JP2017124497A - Conductive fabric - Google Patents
Conductive fabric Download PDFInfo
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- JP2017124497A JP2017124497A JP2016003330A JP2016003330A JP2017124497A JP 2017124497 A JP2017124497 A JP 2017124497A JP 2016003330 A JP2016003330 A JP 2016003330A JP 2016003330 A JP2016003330 A JP 2016003330A JP 2017124497 A JP2017124497 A JP 2017124497A
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- 238000010030 laminating Methods 0.000 claims description 3
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 claims description 2
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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- 241001465754 Metazoa Species 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
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- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
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- 229920000297 Rayon Polymers 0.000 description 1
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- 238000007611 bar coating method Methods 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
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Abstract
Description
本発明は、非導電性の繊維からなる布帛上に導電性材料によるパターン（回路）等を形成した導電性を有する布帛に関する。詳しくは、本発明は布帛本来の柔軟性を損なうことなく十分な導電性を備え、布帛の伸びに対して導電性低下の少ない導電性布帛に関する。 The present invention relates to a conductive fabric in which a pattern (circuit) or the like made of a conductive material is formed on a fabric made of nonconductive fibers. More specifically, the present invention relates to a conductive fabric having sufficient conductivity without impairing the inherent flexibility of the fabric and having a small decrease in conductivity with respect to the elongation of the fabric.
導電性を有する布帛は、電子部品やセンサー類を実装することによって、ウェアラブルデバイスとして利用することができる。本発明の導電性を有する布帛を用いたウェアラブルデバイスを装着することで、人間や動物の生体信号や動作を計測することができ、医療分野やヘルスケア分野に利用されるほか、環境、建築分野などの多様な産業においてその有用性が注目されている。 The conductive fabric can be used as a wearable device by mounting electronic components and sensors. By wearing a wearable device using the conductive fabric of the present invention, it is possible to measure biological signals and movements of humans and animals, and in addition to being used in the medical field and healthcare field, the environment and architectural fields Its usefulness is attracting attention in various industries such as.
布帛に導電性を付与する従来の技術としては、導電性を有する糸を織込んだり編込んだりする手法（例えば特許文献１）、導電性ペーストを印刷する手法（例えば特許文献２）などがある。 Examples of conventional techniques for imparting conductivity to a fabric include a method of weaving or knitting a conductive yarn (for example, Patent Document 1), a method of printing a conductive paste (for example, Patent Document 2), and the like. .
しかしながら、導電性を有する糸を織り込んだり編み込んだりする手法では、特殊な装置を要することや、導電性パターン形状の自由度が低いことなどの問題がある。導電性ペーストを印刷する手法では導電性が不十分となる場合があるため、導電性を上げるために印刷するペーストの量を増やす必要から布帛が硬く重くなる傾向があるという問題がある。加えて、布帛の伸びに対して導電性パターンの追従性が低いために破断が起き、導電性が低下するという問題もある。 However, the method of weaving or knitting conductive yarn has problems such as requiring a special device and having a low degree of freedom in the shape of the conductive pattern. Since the method of printing a conductive paste may result in insufficient conductivity, there is a problem that the fabric tends to be hard and heavy because it is necessary to increase the amount of paste to be printed in order to increase the conductivity. In addition, since the followability of the conductive pattern with respect to the stretch of the fabric is low, there is a problem that the breakage occurs and the conductivity is lowered.
これまでに、装飾目的等で布帛に接着剤等を介して薄い金属層を形成させる方法が提案されている（特許文献３、４）。また、布帛上にインクジェットプリント方式で電子回路等を形成してなる電子衣料が提案されている（特許文献５）。しかしながら、これらの方法では布帛の伸びに対して耐久性のある導電性布帛を得ることはできていない。 So far, a method of forming a thin metal layer on a fabric via an adhesive or the like for decoration purposes has been proposed (Patent Documents 3 and 4). Further, an electronic garment in which an electronic circuit or the like is formed on a fabric by an ink jet printing method has been proposed (Patent Document 5). However, these methods cannot obtain a conductive fabric that is durable against the elongation of the fabric.
本発明は、布帛本来の柔軟性を損なうことなく十分な導電性を備え、布帛の伸びに対する追従性と耐久性に優れた導電性布帛を提供することを課題とする。 An object of the present invention is to provide a conductive fabric that has sufficient conductivity without impairing the inherent flexibility of the fabric, and is excellent in followability and durability to the elongation of the fabric.
本発明者らは、鋭意検討した結果、布帛上に形成された導電性材料による導電パターンの表面が、微細な凹凸構造を有している導電性布帛において、上記課題を解決しうることを見いだし、本発明を完成するに至った。 As a result of intensive studies, the present inventors have found that the above problems can be solved in a conductive fabric in which the surface of the conductive pattern formed of the conductive material formed on the fabric has a fine uneven structure. The present invention has been completed.
すなわち本発明は、布帛上に導電性材料からなる導電パターンが形成された導電性布帛であって、前記導電パターンの表面の算術平均粗さＲａが５．０〜２０．０μｍであることを特徴とする、導電性布帛である。 That is, the present invention is a conductive fabric in which a conductive pattern made of a conductive material is formed on the fabric, and the arithmetic average roughness Ra of the surface of the conductive pattern is 5.0 to 20.0 μm. And a conductive fabric.
前記導電パターンの表面に、合成樹脂からなる保護層が積層されていることが好ましい。また、前記導電性材料が銀粒子、銀／塩化銀粒子、カーボン粒子の中から選ばれる一以上の導電性粒子と、ポリウレタン樹脂、アクリル樹脂、ポリエステル樹脂、エポキシ樹脂から選ばれる一以上のバインダー樹脂とを含む導電性樹脂組成物であることが好ましい。前記保護層を形成する前記合成樹脂がポリウレタン樹脂、フェノキシ樹脂であることが好ましい。 It is preferable that a protective layer made of a synthetic resin is laminated on the surface of the conductive pattern. The conductive material is one or more conductive particles selected from silver particles, silver / silver chloride particles, and carbon particles, and one or more binder resins selected from polyurethane resins, acrylic resins, polyester resins, and epoxy resins. It is preferable that it is the conductive resin composition containing these. The synthetic resin forming the protective layer is preferably a polyurethane resin or a phenoxy resin.
本発明は、離型性基材の一方の表面に導電性材料により導電パターンを形成する工程、前記導電パターン上に接着層を積層する工程、前記接着層側を布帛に重ねて導電パターンを布帛の表面に転写する工程をこの順に含み、布帛上に転写された前記導電パターン表面の算術平均粗さＲａが５．０〜２０．０μｍであることを特徴とする、導電性布帛の製造方法である。 The present invention includes a step of forming a conductive pattern on one surface of a releasable base material with a conductive material, a step of laminating an adhesive layer on the conductive pattern, and a conductive pattern formed by overlapping the adhesive layer side on a fabric. A method for producing a conductive fabric, wherein the arithmetic average roughness Ra of the surface of the conductive pattern transferred onto the fabric is 5.0 to 20.0 μm. is there.
本発明においては、布帛の柔軟性を損なわず、布帛の伸びに対する耐久性の高い導電性布帛を得ることができる。すなわち、布帛が繰り返し伸縮された場合でも抵抗値の変化率が小さい導電性布帛を得ることができる。 In the present invention, it is possible to obtain a conductive fabric having high durability against the elongation of the fabric without impairing the flexibility of the fabric. That is, even when the fabric is repeatedly expanded and contracted, a conductive fabric having a small resistance change rate can be obtained.
１：離型性基材
２：保護層
３：導電パターン
４：接着層
５：布帛
1: releasable substrate 2: protective layer 3: conductive pattern 4: adhesive layer 5: fabric
図１に、本発明の導電性布帛に形成された導電パターンの表面を、電子顕微鏡によって撮影した写真を示す。図１によれば、本発明の導電性布帛においては、導電パターンの表面に微細な凹凸構造が形成されている。 In FIG. 1, the photograph which image | photographed the surface of the conductive pattern formed in the conductive fabric of this invention with the electron microscope is shown. According to FIG. 1, in the conductive fabric of the present invention, a fine uneven structure is formed on the surface of the conductive pattern.
（１）布帛
本発明に用いられる布帛としては、例えば、織物、編物、不織布などの繊維布帛を挙げることができる。また、繊維素材としては、例えば、綿、麻、羊毛、絹等の天然繊維、レーヨン、キュプラ等の再生繊維、アセテート、トリアセテート等の半合成繊維、ポリアミド（ナイロン６、ナイロン６６等）、ポリエステル（ポリエチレンテレフタレート、ポリトリメチレンテレフタレート等）、ポリウレタン、ポリアクリル等の合成繊維などを挙げることができ、これらが２種以上組み合わされていてもよい。
(1) Fabric Examples of the fabric used in the present invention include fiber fabrics such as woven fabrics, knitted fabrics, and non-woven fabrics. Examples of the fiber material include natural fibers such as cotton, hemp, wool, and silk, regenerated fibers such as rayon and cupra, semi-synthetic fibers such as acetate and triacetate, polyamide (nylon 6, nylon 66, etc.), polyester ( (Polyethylene terephthalate, polytrimethylene terephthalate, etc.), synthetic fibers such as polyurethane and polyacryl, and the like, and two or more of these may be combined.
繊維布帛には、必要に応じて染色、帯電防止加工、難燃加工、カレンダー加工などが施されていてもよい。布帛の厚みは特に限定されないが、０．０３〜５ｍｍ程度であることが好ましい。 The fiber fabric may be subjected to dyeing, antistatic processing, flame retardant processing, calendar processing, and the like as necessary. The thickness of the fabric is not particularly limited, but is preferably about 0.03 to 5 mm.
（２）導電性材料
本発明における導電パターンを形成する導電性材料は、銀粒子、銀／塩化銀粒子、カーボン粒子などの導電性粒子と、ポリウレタン樹脂、アクリル樹脂、ポリエステル樹脂、エポキシ樹脂などのバインダー樹脂とを含む導電性樹脂組成物であることが好ましい。他にＰＥＤＯＴ／ ＰＳＳ等の導電性高分子材料を用いてもよい。なかでも布帛に適用可能な程度の比較的低い加工温度で良好な導電性を得られるという理由で銀粒子またはカーボン粒子を含む導電性樹脂組成物を用いることが好ましい。また、生体信号測定においては、電極インピーダンスを下げられるという点で、銀／塩化銀粒子を含む導電性樹脂組成物を用いることが好ましい。
(2) Conductive material The conductive material forming the conductive pattern in the present invention includes conductive particles such as silver particles, silver / silver chloride particles, and carbon particles, and polyurethane resin, acrylic resin, polyester resin, epoxy resin, and the like. A conductive resin composition containing a binder resin is preferable. In addition, a conductive polymer material such as PEDOT / PSS may be used. Among these, it is preferable to use a conductive resin composition containing silver particles or carbon particles because good conductivity can be obtained at a relatively low processing temperature that is applicable to fabrics. In biosignal measurement, it is preferable to use a conductive resin composition containing silver / silver chloride particles in that the electrode impedance can be lowered.
導電性粒子の粒子径は０．００１〜２０μｍであることが好ましい。導電性樹脂組成物中の導電性粒子の含有量としては、５０〜９０ｗｔ％であることが好ましい。 The particle diameter of the conductive particles is preferably 0.001 to 20 μm. As content of the electroconductive particle in an electroconductive resin composition, it is preferable that it is 50-90 wt%.
導電パターンの表面には微細な凹凸構造が形成されていることが必要である（図１参照）。この凹凸構造の程度を表わす指標として、算術平均粗さＲａが用いられる。本発明の導電パターンの表面には、ＪＩＳ Ｂ ０６０１に準拠して測定された算術平均粗さＲａ（基準長さ：１２８０．０μｍ、輪郭曲線フィルタλｃ：４２６．７μｍ）が５．０〜２０．０μｍとなるような凹凸構造が形成されている。 It is necessary that a fine uneven structure is formed on the surface of the conductive pattern (see FIG. 1). Arithmetic average roughness Ra is used as an index representing the degree of the uneven structure. On the surface of the conductive pattern of the present invention, the arithmetic average roughness Ra (reference length: 1280.0 μm, contour curve filter λc: 426.7 μm) measured in accordance with JIS B 0601 is 5.0-20. An uneven structure is formed so as to be 0 μm.
（３）保護層
本発明の導電性布帛においては、微細な凹凸構造を有する前記導電パターンの表面に、合成樹脂を主成分とする保護層が積層されていることが好ましい。保護層を形成する合成樹脂としてはポリウレタン樹脂、フェノキシ樹脂、シリコーン樹脂、ポリエステル樹脂、エポキシ樹脂、アクリル樹脂、エチレン−酢酸ビニル共重合樹脂、ポリビニルブチラール樹脂、ポリ塩化ビニル系共重合樹脂などが挙げられ、なかでも柔軟性、伸縮性、強靭性に優れるという理由でポリウレタン樹脂、フェノキシ樹脂が好ましい。保護層を積層することにより、導電パターンを物理的、化学的に保護することができる。
(3) Protective layer In the conductive fabric of this invention, it is preferable that the protective layer which has a synthetic resin as a main component is laminated | stacked on the surface of the said conductive pattern which has a fine uneven structure. Synthetic resins forming the protective layer include polyurethane resins, phenoxy resins, silicone resins, polyester resins, epoxy resins, acrylic resins, ethylene-vinyl acetate copolymer resins, polyvinyl butyral resins, polyvinyl chloride copolymer resins, and the like. Of these, polyurethane resins and phenoxy resins are preferred because they are excellent in flexibility, stretchability, and toughness. By laminating the protective layer, the conductive pattern can be physically and chemically protected.
本発明の導電性布帛は前記構成要素の他にも、必要に応じて各種構成を備えていてもよい。例えば、繊維布帛の全体あるいは一部を予め合成樹脂コーティングによって被覆するような構成であってもよい。また、導電性パターンが接着層を介して布帛に貼着されていてもよい。 The conductive fabric of the present invention may have various configurations as required in addition to the above-described components. For example, the whole or part of the fiber fabric may be previously covered with a synthetic resin coating. Moreover, the electroconductive pattern may be affixed on the fabric through the contact bonding layer.
本発明の導電性布帛を製造する方法について、その一例を図２を参照して説明する。 An example of the method for producing the conductive fabric of the present invention will be described with reference to FIG.
図２（ａ）は離型性基材１の一方の表面に、導電性材料をパターン状に塗布したものである。離型性基材の一方の表面には微細な凹凸構造が形成されている。この微細な凹凸構造によって、導電パターン３の表面に微細な凹凸構造が付与される。このように導電パターン３の表面に形成された微細な凹凸構造のＪＩＳ Ｂ ０６０１に準拠して測定された算術平均粗さＲａ（基準長さ：１２８０．０μｍ、輪郭曲線フィルタλｃ：４２６．７μｍ）が５．０〜２０．０μｍとなるように、離型性基材１を選択する必要がある。 FIG. 2A shows a pattern in which a conductive material is applied to one surface of a releasable substrate 1. A fine concavo-convex structure is formed on one surface of the releasable substrate. By this fine concavo-convex structure, a fine concavo-convex structure is imparted to the surface of the conductive pattern 3. The arithmetic average roughness Ra (reference length: 1280.0 μm, contour curve filter λc: 426.7 μm) measured in accordance with JIS B 0601 of the fine uneven structure formed on the surface of the conductive pattern 3 in this way. It is necessary to select the releasable substrate 1 so that the thickness becomes 5.0 to 20.0 μm.
本発明で用いられる離型性基材としては、紙やフィルムなどの基材に離型層としてポリエチレンフィルム、ポリプロピレンフィルム、ポリメチルペンテンフィルムなどのポリオレフィンフィルムを貼合したものの他、紙やフィルムなどの基材にシリコーン系あるいはフッ素系の離型剤をコーティングしたものなどが挙げられる。 As the releasable base material used in the present invention, in addition to a base material such as paper or film and a polyolefin film such as polyethylene film, polypropylene film or polymethylpentene film as a release layer, paper or film, etc. And a base material coated with a silicone-based or fluorine-based release agent.
導電性材料をパターン状に塗布する方法はスクリーン印刷法、グラビア印刷法、インクジェット印刷法などが挙げられ、印刷後には加熱乾燥などによって溶剤を除去して導電パターンを硬化させる。導電性材料に含まれるバインダー樹脂がエネルギー線硬化型の樹脂である場合には、エネルギー線を照射することによって導電パターンを硬化させる。また、導電性材料に含まれるバインダー樹脂がエネルギー線硬化型の樹脂である場合、フォトリソグラフィーの手法を用いて導電パターンを形成することもできる。 Examples of the method for applying the conductive material in a pattern include a screen printing method, a gravure printing method, and an ink jet printing method, and after printing, the solvent is removed by heating and drying to cure the conductive pattern. When the binder resin contained in the conductive material is an energy ray curable resin, the conductive pattern is cured by irradiating energy rays. In addition, when the binder resin contained in the conductive material is an energy ray curable resin, the conductive pattern can be formed using a photolithography technique.
導電パターンの厚さは用いる導電性材料の種類によって適宜設定されるが、導電性粒子を含む導電性樹脂組成物を用いた場合は１０〜１００μｍであることが好ましい。 Although the thickness of a conductive pattern is suitably set according to the kind of conductive material to be used, it is preferably 10 to 100 μm when a conductive resin composition containing conductive particles is used.
次に、図２（ｂ）のように導電パターンの上に接着層４を形成する。接着層を形成する材料としては、ポリウレタン樹脂、ナイロン樹脂、ポリエステル樹脂、エチレン酢酸ビニル共重合物、エポキシ樹脂およびそれらの溶液、分散体などを用いることができる。なかでも柔軟性に優れるという理由でポリウレタン樹脂が好ましい。接着層４は図２（ｂ）に示すように導電パターンを覆いつくすように積層されていることが好ましい。接着層４の厚さは１０〜１００μｍであることが好ましい。接着層の厚さがこの範囲であれば、布帛の柔軟性を損なうことなく、十分な接着性を発現することができる。 Next, the adhesive layer 4 is formed on the conductive pattern as shown in FIG. As a material for forming the adhesive layer, polyurethane resin, nylon resin, polyester resin, ethylene vinyl acetate copolymer, epoxy resin, and their solutions and dispersions can be used. Of these, polyurethane resins are preferred because of their excellent flexibility. The adhesive layer 4 is preferably laminated so as to cover the conductive pattern as shown in FIG. The thickness of the adhesive layer 4 is preferably 10 to 100 μm. If the thickness of the adhesive layer is within this range, sufficient adhesiveness can be exhibited without impairing the flexibility of the fabric.
上記操作によって得られた導電性パターン３を備えた離型性基材１を、接着層４の側を布帛５の一表面に重ね、例えば熱転写法によって布帛５に貼り合わせる（図２（ｃ））。その後、離型性基材１を剥離して取り除き、本発明の導電性布帛を得る（図２（ｄ））。 The releasable substrate 1 having the conductive pattern 3 obtained by the above operation is laminated on the surface of the fabric 5 with the adhesive layer 4 side, and bonded to the fabric 5 by, for example, a thermal transfer method (FIG. 2C). ). Thereafter, the releasable substrate 1 is peeled and removed to obtain the conductive fabric of the present invention (FIG. 2 (d)).
熱転写法による貼り合せの条件としては温度１００〜１８０℃、圧力０．２〜０．８ＭＰａ、時間０．５〜２分であることが好ましい。 The bonding conditions by the thermal transfer method are preferably a temperature of 100 to 180 ° C., a pressure of 0.2 to 0.8 MPa, and a time of 0.5 to 2 minutes.
図２（ｅ）には本発明の導電性布帛上に保護層２を形成する例を示しているが、本発明においては保護層２は必須の構成ではない。保護層２を形成する場合は、布帛に転写された後の導電パターン上に形成される。 Although FIG. 2 (e) shows an example in which the protective layer 2 is formed on the conductive fabric of the present invention, the protective layer 2 is not an essential configuration in the present invention. When the protective layer 2 is formed, it is formed on the conductive pattern after being transferred to the fabric.
保護層は導電パターン上において絶縁性を付与すべき部分に形成される。図２（ｅ）に示すように、保護層は導電パターンに対し、幾分大きなサイズで形成されていてもよいし、布帛の全面を覆うように形成されていてもよい。このように保護層を形成することで、保護層が導電パターンを確実に被覆し高い絶縁性が得られる。 A protective layer is formed in the part which should provide insulation on a conductive pattern. As shown in FIG. 2 (e), the protective layer may be formed with a somewhat larger size than the conductive pattern, or may be formed so as to cover the entire surface of the fabric. By forming the protective layer in this way, the protective layer reliably covers the conductive pattern and high insulation is obtained.
保護層をパターン状に形成する方法は電着塗装法、スクリーン印刷法、インクジェット印刷法、グラビア印刷法、グラビアオフセット印刷法、フレキソ印刷法、フォトリソグラフィー法などが挙げられ、保護層を布帛の全面に形成する方法としてはグラビアコート法、ロールコート法、ナイフコート法、バーコート法、ディップコート法、スプレーコート法などが挙げられる。なかでも厚膜が得られやすく、必要な部分にのみ選択的に保護層を形成出来るという理由でスクリーン印刷法、フォトリソグラフィー法が好ましい。スクリーン印刷法によって保護層を形成する場合、合成樹脂のプレポリマーを溶剤にて希釈した合成樹脂組成物を用いることができる。この合成樹脂組成物をパターン状に塗布した後、必要に応じて溶剤を除去する工程をとることが好ましい。溶剤を除去する方法としては、加熱乾燥、真空乾燥、常温乾燥などの方法を採用することができる。 Examples of methods for forming the protective layer in a pattern include electrodeposition coating, screen printing, ink jet printing, gravure printing, gravure offset printing, flexographic printing, and photolithography, and the protective layer is applied to the entire surface of the fabric. Examples of the forming method include a gravure coating method, a roll coating method, a knife coating method, a bar coating method, a dip coating method, and a spray coating method. Among these, a screen printing method and a photolithography method are preferable because a thick film can be easily obtained and a protective layer can be selectively formed only in a necessary portion. When forming a protective layer by a screen printing method, a synthetic resin composition obtained by diluting a prepolymer of a synthetic resin with a solvent can be used. After applying this synthetic resin composition in a pattern, it is preferable to take a step of removing the solvent if necessary. As a method for removing the solvent, methods such as heat drying, vacuum drying, and room temperature drying can be employed.
本発明の導電性布帛を製造する方法の別の一例としては、導電パターンを形成するにあたって導電性材料を用いた印刷法に替えて、無電解メッキ法を利用して金属被膜からなる導電パターンを形成する方法を用いることもできる。 As another example of the method for producing the conductive fabric of the present invention, instead of the printing method using a conductive material in forming a conductive pattern, a conductive pattern made of a metal film using an electroless plating method is used. A forming method can also be used.
離型性材料の一方の表面に無電解メッキ触媒を含有するインクによってパターン印刷を行う。無電解メッキ触媒を活性化した後、例えば無電解銅メッキ処理を行なって導電パターンを形成する。その後、上記と同様に接着層を設け、熱転写法によって布帛に接着、離型性材料を剥離して本発明の導電性布帛を得る。無電解メッキに用いられる無電解メッキ触媒やその活性化剤、無電解メッキ液などは一般的に用いられる材料を使用することができる。 Pattern printing is performed on one surface of the releasable material with ink containing an electroless plating catalyst. After activating the electroless plating catalyst, for example, an electroless copper plating process is performed to form a conductive pattern. Thereafter, an adhesive layer is provided in the same manner as described above, and adhered to the fabric by a thermal transfer method, and the release material is peeled off to obtain the conductive fabric of the present invention. Commonly used materials can be used for the electroless plating catalyst, its activator, and electroless plating solution used for electroless plating.
以下に本発明を実施例により説明するが、本発明はこれらの実施例により何らの制限を受けるものではない。
本実施例における各種物性の評価方法は以下の通りである。
Examples The present invention will be described below with reference to examples, but the present invention is not limited to these examples.
The evaluation methods for various physical properties in this example are as follows.
＜伸び耐久性＞
幅３ｍｍ、長さ１００ｍｍの導電パターンを有する導電性布帛を作製する。導電パターン１００ｍｍ間の抵抗値を測定し、これを初期抵抗値とする。導電パターンの長さ方向に加速度０．９８ｍ／ｓ２、速度１５０ｍｍ／ｓで導電性布帛を１０％伸長させ、加速度０．９８ｍ／ｓ２、速度１５０ｍｍ／ｓで元の長さに戻す。これを２，０００回繰り返す。その後、導電パターン１００ｍｍ間の抵抗値を再度測定し、初期抵抗値からの変化率を算出して評価した。抵抗値の測定には日置電機株式会社製抵抗計３５４０を用いた。
<Elongation durability>
A conductive fabric having a conductive pattern with a width of 3 mm and a length of 100 mm is produced. The resistance value between the conductive patterns of 100 mm is measured, and this is set as the initial resistance value. Acceleration 0.98 m / s 2 in the longitudinal direction of the conductive pattern, the conductive cloth at a speed 150 mm / s is extended 10%, the acceleration 0.98 m / s 2, the former at a speed 150 mm / s back length. Repeat this 2,000 times. Thereafter, the resistance value between the conductive patterns of 100 mm was measured again, and the rate of change from the initial resistance value was calculated and evaluated. A resistance meter 3540 manufactured by Hioki Electric Co., Ltd. was used for measuring the resistance value.
［実施例１］
離型性基材としてリンテック株式会社製離型紙：型番 Ｒ１３１（算術平均粗さＲａ：２０．１μｍ）を用いた。藤倉化成株式会社製：ドータイトＦＡ−３５３Ｎ（銀粒子６９ｗｔ％、ポリエステル樹脂１２ｗｔ％、溶剤１９ｗｔ％）を用いてスクリーン印刷法によって幅３ｍｍ、長さ１１０ｍｍの導電パターンを離型性基材の表面に印刷した。用いた印刷装置は株式会社セリアコーポレーション製印刷機：ＳＳＡ−ＰＣ６６０Ａである。これを１３０℃、１５分間の加熱乾燥を行って導電パターンを硬化させた。次に、ユニ化成株式会社製ホットメルト接着剤：ユニバインダーＴＮ−４９２９Ｎを７０部、第一工業製薬株式会社製水分散ウレタン樹脂：スーパーフレックス４７０を３０部で混合した接着剤を用いスクリーン印刷法にて、導電パターンを覆うように幅５ｍｍ、長さ１１０ｍｍの接着層を印刷した。印刷に用いた装置はＳＳＡ−ＰＣ６６０Ａである。印刷後、１００℃で１０分間の加熱乾燥を行った。
[Example 1]
Release paper manufactured by Lintec Corporation: Model number R131 (arithmetic average roughness Ra: 20.1 μm) was used as the releasable substrate. Fujikura Kasei Co., Ltd .: Dotite FA-353N (silver particles 69 wt%, polyester resin 12 wt%, solvent 19 wt%) was used to apply a conductive pattern with a width of 3 mm and a length of 110 mm on the surface of the release substrate by screen printing Printed. The printing apparatus used is a printing machine manufactured by Ceria Corporation: SSA-PC660A. This was heated and dried at 130 ° C. for 15 minutes to cure the conductive pattern. Next, a screen printing method using an adhesive prepared by mixing 70 parts of Unichemical KK hot melt adhesive: Unibinder TN-4929N and 30 parts of water-dispersed urethane resin: Superflex 470 manufactured by Daiichi Kogyo Seiyaku Co., Ltd. Then, an adhesive layer having a width of 5 mm and a length of 110 mm was printed so as to cover the conductive pattern. The apparatus used for printing is SSA-PC660A. After printing, heating drying was performed at 100 ° C. for 10 minutes.
次にナイロントリコット布帛（ナイロン４４Ｔ／３４ｆ：６６％、ポリウレタン４４Ｔ：２０％、ポリウレタン３１０Ｔ：２４％、目付４３０ｇ／ｍ２）を離型性基材の導電パターンと接着層を形成した面に合わせ、熱転写によって貼り合せを行った。用いた装置は株式会社ハシマ製熱転写プレス機：ＨＰ−４５３６Ａ−１２であり、熱転写の条件は１６０℃、０．５ＭＰａ、１分間であった。離型性基材を剥離して得られた導電性布帛において、導電パターン表面の算術平均粗さを測定した結果は１１．５μｍであった。 Next, a nylon tricot fabric (nylon 44T / 34f: 66%, polyurethane 44T: 20%, polyurethane 310T: 24%, basis weight 430 g / m 2 ) is aligned with the surface of the releasable substrate on which the conductive pattern and adhesive layer are formed. Bonding was performed by thermal transfer. The apparatus used was a thermal transfer press machine manufactured by HASHIMA CORPORATION: HP-4536A-12, and the thermal transfer conditions were 160 ° C., 0.5 MPa, and 1 minute. In the conductive fabric obtained by peeling off the releasable substrate, the result of measuring the arithmetic average roughness of the surface of the conductive pattern was 11.5 μm.
［実施例２］
離型性基材をリンテック株式会社製離型紙：型番Ｒ２３１（算術平均粗さＲａ：２９．１μｍ）に替えた以外は実施例１と同様にして導電性布帛を得た。得られた導電性布帛において、導電パターン表面の算術平均粗さＲａは１６．３μｍであった。
[Example 2]
A conductive fabric was obtained in the same manner as in Example 1 except that the releasable substrate was changed to release paper manufactured by Lintec Corporation: model number R231 (arithmetic mean roughness Ra: 29.1 μm). In the obtained conductive fabric, the arithmetic average roughness Ra of the surface of the conductive pattern was 16.3 μm.
［実施例３］
実施例１で得られた導電性布帛に対し、導電パターン（算術平均粗さ１１．５μｍ）を保護層で被覆した。保護層を形成する合成樹脂としてＤＩＣ株式会社製ハイドランＷＬＳ２０２（水性ポリウレタン樹脂）１００部とセンカ株式会社製アクトゲルＮＳ１００（エマルション型増粘剤）１．５部との混合物を用い、スクリーン印刷法にて導電パターンを被覆するように印刷した。用いた印刷装置はＳＳＡ−ＰＣ６６０Ａであり、保護層のサイズは幅５ｍｍ、長さ１００ｍｍである。導電パターンの長さ方向における両端部は、抵抗値測定のために各５ｍｍずつ露出させている。その後１３０℃にて１５分間の加熱乾燥を行った。
[Example 3]
A conductive pattern (arithmetic mean roughness 11.5 μm) was covered with a protective layer on the conductive fabric obtained in Example 1. As a synthetic resin for forming the protective layer, a mixture of DIC Corporation Hydran WLS202 (aqueous polyurethane resin) 100 parts and Senka Corporation Actgel NS100 (emulsion type thickener) 1.5 parts by screen printing method. Printing was performed to cover the conductive pattern. The printing apparatus used was SSA-PC660A, and the size of the protective layer was 5 mm wide and 100 mm long. Both ends in the length direction of the conductive pattern are exposed by 5 mm each for resistance measurement. Thereafter, heat drying was performed at 130 ° C. for 15 minutes.
［比較例１］
離型紙をパナック株式会社製：パナピールＴＰ−０３（算術平均粗さ１．２μｍ）に替えた以外は実施例１と同様にして導電性布帛を得た。得られた導電性布帛において、導電パターン表面の算術平均粗さＲａは２．５μｍであった。
[Comparative Example 1]
A conductive fabric was obtained in the same manner as in Example 1 except that the release paper was changed to Panapill TP-03 (arithmetic average roughness 1.2 μm) manufactured by Panac Corporation. In the obtained conductive fabric, the arithmetic average roughness Ra of the surface of the conductive pattern was 2.5 μm.
［比較例２］
比較例１で得られた導電性布帛に対し、実施例３と同様にして保護層を形成した。
[Comparative Example 2]
A protective layer was formed in the same manner as in Example 3 on the conductive fabric obtained in Comparative Example 1.
表１に示すように比較例１の導電性布帛は伸び耐久性試験での抵抗値変化率が１０４３％、比較例２では２０１７％となっており、抵抗値が１０倍以上に増大している。一方、実施例１〜３の導電性布帛は伸び耐久性試験後の抵抗値変化率を有意に低く抑えることができている。 As shown in Table 1, in the conductive fabric of Comparative Example 1, the resistance change rate in the elongation durability test is 1043%, and in Comparative Example 2, it is 2017%, and the resistance value is increased 10 times or more. . On the other hand, the conductive fabrics of Examples 1 to 3 can significantly suppress the resistance value change rate after the elongation durability test.
本発明の導電性布帛は、柔軟性に優れ、伸びに対する抵抗値の変化率が小さい。これは導電パターンが布帛の伸びによって断裂しにくいことを示し、高い導電性が長く持続する。そのため、ウェアラブルデバイス用のベース素材等として好適に利用することができる。 The conductive fabric of the present invention is excellent in flexibility and has a small rate of change in resistance value with respect to elongation. This indicates that the conductive pattern is not easily torn by the stretch of the fabric, and the high conductivity lasts for a long time. Therefore, it can be suitably used as a base material for wearable devices.
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| JP6721338B2 (en) | 2020-07-15 |
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