JP2018041800A - Printed wiring board, printed circuit board, and prepreg - Google Patents

Printed wiring board, printed circuit board, and prepreg Download PDF

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Publication number
JP2018041800A
JP2018041800A JP2016173823A JP2016173823A JP2018041800A JP 2018041800 A JP2018041800 A JP 2018041800A JP 2016173823 A JP2016173823 A JP 2016173823A JP 2016173823 A JP2016173823 A JP 2016173823A JP 2018041800 A JP2018041800 A JP 2018041800A
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Prior art keywords
insulating layer
outermost
outermost insulating
wiring board
printed wiring
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JP6735505B2 (en
Inventor
伊藤　彰
Akira Ito
彰 伊藤
斉藤　英一郎
Eiichiro Saito
英一郎 斉藤
山野内　建吾
Kengo Yamanouchi
建吾 山野内
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2016173823A priority Critical patent/JP6735505B2/en
Priority to TW106127284A priority patent/TWI770047B/en
Priority to PCT/JP2017/029840 priority patent/WO2018047613A1/en
Priority to US16/324,199 priority patent/US11114354B2/en
Priority to KR1020197005798A priority patent/KR102337943B1/en
Priority to EP17848556.1A priority patent/EP3512315B1/en
Priority to CN201780052827.9A priority patent/CN109644568A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board capable of improving mounting reliability.SOLUTION: The printed wiring board includes: an inner insulating layer 4 having a conductor wiring line 3; a first outermost insulating layer 51 formed on a first surface 41 of the inner insulating layer 4; and a second outermost insulating layer 52 formed on a second surface 42 of the inner insulating layer 4. The flexural modulus of the first outermost insulating layer 51 and the second outermost insulating layer 52 is 1/4 or more and 3/4 or less of the flexural modulus of the inner insulating layer 4. The glass transition temperature of the first outermost insulating layer 51 and the second outermost insulating layer 52 is ±20°C of the glass transition temperature of the internal insulating layer 4.SELECTED DRAWING: Figure 1

Description

本発明は、プリント配線板、プリント回路板、プリプレグに関する。   The present invention relates to a printed wiring board, a printed circuit board, and a prepreg.

近年、電子機器の小型化及び高機能化を図るため、プリント配線板の配線密度を高め、部品実装密度を高める必要性が大きくなっている。このようにプリント配線板に実装する部品が多くなるほど、実装信頼性の向上が求められる。従来、このような要求に応えるため、コア基板と絶縁層とを備え、さらに絶縁層の弾性率をコア基板の弾性率よりも小さくした複合基板が開発されている（例えば、特許文献１参照）。特許文献１に記載の複合基板では、弾性率の小さい絶縁層により、熱膨張係数の違いによる歪み応力を吸収することができるので、複合基板に実装部品を搭載した場合の接続信頼性が向上するというものである。   In recent years, in order to reduce the size and increase the functionality of electronic devices, there is a growing need to increase the wiring density of printed wiring boards and increase the component mounting density. As the number of components to be mounted on the printed wiring board increases, the mounting reliability is required to be improved. Conventionally, in order to meet such a demand, a composite substrate having a core substrate and an insulating layer, and further having an insulating layer whose elastic modulus is smaller than that of the core substrate has been developed (for example, see Patent Document 1). . In the composite substrate described in Patent Document 1, since the strain stress due to the difference in thermal expansion coefficient can be absorbed by the insulating layer having a small elastic modulus, the connection reliability when mounting components are mounted on the composite substrate is improved. That's it.

特開２００７−３２９４４１号公報JP 2007-329441 A

特許文献１に記載されているような複合基板では、加熱されると反りが発生し、この反りによる応力が、複合基板と実装部品との接続部分のはんだに集中し、クラックが発生する場合があることを本発明者らは見出した。このようなはんだクラックの発生を抑制するためには、絶縁層の弾性率をコア基板の弾性率よりも小さくするだけでは不十分である。   In a composite substrate such as that described in Patent Document 1, warping occurs when heated, and the stress due to this warp concentrates on the solder at the connecting portion between the composite substrate and the mounted component, and cracks may occur. We have found that. In order to suppress the occurrence of such solder cracks, it is not sufficient to make the elastic modulus of the insulating layer smaller than the elastic modulus of the core substrate.

本発明は上記の点に鑑みてなされたものであり、実装信頼性を向上させることができるプリント配線板、プリント回路板、プリプレグを提供することを目的とする。   The present invention has been made in view of the above points, and an object thereof is to provide a printed wiring board, a printed circuit board, and a prepreg capable of improving the mounting reliability.

本発明に係るプリント配線板は、
導体配線を有する内部絶縁層と、
前記内部絶縁層の第１面に形成された第１最外絶縁層と、
前記内部絶縁層の第２面に形成された第２最外絶縁層と
を備え、
前記第１最外絶縁層及び前記第２最外絶縁層の曲げ弾性率が、前記内部絶縁層の曲げ弾性率の１／４以上３／４以下であり、
前記第１最外絶縁層及び前記第２最外絶縁層のガラス転移温度が、前記内部絶縁層のガラス転移温度の±２０℃であることを特徴とする。 The printed wiring board according to the present invention,
An internal insulating layer having conductor wiring;
A first outermost insulating layer formed on the first surface of the inner insulating layer;
A second outermost insulating layer formed on the second surface of the inner insulating layer,
The bending elastic modulus of the first outermost insulating layer and the second outermost insulating layer is not less than 1/4 and not more than 3/4 of the bending elastic modulus of the internal insulating layer,
The glass transition temperatures of the first outermost insulating layer and the second outermost insulating layer are ± 20 ° C. of the glass transition temperature of the inner insulating layer.

本発明に係るプリント回路板は、
前記プリント配線板と、
前記第１最外絶縁層及び前記第２最外絶縁層の少なくともいずれかの外部の表面に形成された最外導体配線と、
前記最外導体配線に電気的に接続されて実装された電子部品と
を備えることを特徴とする。 The printed circuit board according to the present invention is
The printed wiring board;
An outermost conductor wiring formed on an outer surface of at least one of the first outermost insulating layer and the second outermost insulating layer;
And an electronic component mounted in an electrically connected manner with the outermost conductor wiring.

本発明に係るプリプレグは、
導体配線を有する内部絶縁層と、
前記内部絶縁層の第１面に形成された第１最外絶縁層と、
前記内部絶縁層の第２面に形成された第２最外絶縁層と
を備えたプリント配線板の材料として用いられるプリプレグであって、
前記プリプレグの硬化物が、前記第１最外絶縁層及び前記第２最外絶縁層であり、
前記第１最外絶縁層及び前記第２最外絶縁層の曲げ弾性率が、前記内部絶縁層の曲げ弾性率の１／４以上３／４以下であり、
前記第１最外絶縁層及び前記第２最外絶縁層のガラス転移温度が、前記内部絶縁層のガラス転移温度の±２０℃であることを特徴とする。 The prepreg according to the present invention is
An internal insulating layer having conductor wiring;
A first outermost insulating layer formed on the first surface of the inner insulating layer;
A prepreg used as a material for a printed wiring board comprising a second outermost insulating layer formed on the second surface of the inner insulating layer,
The cured product of the prepreg is the first outermost insulating layer and the second outermost insulating layer,
The bending elastic modulus of the first outermost insulating layer and the second outermost insulating layer is not less than 1/4 and not more than 3/4 of the bending elastic modulus of the internal insulating layer,
The glass transition temperatures of the first outermost insulating layer and the second outermost insulating layer are ± 20 ° C. of the glass transition temperature of the inner insulating layer.

本発明によれば、実装信頼性を向上させることができる。   According to the present invention, mounting reliability can be improved.

図１は本発明の実施形態に係るプリント配線板を示す概略断面図である。FIG. 1 is a schematic cross-sectional view showing a printed wiring board according to an embodiment of the present invention. 図２は本発明の他の実施形態に係るプリント配線板を示す概略断面図である。FIG. 2 is a schematic sectional view showing a printed wiring board according to another embodiment of the present invention. 図３Ａ及び図３Ｂは図１に示すプリント配線板の製造工程を示す概略断面図である。3A and 3B are schematic cross-sectional views showing manufacturing steps of the printed wiring board shown in FIG. 図４Ａ及び図４Ｂは図２に示すプリント配線板の製造工程を示す概略断面図である。4A and 4B are schematic cross-sectional views showing manufacturing steps of the printed wiring board shown in FIG. 図５Ａは本発明の実施形態に係るプリント回路板を示す概略断面図であり、図５Ｂは同上のプリント回路板を示す概略斜視図である。FIG. 5A is a schematic sectional view showing a printed circuit board according to an embodiment of the present invention, and FIG. 5B is a schematic perspective view showing the same printed circuit board. 図６は本発明の他の実施形態に係るプリント回路板を示す概略断面図である。FIG. 6 is a schematic sectional view showing a printed circuit board according to another embodiment of the present invention.

以下、本発明の実施の形態を説明する。   Embodiments of the present invention will be described below.

［プリント配線板］
本実施形態のプリント配線板１は、図１及び図２に示すように、内部絶縁層４と、第１最外絶縁層５１と、第２最外絶縁層５２とを備えている。まず内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２について説明し、次にこれらの曲げ弾性率、ガラス転移温度（Ｔｇ）及び熱膨張率の関係について説明する。なお、以下において、厚み方向とは、図５Ｂに示すように、プリント回路板２において電子部品１０が実装される面に平行な面（ＸＹ平面）に対する法線に平行な方向（Ｚ方向）を意味する。プリント回路板２は、電子部品１０をプリント配線板１に実装したものである。 [Printed wiring board]
As shown in FIGS. 1 and 2, the printed wiring board 1 of this embodiment includes an internal insulating layer 4, a first outermost insulating layer 51, and a second outermost insulating layer 52. First, the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 will be described, and then the relationship between the flexural modulus, glass transition temperature (Tg), and thermal expansion coefficient will be described. In the following, the thickness direction means a direction (Z direction) parallel to the normal to the surface (XY plane) parallel to the surface on which the electronic component 10 is mounted on the printed circuit board 2 as shown in FIG. 5B. means. The printed circuit board 2 is obtained by mounting the electronic component 10 on the printed wiring board 1.

（内部絶縁層）
内部絶縁層４は、プリント配線板１の内部に芯として入っているコア材であり、電気的な絶縁性を有している。内部絶縁層４は第１面４１及び第２面４２を有し、これらの第１面４１及び第２面４２は表裏の関係にある。第１面４１及び第２面４２の少なくともいずれかに導体配線３が形成されている。このように内部絶縁層４は導体配線３を有している。この導体配線３は、プリント配線板１の内部において内層の導体層を形成する。内層の導体層の具体例として、信号層、電源層、グラウンド層が挙げられる。 (Inner insulation layer)
The internal insulating layer 4 is a core material contained as a core inside the printed wiring board 1 and has electrical insulation. The inner insulating layer 4 has a first surface 41 and a second surface 42, and the first surface 41 and the second surface 42 are in a front-back relationship. The conductor wiring 3 is formed on at least one of the first surface 41 and the second surface 42. Thus, the internal insulating layer 4 has the conductor wiring 3. The conductor wiring 3 forms an inner conductor layer inside the printed wiring board 1. Specific examples of the inner conductor layer include a signal layer, a power supply layer, and a ground layer.

内部絶縁層４は、図１に示すように単一の内層材４１０で形成されていてもよいし、図２に示すように複数の内層材４１０で形成されていてもよい。   The inner insulating layer 4 may be formed of a single inner layer material 410 as shown in FIG. 1, or may be formed of a plurality of inner layer materials 410 as shown in FIG.

まず図１に示すように、内部絶縁層４が単一の内層材４１０で形成されている場合について説明する。この場合、金属張積層板のように、表面に金属箔のある絶縁基板にサブトラクティブ法を使用して、導体配線３を有する内部絶縁層４を製造することができる。金属張積層板の具体例として、銅張積層板が挙げられる。またアンクラッド板のように、表面に金属箔のない絶縁基板にアディティブ法を使用して、導体配線３を有する内部絶縁層４を製造してもよい。   First, as shown in FIG. 1, the case where the inner insulating layer 4 is formed of a single inner layer material 410 will be described. In this case, the internal insulating layer 4 having the conductor wiring 3 can be manufactured by using a subtractive method on an insulating substrate having a metal foil on the surface like a metal-clad laminate. A specific example of the metal-clad laminate is a copper-clad laminate. Moreover, you may manufacture the internal insulating layer 4 which has the conductor wiring 3 using an additive method to the insulating board | substrate which does not have metal foil on the surface like an unclad board.

次に図２に示すように、内部絶縁層４が複数の内層材４１０で形成されている場合について説明する。特に内部絶縁層４が２枚の内層材４１０で形成されている場合について説明するが、内層材４１０の枚数は特に限定されない。内部絶縁層４は、接着層４００と、第１内層材４１１と、第２内層材４１２とを備えている。以下では、接着層４００、第１内層材４１１及び第２内層材４１２について説明する。   Next, the case where the inner insulating layer 4 is formed of a plurality of inner layer materials 410 will be described as shown in FIG. In particular, the case where the inner insulating layer 4 is formed of two inner layer materials 410 will be described, but the number of inner layer materials 410 is not particularly limited. The internal insulating layer 4 includes an adhesive layer 400, a first inner layer material 411, and a second inner layer material 412. Hereinafter, the adhesive layer 400, the first inner layer material 411, and the second inner layer material 412 will be described.

＜接着層＞
接着層４００は、第１内層材４１１と第２内層材４１２との間に介在し、これらを接着している層である。接着層４００は電気的な絶縁性を有している。このような接着性及び絶縁性を有していれば、接着層４００の材質は特に限定されない。また第１内層材４１１と第２内層材４１２との間の絶縁性が確保できれば、接着層４００の厚みは特に限定されない。接着層４００は第１面４０１及び第２面４０２を有し、これらの第１面４０１及び第２面４０２は表裏の関係にある。このような接着層４００は、例えば、熱硬化性を有する接着シート４４０で形成することができる。 <Adhesive layer>
The adhesive layer 400 is a layer that is interposed between the first inner layer material 411 and the second inner layer material 412 and adheres them. The adhesive layer 400 has electrical insulation. If it has such adhesiveness and insulation, the material of the contact bonding layer 400 will not be specifically limited. In addition, the thickness of the adhesive layer 400 is not particularly limited as long as the insulation between the first inner layer material 411 and the second inner layer material 412 can be secured. The adhesive layer 400 has a first surface 401 and a second surface 402, and the first surface 401 and the second surface 402 are in a front-back relationship. Such an adhesive layer 400 can be formed of, for example, an adhesive sheet 440 having thermosetting properties.

＜第１内層材及び第２内層材＞
第１内層材４１１は、接着層４００の第１面４０１に形成されている。第１内層材４１１は、第１基板４２１と、第１導体配線４３１とを有している。このような第１内層材４１１は、次のようにして製造することができる。すなわち、金属張積層板のように、表面に金属箔のある第１基板４２１にサブトラクティブ法を使用して、第１導体配線４３１を有する第１内層材４１１を製造することができる。金属張積層板の具体例として、銅張積層板が挙げられる。またアンクラッド板のように、表面に金属箔のない第１基板４２１にアディティブ法を使用して、第１導体配線４３１を有する第１内層材４１１を製造してもよい。このように第１導体配線４３１は、第１基板４２１の表面に形成されている。第１導体配線４３１は、第１基板４２１の両面に形成されてもよいし、片面のみに形成されてもよい。 <First inner layer material and second inner layer material>
The first inner layer material 411 is formed on the first surface 401 of the adhesive layer 400. The first inner layer material 411 includes a first substrate 421 and a first conductor wiring 431. Such a first inner layer material 411 can be manufactured as follows. That is, the first inner layer material 411 having the first conductor wiring 431 can be manufactured by using the subtractive method on the first substrate 421 having a metal foil on the surface like a metal-clad laminate. A specific example of the metal-clad laminate is a copper-clad laminate. Moreover, you may manufacture the 1st inner-layer material 411 which has the 1st conductor wiring 431 using the additive method for the 1st board | substrate 421 which does not have metal foil on the surface like an unclad board. Thus, the first conductor wiring 431 is formed on the surface of the first substrate 421. The first conductor wiring 431 may be formed on both surfaces of the first substrate 421 or only on one surface.

第２内層材４１２は、接着層４００の第２面４０２に形成されている。第２内層材４１２は、第２基板４２２と、第２導体配線４３２とを有している。このような第２内層材４１２は、第１内層材４１１と同様に製造することができる。そして第２導体配線４３２は、第２基板４２２の表面に形成されている。第２導体配線４３２は、第２基板４２２の両面に形成されてもよいし、片面のみに形成されてもよい。   The second inner layer material 412 is formed on the second surface 402 of the adhesive layer 400. The second inner layer material 412 has a second substrate 422 and a second conductor wiring 432. Such a second inner layer material 412 can be manufactured in the same manner as the first inner layer material 411. The second conductor wiring 432 is formed on the surface of the second substrate 422. The second conductor wiring 432 may be formed on both surfaces of the second substrate 422 or only on one surface.

内部絶縁層４の厚み方向（Ｚ方向）において、接着層４００を中心として、第１内層材４１１と第２内層材４１２とが対称であることが好ましい。具体的には、第１基板４２１及び第２基板４２２の厚みは同じであることが好ましい。また第１基板４２１及び第２基板４２２の材質は同じであることが好ましい。これにより、プリント配線板１及びプリント回路板２の反りの発生を抑制し、実装信頼性の更なる向上を図ることができる。   In the thickness direction (Z direction) of the inner insulating layer 4, the first inner layer material 411 and the second inner layer material 412 are preferably symmetric with respect to the adhesive layer 400. Specifically, the thicknesses of the first substrate 421 and the second substrate 422 are preferably the same. The materials of the first substrate 421 and the second substrate 422 are preferably the same. Thereby, generation | occurrence | production of the curvature of the printed wiring board 1 and the printed circuit board 2 can be suppressed, and the further improvement of mounting reliability can be aimed at.

（第１最外絶縁層及び第２最外絶縁層）
第１最外絶縁層５１は、内部絶縁層４の第１面４１に形成されている。第２最外絶縁層５２は、内部絶縁層４の第２面４２に形成されている。第１最外絶縁層５１及び第２最外絶縁層５２の厚みは同じであることが好ましい。また第１最外絶縁層５１及び第２最外絶縁層５２の材質は同じであることが好ましい。これにより、プリント配線板１及びプリント回路板２の厚み方向（Ｚ方向）において、内部絶縁層４を中心として対称となるため、プリント配線板１及びプリント回路板２の反りの発生を抑制し、実装信頼性の更なる向上を図ることができる。なお、上述のように第１面４１及び第２面４２の少なくともいずれかに導体配線３が形成されているので、厳密な意味では、第１面４１の全面と第１最外絶縁層５１とが接触していないこともあり、第２面４２の全面と第２最外絶縁層５２とが接触していないこともある。 (First outermost insulating layer and second outermost insulating layer)
The first outermost insulating layer 51 is formed on the first surface 41 of the inner insulating layer 4. The second outermost insulating layer 52 is formed on the second surface 42 of the inner insulating layer 4. The thickness of the first outermost insulating layer 51 and the second outermost insulating layer 52 is preferably the same. The materials of the first outermost insulating layer 51 and the second outermost insulating layer 52 are preferably the same. Thereby, in the thickness direction (Z direction) of the printed wiring board 1 and the printed circuit board 2, since it becomes symmetrical with respect to the inner insulating layer 4, the occurrence of warpage of the printed wiring board 1 and the printed circuit board 2 is suppressed, The mounting reliability can be further improved. Since the conductor wiring 3 is formed on at least one of the first surface 41 and the second surface 42 as described above, in a strict sense, the entire surface of the first surface 41, the first outermost insulating layer 51, and May not be in contact with each other, and the entire second surface 42 may not be in contact with the second outermost insulating layer 52.

第１最外絶縁層５１及び第２最外絶縁層５２は、プリプレグ６の硬化物で形成されていることが好ましい。以下では、プリプレグ６について説明する。   The first outermost insulating layer 51 and the second outermost insulating layer 52 are preferably formed of a cured product of the prepreg 6. Below, the prepreg 6 is demonstrated.

＜プリプレグ＞
プリプレグ６は、熱硬化性樹脂組成物と、基材８とを備えている。 <Prepreg>
The prepreg 6 includes a thermosetting resin composition and a base material 8.

熱硬化性樹脂組成物は、エポキシ樹脂と、硬化剤と、硬化促進剤と、無機充填材と、低弾性化剤とを含有することが好ましい。   The thermosetting resin composition preferably contains an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a low elasticity agent.

エポキシ樹脂の具体例として、臭素化エポキシ樹脂、クレゾールノボラック型エポキシ樹脂が挙げられる。   Specific examples of the epoxy resin include brominated epoxy resin and cresol novolac type epoxy resin.

硬化剤の具体例として、ノボラック型フェノール樹脂、ジシアンジアミドが挙げられる。硬化剤としてノボラック型フェノール樹脂を用いる場合、エポキシ樹脂１当量に対してノボラック型フェノール樹脂は０．８〜１．１当量であることが好ましい。硬化剤としてジシアンジアミドを用いる場合、エポキシ樹脂１当量に対してジシアンジアミドは０．３〜０．６当量であることが好ましい。   Specific examples of the curing agent include novolac type phenol resin and dicyandiamide. When a novolac type phenol resin is used as the curing agent, the novolac type phenol resin is preferably 0.8 to 1.1 equivalents per 1 equivalent of the epoxy resin. When dicyandiamide is used as the curing agent, dicyandiamide is preferably 0.3 to 0.6 equivalents relative to 1 equivalent of epoxy resin.

硬化促進剤の具体例として、２−エチル−４−メチルイミダゾールが挙げられる。エポキシ樹脂１００質量部に対する硬化促進剤の添加量（質量部）をｐｈｒとすると、硬化促進剤の添加量は０．０１〜３ｐｈｒが好ましい。   A specific example of the curing accelerator is 2-ethyl-4-methylimidazole. When the addition amount (mass part) of the curing accelerator with respect to 100 parts by mass of the epoxy resin is phr, the addition amount of the curing accelerator is preferably 0.01 to 3 phr.

無機充填材の具体例として、水酸化アルミニウム、球状シリカ、破砕シリカ、破砕ガラスが挙げられる。   Specific examples of the inorganic filler include aluminum hydroxide, spherical silica, crushed silica, and crushed glass.

低弾性化剤の具体例として、カルボキシル基含有エチレンアクリルゴム、カルボキシル基含有ニトリルゴム、コアシェル型ゴム、アクリルゴムパウダー、シリコーンパウダーが挙げられる。これらの中では特にカルボキシル基含有エチレンアクリルゴムが好ましい。なお、コアシェル型ゴムは、ゴム状ポリマーからなるコア層を、ガラス状ポリマーのシェル層で被覆したコアシェル構造を有する真珠状微粒子である。   Specific examples of the low elastic agent include carboxyl group-containing ethylene acrylic rubber, carboxyl group-containing nitrile rubber, core-shell type rubber, acrylic rubber powder, and silicone powder. Among these, carboxyl group-containing ethylene acrylic rubber is particularly preferable. The core-shell type rubber is a pearl-like fine particle having a core-shell structure in which a core layer made of a rubber-like polymer is covered with a glass-like polymer shell layer.

カルボキシル基含有エチレンアクリルゴムは、一般的なゴムとは異なる特性をプリント配線板１及びプリント回路板２に付与する。一般的なゴムでは、プリント配線板１及びプリント回路板２の弾性率を低下させることはできるが、熱膨張率が上昇したり、ガラス転移温度が低下したりするおそれがある。熱膨張率の上昇及びガラス転移温度の低下により、プリント配線板１及びプリント回路板２に反りが発生するおそれがある。この場合、プリント配線板１及びプリント回路板２が高弾性であると、はんだ接続部１２に発生する応力が大きくなり、はんだクラックが発生するおそれがある。そのため、プリント配線板１及びプリント回路板２は低弾性であることが好ましい。一般的なゴムに対して、カルボキシル基含有エチレンアクリルゴムでは、プリント配線板１及びプリント回路板２の熱膨張率の上昇及びガラス転移温度の低下を抑制しつつ、弾性率を低下させることができる。これにより、プリント配線板１及びプリント回路板２の反りの発生を抑制し、耐熱性も高めることができる。そして、電子部品１０とプリント配線板１とを電気的及び物理的に接続するはんだ接続部１２に発生する応力を緩和しやすくなり、実装信頼性の更なる向上を図ることができる。   The carboxyl group-containing ethylene acrylic rubber gives the printed wiring board 1 and the printed circuit board 2 with characteristics different from general rubber. With general rubber, the elastic modulus of the printed wiring board 1 and the printed circuit board 2 can be reduced, but the thermal expansion coefficient may increase or the glass transition temperature may decrease. The printed wiring board 1 and the printed circuit board 2 may be warped due to an increase in the coefficient of thermal expansion and a decrease in the glass transition temperature. In this case, if the printed wiring board 1 and the printed circuit board 2 are highly elastic, the stress generated in the solder connection portion 12 is increased, and there is a possibility that a solder crack may occur. Therefore, it is preferable that the printed wiring board 1 and the printed circuit board 2 have low elasticity. In contrast to general rubber, carboxyl group-containing ethylene acrylic rubber can reduce the elastic modulus while suppressing the increase in the thermal expansion coefficient and the glass transition temperature of the printed wiring board 1 and the printed circuit board 2. . Thereby, generation | occurrence | production of the curvature of the printed wiring board 1 and the printed circuit board 2 can be suppressed, and heat resistance can also be improved. And it becomes easy to relieve the stress which generate | occur | produces in the solder connection part 12 which connects the electronic component 10 and the printed wiring board 1 electrically and physically, and can aim at the further improvement of mounting reliability.

エポキシ樹脂を１００質量部とした場合に、無機充填材が５０質量部以上２００質量部以下であることが好ましい。無機充填材が５０質量部以上であることによって、プリント配線板１及びプリント回路板２の熱膨張率の上昇を抑制することができる。特にプリント配線板１及びプリント回路板２の厚み方向（Ｚ方向）に垂直な任意の方向における熱膨張率の上昇を抑制することができる。具体的には図５Ｂに示すように、ＸＹ平面に平行な実装面１１での任意の方向における熱膨張率の上昇を抑制することができる。また無機充填材が２００質量部以下であることによって、弾性率の上昇を抑制することができる。これにより、電子部品１０とプリント配線板１とを電気的及び物理的に接続するはんだ接続部１２に発生する応力を緩和しやすくなり、実装信頼性の更なる向上を図ることができる。   When the epoxy resin is 100 parts by mass, the inorganic filler is preferably 50 parts by mass or more and 200 parts by mass or less. When the inorganic filler is 50 parts by mass or more, an increase in the thermal expansion coefficient of the printed wiring board 1 and the printed circuit board 2 can be suppressed. In particular, an increase in the coefficient of thermal expansion in an arbitrary direction perpendicular to the thickness direction (Z direction) of the printed wiring board 1 and the printed circuit board 2 can be suppressed. Specifically, as shown in FIG. 5B, an increase in the coefficient of thermal expansion in an arbitrary direction on the mounting surface 11 parallel to the XY plane can be suppressed. Moreover, the raise of an elastic modulus can be suppressed because an inorganic filler is 200 mass parts or less. Thereby, it becomes easy to relieve the stress generated in the solder connection portion 12 that electrically and physically connects the electronic component 10 and the printed wiring board 1, and the mounting reliability can be further improved.

エポキシ樹脂を１００質量部とした場合に、低弾性化剤が５質量部以上７０質量部以下であることが好ましい。低弾性化剤が５質量部以上であることによって、低弾性化剤の添加による効果をより大きく得ることができる。低弾性化剤が７０質量部以下であることによって、第１最外絶縁層５１及び第２最外絶縁層５２と、導体配線３及び最外導体配線９との間の密着性の低下を抑制することができる。さらに熱硬化性樹脂組成物の成形性（回路埋め込み性）の低下も抑制することができる。すなわち、プリント配線板１を製造する際に、第１面４１及び第２面４２の各々において隣り合う導体配線３，３間の隙間に、ボイド（気泡）の発生を抑えながら、熱硬化性樹脂組成物を埋め込むことができる。   When the epoxy resin is 100 parts by mass, the low elasticity agent is preferably 5 parts by mass or more and 70 parts by mass or less. The effect by addition of a low elasticity agent can be acquired more largely because a low elasticity agent is 5 mass parts or more. Suppressing a decrease in adhesion between the first outermost insulating layer 51 and the second outermost insulating layer 52 and the conductor wiring 3 and the outermost conductor wiring 9 due to the low elasticizing agent being 70 parts by mass or less. can do. Furthermore, a decrease in moldability (circuit embeddability) of the thermosetting resin composition can also be suppressed. That is, when the printed wiring board 1 is manufactured, the thermosetting resin is suppressed while suppressing the generation of voids (bubbles) in the gaps between the adjacent conductor wirings 3 and 3 on each of the first surface 41 and the second surface 42. The composition can be embedded.

さらに熱硬化性樹脂組成物は、柔軟化材を含有してもよい。柔軟化材の具体例として、アルキルアセタール化ポリビニルアルコールが挙げられる。   Furthermore, the thermosetting resin composition may contain a softening material. Specific examples of the softening material include alkyl acetalized polyvinyl alcohol.

熱硬化性樹脂組成物は、上述のエポキシ樹脂、硬化剤、硬化促進剤、無機充填材、低弾性化剤を配合し、さらに必要に応じて柔軟化材を配合することによって調製することができる。   The thermosetting resin composition can be prepared by blending the above-described epoxy resin, curing agent, curing accelerator, inorganic filler, and low elastic agent, and further blending a softening material as necessary. .

基材８は、例えば、無機繊維の織布又は不織布、有機繊維の織布又は不織布であるが、特に限定されない。無機繊維の織布の具体例として、ガラスクロスが挙げられる。   The substrate 8 is, for example, an inorganic fiber woven or nonwoven fabric, or an organic fiber woven or nonwoven fabric, but is not particularly limited. Specific examples of the woven fabric of inorganic fibers include glass cloth.

プリプレグ６を製造するにあたっては、まず熱硬化性樹脂組成物を基材８に含浸させる。基材８に含浸させやすくするため、あらかじめ熱硬化性樹脂組成物は溶剤で希釈してワニスとしてもよい。溶剤の具体例として、Ｎ，Ｎ−ジメチルホルムアミド、メチルエチルケトンが挙げられる。このように、基材８は、熱硬化性樹脂組成物が含浸されている。次に熱硬化性樹脂組成物が含浸された基材８を加熱して、熱硬化性樹脂組成物を半硬化状態とする。半硬化状態はＢステージの状態であり、Ｂステージは硬化反応の中間段階である。中間段階とは、流動性を有するワニス状態のＡステージと、完全に硬化した状態のＣステージとの間の段階である。このように、プリプレグ６において熱硬化性樹脂組成物は半硬化状態である。このプリプレグ６を加熱すると、半硬化状態の熱硬化性樹脂組成物は一度溶融した後、完全硬化し、Ｃステージの状態となる。   In manufacturing the prepreg 6, first, the base 8 is impregnated with the thermosetting resin composition. In order to facilitate the impregnation of the base material 8, the thermosetting resin composition may be diluted with a solvent in advance to form a varnish. Specific examples of the solvent include N, N-dimethylformamide and methyl ethyl ketone. Thus, the base material 8 is impregnated with the thermosetting resin composition. Next, the base material 8 impregnated with the thermosetting resin composition is heated to bring the thermosetting resin composition into a semi-cured state. The semi-cured state is a B-stage state, and the B-stage is an intermediate stage of the curing reaction. The intermediate stage is a stage between a varnish A stage having fluidity and a fully cured C stage. Thus, in the prepreg 6, the thermosetting resin composition is in a semi-cured state. When this prepreg 6 is heated, the semi-cured thermosetting resin composition is once melted and then completely cured to be in a C-stage state.

（曲げ弾性率）
第１最外絶縁層５１及び第２最外絶縁層５２の曲げ弾性率は、内部絶縁層４の曲げ弾性率の１／４以上３／４以下である。このように、内部絶縁層４に比べて、第１最外絶縁層５１及び第２最外絶縁層５２は低弾性である。第１最外絶縁層５１及び第２最外絶縁層５２の曲げ弾性率が内部絶縁層４の曲げ弾性率の１／４未満であると、第１最外絶縁層５１及び第２最外絶縁層５２の外部の表面に最外導体配線９を形成することが困難となり、最外導体配線９の密着性も低下し、さらに電子部品１０を実装する際に実装面１１が凹んだりするおそれもある。第１最外絶縁層５１及び第２最外絶縁層５２の曲げ弾性率が内部絶縁層４の曲げ弾性率の３／４を超えると、電子部品１０とプリント配線板１とを電気的及び物理的に接続するはんだ接続部１２に発生する応力を吸収しにくくなり、実装信頼性が低下するおそれがある。好ましくは、内部絶縁層４の曲げ弾性率は１５〜３５ＧＰａである。 (Flexural modulus)
The bending elastic modulus of the first outermost insulating layer 51 and the second outermost insulating layer 52 is not less than 1/4 and not more than 3/4 of the bending elastic modulus of the internal insulating layer 4. Thus, the first outermost insulating layer 51 and the second outermost insulating layer 52 are less elastic than the inner insulating layer 4. When the bending elastic modulus of the first outermost insulating layer 51 and the second outermost insulating layer 52 is less than ¼ of the bending elastic modulus of the internal insulating layer 4, the first outermost insulating layer 51 and the second outermost insulating layer It becomes difficult to form the outermost conductor wiring 9 on the outer surface of the layer 52, the adhesion of the outermost conductor wiring 9 is lowered, and the mounting surface 11 may be recessed when the electronic component 10 is mounted. is there. When the bending elastic modulus of the first outermost insulating layer 51 and the second outermost insulating layer 52 exceeds 3/4 of the bending elastic modulus of the inner insulating layer 4, the electronic component 10 and the printed wiring board 1 are electrically and physically connected. Therefore, it is difficult to absorb the stress generated in the solder connection portion 12 to be connected, and the mounting reliability may be reduced. Preferably, the flexural modulus of the inner insulating layer 4 is 15 to 35 GPa.

ここで、第１最外絶縁層５１の曲げ弾性率と第２最外絶縁層５２の曲げ弾性率とは異なっていてもよいが、同じであることが好ましい。第１最外絶縁層５１の曲げ弾性率と第２最外絶縁層５２の曲げ弾性率とが同じであると、プリント配線板１及びプリント回路板２の厚み方向（Ｚ方向）において、内部絶縁層４を中心として対称となるため、プリント配線板１及びプリント回路板２の反りの発生を抑制し、実装信頼性の更なる向上を図ることができる。   Here, the bending elastic modulus of the first outermost insulating layer 51 and the bending elastic modulus of the second outermost insulating layer 52 may be different, but are preferably the same. When the bending elastic modulus of the first outermost insulating layer 51 and the bending elastic modulus of the second outermost insulating layer 52 are the same, internal insulation is obtained in the thickness direction (Z direction) of the printed wiring board 1 and the printed circuit board 2. Since it becomes symmetrical about the layer 4, the occurrence of warpage of the printed wiring board 1 and the printed circuit board 2 can be suppressed, and the mounting reliability can be further improved.

次に、内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２の曲げ弾性率の測定方法について説明する。第１の方法は、製造後のプリント配線板１又はプリント回路板２を、内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２の３つに分解して、それぞれの曲げ弾性率を測定する方法である。第２の方法は、製造予定のプリント配線板１及びプリント回路板２における内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２を個別に製造して、それぞれの曲げ弾性率を測定する方法である。いずれの方法においても、ＪＩＳ Ｋ ７１７１に準拠して曲げ弾性率を測定することができる。   Next, a method for measuring the flexural modulus of the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 will be described. The first method is to disassemble the printed wiring board 1 or the printed circuit board 2 after manufacturing into three parts, an internal insulating layer 4, a first outermost insulating layer 51, and a second outermost insulating layer 52, and This is a method for measuring the flexural modulus. In the second method, the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 in the printed wiring board 1 and the printed circuit board 2 to be manufactured are individually manufactured, and each bending elasticity is manufactured. It is a method of measuring the rate. In any method, the flexural modulus can be measured according to JIS K 7171.

（ガラス転移温度）
第１最外絶縁層５１及び第２最外絶縁層５２のガラス転移温度は、内部絶縁層４のガラス転移温度の±２０℃である。すなわち、（内部絶縁層４のガラス転移温度−２０℃）≦（第１最外絶縁層５１及び第２最外絶縁層５２のガラス転移温度）≦（内部絶縁層４のガラス転移温度＋２０℃）である。この不等式の条件が満たされていないと、電子部品１０を実装する際のリフローはんだ付けによる加熱で、ガラス転移温度が低い方が先に軟化して、プリント配線板１に内包されていた応力が解放されて反りが発生するおそれがある。この場合、第１最外絶縁層５１及び第２最外絶縁層５２による応力吸収効果だけでは、反りに起因する応力を吸収しきれないことがあるので、電子部品１０とプリント配線板１とを電気的及び物理的に接続するはんだ接続部１２にはんだクラックが発生するおそれがある。好ましくは、内部絶縁層４のガラス転移温度は１３０℃以上である。 (Glass-transition temperature)
The glass transition temperature of the first outermost insulating layer 51 and the second outermost insulating layer 52 is ± 20 ° C. of the glass transition temperature of the inner insulating layer 4. That is, (glass transition temperature of the inner insulating layer −20 ° C.) ≦ (glass transition temperature of the first outermost insulating layer 51 and the second outermost insulating layer 52) ≦ (glass transition temperature of the inner insulating layer 4 + 20 ° C.) It is. If the condition of this inequality is not satisfied, the heat of reflow soldering when mounting the electronic component 10 will soften the lower glass transition temperature first, and the stress contained in the printed wiring board 1 will be reduced. There is a risk of warping when released. In this case, since the stress due to warping may not be absorbed by only the stress absorption effect of the first outermost insulating layer 51 and the second outermost insulating layer 52, the electronic component 10 and the printed wiring board 1 are connected to each other. There is a possibility that solder cracks may occur in the solder connection portions 12 that are electrically and physically connected. Preferably, the glass transition temperature of the inner insulating layer 4 is 130 ° C. or higher.

ここで、第１最外絶縁層５１のガラス転移温度と第２最外絶縁層５２のガラス転移温度とは異なっていてもよいが、同じであることが好ましい。第１最外絶縁層５１のガラス転移温度と第２最外絶縁層５２のガラス転移温度とが同じであると、プリント配線板１及びプリント回路板２の厚み方向（Ｚ方向）において、内部絶縁層４を中心として対称となるため、プリント配線板１及びプリント回路板２の反りの発生を抑制し、実装信頼性の更なる向上を図ることができる。   Here, the glass transition temperature of the first outermost insulating layer 51 and the glass transition temperature of the second outermost insulating layer 52 may be different, but are preferably the same. When the glass transition temperature of the first outermost insulating layer 51 and the glass transition temperature of the second outermost insulating layer 52 are the same, internal insulation is achieved in the thickness direction (Z direction) of the printed wiring board 1 and the printed circuit board 2. Since it becomes symmetrical about the layer 4, the occurrence of warpage of the printed wiring board 1 and the printed circuit board 2 can be suppressed, and the mounting reliability can be further improved.

次に、内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２のガラス転移温度の測定方法について説明する。第１の方法は、製造後のプリント配線板１又はプリント回路板２を、内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２の３つに分解して、それぞれのガラス転移温度を測定する方法である。第２の方法は、製造予定のプリント配線板１及びプリント回路板２における内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２を個別に製造して、それぞれのガラス転移温度を測定する方法である。いずれの方法においても、ＪＩＳ Ｋ ７１９７に準拠してガラス転移温度を測定することができる。   Next, a method for measuring the glass transition temperature of the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 will be described. The first method is to disassemble the printed wiring board 1 or the printed circuit board 2 after manufacturing into three parts, an internal insulating layer 4, a first outermost insulating layer 51, and a second outermost insulating layer 52, and This is a method for measuring the glass transition temperature. In the second method, the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 in the printed wiring board 1 and the printed circuit board 2 to be manufactured are individually manufactured, and the respective glass transitions are manufactured. This is a method for measuring temperature. In any method, the glass transition temperature can be measured according to JIS K 7197.

（熱膨張率）
第１最外絶縁層５１及び第２最外絶縁層５２の厚み方向に垂直な任意の方向における熱膨張率が、内部絶縁層４の厚み方向に垂直な任意の方向における熱膨張率の±３０％であることが好ましい。以下では、特に断らない限り、厚み方向に垂直な任意の方向における熱膨張率を単に熱膨張率という。すなわち、（内部絶縁層４の熱膨張率×０．７）≦（第１最外絶縁層５１及び第２最外絶縁層５２の熱膨張率）≦（内部絶縁層４の熱膨張率×１．３）である。厚み方向に垂直な任意の方向における熱膨張率は、要するに図５Ｂに示すＸＹ平面における任意の方向の熱膨張率を意味する。上記の不等式の条件が満たされていると、電子部品１０を実装する際のリフローはんだ付けによる加熱で、バイメタルのように反りが発生することを抑制することができる。わずかに反りが発生してもこの反りに起因する応力が小さければ、この応力を第１最外絶縁層５１及び第２最外絶縁層５２による応力吸収効果で吸収することができ、電子部品１０とプリント配線板１とを電気的及び物理的に接続するはんだ接続部１２にはんだクラックが発生することを抑制することができる。好ましくは、内部絶縁層４の熱膨張率は５〜１５ｐｐｍ／℃である。 (Coefficient of thermal expansion)
The thermal expansion coefficient in an arbitrary direction perpendicular to the thickness direction of the first outermost insulating layer 51 and the second outermost insulating layer 52 is ± 30 of the thermal expansion coefficient in an arbitrary direction perpendicular to the thickness direction of the internal insulating layer 4. % Is preferred. Hereinafter, unless otherwise specified, the coefficient of thermal expansion in an arbitrary direction perpendicular to the thickness direction is simply referred to as the coefficient of thermal expansion. That is, (thermal expansion coefficient of the inner insulating layer 4 × 0.7) ≦ (thermal expansion coefficient of the first outermost insulating layer 51 and the second outermost insulating layer 52) ≦ (thermal expansion coefficient of the inner insulating layer 4 × 1). .3). The coefficient of thermal expansion in any direction perpendicular to the thickness direction means the coefficient of thermal expansion in any direction on the XY plane shown in FIG. 5B. When the above inequality condition is satisfied, it is possible to suppress the occurrence of warping like a bimetal due to heating by reflow soldering when the electronic component 10 is mounted. Even if slight warping occurs, if the stress due to this warping is small, this stress can be absorbed by the stress absorption effect by the first outermost insulating layer 51 and the second outermost insulating layer 52, and the electronic component 10. It is possible to suppress the occurrence of solder cracks in the solder connection portion 12 that electrically and physically connects the printed wiring board 1 and the printed wiring board 1. Preferably, the thermal expansion coefficient of the inner insulating layer 4 is 5 to 15 ppm / ° C.

ここで、第１最外絶縁層５１の熱膨張率と第２最外絶縁層５２の熱膨張率とは異なっていてもよいが、同じであることが好ましい。第１最外絶縁層５１の熱膨張率と第２最外絶縁層５２の熱膨張率とが同じであると、プリント配線板１及びプリント回路板２の厚み方向（Ｚ方向）において、内部絶縁層４を中心として対称となるため、プリント配線板１及びプリント回路板２の反りの発生を抑制し、実装信頼性の更なる向上を図ることができる。   Here, the coefficient of thermal expansion of the first outermost insulating layer 51 and the coefficient of thermal expansion of the second outermost insulating layer 52 may be different, but are preferably the same. When the thermal expansion coefficient of the first outermost insulating layer 51 and the thermal expansion coefficient of the second outermost insulating layer 52 are the same, internal insulation is achieved in the thickness direction (Z direction) of the printed wiring board 1 and the printed circuit board 2. Since it becomes symmetrical about the layer 4, the occurrence of warpage of the printed wiring board 1 and the printed circuit board 2 can be suppressed, and the mounting reliability can be further improved.

次に、内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２の熱膨張率の測定方法について説明する。第１の方法は、製造後のプリント配線板１又はプリント回路板２を、内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２の３つに分解して、それぞれの熱膨張率を測定する方法である。第２の方法は、製造予定のプリント配線板１及びプリント回路板２における内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２を個別に製造して、それぞれの熱膨張率を測定する方法である。いずれの方法においても、ＪＩＳ Ｋ ７１９７に準拠して熱膨張率を測定することができる。   Next, a method for measuring the coefficient of thermal expansion of the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 will be described. The first method is to disassemble the printed wiring board 1 or the printed circuit board 2 after manufacturing into three parts, an internal insulating layer 4, a first outermost insulating layer 51, and a second outermost insulating layer 52, and This is a method for measuring the coefficient of thermal expansion. In the second method, the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 in the printed wiring board 1 and the printed circuit board 2 to be manufactured are individually manufactured, and each thermal expansion is performed. It is a method of measuring the rate. In any method, the coefficient of thermal expansion can be measured according to JIS K 7197.

［プリント配線板の製造方法］
本実施形態のプリント配線板１の製造方法の一例について説明する。 [Method of manufacturing printed wiring board]
An example of the manufacturing method of the printed wiring board 1 of this embodiment is demonstrated.

まず図３Ａ及び図３Ｂを示しながら、単一の内層材４１０で内部絶縁層４を形成してプリント配線板１を製造する方法について説明する。図３Ａに示すように、内層材４１０の第１面４１及び第２面４２にプリプレグ６を重ね、さらにその外側に金属箔９０を重ねる。この状態で加熱加圧すると、図３Ｂに示すような金属張積層板１００が得られる。加熱加圧により、プリプレグ６の半硬化状態の熱硬化性樹脂組成物は一度溶融した後、完全硬化し、Ｃステージの状態となる。内層材４１０は内部絶縁層４となり、内部絶縁層４の第１面４１に接触していたプリプレグ６は第１最外絶縁層５１となり、内部絶縁層４の第２面４２に接触していたプリプレグ６は第２最外絶縁層５２となる。その後、第１最外絶縁層５１及び第２最外絶縁層５２に接着されている金属箔９０の不要部分をエッチングなどにより除去して最外導体配線９を形成すると、図１に示すようなプリント配線板１が得られる。   First, a method of manufacturing the printed wiring board 1 by forming the inner insulating layer 4 with a single inner layer material 410 will be described with reference to FIGS. 3A and 3B. As shown in FIG. 3A, the prepreg 6 is stacked on the first surface 41 and the second surface 42 of the inner layer material 410, and the metal foil 90 is further stacked on the outer side thereof. When heated and pressurized in this state, a metal-clad laminate 100 as shown in FIG. 3B is obtained. By heating and pressing, the semi-cured thermosetting resin composition of the prepreg 6 is once melted and then completely cured to be in a C stage state. The inner layer material 410 became the inner insulating layer 4, and the prepreg 6 that was in contact with the first surface 41 of the inner insulating layer 4 became the first outermost insulating layer 51 and was in contact with the second surface 42 of the inner insulating layer 4. The prepreg 6 becomes the second outermost insulating layer 52. Thereafter, when unnecessary portions of the metal foil 90 bonded to the first outermost insulating layer 51 and the second outermost insulating layer 52 are removed by etching or the like to form the outermost conductor wiring 9, as shown in FIG. A printed wiring board 1 is obtained.

次に図４Ａ及び図４Ｂを示しながら、複数の内層材４１０で内部絶縁層４を形成してプリント配線板１を製造する方法について説明する。図４Ａに示すように、接着シート４４０の第１面４０１に第１内層材４１１、プリプレグ６、金属箔９０をこの順に重ね、接着シート４４０の第２面４０２に第２内層材４１２、プリプレグ６、金属箔９０をこの順に重ねる。この状態で加熱加圧すると、図４Ｂに示すような金属張積層板１００が得られる。加熱加圧により、プリプレグ６の半硬化状態の熱硬化性樹脂組成物及び接着シート４４０は一度溶融した後、完全硬化し、Ｃステージの状態となる。接着シート４４０は接着層４００となり、第１内層材４１１及び第２内層材４１２と一体化して内部絶縁層４となり、第１内層材４１１に接触していたプリプレグ６は第１最外絶縁層５１となり、第２内層材４１２に接触していたプリプレグ６は第２最外絶縁層５２となる。その後、第１最外絶縁層５１及び第２最外絶縁層５２に接着されている金属箔９０の不要部分をエッチングなどにより除去して最外導体配線９を形成すると、図２に示すようなプリント配線板１が得られる。   Next, a method of manufacturing the printed wiring board 1 by forming the inner insulating layer 4 with a plurality of inner layer materials 410 will be described with reference to FIGS. 4A and 4B. 4A, the first inner layer material 411, the prepreg 6, and the metal foil 90 are stacked in this order on the first surface 401 of the adhesive sheet 440, and the second inner layer material 412 and the prepreg 6 are stacked on the second surface 402 of the adhesive sheet 440. The metal foil 90 is stacked in this order. When heated and pressurized in this state, a metal-clad laminate 100 as shown in FIG. 4B is obtained. By heat-pressing, the semi-cured thermosetting resin composition and the adhesive sheet 440 of the prepreg 6 are once melted and then completely cured to be in a C stage state. The adhesive sheet 440 becomes the adhesive layer 400, and is integrated with the first inner layer material 411 and the second inner layer material 412 to form the inner insulating layer 4. The prepreg 6 that is in contact with the first inner layer material 411 is the first outermost insulating layer 51. Thus, the prepreg 6 that has been in contact with the second inner layer material 412 becomes the second outermost insulating layer 52. Thereafter, when unnecessary portions of the metal foil 90 bonded to the first outermost insulating layer 51 and the second outermost insulating layer 52 are removed by etching or the like to form the outermost conductor wiring 9, as shown in FIG. A printed wiring board 1 is obtained.

プリント配線板１において導体層の数は特に限定されないが、上限は２０層程度である。導体層の数を増やす場合には、必要数に達するまで接着シート４４０及び内層材４１０を交互に重ねて内部絶縁層４を形成すればよい。   Although the number of conductor layers in the printed wiring board 1 is not particularly limited, the upper limit is about 20 layers. When the number of conductor layers is increased, the inner insulating layer 4 may be formed by alternately stacking the adhesive sheets 440 and the inner layer material 410 until the necessary number is reached.

［プリント回路板］
本実施形態のプリント回路板２は、図５Ａ及び図５Ｂ並びに図６に示すように、プリント配線板１と、最外導体配線９と、電子部品１０とを備えている。 [Printed circuit board]
The printed circuit board 2 of this embodiment includes a printed wiring board 1, an outermost conductor wiring 9, and an electronic component 10 as shown in FIGS.

（プリント配線板）
プリント配線板１は、例えば、上述の図１及び図２に示すものであるが、これらのものに限定されない。 (Printed wiring board)
The printed wiring board 1 is, for example, as shown in FIGS. 1 and 2 described above, but is not limited to these.

（最外導体配線）
最外導体配線９は、プリント配線板１の第１最外絶縁層５１及び第２最外絶縁層５２の少なくともいずれかの外部の表面に形成されている。この外部の表面が実装面１１となる。最外導体配線９は、プリント配線板１の外部において外層の導体層を形成する。外層の導体層の具体例として、部品実装用ランド、信号層、電源層、グラウンド層が挙げられる。 (Outermost conductor wiring)
The outermost conductor wiring 9 is formed on the outer surface of at least one of the first outermost insulating layer 51 and the second outermost insulating layer 52 of the printed wiring board 1. This external surface becomes the mounting surface 11. The outermost conductor wiring 9 forms an outer conductor layer outside the printed wiring board 1. Specific examples of the outer conductor layer include a component mounting land, a signal layer, a power supply layer, and a ground layer.

（電子部品）
電子部品１０は、例えば表面実装部品（ＳＭＤ：Surface Mount Device）であり、特に限定されない。電子部品１０のチップサイズの具体例として、３２１６（３．２ｍｍ×１．６ｍｍ）、２０１２（２．０ｍｍ×１．２５ｍｍ）、１６０８（１．６ｍｍ×０．８ｍｍ）が挙げられる。電子部品１０の熱膨張率は５〜９ｐｐｍ／℃であることが好ましい。図５Ａ及び図５Ｂ並びに図６に示すように、電子部品１０は、最外導体配線９に電気的に接続されて実装されている。具体的にはリフローはんだ付けにより、電子部品１０とプリント配線板１の最外導体配線９との間にはんだ接続部１２を形成して両者を電気的及び物理的に接続している。 (Electronic parts)
The electronic component 10 is, for example, a surface mount component (SMD: Surface Mount Device), and is not particularly limited. Specific examples of the chip size of the electronic component 10 include 3216 (3.2 mm × 1.6 mm), 2012 (2.0 mm × 1.25 mm), and 1608 (1.6 mm × 0.8 mm). The coefficient of thermal expansion of the electronic component 10 is preferably 5 to 9 ppm / ° C. As shown in FIGS. 5A and 5B and FIG. 6, the electronic component 10 is mounted by being electrically connected to the outermost conductor wiring 9. Specifically, a solder connection portion 12 is formed between the electronic component 10 and the outermost conductor wiring 9 of the printed wiring board 1 by reflow soldering, and both are electrically and physically connected.

上述のように、内部絶縁層４、第１最外絶縁層５１及び第２最外絶縁層５２の曲げ弾性率及びガラス転移温度（Ｔｇ）が規定されているため、本実施形態のプリント回路板２においては実装信頼性を向上させることができる。   As described above, since the flexural modulus and the glass transition temperature (Tg) of the inner insulating layer 4, the first outermost insulating layer 51, and the second outermost insulating layer 52 are defined, the printed circuit board of the present embodiment. In 2, the mounting reliability can be improved.

以下、本発明を実施例によって具体的に説明する。   Hereinafter, the present invention will be specifically described by way of examples.

［熱硬化性樹脂組成物］
熱硬化性樹脂組成物の構成成分として以下のものを用いた。 [Thermosetting resin composition]
The following were used as a structural component of a thermosetting resin composition.

（エポキシ樹脂）
・臭素化エポキシ樹脂（ダウケミカル社製「ＤＥＲ５９３」）
・クレゾールノボラック型エポキシ樹脂（ＤＩＣ株式会社製「Ｎ−６９０」）
・臭素化エポキシ樹脂（ＤＩＣ株式会社製「１５３」）
（硬化剤）
・ノボラック型フェノール樹脂（ＤＩＣ株式会社製「ＴＤ−２０９０」）
（硬化促進剤）
・２−エチル−４−メチルイミダゾール（四国化成工業株式会社製「２Ｅ４ＭＺ」）
（無機充填材）
・水酸化アルミニウム（住友化学株式会社製「ＣＬ３０３Ｍ」）
・球状シリカ（株式会社アドマテックス製「ＳＯ−２５Ｒ」）
（低弾性化剤）
・カルボキシル基含有エチレンアクリルゴム（デュポンエラストマー社製「Ｖａｍａｃ Ｇ」）
・カルボキシル基含有ニトリルゴム（ＪＳＲ株式会社製「ＸＥＲ−３２」）
・コアシェル型ゴム（アイカ工業株式会社製「ＡＣ−３８１６Ｎ」）
・アクリルゴムパウダー（積水化学工業株式会社製「ＳＲＫ２００」）
・シリコーンパウダー（東レ・ダウコーニング株式会社製「ＥＰ−２６０１」）
（溶剤）
・ＭＥＫ（メチルエチルケトン）
表１に示す配合組成で各構成成分を配合して熱硬化性樹脂組成物のワニス１〜５を製造した。 (Epoxy resin)
・ Brominated epoxy resin ("DER593" manufactured by Dow Chemical Company)
・ Cresol novolac type epoxy resin (“N-690” manufactured by DIC Corporation)
・ Brominated epoxy resin (“153” manufactured by DIC Corporation)
(Curing agent)
・ Novolak type phenolic resin (“TD-2090” manufactured by DIC Corporation)
(Curing accelerator)
2-ethyl-4-methylimidazole (“2E4MZ” manufactured by Shikoku Kasei Kogyo Co., Ltd.)
(Inorganic filler)
・ Aluminum hydroxide ("CL303M" manufactured by Sumitomo Chemical Co., Ltd.)
・ Spherical silica ("SO-25R" manufactured by Admatex Co., Ltd.)
(Low elasticity agent)
・ Carboxyl group-containing ethylene acrylic rubber (DuPont Elastomer "Vamac G")
・ Carboxyl group-containing nitrile rubber ("XER-32" manufactured by JSR Corporation)
・ Core shell type rubber (“AC-3816N” manufactured by Aika Industry Co., Ltd.)
・ Acrylic rubber powder ("SRK200" manufactured by Sekisui Chemical Co., Ltd.)
・ Silicone powder ("EP-2601" manufactured by Toray Dow Corning Co., Ltd.)
(solvent)
・ MEK (methyl ethyl ketone)
Each component was mix | blended with the compounding composition shown in Table 1, and the varnish 1-5 of the thermosetting resin composition was manufactured.

［プリプレグ］
上記のワニスを基材（日東紡績株式会社製「７６２８タイプクロス」）に含浸させた後に加熱して、厚み０．２ｍｍのプリプレグ１〜５を製造した。また既製のプリプレグとして、パナソニック株式会社製「Ｒ−１５５１」（「Ｒ−１５６６」の材料であるプリプレグ）及び「Ｒ−１６５０Ｄ」（「Ｒ−１７５５Ｄ」の材料であるプリプレグ）を準備した。 [Prepreg]
The varnish was impregnated in a base material (“7628 type cloth” manufactured by Nitto Boseki Co., Ltd.) and then heated to produce prepregs 1 to 5 having a thickness of 0.2 mm. As ready-made prepregs, “R-1551” (prepreg which is a material of “R-1566”) and “R-1650D” (prepreg which is a material of “R-1755D”) manufactured by Panasonic Corporation were prepared.

［内層材］
厚み０．６ｍｍの基板の第１面及び第２面に厚み３５μｍの銅箔で導体配線が形成された２種類の内層材を準備した。具体的には、これらの内層材は、パナソニック株式会社製「Ｒ−１５６６」及び「Ｒ−１７５５Ｄ」を加工して得た。 [Inner layer material]
Two types of inner layer materials were prepared in which conductor wiring was formed with a copper foil having a thickness of 35 μm on the first surface and the second surface of a substrate having a thickness of 0.6 mm. Specifically, these inner layer materials were obtained by processing “R-1566” and “R-1755D” manufactured by Panasonic Corporation.

［プリント配線板］
内層材の第１面及び第２面にプリプレグを重ね、さらにその外側に厚み１８μｍの銅箔を重ねて積層体とした。次に真空プレス機を用いて、真空下においてこの積層体を１８０℃で加熱しながら、３ＭＰａで９０分間加圧して、金属張積層板を得た。その後、第１最外絶縁層及び第２最外絶縁層に接着されている銅箔の不要部分をエッチングなどにより除去して最外導体配線を形成して、プリント配線板を得た。 [Printed wiring board]
A prepreg was stacked on the first surface and the second surface of the inner layer material, and a copper foil having a thickness of 18 μm was stacked on the outer side to form a laminate. Next, using a vacuum press, this laminate was heated at 180 ° C. under vacuum and pressurized at 3 MPa for 90 minutes to obtain a metal-clad laminate. Thereafter, unnecessary portions of the copper foil adhered to the first outermost insulating layer and the second outermost insulating layer were removed by etching or the like to form outermost conductor wiring, thereby obtaining a printed wiring board.

［プリント回路板］
プリント配線板にチップサイズが３２１６、２０１２、１６０８の電子部品を実装して、プリント回路板を得た。 [Printed circuit board]
Electronic components having chip sizes of 3216, 2012, and 1608 were mounted on the printed wiring board to obtain a printed circuit board.

［曲げ弾性率］
内部絶縁層、第１最外絶縁層及び第２最外絶縁層の曲げ弾性率を測定した。内部絶縁層の曲げ弾性率は、内層材の曲げ弾性率を測定して求めた。第１最外絶縁層及び第２最外絶縁層の曲げ弾性率は、プリプレグの硬化物の曲げ弾性率を測定して求めた。プリプレグの硬化物は、上記のプリント配線板を製造する際の加熱加圧の条件と同じ条件で、プリプレグを硬化させて得た。曲げ弾性率は、ＪＩＳ Ｋ ７１７１に準拠して測定した。各プリント配線板を製造する際には、１種類のプリプレグしか使用していないので、第１最外絶縁層及び第２最外絶縁層の曲げ弾性率は同じである。 [Bending elastic modulus]
The bending elastic moduli of the inner insulating layer, the first outermost insulating layer, and the second outermost insulating layer were measured. The bending elastic modulus of the inner insulating layer was obtained by measuring the bending elastic modulus of the inner layer material. The bending elastic moduli of the first outermost insulating layer and the second outermost insulating layer were obtained by measuring the bending elastic modulus of the cured prepreg. A cured product of the prepreg was obtained by curing the prepreg under the same conditions as the heating and pressurizing conditions when manufacturing the printed wiring board. The flexural modulus was measured according to JIS K 7171. When manufacturing each printed wiring board, since only one type of prepreg is used, the flexural modulus of elasticity of the first outermost insulating layer and the second outermost insulating layer is the same.

［ガラス転移温度］
内部絶縁層、第１最外絶縁層及び第２最外絶縁層のガラス転移温度を測定した。内部絶縁層のガラス転移温度は、内層材のガラス転移温度を測定して求めた。第１最外絶縁層及び第２最外絶縁層のガラス転移温度は、プリプレグの硬化物のガラス転移温度を測定して求めた。プリプレグの硬化物は、上記のプリント配線板を製造する際の加熱加圧の条件と同じ条件で、プリプレグを硬化させて得た。ガラス転移温度は、ＪＩＳ Ｋ ７１９７に準拠して測定した。各プリント配線板を製造する際には、１種類のプリプレグしか使用していないので、第１最外絶縁層及び第２最外絶縁層のガラス転移温度は同じである。 [Glass-transition temperature]
The glass transition temperatures of the internal insulating layer, the first outermost insulating layer, and the second outermost insulating layer were measured. The glass transition temperature of the inner insulating layer was determined by measuring the glass transition temperature of the inner layer material. The glass transition temperatures of the first outermost insulating layer and the second outermost insulating layer were determined by measuring the glass transition temperature of the cured prepreg. A cured product of the prepreg was obtained by curing the prepreg under the same conditions as the heating and pressurizing conditions when manufacturing the printed wiring board. The glass transition temperature was measured according to JIS K 7197. When manufacturing each printed wiring board, since only one type of prepreg is used, the glass transition temperatures of the first outermost insulating layer and the second outermost insulating layer are the same.

［熱膨張率］
内部絶縁層、第１最外絶縁層及び第２最外絶縁層の熱膨張率を測定した。内部絶縁層の熱膨張率は、内層材の熱膨張率を測定して求めた。第１最外絶縁層及び第２最外絶縁層の熱膨張率は、プリプレグの硬化物の熱膨張率を測定して求めた。プリプレグの硬化物は、上記のプリント配線板を製造する際の加熱加圧の条件と同じ条件で、プリプレグを硬化させて得た。熱膨張率は、縦型の熱機械分析装置（ＴＭＡ）を用いて、ＪＩＳ Ｋ ７１９７に準拠して測定した。各プリント配線板を製造する際には、１種類のプリプレグしか使用していないので、第１最外絶縁層及び第２最外絶縁層の熱膨張率は同じである。 [Thermal expansion coefficient]
The thermal expansion coefficients of the inner insulating layer, the first outermost insulating layer, and the second outermost insulating layer were measured. The coefficient of thermal expansion of the inner insulating layer was determined by measuring the coefficient of thermal expansion of the inner layer material. The coefficients of thermal expansion of the first outermost insulating layer and the second outermost insulating layer were determined by measuring the coefficient of thermal expansion of the cured prepreg. A cured product of the prepreg was obtained by curing the prepreg under the same conditions as the heating and pressurizing conditions when manufacturing the printed wiring board. The coefficient of thermal expansion was measured using a vertical thermomechanical analyzer (TMA) in accordance with JIS K 7197. Since only one type of prepreg is used when manufacturing each printed wiring board, the first outermost insulating layer and the second outermost insulating layer have the same coefficient of thermal expansion.

［リフローサイクル試験］
プリント回路板について、リフローサイクル試験を行った。具体的には、プリント回路板をリフロー炉により２６０℃ピークの鉛フリーはんだ用プロファイルで加熱する操作を１サイクルとし、これを１０サイクル繰り返した。その後、プリント回路板の基板の状態を観察した。その結果を下記の判定基準で評価した。 [Reflow cycle test]
A reflow cycle test was performed on the printed circuit board. Specifically, the operation of heating the printed circuit board with a lead-free solder profile having a peak at 260 ° C. in a reflow oven was defined as one cycle, and this was repeated 10 cycles. Thereafter, the state of the printed circuit board was observed. The results were evaluated according to the following criteria.

「○」：外観に異常がないもの
「×」：層間剥離に伴う膨れが発生したもの
［温度サイクル試験］
プリント回路板について、温度サイクル試験を行った。具体的には、−４０℃で３０分間、１２５℃で３０分間の負荷を与える操作を１サイクルとし、これを３０００サイクル繰り返した。その後、プリント回路板のはんだ接続部の断面の状態を観察した。その結果を下記の判定基準で評価した。 “○”: No abnormal appearance “×”: Swelling caused by delamination [Temperature cycle test]
A temperature cycle test was performed on the printed circuit board. Specifically, the operation of applying a load of -40 ° C for 30 minutes and 125 ° C for 30 minutes was defined as one cycle, and this was repeated 3000 cycles. Then, the state of the cross section of the solder connection part of a printed circuit board was observed. The results were evaluated according to the following criteria.

「○」：クラックの長さがはんだ接続部全体の長さの８０％以下であるもの
「△」：クラックの長さがはんだ接続部全体の長さの８０％超９９％以下であるもの
「×」：クラックの長さがはんだ接続部全体の長さの９９％超であるもの “◯”: The crack length is 80% or less of the entire solder connection part “△”: The crack length is more than 80% of the total solder connection part and 99% or less “ × ”: The crack length is more than 99% of the entire length of the solder joint.

Figure 2018041800
Figure 2018041800

Figure 2018041800
Figure 2018041800

表２から明らかなように、各実施例では実装信頼性が向上しているのに対して、各比較例では実装信頼性が低下していることが確認された。   As is clear from Table 2, it was confirmed that the mounting reliability improved in each example, whereas the mounting reliability decreased in each comparative example.

１ プリント配線板
２ プリント回路板
３ 導体配線
４ 内部絶縁層
６ プリプレグ
７ 熱硬化性樹脂組成物
８ 基材
９ 最外導体配線
１０ 電子部品
４１ 第１面
４２ 第２面
５１ 第１最外絶縁層
５２ 第２最外絶縁層
４００ 接着層
４０１ 第１面
４０２ 第２面
４１１ 第１内層材
４１２ 第２内層材
４２１ 第１基板
４２２ 第２基板
４３１ 第１導体配線
４３２ 第２導体配線 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Printed circuit board 3 Conductor wiring 4 Inner insulating layer 6 Prepreg 7 Thermosetting resin composition 8 Base material 9 Outermost conductor wiring 10 Electronic component 41 1st surface 42 2nd surface 51 1st outermost insulating layer 52 Second outermost insulating layer 400 Adhesive layer 401 First surface 402 Second surface 411 First inner layer material 412 Second inner layer material 421 First substrate 422 Second substrate 431 First conductor wiring 432 Second conductor wiring

Claims (11)

導体配線を有する内部絶縁層と、
前記内部絶縁層の第１面に形成された第１最外絶縁層と、
前記内部絶縁層の第２面に形成された第２最外絶縁層と
を備え、
前記第１最外絶縁層及び前記第２最外絶縁層の曲げ弾性率が、前記内部絶縁層の曲げ弾性率の１／４以上３／４以下であり、
前記第１最外絶縁層及び前記第２最外絶縁層のガラス転移温度が、前記内部絶縁層のガラス転移温度の±２０℃であることを特徴とする
プリント配線板。 An internal insulating layer having conductor wiring;
A first outermost insulating layer formed on the first surface of the inner insulating layer;
A second outermost insulating layer formed on the second surface of the inner insulating layer,
The bending elastic modulus of the first outermost insulating layer and the second outermost insulating layer is not less than 1/4 and not more than 3/4 of the bending elastic modulus of the internal insulating layer,
The printed wiring board, wherein glass transition temperatures of the first outermost insulating layer and the second outermost insulating layer are ± 20 ° C. of a glass transition temperature of the inner insulating layer. 前記第１最外絶縁層及び前記第２最外絶縁層の厚み方向に垂直な任意の方向における熱膨張率が、前記内部絶縁層の厚み方向に垂直な任意の方向における熱膨張率の±３０％であることを特徴とする
請求項１に記載のプリント配線板。 The coefficient of thermal expansion in an arbitrary direction perpendicular to the thickness direction of the first outermost insulating layer and the second outermost insulating layer is ± 30 of the coefficient of thermal expansion in an arbitrary direction perpendicular to the thickness direction of the inner insulating layer. It is%, The printed wiring board of Claim 1 characterized by the above-mentioned. 前記第１最外絶縁層及び前記第２最外絶縁層が、プリプレグの硬化物で形成されていることを特徴とする
請求項１又は２に記載のプリント配線板。 The printed wiring board according to claim 1, wherein the first outermost insulating layer and the second outermost insulating layer are formed of a cured prepreg. 前記プリプレグが、
熱硬化性樹脂組成物と、
前記熱硬化性樹脂組成物が含浸された基材と
を備え、
前記熱硬化性樹脂組成物が半硬化状態であることを特徴とする
請求項３に記載のプリント配線板。 The prepreg is
A thermosetting resin composition;
A substrate impregnated with the thermosetting resin composition,
The printed wiring board according to claim 3, wherein the thermosetting resin composition is in a semi-cured state. 前記熱硬化性樹脂組成物が、
エポキシ樹脂と、
硬化剤と、
硬化促進剤と、
無機充填材と、
低弾性化剤と
を含有し、
前記エポキシ樹脂を１００質量部とした場合に、
前記無機充填材が５０質量部以上２００質量部以下であり、
前記低弾性化剤が５質量部以上７０質量部以下であることを特徴とする
請求項４に記載のプリント配線板。 The thermosetting resin composition is
Epoxy resin,
A curing agent;
A curing accelerator;
An inorganic filler;
Containing a low elasticity agent and
When the epoxy resin is 100 parts by mass,
The inorganic filler is 50 parts by mass or more and 200 parts by mass or less,
The printed wiring board according to claim 4, wherein the low elasticity agent is 5 parts by mass or more and 70 parts by mass or less. 前記内部絶縁層が、
接着層と、
前記接着層の第１面に形成された第１内層材と、
前記接着層の第２面に形成された第２内層材と
を備え、
前記接着層が絶縁性を有し、
前記第１内層材が、
第１基板と、
前記第１基板の表面に形成された第１導体配線と
を有し、
前記第２内層材が、
第２基板と、
前記第２基板の表面に形成された第２導体配線と
を有することを特徴とする
請求項１乃至５のいずれか一項に記載のプリント配線板。 The inner insulating layer is
An adhesive layer;
A first inner layer material formed on the first surface of the adhesive layer;
A second inner layer material formed on the second surface of the adhesive layer,
The adhesive layer has an insulating property;
The first inner layer material is
A first substrate;
A first conductor wiring formed on the surface of the first substrate;
The second inner layer material is
A second substrate;
The printed wiring board according to claim 1, further comprising: a second conductor wiring formed on a surface of the second substrate. 請求項１乃至６のいずれか一項に記載のプリント配線板と、
前記第１最外絶縁層及び前記第２最外絶縁層の少なくともいずれかの外部の表面に形成された最外導体配線と、
前記最外導体配線に電気的に接続されて実装された電子部品と
を備えることを特徴とする
プリント回路板。 The printed wiring board according to any one of claims 1 to 6,
An outermost conductor wiring formed on an outer surface of at least one of the first outermost insulating layer and the second outermost insulating layer;
And an electronic component electrically connected to and mounted on the outermost conductor wiring. 導体配線を有する内部絶縁層と、
前記内部絶縁層の第１面に形成された第１最外絶縁層と、
前記内部絶縁層の第２面に形成された第２最外絶縁層と
を備えたプリント配線板の材料として用いられるプリプレグであって、
前記プリプレグの硬化物が、前記第１最外絶縁層及び前記第２最外絶縁層であり、
前記第１最外絶縁層及び前記第２最外絶縁層の曲げ弾性率が、前記内部絶縁層の曲げ弾性率の１／４以上３／４以下であり、
前記第１最外絶縁層及び前記第２最外絶縁層のガラス転移温度が、前記内部絶縁層のガラス転移温度の±２０℃であることを特徴とする
プリプレグ。 An internal insulating layer having conductor wiring;
A first outermost insulating layer formed on the first surface of the inner insulating layer;
A prepreg used as a material for a printed wiring board comprising a second outermost insulating layer formed on the second surface of the inner insulating layer,
The cured product of the prepreg is the first outermost insulating layer and the second outermost insulating layer,
The bending elastic modulus of the first outermost insulating layer and the second outermost insulating layer is not less than 1/4 and not more than 3/4 of the bending elastic modulus of the internal insulating layer,
The glass transition temperature of the first outermost insulating layer and the second outermost insulating layer is ± 20 ° C. of the glass transition temperature of the inner insulating layer. 前記第１最外絶縁層及び前記第２最外絶縁層の厚み方向に垂直な任意の方向における熱膨張率が、前記内部絶縁層の厚み方向に垂直な任意の方向における熱膨張率の±３０％であることを特徴とする
請求項８に記載のプリプレグ。 The coefficient of thermal expansion in an arbitrary direction perpendicular to the thickness direction of the first outermost insulating layer and the second outermost insulating layer is ± 30 of the coefficient of thermal expansion in an arbitrary direction perpendicular to the thickness direction of the inner insulating layer. The prepreg according to claim 8, wherein the prepreg is%. 前記プリプレグが、
熱硬化性樹脂組成物と、
前記熱硬化性樹脂組成物が含浸された基材と
を備え、
前記熱硬化性樹脂組成物が半硬化状態であることを特徴とする
請求項８又は９に記載のプリプレグ。 The prepreg is
A thermosetting resin composition;
A substrate impregnated with the thermosetting resin composition,
The prepreg according to claim 8 or 9, wherein the thermosetting resin composition is in a semi-cured state. 前記熱硬化性樹脂組成物が、
エポキシ樹脂と、
硬化剤と、
硬化促進剤と、
無機充填材と、
低弾性化剤と
を含有し、
前記エポキシ樹脂を１００質量部とした場合に、
前記無機充填材が５０質量部以上２００質量部以下であり、
前記低弾性化剤が５質量部以上７０質量部以下であることを特徴とする
請求項８乃至１０のいずれか一項に記載のプリプレグ。 The thermosetting resin composition is
Epoxy resin,
A curing agent;
A curing accelerator;
An inorganic filler;
Containing a low elasticity agent and
When the epoxy resin is 100 parts by mass,
The inorganic filler is 50 parts by mass or more and 200 parts by mass or less,
The prepreg according to any one of claims 8 to 10, wherein the low elasticity agent is 5 parts by mass or more and 70 parts by mass or less.
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