JP2017163054A - Signal transmission substrate - Google Patents

Signal transmission substrate Download PDF

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JP2017163054A
JP2017163054A JP2016047561A JP2016047561A JP2017163054A JP 2017163054 A JP2017163054 A JP 2017163054A JP 2016047561 A JP2016047561 A JP 2016047561A JP 2016047561 A JP2016047561 A JP 2016047561A JP 2017163054 A JP2017163054 A JP 2017163054A
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wiring
primary
signal
power supply
signal transmission
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JP6602241B2 (en
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哲 石坂
Satoru Ishizaka
哲 石坂
悠 廣川
Yu Hirokawa
悠 廣川
誠悟 射延
Seigo Inobe
誠悟 射延
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a signal transmission substrate that can have primary-side wiring and secondary-side wiring overlaid while suppressing noise from the primary-side wiring to the secondary-side wiring, and is high in degree of freedom of a circuit layout.SOLUTION: A signal transmission substrate comprises: a primary-side circuit part comprising primary-side wirings including a primary-side power supply wiring 1P connected to an external power supply; and a secondary-side circuit part 200 comprising secondary-side wirings including secondary-side signal wirings 2SA, 2SB to which output of the primary-side circuit part is input and which input signals into the signal transmission substrate, and secondary-side ground wirings 2G arranged at certain intervals with the secondary-side signal wirings 2SA, 2SB. The secondary-side signal wirings 2SA, 2SB and secondary-side ground wirings 2G comprise an intersection circuit part 300 spatially intersecting the primary-side power supply wiring 1P. The secondary-side ground wirings 2G constitute a superposition circuit 300S which is larger in distance to the primary-side power supply wiring 1P around the primary-side power supply wiring 1P at the intersection circuit part 300.SELECTED DRAWING: Figure 2

Description

本発明は、電気および、電子機器内において、外界からのノイズに対する耐ノイズ性能を備えた信号伝送基板に関する。   The present invention relates to a signal transmission board having noise resistance performance against noise from the outside in electrical and electronic equipment.

産業用電子機器の置かれる電磁環境は劣悪で、通常、キロボルト級の高電圧の開閉器ノイズなどが侵入する可能性のある電源回路と、信号配線とは近接させないようにする必要がある。このため、基板寸法を拡大したり、基板を追加することで電源回路と信号配線とを近づけないように、回路の配置あるいは配線を行う。昨今の電子機器の小型化への要求に伴い、回路配置の自由度が小さくなり、電源回路と信号配線を近接させることを許容しなければ、要求する寸法の信号伝送基板を成立させることが困難になってきている。   The electromagnetic environment in which industrial electronic equipment is placed is inferior, and it is usually necessary to keep the power supply circuit, which may be penetrated by high-voltage switch noise of the kilovolt class, from being close to the signal wiring. For this reason, the circuit is arranged or wired so as not to bring the power supply circuit and the signal wiring close to each other by enlarging the board size or adding a board. With recent demands for downsizing electronic devices, the degree of freedom in circuit arrangement has decreased, and it is difficult to establish a signal transmission board with the required dimensions unless the power supply circuit and signal wiring are allowed to be close to each other. It is becoming.

従来、耐ノイズ性能を有する配線基板として、特許文献１あるいは特許文献２が提案されている。特許文献１は信号配線同士を近接配置した際のクロストーク等の抑制あるいは信号線のインピーダンスコントロールを課題とするものである。上記課題に対しては、
１．差動平衡信号線対同士の間に、２次側接地用配線あるいは２次側電源用配線の少なくとも一方を設けることにより、クロストークなどのノイズを抑制する点、
２．差動信号線対の両側に必ず接地用配線および電源用配線を配置し、信号配線中に流れる信号の負荷を通って信号源に帰ってくるリターン電流が、必ず隣接する配線中を流れるようにする点、
３．２次側接地用配線および２次側電源配線のそれぞれの幅が、差動信号線対の信号線の幅よりも広い点、
の以上３点で解決を図っている。 Conventionally, Patent Document 1 or Patent Document 2 has been proposed as a wiring board having noise resistance. Japanese Patent Application Laid-Open No. 2004-228688 has a problem of suppressing crosstalk or controlling the impedance of signal lines when signal wirings are arranged close to each other. For the above issues,
1. Providing at least one of secondary-side ground wiring or secondary-side power supply wiring between the differential balanced signal line pairs to suppress noise such as crosstalk,
2. Be sure to place grounding wiring and power supply wiring on both sides of the differential signal line pair so that the return current that returns to the signal source through the signal load flowing in the signal wiring always flows in the adjacent wiring. Points to do,
3. The width of each of the secondary side ground wiring and the secondary power supply wiring is wider than the width of the signal line of the differential signal line pair,
The above three points are being solved.

特許文献２では、特許文献１と同様の課題に対し、信号配線を電源配線と交差させることで解決を図っている。   In Patent Document 2, a problem similar to that of Patent Document 1 is solved by crossing signal wiring with power supply wiring.

特開２００１−７４５８号公報JP 2001-7458 A 特開２００３−１６３４６７号公報JP 2003-163467 A

しかしながら、特許文献１の配線配置方法では高電圧ノイズによる１次側電源配線および１次側グランド配線と、２次側信号配線との間の強電界が抑制できず、１次側電源配線および１次側グランド配線と、２次側信号配線とを直交配置することによっても十分なノイズ抑制効果が得られていない。   However, the wiring arrangement method of Patent Document 1 cannot suppress a strong electric field between the primary side power supply wiring and the primary side ground wiring due to high voltage noise and the secondary side signal wiring, and the primary side power supply wiring and 1 Even when the secondary ground wiring and the secondary signal wiring are arranged orthogonally, a sufficient noise suppression effect is not obtained.

特許文献１における２次側電源配線の配置では、差動平衡信号線の不平衡が大きくなるため、ノイズの抑圧効果が十分に得られない。   In the arrangement of the secondary power supply wiring in Patent Document 1, the unbalance of the differential balanced signal line becomes large, so that the noise suppression effect cannot be sufficiently obtained.

また、特許文献１および２では、１次側信号配線間または２次側信号配線間、つまり「信号線路」間のクロストーク低減については、解決されるものの、１次側電源配線、１次側グランド配線といった、「１次側配線」から「２次側配線」へのノイズ漏洩を回避するのが困難であった。特に、「１次側配線」から「２次側信号配線」へのノイズ漏洩は深刻な課題である。   In Patent Documents 1 and 2, although the reduction of crosstalk between primary-side signal wires or between secondary-side signal wires, that is, between “signal lines” is solved, primary-side power supply wires, primary-side wires It was difficult to avoid noise leakage from “primary side wiring” to “secondary side wiring” such as ground wiring. In particular, noise leakage from “primary wiring” to “secondary signal wiring” is a serious problem.

本発明は、上記に鑑みてなされたものであって、１次側配線から２次側信号配線へのノイズを抑制しつつ、１次側配線と２次側信号配線とを重ねることができ、回路レイアウトの自由度が高い信号伝送基板を得ることを目的とする。   The present invention has been made in view of the above, and it is possible to overlap the primary side wiring and the secondary side signal wiring while suppressing noise from the primary side wiring to the secondary side signal wiring. An object is to obtain a signal transmission board having a high degree of freedom in circuit layout.

上述した課題を解決し、目的を達成するために、本発明は、外部電源に接続された１次側電源配線を含む１次側配線を備えた１次側回路部と、１次側回路部の出力が入力され、信号伝送基板内に信号入力を行う２次側信号配線と、２次側信号配線から一定の間隔を隔てて配置された２次側グランド配線とを含む２次側配線を備えた２次側回路部とを備える。２次側信号配線および２次側グランド配線は、１次側電源配線と空間的に交差する交差回路部を備える。２次側グランド配線は、交差回路部において、１次側電源配線の周囲で１次側電源配線との距離が、１次側電源配線との交差領域における１次側電源配線との距離より大きい重畳回避部を構成したことを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention provides a primary-side circuit section including a primary-side wiring including a primary-side power supply wiring connected to an external power supply, and a primary-side circuit section. The secondary side wiring including the secondary side signal wiring for inputting the signal into the signal transmission board and the secondary side ground wiring arranged at a certain distance from the secondary side signal wiring. A secondary side circuit unit provided. The secondary side signal wiring and the secondary side ground wiring include a cross circuit portion that spatially intersects with the primary power supply wiring. In the intersecting circuit portion, the distance between the secondary-side ground wiring and the primary-side power wiring around the primary-side power wiring is larger than the distance from the primary-side power wiring in the region intersecting with the primary-side power wiring. A superposition avoiding unit is configured.

本発明によれば、１次側配線から２次側信号配線へのノイズを抑制しつつ、１次側配線と２次側信号配線とを重ねることができ、回路レイアウトの自由度が高い信号伝送基板を得ることができるという効果を奏する。   According to the present invention, the primary side wiring and the secondary side signal wiring can be overlapped while suppressing noise from the primary side wiring to the secondary side signal wiring, and the signal transmission with a high degree of freedom in circuit layout. There is an effect that a substrate can be obtained.

実施の形態１の信号伝送基板を用いた送受信モジュールの回路構成を示す説明図Explanatory drawing which shows the circuit structure of the transmission / reception module using the signal transmission board | substrate of Embodiment 1. FIG. 実施の形態１の信号伝送基板の要部拡大説明図Explanatory drawing of the principal part of the signal transmission board of the first embodiment 図２のIII−III断面図III-III sectional view of FIG. 図２のIV−IV断面図IV-IV sectional view of FIG. ２次側グランド配線接続部の変形例であり、図２のIV-IV断面図に相当する断面図Sectional view equivalent to the IV-IV sectional view of FIG. 図１のVI−VI断面図VI-VI cross section of Fig. 1 実施の形態２の信号伝送基板の要部拡大説明図Explanatory drawing of the principal part of the signal transmission board of the second embodiment 図７のVIII−VIII断面図VIII-VIII sectional view of FIG. 実施の形態３の信号伝送基板の要部拡大説明図Explanatory drawing of the principal part of the signal transmission board of the third embodiment 図９の信号伝送基板における交差回路部の交差角θと並行線路長との関係を示す図The figure which shows the relationship between the crossing angle (theta) of the crossing circuit part in the signal transmission board | substrate of FIG. 9, and parallel line length. 実施の形態４の信号伝送基板を斜視的に示す説明図Explanatory drawing which shows the signal transmission board | substrate of Embodiment 4 perspectively 実施の形態４の信号伝送基板の要部拡大説明図Explanatory drawing of the principal part of the signal transmission board of the fourth embodiment 実施の形態５の信号伝送基板の配線層の層構造の断面を示す説明図Explanatory drawing which shows the cross section of the layer structure of the wiring layer of the signal transmission board | substrate of Embodiment 5. 実施の形態６の信号伝送基板の要部拡大説明図Explanatory drawing of the principal part of the signal transmission board of the sixth embodiment 実施の形態７および８の信号伝送基板の要部拡大説明図Explanatory drawing of the principal part of the signal transmission board of Embodiments 7 and 8 実施の形態９の信号伝送基板の要部拡大説明図The main part expansion explanatory drawing of the signal transmission board | substrate of Embodiment 9. FIG.

以下に、本発明に係る信号伝送基板の実施の形態を図面に基づいて詳細に説明する。なお、この実施の形態により本発明が限定されるものではなく、本発明の要旨を逸脱しない範囲において適宜変更可能である。また、以下に示す図面においては、理解の容易のため、各部材の縮尺が実際とは異なる場合がある。各図面間においても同様である。   Embodiments of a signal transmission board according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments, and can be appropriately changed without departing from the gist of the present invention. In the drawings shown below, the scale of each member may be different from the actual scale for easy understanding. The same applies between the drawings.

実施の形態１．
図１は、実施の形態１の信号伝送基板を用いた送受信モジュールＭの回路構成を示す説明図である。図２は、実施の形態１の信号伝送基板の要部拡大説明図である。図３は、図２のIII−III断面図である。図４は、図２のIV−IV断面図である。図５は、２次側グランド配線接続部２ＧＣの変形例であり、図４と同様、図２のIV−IV断面に相当する断面図である。図６は、図１のVI−VI断面図である。なお図１は、説明図であるが、図６は図１の断面を想定した図とした。また、図２において、基材１１を省略して下層が見えるように説明している。実施の形態１の信号伝送基板１０は、外部電源１０１に接続された１次側電源配線１Ｐ、１次側グランド配線１Ｇを含む１次側配線１、後述する１次側電源１０２などの機能回路とを備えた１次側回路部１００と、１次側回路部１００の出力が入力され、信号伝送基板１０内に信号入力を行う２次側信号配線２ＳＡ，２ＳＢと２次側信号配線２ＳＡ，２ＳＢから一定の間隔を隔てて配置された２次側グランド配線２Ｇとを含む２次側配線２と、後述する電子回路２０３などの各機能回路とを備えた２次側回路部２００とを備える。２次側信号配線２ＳＡ，２ＳＢは、差動配線対を構成する。２次側信号配線２ＳＡ，２ＳＢおよび２次側グランド配線２Ｇは、１次側電源配線１Ｐ、１次側グランド配線１Ｇと空間的に交差する交差回路部３００を備える。２次側グランド配線２Ｇは、交差回路部３００において、１次側電源配線１Ｐ、１次側グランド配線１Ｇの周囲で欠落部を有し、１次側電源配線１Ｐ、１次側グランド配線１Ｇとの距離がより大きい重畳回避部３００Ｓを構成したことを特徴とする。２次側グランド配線２Ｇは、交差回路部３００で１次側電源配線１Ｐ、１次側グランド配線１Ｇと交差しており、重畳回避部３００Ｓでは、２次側グランド配線２Ｇが切除されており、１次側電源配線１Ｐ、１次側グランド配線１Ｇの周囲で１次側電源配線１Ｐ、１次側グランド配線１Ｇとの距離が一定値以上となっている。２次側グランド配線２Ｇは、交差回路部において、１次側電源配線１Ｐ、１次側グランド配線１Ｇの周囲で１次側電源配線との距離が、交差領域における１次側電源配線１Ｐ、１次側グランド配線１Ｇとの距離より大きい重畳回避部を構成する。つまり、２次側グランド配線２Ｇは、交差回路部において、１次側電源配線１Ｐ、１次側グランド配線１Ｇの周囲で、実質的な交差領域を最小限にし、交差領域の周辺では重畳を回避し１次側電源配線１Ｐ、１次側グランド配線１Ｇとの距離が、交差領域における距離よりも大きくなるようにしている。また、１次側電源配線１Ｐと１次側グランド配線１Ｇ間の高電圧ノイズがなす強電界を、１次側電源配線１Ｐと１次側グランド配線１Ｇを近距離で重ねることで最小にする。 Embodiment 1 FIG.
FIG. 1 is an explanatory diagram illustrating a circuit configuration of a transmission / reception module M using the signal transmission board according to the first embodiment. FIG. 2 is an enlarged explanatory view of a main part of the signal transmission board according to the first embodiment. 3 is a cross-sectional view taken along the line III-III in FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. FIG. 5 is a modification of the secondary side ground wiring connection portion 2GC, and is a cross-sectional view corresponding to the IV-IV cross section of FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. Although FIG. 1 is an explanatory diagram, FIG. 6 is a diagram assuming the cross section of FIG. Moreover, in FIG. 2, the base material 11 is abbreviate | omitted and it demonstrates so that a lower layer can be seen. The signal transmission board 10 according to the first embodiment includes functional circuits such as a primary side power line 1P connected to an external power source 101, a primary side line 1 including a primary side ground line 1G, and a primary side power source 102 described later. The secondary side signal wiring 2SA, 2SB and the secondary side signal wiring 2SA for inputting signals into the signal transmission board 10 are input. A secondary-side wiring 2 including a secondary-side ground wiring 2G disposed at a certain distance from 2SB, and a secondary-side circuit unit 200 including each functional circuit such as an electronic circuit 203 described later. . The secondary side signal wirings 2SA and 2SB constitute a differential wiring pair. The secondary side signal wirings 2SA and 2SB and the secondary side ground wiring 2G include a cross circuit section 300 that spatially intersects with the primary side power supply wiring 1P and the primary side ground wiring 1G. The secondary-side ground wiring 2G has a missing portion around the primary-side power wiring 1P and the primary-side ground wiring 1G in the cross circuit section 300. The primary-side power wiring 1P and the primary-side ground wiring 1G The superposition avoiding unit 300S having a larger distance is configured. The secondary-side ground wiring 2G intersects the primary-side power supply wiring 1P and the primary-side ground wiring 1G at the intersection circuit section 300, and the secondary-side ground wiring 2G is cut off at the overlap avoidance section 300S. The distance between the primary side power supply wiring 1P and the primary side ground wiring 1G around the primary side power supply wiring 1P and the primary side ground wiring 1G is a certain value or more. The secondary-side ground wiring 2G has a distance from the primary-side power supply wiring 1P around the primary-side ground wiring 1G in the intersecting circuit portion so that the primary-side power-supply wiring 1P, 1P A superposition avoidance unit that is larger than the distance from the next-side ground wiring 1G is configured. That is, the secondary-side ground wiring 2G minimizes the substantial intersection area around the primary-side power supply wiring 1P and the primary-side ground wiring 1G in the intersection circuit portion, and avoids overlapping around the intersection area. The distance between the primary side power supply wiring 1P and the primary side ground wiring 1G is set to be larger than the distance in the intersection region. Further, the strong electric field generated by the high voltage noise between the primary power supply wiring 1P and the primary ground wiring 1G is minimized by overlapping the primary power supply wiring 1P and the primary ground wiring 1G at a short distance.

送受信モジュールＭに実装される信号伝送基板１０は、外部の外部電源１０１から電源電圧を入力される１次側電源１０２を備えた１次側回路部１００と、１次側回路部１００から入力された電源電圧により駆動される２次側回路部２００とを具備している。２次側回路部２００は、１次側回路部１００から入力された電源電圧を制御する２次側電源２０１と、２次側電源２０１の出力を所望の電圧に制御する中間バス電源２０２と、中間バス電源２０２の出力に接続された、負荷回路である電子回路２０３と、電子回路２０３に接続された信号送受信回路２０４Ｍとを具備している。実施の形態１の信号伝送基板１０では、送受信用のコネクタ２０４Ｃ、信号送受信回路２０４Ｍを構成する半導体チップが、隣接する２つの角Ａ，Ｂに設けられている。従って、送受信用のコネクタ２０４Ｃ、信号送受信回路２０４Ｍとを接続する２次側配線２が必要となるが、信号伝送基板１０の隣接する２つの角Ａ，Ｂを結ぶ第１辺１０Ａに沿った配線とするのが最短の配線長となる。そこで１次側回路部１００から電源電圧が入力されるための１次側配線１は、信号伝送基板１０の隣接する２つの角Ａ，Ｂを結ぶ第１辺１０Ａと直交する位置で入力されているため、１次側配線１と２次側配線２とが交差することになる。   The signal transmission board 10 mounted on the transmission / reception module M is input from the primary side circuit unit 100 including the primary side power source 102 to which the power source voltage is input from the external power source 101 and the primary side circuit unit 100. And a secondary circuit unit 200 driven by the power supply voltage. The secondary side circuit unit 200 includes a secondary side power source 201 that controls the power source voltage input from the primary side circuit unit 100, an intermediate bus power source 202 that controls the output of the secondary side power source 201 to a desired voltage, An electronic circuit 203, which is a load circuit, is connected to the output of the intermediate bus power source 202, and a signal transmission / reception circuit 204M is connected to the electronic circuit 203. In the signal transmission board 10 of the first embodiment, the semiconductor chips constituting the transmission / reception connector 204C and the signal transmission / reception circuit 204M are provided at two adjacent corners A and B. Accordingly, the secondary wiring 2 that connects the transmission / reception connector 204C and the signal transmission / reception circuit 204M is required, but the wiring along the first side 10A connecting the two adjacent corners A and B of the signal transmission board 10 is necessary. Is the shortest wiring length. Therefore, the primary side wiring 1 for inputting the power supply voltage from the primary side circuit unit 100 is input at a position orthogonal to the first side 10A connecting two adjacent corners A and B of the signal transmission board 10. Therefore, the primary side wiring 1 and the secondary side wiring 2 cross each other.

図３に示すように、１次側配線１は、１層、２層に配されている。また２次側配線２は、２本の差動配線対を構成する２次側信号配線２ＳＡおよび２ＳＢと差動配線対の両側に並置された２本の２次側グランド配線２Ｇとを具備している。そして２次側グランド配線２Ｇが、１次側電源配線１Ｐ、１次側グランド配線１Ｇと交差する交差領域で、除去されて重畳回避部３００Ｓを形成している。実施の形態１で、重畳回避部３００Ｓによって、１次側電源配線１Ｐ、１次側グランド配線１Ｇからの距離が既定の値以上となるように、１次側電源配線１Ｐ、１次側グランド配線１Ｇとの交差部では２次側グランド配線が除去されている。そしてビア２Ｖによって最上層の接続部２ＧＣを介して２本の２次側グランド配線２Ｇは接続され、同電位となっている。   As shown in FIG. 3, the primary wiring 1 is arranged in one layer and two layers. The secondary wiring 2 includes secondary signal wirings 2SA and 2SB constituting two differential wiring pairs and two secondary ground wirings 2G juxtaposed on both sides of the differential wiring pair. ing. The secondary side ground wiring 2G is removed at the intersection region intersecting with the primary side power supply wiring 1P and the primary side ground wiring 1G to form a superposition avoiding portion 300S. In the first embodiment, the primary-side power wiring 1P and the primary-side ground wiring are set so that the distance from the primary-side power wiring 1P and the primary-side ground wiring 1G is equal to or greater than a predetermined value by the overlap avoidance unit 300S. The secondary ground wiring is removed at the intersection with 1G. The two secondary ground wirings 2G are connected to each other by the via 2V via the uppermost connection portion 2GC and have the same potential.

２次側信号配線２ＳＡおよび２ＳＢからなる差動配線対の両側に２本の２次側グランド配線２Ｇを並置するとともに、１次側配線１との交差部の２次側グランド配線２Ｇに重畳回避部３００Ｓを形成することで、２次側配線２を形成している。従って、クロストークを低減しかつ、１次側配線１のノイズによる影響を低減している。従って、実施の形態１の信号伝送基板１０によれば、２次側信号配線２ＳＡおよび２ＳＢのクロストークを低減しかつ、１次側配線１のノイズによる影響を抑制しつつも、２次側配線２で形成される送受信回路２０４Ｍから送受信用のコネクタ２０４Ｃとの接続を最短距離で実現し配線長を低減することができる。   Two secondary-side ground wirings 2G are juxtaposed on both sides of the differential wiring pair composed of the secondary-side signal wirings 2SA and 2SB, and overlapping with the secondary-side ground wiring 2G at the intersection with the primary-side wiring 1 is avoided. By forming the portion 300S, the secondary wiring 2 is formed. Therefore, crosstalk is reduced and the influence of noise on the primary side wiring 1 is reduced. Therefore, according to the signal transmission board 10 of the first embodiment, the secondary side wiring while reducing the crosstalk of the secondary side signal wirings 2SA and 2SB and suppressing the influence of noise on the primary side wiring 1. The transmission / reception circuit 204M formed by 2 can be connected to the transmission / reception connector 204C with the shortest distance to reduce the wiring length.

１次側電源１０２は、信号伝送基板１０内の２次側回路部２００に直流電力を供給する機能を有している。１次側電源１０２は、絶縁回路、あるいは絶縁回路に準ずるＸコンデンサ、Ｙコンデンサおよびコモンモードチョークコイルなどのフィルタ回路を介して、２次側電源２０１に接続される。上記フィルタ回路により、１次側回路部１００から２次側回路部２００間へと絶縁、もしくは不要な交流電力が伝播しないようになっている。２次側信号配線は、１次側配線１との交差部に対応する領域にフィルタ回路を配することで、１次側回路部１００からの不要な交流電力の伝搬を防止することができる。   The primary power source 102 has a function of supplying DC power to the secondary circuit unit 200 in the signal transmission board 10. The primary power supply 102 is connected to the secondary power supply 201 via an insulating circuit or a filter circuit such as an X capacitor, a Y capacitor, and a common mode choke coil according to the insulating circuit. The filter circuit prevents insulation or unnecessary AC power from propagating from the primary side circuit unit 100 to the secondary side circuit unit 200. The secondary-side signal wiring can prevent unnecessary AC power from being propagated from the primary-side circuit unit 100 by arranging a filter circuit in a region corresponding to the intersection with the primary-side wiring 1.

以上のように、実施の形態１の信号伝送基板１０によれば、回路配置の自由度を得るために、１次側回路部１００からの１次側電源配線１Ｐ、１次側グランド配線１Ｇが２次側回路部２００の形成された領域を横断するように配線するとき、２次側回路部２００は分断された部位である、重畳回避部３００Ｓをもつ。信号伝送基板１０上で２次側信号配線２ＳＡ，２ＳＢおよび２次側グランド配線２Ｇを構成する回路パターン１２において、１次側電源配線１Ｐ、１次側グランド配線１Ｇとの交差部で２次側グランド配線２Ｇを分断し、重なり合うのを回避している。分断された２次側グランド配線２Ｇは図２から図３に示すように、最上層配線層上でビア２Ｖを介して最上層の配線パターン１２で２次側グランド配線接続部２ＧＣを構成する。   As described above, according to the signal transmission board 10 of the first embodiment, in order to obtain a degree of freedom in circuit arrangement, the primary power supply wiring 1P and the primary ground wiring 1G from the primary circuit unit 100 are provided. When wiring is performed so as to cross the region where the secondary side circuit unit 200 is formed, the secondary side circuit unit 200 has a superposition avoiding unit 300S, which is a divided part. In the circuit pattern 12 constituting the secondary side signal wirings 2SA and 2SB and the secondary side ground wiring 2G on the signal transmission board 10, the secondary side is crossed with the primary side power supply wiring 1P and the primary side ground wiring 1G. The ground wiring 2G is divided to avoid overlapping. As shown in FIGS. 2 to 3, the divided secondary ground wiring 2 </ b> G constitutes the secondary ground wiring connection portion 2 </ b> GC with the uppermost wiring pattern 12 via the via 2 </ b> V on the uppermost wiring layer.

なお、分断された２次側グランド配線２Ｇは図５に示すように、最下層の回路パターンにベタ状の配線からなるグランド層２ＧＣＣを形成し最上層にはグランド接続部２ＧＣを形成し、それぞれベタ状の配線としてもよい。分断された２次側回路部２００の２次側グランド配線２Ｇ同士はビア２Ｖを介した配線接続部２ＧＣで接続する。また、分断された２次側回路部２００間における信号伝送のために、２次側信号配線２ＳＡ，２ＳＢおよび２次側グランド配線接続部２ＧＣについては、１次側回路部１００からの１次側電源配線１Ｐ、１次側グランド配線１Ｇに対して信号伝送基板１０内で重ねて配置する。   As shown in FIG. 5, the divided secondary-side ground wiring 2G forms a ground layer 2GCC composed of a solid wiring in the lowermost circuit pattern, and forms a ground connection portion 2GC in the uppermost layer. A solid wiring may be used. The secondary ground wirings 2G of the divided secondary circuit part 200 are connected to each other by a wiring connection part 2GC through a via 2V. Further, for signal transmission between the divided secondary side circuit units 200, the secondary side signal wirings 2SA and 2SB and the secondary side ground wiring connection unit 2GC are connected to the primary side from the primary side circuit unit 100. The power supply wiring 1P and the primary side ground wiring 1G are arranged so as to overlap in the signal transmission board 10.

なお、２次側信号配線２ＳＡ，２ＳＢには、フィルタ回路２０５ａ，２０５ｂを、必要に応じて、１次側回路部１００からの１次側電源配線１Ｐおよび１次側グランド配線１Ｇを河渡する前後いずれか若しくは両方に配置する。２次側信号配線に１次側電源配線および１次側グランド配線からのノイズが重畳するので、１次側電源配線および１次側グランド配線を河渡する前後両方に構成したフィルタ回路２０５ａ，２０５ｂがノイズを除去する。１次側電源配線および１次側グランド配線を河渡する前後両方にフィルタ回路２０５ａ，２０５ｂを設けたが、いずれか一方でもよいことはいうまでもない。   Note that filter circuits 205a and 205b are connected to the secondary signal wirings 2SA and 2SB, and before and after the primary power supply wiring 1P and the primary ground wiring 1G from the primary circuit unit 100 are crossed as necessary. Place in either or both. Since noise from the primary power supply wiring and the primary ground wiring is superimposed on the secondary signal wiring, the filter circuits 205a and 205b configured both before and after the primary power supply wiring and the primary ground wiring are crossed. Remove noise. Although the filter circuits 205a and 205b are provided both before and after the primary power supply wiring and the primary ground wiring are crossed, it goes without saying that either one may be used.

分断された２次側回路部２００の２次側グランド配線２Ｇにはそれぞれベタ状の配線を信号伝送基板１０の内層もしく表層あるいは両方に配置してもよい。分断された２次側回路部２００の２次側グランド配線２Ｇ同士はグランド配線接続部２ＧＣで接続することにより、高周波領域において同電位を保つ、あるいは電気的に共振しない構造になり、ノイズが発生しにくくなる。   Solid wirings may be arranged in the inner layer, the surface layer, or both of the signal transmission board 10 in the secondary ground wiring 2G of the divided secondary circuit part 200, respectively. The secondary ground wirings 2G of the divided secondary circuit part 200 are connected to each other by the ground wiring connection part 2GC, so that the same potential is maintained in the high frequency region or the structure does not electrically resonate, and noise is generated. It becomes difficult to do.

また、分断された２次側回路部２００間における信号伝送のために、１次側電源配線１Ｐおよび１次側グランド配線１Ｇに対してプリント配線板内で重ねた２次側信号配線２ＳＡ，２ＳＢを配置し、分断された２次側回路部２００間を最短で信号伝送する。   Further, for signal transmission between the divided secondary circuit parts 200, the secondary signal wirings 2SA and 2SB overlapped in the printed wiring board with respect to the primary power supply wiring 1P and the primary ground wiring 1G. And the signal is transmitted between the divided secondary circuit units 200 in the shortest time.

送受信モジュールＭを構成する信号伝送基板１０は、例えばガラス、エポキシ樹脂などを主成分とする基材に銅等の金属を主成分とする回路パターンおよびビアホールを形成し、３層程度積層した基板を用いる。   The signal transmission board 10 constituting the transmission / reception module M is a board in which, for example, a circuit pattern and a via hole mainly made of metal such as copper are formed on a base material mainly made of glass, epoxy resin, etc., and about 3 layers are laminated. Use.

つまり信号伝送基板１０は、図６に図１のVI−VI断面図を示すように、基材１１と回路パターン１２とで構成されている。回路パターン１２は、基材１１間に形成される中間層パターン１２ｉ、チップ部品搭載領域に形成されるパッド１２ｄを含む回路形成部を具備している。実施の形態１の信号伝送基板１０では、回路形成部は、基材１１を介して積層され、スルーホールで電気的に接続された回路パターンを構成する４層の配線層１２Ｃ１から１２Ｃ４を備えている。   That is, the signal transmission board 10 includes the base material 11 and the circuit pattern 12 as shown in the VI-VI cross-sectional view of FIG. The circuit pattern 12 includes a circuit forming portion including an intermediate layer pattern 12i formed between the base materials 11 and a pad 12d formed in a chip component mounting region. In the signal transmission board 10 according to the first embodiment, the circuit forming unit includes four wiring layers 12C1 to 12C4 which are stacked via the base material 11 and constitute a circuit pattern electrically connected through a through hole. Yes.

なお、図６では、電子回路２０３を構成するチップ部品のみが図示されているが、回路パターン１２については配線層のみを図示し、パターン配置は省略している。電子回路２０３を構成するチップ部品は、半導体集積回路部品２０３ａと、チップコンデンサ２０３ｃと、チップ抵抗２０３Ｒとを備え、最表層の配線層１２Ｃ４で構成された回路パターン上に搭載され、電子回路２０３を構成している。   In FIG. 6, only chip components constituting the electronic circuit 203 are illustrated, but only the wiring layer is illustrated for the circuit pattern 12, and the pattern arrangement is omitted. A chip component that constitutes the electronic circuit 203 includes a semiconductor integrated circuit component 203a, a chip capacitor 203c, and a chip resistor 203R. The chip component is mounted on a circuit pattern that includes the wiring layer 12C4 as the outermost layer. It is composed.

また信号伝送基板１０上には、図１に示した、１次側電源１０２、２次側電源２０１と、中間バス電源２０２と、信号送受信回路２０４Ｍは、電子回路２０３と同様、チップ部品及び回路パターンにて構成されている。   On the signal transmission board 10, the primary power source 102, the secondary power source 201, the intermediate bus power source 202, and the signal transmission / reception circuit 204 </ b> M shown in FIG. It consists of patterns.

実施の形態１の信号伝送基板によれば、１次側電源配線１Ｐと１次側グランド配線１Ｇ間の高電圧ノイズがなす強電界を１次側電源配線１Ｐと１次側グランド配線１Ｇを近距離で重ねることで最小にするものである。基板サイズを大きくして、２次側信号配線を配線することなく、あるいは基板を追加して１次側電源配線および１次側グランド配線を迂回することなく信号伝送を行うことが可能になる。   According to the signal transmission board of the first embodiment, a strong electric field generated by high voltage noise between the primary side power supply wiring 1P and the primary side ground wiring 1G is brought close to the primary side power supply wiring 1P and the primary side ground wiring 1G. It is minimized by overlapping with distance. It is possible to increase the board size and perform signal transmission without wiring the secondary signal wiring, or without adding a board and bypassing the primary power supply wiring and the primary ground wiring.

２次側回路内の２次側グランド配線を２次側グランド配線接続部２ＧＣで接続することで２次側グランド配線内が高周波領域において同電位になることで回路の誤動作を抑制する効果を得る。   By connecting the secondary-side ground wiring in the secondary-side circuit with the secondary-side ground wiring connecting portion 2GC, the secondary-side ground wiring has the same potential in the high-frequency region, thereby suppressing the malfunction of the circuit. .

重畳回避部を設けることにより１次側電源配線および１次側グランド配線から２次側回路に侵入したノイズを抑制できるので、信号通信における誤動作の発生を抑制することができる。   By providing the overlap avoidance section, noise that has entered the secondary circuit from the primary power supply wiring and the primary ground wiring can be suppressed, so that the occurrence of malfunctions in signal communication can be suppressed.

実施の形態２．
実施の形態２の信号伝送基板について図７および８を参照しつつ説明する。図７は、実施の形態２の信号伝送基板の要部拡大説明図である。また、図７において、基材１１を省略して下層が見えるように説明している。図８は、図７のVIII−VIII断面図である。２次側グランド配線２Ｇと２次側グランド配線接続部２ＧＣとを別の配線層で形成した実施の形態１に対して、実施の形態２では、２次側信号配線を信号伝送基板上の同一層に構成し、２次側グランド配線２Ｇを２次側信号配線２ＳＡ，２ＳＢの近傍に並行および並列配置し、１次電源配線１Ｐ、１次側グランド配線１Ｇに対して直交配置する。他の構成については実施の形態１と同様であるため、説明を省略する。 Embodiment 2. FIG.
The signal transmission board according to the second embodiment will be described with reference to FIGS. FIG. 7 is an enlarged explanatory view of a main part of the signal transmission board according to the second embodiment. Moreover, in FIG. 7, the base material 11 is abbreviate | omitted and it demonstrates so that a lower layer can be seen. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. In contrast to the first embodiment in which the secondary-side ground wiring 2G and the secondary-side ground wiring connection portion 2GC are formed of different wiring layers, in the second embodiment, the secondary-side signal wiring is arranged on the signal transmission board. The secondary ground wiring 2G is arranged in a single layer in parallel and in parallel in the vicinity of the secondary signal wirings 2SA and 2SB, and is arranged orthogonal to the primary power supply wiring 1P and the primary ground wiring 1G. Since other configurations are the same as those in the first embodiment, description thereof is omitted.

実施の形態２の信号伝送基板によれば、２次側信号配線、２次側グランド配線同士を接続する配線を同一層で構成することができ、構成の簡略化および基板の薄型化をはかりつつも、分断された２次側回路の２次側グランド配線同士を接続する配線に重畳するノイズを一定量以下に抑制でき、分断された２次側回路間の通信が可能となることから省配線の効果を得ることができる。また、回路配置に自由度を与えることができる。   According to the signal transmission board of the second embodiment, the secondary signal wiring and the wiring connecting the secondary ground wirings can be configured in the same layer, while simplifying the configuration and reducing the thickness of the board. However, the noise superimposed on the wiring that connects the secondary ground wirings of the divided secondary circuit can be suppressed to a certain level or less, and communication between the divided secondary circuits becomes possible, thereby reducing wiring. The effect of can be obtained. In addition, a degree of freedom can be given to the circuit arrangement.

実施の形態３．
実施の形態３の信号伝送基板について図９および１０を参照しつつ用いて説明する。図９は、実施の形態３の信号伝送基板の要部拡大説明図である。また、図９において、基材１１を省略して下層が見えるように説明している。図１０は、図９の信号伝送基板における交差回路部の交差角θと並行線路長との関係を示す図である。２次側グランド配線接続部２ＧＣを２次側信号配線２ＳＡ，２ＳＢと同一の配線層で形成した実施の形態２と同様、実施の形態３でも、２次側信号配線を信号伝送基板上の同一層に構成し、２次側グランド配線２Ｇを２次側信号配線２ＳＡ，２ＳＢに並行および並列配置し、１次電源配線１Ｐ、１次側グランド配線１Ｇに対して角度θ以内で交わる配置とする。他の構成については実施の形態２と同様であるため、説明を省略する。 Embodiment 3 FIG.
The signal transmission board according to the third embodiment will be described with reference to FIGS. FIG. 9 is an enlarged explanatory view of a main part of the signal transmission board according to the third embodiment. Moreover, in FIG. 9, the base material 11 is abbreviate | omitted and it demonstrates so that a lower layer can be seen. FIG. 10 is a diagram illustrating the relationship between the crossing angle θ of the crossing circuit portion and the parallel line length in the signal transmission board of FIG. 9. Similar to the second embodiment in which the secondary-side ground wiring connecting portion 2GC is formed of the same wiring layer as the secondary-side signal wirings 2SA and 2SB, in the third embodiment, the secondary-side signal wiring is arranged on the signal transmission board. It is configured in a single layer, and the secondary ground wiring 2G is arranged in parallel and in parallel with the secondary signal wirings 2SA and 2SB so as to intersect with the primary power supply wiring 1P and the primary ground wiring 1G within an angle θ. . Since other configurations are the same as those in the second embodiment, the description thereof is omitted.

１次側電源配線および１次側グランド配線に対して既定の並行線路長以下に配線する点について説明する。並行線路とは並行および並列配置された信号線路をいうものとする。並行線路長とは分断された２次側回路の２次側信号配線、２次側グランド配線同士を接続する配線が１次側電源配線および１次側グランド配線となす角度θのときの、１次側電源配線および１次側グランド配線に対する等価的な並走距離Ｄpをいう。   A description will be given of a point where the primary side power supply wiring and the primary side ground wiring are wired to a predetermined parallel line length or less. Parallel lines refer to signal lines arranged in parallel and in parallel. The parallel line length is 1 when the secondary signal wiring and secondary ground wiring of the divided secondary circuit are at an angle θ between the primary power wiring and primary ground wiring. This is equivalent to the parallel running distance Dp for the secondary power supply wiring and primary ground wiring.

等価的な並走距離Ｄpが、１次側電源配線および１次側グランド配線に重畳しているノイズの周波数で決定される波長λに対して、λ／２０以下となるように設定する。並走距離が、重畳しているノイズの周波数で決定される波長λに対して、λ／２０以下となるように設定するのは、重畳するノイズの波長λに対し、並走距離Ｄpがλ／４のとき、アンテナとして機能し、配線に漏洩する。このため、ノイズの波長λに対し、並走距離Ｄpを十分に小さいλ／２０以下とし、配線への漏洩量を低減する。   The equivalent parallel running distance Dp is set to be λ / 20 or less with respect to the wavelength λ determined by the noise frequency superimposed on the primary side power supply wiring and the primary side ground wiring. The parallel running distance is set to be λ / 20 or less with respect to the wavelength λ determined by the frequency of the superimposed noise. The parallel running distance Dp is λ with respect to the wavelength λ of the superimposed noise. At / 4, it functions as an antenna and leaks into the wiring. For this reason, the parallel running distance Dp is set to a sufficiently small λ / 20 or less with respect to the noise wavelength λ, and the amount of leakage to the wiring is reduced.

２次側信号配線、分断された２次側回路の２次側グランド配線同士を接続する配線長をＤcとすると、θに対する制約は次のとおりである。   When the wiring length connecting the secondary side signal wiring and the secondary ground wiring of the divided secondary circuit is Dc, the restriction on θ is as follows.

Figure 2017163054
Figure 2017163054

２次側信号配線を差動配線対とすると信号へのノイズ漏洩をさらに大幅に抑制することが可能である。   When the secondary signal wiring is a differential wiring pair, it is possible to further significantly suppress noise leakage to the signal.

上記構成によれば、分断された２次側回路の２次側グランド配線同士を接続する配線に重畳するノイズを一定量以下に抑制でき、分断された２次側回路間の通信が可能となることから省配線の効果を得ることができる。また、交差角度の余裕を与えたことで、回路配置にさらなる自由度を与えることができる。   According to the above configuration, the noise superimposed on the wiring connecting the secondary ground wirings of the divided secondary circuit can be suppressed to a certain amount or less, and communication between the divided secondary circuits becomes possible. Therefore, the effect of wiring saving can be obtained. Further, by providing a margin for the crossing angle, it is possible to give a further degree of freedom to the circuit arrangement.

実施の形態４．
実施の形態４の信号伝送基板について図１１および１２を参照しつつ用いて説明する。図１１は、実施の形態４の信号伝送基板を斜視的に示す説明図である。図１２は、実施の形態４の信号伝送基板の要部拡大説明図である。実施の形態４の信号伝送基板は、実施の形態１に対し、１次側電源配線１Ｐを覆うよう投影した１次側グランド配線１Ｇを配置した構成をとることを特徴とする。また、図１１，１２において、基材１１を省略して下層が見えるように説明している。 Embodiment 4 FIG.
A signal transmission board according to the fourth embodiment will be described with reference to FIGS. FIG. 11 is an explanatory diagram showing a perspective view of the signal transmission board of the fourth embodiment. FIG. 12 is an enlarged explanatory diagram of a main part of the signal transmission board according to the fourth embodiment. The signal transmission board according to the fourth embodiment is characterized in that a primary side ground wiring 1G projected so as to cover the primary side power wiring 1P is arranged with respect to the first embodiment. Further, in FIGS. 11 and 12, the base material 11 is omitted and the lower layer is visible.

１次側電源配線１Ｐと１次側グランド配線１Ｇ間の高電圧ノイズがなす強電界を１次側電源配線１Ｐと１次側グランド配線１Ｇを近距離で重ねることで最小にする。そして、１次側電源配線１Ｐと１次側グランド配線１Ｇを重ねる地点を分断された２次側回路部２００の２次側グランド配線２Ｇ同士を接続する２次側グランド配線接続部２ＧＣの配線幅Ｗgに対して、１次側電源配線１Ｐと１次側グランド配線１Ｇを重ねる地点から２次側グランド配線接続部２ＧＣまでの距離Ｗを、３Ｗg以上離すことで強電界の影響を避ける効果を得ることができる。２次側グランド配線接続部２ＧＣがノイズの影響を受ける電界は、パターン幅Ｗgを用いて３Ｗg以内に集中する。この構成によれば、１Ｗgのときのノイズ漏れ込み量を１００％としたとき、２Ｗgでは３０％、３Ｗgでは３％となり、２Ｗgと３Ｗgの間で大きく漏れ込み量が減衰することによる。   The strong electric field generated by high voltage noise between the primary power supply wiring 1P and the primary ground wiring 1G is minimized by overlapping the primary power supply wiring 1P and the primary ground wiring 1G at a short distance. And the wiring width of the secondary side ground wiring connection part 2GC which connects the secondary side ground wiring 2G of the secondary side circuit part 200 where the point where the primary side power supply wiring 1P and the primary side ground wiring 1G overlap is divided The effect of avoiding the influence of the strong electric field is obtained by separating the distance W from the point where the primary power supply wiring 1P and the primary ground wiring 1G overlap with the secondary ground wiring connection portion 2GC by 3 Wg or more with respect to Wg. be able to. The electric field at which the secondary side ground wiring connection portion 2GC is affected by noise is concentrated within 3 Wg using the pattern width Wg. According to this configuration, when the noise leakage amount at 1 Wg is 100%, the leakage amount is greatly attenuated between 2 Wg and 3 Wg, which is 30% for 2 Wg and 3% for 3 Wg.

実施の形態４の構成によれば、１次側電源配線１Ｐと１次側グランド配線１Ｇ間に生じる輻射ノイズが分断された２次側回路の２次側グランド配線２Ｇ同士を接続する配線に漏れこむ量を小さくする効果を得ることができる。   According to the configuration of the fourth embodiment, the radiation noise generated between the primary-side power supply wiring 1P and the primary-side ground wiring 1G is leaked to the wiring connecting the secondary-side ground wirings 2G of the secondary-side circuit. The effect of reducing the amount of indentation can be obtained.

なお、実施の形態４においても、２次側信号配線２ＳＡ，２ＳＢと１次側電源配線１Ｐおよび１次側グランド配線１Ｇを河渡する前後両方に構成したフィルタ回路２０５ａ，２０５ｂが配されノイズを除去している。フィルタ回路フィルタ回路２０５ａ，２０５ｂは、必要であれば、２次側信号配線２ＳＡ，２ＳＢと１次側電源配線および１次側グランド配線を河渡する前後いずれか、または両方に設けられていてもよい。   In the fourth embodiment as well, filter circuits 205a and 205b configured both before and after the secondary signal wirings 2SA and 2SB, the primary power supply wiring 1P and the primary ground wiring 1G are arranged to remove noise. doing. If necessary, the filter circuits 205a and 205b may be provided before or after the secondary signal wirings 2SA and 2SB, the primary power supply wiring and the primary ground wiring are crossed. .

実施の形態５．
図１３は、実施の形態５の信号伝送基板の配線層の層構造の断面を示す説明図である。実施の形態５の信号伝送基板は、実施の形態２における、分断された２次側回路部２００の２次側グランド配線２Ｇ同士を接続する配線の配線層を変えた構造をもつものである。２次側信号配線２ＳＡ，２ＳＢは差動信号として信号伝送基板１０上の同一層に構成し、２次側グランド配線２Ｇは２次側信号配線２ＳＡ，２ＳＢを投影した隣接層に配置する。また、図１３において、基材１１を省略している。 Embodiment 5. FIG.
FIG. 13 is an explanatory diagram showing a cross section of the layer structure of the wiring layer of the signal transmission board according to the fifth embodiment. The signal transmission board of the fifth embodiment has a structure in which the wiring layer of the wiring connecting the secondary ground wirings 2G of the divided secondary circuit section 200 in the second embodiment is changed. The secondary side signal wirings 2SA and 2SB are configured as differential signals in the same layer on the signal transmission board 10, and the secondary side ground wiring 2G is arranged in an adjacent layer on which the secondary side signal wirings 2SA and 2SB are projected. In FIG. 13, the base material 11 is omitted.

実施の形態５の信号伝送基板では、２次側電源グランド配線２Ｇを１次側電源配線１Ｐまたは１次側グランド配線１Ｇおよび２次側信号配線２ＳＡ，２ＳＢとの間に配置することで、１次側電源配線１Ｐまたは１次側グランド配線１Ｇからのノイズが２次側信号配線２ＳＡ，２ＳＢに輻射するのを抑制する。   In the signal transmission board according to the fifth embodiment, the secondary side power supply ground wiring 2G is arranged between the primary side power supply wiring 1P or the primary side ground wiring 1G and the secondary side signal wirings 2SA and 2SB, so that 1 The noise from the secondary power wiring 1P or the primary ground wiring 1G is suppressed from radiating to the secondary signal wirings 2SA and 2SB.

１次側電源配線１Ｐまたは１次側グランド配線１Ｇからのノイズが２次側信号配線２ＳＡ，２ＳＢへ侵入するのを抑制する効果がある。   There is an effect of suppressing noise from the primary power supply wiring 1P or the primary ground wiring 1G from entering the secondary signal wirings 2SA and 2SB.

なお、２次側グランド配線２Ｇは、２次側信号配線２ＳＡ，２ＳＢを形成する配線層の隣接層に設けられ、２次側信号配線２ＳＡ，２ＳＢの投影部と同等もしくは投影部よりも大きくすることで、より効率よく輻射ノイズが抑制される。また１次側電源配線１Ｐは、１次側グランド配線１Ｇを形成する配線層の隣接層に設けられ、１次側グランド配線１Ｇの投影部と同等ともしくは投影部よりも小さくすることで、より効率よく２次側信号配線２ＳＡ，２ＳＢへの輻射ノイズが抑制される。   The secondary ground wiring 2G is provided in an adjacent layer of the wiring layer that forms the secondary signal wirings 2SA and 2SB, and is equal to or larger than the projection part of the secondary signal wirings 2SA and 2SB. Thus, radiation noise is more efficiently suppressed. Further, the primary power supply wiring 1P is provided in an adjacent layer of the wiring layer that forms the primary ground wiring 1G, and is made equal to or smaller than the projection portion of the primary ground wiring 1G. Radiation noise to the secondary signal wirings 2SA and 2SB is efficiently suppressed.

実施の形態６．
実施の形態６の信号伝送基板について図１４を参照しつつ用いて説明する。図１４は、実施の形態６の信号伝送基板の要部拡大説明図である。また、図１４において、基材１１を省略して下層が見えるように説明している。実施の形態６の信号伝送基板では、分断された２次側回路部２００の２次側グランド配線２Ｇ同士を接続する配線である２次側グランド配線接続部２ＧＣは、１次側電源配線１Ｐおよび１次側グランド配線１Ｇを河渡する前後に内層の２次側グランド配線２Ｇとビア２Ｖで接続される。 Embodiment 6 FIG.
A signal transmission board according to the sixth embodiment will be described with reference to FIG. FIG. 14 is an enlarged explanatory view of main parts of the signal transmission board according to the sixth embodiment. Moreover, in FIG. 14, the base material 11 is abbreviate | omitted and it demonstrates so that a lower layer can be seen. In the signal transmission board of the sixth embodiment, the secondary side ground wiring connection part 2GC, which is a wiring for connecting the secondary side ground wirings 2G of the divided secondary side circuit part 200, is connected to the primary side power supply wiring 1P and Before and after crossing the primary ground wiring 1G, it is connected to the secondary ground wiring 2G in the inner layer by a via 2V.

分断された２次側回路部２００の２次側グランド配線２Ｇ同士を接続する配線は、１次側電源配線１Ｐおよび１次側グランド配線１Ｇを河渡する際に重畳したノイズがビア２Ｖを通じて共通インピーダンスの低い２次側回路部２００の内層の２次側グランド配線２Ｇに伝導する。   The wiring that connects the secondary ground wirings 2G of the divided secondary circuit part 200 has a common impedance through the via 2V due to noise superimposed when the primary power wiring 1P and the primary ground wiring 1G are crossed. Is conducted to the secondary-side ground wiring 2G in the inner layer of the secondary-side circuit unit 200 having a low level.

共通インピーダンスの低い２次側グランド配線２Ｇにノイズを伝導させることで、２次側グランド配線２Ｇ内の電位差により２次側信号配線２ＳＡ，２ＳＢへのノイズの伝搬を抑制する効果を得ることができる。   By conducting noise to the secondary ground wiring 2G having a low common impedance, an effect of suppressing noise propagation to the secondary signal wirings 2SA and 2SB due to a potential difference in the secondary ground wiring 2G can be obtained. .

実施の形態７．
実施の形態７の信号伝送基板について図１５を参照しつつ用いて説明する。図１５は、実施の形態７の信号伝送基板の要部拡大説明図である。実施の形態７の信号伝送基板は、分断された２次側配線２の２次側グランド配線２Ｇ同士を接続するグランド配線接続部２ＧＣの配線長Ｄcは１次側電源配線１Ｐおよび１次側グランド配線１Ｇの幅Ｗoutの７倍以上とすることを特徴とする。 Embodiment 7 FIG.
A signal transmission board according to the seventh embodiment will be described with reference to FIG. FIG. 15 is a main part enlarged explanatory view of the signal transmission board according to the seventh embodiment. In the signal transmission board of the seventh embodiment, the wiring length Dc of the ground wiring connecting portion 2GC that connects the secondary ground wirings 2G of the divided secondary wiring 2 is the primary power supply wiring 1P and the primary ground. It is characterized by being 7 times or more the width Wout of the wiring 1G.

１次側電源配線１Ｐおよび１次側グランド配線１Ｇからの輻射ノイズの電気力線の集中範囲はこれら配線幅Ｗoutの３倍である。したがって、電気力線の集中範囲を避けるために、グランド配線接続部２ＧＣの配線長Ｄcは、配線幅Ｗoutの７倍以上を確保することでより効率よく不要輻射ノイズを回避することができる。なお、実施の形態７においても１次側電源配線１Ｐと１次側グランド配線１Ｇ間の高電圧ノイズがなす強電界を１次側電源配線１Ｐと１次側グランド配線１Ｇを近距離で重ねることで最小にするものである。   The concentration range of the electric lines of force of radiation noise from the primary power supply wiring 1P and the primary ground wiring 1G is three times the wiring width Wout. Therefore, in order to avoid the concentration range of the electric lines of force, it is possible to avoid unnecessary radiation noise more efficiently by securing the wiring length Dc of the ground wiring connection portion 2GC to 7 times or more of the wiring width Wout. Also in the seventh embodiment, the primary power supply wiring 1P and the primary ground wiring 1G are overlapped at a short distance in a strong electric field generated by high voltage noise between the primary power supply wiring 1P and the primary ground wiring 1G. Is to minimize.

実施の形態７の信号伝送基板によれば、１次側電源配線１Ｐおよび１次側グランド配線１Ｇからの２次側回路部２００へのノイズ侵入を効果的に抑制する効果が得られる。グランド配線接続部２ＧＣの配線長Ｄcが、配線幅Ｗoutの７倍に満たない時、電気力線の集中範囲を避けることができず、不要輻射ノイズを回避するのが困難となる。   According to the signal transmission board of the seventh embodiment, an effect of effectively suppressing noise intrusion from the primary power supply wiring 1P and the primary ground wiring 1G to the secondary circuit unit 200 can be obtained. When the wiring length Dc of the ground wiring connection portion 2GC is less than seven times the wiring width Wout, the concentration range of the electric lines of force cannot be avoided, and it becomes difficult to avoid unnecessary radiation noise.

実施の形態８．
実施の形態８の信号伝送基板についても図１５を参照しつつ用いて説明する。図１５は、実施の形態８の信号伝送基板の要部拡大説明図である。また、図１５において、基材１１を省略して下層が見えるように説明している。 Embodiment 8 FIG.
The signal transmission board according to the eighth embodiment will also be described with reference to FIG. FIG. 15 is a main part enlarged explanatory view of the signal transmission board according to the eighth embodiment. Moreover, in FIG. 15, the base material 11 is abbreviate | omitted and it demonstrates so that a lower layer can be seen.

分断された２次側配線２の２次側グランド配線２Ｇ同士を接続するグランド配線接続部２ＧＣの配線幅Ｗgは１次側電源配線１Ｐあるいは１次側グランド配線１Ｇに重畳するノイズの最高周波数における波長λに対してλ／２０以下とする。   The wiring width Wg of the ground wiring connecting portion 2GC for connecting the secondary ground wirings 2G of the divided secondary wiring 2 is the highest frequency of noise superimposed on the primary power wiring 1P or the primary ground wiring 1G. Λ / 20 or less with respect to the wavelength λ.

１次側電源配線１Ｐと１次側グランド配線１Ｇからの輻射ノイズが２次側グランド配線接続部２ＧＣへの結合的かつ誘導的結合を抑制するために、グランド配線接続部２ＧＣの配線幅Ｗgが、１次側電源配線１Ｐあるいは１次側グランド配線１Ｇに重畳するノイズの最高周波数における波長λに対して、１／２０以下としてそのノイズの結合を抑制する。   Since the radiation noise from the primary side power supply wiring 1P and the primary side ground wiring 1G suppresses the coupling and inductive coupling to the secondary side ground wiring connection 2GC, the wiring width Wg of the ground wiring connection 2GC is The noise coupling is suppressed to 1/20 or less with respect to the wavelength λ at the highest frequency of noise superimposed on the primary power supply wiring 1P or the primary ground wiring 1G.

グランド配線接続部２ＧＣの配線幅Ｗgが、１次側電源配線１Ｐあるいは１次側グランド配線１Ｇに重畳するノイズの最高周波数における波長λに対して、１／２０以下であるとき、輻射ノイズの結合的かつ誘導的結合は、ほとんど発生しないことになり、ノイズの結合が抑制される。   When the wiring width Wg of the ground wiring connecting portion 2GC is 1/20 or less with respect to the wavelength λ at the highest frequency of noise superimposed on the primary power wiring 1P or the primary ground wiring 1G, coupling of radiation noise Almost no inductive coupling occurs, and noise coupling is suppressed.

従って、上記構成により、分断された２次側配線２の２次側グランド配線２Ｇ同士を接続する配線に対する１次側電源配線１Ｐおよび１次側グランド配線１Ｇからの輻射ノイズが抑制されるようになる。   Therefore, with the above configuration, radiation noise from the primary power supply wiring 1P and the primary ground wiring 1G to the wiring connecting the secondary ground wirings 2G of the divided secondary wiring 2 is suppressed. Become.

また、配線幅Ｗgは２次側信号線２ＳＡ、３ＳＢのリターンパスとなっていることから、以下の関係式を満たすように形成するのが望ましい。
２次側信号線２ＳＡ（２ＳＢ）の幅≦Ｗg≦λ／２０ Further, since the wiring width Wg is a return path for the secondary signal lines 2SA and 3SB, it is desirable to form the wiring width Wg so as to satisfy the following relational expression.
Width of secondary signal line 2SA (2SB) ≦ Wg ≦ λ / 20

実施の形態７、８の構成によれば、交差部を有しながらも、１次側電源配線１Ｐおよび１次側グランド配線１Ｇからの輻射ノイズが抑制され、配線に自由度を有し、小型で高速伝送の可能な信号伝送基板を得ることが可能となる。   According to the configurations of the seventh and eighth embodiments, the radiation noise from the primary-side power supply wiring 1P and the primary-side ground wiring 1G is suppressed while having an intersection, and the wiring has a degree of freedom and is compact. Thus, a signal transmission board capable of high-speed transmission can be obtained.

実施の形態９．
実施の形態９の信号伝送基板について図１６を参照しつつ用いて説明する。図１６は、実施の形態９の信号伝送基板の要部拡大説明図である。図１６において、基材１１を省略して下層が見えるように説明している。 Embodiment 9 FIG.
A signal transmission board according to the ninth embodiment will be described with reference to FIG. FIG. 16 is an enlarged explanatory view of main parts of the signal transmission board according to the ninth embodiment. In FIG. 16, the base material 11 is omitted and the lower layer can be seen.

実施の形態９の信号伝送基板では、実施の形態１のフィルタ回路２０５ａ，２０５ｂを、２次側回路部２００間における信号伝送のために、１次側電源配線１Ｐおよび１次側グランド配線１Ｇに対してプリント配線板内で重ねた２次側信号配線２ＳＡ，２ＳＢにおける差動信号間へのコンデンサによる容量結合２０５Ｘ、および各差動信号Ｐチャネル、Ｎチャネルと２次側グランド配線２Ｇとのコンデンサによる容量結合２０５Ｙ、および同相除去フィルタ、つまりコモンモードチョークコイル２０５Ｚで構成するものである。   In the signal transmission board of the ninth embodiment, the filter circuits 205a and 205b of the first embodiment are connected to the primary power supply wiring 1P and the primary ground wiring 1G for signal transmission between the secondary circuit sections 200. On the other hand, the capacitive coupling 205X by the capacitor between the differential signals in the secondary side signal wirings 2SA and 2SB overlapped in the printed wiring board, and the capacitor of each differential signal P channel, N channel and the secondary side ground wiring 2G And the common mode choke coil 205Z.

２次側回路部２００間における信号伝送のために、１次側電源配線１Ｐおよび１次側グランド配線１Ｇに対してプリント配線板内で重ねた２次側信号配線２ＳＡ、２ＳＢにおける差動信号間へのコンデンサによる容量結合２０５Ｘにより、差動信号の不平衡で差動信号間に発生したノイズを除去する。デジタル信号の矩形波形の周波数成分は、ほぼ基本波、３倍波、５倍波で構成されるため、デジタル２値信号を差動信号にて伝送する際の基本波周波数に対して５倍波帯域内に減衰領域を持たないように定めるとデジタル信号の波形ひずみを防ぐ最適な効果が得られる。   For signal transmission between the secondary side circuit units 200, between the differential signals in the secondary side signal wirings 2SA and 2SB overlapped in the printed wiring board with respect to the primary side power supply wiring 1P and the primary side ground wiring 1G. The noise generated between the differential signals due to the unbalance of the differential signals is removed by the capacitive coupling 205X by the capacitor. Since the frequency component of the rectangular waveform of the digital signal is composed of almost the fundamental wave, the third harmonic wave, and the fifth harmonic wave, the fifth harmonic wave is higher than the fundamental wave frequency when the digital binary signal is transmitted as a differential signal. If it is determined not to have an attenuation region in the band, the optimum effect of preventing waveform distortion of the digital signal can be obtained.

また、各差動信号Ｐチャネル、Ｎチャネルと２次側グランド配線２Ｇとのコンデンサによる容量結合２０５Ｙおよび、２次側信号配線２ＳＡ，２ＳＢにおける差動信号へのコモンモードチョークコイル２０５Ｚの配置により１次側電源配線１Ｐおよび１次側グランド配線１Ｇからの、差動信号に重畳した同相ノイズを除去することが可能になる。   Further, the capacitive coupling 205Y by the capacitor of each differential signal P channel, N channel and the secondary side ground wiring 2G, and the arrangement of the common mode choke coil 205Z to the differential signal in the secondary side signal wiring 2SA, 2SB are 1 It becomes possible to remove the common-mode noise superimposed on the differential signal from the secondary power supply wiring 1P and the primary ground wiring 1G.

分断された２次側回路部２００の２次側信号配線２ＳＡ，２ＳＢの配線に重畳したノイズの２次側回路部２００側への侵入を、周波数帯域の選択およびコモンモードまたはノーマルモードの選択により効果的に除去することが可能になる。   Intrusion of noise superimposed on the secondary signal wirings 2SA and 2SB of the divided secondary circuit part 200 into the secondary circuit part 200 side is made by selecting the frequency band and selecting the common mode or the normal mode. It can be effectively removed.

以上説明したように、１次側電源配線１Ｐと１次側グランド配線１Ｇ間の高電圧ノイズによる強電界を１次側電源配線１Ｐと１次側グランド配線１Ｇとを近距離で重ねることで、１次側電源配線１Ｐ、１次側グランド配線１Ｇ自体のノイズを抑制する構成とする。さらに、１次側電源配線１Ｐ、１次側グランド配線１Ｇを２次側信号配線２ＳＡ，２ＳＢと直交させるかあるいは、直交からθ度以内で重ねる構成とすることで、２次側信号配線２ＳＡ，２ＳＢが１次側電源配線１Ｐ、１次側グランド配線１Ｇと重畳している部分をできるだけ少なくし、２次側信号配線２ＳＡ，２ＳＢに発生するノイズの抑制効果を得ることが可能となる。   As described above, a strong electric field caused by high voltage noise between the primary power supply wiring 1P and the primary ground wiring 1G is overlapped with the primary power supply wiring 1P and the primary ground wiring 1G at a short distance. The primary side power supply wiring 1P and the primary side ground wiring 1G itself are configured to suppress noise. Further, the primary-side power wiring 1P and the primary-side ground wiring 1G are orthogonal to the secondary-side signal wirings 2SA and 2SB, or are stacked within θ degrees from the orthogonality so that the secondary-side signal wiring 2SA and The portion where 2SB overlaps with the primary power supply wiring 1P and the primary ground wiring 1G is reduced as much as possible, and the effect of suppressing noise generated in the secondary signal wirings 2SA and 2SB can be obtained.

また、直交からθ度以内で重ねる制約、つまりノイズ波長λと接地用配線間距離Ｄｃによる制約θ度以内を与えることで、ノイズの抑制効果を得るようにした。信号配線に対して２次側電源配線路の配置ではなく、２次側グランド配線２Ｇのみの配置を必須とし、差動信号配線の平衡を上げてノイズ侵入を抑制する。   In addition, the effect of suppressing noise is obtained by giving the constraint to be overlapped within θ degrees from the orthogonal, that is, within the constraint θ degrees due to the noise wavelength λ and the distance Dc between the ground wires. The arrangement of only the secondary ground wiring 2G, not the arrangement of the secondary power supply wiring path with respect to the signal wiring, is essential, and the noise intrusion is suppressed by increasing the balance of the differential signal wiring.

１次側電源配線１Ｐおよび１次側グランド配線１Ｇのノイズの最短波長λのとき、２次側信号配線２ＳＡ，２ＳＢである差動平衡信号配線の両側に配置する配線幅をλ／２０以下としてノイズの侵入を抑圧する。   When the shortest noise wavelength λ of the primary power supply wiring 1P and the primary ground wiring 1G is λ / 20 or less, the wiring width to be arranged on both sides of the differential balanced signal wirings that are the secondary signal wirings 2SA and 2SB Suppresses noise intrusion.

以上を特徴とする信号伝送基板の配線構造に加え、さらに、Ｘコンデンサ、Ｙコンデンサで構成したフィルタを交差回路部に追加し、１次側回路部からの同相で重畳したコモンモードノイズを通信回路以外の２次側回路部に伝播させない効果と、不平衡により発生した信号配線へのノーマルモードノイズを抑制する効果とを高めるようにしている。この結果、従来実施しなかった２次側信号配線を１次側電源配線および１次側グランド配線からのノイズを受けることなく重ねることができ、基板上の回路レイアウトの自由度が大きくなることで基板の小型化が可能になり、電気、電子回路機器の小型化を図ることが可能となる。   In addition to the wiring structure of the signal transmission board characterized by the above, a filter composed of an X capacitor and a Y capacitor is added to the cross circuit section, and common mode noise superimposed on the same phase from the primary circuit section is added to the communication circuit. The effect of not propagating to the other secondary side circuit part and the effect of suppressing the normal mode noise to the signal wiring caused by the unbalance are enhanced. As a result, secondary signal wiring that has not been conventionally implemented can be overlapped without receiving noise from the primary power supply wiring and primary ground wiring, and the degree of freedom in circuit layout on the substrate is increased. It is possible to reduce the size of the substrate, and it is possible to reduce the size of electrical and electronic circuit devices.

加えて、２次側グランド配線同士を接続する２次側グランド配線接続部は、配線幅Ｗg、１次側電源配線１Ｐ、１次側グランド配線１Ｇを重ねる地点との距離Ｗを、調整することで、ノイズ侵入をさらに抑制をすることができる。   In addition, the secondary-side ground wiring connecting portion that connects the secondary-side ground wirings adjusts the wiring width Wg, the distance W between the primary-side power supply wiring 1P and the primary-side ground wiring 1G. Thus, noise intrusion can be further suppressed.

また、二次側信号配線については、差動信号配線対を構成するものに限定されることなく、例えばアナログ信号あるいは高速信号でもよく、すべての信号配線基板に適用可能であることはいうまでもない。   Further, the secondary signal wiring is not limited to the one constituting the differential signal wiring pair, and may be, for example, an analog signal or a high-speed signal, and can be applied to all signal wiring boards. Absent.

以上の実施の形態に示した構成は、本発明の内容の一例を示すものであり、別の公知の技術と組み合わせることも可能であるし、本発明の要旨を逸脱しない範囲で、構成の一部を省略、変更することも可能である。   The configuration described in the above embodiment shows an example of the contents of the present invention, and can be combined with another known technique, and can be combined with other configurations without departing from the gist of the present invention. It is also possible to omit or change the part.

１ １次側配線、１Ｐ １次側電源配線、１Ｇ １次側グランド配線、２ ２次側配線、２ＳＡ，２ＳＢ ２次側信号配線、２Ｇ ２次側グランド配線、２ＧＣ ２次側グランド配線接続部、１０ 信号伝送基板、１１ 基材、１２ 回路パターン、１００ １次側回路部、１０１ 外部電源、１０２ １次側電源、２００ ２次側回路部、２０１ ２次側電源、２０２ 中間バス電源、２０３ 電子回路、２０４Ｍ 信号送受信回路、２０４Ｃ 送受信用のコネクタ、３００ 交差回路部、３００Ｓ 重畳回避部。   1 Primary side wiring, 1P Primary side power supply wiring, 1G Primary side ground wiring, 2 Secondary side wiring, 2SA, 2SB Secondary side signal wiring, 2G Secondary side ground wiring, 2GC Secondary side ground wiring connection DESCRIPTION OF SYMBOLS 10 Signal transmission board | substrate, 11 base material, 12 circuit pattern, 100 primary side circuit part, 101 external power supply, 102 primary side power supply, 200 secondary side circuit part, 201 secondary side power supply, 202 intermediate bus power supply, 203 Electronic circuit, 204M signal transmission / reception circuit, 204C transmission / reception connector, 300 cross circuit unit, 300S superposition avoidance unit.

Claims (12)

外部電源に接続された１次側電源配線を含む１次側配線を備えた１次側回路部と、
前記１次側回路部の出力が入力され、信号伝送基板内に信号入力を行う２次側信号配線と、前記２次側信号配線から一定の間隔を隔てて配置された２次側グランド配線とを含む２次側配線を備えた２次側回路部とを備え、
前記２次側信号配線および前記２次側グランド配線は、前記１次側電源配線と空間的に交差する交差回路部を備え、
前記２次側グランド配線は、前記交差回路部において、前記１次側電源配線の周囲で前記１次側電源配線との距離が、前記１次側電源配線との交差領域における前記１次側電源配線との距離より大きい重畳回避部を構成したことを特徴とする信号伝送基板。 A primary side circuit section having a primary side wiring including a primary side power supply wiring connected to an external power source;
A secondary-side signal wiring that receives the output of the primary-side circuit unit and inputs a signal into a signal transmission board; and a secondary-side ground wiring that is arranged at a certain distance from the secondary-side signal wiring; A secondary side circuit portion including a secondary side wiring including
The secondary-side signal wiring and the secondary-side ground wiring include a cross circuit portion that spatially intersects with the primary-side power supply wiring,
The secondary-side ground wiring has a distance from the primary-side power supply wiring around the primary-side power supply wiring in the intersection circuit portion so that the primary-side power supply in the region intersecting with the primary-side power supply wiring is A signal transmission board characterized in that a superposition avoidance portion larger than the distance to the wiring is configured. 前記１次側回路部は、前記１次側電源配線および１次側グランド配線を備え、
前記２次側グランド配線は、前記１次側回路部との交差部で分断されており、前記２次側グランド配線同士が接続される接続部を有することを特徴とする請求項１に記載の信号伝送基板。 The primary side circuit unit includes the primary side power supply wiring and a primary side ground wiring,
The said secondary side ground wiring is divided | segmented by the cross | intersection part with the said primary side circuit part, and has the connection part to which the said secondary side ground wiring is connected. Signal transmission board. 前記接続部は、前記２次側信号配線および前記２次側グランド配線と同一の配線層に形成されたことを特徴とする請求項２に記載の信号伝送基板。   The signal transmission board according to claim 2, wherein the connection portion is formed in the same wiring layer as the secondary signal wiring and the secondary ground wiring. 前記接続部は、前記２次側グランド配線よりも、前記１次側電源配線および前記１次側グランド配線から、離間した配線層内に形成されたことを特徴とする請求項２に記載の信号伝送基板。   3. The signal according to claim 2, wherein the connection portion is formed in a wiring layer separated from the primary-side power supply wiring and the primary-side ground wiring rather than the secondary-side ground wiring. Transmission board. 前記１次側電源配線は、前記１次側グランド配線を形成する配線層の隣接層に設けられ、前記１次側グランド配線の投影部と同等もしくは前記投影部よりも小さいことを特徴とする請求項２に記載の信号伝送基板。   The primary-side power supply wiring is provided in a layer adjacent to a wiring layer that forms the primary-side ground wiring, and is equal to or smaller than a projection portion of the primary-side ground wiring. Item 3. The signal transmission board according to Item 2. 前記２次側信号配線は差動信号対であって、前記交差部にフィルタ回路が配されたことを特徴とする請求項５に記載の信号伝送基板。   The signal transmission board according to claim 5, wherein the secondary signal wiring is a differential signal pair, and a filter circuit is arranged at the intersection. 前記２次側信号配線および前記２次側グランド配線は、同一の配線層内に形成されており、前記２次側グランド配線は、前記２次側信号配線の両側に並行および並列配置されたことを特徴とする請求項２に記載の信号伝送基板。   The secondary signal wiring and the secondary ground wiring are formed in the same wiring layer, and the secondary ground wiring is arranged in parallel and in parallel on both sides of the secondary signal wiring. The signal transmission board according to claim 2 characterized by things. 前記２次側グランド配線は、前記２次側信号配線を形成する配線層の隣接層に設けられ、前記２次側信号配線の投影部と同等もしくは前記投影部よりも大きいことを特徴とする請求項２に記載の信号伝送基板。   The secondary ground wiring is provided in a layer adjacent to a wiring layer forming the secondary signal wiring, and is equal to or larger than a projection portion of the secondary signal wiring. Item 3. The signal transmission board according to Item 2. 前記交差回路部は、前記２次側信号配線が前記１次側電源配線および１次側グランド配線に対して直交配置されたことを特徴とする請求項２に記載の信号伝送基板。 3. The signal transmission board according to claim 2, wherein in the crossing circuit portion, the secondary signal wiring is arranged orthogonal to the primary power supply wiring and primary ground wiring. 4. 前記交差回路部は、前記２次側信号配線が前記１次側電源配線および１次側グランド配線に対して既定の並行線路長以下に換算される角度θ以内で重ねて配置されていることを特徴とする請求項２に記載の信号伝送基板。 The cross circuit portion is arranged such that the secondary signal wiring is overlapped with respect to the primary power supply wiring and the primary ground wiring within an angle θ converted to a predetermined parallel line length or less. The signal transmission board according to claim 2, wherein 分断された前記２次側グランド配線同士を接続する配線長は１次電源配線および１次側グランド配線幅に対して７倍以上であることを特徴とする請求項２に記載の信号伝送基板。 3. The signal transmission board according to claim 2, wherein a wiring length for connecting the divided secondary-side ground wirings is seven times or more than a primary power supply wiring and a primary-side ground wiring width. 分断された前記２次側グランド配線同士を接続する配線の幅は前記１次側電源配線あるいは前記１次側グランド配線に重畳するノイズの最短波長λに対し、λ／２０以下であることを特徴とする請求項２に記載の信号伝送基板。 The width of the wiring connecting the divided secondary ground wirings is λ / 20 or less with respect to the shortest wavelength λ of noise superimposed on the primary power wiring or the primary ground wiring. The signal transmission board according to claim 2.
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CN114677927A (en) * 2022-03-16 2022-06-28 Tcl华星光电技术有限公司 Display panel
CN114677927B (en) * 2022-03-16 2023-08-22 Tcl华星光电技术有限公司 display panel

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