JP2017199733A - Coil device - Google Patents
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- JP2017199733A JP2017199733A JP2016087407A JP2016087407A JP2017199733A JP 2017199733 A JP2017199733 A JP 2017199733A JP 2016087407 A JP2016087407 A JP 2016087407A JP 2016087407 A JP2016087407 A JP 2016087407A JP 2017199733 A JP2017199733 A JP 2017199733A
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- Coils Or Transformers For Communication (AREA)
Abstract
Description
本発明は、インダクタ素子などとして用いられるコイル装置に関する。 The present invention relates to a coil device used as an inductor element or the like.
各種の電子・電気機器には、インダクタ素子などとして多くのコイル装置が搭載されている。たとえば、そのようなコイル装置の一例として、たとえば特許文献１に示すコイル装置が開発されている。この特許文献１に示すコイル装置では、コイルの断面形状を工夫することにより、コイルの中央内部に生じるおそれがあるクラックを防止している。 Various electronic devices are equipped with many coil devices as inductor elements. For example, as an example of such a coil device, for example, a coil device shown in Patent Document 1 has been developed. In the coil device shown in Patent Document 1, a crack that may occur inside the center of the coil is prevented by devising the cross-sectional shape of the coil.
しかしながら、従来では、コイルが内蔵してあるコア部の反実装側外面に生じるクラックを防止することができないなどの不都合を有している。特にスイッチング周波数が高い用途に用いられるコイル装置などの場合に、コイルの発熱により、コア部の実装側外面と反実装側外面との熱膨張差が生じ、反実装側外面にクラックが生じやすいという課題を有している。 However, conventionally, there is a disadvantage that it is impossible to prevent cracks generated on the outer surface on the side opposite to the mounting side of the core portion in which the coil is built. Especially in the case of coil devices used for applications with high switching frequency, the heat generation of the coil causes a difference in thermal expansion between the outer surface on the mounting side and the outer surface on the non-mounting side of the core, and cracks are likely to occur on the outer surface on the non-mounting side Has a problem.
本発明は、このような実状に鑑みてなされ、その目的は、クラックの発生を防止できるコイル装置を提供することである。 The present invention has been made in view of such a situation, and an object thereof is to provide a coil device that can prevent the occurrence of cracks.
上記目的を達成するために、本発明に係るコイル装置は、
ワイヤがコイル状巻回してある巻線部と、
磁性材と樹脂とを含有しており、前記巻線部の内部も含めて前記巻線部の全体を覆うコア部と、
前記巻線部の巻軸方向の一端に位置する前記コア部の実装側外面に装着してある端子電極と、を有するコイル装置であって、
前記実装側外面の少なくとも中央部分を含む前記コア部の第１領域に含まれる空孔の密度よりも、前記実装側外面と反対側に位置する前記コア部の反実装側外面の少なくとも中央部分を含む前記コア部の第２領域に含まれる空孔の密度が高いことを特徴とする。
In order to achieve the above object, a coil device according to the present invention comprises:
A winding portion in which the wire is wound in a coil shape;
Containing a magnetic material and a resin, and a core portion covering the entire winding portion including the inside of the winding portion;
A terminal electrode mounted on the mounting side outer surface of the core part located at one end in the winding axis direction of the winding part,
At least the central portion of the outer surface of the core portion that is opposite to the mounting side outer surface than the density of the holes included in the first region of the core portion including at least the central portion of the outer surface of the mounting side. The density of the void | hole contained in the 2nd area | region of the said core part to contain is characterized by the above-mentioned.
本発明に係るコイル装置では、反実装側外面の少なくとも中央部分を含むコア部の第２領域の空孔の密度が、実装側外面に比較して高くなっている。このため、コア部の反実装側外面では、空孔リッチ層が形成され、その空孔リッチ層が、応力緩和層となると共に、クラックの連続を阻止するクラック拡大防止層となり、クラックの発生および拡大を抑制する。 In the coil device according to the present invention, the density of the holes in the second region of the core portion including at least the central portion of the non-mounting side outer surface is higher than that of the mounting side outer surface. For this reason, a hole-rich layer is formed on the outer surface of the core portion on the side opposite to the mounting side, and the hole-rich layer becomes a stress relaxation layer and a crack expansion prevention layer that prevents continuation of cracks. Suppresses expansion.
本発明では、特にスイッチング周波数が高い用途（たとえば携帯電話用）に用いられるコイル装置などの場合に、巻線部が発熱してコア部の実装側外面と反実装側外面との熱膨張差が生じたとしても、反実装側外面にクラックが生じ難くなる。なお、従来では、巻線部の自己発熱が大きい条件で使用されるコイル装置では、基板との熱膨張係数差などによる影響を受けて反実装側外面のコア部にクラックが発生しやすい。本発明では、巻線部の自己発熱が大きい条件で使用されて、基板との熱膨張係数差などによる影響を受けたとしても、コア部の反実装側外面では、空孔リッチ層が形成され、その空孔リッチ層が、応力緩和層およびクラック拡大防止層となり、クラックの発生および拡大を抑制する。 In the present invention, especially in the case of a coil device or the like used for a high switching frequency application (for example, for a mobile phone), the winding part generates heat, and the thermal expansion difference between the mounting part outer surface and the non-mounting side outer surface of the core part Even if it occurs, cracks are less likely to occur on the outer surface of the non-mounting side. Conventionally, in a coil device used under a condition where the self-heating of the winding portion is large, cracks are likely to occur in the core portion on the outer surface of the non-mounting side due to the influence of the difference in thermal expansion coefficient with the substrate. In the present invention, even when the self-heating of the winding part is used under a large condition and it is affected by a difference in thermal expansion coefficient with the substrate, a hole rich layer is formed on the outer surface of the core part on the non-mounting side. The void-rich layer becomes a stress relaxation layer and a crack expansion preventing layer, and suppresses the generation and expansion of cracks.
前記第２領域は、前記巻線部の内側と外側に連続して存在していてもよい。 The second region may exist continuously on the inner side and the outer side of the winding part.
前記コア部の内部で、前記巻軸方向に沿って前記第１領域と第２領域との間には、前記第１領域とは異なると共に、第２領域とも異なる空孔の密度を有する第３領域が存在してもよい。 Inside the core portion, between the first region and the second region along the winding axis direction, there is a third hole density different from the first region and different from the second region. There may be regions.
前記第３領域は、前記巻線部の内側および外側に連続して存在していてもよい。第３領域が、第２領域の空孔の密度よりも低い場合には、相対的に磁性材が多くなり、磁気特性が向上する。第３領域が、第１領域の空孔の密度よりも低い場合には、相対的に磁性材がさらに多くなり、磁気特性がさらに向上する。第３領域が、第１領域の空孔の密度よりも高い場合には、第３領域も第１領域に比較して空孔リッチ層となり、応力緩和特性が向上すると共に、クラック拡大防止特性も向上する。 The third region may be continuously present inside and outside the winding portion. When the third region is lower than the density of the holes in the second region, the magnetic material is relatively increased and the magnetic characteristics are improved. When the third region is lower than the density of the vacancies in the first region, the magnetic material is relatively increased, and the magnetic characteristics are further improved. When the third region is higher than the density of the vacancies in the first region, the third region also becomes a vacancy rich layer as compared with the first region, and the stress relaxation characteristics are improved and the crack expansion prevention characteristics are also improved. improves.
前記第１領域は、前記巻線部の内側で、前記第２領域に向けて突出する凸部を有してもよい。巻線部の内側に凸部を配置することで、巻線部の位置決めが可能になる。 The first region may have a convex portion that protrudes toward the second region inside the winding portion. By arranging the convex portion inside the winding portion, the winding portion can be positioned.
第１実施形態
図１および図２Ａに示すように、本発明の一実施形態におけるコイル装置としてのインダクタ素子２は、圧縮成形体としてのコア部４と、コア部４の内部でコイル状にワイヤ６ａが巻回してある巻線部６とを有する。ワイヤ６ａは、たとえば、導線と、必要に応じて導線の外周を被覆してある絶縁被覆層とで構成してある。
First Embodiment As shown in FIGS. 1 and 2A, an inductor element 2 as a coil device according to an embodiment of the present invention includes a core portion 4 as a compression molded body and a wire in a coil shape inside the core portion 4. 6a has a winding portion 6 wound thereon. The wire 6a is composed of, for example, a conductive wire and an insulating coating layer that covers the outer periphery of the conductive wire as necessary.
導線は、たとえばＣｕ、Ａｌ、Ｆｅ、Ａｇ、Ａｕ、リン青銅などで構成してある。絶縁被覆層は、たとえばポリウレタン、ポリアミドイミド、ポリイミド、ポリエステル、ポリエステル−イミド、ポリエステル−ナイロンなどで構成してある。ワイヤ６ａの横断面形状は、特に限定されず、円形、平角形状などが例示される。 The conducting wire is made of, for example, Cu, Al, Fe, Ag, Au, phosphor bronze, or the like. The insulating coating layer is made of, for example, polyurethane, polyamideimide, polyimide, polyester, polyester-imide, polyester-nylon, or the like. The cross-sectional shape of the wire 6a is not particularly limited, and examples thereof include a circular shape and a rectangular shape.
コア部４は、磁性粉体およびバインダを含む顆粒を圧縮成形または射出成形して形成してある。磁性粉体としては、特に限定されないが、センダスト（Ｆｅ−Ｓｉ−Ａｌ；鉄−シリコン−アルミニウム）、Ｆｅ−Ｓｉ−Ｃｒ（鉄−シリコン−クロム）、パーマロイ（Ｆｅ−Ｎｉ）、カルボニル鉄系、カルボニルＮｉ系、アモルファス粉、ナノクリスタル粉などの金属磁性体粉が好ましく用いられる。 The core part 4 is formed by compression molding or injection molding a granule containing magnetic powder and a binder. Although it does not specifically limit as magnetic powder, Sendust (Fe-Si-Al; Iron-silicon-aluminum), Fe-Si-Cr (iron-silicon-chromium), permalloy (Fe-Ni), carbonyl iron system, Metallic magnetic powders such as carbonyl Ni-based, amorphous powder, and nanocrystal powder are preferably used.
ただし、磁性粉体としては、Ｍｎ−Ｚｎ、Ｎｉ−Ｃｕ−Ｚｎなどのフェライト磁性体粉であってもよい。バインダ樹脂としては、特に限定されないが、たとえばエポキシ樹脂、フェノール樹脂、アクリル樹脂、ポリエステル樹脂、ポリイミド、ポリアミドイミド、シリコン樹脂、これらを組み合わせたものなどが例示される。 However, the magnetic powder may be a ferrite magnetic powder such as Mn—Zn and Ni—Cu—Zn. The binder resin is not particularly limited, and examples thereof include epoxy resins, phenol resins, acrylic resins, polyester resins, polyimides, polyamideimides, silicon resins, and combinations thereof.
図２Ａに示すように、巻線部６は、１本以上のワイヤ６ａがコイル状に巻回してある部分であり、巻線部６からはワイヤ６ａの両端である少なくとも一対のリード部６ｂが、コア部４の外部に引き出される。図示する実施形態では、巻線部６からは、Ｚ軸方向に沿って一対のリード部６ｂがコア部４の実装側外面４Ａから引き出され、その外面４Ａに設けられた一対の端子電極８に、溶接または導電性接着剤の手段でそれぞれ接続してある。 As shown in FIG. 2A, the winding portion 6 is a portion in which one or more wires 6a are wound in a coil shape. From the winding portion 6, at least a pair of lead portions 6b that are both ends of the wire 6a are provided. , Pulled out of the core 4. In the illustrated embodiment, a pair of lead portions 6b are drawn from the winding portion 6 along the Z-axis direction from the mounting side outer surface 4A of the core portion 4, and are connected to the pair of terminal electrodes 8 provided on the outer surface 4A. They are connected by means of welding or conductive adhesive.
各端子電極８は、本実施形態では、コア部４の実装側外面４Ａにのみ形成してあるが、コア部４の側面４Ｃにまで連続して形成してある電極側部８ａを有していてもよい。端子電極８としては、特に限定されず、コア部４に接着された銅または銅合金などの金属端子であってもよく、あるいは銀あるいは銀合金などを含む焼付け電極、あるいはメッキなどにより形成された金属膜電極であってもよい。 In the present embodiment, each terminal electrode 8 is formed only on the mounting side outer surface 4A of the core part 4, but has an electrode side part 8a formed continuously to the side surface 4C of the core part 4. May be. The terminal electrode 8 is not particularly limited, and may be a metal terminal such as copper or a copper alloy bonded to the core portion 4, or a baked electrode containing silver or a silver alloy, or formed by plating or the like. It may be a metal film electrode.
本実施形態では、コア部４の下面は、回路基板などに接続される実装側外面４Ａであり、相互に垂直なＸ軸およびＹ軸を通る平面と略平行に形成してあり、巻線部６の巻軸が、Ｘ軸およびＹ軸を通る平面と垂直なＺ軸に対して略平行になっている。本実施形態では、コア部４の上面は、その下面に対して略平行な反実装側外面４Ｂであり、４つの側面４Ｃは、これらの上面および下面に対して略垂直となっている。ただし、コア部４の形状は、特に限定されず、６面体に限らず、円柱形、楕円柱、多角柱などであっても良い。 In the present embodiment, the lower surface of the core portion 4 is a mounting-side outer surface 4A connected to a circuit board or the like, and is formed substantially parallel to a plane passing through the mutually perpendicular X axis and Y axis. The winding axis of 6 is substantially parallel to the Z axis perpendicular to the plane passing through the X axis and the Y axis. In the present embodiment, the upper surface of the core portion 4 is an anti-mounting side outer surface 4B substantially parallel to the lower surface, and the four side surfaces 4C are substantially perpendicular to the upper surface and the lower surface. However, the shape of the core portion 4 is not particularly limited, and is not limited to a hexahedron, and may be a cylindrical shape, an elliptical column, a polygonal column, or the like.
本実施形態のインダクタ素子２のサイズは、特に限定されないが、たとえばＸ軸方向幅Ｘ０が１．０〜２０ｍｍ、Ｙ軸方向幅Ｙ０が１．０〜２０ｍｍ、高さＺ０が１．０〜１０ｍｍである。このインダクタ素子２は、たとえばパソコンや携帯型電子機器などに搭載されるＤＣ／ＤＣコンバータ等の回路素子、パソコンや携帯型電子機器などに搭載される電源ラインにおけるチョークコイル、パソコンや携帯型電子機器などに搭載されるデカップリング素子、パソコンや携帯型電子機器などに搭載されるインピーダンスマッチングのための素子、パソコンや携帯型電子機器などに搭載されるフィルタの構成素子、パソコンや携帯型電子機器などに搭載されるアンテナ素子などとして用いることができる。 The size of the inductor element 2 of the present embodiment is not particularly limited. For example, the X-axis direction width X0 is 1.0 to 20 mm, the Y-axis direction width Y0 is 1.0 to 20 mm, and the height Z0 is 1.0 to 10 mm. It is. The inductor element 2 includes, for example, a circuit element such as a DC / DC converter mounted on a personal computer or a portable electronic device, a choke coil in a power supply line mounted on a personal computer or a portable electronic device, a personal computer or a portable electronic device. Decoupling elements mounted on devices, impedance matching elements mounted on personal computers and portable electronic devices, filter components mounted on personal computers and portable electronic devices, personal computers and portable electronic devices, etc. It can be used as an antenna element or the like mounted on the board.
図２Ａに示すように、本実施形態では、コア部４は、巻線部６の内周部と外周部と巻回軸両端部とを一体化して全体を覆うようになっている。コア部４は、実装側外面４Ａの少なくとも中央部分を含む第１領域４ａと、反実装側外面４Ｂの少なくとも中央部分を含む第２領域４ｂとから成る。本実施形態では、中央部分とは、巻線部６の内側部分を意味する。 As shown in FIG. 2A, in the present embodiment, the core portion 4 is configured so as to cover the whole by integrating the inner and outer peripheral portions of the winding portion 6 and both ends of the winding shaft. The core portion 4 includes a first region 4a including at least a central portion of the mounting side outer surface 4A and a second region 4b including at least a central portion of the non-mounting side outer surface 4B. In the present embodiment, the central portion means an inner portion of the winding portion 6.
本実施形態では、第１領域４ａは、巻線部６のＺ軸方向下端よりもさらに下に位置して実装側外面４Ａの全面を含むベース部４ａ１と、ベース部４ａ１の中央部から連続して反実装側外面４Ｂの方向にＺ軸方向に沿って山形に突出する凸部４ａ２とを有する。ベース部４ａ１は、実装側外面４Ａと、コア部４の４つの側面４Ｃの下部とを構成している。 In the present embodiment, the first region 4a is located below the lower end in the Z-axis direction of the winding part 6 and is continuous from the base part 4a1 including the entire surface of the mounting-side outer surface 4A and the center part of the base part 4a1. And a convex portion 4a2 protruding in a mountain shape along the Z-axis direction in the direction of the non-mounting side outer surface 4B. The base portion 4a1 constitutes the mounting side outer surface 4A and the lower portions of the four side surfaces 4C of the core portion 4.
第２領域４ｂは、巻線部６のＺ軸方向上端よりもさらに上に位置して反実装側外面４Ｂの全面を含むベース部４ｂ１と、ベース部４ｂ１の中央部から連続して実装側外面４Ａの方向にＺ軸方向に沿って突出する凸部４ｂ２とを有する。凸部４ｂ２は、山形に突出する凸部４ａ２と巻線部６の内周面との隙間を埋めるような形状を有している。第２領域４ｂは、ベース部４ｂ１から巻線部６の外周部で連続して実装側外面４Ａの方向にＺ軸方向に沿って突出する外周部４ｂ３とを有する。外周部４ｂ３は、コア部４の４つの側面４Ｃの上部を構成している。第２領域４ｂを構成する磁性粉体とバインダ樹脂との混合物は、巻線部６を構成するワイヤ６ａ間の隙間にも充填されている。 The second region 4b includes a base portion 4b1 that is located further above the upper end in the Z-axis direction of the winding portion 6 and includes the entire surface of the non-mounting side outer surface 4B, and a mounting side outer surface that is continuous from the center of the base portion 4b1. And a convex portion 4b2 projecting along the Z-axis direction in the direction of 4A. The convex portion 4 b 2 has a shape that fills the gap between the convex portion 4 a 2 protruding in a mountain shape and the inner peripheral surface of the winding portion 6. The second region 4b includes an outer peripheral portion 4b3 that protrudes along the Z-axis direction in the direction of the mounting-side outer surface 4A from the base portion 4b1 along the outer peripheral portion of the winding portion 6. The outer peripheral part 4 b 3 constitutes the upper part of the four side surfaces 4 C of the core part 4. The mixture of magnetic powder and binder resin that constitutes the second region 4 b is also filled in the gaps between the wires 6 a that constitute the winding portion 6.
第１領域４ａのベース部４ａ１のＺ軸方向の厚みＺ１は、好ましくは、コア部４の高さＺ０の１０〜４０％であり、第２領域４ｂのベース部４ｂ１のＺ軸方向の厚みＺ２と同程度であるが、必ずしも同一である必要はない。凸部４ａ２の高さＺ１ａは、巻線部６のＺ軸方向の高さＺ３より低くても高くてもよく、高さＺ３の２０〜１２０％の高さが好ましく、さらに好ましくは５０〜１００％％の高さである。また、凸部４ａ２は、裁頭錐体形状であることが好ましい。凸部４ａ２の形成が容易であると共に、空芯コイルとしての巻線部６の内部に凸部４ａ２を入り込ませやすく、しかも位置決め効果があるからである。 The thickness Z1 in the Z-axis direction of the base portion 4a1 in the first region 4a is preferably 10 to 40% of the height Z0 of the core portion 4, and the thickness Z2 in the Z-axis direction of the base portion 4b1 in the second region 4b. But not necessarily the same. The height Z1a of the convex portion 4a2 may be lower or higher than the height Z3 of the winding portion 6 in the Z-axis direction, and is preferably 20 to 120% of the height Z3, more preferably 50 to 100. %% height. Moreover, it is preferable that the convex part 4a2 is a truncated cone shape. This is because the convex portion 4a2 can be easily formed, and the convex portion 4a2 can be easily inserted into the winding portion 6 as an air-core coil, and has a positioning effect.
本実施形態では、コア部４を構成する第１領域４ａおよび第２領域４ｂは、所定の界面で直接に接触しており、双方共に、磁性粉末とバインダ樹脂とを含むが、空隙の密度が異なる。すなわち、第１領域４ａにおける空隙の密度よりも、第２領域４ｂにおける空隙の密度が高い。本実施形態において、空隙とは、コア部４を任意の断面で切断した場合に、内径が３〜３０μｍの断面空間が観察された部分を意味する。空隙の形状は、たとえば図４Ａに示すように、円形に近いことが好ましいが、必ずしも円形ではなく、楕円形、多角形でもよい。空隙の内径は、観察された断面空間の形状の外接円で判断する。なお、図４Ｂは、空隙の密度が低い断面写真である。 In the present embodiment, the first region 4a and the second region 4b constituting the core part 4 are in direct contact with each other at a predetermined interface, and both include magnetic powder and a binder resin, but the density of voids is low. Different. That is, the density of voids in the second region 4b is higher than the density of voids in the first region 4a. In the present embodiment, the void means a portion where a cross-sectional space having an inner diameter of 3 to 30 μm is observed when the core portion 4 is cut in an arbitrary cross section. For example, as shown in FIG. 4A, the shape of the gap is preferably close to a circle, but is not necessarily a circle, and may be an ellipse or a polygon. The inner diameter of the air gap is determined by the circumscribed circle of the shape of the observed cross-sectional space. FIG. 4B is a cross-sectional photograph in which the void density is low.
本実施形態において、空隙の密度は、コア部４を任意の断面で切断した場合の断面写真において、９０μｍ×１２０μｍの四角形の面積内に観察される空隙の数で定義される。また、空隙の密度が高いとは、比較される断面における空隙の密度に対して、好ましくは１５０％以上、さらに好ましくは３００％以上に密度が高いことを意味する。 In the present embodiment, the density of voids is defined by the number of voids observed within a square area of 90 μm × 120 μm in a cross-sectional photograph when the core part 4 is cut in an arbitrary cross section. In addition, the high density of voids means that the density is preferably 150% or higher, more preferably 300% or higher, with respect to the density of the voids in the cross-sections to be compared.
第１領域４ａに対して第２領域４ｂの空隙の密度を高くするための方法の一例としては、たとえば第２領域４ｂを形成するための材料に含まれる溶剤の量を、第２領域４ｂを形成するための材料に含まれる溶剤の量よりも多くすることが挙げられる。溶剤の量を多くすることで、コア部４を成形するための乾燥工程、加熱工程、あるいは圧縮工程において、第２領域４ｂでは、溶剤が蒸発して空隙となる割合が多くなり、第２領域４ｂの空隙の密度を高くすることができる。 As an example of a method for increasing the density of voids in the second region 4b with respect to the first region 4a, for example, the amount of the solvent contained in the material for forming the second region 4b is changed to the second region 4b. Increasing the amount of the solvent contained in the material to be formed may be mentioned. By increasing the amount of the solvent, in the drying step, the heating step, or the compression step for forming the core portion 4, in the second region 4b, the ratio of the solvent evaporating to become voids increases, and the second region The density of the voids 4b can be increased.
なお、本実施形態では、第１領域４ａは、単純な形状を有しており、巻回されているワイヤ６ａの間の隙間に入り込ませる必要がないため、第１領域４ａを形成するための材料には、溶剤は、ほとんど含ませなくてもよい。逆に、第２領域４ｂは、巻回されているワイヤ６ａの間の隙間に入り込ませる必要があるため、第２領域４ｂを形成するための材料には、溶剤が多く含まれていることが好ましい。 In the present embodiment, the first region 4a has a simple shape and does not need to enter the gap between the wound wires 6a, so that the first region 4a is formed. The material may contain little solvent. Conversely, since the second region 4b needs to enter the gap between the wound wires 6a, the material for forming the second region 4b may contain a large amount of solvent. preferable.
第１領域４ａに対して第２領域４ｂの空隙の密度を高くするための方法の別の例としては、以下の方法も考えられる。たとえば第１領域４ａを予め成形した後に、第２領域４ｂを形成するための磁性体ペーストに、成形後の第１領域４ａの凸部４ａ２側を巻線部６と共に浸漬させ、磁性体ペーストを硬化させる際に、磁性体ペーストから溶剤成分が抜け難くするようにしてもよい。たとえば溶剤が抜けにくいパレットに磁性体ペーストを入れ、そこに、成形後の第１領域４ａの凸部４ａ２側を巻線部６と共に浸漬させ、溶剤が外部に抜けにくい状態で磁性体ペーストを硬化させてもよい。このような方法によっても、第２領域４ｂにおける空隙の密度を、第１領域４ａよりも高めることができる。 As another example of the method for increasing the density of the voids in the second region 4b with respect to the first region 4a, the following method is also conceivable. For example, after forming the first region 4a in advance, the convex portion 4a2 side of the first region 4a after molding is immersed together with the winding portion 6 in the magnetic paste for forming the second region 4b, and the magnetic paste is used. When curing, the solvent component may be made difficult to escape from the magnetic paste. For example, the magnetic paste is put on a pallet where the solvent is difficult to escape, and the convex portion 4a2 side of the first region 4a after molding is immersed together with the winding portion 6 to cure the magnetic paste in a state where the solvent is difficult to escape to the outside. You may let them. Also by such a method, the density of the voids in the second region 4b can be made higher than that in the first region 4a.
本実施形態では、第１領域４ａおよび第２領域４ｂに含まれるバインダ樹脂の含有量は、磁性粉末１００質量部に対して、１〜１１であることが好ましい。第１領域４ａおよび第２領域４ｂに含まれるバインダ樹脂の含有量は、同じでもよいが、異ならせても良い。第２領域４ｂにおいて、空隙の密度を上げる観点からは、第２領域４ｂに含まれるバインダ樹脂の含有量は、第１領域４ａに含まれるバインダ樹脂の含有量よりも多いことが好ましい。たとえば第２領域４ｂに含まれるバインダ樹脂の含有量は、第１領域４ａに含まれるバインダ樹脂の含有量の１１０〜２００％であることが好ましい。 In this embodiment, it is preferable that content of binder resin contained in the 1st area | region 4a and the 2nd area | region 4b is 1-11 with respect to 100 mass parts of magnetic powder. The content of the binder resin contained in the first region 4a and the second region 4b may be the same or different. In the second region 4b, the content of the binder resin contained in the second region 4b is preferably larger than the content of the binder resin contained in the first region 4a from the viewpoint of increasing the void density. For example, the content of the binder resin contained in the second region 4b is preferably 110 to 200% of the content of the binder resin contained in the first region 4a.
第１領域４ａおよび第２領域４ｂから成るコア体４には、磁性材としての磁性粉末が、コア体４の全体の質量に対して、９０〜９９質量％で含まれていることが好ましい。また、磁性粉末およびバインダ樹脂以外には、溶剤、可塑剤、滑材、酸化防止剤、難燃剤、熱安定剤などがコア体４の内部に含まれていても良い。 The core body 4 including the first region 4a and the second region 4b preferably contains 90 to 99% by mass of magnetic powder as a magnetic material with respect to the total mass of the core body 4. Besides the magnetic powder and the binder resin, a solvent, a plasticizer, a lubricant, an antioxidant, a flame retardant, a heat stabilizer, and the like may be included in the core body 4.
次に、図１および図２Ａに示すインダクタ素子２の製造方法について説明する。まず、たとえば金型のキャビティ内に、図３（ａ）に示す第１領域４ａを形成する。第１領域４ａには、山形の凸部４ａ２が形成してある。第１領域４ａは、磁性粉末とバインダ樹脂とを少なくとも含んでいる。第１領域４ａの形状は比較的に単純な形状なので、第１領域４ａを形成するための材料には、溶剤はほとんど含ませなくても良い。 Next, a method for manufacturing the inductor element 2 shown in FIGS. 1 and 2A will be described. First, for example, a first region 4a shown in FIG. 3A is formed in a cavity of a mold. In the first region 4a, a mountain-shaped convex portion 4a2 is formed. The first region 4a includes at least magnetic powder and a binder resin. Since the shape of the first region 4a is relatively simple, the material for forming the first region 4a may contain almost no solvent.
次に、図３（ｂ）に示すように、凸部４ａ２が空芯コイルとしての巻線部６の内部に入り込むように、巻線部６をベース部４ａ１の上に設置する。その際に、凸部４ａ２とベース部４ａ１との鈍角状の境界部に、巻線部６の下端内周部が自己整合的に位置合わせされる。凸部４ａ２は、裁頭錐体形状を有するために、巻線部６を第１領域４ａのベース部４ａ１上の中央部に位置決めして設置しやすい。 Next, as shown in FIG. 3B, the winding part 6 is installed on the base part 4a1 so that the convex part 4a2 enters the inside of the winding part 6 as an air-core coil. At that time, the inner peripheral portion of the lower end of the winding portion 6 is aligned in a self-aligned manner with the obtuse angled boundary portion between the convex portion 4a2 and the base portion 4a1. Since the convex portion 4a2 has a truncated cone shape, the winding portion 6 is easily positioned and installed at the central portion on the base portion 4a1 of the first region 4a.
その後に、図２Ａに示す第２領域４ｂを構成する磁性粉末とバインダ樹脂とを含む混合物（第１領域４ａよりも溶剤を多く含む）をキャビティ内に充填し、全体を加熱圧縮することで、図１および図２Ａに示すインダクタ素子２が得られる。加熱圧縮時の加熱温度は、好ましくは５０〜３００°Ｃであり、圧縮圧力は、好ましくは１〜４００Ｐａである。圧縮成形するための方法としては、金型を用いてもよいし、油圧や水圧を利用してもよい。巻線部６からのリード部６ｂの図示は、図３では省略してあるが、成形後には、リード部６ｂは成形体と共に取り出される。その後にコア体４の実装側外面４Ａに端子電極８がリード部６ｂに接続されるように、メッキまたは導電ペーストなどを用いて形成される。 After that, by filling the cavity with a mixture containing magnetic powder and binder resin constituting the second region 4b shown in FIG. 2A (containing more solvent than the first region 4a), the whole is heated and compressed. The inductor element 2 shown in FIGS. 1 and 2A is obtained. The heating temperature at the time of heat compression is preferably 50 to 300 ° C., and the compression pressure is preferably 1 to 400 Pa. As a method for compression molding, a mold may be used, or hydraulic pressure or water pressure may be used. Although illustration of the lead part 6b from the coil | winding part 6 is abbreviate | omitted in FIG. 3, after shaping | molding, the lead part 6b is taken out with a molded object. Thereafter, the terminal electrode 8 is formed on the mounting side outer surface 4A of the core body 4 by using plating or conductive paste so as to be connected to the lead portion 6b.
本実施形態では、磁性粉体は、金属磁性粒子であり、その粒子外周は、絶縁被膜してあることが好ましい。絶縁被膜としては、金属酸化物被膜、樹脂被膜などが例示される。磁性粉体の粒径は、好ましくは０．５〜５０μｍである。 In the present embodiment, the magnetic powder is a metal magnetic particle, and the outer periphery of the particle is preferably coated with an insulating film. Examples of the insulating film include a metal oxide film and a resin film. The particle size of the magnetic powder is preferably 0.5 to 50 μm.
本実施形態に係るインダクタ素子２では、反実装側外面４Ｂの少なくとも中央部分を含むコア部４の第２領域４ｂにおける空隙の密度が、実装側外面４Ａに比較して多くなっている。このため、コア部４の反実装側外面４Ｂでは、ベース部４ｂ１、凸部４ｂ２および外周部４ｂ３から成る空孔リッチ層が形成され、その空孔リッチ層が、応力緩和層およびクラック拡大防止層となり、クラックの発生を抑制すると共に、クラックの拡大を抑制する。 In the inductor element 2 according to the present embodiment, the density of voids in the second region 4b of the core portion 4 including at least the central portion of the non-mounting side outer surface 4B is larger than that of the mounting side outer surface 4A. For this reason, on the non-mounting side outer surface 4B of the core part 4, a hole rich layer including the base part 4b1, the convex part 4b2, and the outer peripheral part 4b3 is formed, and the hole rich layer includes the stress relaxation layer and the crack expansion prevention layer. Thus, the generation of cracks is suppressed and the expansion of cracks is suppressed.
本実施形態に係るインダクタ素子２は、特にスイッチング周波数が高い用途（たとえば携帯電話用）に用いられる場合に、巻線部６が発熱してコア部４の実装側外面４Ａと反実装側外面４Ｂとの間で熱膨張差が生じたとしても、反実装側外面４Ｂにクラックが生じ難くなる。また、第２領域４ｂにおいては、空隙により、クラックが連続して拡大することが抑制される。なお、従来では、巻線部６の自己発熱が大きい条件で使用されるコイル装置では、基板との熱膨張係数差などによる影響を受けて反実装側外面のコア部に、反実装側外面から巻線部６の内側内部に向けて広がるクラック１０（図２Ａ参照）が発生しやすい。また、クラック１０が連結して拡大しやすい。本実施形態では、巻線部６の自己発熱が大きい条件で使用されて、基板との熱膨張係数差などによる影響を受けたとしても、コア部４の反実装側外面４Ｂでは、空孔リッチ層が形成され、その空孔リッチ層が、応力緩和層およびクラック拡大防止層となり、クラック１０の発生を抑制すると共に、クラック１０の拡大を抑制する。 The inductor element 2 according to the present embodiment generates heat when the winding portion 6 generates heat, particularly when used for an application with a high switching frequency (for example, for a mobile phone), and the mounting surface outer surface 4A and the non-mounting surface 4B. Even if a difference in thermal expansion occurs between the outer surface 4B and the outer surface 4B on the non-mounting side. In the second region 4b, the cracks are prevented from expanding continuously due to the voids. Conventionally, in a coil device that is used under the condition that the self-heating of the winding part 6 is large, the core part on the non-mounting side outer surface is affected by the difference in thermal expansion coefficient with the substrate and the like from the anti-mounting side outer surface. Cracks 10 (see FIG. 2A) that spread toward the inside of the winding portion 6 are likely to occur. Further, the crack 10 is easily connected and expanded. In this embodiment, even if the winding part 6 is used under conditions where the self-heating is large and is affected by a difference in thermal expansion coefficient from the substrate, the outer surface 4B of the core part 4 is rich in holes. A layer is formed, and the pore-rich layer becomes a stress relaxation layer and a crack expansion prevention layer, and suppresses the generation of the crack 10 and the expansion of the crack 10.
第２実施形態
図２Ｂに示すように、本実施形態に係るインダクタ素子２ａは、第１領域４ａが、平板状のベース部４ａ１のみで構成してあり、凸部を有さない以外は、第１実施形態のインダクタ素子２と同様であり、重複する説明は省略する。本実施形態では、巻線部６の内側は、第２領域４ｂの内周部４ｂ２のみで充填されている。本実施形態のインダクタ素子２Ａは、第１実施形態のインダクタ素子２のコア部４における凸部４ａ２を有さない以外は、インダクタ素子２と同様な作用効果を奏する。
Second Embodiment As shown in FIG. 2B, the inductor element 2a according to the present embodiment includes a first region 4a composed only of a flat base portion 4a1, and the first element 4a, except that it does not have a convex portion. This is the same as the inductor element 2 of the first embodiment, and a duplicate description is omitted. In the present embodiment, the inside of the winding part 6 is filled only with the inner peripheral part 4b2 of the second region 4b. The inductor element 2A of this embodiment has the same effects as the inductor element 2 except that it does not have the convex part 4a2 in the core part 4 of the inductor element 2 of the first embodiment.
第３実施形態
図２Ｃに示すように、本実施形態に係るインダクタ素子２ｂは、第１領域４ａに形成してある凸部４ａ２の形状と高さが異なる以外は、第１実施形態のインダクタ素子２と同様であり、重複する説明は省略する。本実施形態では、凸部４ａ２は、裁頭錐体形状ではなく、柱形状を有し、その高さは、インダクタ素子２の凸部４ａ２に比較して低く設定してある。たとえば本実施形態では、凸部４ａ２の高さＺ１ａは、巻線部６の高さＺ３の０〜４０％の高さであることが好ましい。
Third Embodiment As shown in FIG. 2C, an inductor element 2b according to this embodiment is the same as the inductor element of the first embodiment except that the shape and height of the convex portion 4a2 formed in the first region 4a are different. This is the same as in FIG. In the present embodiment, the convex portion 4a2 has a columnar shape instead of a truncated cone shape, and its height is set lower than that of the convex portion 4a2 of the inductor element 2. For example, in the present embodiment, the height Z1a of the convex portion 4a2 is preferably 0 to 40% of the height Z3 of the winding portion 6.
本実施形態のインダクタ素子２ｂは、第１実施形態のインダクタ素子２のコア部４における凸部４ａ２と形状と高さが異なる凸部４ａ２を有する以外は、インダクタ素子２と同様な作用効果を奏する。 The inductor element 2b according to the present embodiment has the same operational effects as the inductor element 2 except that the inductor element 2b according to the first embodiment has a protrusion 4a2 having a shape and height different from those of the protrusion 4a2 in the core portion 4 of the inductor element 2. .
第４実施形態
図２Ｄに示すように、本実施形態に係るインダクタ素子２ｃは、第１領域４ａにも、ベース部４ａ１からＺ軸方向に沿って反実装側表面４Ｂに向けて突出する外周部４ａ３が形成してある以外は、第１実施形態のインダクタ素子２と同様であり、重複する説明は省略する。本実施形態では、第１領域４ａの外周部４ａ３が、４つの側面４Ｃの一部を構成し、その内側に、第２領域４ｂの外周部４ｂ３が位置する。外周部４ａ３のＺ軸方向の高さは、凸部４ａ２のＺ軸方向の高さと同程度であるが、異なっていても良い。本実施形態のインダクタ素子２ｃは、コア部４における第１領域４ａに外周部４ａ３が一体的に形成してある以外は、インダクタ素子２と同様な作用効果を奏する。
Fourth Embodiment As shown in FIG. 2D, the inductor element 2c according to the present embodiment has an outer peripheral portion that protrudes from the base portion 4a1 toward the counter-mounting surface 4B along the Z-axis direction in the first region 4a. Except that 4a3 is formed, it is the same as the inductor element 2 of the first embodiment, and redundant description is omitted. In the present embodiment, the outer peripheral portion 4a3 of the first region 4a constitutes a part of the four side surfaces 4C, and the outer peripheral portion 4b3 of the second region 4b is located inside thereof. The height of the outer peripheral portion 4a3 in the Z-axis direction is approximately the same as the height of the convex portion 4a2 in the Z-axis direction, but may be different. The inductor element 2c of the present embodiment has the same effects as the inductor element 2 except that the outer peripheral part 4a3 is integrally formed in the first region 4a of the core part 4.
第５実施形態
図２Ｅに示すように、本実施形態に係るインダクタ素子２ｄは、第１領域４ａと第２領域４ｂとの間に、第３領域４ｃが形成してある以外は、第１実施形態のインダクタ素子２と同様であり、重複する説明は省略する。本実施形態では、第２領域４ｂは、平板状のベース部４ｂ１のみで構成してあり、この第２領域４ｂと第１領域４ａとの間が、第３領域４ｃで充填されている。
Fifth Embodiment As shown in FIG. 2E, the inductor element 2d according to this embodiment is the first embodiment except that a third region 4c is formed between the first region 4a and the second region 4b. It is the same as that of the inductor element 2 of the embodiment, and redundant description is omitted. In the present embodiment, the second region 4b is configured only by the flat base portion 4b1, and the space between the second region 4b and the first region 4a is filled with the third region 4c.
第３領域４ｃは、巻線部６の内側で、第１領域４ａと巻線部６との間の隙間を埋めると共に、第１領域４ａと第２領域４ｂとの間の隙間を埋める内周部４ｃ２と、巻線部６の半径方向の外側に位置する外周部４ｃ３とを有し、ワイヤ６ａ間の隙間にも充填してあり、巻線部６の内側および外側に連続して存在している。第３領域４ｃが、第２領域４ｂの空隙密度よりも低い空隙密度の場合には、相対的に磁性粉末が多くなり、磁気特性が向上する。第３領域４ｃは、巻線部６を構成するワイヤ６ａの相互間にも充填される部分なので、ワイヤ６ａの相互間に入り込み易い材料組成であることが好ましい。第３領域４ｃが、第１領域４ａの空隙密度よりも高い空隙密度を有する場合には、第３領域４ｃも第１領域４ａに比較して空孔リッチ層となり、応力緩和特性が向上する。また、空孔リッチ層は、クラック拡大防止層となり、クラック１０の拡大を抑制する。 The third area 4c fills the gap between the first area 4a and the winding part 6 inside the winding part 6, and also fills the gap between the first area 4a and the second area 4b. Part 4c2 and outer peripheral part 4c3 located on the outer side of winding part 6 in the radial direction, the gap between wires 6a is also filled, and is continuously present on the inside and outside of winding part 6. ing. When the third region 4c has a void density lower than that of the second region 4b, the magnetic powder is relatively increased, and the magnetic characteristics are improved. Since the third region 4c is a portion that is also filled between the wires 6a constituting the winding portion 6, it is preferable that the third region 4c has a material composition that easily enters between the wires 6a. When the third region 4c has a void density higher than that of the first region 4a, the third region 4c also becomes a hole-rich layer as compared with the first region 4a, and the stress relaxation characteristics are improved. Further, the hole-rich layer becomes a crack expansion preventing layer and suppresses the expansion of the crack 10.
第６実施形態
図２Ｆに示すように、本実施形態に係るインダクタ素子２ｅは、第１領域４ａと第２領域４ｂとの間に、第３領域４ｃが形成してある以外は、図２Ｂに示す第２実施形態のインダクタ素子２ａと同様であり、重複する説明は省略する。本実施形態では、第２領域４ｂは、平板状のベース部４ｂ１のみで構成してあり、この第２領域４ｂと第１領域４ａとの間が、第３領域４ｃで充填されている。
Sixth Embodiment As shown in FIG. 2F, the inductor element 2e according to this embodiment is similar to FIG. 2B except that a third region 4c is formed between the first region 4a and the second region 4b. This is the same as the inductor element 2a of the second embodiment shown, and redundant description is omitted. In the present embodiment, the second region 4b is configured only by the flat base portion 4b1, and the space between the second region 4b and the first region 4a is filled with the third region 4c.
第３領域４ｃは、巻線部６の内側の隙間を埋める内周部４ｃ２と、巻線部６の半径方向の外側に位置する外周部４ｃ３とを有し、ワイヤ６ａ間の隙間にも充填してあり、巻線部６の内側および外側に連続して存在している。第３領域４ｃが、第２領域４ｂの空隙密度よりも低い空隙密度の場合には、相対的に磁性粉末が多くなり、磁気特性が向上する。第３領域４ｃは、巻線部６を構成するワイヤ６ａの相互間にも充填される部分なので、ワイヤ６ａの相互間に入り込み易い材料組成であることが好ましい。第３領域４ｃが、第１領域４ａの空隙密度よりも高い空隙密度を有する場合には、第３領域４ｃも第１領域４ａに比較して空孔リッチ層となり、応力緩和特性が向上する。また、空孔リッチ層は、クラック拡大防止層となり、クラック１０の拡大を抑制する。 The third region 4c has an inner peripheral portion 4c2 that fills the gap inside the winding portion 6 and an outer peripheral portion 4c3 that is located on the outer side in the radial direction of the winding portion 6, and also fills the gap between the wires 6a. It exists continuously inside and outside the winding part 6. When the third region 4c has a void density lower than that of the second region 4b, the magnetic powder is relatively increased, and the magnetic characteristics are improved. Since the third region 4c is a portion that is also filled between the wires 6a constituting the winding portion 6, it is preferable that the third region 4c has a material composition that easily enters between the wires 6a. When the third region 4c has a void density higher than that of the first region 4a, the third region 4c also becomes a hole-rich layer as compared with the first region 4a, and the stress relaxation characteristics are improved. Further, the hole-rich layer becomes a crack expansion preventing layer and suppresses the expansion of the crack 10.
第７実施形態
図２Ｇに示すように、本実施形態に係るインダクタ素子２ｆは、第１領域４ａと第２領域４ｂとの間に、第３領域４ｃが形成してある以外は、図２Ｃに示す第３実施形態のインダクタ素子２ｂと同様であり、重複する説明は省略する。本実施形態では、第２領域４ｂは、平板状のベース部４ｂ１のみで構成してあり、この第２領域４ｂと第１領域４ａとの間が、第３領域４ｃで充填されている。
Second Embodiment As shown in FIG. 2G, the inductor element 2f according to the present embodiment is similar to FIG. 2C except that a third region 4c is formed between the first region 4a and the second region 4b. This is the same as the inductor element 2b of the third embodiment shown, and redundant description is omitted. In the present embodiment, the second region 4b is configured only by the flat base portion 4b1, and the space between the second region 4b and the first region 4a is filled with the third region 4c.
第３領域４ｃは、巻線部６の内側の隙間を埋める内周部４ｃ２と、巻線部６の半径方向の外側に位置する外周部４ｃ３とを有し、ワイヤ６ａ間の隙間にも充填してあり、巻線部６の内側および外側に連続して存在している。第３領域４ｃが、第２領域４ｂの空隙密度よりも低い空隙密度の場合には、相対的に磁性粉末が多くなり、磁気特性が向上する。第３領域４ｃは、巻線部６を構成するワイヤ６ａの相互間にも充填される部分なので、ワイヤ６ａの相互間に入り込み易い材料組成であることが好ましい。第３領域４ｃが、第１領域４ａの空隙密度よりも高い空隙密度を有する場合には、第３領域４ｃも第１領域４ａに比較して空孔リッチ層となり、応力緩和特性が向上する。また、空孔リッチ層は、クラック拡大防止層となり、クラック１０の拡大を抑制する。 The third region 4c has an inner peripheral portion 4c2 that fills the gap inside the winding portion 6 and an outer peripheral portion 4c3 that is located on the outer side in the radial direction of the winding portion 6, and also fills the gap between the wires 6a. It exists continuously inside and outside the winding part 6. When the third region 4c has a void density lower than that of the second region 4b, the magnetic powder is relatively increased, and the magnetic characteristics are improved. Since the third region 4c is a portion that is also filled between the wires 6a constituting the winding portion 6, it is preferable that the third region 4c has a material composition that easily enters between the wires 6a. When the third region 4c has a void density higher than that of the first region 4a, the third region 4c also becomes a hole-rich layer as compared with the first region 4a, and the stress relaxation characteristics are improved. Further, the hole-rich layer becomes a crack expansion preventing layer and suppresses the expansion of the crack 10.
なお、本発明は、上述した実施形態に限定されるものではなく、本発明の範囲内で種々に改変することができる。 The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention.
たとえば、上述した実施形態では、コア部４は、第１領域４ａと第２領域４ｂとで構成されるか、それらの間に第３領域４ｃが配置してある。しかしながら、コア部４の第３領域４ｃは、単一の領域である必要はなく、空孔密度が異なる複数の領域に分割されていてもよい。 For example, in the above-described embodiment, the core portion 4 is configured by the first region 4a and the second region 4b, or the third region 4c is disposed between them. However, the third region 4c of the core part 4 does not have to be a single region, and may be divided into a plurality of regions having different hole densities.
また、上述した実施形態では、第１領域４ａを充填して形成した後に、巻線部６を取り付け、第２領域４ｂを充填して形成してあるが、その逆でもよい。すなわち、Ｚ軸方向に上下を逆にして、第２領域４ｂを充填して形成した後に、巻線部６を取り付け、第１領域４ａを充填して形成してもよい。その場合には、第２領域４ｂには、第１領域４ａの中央部に形成してある凸部４ａ２と同様な凸部を形成し、巻線部６を位置決めするようにしてもよい。 In the above-described embodiment, the first region 4a is filled and formed, and then the winding portion 6 is attached and the second region 4b is filled. In other words, it may be formed by filling the second region 4b upside down in the Z-axis direction and then attaching the winding portion 6 and filling the first region 4a. In that case, a convex portion similar to the convex portion 4a2 formed in the central portion of the first region 4a may be formed in the second region 4b, and the winding portion 6 may be positioned.
さらに、上述した実施形態では、巻線部６のリード部６ｂを実装側外面４Ａに向けて直接に引き出しているが、それに限らず、側面４Ｃに向けてコア部４の外側に引き出して電極側部８ａに接続しても良い。あるいは、リード部６ｂは、側面４Ｃに向けてコア部４の外側に引き出した後に、実装側外面４Ａにまで引き延ばし、端子電極８に接続してもよい。 Further, in the above-described embodiment, the lead portion 6b of the winding portion 6 is directly drawn out toward the mounting side outer surface 4A, but is not limited thereto, and is drawn out toward the side surface 4C toward the outside of the core portion 4 to the electrode side. You may connect to the part 8a. Alternatively, the lead portion 6b may be extended to the mounting-side outer surface 4A after being pulled out of the core portion 4 toward the side surface 4C and connected to the terminal electrode 8.
さらにまた、上述した実施形態では、巻線部６の内径および外径が、巻軸方向であるＺ軸方向に沿って均一な巻線部６を用いているが、巻線部６の具体的な形状は、特に限定されない。たとえば図２Ａに示す山形の凸部４ａ２の外周面に沿って、Ｚ軸方向の上部に行くほど内径および外径が小さくなるような裁頭推体状の巻線部６であってもよく、その他の形状でもよい。 Furthermore, in the above-described embodiment, the inner and outer diameters of the winding portion 6 are uniform in the Z-axis direction, which is the winding axis direction. The shape is not particularly limited. For example, the winding portion 6 may be a truncated protuberance that has an inner diameter and an outer diameter that decrease toward the top in the Z-axis direction along the outer peripheral surface of the mountain-shaped convex portion 4a2 illustrated in FIG. 2A. Other shapes may be used.
２，２ａ〜２ｆ… インダクタ素子（コイル装置）
４… コア部
４ａ… 第１領域
４ａ１… ベース部
４ａ２… 凸部
４ａ３… 外周部
４ｂ… 第２領域
４ｂ１… ベース部
４ｂ２… 内周部
４ｂ３… 外周部
４ｃ… 第３領域
４ｃ２… 内周部
４ｃ３… 外周部
４Ａ… 実装側外面
４Ｂ… 反実装側外面
４Ｃ… 側面
６… 巻線部
６ａ… ワイヤ
６ｂ… リード部
８… 端子電極
８ａ… 電極側部
１０… クラック
2, 2a-2f ... Inductor element (coil device)
4 ... Core part 4a ... 1st area | region 4a1 ... Base part 4a2 ... Convex part 4a3 ... Outer peripheral part 4b ... 2nd area | region 4b1 ... Base part 4b2 ... Inner peripheral part 4b3 ... Outer peripheral part 4c ... 3rd area | region 4c2 ... Inner peripheral part 4c3 ... Outer peripheral part 4A ... Mounting side outer surface 4B ... Non-mounting side outer surface 4C ... Side face 6 ... Winding part 6a ... Wire 6b ... Lead part 8 ... Terminal electrode 8a ... Electrode side part 10 ... Crack
Claims (5)
磁性材と樹脂とを含有しており、前記巻線部の内部も含めて前記巻線部の全体を覆うコア部と、
前記巻線部の巻軸方向の一端に位置する前記コア部の実装側外面に装着してある端子電極と、を有するコイル装置であって、
前記実装側外面の少なくとも中央部分を含む前記コア部の第１領域に含まれる空孔の密度よりも、前記実装側外面と反対側に位置する前記コア部の反実装側外面の少なくとも中央部分を含む前記コア部の第２領域に含まれる空孔の密度が高いことを特徴とするコイル装置。 A winding portion in which the wire is wound in a coil shape;
Containing a magnetic material and a resin, and a core portion covering the entire winding portion including the inside of the winding portion;
A terminal electrode mounted on the mounting side outer surface of the core part located at one end in the winding axis direction of the winding part,
At least the central portion of the outer surface of the core portion that is opposite to the mounting side outer surface than the density of the holes included in the first region of the core portion including at least the central portion of the outer surface of the mounting side. The coil device, wherein the density of the holes included in the second region of the core portion is high.
The coil device according to any one of claims 1 to 4, wherein the first region has a convex portion that protrudes toward the second region inside the winding portion.
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| JP2021057482A (en) * | 2019-09-30 | 2021-04-08 | 株式会社村田製作所 | Coil component |
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| JPH0714717A (en) * | 1993-06-23 | 1995-01-17 | Taiyo Yuden Co Ltd | Electronic component such as inductor and production thereof |
| JP2000252126A (en) * | 1999-03-04 | 2000-09-14 | Murata Mfg Co Ltd | Laminated inductor and manufacture thereof |
| JP2012234867A (en) * | 2011-04-28 | 2012-11-29 | Taiyo Yuden Co Ltd | Coil component |
| JP2013045995A (en) * | 2011-08-26 | 2013-03-04 | Panasonic Corp | Multilayer inductor |
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Patent Citations (5)
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| JPH0669039A (en) * | 1992-08-18 | 1994-03-11 | Taiyo Yuden Co Ltd | Laminated ceramic electronic component and its manufacture |
| JPH0714717A (en) * | 1993-06-23 | 1995-01-17 | Taiyo Yuden Co Ltd | Electronic component such as inductor and production thereof |
| JP2000252126A (en) * | 1999-03-04 | 2000-09-14 | Murata Mfg Co Ltd | Laminated inductor and manufacture thereof |
| JP2012234867A (en) * | 2011-04-28 | 2012-11-29 | Taiyo Yuden Co Ltd | Coil component |
| JP2013045995A (en) * | 2011-08-26 | 2013-03-04 | Panasonic Corp | Multilayer inductor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2021057482A (en) * | 2019-09-30 | 2021-04-08 | 株式会社村田製作所 | Coil component |
| JP7371423B2 (en) | 2019-09-30 | 2023-10-31 | 株式会社村田製作所 | coil parts |
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