substrate 1 in which the semiconductor chip 3 and the frame-like member 11 are mounted on the upper mold 13 is supplied. A conductive plate member 19 and a resin material (granular resin) 20 are supplied to the lower mold 14. Between the upper mold | type 13 and the lower mold | type 14, the board | substrate 1 before sealing, the frame-shaped member 11, and the plate-shaped member 19 are arrange | positioned in this order, and it clamps. By molding the resin, the bent portion 12 can be elastically deformed to electrically connect the plate-like member 19 and the frame-like member 11. Therefore, the manufacturing cost for manufacturing the electronic circuit device 25 having the shield structure can be reduced.

本実施形態によれば、枠状部材１１の上端に弾性変形可能な折り曲げ部１２を設ける。折り曲げ部１２を弾性変形させて板状部材１９と枠状部材１１とを接続する。折り曲げ部１２が弾性変形することによって、板状部材１９と折り曲げ部１２との間に硬化樹脂２２ａが存在しない部分である接触部２６ａ、２６ｂが得られる。接触部２６ａ、２６ｂによって板状部材１９と枠状部材１１とを電気的に接続することができる。したがって、電子回路装置２５を枠状部材１１と板状部材１９とによって電磁シールドすることができる。
〔実施形態２〕 According to the present embodiment, the bent portion 12 that is elastically deformable is provided at the upper end of the frame-shaped member 11. The bent portion 12 is elastically deformed to connect the plate-like member 19 and the frame-like member 11. When the bent portion 12 is elastically deformed, contact portions 26a and 26b that are portions where the cured resin 22a does not exist between the plate-like member 19 and the bent portion 12 are obtained. The plate-shaped member 19 and the frame-shaped member 11 can be electrically connected by the contact portions 26a and 26b. Therefore, the electronic circuit device 25 can be electromagnetically shielded by the frame-like member 11 and the plate-like member 19.
[Embodiment 2]

（封止前基板の構成）
本発明に係る実施形態２の電子回路装置において使用される封止前基板の構成について、図６を参照して説明する。本実施形態においては、電子部品として樹脂封止された異なる種類の電子部品を装着した封止前基板を示す。 (Configuration of substrate before sealing)
The configuration of the pre-sealing substrate used in the electronic circuit device according to the second embodiment of the present invention will be described with reference to FIG. In the present embodiment, a substrate before sealing on which different types of electronic components sealed with resin as electronic components are mounted is shown.

図６に示されるように、封止前基板２８は、基板２９と基板２９の上に装着された複数の電子部品３０及び電子部品３１とを備える。電子部品３０と電子部品３１とは種類が異なり、それぞれが樹脂封止された完成済みの電子部品である。本実施形態においては、電子部品３０と電子部品３１とをモジュール化した電子回路装置が製造される。   As shown in FIG. 6, the pre-sealing substrate 28 includes a substrate 29 and a plurality of electronic components 30 and electronic components 31 mounted on the substrate 29. The electronic component 30 and the electronic component 31 are different types, and each is a completed electronic component sealed with resin. In the present embodiment, an electronic circuit device in which the electronic component 30 and the electronic component 31 are modularized is manufactured.

基板２９の表面には、電子部品３０に対応して複数の基板電極３２ａが設けられる。電子部品３０は、複数のバンプ３３ａを介して基板電極３２ａにそれぞれ接続される。同様に、基板２９の表面には、電子部品３１に対応して複数の基板電極３２ｂが設けられる。電子部品３１は、複数のバンプ３３ｂを介して基板電極３２ｂにそれぞれ接続される。   A plurality of substrate electrodes 32 a are provided on the surface of the substrate 29 corresponding to the electronic components 30. The electronic component 30 is connected to the substrate electrode 32a through a plurality of bumps 33a. Similarly, a plurality of substrate electrodes 32 b are provided on the surface of the substrate 29 corresponding to the electronic components 31. The electronic component 31 is connected to the substrate electrode 32b via a plurality of bumps 33b.

基板電極３２ａは、基板２９の表面に設けられた配線及び基板２９の内部に設けられたビア配線を介して基板電極３２ｂ、又は、基板２９の裏面に設けられた外部電極にそれぞれ接続される。電子部品３０と電子部品３１とを基板電極３２ａ、３２ｂを介して接続することにより電子部品３０と電子部品３１とがモジュール化される。基板電極３２ａ、３２ｂ、配線及びビア配線は、電気抵抗率が小さいＣｕを用いることが好ましい。   The substrate electrode 32 a is connected to the substrate electrode 32 b or an external electrode provided on the back surface of the substrate 29 through wiring provided on the surface of the substrate 29 and via wiring provided in the substrate 29. By connecting the electronic component 30 and the electronic component 31 via the substrate electrodes 32a and 32b, the electronic component 30 and the electronic component 31 are modularized. The substrate electrodes 32a and 32b, the wiring, and the via wiring are preferably made of Cu having a low electrical resistivity.

複数の基板電極３２ａ、３２ｂのうち、特定の電極は、電子部品３０又は電子部品３１の電位を接地電位にするための接地電極３４、３４ａを構成する。接地電極３４、３４ａは電気抵抗率が小さいＣｕが用いられる。図６（ａ）の上段に示されるように、接地電極３４、３４ａは電子部品３０及び電子部品３１の周囲をそれぞれ取り囲む枠状のパターンとして形成される。図６（ａ）において、電子部品３０及び電子部品３１の外周を取り囲むようにして形成される接地電極３４はパターン幅Ｗを有し、電子部品３０と電子部品３１との間に形成される接地電極３４ａはパターン幅Ｗ１を有する。   Among the plurality of substrate electrodes 32a and 32b, a specific electrode constitutes ground electrodes 34 and 34a for setting the potential of the electronic component 30 or the electronic component 31 to the ground potential. The ground electrodes 34 and 34a are made of Cu having a small electrical resistivity. As shown in the upper part of FIG. 6A, the ground electrodes 34 and 34 a are formed as a frame-shaped pattern that surrounds the electronic component 30 and the electronic component 31. In FIG. 6A, the ground electrode 34 formed so as to surround the outer periphery of the electronic component 30 and the electronic component 31 has a pattern width W, and is formed between the electronic component 30 and the electronic component 31. The electrode 34a has a pattern width W1.

基板２９の表面には、基板電極３２ａ、３２ｂ及び接地電極３４、３４ａの表面を除いて、ソルダレジスト３５が設けられる。   A solder resist 35 is provided on the surface of the substrate 29 except for the surfaces of the substrate electrodes 32a and 32b and the ground electrodes 34 and 34a.

基板２９に設けられた接地電極３４、３４ａの上には枠状部材３６が設けられる。枠状部材３６は、導電性接着剤又は半田などによって接地電極３４、３４ａに接続される。枠状部材３６は端部に弾性変形可能な折り曲げ部３７、３７ａを有する。図６においては、枠状部材３６の上端に折り曲げ部３７、３７ａが設けられる。枠状部材３６の上端に設けられた折り曲げ部３７、３７ａは、電子部品３０及び電子部品３１よりも高い位置に設けられる。   A frame-shaped member 36 is provided on the ground electrodes 34 and 34 a provided on the substrate 29. The frame-shaped member 36 is connected to the ground electrodes 34 and 34a by a conductive adhesive or solder. The frame-like member 36 has bent portions 37 and 37a that can be elastically deformed at the ends. In FIG. 6, bent portions 37 and 37 a are provided at the upper end of the frame-shaped member 36. The bent portions 37 and 37 a provided at the upper end of the frame-like member 36 are provided at a position higher than the electronic component 30 and the electronic component 31.

図６（ａ）に示されるように、折り曲げ部３７、３７ａは、平面視して接地電極３４、３４ａに重なるようにして設けられる。外周に設けられる折り曲げ部３７の長さＬは、外周に形成された接地電極３４のパターン幅Ｗと同じ程度に形成される。電子部品３０と電子部品３１との間に設けられる折り曲げ部３７ａの長さＬ１は、接地電極３４ａのパターン幅Ｗ１と同じ程度に形成される。   As shown in FIG. 6A, the bent portions 37 and 37a are provided so as to overlap the ground electrodes 34 and 34a in plan view. The length L of the bent portion 37 provided on the outer periphery is formed to the same extent as the pattern width W of the ground electrode 34 formed on the outer periphery. The length L1 of the bent portion 37a provided between the electronic component 30 and the electronic component 31 is formed to be approximately the same as the pattern width W1 of the ground electrode 34a.

封止前基板２８には、基板２９を切断するための切断線３８がＸ方向及びＹ方向（図６（ａ）において横方向及び縦方向に示す破線）に沿ってそれぞれ設けられる。複数の切断線３８によって囲まれる領域３９ａ、３９ｂが、それぞれ樹脂成形されてモジュール化される電子回路装置となる領域に相当する。   A cutting line 38 for cutting the substrate 29 is provided on the pre-sealing substrate 28 along the X direction and the Y direction (broken lines shown in the horizontal direction and the vertical direction in FIG. 6A), respectively. Regions 39a and 39b surrounded by a plurality of cutting lines 38 correspond to regions that become electronic circuit devices that are molded by resin and modularized.

なお、図６（ａ）において、上段に示す領域３９ａは、接地電極３４、３４ａを実線で図示し、枠状部材３６と折り曲げ部３７、３７ａとを二点鎖線で図示している。下段に示す領域３９ｂは、枠状部材３６の折り曲げ部３７、３７ａの平面形状をわかりやすくするために、枠状部材３６と折り曲げ部３７、３７ａとを実線で図示し、接地電極３４、３４ａの図示を省略している。   In FIG. 6A, in the upper region 39a, the ground electrodes 34 and 34a are indicated by solid lines, and the frame member 36 and the bent portions 37 and 37a are indicated by two-dot chain lines. In the lower region 39b, the frame-shaped member 36 and the bent portions 37, 37a are illustrated by solid lines so that the planar shape of the bent portions 37, 37a of the frame-shaped member 36 can be easily understood, and the ground electrodes 34, 34a The illustration is omitted.

図６においては、枠状部材３６の強度及び安定性を確保するために、電子部品３０と電子部品３１とを区画（シールド）する枠状部材３６の折り曲げ部３７ａを分割せずに連続して設けた場合を示した。折り曲げ部３７ａの長さＬ１は、接地電極３４ａのパターン幅Ｗ１同じ程度に形成される。これに限らず、領域３９ａ、３９ｂの外周を取り囲む枠状部材３６の折り曲げ部３７と同様に折り曲げ部３７ａを分割してもよい。   In FIG. 6, in order to ensure the strength and stability of the frame-shaped member 36, the bent portion 37a of the frame-shaped member 36 that partitions (shields) the electronic component 30 and the electronic component 31 is continuously divided without being divided. The case where it was provided is shown. The length L1 of the bent portion 37a is formed to be approximately the same as the pattern width W1 of the ground electrode 34a. Not only this but the bending part 37a may be divided | segmented similarly to the bending part 37 of the frame-shaped member 36 surrounding the outer periphery of area | region 39a, 39b.

本実施形態では、基板２９の基板電極３２ａ、３２ｂに対して電子部品３０、３１のバンプ電極３３ａ、３３ｂを接続する構成なので、それらの接続と共通の接続工程により、基板２９の接地電極３４、３４ａに対して枠状部材３６も接続することができる。例えば、共通のリフロー半田付け工程により、基板２９の基板電極３２ａ、３２ｂに対して電子部品３０、３１のバンプ電極３３ａ、３３ｂを接続すると共に、基板２９の接地電極３４、３４ａに対して枠状部材３６を接続することができる。この点については、後述の実施形態３、４についても、バンプ電極を備えた電子部品を用いているので、本実施形態と同じである。   In the present embodiment, since the bump electrodes 33a and 33b of the electronic components 30 and 31 are connected to the substrate electrodes 32a and 32b of the substrate 29, the ground electrode 34 of the substrate 29, A frame-like member 36 can also be connected to 34a. For example, the bump electrodes 33 a and 33 b of the electronic components 30 and 31 are connected to the substrate electrodes 32 a and 32 b of the substrate 29 by a common reflow soldering process, and a frame shape is formed to the ground electrodes 34 and 34 a of the substrate 29. The member 36 can be connected. In this regard, the third and fourth embodiments to be described later are the same as the present embodiment because the electronic component including the bump electrode is used.

（樹脂成形工程及び個片化工程）
図７〜８を参照して、図６に示した封止前基板２８を樹脂成形して封止済基板を作製し、封止済基板を個片化してモジュール化された電子回路装置を製造する工程を説明する。樹脂成形工程及び個片化工程は基本的に実施形態１と同じなので説明を簡略化する。 (Resin molding process and individualization process)
Referring to FIGS. 7 to 8, the pre-sealing substrate 28 shown in FIG. 6 is resin-molded to produce a sealed substrate, and the sealed substrate is singulated to produce a modularized electronic circuit device. The process to perform is demonstrated. Since the resin molding step and the individualization step are basically the same as those in the first embodiment, the description will be simplified.

図７（ａ）に示されるように、まず、上型１３と下型１４とを型開きする。次に、図６に示した封止前基板２８（電子部品３０と電子部品３１と枠状部材３６とを装着済み）を上型１３の型面に供給する。   As shown in FIG. 7A, first, the upper mold 13 and the lower mold 14 are opened. Next, the substrate 28 before sealing shown in FIG. 6 (with the electronic component 30, the electronic component 31, and the frame-shaped member 36 already mounted) is supplied to the mold surface of the upper mold 13.

次に、下型１４に設けられたキャビティ１７に離型フィルム１８と板状部材１９と樹脂材料（顆粒状樹脂）２０とを供給する。次に、下型１４に設けられたヒータによって顆粒状樹脂２０を加熱して流動性樹脂２１を生成する。   Next, a release film 18, a plate-shaped member 19, and a resin material (granular resin) 20 are supplied to the cavity 17 provided in the lower mold 14. Next, the granular resin 20 is heated by the heater provided in the lower mold 14 to generate the fluid resin 21.

次に、図７（ｂ）に示されるように、型締機構によって上型１３と下型１４とを型締めする。型締めすることによって、封止前基板２８に装着された電子部品３０、３１と枠状部材３６とを流動性樹脂２１に浸漬させる。枠状部材３６の各面に開口部を設けておくと、型締めした際にキャビティ１７内において流動性樹脂２１を安定して流動させることができる。   Next, as shown in FIG. 7B, the upper mold 13 and the lower mold 14 are clamped by a mold clamping mechanism. By clamping the mold, the electronic components 30 and 31 and the frame-shaped member 36 mounted on the pre-sealing substrate 28 are immersed in the fluid resin 21. If an opening is provided on each surface of the frame-shaped member 36, the fluid resin 21 can be stably flowed in the cavity 17 when the mold is clamped.

側面部材１６によって封止前基板２８をクランプした状態で底面部材１５のみを更に上昇させる。枠状部材３６の上端に設けられた折り曲げ部３７、３７ａと板状部材１９とを接触させる。更に、板状部材１９によって折り曲げ部１２を押圧することにより折り曲げ部３７、３７ａを弾性変形させる。折り曲げ部３７、３７ａを弾性変形させた状態で、キャビティ１７内の流動性樹脂２１に所定の樹脂圧力を加える。   In a state where the pre-sealing substrate 28 is clamped by the side member 16, only the bottom member 15 is further raised. The bent portions 37 and 37a provided at the upper end of the frame-shaped member 36 and the plate-shaped member 19 are brought into contact with each other. Furthermore, the bent portions 37 and 37 a are elastically deformed by pressing the bent portion 12 with the plate-like member 19. A predetermined resin pressure is applied to the fluid resin 21 in the cavity 17 in a state where the bent portions 37 and 37a are elastically deformed.

次に、図７（ｃ）に示されるように、下型１４に設けられたヒータを使用して、流動性樹脂２１を加熱して硬化樹脂２２を成形する。このことにより、封止前基板２８に装着された電子部品３０、３１と枠状部材３６とを硬化樹脂（封止樹脂）２２によって樹脂封止する。   Next, as shown in FIG. 7C, the flowable resin 21 is heated to form a cured resin 22 using a heater provided in the lower mold 14. As a result, the electronic components 30 and 31 and the frame-shaped member 36 mounted on the pre-sealing substrate 28 are resin-sealed with the cured resin (sealing resin) 22.

この状態で、枠状部材３６と板状部材１９とは折り曲げ部３７、３７ａを介して接続され、板状部材１９は硬化樹脂２２に固着される。折り曲げ部３７、３７ａを弾性変形させることによって、板状部材１９と枠状部材３６とを電気的に接続する。板状部材１９と折り曲げ部３７、３７ａと枠状部材３６と接地電極３４、３４ａとが電気的に導通する。このことにより、電子部品３０と電子部品３１とは、それぞれが枠状部材３６と折り曲げ部３７、３７ａと板状部材１９とによって取り囲まれて電磁シールドされる。   In this state, the frame member 36 and the plate member 19 are connected via the bent portions 37 and 37 a, and the plate member 19 is fixed to the cured resin 22. The plate-like member 19 and the frame-like member 36 are electrically connected by elastically deforming the bent portions 37 and 37a. The plate-shaped member 19, the bent portions 37 and 37a, the frame-shaped member 36, and the ground electrodes 34 and 34a are electrically connected. As a result, the electronic component 30 and the electronic component 31 are surrounded by the frame-shaped member 36, the bent portions 37 and 37a, and the plate-shaped member 19, and are electromagnetically shielded.

次に、図８（ａ）に示されるように、型締機構を使用して上型１３と下型１４とを型開きする。上型１３の型面には樹脂封止された樹脂成形品（封止済基板）４０が固定されている。樹脂成形品４０を成形型から取り出す。   Next, as shown in FIG. 8A, the upper mold 13 and the lower mold 14 are opened using a mold clamping mechanism. A resin molded product (sealed substrate) 40 sealed with resin is fixed to the mold surface of the upper mold 13. The resin molded product 40 is taken out from the mold.

次に、図８（ｂ）に示されるように、回転刃２４を有する切断装置を使用して樹脂成形品４０をＸ方向及びＹ方向に沿って設けられた切断線３８に沿って切断する。   Next, as shown in FIG. 8B, the resin molded product 40 is cut along cutting lines 38 provided along the X direction and the Y direction using a cutting device having the rotary blade 24.

図８（ｃ）に示されるように、樹脂成形品４０を個片化することによって電子回路装置４１がそれぞれ製造される。電子回路装置４１は、電子部品３０と電子部品３１とがモジュール化された複合機能を有し、電子部品３０と電子部品３１とはそれぞれが枠状部材３６と折り曲げ部３７、３７ａと板状部材１９とによって取り囲まれてシールドされた構造となっている。   As shown in FIG. 8C, the electronic circuit device 41 is manufactured by dividing the resin molded product 40 into individual pieces. The electronic circuit device 41 has a composite function in which the electronic component 30 and the electronic component 31 are modularized, and each of the electronic component 30 and the electronic component 31 includes a frame-shaped member 36, bent portions 37, 37a, and a plate-shaped member. It is surrounded by 19 and shielded.

（作用効果）
本実施形態の電子回路装置の製造方法は、第１型である上型１３と上型１３に対向して配置される第２型である下型１４とを有する成形型を用いて、電子部品３０及び電子部品３１が装着された基板２９に対して樹脂成形して、電子部品３０及び電子部品３１がシールド用部材によりシールドされた構造の電子回路装置４１を製造する電子回路装置の製造方法であって、シールド用部材として、導電性の板状部材１９と、少なくとも一方の端部が折り曲げられて弾性変形可能とされた折り曲げ部３７、３７ａを備える導電性の枠状部材３６とを準備する工程と、上型１３と下型１４との間に、基板２と枠状部材３６と板状部材１９とがこの順にて、基板２及び板状部材１９の少なくとも一方側に折り曲げ部３７、３７ａが配置された状態において、上型１３と下型１４とを型締めして、折り曲げ部３７、３７ａを弾性変形させて樹脂成形を行う樹脂成形工程とを含む。 (Function and effect)
The method of manufacturing an electronic circuit device according to the present embodiment uses a molding die having an upper die 13 that is a first die and a lower die 14 that is a second die disposed to face the upper die 13. An electronic circuit device manufacturing method for manufacturing an electronic circuit device 41 having a structure in which the electronic component 30 and the electronic component 31 are shielded by a shielding member by resin molding the substrate 29 on which the electronic component 30 and the electronic component 31 are mounted. As a shielding member, a conductive plate-like member 19 and a conductive frame-like member 36 provided with bent portions 37 and 37a which are bent at least one end to be elastically deformed are prepared. Between the process and the upper mold 13 and the lower mold 14, the substrate 2, the frame-shaped member 36, and the plate-shaped member 19 are bent in this order on at least one side of the substrate 2 and the plate-shaped member 19. In the state where Te, and an upper mold 13 and the lower mold 14 by clamping, and a bent portion 37,37a and is elastically deformed resin molding step of performing resin molding.

この方法によれば、樹脂成形することにより、枠状部材３６に設けられた折り曲げ部３７、３７ａを弾性変形させて板状部材１９と折り曲げ部３７、３７ａとを電気的に接続することができる。したがって、電子回路装置４１は電子部品３０と電子部品３１とをモジュール化した複合機能を備え、電子回路装置４１を構成する電子部品３０及び電子部品３１をそれぞれ枠状部材３６と板状部材１９とによって電磁シールドすることができる。かつ、基板２９と枠状部材３６と板状部材１９とをこの順に配置して樹脂成形することにより電子回路装置４１を電磁シールドすることができる。したがって、電子回路装置４１の製造コストを低減することができる。   According to this method, by bending resin, the bent portions 37 and 37a provided on the frame-like member 36 can be elastically deformed to electrically connect the plate-like member 19 and the bent portions 37 and 37a. . Therefore, the electronic circuit device 41 has a composite function in which the electronic component 30 and the electronic component 31 are modularized, and the electronic component 30 and the electronic component 31 constituting the electronic circuit device 41 are respectively connected to the frame-like member 36 and the plate-like member 19. Can be electromagnetically shielded. In addition, the electronic circuit device 41 can be electromagnetically shielded by arranging the substrate 29, the frame-like member 36, and the plate-like member 19 in this order and performing resin molding. Therefore, the manufacturing cost of the electronic circuit device 41 can be reduced.

本実施形態によれば、封止前基板２８に設けられた接地電極３４、３４ａの上に導電性の枠状部材３６を接続する。枠状部材３６は端部（上端）に弾性変形可能な折り曲げ部３７、３７ａを有する。圧縮成形法による成形型において、上型１３に電子部品３０、３１と枠状部材３６とが装着された封止前基板２８を供給する。下型１４に導電性の板状部材１９と樹脂材料（顆粒状樹脂）２０とを供給する。上型１３と下型１４とを型締めして樹脂成形することによって、折り曲げ部３７、３７ａを弾性変形させて板状部材１９と枠状部材３６とを電気的に接続する。このことにより、電子回路装置４１を電子部品３０と電子部品３１とによってモジュール化し、電子部品３０と電子部品３１とをそれぞれ枠状部材３６と板状部材１９とによって電磁シールドすることができる。   According to the present embodiment, the conductive frame member 36 is connected to the ground electrodes 34 and 34 a provided on the pre-sealing substrate 28. The frame-shaped member 36 has bent portions 37 and 37a that can be elastically deformed at an end portion (upper end). In the molding die by the compression molding method, the substrate 28 before sealing in which the electronic components 30 and 31 and the frame-like member 36 are mounted on the upper die 13 is supplied. A conductive plate member 19 and a resin material (granular resin) 20 are supplied to the lower mold 14. The upper die 13 and the lower die 14 are clamped and resin-molded, whereby the bent portions 37 and 37a are elastically deformed to electrically connect the plate-like member 19 and the frame-like member 36. Thus, the electronic circuit device 41 can be modularized by the electronic component 30 and the electronic component 31, and the electronic component 30 and the electronic component 31 can be electromagnetically shielded by the frame-shaped member 36 and the plate-shaped member 19, respectively.

本実施形態によれば、枠状部材３６の上端に弾性変形可能な折り曲げ部３７、３７ａを設ける。折り曲げ部３７、３７ａを板状部材１９に接触させ押圧することによって折り曲げ部３７、３７ａを弾性変形させる。このことによって、折り曲げ部３７、３７ａを介して、板状部材１９と枠状部材３６とを電気的に接続する。したがって、板状部材１９と折り曲げ部３７、３７ａと枠状部材３６と接地電極３４、３４ａとを電気的に導通させることができる。このことにより、電子回路装置４１を構成する電子部品３０と電子部品３１とをそれぞれ枠状部材３６と折り曲げ部３７、３７ａと板状部材１９とによって電磁シールドすることができる。   According to the present embodiment, the bent portions 37 and 37 a that can be elastically deformed are provided at the upper end of the frame-shaped member 36. The bent portions 37 and 37a are elastically deformed by contacting and pressing the bent portions 37 and 37a with the plate-like member 19. Thus, the plate-like member 19 and the frame-like member 36 are electrically connected via the bent portions 37 and 37a. Therefore, the plate-shaped member 19, the bent portions 37 and 37a, the frame-shaped member 36, and the ground electrodes 34 and 34a can be electrically connected. Thus, the electronic component 30 and the electronic component 31 constituting the electronic circuit device 41 can be electromagnetically shielded by the frame-shaped member 36, the bent portions 37 and 37a, and the plate-shaped member 19, respectively.

本実施形態によれば、上型１３に電子部品３０と電子部品３１と枠状部材３６とが装着された封止前基板２８を供給する。下型１４に導電性の板状部材１９と樹脂材料（顆粒状樹脂）２０とを供給する。上型１３と下型１４との間に、封止前基板２８と枠状部材３６と板状部材１９とをこの順に配置して型締めする。樹脂成形することにより、折り曲げ部３７、３７ａを弾性変形させて板状部材１９と枠状部材３６とを電気的に接続する。したがって、シ−ルド構造の電子回路装置４１を製造する製造コストを低減することができる。   According to this embodiment, the substrate 28 before sealing in which the electronic component 30, the electronic component 31, and the frame-shaped member 36 are mounted on the upper mold 13 is supplied. A conductive plate member 19 and a resin material (granular resin) 20 are supplied to the lower mold 14. Between the upper mold 13 and the lower mold 14, the pre-sealing substrate 28, the frame-shaped member 36, and the plate-shaped member 19 are arranged in this order and clamped. By bending the resin, the bent portions 37 and 37 a are elastically deformed to electrically connect the plate-like member 19 and the frame-like member 36. Therefore, the manufacturing cost for manufacturing the electronic circuit device 41 having the shield structure can be reduced.

本実施形態によれば、電子部品３０と電子部品３１とをモジュール化することによって、電子回路装置４１を構成する。電子部品３０と電子部品３１とはそれぞれが枠状部材３６と折り曲げ部３７、３７ａと板状部材１９とによって電磁シールドされる。したがって、電子部品３０と電子部品３１とはそれぞれが電磁ノイズによる誤動作を抑制し、信頼性の向上を図ることができる。よって、電子回路装置４１の信頼性及び性能を向上させることが可能となる。
〔実施形態３〕 According to the present embodiment, the electronic circuit device 41 is configured by modularizing the electronic component 30 and the electronic component 31. The electronic component 30 and the electronic component 31 are electromagnetically shielded by the frame-shaped member 36, the bent portions 37 and 37a, and the plate-shaped member 19, respectively. Therefore, each of the electronic component 30 and the electronic component 31 can suppress malfunction due to electromagnetic noise and improve reliability. Therefore, the reliability and performance of the electronic circuit device 41 can be improved.
[Embodiment 3]

（封止前基板の構成）
本発明に係る実施形態３の電子回路装置において使用される封止前基板の構成について、図９を参照して説明する。本実施形態では、例えば、モノのインターネット：ＩｏＴ（Internet of Things ）において使用される電子回路装置について説明する。 (Configuration of substrate before sealing)
The configuration of the pre-sealing substrate used in the electronic circuit device according to Embodiment 3 of the present invention will be described with reference to FIG. In this embodiment, for example, an electronic circuit device used in the Internet of Things (IoT) will be described.

図９（ａ）に示されるように、ＩｏＴに用いられる封止前基板４２は、基板４３と基板４３の上に装着された複数の電子部品４４、４５、４６、４７を備える。例えば、電子部品４４は、図示しない電源からの電力を変換して他の回路部（通信回路、検知回路及び演算回路の少なくとも一つ）に供給する電源回路から構成される。電子部品４５は、外部とデータの通信を行う通信回路から構成される。電子部品４６は、少なくともセンサから信号を取得して処理する検知回路から構成される。電子部品４７は、通信回路及び／又は検知回路からのデータに基づき演算を行う演算回路（制御回路）から構成される。これらの電子部品４４、４５、４６、４７をモジュール化することによりＩｏＴで使用される電子回路装置が構成される。   As shown in FIG. 9A, the pre-sealing substrate 42 used for IoT includes a substrate 43 and a plurality of electronic components 44, 45, 46, 47 mounted on the substrate 43. For example, the electronic component 44 includes a power supply circuit that converts electric power from a power supply (not shown) and supplies it to another circuit unit (at least one of a communication circuit, a detection circuit, and an arithmetic circuit). The electronic component 45 includes a communication circuit that performs data communication with the outside. The electronic component 46 includes at least a detection circuit that acquires and processes a signal from a sensor. The electronic component 47 includes an arithmetic circuit (control circuit) that performs an operation based on data from the communication circuit and / or the detection circuit. These electronic components 44, 45, 46 and 47 are modularized to constitute an electronic circuit device used in IoT.

各電子部品４４、４５、４６、４７は、それぞれバンプ４８を介して基板電極４９に接続される。接地電極５０、５０ａは、それぞれの電子部品４４、４５、４６、４７の周囲を取り囲むようにして基板４３に形成される。それぞれの電子部品の外周に形成される接地電極５０はパターン幅Ｗを有し、各電子部品の間に形成される接地電極５０ａはパターン幅Ｗ２を有する。それぞれの電子部品４４、４５、４６、４７は、基板４３の内部に設けられたビア配線を介して接続される。   Each electronic component 44, 45, 46, 47 is connected to a substrate electrode 49 via a bump 48. The ground electrodes 50, 50 a are formed on the substrate 43 so as to surround the respective electronic components 44, 45, 46, 47. The ground electrode 50 formed on the outer periphery of each electronic component has a pattern width W, and the ground electrode 50a formed between the electronic components has a pattern width W2. Each electronic component 44, 45, 46, 47 is connected via a via wiring provided inside the substrate 43.

（枠状部材の構成）
図１０を参照して、図９で示した封止前基板４２に装着される枠状部材について説明する。図１０（ｂ）に示されるように、枠状部材５１は、上端及び下端にそれぞれ弾性変形可能な複数の折り曲げ部を有する。枠状部材５１は、上端に弾性変形可能な複数の折り曲げ部５２ａ、５２ｂを有する。同様に、枠状部材５１は、下端に弾性変形可能な複数の折り曲げ部５２ｃ、５２ｄを有する。複数の折り曲げ部５２ａ、５２ｃは、平面視して接地電極５０（図９（ａ）参照）に重なるようにして設けられる。同様に、複数の折り曲げ部５２ｂ、５２ｄは、平面視して接地電極５０ａ（図９（ａ）参照）に重なるようにして設けられる。 (Configuration of frame-shaped member)
With reference to FIG. 10, the frame-shaped member mounted on the pre-sealing substrate 42 shown in FIG. 9 will be described. As shown in FIG. 10B, the frame-shaped member 51 has a plurality of bent portions that can be elastically deformed at the upper end and the lower end, respectively. The frame-like member 51 has a plurality of bent portions 52a and 52b that can be elastically deformed at the upper end. Similarly, the frame-shaped member 51 has a plurality of bent portions 52c and 52d that can be elastically deformed at the lower end. The plurality of bent portions 52a and 52c are provided so as to overlap the ground electrode 50 (see FIG. 9A) in plan view. Similarly, the plurality of bent portions 52b and 52d are provided so as to overlap the ground electrode 50a (see FIG. 9A) in plan view.

複数の折り曲げ部５２ａ、５２ｃの長さＬは、接地電極５０のパターン幅Ｗと同じ程度に形成される。複数の折り曲げ部５２ｂ、５２ｄの長さＬ２は、接地電極５０ａのパターン幅Ｗ２と同じ程度に形成される。枠状部材５１の強度及び安定性を確保するために、それぞれの電子部品４４、４５、４６、４７の間を区画する枠状部材５１の折り曲げ部５２ｂ、５２ｄの長さＬ２を大きくしている。   The length L of the plurality of bent portions 52 a and 52 c is formed to be approximately the same as the pattern width W of the ground electrode 50. The length L2 of the plurality of bent portions 52b and 52d is formed to be approximately the same as the pattern width W2 of the ground electrode 50a. In order to ensure the strength and stability of the frame-like member 51, the length L2 of the bent portions 52b, 52d of the frame-like member 51 that partitions the respective electronic components 44, 45, 46, 47 is increased. .

（樹脂成形工程）
図１１〜１２を参照して、図９に示した封止前基板４２と、図１０に示した枠状部材５１と、板状部材１９とを樹脂成形してモジュール化された電子回路装置を製造する工程を説明する。 (Resin molding process)
Referring to FIGS. 11 to 12, an electronic circuit device obtained by modularizing a pre-sealing substrate 42 shown in FIG. 9, a frame-like member 51 shown in FIG. The manufacturing process will be described.

図１１（ａ）に示されるように、まず、上型１３と下型１４とを型開きする。次に、図９に示した封止前基板４２（電子部品４４、４５、４６、４７を装着済み）を上型１３の型面に供給する。   As shown in FIG. 11A, first, the upper mold 13 and the lower mold 14 are opened. Next, the pre-sealing substrate 42 (with the electronic components 44, 45, 46, 47 mounted) shown in FIG. 9 is supplied to the mold surface of the upper mold 13.

次に、下型１４に設けられたキャビティ１７に離型フィルム１８と板状部材１９とを供給する。   Next, the release film 18 and the plate member 19 are supplied to the cavity 17 provided in the lower mold 14.

次に、図１０に示した枠状部材５１を下型１４に設けられたキャビティ１７に供給する。枠状部材５１は、上下を逆にして板状部材１９の上に載置される。具体的には、板状部材１９の上端に設けられた弾性変形可能な複数の折り曲げ部５２ａ、５２ｂが、板状部材１９の上に載置される。枠状部材５１の高さはキャビティ１７の深さよりも小さく設定される。本実施形態においては、枠状部材５１の下端にも弾性変形可能な複数の折り曲げ部５２ｃ、５２ｄを設けた場合を示す。   Next, the frame-like member 51 shown in FIG. 10 is supplied to the cavity 17 provided in the lower mold 14. The frame-like member 51 is placed on the plate-like member 19 upside down. Specifically, a plurality of elastically deformable bent portions 52 a and 52 b provided at the upper end of the plate-like member 19 are placed on the plate-like member 19. The height of the frame member 51 is set to be smaller than the depth of the cavity 17. In the present embodiment, a case where a plurality of bent portions 52c and 52d that can be elastically deformed is also provided at the lower end of the frame-shaped member 51 is shown.

次に、図１１（ｂ）に示されるように、下型１４に設けられたキャビティ１７に樹脂材料（顆粒状樹脂）２０を供給する。顆粒状樹脂２０は、板状部材１９と枠状部材５１とによって囲まれた空間に供給される。   Next, as shown in FIG. 11B, a resin material (granular resin) 20 is supplied to the cavity 17 provided in the lower mold 14. The granular resin 20 is supplied to a space surrounded by the plate-like member 19 and the frame-like member 51.

次に、下型１４に設けられたヒータによって顆粒状樹脂２０を加熱して流動性樹脂２１を生成する。枠状部材５１の各面に開口部を設けておくとキャビティ１７内において流動性樹脂２１を安定して流動させることができる。   Next, the granular resin 20 is heated by the heater provided in the lower mold 14 to generate the fluid resin 21. If an opening is provided on each surface of the frame-shaped member 51, the fluid resin 21 can be stably flowed in the cavity 17.

次に、図１１（ｃ）に示されるように、型締機構によって上型１３と下型１４とを型締めする。型締めすることによって、封止前基板４２に装着された電子部品４４、４５、４６、４７を流動性樹脂２１に浸漬させる。この状態においては、枠状部材５１の下端に設けられた複数の折り曲げ部５２ｃ、５２ｄは、封止前基板４２に形成された接地電極５０、５０ａにまだ接触していない。   Next, as shown in FIG. 11C, the upper mold 13 and the lower mold 14 are clamped by a mold clamping mechanism. By clamping the mold, the electronic components 44, 45, 46 and 47 mounted on the pre-sealing substrate 42 are immersed in the fluid resin 21. In this state, the plurality of bent portions 52 c and 52 d provided at the lower end of the frame-shaped member 51 are not yet in contact with the ground electrodes 50 and 50 a formed on the pre-sealing substrate 42.

次に、側面部材１６によって封止前基板４２をクランプした状態で、底面部材１５のみを更に上昇させる。枠状部材５１の下端に設けられた折り曲げ部５２ｃ、５２ｄと接地電極５０、５０ａとを接触させる。更に、板状部材１９を上昇させることにより折り曲げ部５２ａ、５２ｂ、５２ｃ、５２ｄを弾性変形させる。折り曲げ部５２ａ、５２ｂ、５２ｃ、５２ｄを弾性変形させた状態で、キャビティ１７内の流動性樹脂２１に所定の樹脂圧力を加える。   Next, in a state where the substrate 42 before sealing is clamped by the side member 16, only the bottom member 15 is further raised. The bent portions 52c and 52d provided at the lower end of the frame member 51 are brought into contact with the ground electrodes 50 and 50a. Further, the bent portions 52a, 52b, 52c and 52d are elastically deformed by raising the plate-like member 19. A predetermined resin pressure is applied to the fluid resin 21 in the cavity 17 in a state where the bent portions 52a, 52b, 52c, and 52d are elastically deformed.

次に、図１２（ａ）に示されるように、下型１４に設けられたヒータを使用して、流動性樹脂２１を加熱して硬化樹脂２２を成形する。このことにより、封止前基板４２に装着された電子部品４４、４５、４６、４７と枠状部材５１とが硬化樹脂（封止樹脂）２２によって樹脂封止される。   Next, as shown in FIG. 12A, the flowable resin 21 is heated to form a cured resin 22 using a heater provided in the lower mold 14. As a result, the electronic components 44, 45, 46, 47 and the frame-shaped member 51 mounted on the pre-sealing substrate 42 are resin-sealed with the cured resin (sealing resin) 22.

この状態で、枠状部材５１の上端に設けられた折り曲げ部５２ａ、５２ｂは、弾性変形して板状部材１９に接続される。板状部材１９は硬化樹脂２２に固着される。枠状部材５１の下端に設けられた折り曲げ部５２ｃ、５２ｄは、弾性変形して接地電極５０、５０ａに接続される。このことにより、板状部材１９と折り曲げ部５２ａ、５２ｂと枠状部材５１と折り曲げ部５２ｃ、５２ｄと接地電極５０、５０ａとが電気的に導通する。したがって、電子部品４４、４５、４６、４７は、それぞれが枠状部材５１と板状部材１９とによって取り囲まれて電磁シールドされる。   In this state, the bent portions 52 a and 52 b provided at the upper end of the frame-like member 51 are elastically deformed and connected to the plate-like member 19. The plate-like member 19 is fixed to the cured resin 22. The bent portions 52c and 52d provided at the lower end of the frame-like member 51 are elastically deformed and connected to the ground electrodes 50 and 50a. As a result, the plate-shaped member 19, the bent portions 52a and 52b, the frame-shaped member 51, the bent portions 52c and 52d, and the ground electrodes 50 and 50a are electrically connected. Accordingly, the electronic components 44, 45, 46 and 47 are surrounded by the frame-like member 51 and the plate-like member 19 and are electromagnetically shielded.

次に、図１２（ｂ）に示されるように、型締機構を使用して上型１３と下型１４とを型開きする。上型１３の型面には樹脂封止された樹脂成形品（封止済基板）５３が固定されている。樹脂成形品５３を成形型から取り出す。   Next, as shown in FIG. 12B, the upper mold 13 and the lower mold 14 are opened using a mold clamping mechanism. A resin molded product (sealed substrate) 53 sealed with resin is fixed to the mold surface of the upper mold 13. The resin molded product 53 is taken out from the mold.

図１２（ｃ）に示されるように、本実施形態においては、樹脂封止されて取り出された樹脂成形品５３自体がＩｏＴで使用される電子回路装置５４となる。電子回路装置５４に含まれる電子部品４４、４５、４６、４７は、それぞれが枠状部材５１と板状部材１９とによって電磁シールドされる。   As shown in FIG. 12C, in the present embodiment, the resin molded product 53 itself taken out after being sealed with a resin is an electronic circuit device 54 used in IoT. The electronic components 44, 45, 46 and 47 included in the electronic circuit device 54 are electromagnetically shielded by the frame member 51 and the plate member 19, respectively.

なお、図９〜１２においては、電源回路、通信回路、検知回路及び演算回路の回路部を備える構成を示したが、これに限定されない。例えば、電源回路、通信回路、検知回路及び演算回路のうち少なくとも一つの回路部を含む複数の回路部を備えた構成とすることができる。また、複数の回路部をそれぞれに対応する個別の複数の枠状部材を用いてシールドする構成とすることもできる。   9 to 12 illustrate the configuration including the circuit portions of the power supply circuit, the communication circuit, the detection circuit, and the arithmetic circuit, the present invention is not limited to this. For example, a configuration including a plurality of circuit units including at least one circuit unit among a power supply circuit, a communication circuit, a detection circuit, and an arithmetic circuit can be employed. Moreover, it can also be set as the structure which shields a some circuit part using the separate some frame-shaped member corresponding to each.

（作用効果）
本実施形態の電子回路装置の製造方法は、第１型である上型１３と上型１３に対向して配置される第２型である下型１４とを有する成形型を用いて、電子部品４４、４５、４６、４７が装着された基板４３に対して樹脂成形して、電子部品４４、４５、４６、４７がそれぞれシールド用部材によりシールドされた構造の電子回路装置５４を製造する電子回路装置の製造方法であって、シールド用部材として、導電性の板状部材５１と、端部が折り曲げられて弾性変形可能とされた折り曲げ部５２ａ、５２ｂ、５２ｃ、５２ｄを備える導電性の枠状部材５１とを準備する工程と、上型１３と下型１４との間に、基板４３と枠状部材５１と板状部材１９とがこの順にて、基板４３及び板状部材１９の側に折り曲げ部５２ｃ、５２ｄ及び５２ａ、５２ｂが配置された状態において、上型１３と下型１４とを型締めして、折り曲げ部５２ａ、５２ｂ、５２ｃ、５２ｄを弾性変形させて樹脂成形を行う樹脂成形工程とを含む。 (Function and effect)
The method of manufacturing an electronic circuit device according to the present embodiment uses a molding die having an upper die 13 that is a first die and a lower die 14 that is a second die disposed to face the upper die 13. An electronic circuit for manufacturing an electronic circuit device 54 having a structure in which the electronic components 44, 45, 46, 47 are respectively shielded by a shielding member by resin molding with respect to the substrate 43 on which 44, 45, 46, 47 is mounted A method for manufacturing an apparatus, comprising a conductive plate-like member 51 as a shielding member, and a conductive frame-like member having bent portions 52a, 52b, 52c, and 52d that are elastically deformable by bending the end portions. Between the step of preparing the member 51 and the upper die 13 and the lower die 14, the substrate 43, the frame-like member 51, and the plate-like member 19 are bent in this order in the direction of the substrate 43 and the plate-like member 19. Parts 52c, 52d and 52a, 5 In a state in which b is arranged, comprising an upper die 13 and the lower mold 14 by clamping, the bent portions 52a, 52 b, 52c, and a resin molding step for resin molding 52d to elastically deform.

この方法によれば、樹脂成形することにより、枠状部材５１の上端に設けられた折り曲げ部５２ａ、５２ｂを弾性変形させて板状部材１９と折り曲げ部５２ａ、５２ｂとを電気的に接続する。同様に、枠状部材５１の下端に設けられた折り曲げ部５２ｃ、５２ｄを弾性変形させて接地電極５０、５０ａと折り曲げ部５２ｃ、５２ｄとを電気的に接続する。したがって、電子回路装置５４は電子部品４４、４５、４６、４７をモジュール化した複合機能を備え、電子回路装置５４を構成する電子部品４４、４５、４６、４７をそれぞれ枠状部材５１と板状部材１９とによって電磁シールドすることができる。かつ、基板４３と枠状部材５１と板状部材１９とをこの順に配置して樹脂成形することにより電子回路装置５４を電磁シールドすることができる。したがって、電子回路装置５４の製造コストを低減することができる。   According to this method, by bending resin, the bent portions 52a and 52b provided at the upper end of the frame-like member 51 are elastically deformed to electrically connect the plate-like member 19 and the bent portions 52a and 52b. Similarly, the bent portions 52c and 52d provided at the lower end of the frame-like member 51 are elastically deformed to electrically connect the ground electrodes 50 and 50a and the bent portions 52c and 52d. Therefore, the electronic circuit device 54 has a composite function in which the electronic components 44, 45, 46, and 47 are modularized. Electromagnetic shielding can be performed by the member 19. In addition, the electronic circuit device 54 can be electromagnetically shielded by arranging the substrate 43, the frame-like member 51, and the plate-like member 19 in this order and performing resin molding. Therefore, the manufacturing cost of the electronic circuit device 54 can be reduced.

本実施形態によれば圧縮成形法による成形型において、上型１３に電子部品４４、４５、４６、４７が装着された封止前基板４２を供給する。下型１４に導電性の板状部材１９と導電性の枠状部材５１と樹脂材料（顆粒状樹脂）２０とを供給する。枠状部材５１は、上端に弾性変形可能な折り曲げ部５２ａ、５２ｂを有し、下端に弾性変形可能な折り曲げ部５２ｃ、５２ｄを有する。上型１３と下型１４とを型締めして樹脂成形することによって、折り曲げ部５２ａ、５２ｂを弾性変形させて板状部材１９と枠状部材５１とを電気的に接続する。折り曲げ部５２ｃ、５２ｄを弾性変形させて接地電極５０、５０ａと枠状部材５１とを電気的に接続する。このことにより、電子回路装置５４を電子部品４４、４５、４６、４７によってモジュール化し、電子部品４４、４５、４６、４７をそれぞれ枠状部材５１と板状部材１９とによって電磁シールドすることができる。   According to the present embodiment, the pre-sealing substrate 42 in which the electronic components 44, 45, 46, and 47 are mounted on the upper mold 13 is supplied in a mold by the compression molding method. A conductive plate-like member 19, a conductive frame-like member 51, and a resin material (granular resin) 20 are supplied to the lower mold 14. The frame-like member 51 has bent portions 52a and 52b that can be elastically deformed at the upper end, and bent portions 52c and 52d that can be elastically deformed at the lower end. The upper mold 13 and the lower mold 14 are clamped and resin-molded, whereby the bent portions 52a and 52b are elastically deformed to electrically connect the plate-shaped member 19 and the frame-shaped member 51. The bent portions 52c and 52d are elastically deformed to electrically connect the ground electrodes 50 and 50a and the frame member 51. Thus, the electronic circuit device 54 can be modularized by the electronic components 44, 45, 46, 47, and the electronic components 44, 45, 46, 47 can be electromagnetically shielded by the frame-shaped member 51 and the plate-shaped member 19, respectively. .

本実施形態によれば、上型１３に電子部品４４、４５、４６、４７が装着された封止前基板４２を供給する。下型１４に導電性の板状部材１９と導電性の枠状部材５１と樹脂材料（顆粒状樹脂）２０とを供給する。上型１３と下型１４との間に、封止前基板４２と枠状部材５１と板状部材１９とをこの順に配置して型締めする。樹脂成形することにより、折り曲げ部５２ａ、５２ｂを弾性変形させて板状部材１９と枠状部材５１とを電気的に接続する。折り曲げ部５２ｃ、５２ｄを弾性変形させて接地電極５０、５０ａと枠状部材５１とを電気的に接続する。実施形態１、２のように枠状部材５１を封止前基板４２に予め装着する工程を省略することができる。したがって、電子回路装置５４を製造する製造コストをより低減することができる。   According to this embodiment, the substrate 42 before sealing in which the electronic components 44, 45, 46, 47 are mounted on the upper mold 13 is supplied. A conductive plate-like member 19, a conductive frame-like member 51, and a resin material (granular resin) 20 are supplied to the lower mold 14. Between the upper mold 13 and the lower mold 14, the pre-sealing substrate 42, the frame-shaped member 51, and the plate-shaped member 19 are arranged in this order and clamped. By bending the resin, the bent portions 52a and 52b are elastically deformed to electrically connect the plate member 19 and the frame member 51. The bent portions 52c and 52d are elastically deformed to electrically connect the ground electrodes 50 and 50a and the frame member 51. As in Embodiments 1 and 2, the step of attaching the frame-like member 51 to the pre-sealing substrate 42 in advance can be omitted. Therefore, the manufacturing cost for manufacturing the electronic circuit device 54 can be further reduced.

本実施形態によれば、電子部品４４、４５、４６、４７をモジュール化することによって、電子回路装置５４を構成する。電子部品４４、４５、４６、４７はそれぞれが枠状部材５１と折り曲げ部５２ａ、５２ｂ、５２ｃ、５２ｄと板状部材１９とによって電磁シールドされる。したがって、電子部品４４、４５、４６、４７はそれぞれが電磁ノイズによる誤動作を抑制し、信頼性の向上を図ることができる。よって、電子回路装置５４の信頼性及び性能を向上させることが可能となる。   According to the present embodiment, the electronic circuit device 54 is configured by modularizing the electronic components 44, 45, 46 and 47. Each of the electronic components 44, 45, 46, 47 is electromagnetically shielded by the frame-shaped member 51, the bent portions 52 a, 52 b, 52 c, 52 d and the plate-shaped member 19. Therefore, each of the electronic components 44, 45, 46, and 47 can suppress malfunction due to electromagnetic noise and improve reliability. Therefore, the reliability and performance of the electronic circuit device 54 can be improved.

本実施形態においては、枠状部材５１の上端だけでなく下端にも弾性変形可能な折り曲げ部５２ｃ、５２ｄを設けた。これに限らず、枠状部材５１の上端にのみ折り曲げ部５２ａ、５２ｂを設け、枠状部材５１の下端に折り曲げ部５２ｃ、５２ｄを設けない構成にしてもよい。この場合には、枠状部材５１の下端を微小な凹凸（突起）を有する突起状の形状にしておく。微小な凹凸を設けることにより、枠状部材５１の下端と接地電極５０、５０ａとを電気的に接続することができる。   In the present embodiment, the bent portions 52c and 52d that can be elastically deformed are provided not only at the upper end of the frame-like member 51 but also at the lower end. However, the present invention is not limited to this, and the bent portions 52 a and 52 b may be provided only at the upper end of the frame-like member 51, and the bent portions 52 c and 52 d may not be provided at the lower end of the frame-like member 51. In this case, the lower end of the frame-shaped member 51 is formed in a protruding shape having minute irregularities (projections). By providing minute irregularities, the lower end of the frame-shaped member 51 and the ground electrodes 50 and 50a can be electrically connected.

なお、本実施形態においては、ＩｏＴで使用される電子回路装置の１つの例として、電源回路、通信回路、検知回路及び演算回路を含む複数の電子部品によって構成される電子回路装置を示した。これに限らず、ＩｏＴで使用される電子回路装置は、様々な回路構成（機能）を有する複数の電子部品を組み合わせることによって構成することができる。
〔実施形態４〕 In the present embodiment, as an example of an electronic circuit device used in IoT, an electronic circuit device including a plurality of electronic components including a power supply circuit, a communication circuit, a detection circuit, and an arithmetic circuit is shown. Not only this but the electronic circuit device used by IoT can be comprised by combining several electronic components which have various circuit structures (function).
[Embodiment 4]

（トランスファモールド法による樹脂成形）
図１３を参照して、トランスファモールド法を用いた樹脂成形装置において使用される成形型について説明する。 (Resin molding by transfer molding method)
With reference to FIG. 13, the shaping | molding die used in the resin molding apparatus using the transfer mold method is demonstrated.

図１３（ａ）において、樹脂封止装置は、例えば、上型５５と下型５６と中間型５７とを備える。上型５５と下型５６と中間型５７とは、併せて成形型を構成する。下型５６には樹脂タブレット５８を収容するポット５９が設けられる。ポット５９内には収容された樹脂タブレット５８を押圧するプランジャ６０が設けられる。上型５５には、樹脂タブレット５８が加熱されて溶融した流動性樹脂の樹脂通路となるカル６１とランナ６２とが設けられる。中間型５７には、硬化樹脂が成形される空間となるキャビティ６３と、キャビティ６３に流動性樹脂を供給するゲート６４とが設けられる。更に、中間型５７には、ポット５９からカル６１に流動性樹脂を圧送する樹脂通路となる貫通穴６５が設けられる。   In FIG. 13A, the resin sealing device includes, for example, an upper die 55, a lower die 56, and an intermediate die 57. The upper die 55, the lower die 56, and the intermediate die 57 together constitute a forming die. The lower mold 56 is provided with a pot 59 for accommodating the resin tablet 58. In the pot 59, a plunger 60 for pressing the accommodated resin tablet 58 is provided. The upper die 55 is provided with a curl 61 and a runner 62 that serve as resin passages for the fluid resin that is melted by heating the resin tablet 58. The intermediate mold 57 is provided with a cavity 63 serving as a space in which the cured resin is molded, and a gate 64 for supplying the fluid resin to the cavity 63. Further, the intermediate mold 57 is provided with a through hole 65 serving as a resin passage for pumping the fluid resin from the pot 59 to the cull 61.

図１３を参照して、トランスファモールド法によって電子部品と枠状部材と板状部材とを樹脂成形する工程を説明する。   With reference to FIG. 13, the process of resin-molding an electronic component, a frame-like member, and a plate-like member by a transfer mold method will be described.

図１３（ａ）に示されるように、成形型を型開きした状態において、下型５６に設けられた基板配置部に封止前基板６６を配置する。封止前基板６６は、基板６７と基板６７の上に装着された電子部品６８、６９と導電性を有する枠状部材７０とを備える。電子部品６８、６９は、バンプ７１を介して基板６７に設けられた基板電極７２に接続される。枠状部材７０は接地電極７３の上に装着される。枠状部材７０は、上端に弾性変形可能な折り曲げ部７４を有する。封止前基板６６の上（具体的には折り曲げ部７４の上）に導電性を有する板状部材７５を配置する。板状部材７５は流動性樹脂が注入される注入口７６を有する。   As shown in FIG. 13A, the pre-sealing substrate 66 is placed on the substrate placement portion provided in the lower die 56 in a state where the mold is opened. The pre-sealing substrate 66 includes a substrate 67, electronic components 68 and 69 mounted on the substrate 67, and a frame member 70 having conductivity. The electronic components 68 and 69 are connected to a substrate electrode 72 provided on the substrate 67 through bumps 71. The frame member 70 is mounted on the ground electrode 73. The frame-like member 70 has a bent portion 74 that can be elastically deformed at the upper end. A conductive plate-like member 75 is disposed on the pre-sealing substrate 66 (specifically, on the bent portion 74). The plate-like member 75 has an inlet 76 into which a fluid resin is injected.

次に、下型５６に設けられたポット５９に樹脂タブレット５８を供給する。   Next, the resin tablet 58 is supplied to the pot 59 provided in the lower mold 56.

次に、図１３（ｂ）に示されるように、型締め機構（図示なし）を使用して、上型５５と下型５６と中間型５７とを型締めする。型締めすることによって、封止前基板６６の上に配置された板状部材７５が、中間型５７に設けられたキャビティ６３の天面に接触する。このことにより、折り曲げ部７４が弾性変形し、折り曲げ部７４と板状部材７５とが接続する。   Next, as shown in FIG. 13B, the upper mold 55, the lower mold 56, and the intermediate mold 57 are clamped using a mold clamping mechanism (not shown). By clamping the mold, the plate-like member 75 disposed on the pre-sealing substrate 66 comes into contact with the top surface of the cavity 63 provided in the intermediate mold 57. As a result, the bent portion 74 is elastically deformed, and the bent portion 74 and the plate-like member 75 are connected.

次に、ポット５９に供給された樹脂タブレット５８を加熱して溶融し流動性樹脂を生成する。プランジャ６０によって流動性樹脂を押圧し、樹脂通路（貫通穴６５、カル６１、ランナ６２、ゲート６４）を経由して、板状部材７５に設けられた注入口７６からキャビティ６３に流動性樹脂を注入する。引き続き、流動性樹脂を加熱することによって硬化樹脂７７を成形する。このことによって、封止前基板６６に装着され電子部品６８、６９と枠状部材７０と板状部材７５とが樹脂成形される。   Next, the resin tablet 58 supplied to the pot 59 is heated and melted to produce a fluid resin. The flowable resin is pressed by the plunger 60, and the flowable resin is injected into the cavity 63 from the inlet 76 provided in the plate-like member 75 via the resin passage (through hole 65, cull 61, runner 62, gate 64). inject. Subsequently, the cured resin 77 is formed by heating the fluid resin. As a result, the electronic components 68 and 69, the frame-like member 70, and the plate-like member 75 are mounted on the pre-sealing substrate 66 and resin-molded.

硬化樹脂７７を成形した後に、型締め機構を使用して、上型５５と下型５６と中間型５７とを型開きする。型開きした後に樹脂成形品を取り出す。本実施形態においては、取り出された樹脂成形品が電子回路装置７８に相当する。   After the cured resin 77 is molded, the upper mold 55, the lower mold 56, and the intermediate mold 57 are opened using a mold clamping mechanism. After opening the mold, the resin molded product is taken out. In the present embodiment, the removed resin molded product corresponds to the electronic circuit device 78.

本実施形態によれば、トランスファモールド法による樹脂成形装置を使用して、封止前基板６６に装着された電子部品６８、６９及び枠状部材７０と、封止前基板６６の上に配置された板状部材７５とを樹脂成形する。上型５５と下型５６と中間型５７とを型締めして樹脂成形することによって、折り曲げ部７４を弾性変形させて板状部材７５と枠状部材７０とを電気的に接続することができる。このことにより、電子回路装置７８を電子部品６８と電子部品６９とによってモジュール化し、電子部品６８及び電子部品６９を枠状部材７０と板状部材７５とによって電磁シールドすることができる。   According to the present embodiment, the electronic components 68 and 69 and the frame-like member 70 mounted on the pre-sealing substrate 66 are disposed on the pre-sealing substrate 66 using a resin molding apparatus by a transfer mold method. The plate-like member 75 is resin-molded. The upper die 55, the lower die 56, and the intermediate die 57 are clamped and resin-molded, whereby the bent portion 74 can be elastically deformed to electrically connect the plate-like member 75 and the frame-like member 70. . Thus, the electronic circuit device 78 can be modularized by the electronic component 68 and the electronic component 69, and the electronic component 68 and the electronic component 69 can be electromagnetically shielded by the frame-like member 70 and the plate-like member 75.

本実施形態においては、キャビティ６３に流動性樹脂を注入する注入口を板状部材７５に設けた。これに限らず、注入口を枠状部材７０に設けてもよい。さらに、板状部材７５又は枠状部材７０に注入口を複数設けることができる。   In the present embodiment, the plate-like member 75 is provided with an inlet for injecting the fluid resin into the cavity 63. Not limited to this, the inlet may be provided in the frame-shaped member 70. Furthermore, a plurality of injection ports can be provided in the plate-like member 75 or the frame-like member 70.

本実施形態においては、成形型として上型５５と下型５６と中間型５７とを有する３枚型の成形型を使用する場合を示した。これに限らず、通常の上型と下型とを有する２枚型の成形型を使用することができる。この場合には、上型に樹脂通路となるカルとランナとゲートとキャビティとがそれぞれ設けられる。加えて、上型と下型とを入れ換えた構成を採用することもできる。
〔実施形態５〕 In the present embodiment, a case where a three-sheet mold having an upper mold 55, a lower mold 56, and an intermediate mold 57 is used as the mold is shown. However, the present invention is not limited to this, and a normal two-sheet mold having an upper mold and a lower mold can be used. In this case, a cull, a runner, a gate, and a cavity serving as a resin passage are provided in the upper mold. In addition, it is possible to adopt a configuration in which the upper mold and the lower mold are interchanged.
[Embodiment 5]

（電子回路装置の変形例）
図１４を参照して、実施形態１で示した電子回路装置の変形例について説明する。電子回路装置は枠状部材１１に設けられた折り曲げ部１２と板状部材１９との間の電気的接続をより確実にするため、異方性導電フィルム：ＡＣＦ（Anisotropic Conductive Film ）又は導電性ペーストを折り曲げ部１２と板状部材１９との間に挟んだ構成としている。 (Modification of electronic circuit device)
A modification of the electronic circuit device shown in Embodiment 1 will be described with reference to FIG. In the electronic circuit device, an anisotropic conductive film: ACF (Anisotropic Conductive Film) or conductive paste is used in order to ensure electrical connection between the bent portion 12 provided on the frame-shaped member 11 and the plate-shaped member 19. Is sandwiched between the bent portion 12 and the plate-like member 19.

図１４（ａ）に示されるように、電子回路装置７９において、枠状部材１１に設けられた折り曲げ部１２と板状部材１９との間に異方性導電フィルム８０が設けられる。異方性導電フィルム８０は金属粒子等の導電性粒子を熱硬化性樹脂等の絶縁性樹脂中に分散したフィルムであり、加熱加圧することにより面方向の絶縁性を保持したまま厚み方向にのみ導電性を示す接続材料である。   As shown in FIG. 14A, in the electronic circuit device 79, an anisotropic conductive film 80 is provided between the bent portion 12 provided on the frame-like member 11 and the plate-like member 19. The anisotropic conductive film 80 is a film in which conductive particles such as metal particles are dispersed in an insulating resin such as a thermosetting resin, and only in the thickness direction while maintaining the surface insulation by heating and pressing. It is a connection material showing conductivity.

例えば、図３（ａ）で示した電子回路装置を製造する工程において、キャビティ１７に板状部材１９を供給した後に、異方性導電フィルム８０をキャビティ１７に供給する。したがって、キャビティ１７には、離型フィルム１８、板状部材１９、異方性導電フィルム８０、樹脂材料２０が、順次供給される。この状態で、上型１３と下型１４とを型締めして樹脂成形する。   For example, in the process of manufacturing the electronic circuit device shown in FIG. 3A, the anisotropic conductive film 80 is supplied to the cavity 17 after supplying the plate-like member 19 to the cavity 17. Therefore, the release film 18, the plate-like member 19, the anisotropic conductive film 80, and the resin material 20 are sequentially supplied to the cavity 17. In this state, the upper mold 13 and the lower mold 14 are clamped and resin-molded.

樹脂成形することによって、異方性導電フィルム８０は加熱加圧される。このことにより、異方性導電フィルム８０内の導電性粒子は厚み方向に凝集し、板状部材１９と折り曲げ部１２とを電気的に接続する。異方性導電フィルム８０を板状部材１９と折り曲げ部１２との間に挟むことによって、折り曲げ部１２と板状部材１９とを部分的でなく折り曲げ部１２の全面を板状部材１９に接続させることができる。したがって、折り曲げ部１２と板状部材１９との間の電気的接続をより確実にすることができる。   The anisotropic conductive film 80 is heated and pressurized by resin molding. As a result, the conductive particles in the anisotropic conductive film 80 aggregate in the thickness direction, and the plate member 19 and the bent portion 12 are electrically connected. By sandwiching the anisotropic conductive film 80 between the plate-like member 19 and the bent portion 12, the bent portion 12 and the plate-like member 19 are not partially connected but the entire surface of the bent portion 12 is connected to the plate-like member 19. be able to. Therefore, the electrical connection between the bent portion 12 and the plate-like member 19 can be further ensured.

図１４（ｂ）に示される電子回路装置８１は、異方性導電フィルム８２を予め枠状部材１１の折り曲げ部１２に接着しておいた例である。この場合も、樹脂成形することにより異方性導電フィルム８２は加熱加圧され、折り曲げ部１２と板状部材１９とを接続する。折り曲げ部１２の全面が板状部材１９と接続するので、折り曲げ部１２と板状部材１９との間の電気的接続をより確実にすることができる。   An electronic circuit device 81 shown in FIG. 14B is an example in which an anisotropic conductive film 82 is bonded in advance to the bent portion 12 of the frame-shaped member 11. Also in this case, the anisotropic conductive film 82 is heated and pressurized by resin molding, and the bent portion 12 and the plate member 19 are connected. Since the entire surface of the bent portion 12 is connected to the plate-like member 19, the electrical connection between the bent portion 12 and the plate-like member 19 can be made more reliable.

図１４（ｃ）に示される電子回路装置８３は、導電性ペースト８４を予め枠状部材１１の折り曲げ部１２に塗布しておいた例である。この場合は、樹脂成形することにより、折り曲げ部１２と板状部材１９とを導電性ペースト８４を介して接着する。折り曲げ部１２の全面が板状部材１９と接続するので、折り曲げ部１２と板状部材１９との間の電気的接続をより確実にすることができる。   An electronic circuit device 83 shown in FIG. 14C is an example in which a conductive paste 84 is previously applied to the bent portion 12 of the frame-shaped member 11. In this case, the bent portion 12 and the plate-like member 19 are bonded via the conductive paste 84 by resin molding. Since the entire surface of the bent portion 12 is connected to the plate-like member 19, the electrical connection between the bent portion 12 and the plate-like member 19 can be made more reliable.

なお、実施形態２〜４で示した電子回路装置においても、枠状部材に設けられた折り曲げ部と板状部材との間に、異方性導電フィルム又は導電性ペーストを挟んだ構成にすることができる。これらの電子回路装置においても、異方性導電フィルム又は導電性ペーストを設けることにより折り曲げ部と板状部材との間の電気的接続をより確実することができる。   In addition, also in the electronic circuit device shown in Embodiments 2 to 4, an anisotropic conductive film or conductive paste is sandwiched between the bent portion provided on the frame-like member and the plate-like member. Can do. Also in these electronic circuit devices, the electrical connection between the bent portion and the plate-like member can be further ensured by providing the anisotropic conductive film or the conductive paste.

実施形態１〜３においては、キャビティ１７を下型１４に設けた場合を示した。これに限らず、キャビティを上型に設けた場合においても、同様の効果を奏する。なお、キャビティを上型に設けた場合には、側面部材とその内側に配置される底面部材とを備える型が上側に配置されることになり、それに対向する型が下側に配置されることになる。   In Embodiments 1-3, the case where the cavity 17 was provided in the lower mold | type 14 was shown. Not only this but also when a cavity is provided in the upper mold, the same effect is produced. In addition, when the cavity is provided in the upper mold, the mold including the side surface member and the bottom surface member disposed inside the cavity is disposed on the upper side, and the mold opposite to the mold is disposed on the lower side. become.

実施形態１〜３においては、下型１４に設けられたキャビティ１７に離型フィルム１８を供給した場合を示した。これに限らず、離型フィルム１８をキャビティ１７に供給しない場合においても、同様の効果を奏する。   In Embodiments 1-3, the case where the release film 18 was supplied to the cavity 17 provided in the lower mold | type 14 was shown. Not only this, but also when the release film 18 is not supplied to the cavity 17, the same effect is produced.

以上のように、上記実施形態の電子回路装置の製造方法は、第１型と第１型に対向して配置される第２型とを有する成形型を用いて、電子部品が装着された基板に対して樹脂成形して、電子部品がシールド用部材によりシールドされた構造の電子回路装置を製造する電子回路装置の製造方法であって、シールド用部材として、導電性の板状部材と、少なくとも一方の端部が折り曲げられて弾性変形可能とされた折り曲げ部を備える導電性の枠状部材とを準備する工程と、第１型と第２型との間に、基板と枠状部材と板状部材とがこの順にて、基板及び板状部材の少なくとも一方側に折り曲げ部が配置された状態において、第１型と第２型とを型締めして、折り曲げ部を弾性変形させて樹脂成形を行う樹脂成形工程とを含む。   As described above, in the method of manufacturing the electronic circuit device according to the above-described embodiment, the substrate on which the electronic component is mounted using the molding die having the first die and the second die arranged to face the first die. An electronic circuit device manufacturing method for manufacturing an electronic circuit device having a structure in which an electronic component is shielded by a shielding member, wherein the conductive component is at least a conductive plate member, A step of preparing a conductive frame-like member having a bent portion whose one end portion is bent and elastically deformable; and a substrate, a frame-like member and a plate between the first mold and the second mold In this order, the first mold and the second mold are clamped in a state where the bent portions are arranged on at least one side of the substrate and the plate-like member, and the bent portions are elastically deformed to form a resin. Resin molding process.

この方法によれば、樹脂成形することにより、枠状部材に設けられた折り曲げ部を弾性変形させて板状部材と枠状部材とを電気的に接続する。したがって、電子回路装置を枠状部材と板状部材とによって電磁シールドすることができる。かつ、基板と枠状部材と板状部材とをこの順に配置して樹脂成形することにより電子回路装置を電磁シールドする。したがって、電子回路装置の製造コストを低減することができる。   According to this method, by bending the resin, the bent portion provided in the frame-shaped member is elastically deformed to electrically connect the plate-shaped member and the frame-shaped member. Therefore, the electronic circuit device can be electromagnetically shielded by the frame-like member and the plate-like member. And an electronic circuit apparatus is electromagnetically shielded by arrange | positioning a board | substrate, a frame-shaped member, and a plate-shaped member in this order, and resin-molding. Therefore, the manufacturing cost of the electronic circuit device can be reduced.

さらに、上記実施形態の電子回路装置の製造方法は、折り曲げ部を弾性変形させる前に、板状部材と基板との間に流動性樹脂が配置された状態として、流動性樹脂を用いて樹脂成形を行う。   Furthermore, in the method of manufacturing the electronic circuit device according to the above-described embodiment, before the bent portion is elastically deformed, the fluid resin is placed between the plate-like member and the substrate and the resin molding is performed using the fluid resin. I do.

この方法によれば、折り曲げ部を流動性樹脂に浸漬させた後に、折り曲げ部を弾性変形させて板状部材と枠状部材とを電気的に接続する。したがって、電子回路装置を枠状部材と板状部材とによって電磁シールドすることができる。かつ、電子回路装置の製造コストを低減することができる。   According to this method, after the bent portion is immersed in the fluid resin, the bent portion is elastically deformed to electrically connect the plate-like member and the frame-like member. Therefore, the electronic circuit device can be electromagnetically shielded by the frame-like member and the plate-like member. And the manufacturing cost of an electronic circuit device can be reduced.

さらに、上記実施形態の電子回路装置の製造方法は、第１型に基板及び枠状部材が配置され、第２型に板状部材が配置された状態において、樹脂成形を行う。   Furthermore, in the method for manufacturing the electronic circuit device of the above embodiment, the resin molding is performed in a state where the substrate and the frame-like member are arranged in the first mold and the plate-like member is arranged in the second mold.

この方法によれば、第１型に基板及び枠状部材を配置し、第２型に板状部材を配置して樹脂成形を行い、折り曲げ部を弾性変形させて板状部材と枠状部材とを電気的に接続する。したがって、電子回路装置を枠状部材と板状部材とによって電磁シールドすることができる。かつ、電子回路装置の製造コストを低減することができる。   According to this method, the substrate and the frame-shaped member are disposed in the first mold, the plate-shaped member is disposed in the second mold, the resin molding is performed, and the bent portion is elastically deformed so that the plate-shaped member and the frame-shaped member are Are electrically connected. Therefore, the electronic circuit device can be electromagnetically shielded by the frame-like member and the plate-like member. And the manufacturing cost of an electronic circuit device can be reduced.

さらに、上記実施形態の電子回路装置の製造方法は、第１型に基板が配置され、第２型に板状部材及び枠状部材が配置された状態において、樹脂成形を行う。   Furthermore, in the method for manufacturing the electronic circuit device of the above embodiment, the resin molding is performed in a state where the substrate is arranged in the first mold and the plate-like member and the frame-like member are arranged in the second mold.

この方法によれば、第１型に基板を配置し、第２型に板状部材及び枠状部材を配置して樹脂成形を行い、折り曲げ部を弾性変形させて板状部材と枠状部材とを電気的に接続する。したがって、電子回路装置を枠状部材と板状部材とによって電磁シールドすることができる。かつ、電子回路装置の製造コストを低減することができる。   According to this method, the substrate is disposed in the first mold, the plate-shaped member and the frame-shaped member are disposed in the second mold, the resin molding is performed, and the bent portion is elastically deformed, so that the plate-shaped member and the frame-shaped member are Are electrically connected. Therefore, the electronic circuit device can be electromagnetically shielded by the frame-like member and the plate-like member. And the manufacturing cost of an electronic circuit device can be reduced.

さらに、上記実施形態の電子回路装置の製造方法は、折り曲げ部を弾性変形させた後に、板状部材と基板との間に流動性樹脂を導入して、流動性樹脂を用いて樹脂成形を行う。   Furthermore, in the method of manufacturing the electronic circuit device according to the above embodiment, after the bent portion is elastically deformed, a fluid resin is introduced between the plate-like member and the substrate, and resin molding is performed using the fluid resin. .

この方法によれば、折り曲げ部を弾性変形させて板状部材と枠状部材とを電気的に接続させた状態で、板状部材と基板との間に流動性樹脂を導入して樹脂成形する。したがって、電子回路装置を枠状部材と板状部材とによって電磁シールドすることができる。かつ、電子回路装置の製造コストを低減することができる。   According to this method, in a state where the bent portion is elastically deformed to electrically connect the plate-like member and the frame-like member, the flowable resin is introduced between the plate-like member and the substrate to perform resin molding. . Therefore, the electronic circuit device can be electromagnetically shielded by the frame-like member and the plate-like member. And the manufacturing cost of an electronic circuit device can be reduced.

上記実施形態の電子回路装置は、基板に装着された電子部品と、電子部品をシールドする導電性の枠状部材と、枠状部材の基板とは反対側に配置され、枠状部材と電気的に接続された導電性の板状部材と、少なくとも基板と板状部材との間に配置された封止樹脂とを備え、基板及び板状部材の少なくとも一方側において枠状部材の端部が折り曲げられた折り曲げ部が設けられており、枠状部材が弾性変形可能な材質であり、基板及び板状部材の少なくとも一方と折り曲げ部との間に、封止樹脂が存在する部分と封止樹脂が存在しない部分とが存在する構成としている。   The electronic circuit device of the above embodiment is arranged on the opposite side of the frame-shaped member from the electronic component mounted on the substrate, the conductive frame-shaped member that shields the electronic component, and the frame-shaped member A conductive plate member connected to the substrate and at least a sealing resin disposed between the substrate and the plate member, and the end of the frame member is bent on at least one side of the substrate and the plate member. The frame-shaped member is made of an elastically deformable material, and a portion where the sealing resin exists between at least one of the substrate and the plate-shaped member and the bent portion and the sealing resin are provided. It has a configuration in which there are parts that do not exist.

この構成によれば、折り曲げ部を弾性変形させて板状部材と枠状部材とが接触した状態で樹脂成形する。板状部材と折り曲げ部との間には封止樹脂が存在しない部分が存在し、この部分において板状部材と折り曲げ部とは電気的に接続される。したがって、電子回路装置を枠状部材と板状部材とによって電磁シールドすることができる。   According to this configuration, the bent portion is elastically deformed, and the resin molding is performed in a state where the plate-like member and the frame-like member are in contact with each other. There is a portion where no sealing resin exists between the plate-like member and the bent portion, and the plate-like member and the bent portion are electrically connected at this portion. Therefore, the electronic circuit device can be electromagnetically shielded by the frame-like member and the plate-like member.

上記実施形態の電子回路装置は、基板に装着された電子部品と、電子部品をシールドする導電性の枠状部材と、枠状部材の基板とは反対側に配置され、枠状部材と電気的に接続された導電性の板状部材と、少なくとも基板と板状部材との間に配置された封止樹脂とを備え、基板及び板状部材の少なくとも一方側において枠状部材の端部が折り曲げられた折り曲げ部が設けられており、枠状部材が弾性変形可能な材質であり、基板及び板状部材の少なくとも一方と折り曲げ部との間に異方導電性部材が介在する構成としている。   The electronic circuit device of the above embodiment is arranged on the opposite side of the frame-shaped member from the electronic component mounted on the substrate, the conductive frame-shaped member that shields the electronic component, and the frame-shaped member A conductive plate member connected to the substrate and at least a sealing resin disposed between the substrate and the plate member, and the end of the frame member is bent on at least one side of the substrate and the plate member. The frame-shaped member is made of an elastically deformable material, and an anisotropic conductive member is interposed between at least one of the substrate and the plate-shaped member and the bent portion.

この構成によれば、枠状部材に設けられた弾性変形可能な折り曲げ部と板状部材との間に異方導電性部材を設ける。樹脂成形することによって、折り曲げ部と板状部材とを異方導電性部材を挟んで電気的に接続する。したがって、電子回路装置を枠状部材と板状部材とによって電磁シールドすることができる。   According to this configuration, the anisotropic conductive member is provided between the elastically deformable bent portion provided on the frame member and the plate member. By bending the resin, the bent portion and the plate-like member are electrically connected with the anisotropic conductive member interposed therebetween. Therefore, the electronic circuit device can be electromagnetically shielded by the frame-like member and the plate-like member.

本発明は、上述した各実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に組み合わせ、変更し、又は選択して採用できるものである。   The present invention is not limited to each of the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. It is.

１、２８、４２、６６ 封止前基板
２、２９、４３、６７ 基板
３ 半導体チップ（電子部品）
４、３２ａ、３２ｂ、４９、７２ 基板電極
５ パッド電極
６ ボンディングワイヤ
７、３４、３４ａ、５０、５０ａ、７３ 接地電極
８、３５ ソルダレジスト
９、３８ 切断線
１０、１０ａ、１０ｂ、３９ａ、３９ｂ 領域
１１、３６、５１、７０ 枠状部材
１２、１２ａ、１２ｂ、１２ｃ、１２ｄ、１２ｅ、３７、３７ａ、５２ａ、５２ｂ、５２ｃ、５２ｄ、７４ 折り曲げ部
１３、５５ 上型（第１型）
１４、５６ 下型（第２型）
１５ 底面部材
１６ 側面部材
１７、６３ キャビティ
１８ 離型フィルム
１９、７５ 板状部材
２０ 樹脂材料
２１ 流動性樹脂
２２、２２ａ、７７ 硬化樹脂（封止樹脂）
２３、４０、５３ 樹脂成形品
２４ 回転刃
２５、４１、５４、７８、７９、８１、８３ 電子回路装置
２６ａ、２６ｂ 接触部
２７ 隙間
３０、３１、４４、４５、４６、４７、６８、６９ 電子部品
３３ａ、３３ｂ、４８、７１ バンプ
５７ 中間型
５８ 樹脂タブレット
５９ ポット
６０ プランジャ
６１ カル
６２ ランナ
６４ ゲート
６５ 貫通穴
７６ 注入口
８０、８２ 異方性導電フィルム（異方導電部材）
８４ 導電性ペースト
Ｌ、Ｌ１、Ｌ２ 折り曲げ部の長さ
Ｗ、Ｗ１、Ｗ２ 接地電極の幅
Ｓ１、Ｓ２ 領域 1, 28, 42, 66 Pre-sealing substrate 2, 29, 43, 67 Substrate 3 Semiconductor chip (electronic component)
4, 32a, 32b, 49, 72 Substrate electrode 5 Pad electrode 6 Bonding wire 7, 34, 34a, 50, 50a, 73 Ground electrode 8, 35 Solder resist 9, 38 Cutting line 10, 10a, 10b, 39a, 39b Region 11, 36, 51, 70 Frame-like member 12, 12a, 12b, 12c, 12d, 12e, 37, 37a, 52a, 52b, 52c, 52d, 74 Bending part 13, 55 Upper mold (first mold)
14, 56 Lower mold (second mold)
15 Bottom member 16 Side member 17, 63 Cavity 18 Release film 19, 75 Plate member 20 Resin material 21 Flowable resin 22, 22a, 77 Cured resin (sealing resin)
23, 40, 53 Resin molded product 24 Rotary blade 25, 41, 54, 78, 79, 81, 83 Electronic circuit device 26a, 26b Contact portion 27 Gap 30, 31, 44, 45, 46, 47, 68, 69 Electronics Parts 33a, 33b, 48, 71 Bump 57 Intermediate mold 58 Resin tablet 59 Pot 60 Plunger 61 Cal 62 Runner 64 Gate 65 Through hole 76 Inlet 80, 82 Anisotropic conductive film (anisotropic conductive member)
84 Conductive paste L, L1, L2 Length of bent portion W, W1, W2 Ground electrode width S1, S2 region

Claims (7)

第１型と前記第１型に対向して配置される第２型とを有する成形型を用いて、電子部品が装着された基板に対して樹脂成形して、前記電子部品がシールド用部材によりシールドされた構造の電子回路装置を製造する電子回路装置の製造方法であって、
前記シールド用部材として、導電性の板状部材と、少なくとも一方の端部が折り曲げられて弾性変形可能とされた折り曲げ部を備える導電性の枠状部材とを準備する工程と、
前記第１型と前記第２型との間に、前記基板と前記枠状部材と前記板状部材とがこの順にて、前記基板及び前記板状部材の少なくとも一方側に前記折り曲げ部が配置された状態において、前記第１型と前記第２型とを型締めして、前記折り曲げ部を弾性変形させて樹脂成形を行う樹脂成形工程とを含む、電子回路装置の製造方法。 Using a mold having a first mold and a second mold disposed opposite to the first mold, resin molding is performed on a substrate on which the electronic component is mounted, and the electronic component is formed by a shielding member. An electronic circuit device manufacturing method for manufacturing an electronic circuit device having a shielded structure, comprising:
Preparing a conductive plate-like member and a conductive frame-like member provided with a bent portion, at least one of which is bent and elastically deformed, as the shielding member;
Between the first mold and the second mold, the substrate, the frame member, and the plate member are arranged in this order, and the bent portion is disposed on at least one side of the substrate and the plate member. A method of manufacturing an electronic circuit device, comprising: a resin molding step in which the first mold and the second mold are clamped and the bent portion is elastically deformed to perform resin molding. 前記樹脂成形工程では、前記折り曲げ部を弾性変形させる前に、前記板状部材と前記基板との間に流動性樹脂が配置された状態として、前記流動性樹脂を用いて樹脂成形を行う、請求項１に記載の電子回路装置の製造方法。   In the resin molding step, the resin molding is performed using the fluid resin in a state where the fluid resin is disposed between the plate-like member and the substrate before elastically deforming the bent portion. Item 2. A method for manufacturing an electronic circuit device according to Item 1. 前記樹脂成形工程では、前記第１型に前記基板及び前記枠状部材が配置され、前記第２型に前記板状部材が配置された状態において、樹脂成形を行う、請求項２に記載の電子回路装置の製造方法。   3. The electronic device according to claim 2, wherein in the resin molding step, resin molding is performed in a state in which the substrate and the frame-shaped member are disposed in the first mold and the plate-shaped member is disposed in the second mold. A method of manufacturing a circuit device. 前記樹脂成形工程では、前記第１型に前記基板が配置され、前記第２型に前記板状部材及び前記枠状部材が配置された状態において、樹脂成形を行う、請求項２に記載の電子回路装置の製造方法。   3. The electronic device according to claim 2, wherein, in the resin molding step, resin molding is performed in a state where the substrate is disposed in the first mold and the plate-shaped member and the frame-shaped member are disposed in the second mold. A method of manufacturing a circuit device. 前記樹脂成形工程では、前記折り曲げ部を弾性変形させた後に、前記板状部材と前記基板との間に流動性樹脂を導入して、前記流動性樹脂を用いて樹脂成形を行う、請求項１に記載の電子回路装置の製造方法。   In the resin molding step, after the bent portion is elastically deformed, a fluid resin is introduced between the plate member and the substrate, and resin molding is performed using the fluid resin. A method for manufacturing the electronic circuit device according to claim 1. 基板に装着された電子部品と、
前記電子部品をシールドする導電性の枠状部材と、
前記枠状部材の前記基板とは反対側に配置され、前記枠状部材と電気的に接続された導電性の板状部材と、
少なくとも前記基板と前記板状部材との間に配置された封止樹脂とを備え、
前記基板及び前記板状部材の少なくとも一方側において前記枠状部材の端部が折り曲げられた折り曲げ部が設けられており、
前記枠状部材が弾性変形可能な材質であり、前記基板及び前記板状部材の少なくとも一方と前記折り曲げ部との間に、前記封止樹脂が存在する部分と前記封止樹脂が存在しない部分とが存在する、電子回路装置。 Electronic components mounted on the board;
A conductive frame member that shields the electronic component;
A conductive plate-like member disposed on the opposite side of the frame-like member from the substrate and electrically connected to the frame-like member;
A sealing resin disposed at least between the substrate and the plate-like member;
A bent portion in which an end portion of the frame-like member is bent is provided on at least one side of the substrate and the plate-like member;
The frame-shaped member is made of an elastically deformable material, and a portion where the sealing resin exists and a portion where the sealing resin does not exist between at least one of the substrate and the plate-shaped member and the bent portion, There is an electronic circuit device. 基板に装着された電子部品と、
前記電子部品をシールドする導電性の枠状部材と、
前記枠状部材の前記基板とは反対側に配置され、前記枠状部材と電気的に接続された導電性の板状部材と、
少なくとも前記基板と前記板状部材との間に配置された封止樹脂とを備え、
前記基板及び前記板状部材の少なくとも一方側において前記枠状部材の端部が折り曲げられた折り曲げ部が設けられており、
前記枠状部材が弾性変形可能な材質であり、前記基板及び前記板状部材の少なくとも一方と前記折り曲げ部との間に異方導電性部材が介在する、電子回路装置。 Electronic components mounted on the board;
A conductive frame member that shields the electronic component;
A conductive plate-like member disposed on the opposite side of the frame-like member from the substrate and electrically connected to the frame-like member;
A sealing resin disposed at least between the substrate and the plate-like member;
A bent portion in which an end portion of the frame-like member is bent is provided on at least one side of the substrate and the plate-like member;
The electronic circuit device, wherein the frame member is made of an elastically deformable material, and an anisotropic conductive member is interposed between at least one of the substrate and the plate member and the bent portion.
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