JP2018032706A - Led module manufacturing method and led module - Google Patents

Led module manufacturing method and led module Download PDF

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JP2018032706A
JP2018032706A JP2016163486A JP2016163486A JP2018032706A JP 2018032706 A JP2018032706 A JP 2018032706A JP 2016163486 A JP2016163486 A JP 2016163486A JP 2016163486 A JP2016163486 A JP 2016163486A JP 2018032706 A JP2018032706 A JP 2018032706A
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connection terminal
substrate
led module
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JP6941923B2 (en
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智紀 三次
Tomonori Mitsuji
智紀 三次
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Nichia Chemical Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide an LED module manufacturing method which enables easy formation of various light emission forms.SOLUTION: An LED module manufacturing method comprises the steps of: preparing a plurality of LED devices which are substantially identical to one another in the length of substrates in a first direction, and different in the length of encapsulation members in the first direction, and which can be classified into a plurality of groups; and selecting one or more LED devices from each of two or more groups of the plurality of groups so that first connection terminals and second connection terminals are successively arrayed in respective lines in a second direction substantially perpendicular to the first direction in top view, and the selected one or more LED devices in combination allow the encapsulation member concerned to form a predetermined shape, and disposing the selected LED devices.SELECTED DRAWING: Figure 2B

Description

本開示はＬＥＤモジュールの製造方法及びＬＥＤモジュールに関する。   The present disclosure relates to an LED module manufacturing method and an LED module.

基板上に、複数の発光ダイオード（ＬＥＤ）素子が一列に配列されたＬＥＤ素子列が、複数行並んでいるＬＥＤモジュールが知られている（例えば、特許文献１）。このＬＥＤモジュールでは、ＬＥＤ素子が一列ごとに封止部材で封止されている。   There is known an LED module in which a plurality of LED element arrays in which a plurality of light emitting diode (LED) elements are arranged in a line are arranged on a substrate (for example, Patent Document 1). In this LED module, the LED elements are sealed with a sealing member for each row.

特許第５２９１２６８号公報Japanese Patent No. 5291268

しかしながら、特許文献１に係るＬＥＤモジュールでは、１つの基板上にすべてのＬＥＤ素子が直接配置されている。このため、ＬＥＤモジュールの発光形状を変えたい場合、発光形状に合わせて、ＬＥＤ素子を配置する位置及び／又は封止部材の形状を変える必要がある。また、それに合わせて基板上の配線パターンの変更も必要となる場合がある。このため、このようなＬＥＤモジュールは、様々な発光形状を作製したい場合には不向きである。   However, in the LED module according to Patent Document 1, all the LED elements are directly arranged on one substrate. For this reason, when it is desired to change the light emission shape of the LED module, it is necessary to change the position of the LED element and / or the shape of the sealing member in accordance with the light emission shape. In addition, the wiring pattern on the board may need to be changed accordingly. For this reason, such an LED module is not suitable for producing various light emitting shapes.

本開示は、以下の発明を含む。上面視において第１方向に長い基板と、前記基板の上面における前記第１方向の両端にそれぞれ配置されるアノード側の第１接続端子及びカソード側の第２接続端子と、前記基板の上面における前記第１接続端子と前記第２接続端子との間に配置される１以上のＬＥＤ素子と、前記ＬＥＤ素子を覆う封止部材と、を備え、前記基板の前記第１方向の長さが略同一である複数のＬＥＤ装置であって、前記封止部材の前記第１方向の長さが異なる複数のグループに分類可能な複数のＬＥＤ装置を準備する工程と、前記複数のグループのうち２以上のグループからそれぞれ１以上の前記ＬＥＤ装置を選択し、上面視において、前記第１方向に対して略垂直な第２方向に前記第１接続端子及び前記第２接続端子がそれぞれ直線状に連なるように、且つ、前記封止部材が所定の形状を成す組み合わせとなるように、前記選択したＬＥＤ装置を配置する工程と、を有することを特徴とするＬＥＤモジュールの製造方法。   The present disclosure includes the following inventions. A substrate that is long in the first direction in a top view, a first connection terminal on the anode side and a second connection terminal on the cathode side that are respectively disposed at both ends in the first direction on the upper surface of the substrate, and the second connection terminal on the cathode side. One or more LED elements disposed between the first connection terminal and the second connection terminal, and a sealing member that covers the LED element, and the length of the substrate in the first direction is substantially the same. Preparing a plurality of LED devices that can be classified into a plurality of groups having different lengths in the first direction of the sealing member, and two or more of the plurality of groups. One or more LED devices are selected from each group, and the first connection terminal and the second connection terminal are linearly connected in a second direction substantially perpendicular to the first direction in a top view. ,and The way the sealing member is combined to form a predetermined shape, manufacturing method of the LED module and having a placing said selected LED device.

上面を有し、上面視において第１方向に長い基板と、前記基板の上面における前記第１方向の両端にそれぞれ配置されるアノード側の第１接続端子及びカソード側の第２接続端子と、前記基板の上面における前記第１接続端子と前記第２接続端子との間に配置される１以上のＬＥＤ素子と、前記基板の上面に設けられ、前記ＬＥＤ素子を覆う封止部材と、を有するＬＥＤ装置を複数備えるＬＥＤモジュールであって、前記複数のＬＥＤ装置は、前記基板の前記第１方向の長さが略同一である一方、前記封止部材の前記第１方向の長さが２以上のＬＥＤ装置で異なっており、上面視において、前記第１方向に対して略垂直な第２方向に前記第１接続端子及び前記第２接続端子がそれぞれ直線状に連なるように、且つ、前記封止部材が所定の形状を成すように、配置されることを特徴とするＬＥＤモジュール。   A substrate that has an upper surface and is long in the first direction in a top view; a first connection terminal on the anode side and a second connection terminal on the cathode side that are respectively disposed at both ends of the first direction on the upper surface of the substrate; LED having one or more LED elements disposed between the first connection terminal and the second connection terminal on the upper surface of the substrate, and a sealing member provided on the upper surface of the substrate and covering the LED element An LED module including a plurality of devices, wherein the plurality of LED devices have substantially the same length in the first direction of the substrate, and the length of the sealing member in the first direction is 2 or more. The LED device is different from each other in the top view so that the first connection terminal and the second connection terminal are linearly connected to each other in a second direction substantially perpendicular to the first direction, and the sealing is performed. The member has a predetermined shape As form, LED module, characterized in that it is arranged.

このような製造方法によれば、様々な発光形状をもつＬＥＤモジュールを容易に製造することができる。また、所望の発光形状をもつＬＥＤモジュールとすることができる。   According to such a manufacturing method, LED modules having various light emission shapes can be easily manufactured. Moreover, it can be set as the LED module which has a desired light emission shape.

実施形態１に係るＬＥＤモジュールの製造方法を説明するための模式平面図である。FIG. 5 is a schematic plan view for explaining the method for manufacturing the LED module according to the first embodiment. 実施形態１に係るＬＥＤモジュールの製造方法を説明するための模式平面図である。FIG. 5 is a schematic plan view for explaining the method for manufacturing the LED module according to the first embodiment. 実施形態１に係るＬＥＤモジュールを示す模式平面図である。1 is a schematic plan view showing an LED module according to Embodiment 1. FIG. 図２Ｂ中のＡ―Ａ’線における模式断面図である。It is a schematic cross section in the A-A 'line in FIG. 2B. 実施形態１に係るホルダを示す模式平面図である。4 is a schematic plan view showing a holder according to Embodiment 1. FIG. 図４中のＡ―Ａ’線における模式断面図である。FIG. 5 is a schematic cross-sectional view taken along line A-A ′ in FIG. 4. 実施形態２に係るＬＥＤモジュールを示す模式平面図である。6 is a schematic plan view showing an LED module according to Embodiment 2. FIG.

以下、本発明の実施形態について図面を参照しながら説明する。ただし、以下に示す実施形態は、本発明の技術思想を具体化するための構成を例示するものであって、本発明を特定するものではない。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the embodiment described below exemplifies a configuration for embodying the technical idea of the present invention, and does not specify the present invention. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

［実施形態１］
実施形態１に係るＬＥＤモジュール１００の製造方法は、以下の工程を含む。まず、複数のＬＥＤ装置１０を準備する。複数のＬＥＤ装置１０は、図１〜図３に示すように、それぞれ、上面視において第１方向Ｘに長い基板１７を有し、基板１７の上面の第１方向Ｘの両端にそれぞれ、アノード側の第１接続端子１３ａ及びカソード側の第２接続端子１３ｂが配置されている。そして、第１接続端子１３ａと第２接続端子１３ｂの間には、１以上のＬＥＤ素子１１が配置され、ＬＥＤ素子１１は封止部材１２により覆われている。さらに、複数のＬＥＤ装置１０の基板１７の第１方向Ｘの長さは略同一である。図１に示すように、複数のＬＥＤ装置１０は、封止部材１２の第１方向Ｘの長さごとに複数のグループに分類できる。 [Embodiment 1]
The method for manufacturing the LED module 100 according to Embodiment 1 includes the following steps. First, a plurality of LED devices 10 are prepared. As shown in FIGS. 1 to 3, each of the plurality of LED devices 10 includes a substrate 17 that is long in the first direction X when viewed from above, and an anode side at each end of the upper surface of the substrate 17 in the first direction X. The first connection terminal 13a and the second connection terminal 13b on the cathode side are arranged. One or more LED elements 11 are arranged between the first connection terminal 13 a and the second connection terminal 13 b, and the LED elements 11 are covered with the sealing member 12. Further, the lengths in the first direction X of the substrates 17 of the plurality of LED devices 10 are substantially the same. As shown in FIG. 1, the plurality of LED devices 10 can be classified into a plurality of groups for each length of the sealing member 12 in the first direction X.

その後、図２Ａに示すように、複数のグループのうち、２以上のグループからそれぞれ１以上のＬＥＤ装置１０を選択し、図２Ｂに示すように、上面視において、第１方向Ｘに対して略垂直な第２方向Ｙに第１接続端子１３ａ及び第２接続端子１３ｂがそれぞれ直線状に連なるように配置する。このとき、封止部材１２が所定の形状を成す組み合わせとなるように、選択したＬＥＤ装置１０を配置することで、ＬＥＤモジュール１００を作製することができる。   Thereafter, as shown in FIG. 2A, one or more LED devices 10 are selected from two or more groups among a plurality of groups, respectively, and as shown in FIG. The first connection terminal 13a and the second connection terminal 13b are arranged so as to be linearly connected in the vertical second direction Y, respectively. At this time, the LED module 100 can be manufactured by arranging the selected LED devices 10 so that the sealing member 12 has a predetermined shape.

実施形態１に係るＬＥＤモジュール１００の製造方法では、図２Ａに示すように、封止部材１２の第１方向Ｘの長さが異なる４つのグループからそれぞれ２つのＬＥＤ装置１０が選択されている。そして、図２Ｂに示すように、上面視において、ＬＥＤモジュール１００の中央から第２方向Ｙの両端に向かって封止部材１２の第１方向Ｘの長さが短くなるように、ＬＥＤ装置１０が配置されている。つまり、ＬＥＤモジュール１００の中央に封止部材１２の第１方向Ｘの長さが最も長いＬＥＤ装置１０が２つ配置され、封止部材１２の第１方向Ｘの長さが次に長いＬＥＤ装置１０が、これら２つのＬＥＤ装置１０を挟むように２つ配置され、封止部材１２の第１方向Ｘの長さが次に長いＬＥＤ装置１０が、これら２つのＬＥＤ装置１０をさらに挟むように２つ配置され、封止部材１２の第１方向Ｘの長さが最も短いＬＥＤ装置１０が、ＬＥＤモジュール１００の第２方向Ｙの両端に２つ配置されている。   In the method for manufacturing the LED module 100 according to Embodiment 1, as shown in FIG. 2A, two LED devices 10 are selected from four groups having different lengths in the first direction X of the sealing member 12. Then, as shown in FIG. 2B, the LED device 10 is configured so that the length in the first direction X of the sealing member 12 decreases from the center of the LED module 100 toward both ends in the second direction Y as viewed from above. Has been placed. That is, two LED devices 10 having the longest length in the first direction X of the sealing member 12 are arranged in the center of the LED module 100, and the LED device 10 having the next longest length in the first direction X of the sealing member 12 is disposed. Two LED devices 10 are arranged so as to sandwich the two LED devices 10, and the LED device 10 having the next longest length in the first direction X of the sealing member 12 further sandwiches the two LED devices 10. Two LED devices 10 that are arranged and have the shortest length in the first direction X of the sealing member 12 are arranged at both ends in the second direction Y of the LED module 100.

ＬＥＤモジュール１００の製造方法によれば、複数のグループに分類されたＬＥＤ装置１０を組み合わせることで、様々な発光形状を有するＬＥＤモジュール１００を容易に作製することができる。つまり、封止部材１２の長さが異なるＬＥＤ装置１０を選択して組み合わせるだけで、ＬＥＤモジュール１００を任意の発光形状とすることができる。この結果、ＬＥＤモジュール１００の発光形状ごとに、後述するＬＥＤ素子１１、封止部材１２又は配線パターン１４等の配置を変更する必要がなくなるため、様々な発光形状をもつＬＥＤモジュール１００を容易に製造することができる。   According to the manufacturing method of the LED module 100, the LED module 100 having various light emission shapes can be easily manufactured by combining the LED devices 10 classified into a plurality of groups. That is, the LED module 100 can be formed into an arbitrary light emitting shape simply by selecting and combining the LED devices 10 having different sealing member 12 lengths. As a result, it is not necessary to change the arrangement of the LED element 11, the sealing member 12, or the wiring pattern 14 to be described later for each light emission shape of the LED module 100, and thus the LED module 100 having various light emission shapes can be easily manufactured. can do.

ＬＥＤモジュール１００を構成するそれぞれのＬＥＤ装置１０の発光色は実質的に同じであってもよいが、図２Ｂに示すように、異なる発光色のＬＥＤ装置１０ａ、１０ｂを組み合わせれば調色が可能となる。つまり、ＬＥＤモジュール１００を点灯させる際、第１色ＬＥＤ装置１０ａ及び第２色ＬＥＤ装置１０ｂの発光強度をそれぞれ調整することで、第１色及び第２色を任意の割合で調色することができる。ＬＥＤモジュール１００では、４つのグループからそれぞれ２つのＬＥＤ装置１０を選択するとき、２つのＬＥＤ装置１０に、第１色を発光する第１色ＬＥＤ装置１０ａ及び第２色を発光する第２色ＬＥＤ装置１０ｂが含まれるように選択している。そして、これら第１色ＬＥＤ装置１０ａ及び第２色ＬＥＤ装置１０ｂを、第２方向Ｙにおいて交互に配置している。これにより、ＬＥＤモジュール１００における色の再現範囲を広くすることができる。ＬＥＤモジュール１００に第３色を発光する第３色ＬＥＤ装置を追加することで、更に色の再現範囲を広くすることができる。具体的には、例えば、第１色を赤、第２色を緑、第３色を青として、ＬＥＤモジュール１００をフルカラーとすることもできる。   The light emission colors of the LED devices 10 constituting the LED module 100 may be substantially the same, but as shown in FIG. 2B, color adjustment is possible by combining LED devices 10a and 10b having different light emission colors. It becomes. That is, when the LED module 100 is turned on, the first color and the second color can be adjusted at an arbitrary ratio by adjusting the emission intensity of the first color LED device 10a and the second color LED device 10b, respectively. it can. In the LED module 100, when two LED devices 10 are selected from the four groups, the first LED device 10a that emits the first color and the second color LED that emits the second color are emitted to the two LED devices 10. The device 10b is selected to be included. The first color LED device 10a and the second color LED device 10b are alternately arranged in the second direction Y. Thereby, the color reproduction range in the LED module 100 can be widened. By adding a third color LED device that emits the third color to the LED module 100, the color reproduction range can be further widened. Specifically, for example, the first color may be red, the second color may be green, and the third color may be blue, and the LED module 100 may be full color.

複数のＬＥＤ装置１０を配置する工程の後、図４及び図５に示すように、選択したＬＥＤ装置１０を、給電端子２３を備えるホルダ２０に取り付ける工程をさらに有してもよい。このとき、複数のＬＥＤ装置１０は、第１接続端子１３ａ及び第２接続端子１３ｂがホルダ２０の給電端子２３と接触するように取り付けられる。これにより、外部からの電力をＬＥＤ装置１０に給電することが可能になるとともに、複数のＬＥＤ装置１０が互いに離間しないように保持することができる。   After the step of arranging the plurality of LED devices 10, as shown in FIGS. 4 and 5, a step of attaching the selected LED device 10 to the holder 20 including the power supply terminal 23 may be further included. At this time, the plurality of LED devices 10 are attached such that the first connection terminal 13 a and the second connection terminal 13 b are in contact with the power supply terminal 23 of the holder 20. Thereby, it becomes possible to supply electric power from the outside to the LED device 10, and it is possible to hold the plurality of LED devices 10 so as not to be separated from each other.

複数のＬＥＤ装置１０を配置する工程において、複数のＬＥＤ装置１０を、上面視において、封止部材１２が略円形状を成す組み合わせとなるように配置することが好ましい。これにより、封止部材１２を、円形状に設計される事が多いレンズやリフレクタ等の光学系と組み合わせやすくすることができる。複数のＬＥＤ装置１０は、５個以上配置することが好ましい。これにより、封止部材１２で任意の発光形状を形成しやすくなる。複数のＬＥＤ装置１０の上限は、例えば３０個以下とする。   In the step of arranging the plurality of LED devices 10, it is preferable that the plurality of LED devices 10 be arranged such that the sealing member 12 is a substantially circular combination in a top view. Thereby, the sealing member 12 can be easily combined with an optical system such as a lens or a reflector that is often designed in a circular shape. It is preferable to arrange five or more LED devices 10. Thereby, it becomes easy to form arbitrary light emission shapes with the sealing member 12. The upper limit of the plurality of LED devices 10 is, for example, 30 or less.

複数のＬＥＤ装置１０において、基板１７の第２方向Ｙの長さは略同一である。また、封止部材１２の第２方向Ｙの長さが略同一であることが好ましい。これにより、同数のＬＥＤ装置１０を組み合わせて様々な発光形状を作製する場合、発光形状の設計がしやすい。   In the plurality of LED devices 10, the length of the substrate 17 in the second direction Y is substantially the same. Moreover, it is preferable that the length of the sealing member 12 in the second direction Y is substantially the same. Thereby, when producing various light emission shapes combining the same number of LED devices 10, it is easy to design the light emission shape.

＜ＬＥＤモジュール１００＞
実施形態１に係るＬＥＤモジュール１００は、図２Ｂ及び図３に示すように、複数のＬＥＤ装置１０を組み合わすことで形成されている。複数のＬＥＤ装置１０は、それぞれ、上面視において第１方向Ｘに長い基板１７を有し、基板１７の上面の第１方向Ｘの両端にそれぞれ、アノード側の第１接続端子１３ａ及びカソード側の第２接続端子１３ｂが配置されている。第１接続端子１３ａと第２接続端子１３ｂの間には、１以上のＬＥＤ素子１１が配置され、ＬＥＤ素子１１は封止部材１２により覆われている。複数のＬＥＤ装置１０は、基板１７の第１方向Ｘの長さが略同一である一方、封止部材１２の第１方向Ｘの長さが２以上のＬＥＤ装置１０で異なっている。このような複数のＬＥＤ装置１０が、上面視において、第１方向Ｘに対して略垂直な第２方向Ｙに第１接続端子１３ａ及び第２接続端子１３ｂがそれぞれ直線状に連なるように配置される。このとき、封止部材１２が所定の形状を成すように配置されることで、ＬＥＤモジュール１００が形成される。 <LED module 100>
The LED module 100 according to Embodiment 1 is formed by combining a plurality of LED devices 10 as shown in FIGS. 2B and 3. Each of the plurality of LED devices 10 includes a substrate 17 that is long in the first direction X in a top view, and the first connection terminal 13a on the anode side and the cathode side on both ends of the upper surface of the substrate 17 in the first direction X, respectively. The second connection terminal 13b is arranged. One or more LED elements 11 are arranged between the first connection terminal 13 a and the second connection terminal 13 b, and the LED elements 11 are covered with the sealing member 12. The plurality of LED devices 10 are different in LED devices 10 in which the length of the substrate 17 in the first direction X is substantially the same while the length of the sealing member 12 in the first direction X is two or more. Such a plurality of LED devices 10 are arranged such that the first connection terminal 13a and the second connection terminal 13b are linearly connected in a second direction Y substantially perpendicular to the first direction X in a top view. The At this time, the LED module 100 is formed by arranging the sealing member 12 to have a predetermined shape.

ＬＥＤモジュール１００は、複数のＬＥＤ装置１０を組み合わすことで形成されている。このため、所望の封止部材１２の長さをもつＬＥＤ装置１０を複数選択して、封止部材１２が所定の形状を成すように配置することで、ＬＥＤモジュール１００の発光形状を容易に変えることができる。   The LED module 100 is formed by combining a plurality of LED devices 10. For this reason, the light emission shape of the LED module 100 is easily changed by selecting a plurality of LED devices 10 having a desired length of the sealing member 12 and arranging the sealing members 12 so as to form a predetermined shape. be able to.

さらに、複数のＬＥＤ装置１０は、基板１７の第１方向Ｘの長さが略同一であるため、基板１７の第１方向Ｘの両端に配置された第１接続端子１３ａ及び第２接続端子１３ｂがそれぞれ直線状に連なるように配置することが容易である。第１接続端子１３ａ及び第２接続端子１３ｂがそれぞれ直線状に連なるように配置されることで、第１接続端子１３ａ及び第２接続端子１３ｂがそれぞれ直線状に連なるように配置されていない場合と比較して、図４及び図５に示すように、第１接続端子１３ａ及び第２接続端子１３ｂとホルダ２０の給電端子２３とを接触させるのが容易となる。この結果、ＬＥＤモジュール１００への通電が容易となる。   Further, since the plurality of LED devices 10 have substantially the same length in the first direction X of the substrate 17, the first connection terminal 13 a and the second connection terminal 13 b disposed at both ends of the substrate 17 in the first direction X. It is easy to arrange so that each is connected in a straight line. When the first connection terminal 13a and the second connection terminal 13b are arranged so as to be linearly connected, the first connection terminal 13a and the second connection terminal 13b are not arranged so as to be linearly connected. In comparison, as shown in FIGS. 4 and 5, it is easy to bring the first connection terminal 13 a and the second connection terminal 13 b into contact with the power supply terminal 23 of the holder 20. As a result, energization to the LED module 100 is facilitated.

図１に示すように、複数のＬＥＤ装置１０は、基板１７上の配線パターン１４が全て同一であることが好ましい。これにより、複数のＬＥＤ装置１０にＬＥＤ素子１１をフェイスアップ実装して配置する際の設計が容易となる。以下、この点について説明する。   As shown in FIG. 1, the plurality of LED devices 10 preferably have the same wiring pattern 14 on the substrate 17. Thereby, the design at the time of arranging the LED element 11 in face-up mounting on the plurality of LED devices 10 becomes easy. Hereinafter, this point will be described.

ＬＥＤ素子１１として、絶縁性の透光基板の上側に半導体構造が設けられ、半導体構造の上側に正電極及び負電極が設けられたものを用いることができる。この場合、ＬＥＤ素子１１を、配線パターン１４と重なるように、且つ、正電極及び負電極が上方に向くように基板に実装（フェイスアップ実装）しても、配線パターンと半導体構造の間には絶縁性の透光基板が存在するので、配線パターンと半導体構造が電気的に接続される恐れはない。そこで、例えば、図１等に示すように、複数のＬＥＤ１０の基板１７上の配線パターン１４を全て同一とすることで、ワイヤ１５の接続位置の設計が容易となる。より具体的に言うと、本実施形態では基板１７が第１方向Ｘに長い長方形であり、１つの基板１７が一対の配線パターン１４を有する。一対の配線パターン１４はそれぞれ、基板の両端に位置する第１接続端子１３ａ及び第２接続端子１３ｂから内側に第１方向Ｘに延伸しており、基板の中心を通り第２方向Ｙに延伸する直線を基準として線対称となっている。このような配線パターン１４を有する基板１７に、配線パターン１４と重なるように複数のＬＥＤ素子１１を第１方向Ｘに沿って直線上に配置することができる。この場合、ＬＥＤ素子１１同士はワイヤ１５で電気的に接続できる一方、第１方向Ｘに並ぶ複数のＬＥＤ素子１１のうち両端に位置するＬＥＤ素子１１は配線パターン１４とワイヤ１５で接続できる。配線パターン１４は第１方向Ｘに延伸しているので、１の基板１７に配置するＬＥＤ素子１１の数を変更したとしても、第２方向Ｙにおいてワイヤ１５を配線パターン１４に接続する位置が変わることはない。したがって、ワイヤ１５による接続が容易となる。   As the LED element 11, one in which a semiconductor structure is provided above an insulating translucent substrate and a positive electrode and a negative electrode are provided above the semiconductor structure can be used. In this case, even if the LED element 11 is mounted on the substrate so as to overlap the wiring pattern 14 and the positive electrode and the negative electrode face upward (face-up mounting), there is a gap between the wiring pattern and the semiconductor structure. Since there is an insulating translucent substrate, there is no fear that the wiring pattern and the semiconductor structure are electrically connected. Therefore, for example, as shown in FIG. 1 and the like, design of the connection position of the wire 15 is facilitated by making all the wiring patterns 14 on the substrate 17 of the plurality of LEDs 10 the same. More specifically, in this embodiment, the substrate 17 is a rectangle that is long in the first direction X, and one substrate 17 has a pair of wiring patterns 14. Each of the pair of wiring patterns 14 extends inward in the first direction X from the first connection terminal 13a and the second connection terminal 13b located at both ends of the substrate, and extends in the second direction Y through the center of the substrate. It is line symmetric with respect to a straight line. A plurality of LED elements 11 can be arranged on a straight line along the first direction X on the substrate 17 having such a wiring pattern 14 so as to overlap the wiring pattern 14. In this case, the LED elements 11 can be electrically connected to each other by the wire 15, while the LED elements 11 positioned at both ends of the plurality of LED elements 11 arranged in the first direction X can be connected to the wiring pattern 14 by the wire 15. Since the wiring pattern 14 extends in the first direction X, even if the number of LED elements 11 arranged on one substrate 17 is changed, the position where the wire 15 is connected to the wiring pattern 14 in the second direction Y changes. There is nothing. Therefore, the connection by the wire 15 becomes easy.

１つの基板１７上に配置されるＬＥＤ素子１１の数は、１個以上、さらには２個以上であることが好ましい。これにより、封止部材１２の長さに合わせて、配置するＬＥＤ素子１１の数を調整することができる。１つの基板１７上に配置されるＬＥＤ素子１１の数の上限は、例えば４０個以下とする。封止部材１２の長さが異なる２以上のＬＥＤ装置１０の、封止部材１２の第１方向Ｘの長さの差は１ｍｍ以上であることが好ましい。また、封止部材１２の長さが異なる２以上のＬＥＤ装置１０の基板１７上に配置されているＬＥＤ素子１１の数は、１個以上異なることが好ましい。これにより、封止部材１２を組み合わせて様々な発光形状を作製しやすくなる。さらには、１個ずつ異なることがより好ましく、これによりＬＥＤモジュール１００の発光形状をより精細化することができる。   The number of the LED elements 11 arranged on one substrate 17 is preferably 1 or more, and more preferably 2 or more. Thereby, according to the length of the sealing member 12, the number of the LED elements 11 to arrange can be adjusted. The upper limit of the number of LED elements 11 arranged on one substrate 17 is, for example, 40 or less. The difference in the length of the sealing member 12 in the first direction X between the two or more LED devices 10 having different lengths of the sealing member 12 is preferably 1 mm or more. Moreover, it is preferable that the number of the LED elements 11 arrange | positioned on the board | substrate 17 of two or more LED apparatuses 10 from which the length of the sealing member 12 differs differs 1 or more. Thereby, it becomes easy to produce various light emission shapes by combining the sealing member 12. Furthermore, it is more preferable that they are different one by one, whereby the light emission shape of the LED module 100 can be further refined.

複数のＬＥＤ装置１０は、基板１７上に配置されるすべてのＬＥＤ素子１１が、半導体構造、デバイス構造、サイズ等が略同一であることが好ましい。これにより、基板１７上に同数のＬＥＤ素子１１が配置されたＬＥＤ装置１０の発光が略同一となるため、発光形状の設計が容易となる。また、基板１７上に配置されるＬＥＤ素子１１は、フェイスアップ実装されることが好ましい。これにより、上述のとおり基板１７上に配置されるＬＥＤ素子１１の位置や個数に合わせて配線パターン１４を変える必要なく実装可能となるため、複数のＬＥＤ装置１０の製造が容易となる。   In the plurality of LED devices 10, it is preferable that all LED elements 11 arranged on the substrate 17 have substantially the same semiconductor structure, device structure, size, and the like. Thereby, since the light emission of the LED device 10 in which the same number of LED elements 11 are arranged on the substrate 17 becomes substantially the same, the design of the light emission shape becomes easy. Moreover, it is preferable that the LED element 11 arrange | positioned on the board | substrate 17 is mounted face-up. As a result, mounting can be performed without changing the wiring pattern 14 in accordance with the position and number of the LED elements 11 arranged on the substrate 17 as described above, so that the manufacture of the plurality of LED devices 10 is facilitated.

複数のＬＥＤ装置１０は、隣接するＬＥＤ装置１０の基板１７を離間させて配置してもよいが、隣接するＬＥＤ装置１０の基板１７が接するように配置することが好ましい。これにより、ＬＥＤモジュール１００の輝度を向上させることができる。   The plurality of LED devices 10 may be arranged such that the substrates 17 of the adjacent LED devices 10 are separated from each other, but are preferably arranged so that the substrates 17 of the adjacent LED devices 10 are in contact with each other. Thereby, the brightness | luminance of the LED module 100 can be improved.

以下、ＬＥＤモジュール１００における各部材について説明する。   Hereinafter, each member in the LED module 100 will be described.

（基板）
基板１７は、上面視において第１方向Ｘに長いものが用いられる。基板１７は、第１方向Ｘの長さが、例えば１０ｍｍ〜１００ｍｍのものを用いることができる。基板１７の上面には、１以上のＬＥＤ素子１１の電極に電流を供給するための配線パターン１４が形成されている。これら配線パターン１４は、第１接続端子１３ａ及び第２接続端子１３ｂに接続される。なお、第２方向Ｙにおける配線パターン１４の幅と第２方向Ｙにおける第１接続端子１３ａ及び第２接続端子１３ｂの幅は同じであってもよい。ＬＥＤ素子１１の電極をワイヤ１５、金属バンプ又は導電性接着剤等により配線パターン１４に電気的に接続することで、ＬＥＤ素子１１に第１接続端子１３ａ及び第２接続端子１３ｂを介して電流を供給することができる。基板１７として具体的には、アルミ基板、銅基板、ＡｌＮ基板、又はＳｉＣ基板等を用いることができる。配線パターン１４としてはＡｕ層等の金属層を用いることができる。 (substrate)
The substrate 17 is long in the first direction X when viewed from above. The substrate 17 having a length in the first direction X of, for example, 10 mm to 100 mm can be used. A wiring pattern 14 for supplying current to the electrodes of one or more LED elements 11 is formed on the upper surface of the substrate 17. These wiring patterns 14 are connected to the first connection terminal 13a and the second connection terminal 13b. The width of the wiring pattern 14 in the second direction Y and the width of the first connection terminal 13a and the second connection terminal 13b in the second direction Y may be the same. By electrically connecting the electrode of the LED element 11 to the wiring pattern 14 by a wire 15, a metal bump, a conductive adhesive or the like, a current is supplied to the LED element 11 via the first connection terminal 13a and the second connection terminal 13b. Can be supplied. Specifically, an aluminum substrate, a copper substrate, an AlN substrate, a SiC substrate, or the like can be used as the substrate 17. As the wiring pattern 14, a metal layer such as an Au layer can be used.

（接続端子）
ＬＥＤ装置１０は、アノード側の第１接続端子１３ａ及びカソード側の第２接続端子１３ｂを有する。第１接続端子１３ａ及び第２接続端子１３ｂは、基板１７の第１方向Ｘの両端から０．５ｍｍ〜５ｍｍの位置に配置することが好ましいが、基板１７の第１方向Ｘの両端から１ｍｍの位置に配置することがさらに好ましい。これにより、第１接続端子１３ａ及び第２接続端子１３ｂが外部の部材と接触してショートすることを抑制することができる。第１接続端子１３ａ及び第２接続端子１３ｂとしては、Ａｕ層等の金属層を用いることができる。 (Connecting terminal)
The LED device 10 includes a first connection terminal 13a on the anode side and a second connection terminal 13b on the cathode side. The first connection terminal 13a and the second connection terminal 13b are preferably arranged at positions of 0.5 mm to 5 mm from both ends of the substrate 17 in the first direction X, but 1 mm from both ends of the substrate 17 in the first direction X. More preferably, it is arranged at a position. Thereby, it can suppress that the 1st connecting terminal 13a and the 2nd connecting terminal 13b contact an external member, and short-circuit. A metal layer such as an Au layer can be used as the first connection terminal 13a and the second connection terminal 13b.

（ＬＥＤ素子）
ＬＥＤ素子１１は、透光性基板と、その一主面に形成された半導体構造とを含むことができる。透光性基板には、例えば、サファイアや窒化ガリウム等を用いることができる。半導体構造は、例えば、ｎ型半導体層と、発光層と、ｐ型半導体層とを含む。半導体構造を構成する各層には、ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ（０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）の窒化物半導体等を用いることができる。ＬＥＤ素子１１が発する光は、例えば青色光又は紫外線光である。 (LED element)
The LED element 11 can include a translucent substrate and a semiconductor structure formed on one main surface thereof. For the light-transmitting substrate, for example, sapphire, gallium nitride, or the like can be used. The semiconductor structure includes, for example, an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer. For each layer constituting the semiconductor structure, a nitride semiconductor of In X Al Y Ga 1- XYN (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) or the like can be used. The light emitted from the LED element 11 is, for example, blue light or ultraviolet light.

（封止部材）
基板１７の上面に配置されたＬＥＤ素子１１は、封止部材１２で覆われている。封止部材１２は、例えば、蛍光体と透光性材料とを含むことができる。蛍光体は、ＬＥＤ素子１１からの光により蛍光を発する。 (Sealing member)
The LED element 11 disposed on the upper surface of the substrate 17 is covered with a sealing member 12. The sealing member 12 can contain a fluorescent substance and a translucent material, for example. The phosphor emits fluorescence by the light from the LED element 11.

青色光又は紫外線光で励起可能な蛍光体としては、セリウムで賦活されたＹＡＧ系蛍光体、セリウムで賦活されたＬＡＧ系蛍光体、ユウロピウムおよび／又はクロムで賦活された窒素含有アルミノ珪酸カルシウム系蛍光体、ユウロピウムで賦活されたシリケート系蛍光体、βサイアロン蛍光体、ＣＡＳＮ系蛍光体、ＳＣＡＳＮ系蛍光体、ＫＳＦ系蛍光体、硫化物系蛍光体などが挙げられる。また、蛍光体として量子ドット蛍光体を用いてもよい。これらの蛍光体と、青色発光又は紫外発光のＬＥＤ素子１１とを組み合わせることにより、ＬＥＤ装置１０の発光色を、様々な色、例えば白色とすることができる。   Examples of phosphors that can be excited by blue light or ultraviolet light include YAG phosphors activated by cerium, LAG phosphors activated by cerium, and nitrogen-containing calcium aluminosilicate phosphors activated by europium and / or chromium. And silicate phosphors activated with europium, β sialon phosphors, CASN phosphors, SCASN phosphors, KSF phosphors, sulfide phosphors, and the like. Moreover, you may use a quantum dot fluorescent substance as fluorescent substance. By combining these phosphors with the LED element 11 that emits blue light or ultraviolet light, the light emission color of the LED device 10 can be various colors, for example, white.

第１の色を発光する第１色ＬＥＤ装置１０ａは、例えば第１蛍光体を含むことができ、第１の色と異なる第２の色を発光する第２色ＬＥＤ装置１０ｂは、第１蛍光体と異なる第２蛍光体を含むことができる。第１色ＬＥＤ装置１０ａ及び第２ＬＥＤ装置１０ｂは、ともに同じ発光色のＬＥＤ素子１１を有することができる。   The first color LED device 10a that emits the first color can include, for example, a first phosphor, and the second color LED device 10b that emits a second color different from the first color is the first fluorescence. A second phosphor different from the body can be included. Both the first color LED device 10a and the second LED device 10b can have LED elements 11 having the same emission color.

第１色ＬＥＤ装置１０ａの色温度を５０００Ｋ〜６５００Ｋ近傍の昼白色〜昼光色とし、第２色ＬＥＤ装置１０ｂの色温度を３０００Ｋ近傍の電球色とすることができる。この結果、第１色ＬＥＤ装置１０ａ及び第２色ＬＥＤ装置１０ｂの発光強度をそれぞれ調整することで、昼光色〜電球色の間で発光可能な調色型のＬＥＤモジュール１００を作製することができる。例えば、第１色ＬＥＤ装置１０ａは、第１蛍光体としてＹＡＧ系蛍光体等の黄色蛍光体を含むことができ、第２色ＬＥＤ装置１０ｂは、第２蛍光体としてＳＣＡＳＮ系蛍光体等の赤色蛍光体を含むことができる。より具体的には、第１色ＬＥＤ装置１０ａの含有する蛍光体は黄色蛍光体のみであってよく、第２色ＬＥＤ装置１０ｂの含有する蛍光体は赤色蛍光体と黄色蛍光体の２種類の蛍光体であってよい。   The color temperature of the first color LED device 10a can be a daylight white to daylight color near 5000K to 6500K, and the color temperature of the second color LED device 10b can be a light bulb color near 3000K. As a result, the toned LED module 100 capable of emitting light between the daylight color and the light bulb color can be manufactured by adjusting the light emission intensities of the first color LED device 10a and the second color LED device 10b. For example, the first color LED device 10a may include a yellow phosphor such as a YAG phosphor as the first phosphor, and the second color LED device 10b may include a red color such as a SCASN phosphor as the second phosphor. A phosphor can be included. More specifically, the phosphor contained in the first color LED device 10a may be only a yellow phosphor, and the phosphor contained in the second color LED device 10b includes two types of phosphors, a red phosphor and a yellow phosphor. It may be a phosphor.

第１色ＬＥＤ装置１０ａの封止部材１２に、励起光の変換効率が比較的高い蛍光体、例えばＹＡＧ系蛍光体等の黄色蛍光体を含み、第２色ＬＥＤ装置１０ｂの封止部材１２に、励起光の変換効率が比較的低い蛍光体、例えばＳＣＡＳＮ系蛍光体等の赤色蛍光体を含む場合、第１色ＬＥＤ装置１０ａの封止部材１２の長さを、第２色ＬＥＤ装置１０ｂの封止部材１２の長さよりも短くすることが好ましい。このように、封止部材１２に含まれる蛍光体の変換効率が、第１ＬＥＤ装置１０ａと第２ＬＥＤ装置１０ｂとで異なっている場合には、封止部材１２に含まれる蛍光体の濃度を変更することなく、封止部材１２の長さを調整することで、ＬＥＤモジュール１００全体でみた時に、第１色ＬＥＤ装置１０ａに含まれる蛍光体からの光と第２色ＬＥＤ装置１０ｂに含まれる蛍光体からの光の取出し量の差を小さくすることができる。   The sealing member 12 of the first color LED device 10a includes a phosphor having a relatively high excitation light conversion efficiency, for example, a yellow phosphor such as a YAG phosphor, and the sealing member 12 of the second color LED device 10b includes In the case where a phosphor having a relatively low conversion efficiency of excitation light, for example, a red phosphor such as a SCASN phosphor, is included, the length of the sealing member 12 of the first color LED device 10a is set to the length of the second color LED device 10b. It is preferable to make it shorter than the length of the sealing member 12. Thus, when the conversion efficiency of the phosphor contained in the sealing member 12 is different between the first LED device 10a and the second LED device 10b, the concentration of the phosphor contained in the sealing member 12 is changed. Without adjusting the length of the sealing member 12, the light from the phosphor contained in the first color LED device 10a and the phosphor contained in the second color LED device 10b when viewed from the LED module 100 as a whole. The difference in the amount of light extracted from the light can be reduced.

透光性材料としては、透光性の樹脂を用いることができる。透光性の樹脂としては熱硬化性樹脂又は熱可塑性樹脂を用いることができ、熱硬化性樹脂としてはシリコーン樹脂、エポキシ樹脂などが挙げられ、熱可塑性樹脂としてはポリカーボネート樹脂、アクリル樹脂などが挙げられる。透光性材料としては、耐光性、耐熱性に優れるシリコーン樹脂が特に好ましい。   As the light-transmitting material, a light-transmitting resin can be used. As the translucent resin, a thermosetting resin or a thermoplastic resin can be used. Examples of the thermosetting resin include a silicone resin and an epoxy resin. Examples of the thermoplastic resin include a polycarbonate resin and an acrylic resin. It is done. As the translucent material, a silicone resin excellent in light resistance and heat resistance is particularly preferable.

（枠）
図１などに示すように、上面視において、封止部材１２の周りには枠１６を形成することが好ましい。枠１６は、封止部材１２の周囲を完全に囲んでいることが好ましい。枠１６を形成した後、封止部材１２となる材料を枠１６の内側に流し込んで固めることで、容易に封止部材１２を形成することができる。枠１６は、例えば、白色樹脂等を用いることができる。 (frame)
As shown in FIG. 1 and the like, a frame 16 is preferably formed around the sealing member 12 in a top view. The frame 16 preferably completely surrounds the periphery of the sealing member 12. After forming the frame 16, the sealing member 12 can be easily formed by pouring the material to be the sealing member 12 into the inside of the frame 16 and solidifying it. For example, a white resin or the like can be used for the frame 16.

（ホルダ）
ホルダ２０は、図４及び図５に示すように、絶縁性の本体部２１と、複数のＬＥＤ装置１０の第１接続端子１３ａ及び第２接続端子１３ｂと通電するための給電端子２３を有する。複数のＬＥＤ装置１０は、第１接続端子１３ａ及び第２接続端子１３ｂがホルダ２０の給電端子２３と接触するように取り付けられるのが好ましい。上面視において、ホルダ２０の中央には、ＬＥＤ装置１０の封止部材１２を露出させるための凹部２２が本体部２１に形成されている。凹部２２を、矩形状とすることで、同一形状のホルダ２０で、様々な発光形状のＬＥＤモジュール１００に対応することができる。 (holder)
As shown in FIGS. 4 and 5, the holder 20 has an insulating main body 21 and a power supply terminal 23 for energizing the first connection terminal 13 a and the second connection terminal 13 b of the plurality of LED devices 10. The plurality of LED devices 10 are preferably attached so that the first connection terminal 13 a and the second connection terminal 13 b are in contact with the power supply terminal 23 of the holder 20. A concave portion 22 for exposing the sealing member 12 of the LED device 10 is formed in the main body portion 21 at the center of the holder 20 in a top view. By making the concave portion 22 rectangular, the holder 20 having the same shape can correspond to the LED modules 100 having various light emission shapes.

［実施形態２］
実施形態２に係るＬＥＤモジュール２００を図６に示す。ＬＥＤモジュール２００は、実施形態１のＬＥＤモジュール１００とは、中央に、封止部材１２の第１方向Ｘの長さが最も長いＬＥＤ装置１０が１つ配置されている点が異なる。それ以外については、実施形態１と同様である。 [Embodiment 2]
An LED module 200 according to Embodiment 2 is shown in FIG. The LED module 200 differs from the LED module 100 of Embodiment 1 in that one LED device 10 having the longest length in the first direction X of the sealing member 12 is arranged at the center. The rest is the same as in the first embodiment.

ＬＥＤモジュール２００では、図６に示すように、封止部材１２の第１方向Ｘの長さが異なる３つのグループからそれぞれ２つのＬＥＤ装置１０を選択し、さらに、これら３つのグループよりも封止部材１２の第１方向Ｘの長さが長いグループから１つのＬＥＤ装置１０を選択する。そして、ＬＥＤモジュール２００の中央に、封止部材１２の第１方向Ｘの長さが最も長いＬＥＤ装置１０を１つ配置し、ＬＥＤモジュール２００の中央から第２方向Ｙの両端に向かって封止部材１２の第１方向Ｘの長さが短くなるようにＬＥＤ装置１０を配置する。   In the LED module 200, as shown in FIG. 6, two LED devices 10 are selected from each of three groups having different lengths in the first direction X of the sealing member 12, and further sealed from these three groups. One LED device 10 is selected from the group in which the length of the member 12 in the first direction X is long. Then, one LED device 10 having the longest length in the first direction X of the sealing member 12 is arranged in the center of the LED module 200 and sealed toward both ends in the second direction Y from the center of the LED module 200. The LED device 10 is arranged so that the length of the member 12 in the first direction X is shortened.

ＬＥＤモジュール２００によれば、複数のＬＥＤ装置１０を奇数個配置することができる。これにより、上面視においてＬＥＤモジュール２００の中央にＬＥＤ装置１０が配置されることになるため、ＬＥＤモジュール２００が照射する範囲の中央を光らせることができる。通常、光を対象物に向けて照射する場合、ＬＥＤモジュール２００が照射する範囲の中央を対象物に合わせることが多いので、このような配置が好ましい。   According to the LED module 200, an odd number of the plurality of LED devices 10 can be arranged. Thereby, since the LED device 10 is disposed at the center of the LED module 200 in a top view, the center of the range irradiated by the LED module 200 can be illuminated. Usually, when irradiating light toward an object, the center of the range irradiated by the LED module 200 is often aligned with the object, and such an arrangement is preferable.

１００、２００ ＬＥＤモジュール
１０ ＬＥＤ装置
１０ａ 第１色ＬＥＤ装置
１０ｂ 第２色ＬＥＤ装置
１１ ＬＥＤ素子
１２ 封止部材
１３ａ 第１接続端子
１３ｂ 第２接続端子
１４ 配線パターン
１５ ワイヤ
１６ 枠
１７ 基板
２０ ホルダ
２１ 本体部
２２ 凹部
２３ 給電端子
Ｘ 第１方向
Ｙ 第２方向 100, 200 LED module 10 LED device 10a First color LED device 10b Second color LED device 11 LED element 12 Sealing member 13a First connection terminal 13b Second connection terminal 14 Wiring pattern 15 Wire 16 Frame 17 Substrate 20 Holder 21 Main body Part 22 Recess 23 Feeding terminal X First direction Y Second direction

Claims (11)

上面視において第１方向に長い基板と、前記基板の上面における前記第１方向の両端にそれぞれ配置されるアノード側の第１接続端子及びカソード側の第２接続端子と、前記基板の上面における前記第１接続端子と前記第２接続端子との間に配置される１以上のＬＥＤ素子と、前記ＬＥＤ素子を覆う封止部材と、を備え、前記基板の前記第１方向の長さが略同一である複数のＬＥＤ装置であって、前記封止部材の前記第１方向の長さが異なる複数のグループに分類可能な複数のＬＥＤ装置を準備する工程と、
前記複数のグループのうち２以上のグループからそれぞれ１以上の前記ＬＥＤ装置を選択し、上面視において、前記第１方向に対して略垂直な第２方向に前記第１接続端子及び前記第２接続端子がそれぞれ直線状に連なるように、且つ、前記封止部材が所定の形状を成す組み合わせとなるように、前記選択したＬＥＤ装置を配置する工程と、を有することを特徴とするＬＥＤモジュールの製造方法。 A substrate that is long in the first direction in a top view, a first connection terminal on the anode side and a second connection terminal on the cathode side that are respectively disposed at both ends in the first direction on the upper surface of the substrate, and the second connection terminal on the cathode side. One or more LED elements disposed between the first connection terminal and the second connection terminal, and a sealing member that covers the LED element, and the length of the substrate in the first direction is substantially the same. A step of preparing a plurality of LED devices that can be classified into a plurality of groups having different lengths in the first direction of the sealing member,
One or more LED devices are selected from two or more groups among the plurality of groups, and the first connection terminal and the second connection in a second direction substantially perpendicular to the first direction in a top view. And a step of arranging the selected LED devices so that the terminals are connected in a straight line and the sealing member has a predetermined shape. Method. 前記ＬＥＤ装置を配置する工程において、第１の色を発光する第１色ＬＥＤ装置と、第１の色と異なる第２の色を発光する第２色ＬＥＤ装置とを含むように前記ＬＥＤ装置を配置することを特徴とする請求項１に記載のＬＥＤモジュールの製造方法。   In the step of arranging the LED device, the LED device is configured to include a first color LED device that emits a first color and a second color LED device that emits a second color different from the first color. The LED module manufacturing method according to claim 1, wherein the LED module is disposed. 前記第１色ＬＥＤ装置は第１蛍光体を含み、前記第２色ＬＥＤ装置は前記第１蛍光体と異なる第２蛍光体を含むことを特徴とする請求項２に記載のＬＥＤモジュールの製造方法。   3. The method of manufacturing an LED module according to claim 2, wherein the first color LED device includes a first phosphor and the second color LED device includes a second phosphor different from the first phosphor. . 前記ＬＥＤ装置を配置する工程において、前記選択したＬＥＤ装置を、前記封止部材が上面視において略円形状を成す組み合わせとなるように配置することを特徴とする請求項１乃至請求項３のいずれか一に記載のＬＥＤモジュールの製造方法。   4. The method according to claim 1, wherein in the step of arranging the LED device, the selected LED device is arranged such that the sealing member has a substantially circular shape in a top view. The manufacturing method of the LED module as described in one. 前記ＬＥＤ装置を配置する工程において、５以上の前記ＬＥＤ装置を選択し、前記選択したＬＥＤ装置を配置することを特徴とする請求項１乃至請求項４のいずれか一に記載のＬＥＤモジュールの製造方法。   5. The manufacturing of the LED module according to claim 1, wherein in the step of arranging the LED devices, five or more LED devices are selected and the selected LED devices are arranged. Method. 前記ＬＥＤ装置を配置する工程の後に、
前記選択したＬＥＤ装置を、給電端子を備えるホルダに、前記第１接続端子及び前記第２接続端子が前記給電端子にそれぞれ接続されるように取り付ける工程をさらに有することを特徴とする請求項１乃至請求項５のいずれか一に記載のＬＥＤモジュールの製造方法。 After the step of arranging the LED device,
2. The method according to claim 1, further comprising a step of attaching the selected LED device to a holder having a power supply terminal so that the first connection terminal and the second connection terminal are connected to the power supply terminal, respectively. The manufacturing method of the LED module as described in any one of Claims 5. 上面を有し、上面視において第１方向に長い基板と、
前記基板の上面における前記第１方向の両端にそれぞれ配置されるアノード側の第１接続端子及びカソード側の第２接続端子と、
前記基板の上面における前記第１接続端子と前記第２接続端子との間に配置される１以上のＬＥＤ素子と、
前記基板の上面に設けられ、前記ＬＥＤ素子を覆う封止部材と、を有するＬＥＤ装置を複数備えるＬＥＤモジュールであって、
前記複数のＬＥＤ装置は、
前記基板の前記第１方向の長さが略同一である一方、前記封止部材の前記第１方向の長さが２以上のＬＥＤ装置で異なっており、
上面視において、前記第１方向に対して略垂直な第２方向に前記第１接続端子及び前記第２接続端子がそれぞれ直線状に連なるように、且つ、前記封止部材が所定の形状を成すように、配置されることを特徴とするＬＥＤモジュール。 A substrate having an upper surface and long in the first direction in a top view;
A first connection terminal on the anode side and a second connection terminal on the cathode side respectively disposed at both ends in the first direction on the upper surface of the substrate;
One or more LED elements disposed between the first connection terminal and the second connection terminal on the upper surface of the substrate;
An LED module including a plurality of LED devices provided on the upper surface of the substrate and covering the LED element;
The plurality of LED devices are:
While the length of the substrate in the first direction is substantially the same, the length of the sealing member in the first direction is different in two or more LED devices,
When viewed from above, the first connecting terminal and the second connecting terminal are linearly connected in a second direction substantially perpendicular to the first direction, and the sealing member has a predetermined shape. An LED module that is arranged as described above. 前記複数のＬＥＤ装置は、第１の色を発光する第１色ＬＥＤ装置と、第１の色と異なる第２の色を発光する第２色ＬＥＤ装置とを含むことを特徴とする請求項７に記載のＬＥＤモジュール。   8. The plurality of LED devices include a first color LED device that emits a first color and a second color LED device that emits a second color different from the first color. LED module according to 1. 前記第１色ＬＥＤ装置は第１蛍光体を含み、前記第２色ＬＥＤ装置は前記第１蛍光体と異なる第２蛍光体を含むことを特徴とする請求項７又は請求項８に記載のＬＥＤモジュール。   The LED according to claim 7 or 8, wherein the first color LED device includes a first phosphor, and the second color LED device includes a second phosphor different from the first phosphor. module. 前記複数のＬＥＤ装置は、前記封止部材が上面視において略円形状を成す組み合わせで配置されることを特徴とする請求項７乃至請求項９のいずれか一に記載のＬＥＤモジュール。   The LED module according to any one of claims 7 to 9, wherein the plurality of LED devices are arranged in a combination in which the sealing members form a substantially circular shape in a top view. 複数の前記複数のＬＥＤ装置が、５以上配置されている請求項７乃至請求項１０のいずれか一に記載のＬＥＤモジュール。   11. The LED module according to claim 7, wherein five or more of the plurality of LED devices are arranged.
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020095939A (en) * 2018-12-12 2020-06-18 日亜化学工業株式会社 Manufacturing method of light emitting module, light emitting module, and projector
JP2022176210A (en) * 2018-12-12 2022-11-25 日亜化学工業株式会社 Manufacturing method of light emitting module, light emitting module, and projector
US11949209B2 (en) 2018-06-14 2024-04-02 Nichia Corporation Semiconductor device and method of manufacturing the semiconductor device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534792A (en) * 2006-04-21 2009-09-24 クリー インコーポレイテッド Solid state lighting for general lighting
JP2010192394A (en) * 2009-02-20 2010-09-02 Toshiba Lighting & Technology Corp Lighting system
JP2010287657A (en) * 2009-06-10 2010-12-24 Toshiba Lighting & Technology Corp Light-emitting module and method of manufacturing the same
JP2013042036A (en) * 2011-08-18 2013-02-28 Toshiba Corp Light-emitting device
WO2013088619A1 (en) * 2011-12-16 2013-06-20 パナソニック株式会社 Light-emitting module, and illumination light source and illumination device using same
JP2014216435A (en) * 2013-04-24 2014-11-17 日東電工株式会社 Electrical connection member for light-emitting device, light-emitting device module, and method of manufacturing the same
US20150060903A1 (en) * 2013-08-27 2015-03-05 Glo Ab Molded led package and method of making same
JP2015195395A (en) * 2013-05-24 2015-11-05 日東電工株式会社 Manufacturing method of encapsulation sheet

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009534792A (en) * 2006-04-21 2009-09-24 クリー インコーポレイテッド Solid state lighting for general lighting
JP2010192394A (en) * 2009-02-20 2010-09-02 Toshiba Lighting & Technology Corp Lighting system
JP2010287657A (en) * 2009-06-10 2010-12-24 Toshiba Lighting & Technology Corp Light-emitting module and method of manufacturing the same
JP2013042036A (en) * 2011-08-18 2013-02-28 Toshiba Corp Light-emitting device
WO2013088619A1 (en) * 2011-12-16 2013-06-20 パナソニック株式会社 Light-emitting module, and illumination light source and illumination device using same
JP2014216435A (en) * 2013-04-24 2014-11-17 日東電工株式会社 Electrical connection member for light-emitting device, light-emitting device module, and method of manufacturing the same
JP2015195395A (en) * 2013-05-24 2015-11-05 日東電工株式会社 Manufacturing method of encapsulation sheet
US20150060903A1 (en) * 2013-08-27 2015-03-05 Glo Ab Molded led package and method of making same

Cited By (14)

* Cited by examiner, † Cited by third party
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