JP2017183302A - Light-emitting device - Google Patents

Light-emitting device Download PDF

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JP2017183302A
JP2017183302A JP2016062948A JP2016062948A JP2017183302A JP 2017183302 A JP2017183302 A JP 2017183302A JP 2016062948 A JP2016062948 A JP 2016062948A JP 2016062948 A JP2016062948 A JP 2016062948A JP 2017183302 A JP2017183302 A JP 2017183302A
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wavelength conversion
conversion member
metal frame
emitting device
light
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JP6754206B2 (en
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原　博昭
Hiroaki Hara
博昭 原
紀彦 小林
Norihiko Kobayashi
紀彦 小林
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Citizen Electronics Co Ltd
Citizen Watch Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To solve such a problem of a light-emitting device where a wavelength conversion member is caulked to a resin frame that there is difficulty in heat dissipation from the wavelength conversion member, or adhesion to a translucent member such as a lens placed on the wavelength conversion member.SOLUTION: A notch is formed in the upper surface peripheral edge of a wavelength conversion member placed on an LED element, and after placing this wavelength conversion member on a step part formed in a metal frame, the notch of the metal frame is caulked. In that case, the height from the lower surface of a substrate to the upper surface of the metal frame is made the same as the height from the lower surface of the substrate to the upper surface of the wavelength conversion member.SELECTED DRAWING: Figure 2

Description

本発明は、発光素子としてＬＥＤ素子を用いた発光装置に関する。   The present invention relates to a light emitting device using an LED element as a light emitting element.

従来、ＬＥＤ素子と蛍光体を備える発光装置の課題として、ＬＥＤ素子の放熱性改善が挙げられてきた。   Conventionally, improvement of the heat dissipation of an LED element has been cited as a problem of a light emitting device including an LED element and a phosphor.

このような従来の課題を解決する発光装置の構造の一例として、下記特許文献１に記載されたものが挙げられる。特許文献１に記載の従来の発光装置は、樹脂製のパッケージにインサートモールドされた電極部材であるリードフレームを備え、リードフレームの前面（代表図面の上面側）にＬＥＤ素子が実装されている。リードフレームはパッケージの外面まで延長され、このリードフレームから熱を外部へ逃がすことによってＬＥＤ素子からの放熱性を改善している。また、蛍光体を含有した波長変換部材である蓋部材は、ＬＥＤ素子の上方において、樹脂を成型したパッケージの開口部に配置され、樹脂によってかしめ固定されている。   As an example of the structure of a light emitting device that solves such a conventional problem, one described in Patent Document 1 below can be cited. The conventional light-emitting device described in Patent Document 1 includes a lead frame that is an electrode member that is insert-molded in a resin package, and an LED element is mounted on the front surface (upper surface side of the representative drawing) of the lead frame. The lead frame is extended to the outer surface of the package, and heat dissipation from the LED element is improved by releasing heat from the lead frame to the outside. Further, a lid member, which is a wavelength conversion member containing a phosphor, is disposed in an opening portion of a package in which a resin is molded above the LED element, and is fixed by caulking with the resin.

特開２００４−３３５７４０号公報（４頁、図１）JP 2004-335740 A (page 4, FIG. 1)

しかしながら、引用文献１に記載の従来の発光装置では、ＬＥＤ素子の輝度の増加によって波長変換部材の励起熱も増加した場合、波長変換部材の固定方法が熱伝導性の低い樹脂によるかしめ固定であることから、波長変換部材は励起熱を逃がすことができずに高温化する。このようにして、引用文献１に記載の波長変換部材は、光変換効率が低下するという問題があった。   However, in the conventional light emitting device described in the cited document 1, when the excitation heat of the wavelength conversion member is also increased due to the increase in the luminance of the LED element, the wavelength conversion member is fixed by caulking with a resin having low thermal conductivity. For this reason, the wavelength conversion member is heated up without being able to release the excitation heat. Thus, the wavelength conversion member described in the cited document 1 has a problem that the light conversion efficiency is lowered.

また、従来の発光装置は、波長変換部材をかしめ固定した際に、かしめた領域に樹脂の凸部が形成される。これによって、波長変換部材上にレンズなどの透光性部材を密接して配置しようとすると、かしめた領域に形成された凸部の形状も考慮した複雑な構造の透光性部材を作成せねばならないという問題もあった。   Further, in the conventional light emitting device, when the wavelength conversion member is caulked and fixed, a convex portion of resin is formed in the caulked region. Accordingly, when a light-transmitting member such as a lens is placed in close contact with the wavelength conversion member, a light-transmitting member having a complicated structure that takes into account the shape of the convex portion formed in the crimped region must be created. There was also a problem of not becoming.

そこで本発明の目的は、波長変換部材がかしめ固定されている発光装置において、波長変換部材からの放熱を積極的に行うと共に、波長変換部材の上面に、下面が平面形状という単純な構造の透光性部材を密接して配置できる発光装置を提供することである。   Accordingly, an object of the present invention is to positively dissipate heat from the wavelength conversion member in a light emitting device in which the wavelength conversion member is fixed by caulking, and to transmit light having a simple structure in which the lower surface is a planar shape on the upper surface of the wavelength conversion member. It is an object of the present invention to provide a light-emitting device in which a light member can be closely arranged.

本発明の発光装置は、上記目的を達成するため、以下の構成を採用する。   In order to achieve the above object, the light emitting device of the present invention employs the following configuration.

本発明の発光装置は、基板上に実装されたＬＥＤ素子と、ＬＥＤ素子を取り囲むように配置された金属枠体と、金属枠体の内側に形成された段差部と、段差部に配置された平板上の波長変換部材と、を備え、上記波長変換部材は、上面端部に切欠部を有し、上記金属枠体は、切欠部に対応する箇所に突出部を有し、基板の下面から波長変換部材の上面までの高さと、基板の下面から金属枠体の上面までの高さが同一となるように、この突出部によってかしめ固定されてなることを特徴とする。   The light-emitting device of the present invention includes an LED element mounted on a substrate, a metal frame disposed so as to surround the LED element, a stepped portion formed inside the metal frame, and a stepped portion. A wavelength conversion member on a flat plate, wherein the wavelength conversion member has a notch at the upper surface end, and the metal frame has a protrusion at a location corresponding to the notch, from the lower surface of the substrate. The protrusion is fixed by caulking so that the height from the lower surface of the substrate to the upper surface of the metal frame is the same as the height from the upper surface of the wavelength conversion member.

また、前記切欠部は、斜面形状を有するとよい。   Moreover, the said notch part is good to have a slope shape.

また、下面が平面状であって、金属枠体及び波長変換部材の上面に密接して配置される透光性部材を備えてもよい。   Moreover, you may provide the translucent member by which a lower surface is planar shape and arrange | positioned closely to the upper surface of a metal frame and a wavelength conversion member.

また、透光性部材は、レンズであるとよい。   The translucent member may be a lens.

波長変換部材が、熱伝導性の高い金属枠に直接かしめ固定されることよって、波長変換部材からの放熱性が向上する。これによって、波長変換部材の光変換効率が増加するという効果がある。
また、基板の下面から波長変換部材の上面までの高さと、基板の下面から金属枠体の上面までの高さを同一とすることで、波長変換部材及び金属枠上に、下面が平面状という単純な形状の透光性部材を容易に密接して配置できるという効果もある。 Since the wavelength conversion member is directly caulked and fixed to the metal frame having high thermal conductivity, heat dissipation from the wavelength conversion member is improved. This has the effect of increasing the light conversion efficiency of the wavelength conversion member.
In addition, by making the height from the lower surface of the substrate to the upper surface of the wavelength conversion member the same as the height from the lower surface of the substrate to the upper surface of the metal frame, the lower surface is said to be planar on the wavelength conversion member and the metal frame There is also an effect that a light-transmitting member having a simple shape can be easily and closely arranged.

本発明の発光装置の実施形態の要部斜視図である。It is a principal part perspective view of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施形態の断面図である。It is sectional drawing of embodiment of the light-emitting device of this invention. 本発明の発光装置の実施形態のレンズを備えた断面図である。It is sectional drawing provided with the lens of embodiment of the light-emitting device of this invention. 本発明の各実施例における、変形前の金属枠とその内部における波長変換部材の配置を示し、（ａ）は斜視図、（ｂ）は断面図である。In each Example of this invention, the arrangement | positioning of the metal frame before a deformation | transformation and the wavelength conversion member in the inside is shown, (a) is a perspective view, (b) is sectional drawing. 金属枠を変形加工する金型の上型の一例を示し、（ａ）はその下面側の斜視図、（ｂ）は上面側の斜視図である。An example of the upper mold | type of the metal mold | die which deform | transforms a metal frame is shown, (a) is the perspective view of the lower surface side, (b) is a perspective view of the upper surface side. 金属枠の変形前後の状態を上型と共に示し、（ａ）は変形直前の斜視図、（ｂ）はその断面図、（ｃ）は変形完了後の斜視図、（ｄ）はその断面図である。The state before and after the deformation of the metal frame is shown together with the upper mold, (a) is a perspective view immediately before the deformation, (b) is a sectional view thereof, (c) is a perspective view after the deformation is completed, and (d) is a sectional view thereof. is there.

以下、本発明の実施形態について、図面を用いて説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings.

＜構造の説明 図１〜図３＞
本実施形態に係る発光装置の外観構造について、図１、図２を用いて説明する。図１は、金属枠３と波長変換部材４のみを図示した要部斜視図であり、その他の部材については記載を省略している。図２は、本実施形態に係る発光装置の断面図である。 <Description of Structure FIGS. 1 to 3>
The external structure of the light emitting device according to this embodiment will be described with reference to FIGS. FIG. 1 is a perspective view of a main part illustrating only the metal frame 3 and the wavelength conversion member 4, and description of other members is omitted. FIG. 2 is a cross-sectional view of the light emitting device according to this embodiment.

図１、図２に示す様に、本実施形態において波長変換部材４は、発光装置１０の上面に配置されており、金属枠３によって周縁部を全て固定されている。基板２には、金属またはセラミック材料を主体として電極面が露出して形成されており、複数のＬＥＤ素子１と図示しない電極面とが電気的に接合される。ここで、ＬＥＤ素子１の発光した際に発せられる熱は、基板２を経由して周囲へ放散する構成としているが、この構成に限定されず、例えば特許文献１記載の従来例、又はその他の記載しない従来例のようであってもよい。   As shown in FIGS. 1 and 2, in the present embodiment, the wavelength conversion member 4 is disposed on the upper surface of the light emitting device 10, and all the peripheral portions are fixed by the metal frame 3. The substrate 2 is formed with a metal or ceramic material as a main component with the electrode surface exposed, and the plurality of LED elements 1 and electrode surfaces (not shown) are electrically joined. Here, the heat generated when the LED element 1 emits light is configured to dissipate to the surroundings via the substrate 2, but is not limited to this configuration. For example, the conventional example described in Patent Document 1 or other It may be a conventional example not described.

金属枠３は、基板２の上に配置されており、複数のＬＥＤ素子１を収容するように周囲を囲んでいる。金属枠３は、比較的容易に変形し可塑性が高く熱伝導性の優れた金属材料、例えばアルミニウムや銅のような素材より形成される。金属枠３は、内側領域に段差部３ａを有し、この段差部３ａの上面には、波長変換部材４の下面の周縁部が載置されている。   The metal frame 3 is disposed on the substrate 2 and surrounds the periphery so as to accommodate the plurality of LED elements 1. The metal frame 3 is formed from a metal material, such as aluminum or copper, which is relatively easily deformed and has high plasticity and excellent thermal conductivity. The metal frame 3 has a stepped portion 3a in the inner region, and the peripheral portion of the lower surface of the wavelength conversion member 4 is placed on the upper surface of the stepped portion 3a.

波長変換部材４は、透明な基材内に蛍光体が分散配置された平板状の部材である。その平面形状は本例では正方形であって厚板状である。基材の材質は、透光性、熱伝導性及び耐熱性の観点から、透光性樹脂よりも透光性セラミックスやガラス材より成ることが好ま
しい。この蛍光体は、青色光や紫外光を発するＬＥＤ素子１の光によって励起され、ＬＥＤ素子１と異なる波長の光を発する。これにより、ＬＥＤ素子の光や、複数の蛍光体の色を混合させることで、例えば白色光化するなどＬＥＤ素子１の本来の発光色と異なる演色効果を有することができる。 The wavelength conversion member 4 is a flat plate member in which phosphors are dispersedly arranged in a transparent base material. In this example, the planar shape is a square and a thick plate. The material of the base material is preferably made of translucent ceramics or glass material rather than translucent resin from the viewpoint of translucency, thermal conductivity and heat resistance. This phosphor is excited by the light of the LED element 1 that emits blue light or ultraviolet light, and emits light having a wavelength different from that of the LED element 1. Thereby, by mixing the light of the LED element and the colors of a plurality of phosphors, it is possible to have a color rendering effect different from the original emission color of the LED element 1 such as, for example, whitening.

また、波長変換部４は、周縁端部に切欠部４ａを備える。本実施形態にける切欠部４ａは、図２に示すように波長変換部材４の側面が斜面形状となるように形成されている。この切欠部４ａは、波長変換部材の上面と下面を除く４つ側面に形成されており、これらによって、波長変換部材４の形状は、下面から上面へ向かって断面積が漸減する錘台形状となっている。切欠部４ａは、金属枠３の一部の金属に力を加えることで、その金属を塑性変形させ金属枠３の内側に突出して寄せられた変形部３ｄによってかしめ固定される。このようにして、金属枠３の段差部３ａに波長変換部材４は固定される。   Moreover, the wavelength conversion part 4 is provided with the notch part 4a in the peripheral edge part. As shown in FIG. 2, the cutout 4 a in the present embodiment is formed so that the side surface of the wavelength conversion member 4 has a slope shape. The notches 4a are formed on the four side surfaces excluding the upper surface and the lower surface of the wavelength conversion member, whereby the shape of the wavelength conversion member 4 is a frustum shape whose cross-sectional area gradually decreases from the lower surface to the upper surface. It has become. The notch 4 a is caulked and fixed by a deformed portion 3 d that is applied to a part of the metal frame 3 to plastically deform the metal and project toward the inside of the metal frame 3. In this way, the wavelength conversion member 4 is fixed to the step portion 3a of the metal frame 3.

また、金属枠３の金属が、波長変換部の切欠部４ａのみをかしめて波長変換部材４の上面にまで金属が到達しないようにすることで、基板２の下面から波長変換部材４の上面までの高さと、基板２の下面から金属枠３の上面までの高さを略同一とすることができる。   Further, the metal of the metal frame 3 caulks only the notch portion 4 a of the wavelength conversion portion so that the metal does not reach the upper surface of the wavelength conversion member 4, so that the lower surface of the substrate 2 to the upper surface of the wavelength conversion member 4. And the height from the lower surface of the substrate 2 to the upper surface of the metal frame 3 can be made substantially the same.

この様な構成とすることで、図３に示すように、下面が平面形状である前面透光性部材５を、金属枠３及び波長変換部材４の上面に配置する際に、金属枠３及び波長変換部材４と前面透光性部材５は密接して配置することができる。なお、本実施形態において前面透光性部材５に、下面が平面形状を有する凸レンズを用いたが、下面が平面形状の光学部材であれば、他の構成（板状部材を含むプリズム）を用いても良い。   With such a configuration, as shown in FIG. 3, when the front translucent member 5 whose lower surface is planar is disposed on the upper surfaces of the metal frame 3 and the wavelength conversion member 4, the metal frame 3 and The wavelength conversion member 4 and the front translucent member 5 can be disposed in close contact with each other. In the present embodiment, a convex lens having a flat bottom surface is used for the front translucent member 5, but other configurations (prisms including a plate-like member) are used as long as the bottom surface is a planar optical member. May be.

＜実施形態の作用＞
波長変換部材４より発せられた励起熱は、熱伝導によって切欠部４ａから金属枠３に接着剤などの樹脂を介さず直接伝わるため、効果的に外部に放熱される。また、金属枠３の上面と波長変換部材４の上面の高さが略同一となっていることから、金属枠３及び波長変換部材４上に、下面を平面形状とした、構造が単純な前面透光性部材５を、密接して配置することが可能となる。 <Operation of Embodiment>
Since the excitation heat generated from the wavelength conversion member 4 is directly transmitted from the cutout portion 4a to the metal frame 3 through the heat conduction without the resin such as an adhesive, the heat is effectively radiated to the outside. In addition, since the height of the upper surface of the metal frame 3 and the upper surface of the wavelength conversion member 4 are substantially the same, the front surface of the metal frame 3 and the wavelength conversion member 4 having a simple bottom surface with a flat bottom surface. It becomes possible to arrange the translucent member 5 closely.

＜実施形態の効果＞
この様にして、本実施例の構成によれば、波長変換部材４より発せられた励起熱を、効果的に金属枠３へ放熱し、それにより、蛍光体の温度消光が減り、波長変換部材４の発光効率を高くすることができる。また、下面が平面形状である前面透光性部材５を、金属枠３及び波長変換部材４と密接して配置することによって、波長変換部材４から前面透光性部材５を経由し金属枠３へ至るという、新たな放熱経路を形成することができる。これにより、励起熱をさらに放熱できる為、波長変換部材４の発光効率は更に高くなる。また、前面透光性部材５が本実施形態のような凸レンズなどの光学部材であるならば、前面透光性部材の下面を単純な平面形状とできることから光学設計が容易となり、結果として所望の光学効果を得やすくなる。 <Effect of embodiment>
Thus, according to the configuration of the present embodiment, the excitation heat generated from the wavelength conversion member 4 is effectively radiated to the metal frame 3, thereby reducing the temperature quenching of the phosphor, and the wavelength conversion member. The luminous efficiency of 4 can be increased. Further, by arranging the front translucent member 5 having a planar lower surface in close contact with the metal frame 3 and the wavelength conversion member 4, the metal frame 3 passes through the front translucent member 5 from the wavelength conversion member 4. A new heat dissipation path can be formed. Thereby, since the excitation heat can be further dissipated, the light emission efficiency of the wavelength conversion member 4 is further increased. Further, if the front translucent member 5 is an optical member such as a convex lens as in the present embodiment, the lower surface of the front translucent member can be formed into a simple planar shape, so that optical design is facilitated, resulting in a desired It becomes easy to obtain an optical effect.

次に、本実施形態に係る発光装置の製造方法について説明する。
発光装置の製造方法は、工程１：基板にＬＥＤ素子と枠体を配置する工程、と、工程２：枠体段段差部に波長変換部材を載置する工程、と、工程３：波長変換部材をかしめ固定する工程、とによって構成される。このうち、工程１に関しては、従来知られているどのような方法を用いても良く、本発明の要部ではないため説明を省略する。以下、工程２、工程３より金属枠３に波長変換部材４をかしめ固定する具体的な製造方法について説明する。 Next, a method for manufacturing the light emitting device according to this embodiment will be described.
The manufacturing method of a light-emitting device includes: Step 1: a step of placing an LED element and a frame on a substrate; Step 2: a step of placing a wavelength conversion member on a step portion of the frame body; and Step 3: a wavelength conversion member. And caulking and fixing. Among these, regarding the process 1, any conventionally known method may be used, and since it is not a main part of the present invention, description thereof is omitted. Hereinafter, the specific manufacturing method which crimps and fixes the wavelength conversion member 4 to the metal frame 3 from the process 2 and the process 3 is demonstrated.

＜工程２：枠体段段差部に波長変換部材を載置する工程 図４＞
図４は、かしめ固定される前の金属枠１３と波長変形部材４との配置関係を示す図で、（ａ）は斜視図、（ｂ）は断面図である。かしめ固定される前の金属枠１３は、その段差部３ａの外側に直立部１３ｂを備える。波長変換部材４は、その切欠部４ａの斜面形状が上向きになるように、段差部３ａ上に落とし込んで載置される。段差部３ａから直立部１３ｂの上面までの高さは、波長変換部材４の上面までの高さよりも大きく設定されている。また各辺の直立部１３ｂの上隅の部分は切欠部１３ｃを設けて斜面状となし、金属枠３の４隅には金型係合部３ｅを設ける。 <Step 2: Step of Placing Wavelength Conversion Member on Frame Step Step> FIG.
4A and 4B are views showing the positional relationship between the metal frame 13 and the wavelength deforming member 4 before caulking, in which FIG. 4A is a perspective view and FIG. 4B is a cross-sectional view. The metal frame 13 before being caulked and fixed includes an upright portion 13b outside the stepped portion 3a. The wavelength conversion member 4 is dropped and placed on the stepped portion 3a so that the slope shape of the cutout portion 4a faces upward. The height from the stepped portion 3 a to the upper surface of the upright portion 13 b is set to be larger than the height from the upper surface of the wavelength conversion member 4. Further, the upper corner portion of each side of the upright portion 13 b is provided with a notch portion 13 c to form a slope, and the metal frame 3 is provided with a mold engaging portion 3 e at the four corners.

＜金型 図５＞
次に、かしめ固定を行うための金型について説明する。
図５は、かしめ固定される前の金属枠１３の直立部１３ｂをかしめて、図１〜図３に記載のように金属枠３に波長変換部材４を固定するために用いる金型の上型６の形態の一例を示す図である。（ａ）は上型６の下面の形状を見せるため上下を反転した下面側の斜視図、（ｂ）は本来の向きにした上面側の斜視図である。６ａは上面部、６ｂは側面部、６ｃは下面側の天井部、６ｄは突出部、６ｅは斜面部である。 <Mold Figure 5>
Next, a mold for performing caulking and fixing will be described.
FIG. 5 shows an upper mold of a mold used for fixing the wavelength conversion member 4 to the metal frame 3 by caulking the upright portion 13b of the metal frame 13 before being caulked and fixed. It is a figure which shows an example of the form of 6. (A) is the perspective view of the lower surface side turned upside down in order to show the shape of the lower surface of the upper mold | type 6, (b) is the perspective view of the upper surface side made into the original direction. 6a is an upper surface portion, 6b is a side surface portion, 6c is a ceiling portion on the lower surface side, 6d is a protruding portion, and 6e is a slope portion.

金型は、上型と下型から成る。下型は有底で直立する壁面を有する４角筒状をなし、プレス機に固定されているが図示していない。下型の筒状の内面は、かしめ固定される前の金属枠１３の外側面及び上型の側面部６ｂに適合した寸法を有し、上型６は下型の内部で上下にスライドする。また、斜面部６ｅは図４に記載の金属枠３の切欠部１３ｃに比べ、水平面に対する角度が浅く形成されている。   The mold consists of an upper mold and a lower mold. The lower mold is a quadrangular cylinder having a bottomed and upright wall surface, and is fixed to a press machine, but is not shown. The cylindrical inner surface of the lower mold has a size that fits the outer surface of the metal frame 13 and the side surface portion 6b of the upper mold before being caulked and fixed, and the upper mold 6 slides up and down inside the lower mold. Further, the slope 6e is formed with a shallower angle with respect to the horizontal plane than the notch 13c of the metal frame 3 shown in FIG.

＜工程３：波長変換部材をかしめ固定する工程 図６＞
図６は金属枠の変形前後の状態を上型と共に示す図であり、（ａ）は変形加工直前の状態斜視図、（ｂ）はその断面図、（ｃ）は変形加工完了後の斜視図、（ｄ）はその断面図である。
このとき、図６（ａ）及び（ｂ）においてかしめ固定される前の金属枠１３は、波長変換部材４がかしめ固定される前の金属枠１３の段差部３ａに載置された状態で、図示しない下型の底部に置かれている。
このとき、角筒状の下型は、金属枠３の直立部３ｂの金属がかしめ固定される前の金属枠１３の内側へのみに流れ、外側へ向かいはみ出すことを防止している。その図示はしないが、作用は自明である。 <Step 3: Step of Caulking and Fixing Wavelength Conversion Member FIG. 6>
6A and 6B are views showing the state before and after the deformation of the metal frame together with the upper mold. FIG. 6A is a perspective view of the state immediately before the deformation process, FIG. 6B is a cross-sectional view thereof, and FIG. , (D) is a sectional view thereof.
At this time, the metal frame 13 before being caulked and fixed in FIGS. 6A and 6B is placed on the stepped portion 3a of the metal frame 13 before the wavelength conversion member 4 is caulked and fixed. It is placed on the bottom of the lower mold (not shown).
At this time, the lower mold of the rectangular tube shape prevents the metal of the upright portion 3b of the metal frame 3 from flowing only to the inside of the metal frame 13 before being caulked and fixed and protruding outward. Although not shown, the operation is self-evident.

図６（ａ）及び（ｂ）において、上型６の天井部６ｃは平面形状を有し、かしめ固定される前の金属枠１３の直立部１３ｂの上面に載っている。上述のとおり直立部１３ｂの上面が波長変換部材の上面より高いので、波長変換部材４の上面と天井部６ｃの間には所定量だけ隙間が生じている。また、突出部６ｄの突端側はかしめ固定される前の金属枠１３の金型係合部１３ｅと一部係合している。   6 (a) and 6 (b), the ceiling portion 6c of the upper mold 6 has a planar shape and rests on the upper surface of the upright portion 13b of the metal frame 13 before being caulked and fixed. Since the upper surface of the upright portion 13b is higher than the upper surface of the wavelength conversion member as described above, a predetermined amount of gap is generated between the upper surface of the wavelength conversion member 4 and the ceiling portion 6c. Further, the protruding end side of the protruding portion 6d is partially engaged with the mold engaging portion 13e of the metal frame 13 before being caulked and fixed.

図６（ｃ）及び（ｄ）において、上型６の上面部６ａが図示しないプレス機に押圧されて、上型６の突出部６ｄの先端がかしめ固定される前の金属枠１３を載置した下型の底面に当接するまで上型６を沈下する。このとき、図６（ｂ）の直立部における波長変換部材より上の金属の量などを調整することで上型６の下面側の天井部６ｃは、波長変換部材４の上面と当接させることができる。すなわち、図６（ａ）に記載の直立部１３ｂは天井部６ｃに潰されて金属枠の内側へ突出して変形部３ｄとなり、波長変換部材４の切欠部４ａのみがかしめ固定され、波金属枠３の上面と波長変換部材４の上面の高さを同一とすることができる。   6 (c) and 6 (d), the metal frame 13 is placed before the top surface 6a of the upper mold 6 is pressed by a press machine (not shown) and the tip of the protrusion 6d of the upper mold 6 is fixed by caulking. The upper die 6 is lowered until it comes into contact with the bottom surface of the lower die. At this time, the ceiling portion 6c on the lower surface side of the upper mold 6 is brought into contact with the upper surface of the wavelength conversion member 4 by adjusting the amount of metal above the wavelength conversion member in the upright portion of FIG. Can do. That is, the upright portion 13b shown in FIG. 6 (a) is crushed by the ceiling portion 6c and protrudes to the inside of the metal frame to become a deformed portion 3d, and only the notch portion 4a of the wavelength conversion member 4 is caulked and fixed. 3 and the height of the upper surface of the wavelength conversion member 4 can be made the same.

その際、突出部６ｄを有することによって過剰な押圧を防ぐことができる。
また、上述のとおり、上型６は斜面部６ｅとかしめ固定される前の金属枠１３の切欠部
１３ｃが共に傾斜面を有し、斜面部６ｅは切欠部１３ｃに比べて水平面に対する角度が浅く形成されている。これにより、傾斜部６ｅと切欠部１３ｃが共にガイドの役割をすることで近くに金属の少ない波長変換部材４の角部も綺麗にかしめ固定することが可能となる。
なお、金型の上型６を下げきった際に、金属が波長変換部材４の上面に乗り上げず、また、不要なすきまができないように、かしめ固定される前の金属枠１３の直立部１３ｂの高さ、切欠部１３ｃの形状・寸法、上型６の突出部６ｄ、その斜面部６ｅの形状・寸法が設定されるのは勿論である。このようにして、波長変換部材４のかしめ固定が終了する。 At this time, excessive pressing can be prevented by having the protrusion 6d.
In addition, as described above, the upper mold 6 has both the slope portion 6e and the notch portion 13c of the metal frame 13 before being caulked and fixed, and the slope portion 6e has a shallower angle with respect to the horizontal plane than the notch portion 13c. Is formed. As a result, both the inclined portion 6e and the notch portion 13c serve as a guide, so that the corner portion of the wavelength conversion member 4 with less metal can be caulked and fixed neatly.
In addition, when the upper mold 6 of the mold is lowered, the upright portion 13b of the metal frame 13 before being fixed by caulking so that the metal does not run on the upper surface of the wavelength conversion member 4 and an unnecessary gap is not formed. Of course, the height, the shape / dimension of the notch 13c, the protrusion 6d of the upper mold 6 and the shape / dimension of the slope 6e are set. In this way, the caulking and fixing of the wavelength conversion member 4 is completed.

＜他の実施形態について＞
本実施形態において、波長変換部材４の切欠部４ａを斜面形状としたが、斜面形状に代えて段差（階段）形状として切欠部４を形成してもよい。ただし、段差形状よりも斜面形状の方がよりスムーズに金属を塑性変形させることができるため、かしめ固定をよりきれいにおこなうことができる。 <About other embodiments>
In the present embodiment, the cutout portion 4a of the wavelength conversion member 4 has a slope shape, but the cutout portion 4 may be formed in a step (step) shape instead of the slope shape. However, since the slope shape can more smoothly plastically deform the metal than the step shape, the caulking and fixing can be performed more cleanly.

また、本実施形態において、波長変換部材４の上面は正方形としたが、これに限らず、長方形、または円形であっても良い。また、波長変換部材４の形状に合わせて金属枠３の形状も任意に変更してよい。
また、本実施形態において波長変換部材４の４辺を全てかしめ固定しているが、これに限らず例えば向かい合う２辺のみを固定するなど、一部だけを固定してもよい。
また、本実施形態において、前面透光性部材５を凸レンズとしたが、これに限らず例えば他のレンズ、プリズムなどの光学部材や、光学的な機能を有さない透明な熱伝導部材であってもよい。 In the present embodiment, the upper surface of the wavelength conversion member 4 is a square, but is not limited thereto, and may be a rectangle or a circle. Further, the shape of the metal frame 3 may be arbitrarily changed according to the shape of the wavelength conversion member 4.
In the present embodiment, all four sides of the wavelength conversion member 4 are caulked and fixed. However, the present invention is not limited to this. For example, only two sides facing each other may be fixed.
In the present embodiment, the front translucent member 5 is a convex lens. However, the front translucent member 5 is not limited to this and may be, for example, an optical member such as another lens or a prism, or a transparent heat conducting member having no optical function. May be.

また、本実施形態において、ＬＥＤ素子１は複数として説明したが、個数に限定はなく、１個でもよい。
さらに、ＬＥＤ素子の実装方法としては、特に限定はなく、基板上へのフリップチップ実装や、ダイボンド実装した後に電極面とＬＥＤ素子の電極をワイヤーボンディングにて接合してもよい。 In the present embodiment, a plurality of LED elements 1 have been described. However, the number is not limited, and one LED element 1 may be used.
Furthermore, the mounting method of the LED element is not particularly limited, and the electrode surface and the electrode of the LED element may be joined by wire bonding after flip chip mounting on the substrate or die bonding mounting.

その他、各部材の材質、形状に種々の変更を与えることが考えられる。なお、ＬＥＤ素子以外の発光素子を用いて発光装置を構成してもよい。   In addition, it is possible to give various changes to the material and shape of each member. In addition, you may comprise a light-emitting device using light emitting elements other than an LED element.

１ ＬＥＤ素子
２ 基板
３ 金属枠
３ａ 段差部
３ｄ 変形部
４ 波長変換部材
４ａ 切欠部
５ 前面透光性部材
６ 金型
６ａ 上面部
６ｂ 側面部
６ｃ 天井部
６ｄ 突出部
６ｅ 斜面部
１０ 発光装置
１３ かしめ固定される前の金属枠
１３ｂ 直立部
１３ｃ 切欠部
１３ｅ 金型係合部
DESCRIPTION OF SYMBOLS 1 LED element 2 Board | substrate 3 Metal frame 3a Step part 3d Deformation part 4 Wavelength conversion member 4a Notch part 5 Front light-transmitting member 6 Mold 6a Upper surface part 6b Side surface part 6c Ceiling part 6d Projection part 6e Slope part 10 Light-emitting device 13 Caulking Metal frame 13b before being fixed Upright portion 13c Notch portion 13e Mold engaging portion

Claims (4)

基板上に実装されたＬＥＤ素子と、
前記ＬＥＤ素子を取り囲むように配置された金属枠体と、
前記金属枠体の内側に形成された段差部と、
該段差部に配置された平板上の波長変換部材と、を備え、
前記波長変換部材は、上面端部に切欠部を有し、
前記金属枠体は、前記切欠部に対応した箇所に突出部を有し、
前記基板の下面から前記波長変換部材の上面までの高さと、前記基板の下面から前記金属枠体の上面までの高さが同一となるように、前記突出部によってかしめ固定されてなることを特徴とする発光装置。 An LED element mounted on a substrate;
A metal frame disposed so as to surround the LED element;
A step portion formed inside the metal frame;
A wavelength conversion member on a flat plate disposed in the step portion,
The wavelength conversion member has a notch at the upper surface end,
The metal frame has a protrusion at a location corresponding to the notch,
The protrusion is caulked and fixed so that the height from the lower surface of the substrate to the upper surface of the wavelength conversion member is the same as the height from the lower surface of the substrate to the upper surface of the metal frame. A light emitting device. 前記切欠部は、斜面形状を有することを特徴とする請求項１に記載の発光装置。   The light-emitting device according to claim 1, wherein the notch has a slope shape. 下面が平面状であって、前記金属枠体及び前記波長変換部材の上面に密接して配置される透光性部材を備えたことを特徴とする請求項１又は２に記載の発光装置。   The light emitting device according to claim 1, further comprising a translucent member having a flat bottom surface and disposed in close contact with the top surfaces of the metal frame and the wavelength conversion member. 前記透光性部材は、レンズであることを特徴とする請求項３に記載の発光装置。   The light-emitting device according to claim 3, wherein the translucent member is a lens.
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