JP2017004670A - Terminal and terminal soldering structure - Google Patents

Terminal and terminal soldering structure Download PDF

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JP2017004670A
JP2017004670A JP2015115463A JP2015115463A JP2017004670A JP 2017004670 A JP2017004670 A JP 2017004670A JP 2015115463 A JP2015115463 A JP 2015115463A JP 2015115463 A JP2015115463 A JP 2015115463A JP 2017004670 A JP2017004670 A JP 2017004670A
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terminal
substrate
distal end
solder
tip
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健三 田中
Kenzo Tanaka
健三 田中
孝裕 松尾
Takahiro Matsuo
孝裕 松尾
智之 堀江
Tomoyuki Horie
智之 堀江
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Yazaki Corp
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Yazaki Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a terminal which enables solder to unfailingly wet the terminal during reflow soldering to prevent solder failure.SOLUTION: In a terminal 10, a terminal tip part 14 penetrates through a through hole 2 of a substrate 1 and the terminal tip part 14 is electrically connected to the substrate 1 by solder 15. Vertical grooves 16 extending from a tip of the terminal tip part 14 to a base end side are provided an outer peripheral surface 14a of the terminal tip part 14.SELECTED DRAWING: Figure 1

Description

本発明は、基板に半田で接続される端子及び端子半田付け構造に関する。   The present invention relates to a terminal connected to a substrate with solder and a terminal soldering structure.

この種の端子半田付け構造の一従来例が、図５に示されている（特許文献１参照）。図４において、端子半田付け構造は、複数のスルーホール１０１を有する基板１００と、基板１００上に載置されたコネクタハウジング１０２に保持された複数の端子１１０とを備えている。基板１００の上下面のスルーホール１０１の周辺及びスルーホール１０１の内面には、配線メッキ部１０３が形成されている。   One conventional example of this type of terminal soldering structure is shown in FIG. 5 (see Patent Document 1). 4, the terminal soldering structure includes a substrate 100 having a plurality of through holes 101 and a plurality of terminals 110 held by a connector housing 102 placed on the substrate 100. A wiring plating portion 103 is formed around the through hole 101 on the upper and lower surfaces of the substrate 100 and on the inner surface of the through hole 101.

各端子１１０は、長手方向の途中で直角に折り曲げられた折り曲げ部１１１と、基板１００の上面１００ａ及び下面１００ｂと平行な方向に伸びるコネクタ接続部１１２と、基板１００の上面１００ａ及び下面１００ｂに対して垂直な方向に伸びる端子先端部１１３とを有する。端子先端部１１３は、基板１００のスルーホール１０１に貫通されている、端子先端部１１３は、基板１００の配線メッキ部１０３に半田１０４によって接続されている。   Each terminal 110 is connected to a bent portion 111 bent at a right angle in the middle of the longitudinal direction, a connector connecting portion 112 extending in a direction parallel to the upper surface 100a and the lower surface 100b of the substrate 100, and the upper surface 100a and the lower surface 100b of the substrate 100. And a terminal tip 113 extending in a vertical direction. The terminal tip portion 113 is penetrated through the through hole 101 of the substrate 100, and the terminal tip portion 113 is connected to the wiring plating portion 103 of the substrate 100 by solder 104.

上記構成において、基板１００のスルーホール１０１にペースト状の半田１０４を詰めた後、基板１００のスルーホール１０１に端子先端部１１３を圧入すると、端子先端部１１３によりペースト状の半田１０４が基板１００のスルーホール１０１から押し出される。   In the above configuration, after the paste-like solder 104 is packed in the through-hole 101 of the substrate 100 and then the terminal tip portion 113 is press-fitted into the through-hole 101 of the substrate 100, the paste-like solder 104 is attached to the substrate 100 by the terminal tip portion 113. It is pushed out from the through hole 101.

次に、リフロー炉などにより熱風を加える。すると、ペースト状の半田１０４が溶融し、溶融した半田１０４が端子先端部１１３の外周に沿って濡れ上げる。濡れ上がった半田１０４が固化し、半田１０４によって端子先端部１１３と基板１００の配線メッキ部１０３とが接続される。   Next, hot air is applied by a reflow furnace or the like. Then, the paste-like solder 104 is melted, and the melted solder 104 is wetted along the outer periphery of the terminal tip portion 113. The wet solder 104 is solidified, and the terminal end portion 113 and the wiring plating portion 103 of the substrate 100 are connected by the solder 104.

特開２０１２−１４６５３３号公報JP 2012-146533 A

しかしながら、前記従来例では、溶融された半田１０４が端子先端部１１３の表面を濡れ上がるため、基板１００の位置まで十分な量の半田１０４が濡れ上がらず、半田付け不良が発生する恐れがある。   However, in the conventional example, since the melted solder 104 wets the surface of the terminal tip portion 113, a sufficient amount of the solder 104 does not wet up to the position of the substrate 100, which may cause a soldering failure.

特に、基板１００より突出する端子先端部１１３の寸法が長いと、半田１０４が濡れあがらずに半田付け不良が発生する可能性が高くなる。   In particular, if the dimension of the terminal tip 113 protruding from the substrate 100 is long, there is a high possibility that a soldering defect will occur without the solder 104 getting wet.

本発明は、上記事情を考慮し、リフロー半田付け時にあって半田が確実に濡れ上がり、半田付け不良を防止できる端子及び半田付け構造を提供することを目的とする。   In view of the above circumstances, an object of the present invention is to provide a terminal and a soldering structure capable of preventing soldering failure and preventing soldering failure during reflow soldering.

本発明の端子は、基板のスルーホールに端子先端部が貫通され、前記端子先端部が前記基板に半田によって電気的に接続される端子において、前記端子先端部の外周面には、前記端子先端部の先端から基端側に向かって伸びる溝が設けられたことを特徴とする。   The terminal of the present invention is a terminal in which a terminal tip is passed through a through hole of a substrate, and the terminal tip is electrically connected to the substrate by solder. A groove extending from the distal end of the portion toward the proximal end side is provided.

他の本発明の端子半田付け構造は、スルーホールを有する基板と、前記スルーホールに端子先端部が貫通される端子とを備え、前記スルーホールより貫通した前記端子先端部の箇所を半田によって前記基板に電気的に接続される端子半田付け構造であって、前記端子先端部の外周面には、前記端子先端部の先端から基端部に向かって伸びる溝が設けられたことを特徴とする。   Another terminal soldering structure of the present invention includes a substrate having a through hole, and a terminal having a terminal tip portion penetrating through the through hole, and the portion of the terminal tip portion penetrating from the through hole is soldered. A terminal soldering structure electrically connected to a substrate, wherein a groove extending from a distal end of the terminal distal end toward a proximal end is provided on an outer peripheral surface of the terminal distal end. .

本発明によれば、端子先端部の先端に押し出された溶融半田が溝内を毛細管現象によって基板側に濡れ上がる。従って、リフロー半田付け時にあって半田が確実に濡れ上がり、半田付け不良を防止できる。   According to the present invention, the molten solder pushed out to the tip of the terminal tip portion wets up in the groove toward the substrate side by capillary action. Accordingly, the solder is surely wetted during reflow soldering, and soldering failure can be prevented.

本発明の一実施形態を示し、端子半田付け構造の断面図である。1 is a cross-sectional view of a terminal soldering structure according to an embodiment of the present invention. 本発明の一実施形態を示し、（ａ）は端子先端部及び基板の拡大断面図、（ｂ）は端子先端部の拡大斜視図である。1 shows an embodiment of the present invention, in which (a) is an enlarged cross-sectional view of a terminal tip and a substrate, and (b) is an enlarged perspective view of a terminal tip. 本発明の一実施形態を示し、（ａ）は基板のスルーホールにペースト状の半田を詰める工程を説明する断面図、（ｂ）は基板のスルーホールに端子先端部を圧入する工程を説明する断面図、（ｃ）は端子先端部の縦溝に入り込んだ半田が濡れ上がる状態を示す図である。1A and 1B show an embodiment of the present invention, in which FIG. 1A is a cross-sectional view illustrating a process of filling paste-like solder into a through hole of a substrate, and FIG. 2B illustrates a process of press-fitting a terminal tip into the through hole of the substrate. Sectional drawing (c) is a diagram showing a state in which the solder that has entered the vertical groove at the tip of the terminal wets. （ａ）は端子の第１変形例であって、端子先端部の拡大斜視図、（ｂ）は端子の第２変形例であって、端子先端部の拡大斜視図である。(A) is a 1st modification of a terminal, Comprising: The expansion perspective view of a terminal front-end | tip part, (b) is a 2nd modification of a terminal, Comprising: It is an expansion perspective view of a terminal front-end | tip part. 一従来例を示し、端子半田付け構造の断面図である。It is sectional drawing of a terminal soldering structure which shows one prior art example.

以下、本発明の一実施形態を図面に基づいて説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１〜図３は本発明の一実施形態を示す。図１に示すように、端子半田付け構造は、基板（プリント配線基板）１と、端子１０とを備えている。基板１には、スルーホール２が設けられている。基板１のスルーホール２の上面１ａ及び下面１ｂの周縁及びスルーホール２の内面には、導電性材からなるランド３が形成されている。   1 to 3 show an embodiment of the present invention. As shown in FIG. 1, the terminal soldering structure includes a substrate (printed wiring substrate) 1 and terminals 10. A through hole 2 is provided in the substrate 1. Lands 3 made of a conductive material are formed on the periphery of the upper surface 1 a and the lower surface 1 b of the through hole 2 of the substrate 1 and the inner surface of the through hole 2.

端子１０は、その基端側が基板１上に載置されたコネクタハウジング１１に保持されている。各端子１０は、長手方向の途中で直角に折り曲げられた折り曲げ部１２と、基板１の上面１ａ及び下面１ｂと平行に伸びるコネクタ接続部１３と、基板１の上面１ａ及び下面１ｂに対して垂直な方向に伸びる端子先端部１４とを有する。   The terminal 10 is held by a connector housing 11 whose base end is placed on the substrate 1. Each terminal 10 is perpendicular to the bent portion 12 bent at a right angle in the middle of the longitudinal direction, the connector connecting portion 13 extending in parallel with the upper surface 1 a and the lower surface 1 b of the substrate 1, and the upper surface 1 a and the lower surface 1 b of the substrate 1. And a terminal tip 14 extending in any direction.

図２（ａ）に詳しく示すように、端子先端部１４は、基板１のスルーホール２に貫通されている。端子先端部１４は、基板１のランド３に半田１５で固定され、電気的に接続されている。   As shown in detail in FIG. 2A, the terminal tip portion 14 penetrates the through hole 2 of the substrate 1. The terminal tip 14 is fixed to the land 3 of the substrate 1 with solder 15 and is electrically connected.

図２（ｂ）に詳しく示すように、端子先端部１４は、断面が四角柱状に形成されている。また、端子先端部１４の外周面１４ａの４面には、端子先端部１４の先端から基端側に向かって軸方向に沿って延びる４本の溝である縦溝１６が設けられている。このようにして、縦溝１６は、端子先端部１４の全周にわたって間隔を置いて設けられている。   As shown in detail in FIG. 2B, the terminal tip 14 is formed in a quadrangular prism shape in cross section. Further, on the four surfaces of the outer peripheral surface 14a of the terminal distal end portion 14, there are provided vertical grooves 16 that are four grooves extending along the axial direction from the distal end of the terminal distal end portion 14 toward the proximal end side. In this way, the longitudinal grooves 16 are provided at intervals over the entire circumference of the terminal tip portion 14.

次に、半田付け作業を説明する。先ず、図３（ａ）に示すように、基板１のスルーホール２にペースト状の半田１５を詰める。次に、基板１のスルーホール２に端子１０の端子先端部１４を圧入する。すると、図３（ｂ）に示すように、端子先端部１４で基板１のスルーホール２からペースト状の半田１５が下方へ押し出される。   Next, the soldering operation will be described. First, as shown in FIG. 3A, paste-like solder 15 is filled in the through hole 2 of the substrate 1. Next, the terminal tip 14 of the terminal 10 is press-fitted into the through hole 2 of the substrate 1. Then, as shown in FIG. 3B, the paste-like solder 15 is pushed downward from the through hole 2 of the substrate 1 at the terminal tip portion 14.

次に、図示しないリフロー炉で熱風を加える。すると、ペースト状の半田１５が溶融し、溶融した半田１５が、図３（ｃ）に示すように、端子先端部１４の表面より濡れ上がると共に、各縦溝１６に入り込んだ溶融半田１５が毛細管現象によって基板１の上面１ａ側に濡れ上がる。つまり、半田１５の濡れ上がりが促進される。   Next, hot air is applied in a reflow furnace (not shown). Then, the paste-like solder 15 is melted, and the melted solder 15 is wetted from the surface of the terminal tip 14 as shown in FIG. 3C, and the molten solder 15 that has entered each vertical groove 16 is capillary. Due to the phenomenon, the substrate 1 gets wet to the upper surface 1a side. That is, wetting up of the solder 15 is promoted.

このように濡れ上がった半田１５が冷却し、固化することにより、端子先端部１４と基板１のランド３が半田１５で確実に電気的に接続される。   The solder 15 thus wetted is cooled and solidified, so that the terminal tip 14 and the land 3 of the substrate 1 are reliably electrically connected by the solder 15.

以上説明したように、リフロー半田付け時にあって半田１５が確実に濡れ上がり、半田付け不良を防止できる。   As described above, during reflow soldering, the solder 15 is surely wetted and soldering failure can be prevented.

溶融半田１５が端子先端部１４の４本の縦溝１６に沿って基板１の上面１ａ側に濡れ上がるため、端子先端部１４と基板１との半田付け不良を更に確実に防止できる。   Since the molten solder 15 wets toward the upper surface 1a side of the substrate 1 along the four vertical grooves 16 of the terminal tip portion 14, it is possible to prevent soldering defects between the terminal tip portion 14 and the substrate 1 more reliably.

図４（ａ）には、第１変形例に係る端子１０Ａの端子先端部１４が示されている。この端子１０Ａの端子先端部１４には、その外周面１４ａの４面に亘って連続し、且つ、端子先端部１４の先端から基端側に向かって螺旋状に延びる二条の螺旋溝（溝）１６ａが設けられている。螺旋溝１６ａは、螺旋溝１６ａの延設方向に対し直交する方向の形状が円弧状の溝であるが、前記実施形態のように螺旋溝１６ａの延設方向に対し直交する方向の形状が四角形の溝であったも良い。
螺旋溝１６ａに入り込んだ溶融半田１５は、毛細管現象によって基板１の上面１ａ側に濡れ上がる。 FIG. 4A shows the terminal tip portion 14 of the terminal 10A according to the first modification. Two spiral grooves (grooves) that are continuous with the terminal distal end portion 14 of the terminal 10A over the four outer peripheral surfaces 14a and extend spirally from the distal end of the terminal distal end portion 14 toward the proximal end side. 16a is provided. The spiral groove 16a is an arc-shaped groove in a direction orthogonal to the extending direction of the spiral groove 16a, but the shape in a direction orthogonal to the extending direction of the spiral groove 16a is a quadrangle as in the above-described embodiment. It may be a groove.
The molten solder 15 that has entered the spiral groove 16a gets wet to the upper surface 1a side of the substrate 1 by capillary action.

図４（ｂ）には、第２変形例に係る端子１０Ｂの端子先端部１４が示されている。この端子１０Ｂの端子先端部１４には、前記実施形態と同様に、その外周面１４ａの４面に、端子先端部１４の先端から基端側に向かって軸方向に沿って延びる４本の縦溝（溝）１６ｂが設けられている。各縦溝１６ｂは、前記実施形態では縦溝１６ｂの延設方向に対し直交する方向の形状が四角形の溝であったが、この第２変形例では縦溝１６ｂの延設方向に対し直交する方向の形状が円弧状の溝である。縦溝１６ｂに入り込んだ溶融半田１５は、前記実施形態と同様に、毛細管現象によって基板１の上面１ａ側に濡れ上がる。   FIG. 4B shows the terminal tip 14 of the terminal 10B according to the second modification. In the terminal distal end portion 14 of the terminal 10B, as in the above-described embodiment, four vertical surfaces extending along the axial direction from the distal end of the terminal distal end portion 14 toward the proximal end side are formed on the four outer peripheral surfaces 14a. A groove (groove) 16b is provided. Each vertical groove 16b is a quadrangular groove in the direction orthogonal to the extending direction of the vertical groove 16b in the above-described embodiment, but in the second modification example, the vertical groove 16b is orthogonal to the extending direction of the vertical groove 16b. The direction shape is an arc-shaped groove. The molten solder 15 that has entered the vertical groove 16b is wetted to the upper surface 1a side of the substrate 1 by capillary action as in the above-described embodiment.

なお、上記実施形態及び各変形例にあっては、端子先端部１４を四角柱状に形成したが、本発明はこれに限定されず、端子先端部を他の断面形状、例えば円形状に形成することもできる。また、上記実施形態にあっては、端子先端部１４の外周面１４ａに４本の縦溝１６を端子先端部１４の全周にわたって間隔を置いて設けたが、端子先端部の断面形状に応じて異なる本数の縦溝や螺旋溝を設けても良い。   In addition, in the said embodiment and each modification, although the terminal front-end | tip part 14 was formed in square pillar shape, this invention is not limited to this, A terminal front-end | tip part is formed in another cross-sectional shape, for example, circular shape. You can also. Further, in the above embodiment, the four vertical grooves 16 are provided on the outer peripheral surface 14a of the terminal tip portion 14 at intervals over the entire circumference of the terminal tip portion 14, but depending on the cross-sectional shape of the terminal tip portion. Different numbers of longitudinal grooves and spiral grooves may be provided.

さらに、上記実施形態にあっては、端子１０の端子先端部１４を四角柱状に形成したが、端子を長手方向の全長にわたって四角柱状に形成することもできる。   Furthermore, in the said embodiment, although the terminal front-end | tip part 14 of the terminal 10 was formed in square pillar shape, a terminal can also be formed in square pillar shape over the full length of a longitudinal direction.

１ 基板
２ スルーホール
１０ 端子
１４ 端子先端部
１４ａ 外周面
１５ 半田
１６，１６ｂ 縦溝（溝）
１６ａ 螺旋溝（溝） DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Through hole 10 Terminal 14 Terminal front-end | tip part 14a Outer peripheral surface 15 Solder 16, 16b Vertical groove (groove)
16a Spiral groove (groove)

Claims (6)

基板のスルーホールに端子先端部が貫通され、
前記端子先端部が前記基板に半田によって電気的に接続される端子において、
前記端子先端部の外周面には、前記端子先端部の先端から基端側に向かって伸びる溝が設けられたことを特徴とする端子。 The terminal tip is passed through the through hole of the board,
In the terminal where the terminal tip is electrically connected to the substrate by solder,
A terminal characterized in that a groove extending from the distal end of the terminal distal end portion toward the proximal end side is provided on an outer peripheral surface of the terminal distal end portion. 請求項１記載の端子であって、
前記溝は、前記端子先端部の全周にわたって間隔を置いて複数本設けられた縦溝であることを特徴とする端子。 The terminal according to claim 1,
The terminal is characterized in that the groove is a plurality of vertical grooves provided at intervals over the entire circumference of the terminal tip. 請求項１記載の端子であって、
前記溝は、前記端子先端部の先端から基端側に向かって延びる螺旋溝であることを特徴とする端子。 The terminal according to claim 1,
The terminal is characterized in that the groove is a spiral groove extending from the distal end of the terminal distal end portion toward the proximal end side. スルーホールを有する基板と、
前記スルーホールに端子先端部が貫通される端子とを備え、
前記スルーホールより貫通した前記端子先端部の箇所を半田によって前記基板に電気的に接続される端子半田付け構造であって、
前記端子先端部の外周面には、前記端子先端部の先端から基端側に向かって伸びる溝が設けられたことを特徴とする端子半田付け構造。 A substrate having a through hole;
A terminal through which the tip of the terminal penetrates the through hole;
A terminal soldering structure in which a portion of the terminal tip portion penetrating from the through hole is electrically connected to the substrate by solder,
A terminal soldering structure, wherein a groove extending from a distal end of the terminal distal end portion toward a proximal end side is provided on an outer peripheral surface of the terminal distal end portion. 請求項４に記載の端子半田付け構造であって、
前記溝は、前記端子先端部の全周にわたって間隔を置いて複数本設けられた縦溝であることを特徴とする端子半田付け構造。 The terminal soldering structure according to claim 4,
The terminal soldering structure, wherein the groove is a plurality of vertical grooves provided at intervals over the entire circumference of the terminal tip. 請求項４に記載の端子半田付け構造であって、
前記溝は、前記端子先端部の先端から基端側に向かって延びる螺旋溝であることを特徴とする端子半田付け構造。 The terminal soldering structure according to claim 4,
The terminal soldering structure, wherein the groove is a spiral groove extending from the distal end of the terminal distal end portion toward the proximal end side.
JP2015115463A 2015-06-08 2015-06-08 Terminal and terminal soldering structure Pending JP2017004670A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140038A (en) * 2018-02-14 2019-08-22 住友電装株式会社 Press-fit terminal

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019140038A (en) * 2018-02-14 2019-08-22 住友電装株式会社 Press-fit terminal
WO2019159628A1 (en) * 2018-02-14 2019-08-22 住友電装株式会社 Press-fit terminal
US11264741B2 (en) 2018-02-14 2022-03-01 Sumitomo Wiring Systems, Ltd. Press-fit terminal
JP7027932B2 (en) 2018-02-14 2022-03-02 住友電装株式会社 Press-fit terminal

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