JP2017110295A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017110295A5 JP2017110295A5 JP2016234953A JP2016234953A JP2017110295A5 JP 2017110295 A5 JP2017110295 A5 JP 2017110295A5 JP 2016234953 A JP2016234953 A JP 2016234953A JP 2016234953 A JP2016234953 A JP 2016234953A JP 2017110295 A5 JP2017110295 A5 JP 2017110295A5
- Authority
- JP
- Japan
- Prior art keywords
- present
- penetrating
- trench
- fill
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000149 penetrating Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241000724291 Tobacco streak virus Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Description
＜充填＞
本発明において、本発明の導電性ペーストで充填すべき部材（被充填物）としては、金属（合金、金属間化合物も含む。）のほか、セラミック、プラスチック、これらの複合材料等を例示できるが、本発明では特にセラミック（シリコンチップ含む）又はプラスチックが好ましい。ここで言う被充填物は、ビア又はトレンチのような微細空間を有するものであり、これを充填するために本発明の導電性ペーストを使用することができる。本発明においては、上述のようなナノ粒子を用いることから、半導体を貫通するビアホール（スルーサブストレートビア：ＴＳＶ）を充填するような場合に採用されうる。
本発明では、特に金属ナノ粒子を使用する点から、ビアは直径０．５〜２．０μｍ、深さが０．５〜２．０μｍ、トレンチは幅０．５〜２．０μｍ、深さが０．５〜２．０μｍのものが好ましい。ここで「ビア」は、基板に設けた貫通又は非貫通の穴のことを示す。
<Fill>
In the present invention, examples of the member (filling material) to be filled with the conductive paste of the present invention include metals (including alloys and intermetallic compounds), ceramics, plastics, and composite materials thereof. In the present invention, ceramic (including a silicon chip) or plastic is particularly preferable. The material to be filled here has a minute space such as a via or a trench, and the conductive paste of the present invention can be used to fill the space. In the present invention, since the above-described nanoparticles are used, the present invention can be employed when filling a via hole (through substrate via: TSV) penetrating a semiconductor.
In the present invention, from the viewpoint of using metal nanoparticles, the via has a diameter of 0.5 to 2.0 μm and a depth of 0.5 to 2.0 μm, and the trench has a width of 0.5 to 2.0 μm and a depth of 0.5 to 2.0 μm. It is preferably 0.5 to 2.0 μm. Here, the “via” indicates a penetrating or non-penetrating hole provided in the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015242211 | 2015-12-11 | ||
| JP2015242211 | 2015-12-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017110295A JP2017110295A (en) | 2017-06-22 |
| JP2017110295A5 true JP2017110295A5 (en) | 2020-01-09 |
| JP6812768B2 JP6812768B2 (en) | 2021-01-13 |
Family
ID=59081498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016234953A Active JP6812768B2 (en) | 2015-12-11 | 2016-12-02 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6812768B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6638863B2 (en) * | 2017-12-18 | 2020-01-29 | Dic株式会社 | Copper fine particle sintered body |
| KR102181676B1 (en) * | 2020-01-15 | 2020-11-24 | 조옥래 | Copper-based material having embedded silver nano particles and method for producing the same |
| WO2024058254A1 (en) * | 2022-09-16 | 2024-03-21 | 日亜化学工業株式会社 | Ceramic sintered body substrate, light-emitting device, and methods for manufacturing these |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103328136B (en) * | 2011-03-31 | 2014-12-03 | Dic株式会社 | Composite of organic compound and silver core/copper shell nanoparticles and method for producing same |
| JP2013171862A (en) * | 2012-02-17 | 2013-09-02 | Tokyo Electron Ltd | Metal paste filling method, metal paste filling device, and via plug manufacturing method |
| SG11201502567TA (en) * | 2012-10-29 | 2015-05-28 | Alpha Metals | Sintering powder |
| JP6372978B2 (en) * | 2013-06-28 | 2018-08-15 | 古河電気工業株式会社 | Conductive paste |
| WO2015098658A1 (en) * | 2013-12-24 | 2015-07-02 | Dic株式会社 | Bonding material containing metal nanoparticles |
-
2016
- 2016-12-02 JP JP2016234953A patent/JP6812768B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017110295A5 (en) | ||
| JP2009117611A5 (en) | ||
| JP2017038062A5 (en) | ||
| WO2016209668A3 (en) | Structures and methods for reliable packages | |
| JP2012216786A5 (en) | ||
| JP2015185589A5 (en) | ||
| JP2018014372A5 (en) | ||
| PH12016501025A1 (en) | Bonding wire for semiconductor device | |
| JP2013031842A5 (en) | ||
| PH12019501192A1 (en) | Joining film and tape for wafer processing | |
| JP2019006490A5 (en) | ||
| JP2015220428A5 (en) | ||
| JP2014085099A5 (en) | ||
| WO2015160808A3 (en) | Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package | |
| JP2017103389A5 (en) | ||
| JP2017522579A5 (en) | ||
| JP2016519718A5 (en) | ||
| JP2013140874A5 (en) | ||
| JP2015050228A5 (en) | ||
| JP2012033905A5 (en) | Semiconductor device | |
| JP2015080900A5 (en) | ||
| JP2011091105A5 (en) | ||
| Barkur et al. | Raman Tweezers Study of Size Dependent Effect of Silver Nanoparticles on RBCs | |
| GB2547574A (en) | Chemically strenghened bond between thermally stable polycrystalline hard materials and braze material | |
| TW201209012A (en) | Composition with ceramic heat dissipation performance |