JP2007214522A - Light source device and illuminator using same - Google Patents

Light source device and illuminator using same Download PDF

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JP2007214522A
JP2007214522A JP2006063320A JP2006063320A JP2007214522A JP 2007214522 A JP2007214522 A JP 2007214522A JP 2006063320 A JP2006063320 A JP 2006063320A JP 2006063320 A JP2006063320 A JP 2006063320A JP 2007214522 A JP2007214522 A JP 2007214522A
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light emitting
opening
molded body
source device
light source
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Kiminori Yanagisawa
公紀 柳沢
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INTEKKUSU KK
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source device and an illuminator for improving a heat radiation property of a light-emitting diode element, and achieving high-luminance light emission at low cost. <P>SOLUTION: A light source device is constituted of: a resin mold 1 including a first opening spread upward in a central part, and a second opening of which a diameter is smaller than that of the first opening through a bottom of the first opening; a heat sink 2 embedded to close the second opening and partially exposed outside the resin mold 1; a light-emitting diode element 4 including a plurality of electrodes mounted on the heat sink exposed within the first opening; a plurality of lead frames 3a, 3b constituted of the same mold of the same metal member as the heat sink 2 of which one terminal is exposed within the first opening, and another terminal is pulled out of the resin mold; a bonding wire 5 connecting the lead frames 3a, 3b and the electrodes of the light-emitting diode element 4; a sealing material 7 constituted of a translucent resin charged on the light-emitting diode element 4; and a lens 8 constituted of a translucent resin mounted in an upper part of the sealing material 7. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

本発明は、光源装置及びこれを用いた照明装置に係り、特に発光ダイオード素子（ＬＥＤ素子）を用いた光源装置から放射された出射光を被写体に投射させる投光手段に適用して好適な光源装置及び照明装置に関するものである。  The present invention relates to a light source device and an illumination device using the same, and more particularly to a light source suitable for application to light projecting means for projecting emitted light emitted from a light source device using a light emitting diode element (LED element) onto a subject. The present invention relates to a device and a lighting device.

この種の光源装置では、例えば、電気信号を光信号に変換する手段として回路基板上に発光素子を実装し、この回路基板上の発光素子の全面を覆うように半球型レンズ部を有する透光性の封止樹脂で封止して構成された光素子モジュール構造が提案されている。  In this type of light source device, for example, a light-emitting element is mounted on a circuit board as a means for converting an electrical signal into an optical signal, and a translucent light having a hemispherical lens portion so as to cover the entire surface of the light-emitting element on the circuit board. An optical element module structure configured by sealing with a functional sealing resin has been proposed.

近年、この種の光源装置として白色ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）を用いた照明手段が実用化しつつある。照明用途としてＬＥＤを使用するには、高出力で且つ高効率なＬＥＤが必須である。現行では、白色ＬＥＤでは、約７０ｍＷ程度の入力で約１１ｍ程度の明るさしか得られなかった。  In recent years, illumination means using a white LED (Light Emitting Diode) as a light source device of this type has been put into practical use. In order to use LEDs for lighting applications, LEDs with high output and high efficiency are essential. At present, with a white LED, a brightness of only about 11 m can be obtained with an input of about 70 mW.

最近になって約１Ｗ入力クラスの白色ＬＥＤが相次いで発表され始め、一部では市販されているが、本格的な照明として十分な光束が得られていない。また、発光効率も約２０１ｍ／Ｗ程度であり、白熱電球よりも高いものの、蛍光灯には遠く及ばない。ＬＥＤ照明に期待されている長寿命及びコンパクト性等の特長は、高出力化と技術的に相反するという問題があった。  Recently, about 1 W input class white LEDs have begun to be announced one after another, and some of them are commercially available, but sufficient luminous flux has not been obtained for full-scale illumination. In addition, the luminous efficiency is about 201 m / W, which is higher than that of an incandescent bulb, but far from that of a fluorescent lamp. Features such as long life and compactness expected for LED lighting have the problem of technical conflict with high output.

この種の技術的な問題を解決するために各種の手段が提案されている。これらの各種の手段としては、器具筐体と、ユニットと、パッケージと、ＬＥＤチップ（以下、チップと称する）とから構成されている。ユニットの形態としては、チップがパッケージを介してユニット基板に実装された構造（砲弾（一般的な形状）型，ＳＭＤ（表面実装）型，ハイパワーＬＥＤ ＦＵ（ｆａｃｅ ｕｐ）型，ハイパワーＬＥＤ ＦＤ（ｆａｃｅ ｄｏｗｎ）型及び直接ユニット基板に実装された構造（ｃｈｉｐ ｏｎ ｂｏａｒｄ（ＣＯＢ））等とがある。なお、上記ハイパワーＬＥＤとは、チップのサイズが通常の約１０倍程度であり、一個当たりの出力が大きく、フリップチップ実装されている構造である。また、この種の従来技術に関しては、例えば下記非特許文献１に開示されている。  Various means have been proposed to solve this type of technical problem. These various means are composed of an instrument housing, a unit, a package, and an LED chip (hereinafter referred to as a chip). As the form of the unit, a structure in which a chip is mounted on a unit substrate via a package (a shell (general shape) type, an SMD (surface mount) type, a high power LED FU (face up) type, a high power LED FD) (Face down) type and a structure (chip on board (COB)) directly mounted on a unit substrate, etc. The high power LED is about 10 times the size of a normal chip, The hit output is large and the structure is flip-chip mounted, and this type of prior art is disclosed in Non-Patent Document 1, for example.

松下電工技報（Ｖｏｌ．５３ Ｎｏ．１）  Matsushita Electric Works Technical Report (Vol.53 No.1)

このように構成された光源装置では、実装基板からチップ発光部までの熱抵抗が小さく、耐熱温度が高いほど、高い周囲温度と大入力での使用が可能であり、これがＬＥＤを高出力化していくためのキーポイントとなっている。しかしながら、熱抵抗と耐熱性とはパッケージの材質とチップの実装形態に大きく依存しているために最適化が難しく、高出力化を拒む主要因となっている。  In the light source device configured as described above, the lower the thermal resistance from the mounting substrate to the chip light emitting unit and the higher the heat-resistant temperature, the higher the ambient temperature and the larger the input can be used. It is a key point to go. However, the thermal resistance and heat resistance are largely dependent on the material of the package and the mounting form of the chip, so that it is difficult to optimize them, which is a main factor for rejecting high output.

このようなＬＥＤからユニットへの熱抵抗を低くするために図１３に要部断面図で示すようにカップ形状２１ａをプレス成形したアルミニウム板２１と、穴２２を設けたプリント配線基板２３とを接合し、アルミニウム板２１に形成したカップ形状２１ａ内にＬＥＤ２４を直接的に実装し、ＬＥＤ２４とプリント配線基板２３とをボンディングワイヤ２５で接続した後に封止枠２６により封止して構成した発光装置が提案されている。このように構成される光源装置は、熱抵抗が極めて低く、従来構造の約３倍の入力が可能となり、約３倍の光束が得られることを可能としている。  In order to reduce the thermal resistance from the LED to the unit, the aluminum plate 21 formed by press-molding the cup shape 21a and the printed wiring board 23 provided with the holes 22 are joined as shown in the sectional view of the main part in FIG. The LED 24 is directly mounted in the cup shape 21 a formed on the aluminum plate 21, and the LED 24 and the printed wiring board 23 are connected by the bonding wire 25 and then sealed by the sealing frame 26. Proposed. The light source device configured as described above has an extremely low thermal resistance, and can input approximately three times as much as the conventional structure, and can obtain approximately three times the luminous flux.

しかしながら、このように構成された光源装置は、熱抵抗を向上させ、放熱効果を向上させて高出力で高効率を実現する手段としてアルミニウム板２１へのカップ形状２１ａの成形，プリント配線基板２３への回路配線の形成及びプリント配線基板２３への穴２２の形成等の工程を経て製作することから、部品点数及び組み立て工数が増大し、生産コストが高価となる等の課題があった。  However, the light source device configured in this way improves the thermal resistance, improves the heat dissipation effect, and forms the cup shape 21a on the aluminum plate 21 as a means for realizing high output and high efficiency. Therefore, there are problems such as an increase in the number of parts and the number of assembly steps and an increase in production cost.

したがって、本発明は前述した従来の課題を解決するためになされたものであり、その目的は、簡単な構成で発光ダイオード素子の放熱性を向上させることにより、低コストにて高輝度発光を実現可能とする発光装置及び照明装置を提供することにある。  Accordingly, the present invention has been made to solve the above-described conventional problems, and its purpose is to realize high-luminance light emission at a low cost by improving the heat dissipation of the light-emitting diode element with a simple configuration. An object of the present invention is to provide a light-emitting device and a lighting device that can be used.

このような目的を達成するために本発明による光源装置は、中央部に上方に向かって拡がる傾斜面を有する第１の開口部を有し、当該第１の開口部の底部を貫通して第１の開口部よりも口径の小さい第２の開口部を有する樹脂成型体と、この樹脂成型体の第２の開口部を塞ぐように埋め込まれ、且つ一部が樹脂成型体の外部に露出された放熱板と、第１の開口部内に露出した放熱板上に実装された複数の電極を有する発光ダイオード素子と、樹脂成型体の内部を貫通して一部が第１の開口部内に一端が露出し、他端が樹脂成型体の外部に引き出された放熱板と同一金属部材の同一成型体からなる複数のリードフレームと、複数のリードフレームの一端と発光ダイオード素子の複数の電極とを電気的に接続するボンディングワイヤと、発光ダイオード素子上に充填された透光性樹脂材からなる封止材と、この封止材の上部に装着された透光性樹脂材からなるレンズとから構成することにより、発光ダイオード素子からの発熱が放熱板を介して効率良く伝導され、外部に放熱されるので、背景技術の課題を解決することができる。  In order to achieve such an object, a light source device according to the present invention has a first opening having an inclined surface that extends upward at the center, and passes through the bottom of the first opening. A resin molded body having a second opening having a smaller diameter than that of the first opening, and embedded so as to close the second opening of the resin molded body, and a part thereof is exposed to the outside of the resin molded body. A light emitting diode element having a plurality of electrodes mounted on the heat sink exposed in the first opening, a part of the resin molded body penetrating through the inside of the first opening, and one end in the first opening Electrically connecting a plurality of lead frames made of the same molded body of the same metal member as the heat sink exposed at the other end and drawn out of the resin molded body, one end of the plurality of lead frames, and a plurality of electrodes of the light emitting diode element Connecting bonding wire and light emitting die By comprising a sealing material made of a translucent resin material filled on the card element and a lens made of a translucent resin material mounted on the top of the sealing material, Since heat generation is efficiently conducted through the heat radiating plate and radiated to the outside, the problems of the background art can be solved.

また、本発明による照明手段は、上記構成による光源装置をリードフレーム同士一体接続して構成することにより、背景技術の課題を解決することができる。  Moreover, the illumination means by this invention can solve the subject of background art by comprising the light source device by the said structure by integrally connecting lead frames.

なお、本発明は、前述した各構成及び後述する実施の形態に記載される構成に限定されるものではなく、本発明の技術思想を逸脱することなく、種々の変更が可能であることは言うまでもない。  It should be noted that the present invention is not limited to the above-described configurations and the configurations described in the embodiments described below, and it goes without saying that various modifications can be made without departing from the technical idea of the present invention. Yes.

本発明によれば、発光ダイオード素子を実装した放熱板が樹脂成型体から露出されることにより、発光ダイオード素子の発熱が効率的に放熱板に伝導して放熱させることができるので、放熱性の高い光源装置が得られるという極めて優れた効果を有する。  According to the present invention, since the heat sink mounted with the light emitting diode element is exposed from the resin molded body, the heat generated by the light emitting diode element can be efficiently conducted to the heat sink and dissipated. It has an extremely excellent effect that a high light source device can be obtained.

また、本発明によれば、放熱板と樹脂成型体とを一体成型により製造されるので、簡単な構成でしかも低コストにて放熱性の高い光源装置が得られるという極めて優れた効果を有する。  Further, according to the present invention, since the heat radiating plate and the resin molded body are manufactured by integral molding, it has an extremely excellent effect that a light source device having a simple structure and high heat dissipation can be obtained at a low cost.

また、本発明によれば、樹脂成型体が擂鉢状の開口部を有する高耐熱、且つ高光反射性の射出成形樹脂により構成されており、発光ダイオード素子からの放射光が効率良く反射されるので、低コストにて高輝度発光の光源装置を容易に実現できるという極めて優れた効果が得られる。  Further, according to the present invention, the resin molded body is made of a highly heat-resistant and light-reflective injection-molded resin having a bowl-shaped opening, and the emitted light from the light-emitting diode element is efficiently reflected. Thus, an extremely excellent effect that a light source device with high luminance emission can be easily realized at low cost is obtained.

また、本発明による光源装置を用いた照明装置によれば、発光ダイオード素子の同色発光または各色発光の発光ダイオード素子を組み合わせて直列接続により、所望の発光色の高輝度照明光が容易に得られるという極めて優れた効果を有する。  In addition, according to the illumination device using the light source device according to the present invention, high-luminance illumination light of a desired emission color can be easily obtained by serially connecting light emitting diode elements having the same color light emission or each color light emission. It has an extremely excellent effect.

以下、本発明の具体的な実施の形態について、実施例の図面を参照して詳細に説明する。  Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings of the examples.

図１は本発明による光源装置の実施例１による構成を説明する上方から見た要部平面図であり、レンズを除いてある。図２は図１の矢印Ａ方向から見た側面図、図３は図１のＢ−Ｂ′線に沿って切断した断面図、図４は図１のＣ−Ｃ′線に沿って切断した断面図、図５は図１の樹脂成型体を裏面から見た平面図である。  FIG. 1 is a plan view of an essential part viewed from above illustrating a configuration according to a first embodiment of a light source device according to the present invention, in which a lens is omitted. 2 is a side view as seen from the direction of arrow A in FIG. 1, FIG. 3 is a cross-sectional view taken along line BB ′ in FIG. 1, and FIG. 4 is cut along line CC ′ in FIG. Sectional drawing and FIG. 5 are the top views which looked at the resin molding of FIG. 1 from the back surface.

参照符号１は、樹脂成型体であり、この樹脂成型体１は、高耐熱、且つ高光反射性を有するＰＰＡ樹脂等の射出成形により形成されている。この樹脂成型体１には、上方に向かって略擂鉢状に広がり、底部が貫通する開口部１ａが一体的に形成され、外形が略円形状に形成されている。なお、この開口部１ａ内の内面は、光反射性を持たせるために鏡面仕上げが施されている。  Reference numeral 1 denotes a resin molded body. The resin molded body 1 is formed by injection molding of PPA resin or the like having high heat resistance and high light reflectivity. The resin molded body 1 is integrally formed with an opening 1a that spreads upward in a substantially bowl shape and penetrates the bottom, and has an outer shape that is substantially circular. Note that the inner surface of the opening 1a is mirror-finished to give light reflectivity.

また、参照符号２は、後述する発光ダイオード素子を実装する台座部も兼ね備えた放熱板であり、この放熱板２は、開口部１ａの底部に後述する発光ダイオード素子を実装する台座部２ａ及びこの台座部２ａに連結し、樹脂成型体１内を貫通して一部を外部方向に略放射状に突出させた複数の放熱片２ｂが一体的に形成されている。  Reference numeral 2 denotes a heat radiating plate that also has a pedestal portion for mounting a light emitting diode element to be described later. The heat radiating plate 2 includes a pedestal portion 2a for mounting a light emitting diode element to be described later on the bottom of the opening 1a and the radiating plate 2a. A plurality of heat dissipating pieces 2b that are connected to the pedestal portion 2a and penetrate the resin molded body 1 and partially protrude outward in the radial direction are integrally formed.

この台座部２ａは樹脂成型体１の開口部１ａの底部に形成された開口を塞ぐように、さらに複数の放熱片２ｂは樹脂成型体１の内部にこの樹脂成型体１の成型と同時に嵌入され、台座部２ａの背面は樹脂成型体１の背面（底面）側に露出して放熱機能をもたせる構造となっている。この台座部２ａ及び放熱片２ｂを一体的に有する放熱板３は、例えば板厚が約０．２５ｍｍの銅合金板のプレス成型により形成され、その表面には銀メッキ処理が施されている。  The pedestal 2a is inserted into the resin molded body 1 simultaneously with the molding of the resin molded body 1 so that the opening formed at the bottom of the opening 1a of the resin molded body 1 is closed. The back surface of the pedestal portion 2a is exposed to the back surface (bottom surface) side of the resin molded body 1 so as to have a heat dissipation function. The heat radiating plate 3 integrally including the pedestal portion 2a and the heat radiating piece 2b is formed, for example, by press molding of a copper alloy plate having a plate thickness of about 0.25 mm, and the surface thereof is subjected to silver plating.

また、参照符号３ａ，３ｂは、一対のリードフレームであり、このリードフレーム３ａ，３ｂは、放熱板２と同一部材の銅合金板の成型体により形成され、その表面には銀メッキ処理が施されている。また、このリードフレーム３ａ，３ｂと、台座部２ａ及び放熱片２ｂを有する放熱板２とは、ロール状に巻かれた帯状の銅合金板をプレス成型法により同時に一体成型され、多数個連続してフレーム枠内に組み込まれてリードフレーム組み立て体として一体形成される。  Reference numerals 3a and 3b are a pair of lead frames. The lead frames 3a and 3b are formed of a copper alloy plate molded body that is the same member as the heat radiating plate 2, and the surface thereof is subjected to silver plating. Has been. The lead frames 3a and 3b and the heat sink 2 having the pedestal 2a and the heat dissipating piece 2b are formed by integrally forming a strip-shaped copper alloy plate wound in a roll shape at the same time by a press molding method. And integrated into a frame frame to be integrally formed as a lead frame assembly.

そして、このリードフレーム組み立て体は、樹脂成型体１の射出成形時に組み合わせて成型することにより、台座２ａ，放熱片２ｂ及びリードフレーム３ａ，３ｂが樹脂成型体１内のそれぞれの所定位置に設置されて一体化されて成形されることになる。  And this lead frame assembly is combined and molded at the time of injection molding of the resin molded body 1 so that the base 2a, the heat radiating piece 2b and the lead frames 3a, 3b are installed at respective predetermined positions in the resin molded body 1. Are integrated and molded.

また、参照符号４は、フェイスアップ型の発光ダイオード素子であり、この発光ダイオード素子４は、表面側に発光面及びその一部に複数の電極端子を有し、その背面側が台座部２ａ上に熱伝導性の高い例えばシリコン樹脂接着材を介して密着配置されて実装されている。なお、この発光ダイオード素子４は、赤色発光素子と緑色発光素子と青色発光素子と白色発光素子とから選択された少なくとも一個の発光素子であれば良い。  Reference numeral 4 denotes a face-up type light emitting diode element. The light emitting diode element 4 has a light emitting surface on the surface side and a plurality of electrode terminals on a part thereof, and the back side thereof is on the pedestal portion 2a. For example, it is mounted in close contact via a silicon resin adhesive having high thermal conductivity. The light emitting diode element 4 may be at least one light emitting element selected from a red light emitting element, a green light emitting element, a blue light emitting element, and a white light emitting element.

また、参照符号５は、ボンディングワイヤであり、このボンディングワイヤ５は、例えば直径約３０μｍ程度の金線により形成され、一方は発光ダイオード素子４の電極とリードフレーム３ａの端子部との間に、他方は発光ダイオード素子４の電極とリードフレーム３ｂの端子部との間にそれぞれワイヤボンダにより電気的に接続され、さらに一方のリードフレーム３ａの端子部と他方のリードフレーム３ｂの端子との間にリードフレーム３ｂ上に接続されたＺＤ素子（ツェナーダイオード素子）６を介して電気的に接続されている。このＺＤ素子６は、リードフレーム３ａ側に正極が接続され、リードフレーム３ｂ側に負極が接続されている。つまり、発光ダイオード素子４と逆並列に接続されて静電破壊防止機能を持たせている。  Reference numeral 5 denotes a bonding wire. The bonding wire 5 is formed of, for example, a gold wire having a diameter of about 30 μm, and one of the electrodes is disposed between the electrode of the light emitting diode element 4 and the terminal portion of the lead frame 3a. The other is electrically connected by a wire bonder between the electrode of the light-emitting diode element 4 and the terminal portion of the lead frame 3b, and further between the terminal portion of one lead frame 3a and the terminal of the other lead frame 3b. It is electrically connected via a ZD element (Zener diode element) 6 connected on the frame 3b. The ZD element 6 has a positive electrode connected to the lead frame 3a side and a negative electrode connected to the lead frame 3b side. That is, it is connected in antiparallel with the light emitting diode element 4 and has an electrostatic breakdown preventing function.

また、参照符号７は、封止材であり、この封止材７は、樹脂成型体１の開口部１ａ内に例えば透光性のシリコン樹脂材のポッティング法により充填して形成され、発光ダイオード素子４及びボンディングワイヤ５を開口部１ａ内に保持固定させている。また、参照符号８は、レンズであり、このレンズ８は、例えば透光性の耐熱性シリコン樹脂材の成型体により凸状に突出して外形が円形状に形成されて樹脂成型体１の開口部１ａを塞ぐようにその周縁部に形成されたリング状の隙間に嵌合させ、シール材により保持固定されている。  Reference numeral 7 denotes a sealing material. The sealing material 7 is formed by filling the opening 1a of the resin molded body 1 with, for example, a potting method of a translucent silicon resin material. The element 4 and the bonding wire 5 are held and fixed in the opening 1a. Reference numeral 8 is a lens, and this lens 8 is projected in a convex shape by a molded body of, for example, a translucent heat-resistant silicon resin material, and the outer shape is formed in a circular shape, so that the opening of the resin molded body 1 is formed. It is fitted into a ring-shaped gap formed at the peripheral edge so as to close la, and is held and fixed by a sealing material.

このように構成された発光装置は、発光ダイオード素子４が樹脂成型体１の背面に露出した放熱板２の台座部２ａ上に密着配置されて実装されるので、発光ダイオード素子４の発熱が直接的に放熱板２の台座部２ａから外部に放熱されるとともに、この台座部２ａを介して放熱片２ｂに伝導して外部に効率よく放熱されることになる。つまり、樹脂成型体１から外部に露出している放熱板２から効率よく放熱される。  In the light emitting device configured as described above, the light emitting diode element 4 is mounted in close contact with the pedestal 2a of the heat radiating plate 2 exposed on the back surface of the resin molded body 1, so that the heat generated by the light emitting diode element 4 is directly generated. In addition, heat is radiated to the outside from the pedestal portion 2a of the heat radiating plate 2, and is conducted to the heat radiating piece 2b through the pedestal portion 2a to be efficiently radiated to the outside. That is, heat is efficiently radiated from the heat radiating plate 2 exposed to the outside from the resin molded body 1.

また、このように構成された発光装置は、樹脂成型体１が上方に向かって略擂鉢状に広がる鏡面を有する開口部１ａを有しているので、発光ダイオード素子４からの放射光が高い反射率で効率よく反射され、レンズ８を介して外部に向かって高輝度で投射させることができる。  In the light emitting device configured as described above, the resin molded body 1 has the opening 1a having a mirror surface that spreads upward in a substantially bowl shape, and thus the emitted light from the light emitting diode element 4 is highly reflected. It is efficiently reflected at a high rate and can be projected to the outside through the lens 8 with high brightness.

図６〜図１１は、実施例１で説明した発光装置の製作方法を説明する平面図である。図６に示すように実施例１による発光装置１０は、ロール状に巻かれた帯状の銅合金板からなるフレーム３にこのフレーム３に放熱板２及びリードフレーム３ａ，３ｂとなる部分を残してプレス成型法により打ち抜いた後、図７に示すように放熱板２とフレーム３との結合部に下方向（垂直方向）に折れ曲がる曲げ加工を施す。次に図８に示すように放熱板２及びリードフレーム３ａ，３ｂとなる部分に高耐熱、且つ高光反射性を有するＰＰＡ樹脂材をインサート射出成形する。  6 to 11 are plan views illustrating a method for manufacturing the light-emitting device described in the first embodiment. As shown in FIG. 6, the light-emitting device 10 according to the first embodiment has a frame 3 made of a strip-shaped copper alloy plate wound in a roll shape, with the frame 3 being left with portions to be the heat radiating plate 2 and the lead frames 3a and 3b. After punching by the press molding method, as shown in FIG. 7, a bending process is applied to the joint portion between the heat radiating plate 2 and the frame 3 to be bent downward (vertical direction). Next, as shown in FIG. 8, a PPA resin material having high heat resistance and high light reflectivity is insert-injection-molded into the portions to be the heat radiating plate 2 and the lead frames 3a and 3b.

次に、図９に示すようにこの樹脂成型体１の開口部１ａ内に露出している台座部２ａ上に発光ダイオード素子４を実装した後、この発光ダイオード素子４とリードフレーム３ａ，３ｂとをそれぞれワイヤボンダにより電気的に接続する。次に樹脂成型体１の開口部１ａ内に図示しないが、この発光ダイオード素子４上に封止材を充填した後に図１０に示すように樹脂成型体１の開口部１ａ上の隙間にシール材を介してレンズ８を装着して保持固定する。  Next, as shown in FIG. 9, after mounting the light emitting diode element 4 on the pedestal 2a exposed in the opening 1a of the resin molded body 1, the light emitting diode element 4 and the lead frames 3a and 3b Are electrically connected by wire bonders. Next, although not shown in the opening 1a of the resin molded body 1, a sealing material is filled in the gap on the opening 1a of the resin molded body 1 as shown in FIG. The lens 8 is attached and held and fixed via the.

次に、図１１に示すようにリードフレーム３ａ，３ｂ及び放熱板の放熱片２ｂを残してフレーム３から切断して切り離すことにより、図１に示した発光装置１０が互いに隣接するリードフレーム３ａとリードフレーム３ｂとを直列接続して形成された照明装置を得ることができる。また、図中、Ｄ部で切断することにより、図１に示した個々の発光装置が得られる。  Next, as shown in FIG. 11, the light emitting device 10 shown in FIG. 1 is separated from the adjacent lead frames 3a by cutting away from the frame 3 while leaving the lead frames 3a, 3b and the heat radiating pieces 2b of the heat sink. An illuminating device formed by connecting the lead frame 3b in series can be obtained. In addition, the individual light emitting devices shown in FIG. 1 can be obtained by cutting at a D portion in the drawing.

図１２は、図１１に示した発光装置１０を直列接続して形成された照明装置の構成を説明する図であり、図１２（ａ）は平面図、図１２（ｂ）は図１２（ａ）断面図である。図１２において、この照明装置は、複数の発光装置１０が行方向に隣接するリードフレーム３ａ，３ｂを互いに行方向に直列接続し、さらに列方向に複数段に配列して例えば筐体等の放熱体１１に密着させて搭載することにより、発光ダイオード素子４からの発熱が放熱板２を介して効率的に放熱させることができるとともに、輝度の高い面状の照明光を得ることができる。なお、この放熱体１１は、例えば板厚が１ｍｍ〜５０ｍｍ程度のアルミニウム板または銅板等の熱伝導率の高い金属板により形成される。  12A and 12B are diagrams illustrating a configuration of a lighting device formed by connecting the light-emitting devices 10 illustrated in FIG. 11 in series. FIG. 12A is a plan view, and FIG. FIG. In FIG. 12, this illuminating device includes a plurality of light emitting devices 10 in which lead frames 3a and 3b adjacent in the row direction are connected in series in the row direction and arranged in a plurality of stages in the column direction, for example, heat dissipation of a housing or the like. By mounting in close contact with the body 11, heat generated from the light emitting diode element 4 can be efficiently radiated through the heat radiating plate 2, and planar illumination light with high luminance can be obtained. The heat radiator 11 is formed of a metal plate having a high thermal conductivity such as an aluminum plate or a copper plate having a plate thickness of about 1 mm to 50 mm.

このような構成によれば、複数の発光装置１０を実装する配線基板を不要として低コストにて高輝度の面状照明光を得ることができる。  According to such a configuration, it is possible to obtain high-luminance planar illumination light at low cost without the need for a wiring board on which a plurality of light-emitting devices 10 are mounted.

なお、前述した実施例において、発光ダイオード素子４は、樹脂成型体１内に赤色発光素子と緑色発光素子と青色発光素子と白色発光素子とから選択された少なくとも一個の発光素子を実装する場合について説明したが、本発明においては、１個の樹脂成型体１内に複数個の単色発光の発光ダイオード素子を実装しても良く、また、複数色発光（赤，緑，青発光）の発光ダイオード素子を実装しても良い。さらには、図１２に示す構成において、１行目に連結して配列される発光装置１０の発光ダイオード素子を赤色発光素子とし、２行目に連結して配列される発光ダイオード素子は緑色発光素子とし、３行目に連結して配列される発光ダイオード素子は青色発光素子としても良い。  In the embodiment described above, the light-emitting diode element 4 is mounted on at least one light-emitting element selected from a red light-emitting element, a green light-emitting element, a blue light-emitting element, and a white light-emitting element in the resin molding 1. As described above, in the present invention, a plurality of single-color light emitting diode elements may be mounted in one resin molded body 1, and a plurality of light emitting diodes emitting red (green, blue) light. An element may be mounted. Furthermore, in the configuration shown in FIG. 12, the light emitting diode elements of the light emitting device 10 connected and arranged in the first row are red light emitting elements, and the light emitting diode elements arranged and connected in the second row are green light emitting elements. The light emitting diode elements connected and arranged in the third row may be blue light emitting elements.

本発明による光源装置の実施例１による構成を説明する上方から見た要部平面図である。  It is the principal part top view seen from the top explaining the structure by Example 1 of the light source device by this invention. 図２は図１の矢印Ａ方向から見た側面図である。  FIG. 2 is a side view seen from the direction of arrow A in FIG. 図１のＢ−Ｂ′線に沿って切断した断面図である。  It is sectional drawing cut | disconnected along the BB 'line | wire of FIG. 図１のＣ−Ｃ′線に沿って切断した断面図である。  It is sectional drawing cut | disconnected along CC 'line of FIG. 図１の樹脂成型体を裏面から見た平面図である。  It is the top view which looked at the resin molding of FIG. 1 from the back surface. 図１に示した発光装置の製作方法を説明する平面図である。  It is a top view explaining the manufacturing method of the light-emitting device shown in FIG. 図６に引き続く発光装置の製作方法を示す平面図である。  It is a top view which shows the manufacturing method of the light-emitting device following FIG. 図７に引き続く発光装置の製作方法を示す平面図である。  It is a top view which shows the manufacturing method of the light-emitting device following FIG. 図８に引き続く発光装置の製作方法を示す平面図である。  It is a top view which shows the manufacturing method of the light-emitting device following FIG. 図９に引き続く発光装置の製作方法を示す平面図である。  It is a top view which shows the manufacturing method of the light-emitting device following FIG. 図１０に引き続く発光装置の製作方法を示す平面図である。  It is a top view which shows the manufacturing method of the light-emitting device following FIG. 図１１に示した発光装置を直列接続して形成された照明装置の構成を示す図である。  It is a figure which shows the structure of the illuminating device formed by connecting the light-emitting device shown in FIG. 11 in series. 従来の発光装置の構成を示す要部断面図である。  It is principal part sectional drawing which shows the structure of the conventional light-emitting device.

符号の説明Explanation of symbols

１・・・樹脂成型体、１ａ・・・開口部、２・・・放熱板、２ａ・・・台座部、２ｂ・・・放熱片、３・・・フレーム、３ａ・・・リードフレーム、３ｂ・・・リードフレーム、４・・・発光ダイオード素子、５・・・ボンディングワイヤ、６・・・ＺＤ素子（ツェナーダイオード素子）、７・・・封止材、８・・・レンズ、１０・・・光源装置、１１・・・放熱体。  DESCRIPTION OF SYMBOLS 1 ... Resin molded object, 1a ... Opening part, 2 ... Heat sink, 2a ... Base part, 2b ... Radiation piece, 3 ... Frame, 3a ... Lead frame, 3b ... Lead frame, 4 ... Light-emitting diode element, 5 ... Bonding wire, 6 ... ZD element (Zener diode element), 7 ... Encapsulant, 8 ... Lens, 10 ... -Light source device, 11 ... radiator.

Claims (8)

中央部に上方に向かって拡がる傾斜面を有する第１の開口部を有し、当該第１の開口部の底部を貫通して前記第１の開口部よりも口径の小さい第２の開口部を有する樹脂成型体と、
前記樹脂成型体の第２の開口部を塞ぐように埋め込まれ、且つ一部が前記樹脂成型体の外部に露出された放熱板と、
前記第２の開口部内に露出した前記放熱板上に実装された複数の電極を有する発光ダイオード素子と、
前記樹脂成型体の内部を貫通して一部が前記第１の開口部内に一端が露出し、他端が前記樹脂成型体の外部に引き出された前記放熱板と同一金属部材の同一成型体からなる複数のリードフレームと、
前記複数のリードフレームの一端と前記発光ダイオード素子の複数の電極とを電気的に接続するボンディングワイヤと、
前記発光ダイオード素子上に充填された透光性樹脂材からなる封止材と、
前記封止材の上部に装着された透光性樹脂材からなるレンズと、
を備えたことを特徴とする光源装置。A second opening having a first opening having an inclined surface extending upward in the central portion and penetrating through a bottom of the first opening and having a smaller diameter than the first opening; A resin molded body having,
A heat sink embedded so as to close the second opening of the resin molded body, and a part of which is exposed to the outside of the resin molded body;
A light emitting diode element having a plurality of electrodes mounted on the heat sink exposed in the second opening;
From the same molded body of the same metal member as the heat dissipation plate, one end of which penetrates the inside of the resin molded body, one end is exposed in the first opening, and the other end is drawn out of the resin molded body. A plurality of lead frames,
Bonding wires for electrically connecting one end of the plurality of lead frames and the plurality of electrodes of the light emitting diode element;
A sealing material made of a translucent resin material filled on the light emitting diode element;
A lens made of a translucent resin material mounted on the top of the sealing material;
A light source device comprising: 前記発光ダイオード素子は、赤色発光素子と緑色発光素子と青色発光素子と白色発光素子とから選択された少なくとも一個の発光素子であることを特徴とする請求項１に記載の光源装置。  The light source device according to claim 1, wherein the light emitting diode element is at least one light emitting element selected from a red light emitting element, a green light emitting element, a blue light emitting element, and a white light emitting element. 前記レンズは、耐熱性樹脂材の成型体により形成されたことを特徴とする請求項１に記載の光源装置。  The light source device according to claim 1, wherein the lens is formed of a molded body of a heat resistant resin material. 前記レンズは、外形が円形状の凸レンズであることを特徴とする請求項１に記載の光源装置。  The light source device according to claim 1, wherein the lens is a convex lens having a circular outer shape. 前記樹脂成型体の開口端の周縁部と前記レンズの周縁部との間にリング状の隙間を有することを特徴とする請求項１に記載の光源装置。  The light source device according to claim 1, wherein a ring-shaped gap is provided between a peripheral edge portion of the opening end of the resin molded body and a peripheral edge portion of the lens. 前記レンズは、前記樹脂成型体の前記リング状隙間にシール材を介して保持固定されたことを特徴とする請求項５に記載の光源装置。  The light source device according to claim 5, wherein the lens is held and fixed in the ring-shaped gap of the resin molded body via a sealing material. 前記光源装置が前記リードフレーム同士を複数直列接続してなることを特徴とする照明装置。  A lighting device, wherein the light source device comprises a plurality of lead frames connected in series. 前記光源装置の発光ダイオード素子は、赤色発光素子と緑色発光素子と青色発光素子と白色発光素子とから選択された少なくとも一個の発光素子であることを特徴とする請求項７に記載の照明装置。  The lighting device according to claim 7, wherein the light emitting diode element of the light source device is at least one light emitting element selected from a red light emitting element, a green light emitting element, a blue light emitting element, and a white light emitting element.
JP2006063320A 2006-02-10 2006-02-10 Light source device and illuminator using same Pending JP2007214522A (en)

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