JP2017094580A - 配線構造、memsデバイス、液体噴射ヘッド、液体噴射装置、memsデバイスの製造方法、液体噴射ヘッドの製造方法、および、液体噴射装置の製造方法 - Google Patents
配線構造、memsデバイス、液体噴射ヘッド、液体噴射装置、memsデバイスの製造方法、液体噴射ヘッドの製造方法、および、液体噴射装置の製造方法 Download PDFInfo
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Abstract
【解決手段】第1の基板(12)に形成された接続端子列(22)に、第2の基板(30)の被接続端子列(57)が電気的に接続されてなる配線構造であって、接続端子列の両端部の端子並設方向側に、電気信号の送受に使用されないダミー端子(24)がそれぞれ設けられ、第1の基板と第2の基板との間に設けられた導電性粒子を含む異方性導電膜(9)は、ダミー端子に向かって延在し、異方性導電膜の端がダミー端子の表面上に設けられていることを特徴とする。
【選択図】図13
Description
第1の基板に形成された接続端子列に、第2の基板の被接続端子列が電気的に接続されてなる配線構造であって、
前記接続端子列の両端部の端子並設方向側に、電気信号の送受に使用されないダミー端子がそれぞれ設けられ、
前記第1の基板と前記第2の基板との間に設けられた導電性粒子を含む異方性導電膜は、前記ダミー端子に向かって延在し、前記異方性導電膜の端が前記ダミー端子の表面上に設けられていることを特徴とする。
前記異方性導電膜が、熱圧着治具によって前記剥離フィルムと前記第1の基板との間で加熱および押圧されて前記接続端子列および前記ダミー端子に仮圧着される工程と、
前記接続端子列および前記ダミー端子に仮圧着された異方性導電膜から前記剥離フィルムが剥離される工程と、
前記接続端子列の各接続端子と前記被接続端子列の各被接続端子とがそれぞれ対応するように前記第1の基板と前記第2の基板との相対位置が規定された状態で、前記第1の基板と前記第2の基板とが前記異方性導電膜を介在させて貼り合わされる工程と、
前記第1の基板と前記第2の基板とが、熱圧着治具により前記異方性導電膜を挟む方向に加熱および加圧されて圧着される工程と、
を経ることを特徴とする。
Claims (9)
- 第1の基板に形成された接続端子列に、第2の基板の被接続端子列が電気的に接続されてなる配線構造であって、
前記接続端子列の両端部の端子並設方向側に、電気信号の送受に使用されないダミー端子がそれぞれ設けられ、
前記第1の基板と前記第2の基板との間に設けられた導電性粒子を含む異方性導電膜は、前記ダミー端子に向かって延在し、前記異方性導電膜の端が前記ダミー端子の表面上に設けられていることを特徴とする配線構造。 - 前記端子並設方向に垂直な方向において、前記異方性導電膜の幅が前記ダミー端子の幅よりも小さく、前記異方性導電膜の少なくとも一方の端が前記ダミー端子の表面上に設けられていることを特徴とする請求項1に記載の配線構造。
- 前記ダミー端子の面積は、前記接続端子列を構成する複数の接続端子のうち最も大きい接続端子の面積に揃えられていることを特徴とする請求項1または請求項2に記載の配線構造。
- 請求項1から請求項3の何れか一項に記載の配線構造により電気的に接続された第1の基板および第2の基板を備えることを特徴とするMEMSデバイス。
- 請求項4に記載のMEMSデバイスを備えることを特徴とする液体噴射ヘッド。
- 請求項5に記載の液体噴射ヘッドを備えることを特徴とする液体噴射装置。
- 請求項4に記載のMEMSデバイスの製造方法であって、
可撓性を有する剥離フィルム上に形成された前記異方性導電膜が、前記接続端子列の端子並設方向における当該異方性導電膜の両端がそれぞれ接続端子列の両側のダミー端子の表面に位置する状態で前記第1の基板に貼着される工程と、
前記異方性導電膜が、熱圧着治具によって前記剥離フィルムと前記第1の基板との間で加熱および押圧されて前記接続端子列および前記ダミー端子に仮圧着される工程と、
前記接続端子列および前記ダミー端子に仮圧着された異方性導電膜から前記剥離フィルムが剥離される工程と、
前記接続端子列の各接続端子と前記被接続端子列の各被接続端子とがそれぞれ対応するように前記第1の基板と前記第2の基板との相対位置が規定された状態で、前記第1の基板と前記第2の基板とが前記異方性導電膜を介在させて貼り合わされる工程と、
前記第1の基板と前記第2の基板とが、熱圧着治具により前記異方性導電膜を挟む方向に加熱および加圧されて圧着される工程と、
を有することを特徴とするMEMSデバイスの製造方法。 - 請求項7に記載のMEMSデバイスの製造方法を含む液体噴射ヘッドの製造方法。
- 請求項8に記載の液体噴射ヘッドの製造方法を含む液体噴射装置の製造方法。
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JP2015228460A JP2017094580A (ja) | 2015-11-24 | 2015-11-24 | 配線構造、memsデバイス、液体噴射ヘッド、液体噴射装置、memsデバイスの製造方法、液体噴射ヘッドの製造方法、および、液体噴射装置の製造方法 |
US15/354,864 US20170144438A1 (en) | 2015-11-24 | 2016-11-17 | Wiring structure, mems device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing mems device, method for manufacturing liquid ejecting head and method for manufacturing liquid ejecting apparatus |
CN201611038117.4A CN107020842A (zh) | 2015-11-24 | 2016-11-23 | Mems装置、喷射头、喷射装置及它们的制造方法、配线结构 |
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JP7147319B2 (ja) * | 2018-07-20 | 2022-10-05 | セイコーエプソン株式会社 | 液体噴射装置および液体噴射ヘッド |
CN109278409B (zh) * | 2018-08-16 | 2019-07-23 | 西安微电子技术研究所 | 一种mems压电打印喷头组件集成结构 |
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US20170144438A1 (en) | 2017-05-25 |
CN107020842A (zh) | 2017-08-08 |
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