JP2017137487A - 表面保護フィルム、基板加工体、及び表面保護フィルムの製造方法 - Google Patents
表面保護フィルム、基板加工体、及び表面保護フィルムの製造方法 Download PDFInfo
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- JP2017137487A JP2017137487A JP2017012796A JP2017012796A JP2017137487A JP 2017137487 A JP2017137487 A JP 2017137487A JP 2017012796 A JP2017012796 A JP 2017012796A JP 2017012796 A JP2017012796 A JP 2017012796A JP 2017137487 A JP2017137487 A JP 2017137487A
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Abstract
【解決手段】基材フィルム及びその上に形成された樹脂フィルムを備える表面保護フィルムであって、前記樹脂フィルムが、(A)下記式(1)で表され、重量平均分子量が10,000〜100,000であるシルフェニレン・シロキサン骨格含有樹脂、(B)前記シルフェニレン・シロキサン骨格含有樹脂に含まれるエポキシ基と反応し、架橋構造を形成し得る化合物、(C)硬化触媒、及び(D)離型剤を含み、(D)成分の含有量が、(A)成分100質量部に対して0.5〜20質量部であり、(D)成分が、ポリエチレン、シリコーン系化合物、フッ素系化合物、脂肪酸及び脂肪酸エステルから選ばれる少なくとも1種を含む表面保護フィルム。
【選択図】なし
Description
1.基材フィルム及びその上に形成された樹脂フィルムを備える表面保護フィルムであって、
前記樹脂フィルムが、
(A)下記式(1)で表され、重量平均分子量が10,000〜100,000であるシルフェニレン・シロキサン骨格含有樹脂、
(B)前記シルフェニレン・シロキサン骨格含有樹脂に含まれるエポキシ基と反応し、架橋構造を形成し得る化合物、
(C)硬化触媒、及び
(D)離型剤
を含み、
(D)成分の含有量が、(A)成分100質量部に対して0.5〜20質量部であり、
(D)成分が、ポリエチレン、シリコーン系化合物、フッ素系化合物、脂肪酸及び脂肪酸エステルから選ばれる少なくとも1種を含む表面保護フィルム。
2.a+c=0.5及びb+d=0.5である1の表面保護フィルム。
3.前記樹脂フィルムが、更に、(E)難燃剤、(F)酸化防止剤及び(G)充填剤から選ばれる少なくとも1つを含む1又は2の表面保護フィルム。
4.前記基材フィルムが、ポリエステル、ポリイミド、ポリアミド、ポリアミド・イミド、ポリエーテルイミド、トリアセテートセルロース、ポリエーテルスルフォン又はポリフェニレンスルフィドである1〜3のいずれかの表面保護フィルム。
5.1〜4のいずれかの表面保護フィルムが、基板の少なくとも片面に形成されている基板加工体。
6.基材フィルム及びその上に形成された樹脂フィルムを備える表面保護フィルムの製造方法であって、
前記基材フィルム上に、
(A)下記式(1)で表され、重量平均分子量が10,000〜100,000であるシルフェニレン・シロキサン骨格含有樹脂、
(B)前記シルフェニレン・シロキサン骨格含有樹脂に含まれるエポキシ基と反応し、架橋構造を形成し得る化合物、
(C)硬化触媒、
(D)離型剤、及び
溶媒を含み、(D)成分の含有量が、(A)成分100質量部に対して0.5〜20質量部であり、(D)成分が、ポリエチレン、シリコーン系化合物、フッ素系化合物、脂肪酸及び脂肪酸エステルから選ばれる少なくとも1種を含むものである表面保護樹脂組成物を塗布し、加熱硬化させる表面保護フィルムの製造方法。
7.a+c=0.5及びb+d=0.5である6の表面保護フィルムの製造方法。
8.前記表面保護樹脂組成物が、更に、(E)難燃剤、(F)酸化防止剤及び(G)充填剤から選ばれる少なくとも1つを含む6又は7の表面保護フィルムの製造方法。
9.前記基材フィルムが、ポリエステル、ポリイミド、ポリアミド、ポリアミド・イミド、ポリエーテルイミド、トリアセテートセルロース、ポリエーテルスルフォン又はポリフェニレンスルフィドである6〜8のいずれかの表面保護フィルムの製造方法。
10.基板の回路面に、1〜4のいずれかの表面保護フィルムを貼り付け、加熱硬化を施し、該表面保護フィルムを接着させる、基板の表面保護方法。
本発明の表面保護フィルムは、基材フィルム及びその上に形成された樹脂フィルムを備える。
前記樹脂フィルムは、(A)シルフェニレン・シロキサン骨格含有樹脂、(B)(A)成分の樹脂に含まれるエポキシ基と反応し、架橋構造を形成し得る化合物、(C)硬化触媒、及び(D)離型剤を含むものである。
(B)成分である(A)シルフェニレン・シロキサン骨格含有樹脂に含まれるエポキシ基と反応し、架橋構造を形成しうる化合物としては、特に限定されないが、フェノール性ヒドロキシ基を1分子中に2個以上含む化合物が好ましい。1分子中のフェノール性ヒドロキシ基数は、2〜10程度が好ましい。フェノール性ヒドロキシ基数が1だと架橋できずに硬化しない。また、10より多いと硬化収縮が大きく、実用に向かない。フェノール性ヒドロキシ基数が前記範囲である限り、化合物の構造は特に限定されないが、以下に示すものが好ましい。
(C)成分である硬化触媒は、エポキシ基の開環に用いられるものであれば、広く使用可能である。硬化触媒としては、イミダゾール、2−メチルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、1,2−ジメチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−ウンデシルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール、1−シアノエチル−2−フェニルイミダゾール、2−フェニル−4,5−ジヒドロキシメチルイミダゾール、2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾール等のイミダゾール系化合物、1,8−ジアザビシクロ[5,4,0]−ウンデセン−7、トリス(ジメチルアミノメチル)フェノール、トリフェニルホスフィン、テトラフェニルホスホニウム・テトラフェニルボレート等が挙げられるが、これらに限定されない。
(D)成分である離型剤としては、ポリエチレン、シリコーン系化合物、フッ素系化合物、脂肪酸、脂肪酸エステル等が好ましい。これらは、1種単独でも、2種以上を組み合わせて使用してもよい。中でも、相溶性の理由からシリコーン系化合物等が好ましく選択される。
前記樹脂フィルムには、燃焼を防ぐために(E)成分として難燃剤を配合してもよい。難燃剤として、例えば、リン酸エステル化合物等の有機系難燃剤を用いることができる。
前記樹脂フィルムには、熱安定性を向上させるために(F)成分として酸化防止剤を配合してもよい。酸化防止剤は、ヒンダードフェノール系化合物、ヒンダードアミン系化合物、有機リン化合物及び有機硫黄化合物からなる群より選ばれる少なくとも1種の化合物であることが好ましい。
前記樹脂フィルムには、更に(G)成分として充填剤を配合してもよい。(G)充填剤としては、公知の無機充填剤を使用することができる。このような充填剤としては、例えば、金属酸化物、金属窒化物、金属水酸化物、フェライト類等が挙げられる。
前記樹脂フィルムには、基板に貼り付けられ、耐熱性、耐圧性を示し、利用後に容易に剥離させることができるという特徴が失われない限り、他のポリマーを配合しても構わない。他のポリマーとしては、例えば、エポキシ樹脂、ポリオレフィン樹脂、ビスマレイミド樹脂、ポリイミド樹脂、ポリエーテル樹脂、フェノール樹脂、シリコーン樹脂、ポリカーボネート樹脂、ポリアミド樹脂、ポリエステル樹脂、フッ素樹脂、アクリル樹脂、メラミン樹脂、ユリア樹脂、ウレタン樹脂等が挙げられる。これらの樹脂を併用する場合、その使用量は、シルフェニレン・シロキサン骨格含有樹脂(A)100質量部に対し、0〜1,000質量部の範囲が好ましい。
本発明の表面保護フィルムに含まれる基材フィルムは、前記樹脂フィルムを支持するものであり、ポリエステル、ポリイミド、ポリアミド、ポリアミド・イミド、ポリエーテルイミド、トリアセテートセルロース、ポリエーテルスルフォン、ポリフェニレンスルフィド等であることが好ましい。基材フィルムは、複数のフィルムの積層体であってもよい。
本発明の表面保護フィルムは、前記基材フィルム上に、前述した樹脂フィルムの各成分を溶媒に溶解させた表面保護樹脂組成物を塗布し、加熱硬化させることで製造することができる。
本発明の基板加工体は、少なくとも基板の片面に本発明の表面保護フィルムが形成されてなるものである。前記基板加工体は、例えば、基板の少なくとも片面に本発明の表面保護フィルムを貼り付けることによって製造することができる。このように、基板に本発明の表面保護フィルムを貼り付けることによって、フィルム添付面を保護することができ、フィルム添付面とは逆の面を精密加工する際や移動等の取扱い時に、フィルム添付面を傷つけたり汚染したりせずに作業することができる。また、加工終了後や保護の必要が無くなった際に、フィルムを物理的に容易に剥離することができ、更に剥離後の基板表面に残渣や樹脂組成物成分が残らない又は残りづらいため、作業性や歩留まりを大きく改善することができる。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−1)14.3g、化合物(S−2)477.0g及び化合物(S−3)167.0gをトルエン2,000gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)2.0gを投入し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、3時間攪拌を行い、再び60℃まで冷却して、カーボン担持白金触媒(5質量%)2.0gを投入し、化合物(S−4)44.9gを0.5時間かけてフラスコ内に滴下した。このときフラスコ内温度は、68℃まで上昇した。滴下終了後、更に、90℃で3時間熟成し、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを378g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Aの溶液を得た。樹脂AのMwは、53,000であった。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−3)108.5g及び化合物(S−5)603.9gをトルエン2,040gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)2.0gを投入し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、3時間攪拌を行い、再び60℃まで冷却して、カーボン担持白金触媒(5質量%)2.0gを投入し、化合物(S−4)23.3gを0.5時間かけてフラスコ内に滴下した。このときフラスコ内温度は、75℃まで上昇した。滴下終了後、更に、90℃で3時間熟成し、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを396g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Bの溶液を得た。樹脂BのMwは、53,900であった。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−3)86.8g、化合物(S−5)603.9g及び化合物(S−1)7.5gをトルエン1,950gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)2.0gを投入し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、3時間攪拌を行い、再び60℃まで冷却して、カーボン担持白金触媒(5質量%)2.0gを投入し、化合物(S−4)23.3gを0.5時間かけてフラスコ内に滴下した。このときフラスコ内温度は、72℃まで上昇した。滴下終了後、更に、90℃で3時間熟成し、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを388g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Cの溶液を得た。樹脂CのMwは、62,200であった。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−6)252.3g、化合物(S−7)318.5g及び化合物(S−1)74.6gをトルエン1,950gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)2.0gを投入し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、3時間攪拌を行い、再び60℃まで冷却して、カーボン担持白金触媒(5質量%)2.0gを投入し、化合物(S−4)77.8gを0.5時間かけてフラスコ内に滴下した。このときフラスコ内温度は、70℃まで上昇した。滴下終了後、更に、90℃で3時間熟成し、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを389g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Dの溶液を得た。樹脂DのMwは、32,000であった。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−6)210.3g、化合物(S−7)414.1g及び化合物(S−1)37.3gをトルエン2,000gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)2.0gを投入し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、3時間攪拌を行い、再び60℃まで冷却して、カーボン担持白金触媒(5質量%)2.0gを投入し、化合物(S−4)101.1gを0.5時間かけてフラスコ内に滴下した。このときフラスコ内温度は、70℃まで上昇した。滴下終了後、更に、90℃で3時間熟成し、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを410g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Eの溶液を得た。樹脂EのMwは、25,000であった。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−3)27.1g、化合物(S−5)629.1g、化合物(S−6)6.2gをトルエン1,950gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)4.0gを投入し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、6時間攪拌を行い、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを356g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Fの溶液を得た。樹脂FのMwは、50,100であった。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−3)542.7gを加え、トルエン1,850gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)4.0gを投入し、化合物(S−4)194.4gを滴下し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、3時間攪拌を行い、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを397g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Gの溶液を得た。樹脂GのMwは、48,000であった。
攪拌機、温度計、窒素置換装置及び還流冷却器を具備した3Lフラスコに、化合物(S−6)168.2g、化合物(S−7)446.0g及び化合物(S−1)37.3gをトルエン2,000gに溶解後、60℃に加温した。その後、カーボン担持白金触媒(5質量%)2.0gを投入し、内部反応温度が65〜67℃に昇温するのを確認後、更に、90℃まで加温し、3時間攪拌を行い、再び60℃まで冷却して、カーボン担持白金触媒(5質量%)2.0gを投入し、化合物(S−4)108.9gを0.5時間かけてフラスコ内に滴下した。このときフラスコ内温度は、70℃まで上昇した。滴下終了後、更に、90℃で3時間熟成し、次いで室温まで冷却後、メチルイソブチルケトン700gを加え、本反応溶液をフィルターにて加圧濾過することで白金触媒を取り除いた。更に、得られた高分子化合物溶液に純水600gを加えて攪拌、静置分液を行い、下層の水層を除去した。この分液水洗操作を6回繰り返し、高分子化合物溶液中の微量酸成分を取り除いた。この樹脂溶液中の溶媒を減圧留去し、その後、シクロペンタノンを410g添加して、シクロペンタノンを溶媒とする固形分濃度65質量%の樹脂Hの溶液を得た。樹脂HのMwは、12,100であった。
[表面保護フィルムの作製]
各樹脂溶液中の樹脂100gに対し、(B)成分として下記式(S−8)で表される3官能フェノール化合物TrisP-PA(本州化学工業(株)製)を前記樹脂中のエポキシ基と当量になるように加え、(C)成分として2−フェニル−4−メチル−5−ヒドロキシメチルイミダゾール(四国化成工業(株)製)を0.5g、酸化防止剤Chimassorb 944(チバ・スペシャルティ・ケミカルズ(株)製)を0.5g、(D)成分として表1に記載の各離型剤、及び(G)成分としてシリカを加えた。各溶液を厚さ50μmのポリイミド(PI)シート上にブレードナイフを使用して各々コーティングし、その後、100℃の乾燥機で10分間加熱して、PIシート上に膜厚90μmの樹脂が形成されているフィルムを各々得た。なお、樹脂厚みは接触式厚み計によって測定した。
真空ラミネータ((株)タカトリ製、TEAM-100)を使用して、シリコンウエハとガラスウエハに各表面保護フィルムを120℃で貼付した。また、有機基板(ガラス・エポキシ基板)に対しては、テープ貼付装置を利用し、120℃で表面保護フィルムを貼付した。いずれも表面保護フィルムを貼付後、窒素雰囲気下で180℃、4時間加熱し、樹脂組成物を硬化させ、その後、下記試験を行った。
なお、シリコンウエハとしては表面に高さ10μm、直径40μmの銅ポストが全面に形成された200mmシリコンウエハ(厚さ:725μm)を、ガラスウエハとしては表面に加工がなされていない200mmガラスウエハを、有機基板としては表面にソルダーレジストが塗布された縦横15cmの有機基板を使用した。
シリコンウエハ、ガラスウエハ、有機基板に各々接着させた表面保護フィルムを熱硬化し、冷却後、界面の接着状況を目視で確認した。界面での気泡等の異常が発生しなかった場合を良好と評価して「○」で示し、異常が発生した場合を不良と評価して「×」で示した。
シリコンウエハに表面保護フィルムをラミネートし、樹脂を熱硬化させた後、200℃あるいは260℃に熱したホットプレート上に10分間置いた。それらを室温まで冷却した後、界面の接着状況を目視で確認した。界面での気泡等の異常が発生しなかった場合を良好と評価して「○」で示し、異常が発生した場合を不良と評価して「×」で示した。
シリコンウエハに表面保護フィルムをラミネートし、樹脂を熱硬化させた後、熱と圧力をかけ、それによる樹脂の大きな変形の有無を確認した。加熱と加圧はEVG社のウエハ接合装置EVG520ISを用いて行った。温度は160℃、チャンバー内圧力は10-3mbar以下、荷重は5kNで実施した。室温まで冷却した後の界面の接着状況を目視で確認した。界面での気泡等の異常が発生せず、かつ樹脂がウエハ側面にかかるほどはみ出していない場合を良好と評価して「○」で示し、異常が発生した場合や樹脂がはみ出してウエハ側面に到達した場合を不良と評価して「×」で示した。
硬化後の表面保護フィルムを貼付したシリコンウエハ、ガラスウエハ又は有機基板を、真空吸着によって吸着板にセットし、その後、室温にて、フィルムの1点をピンセットにて剥がして持ち上げ、そこを起点に表面保護フィルムを剥がした。剥離後の試験体表面上に本発明の樹脂の残渣や跡が残らなかった場合を「○」で示し、試験体表面上に樹脂残渣や跡が残った場合、剥離できなかった場合、及び剥離力が大きいため剥離中に試験体が割れた場合を不良と評価して「×」で示した。
本発明の表面保護フィルムを貼付したシリコンウエハを加熱硬化し、放冷後、室温にて15日間と30日間保存し、その際の表面保護フィルムとウエハとの界面の状態を確認し、保存前と変化がなければ「○」で示し、異常があれば「×」で示した。更に、各々の期間保存したシリコンウエハを、真空吸着によって吸着板にセットし、その後、室温にて、フィルムの1点をピンセットにて剥がして持ち上げ、そこを起点にフィルムを剥がした。剥離後の試験体表面上に本発明の樹脂の残渣や跡が残らなかった場合を「○」で示し、試験体表面上に樹脂残渣や跡が残った場合、剥離できなかった場合、及び剥離力が大きいため剥離中に試験体が割れた場合を不良と評価して「×」で示した。
Claims (10)
- 基材フィルム及びその上に形成された樹脂フィルムを備える表面保護フィルムであって、
前記樹脂フィルムが、
(A)下記式(1)で表され、重量平均分子量が10,000〜100,000であるシルフェニレン・シロキサン骨格含有樹脂、
(B)前記シルフェニレン・シロキサン骨格含有樹脂に含まれるエポキシ基と反応し、架橋構造を形成し得る化合物、
(C)硬化触媒、及び
(D)離型剤
を含み、
(D)成分の含有量が、(A)成分100質量部に対して0.5〜20質量部であり、
(D)成分が、ポリエチレン、シリコーン系化合物、フッ素系化合物、脂肪酸及び脂肪酸エステルから選ばれる少なくとも1種を含む表面保護フィルム。
- 式(1)において、a+c=0.5及びb+d=0.5である請求項1記載の表面保護フィルム。
- 前記樹脂フィルムが、更に、(E)難燃剤、(F)酸化防止剤及び(G)充填剤から選ばれる少なくとも1つを含む請求項1又は2記載の表面保護フィルム。
- 前記基材フィルムが、ポリエステル、ポリイミド、ポリアミド、ポリアミド・イミド、ポリエーテルイミド、トリアセテートセルロース、ポリエーテルスルフォン又はポリフェニレンスルフィドである請求項1〜3のいずれか1項記載の表面保護フィルム。
- 請求項1〜4のいずれか1項記載の表面保護フィルムが、基板の少なくとも片面に形成されている基板加工体。
- 基材フィルム及びその上に形成された樹脂フィルムを備える表面保護フィルムの製造方法であって、
前記基材フィルム上に、
(A)下記式(1)で表され、重量平均分子量が10,000〜100,000であるシルフェニレン・シロキサン骨格含有樹脂、
(B)前記シルフェニレン・シロキサン骨格含有樹脂に含まれるエポキシ基と反応し、架橋構造を形成し得る化合物、
(C)硬化触媒、
(D)離型剤、及び
溶媒を含み、(D)成分の含有量が、(A)成分100質量部に対して0.5〜20質量部であり、(D)成分が、ポリエチレン、シリコーン系化合物、フッ素系化合物、脂肪酸及び脂肪酸エステルから選ばれる少なくとも1種を含むものである表面保護樹脂組成物を塗布し、加熱硬化させる表面保護フィルムの製造方法。
- 式(1)において、a+c=0.5及びb+d=0.5である請求項6記載の表面保護フィルムの製造方法。
- 前記表面保護樹脂組成物が、更に、(E)難燃剤、(F)酸化防止剤及び(G)充填剤から選ばれる少なくとも1つを含む請求項6又は7記載の表面保護フィルムの製造方法。
- 前記基材フィルムが、ポリエステル、ポリイミド、ポリアミド、ポリアミド・イミド、ポリエーテルイミド、トリアセテートセルロース、ポリエーテルスルフォン又はポリフェニレンスルフィドである請求項6〜8のいずれか1項記載の表面保護フィルムの製造方法。
- 基板の回路面に、請求項1〜4のいずれか1項記載の表面保護フィルムを貼り付け、加熱硬化を施し、該表面保護フィルムを接着させる、基板の表面保護方法。
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TWI726990B (zh) | 2021-05-11 |
EP3202827A1 (en) | 2017-08-09 |
CN107033798B (zh) | 2021-09-21 |
US20170226386A1 (en) | 2017-08-10 |
JP6627792B2 (ja) | 2020-01-08 |
EP3202827B1 (en) | 2018-08-29 |
TW201800547A (zh) | 2018-01-01 |
US10377923B2 (en) | 2019-08-13 |
KR20170093072A (ko) | 2017-08-14 |
CN107033798A (zh) | 2017-08-11 |
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