JP2016533562A - タッチセンサ装置 - Google Patents
タッチセンサ装置 Download PDFInfo
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- JP2016533562A JP2016533562A JP2016519861A JP2016519861A JP2016533562A JP 2016533562 A JP2016533562 A JP 2016533562A JP 2016519861 A JP2016519861 A JP 2016519861A JP 2016519861 A JP2016519861 A JP 2016519861A JP 2016533562 A JP2016533562 A JP 2016533562A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Position Input By Displaying (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (12)
- 光学的に透明で電気絶縁性の基板(1)、該基板上に配列された少なくとも1つの光学的に透明で導電性のセンサ要素(2x、2y)、及び前記光学的に透明なセンサ要素に電気的に接触させるための少なくとも1つの接触構造(4、4’)を有するタッチセンサ装置(10)であって、前記接触構造が組成MoaXbOcNd(ここで、b≧0であり、Xは、ニオブ、タンタル、バナジウム、タングステン、クロム、レニウム、ハフニウム、チタン及びジルコニウムの群から選ばれる元素又はこれらのニオブ、タンタル、バナジウム、タングステン、クロム、レニウム、ハフニウム、チタン及びジルコニウムの群から選ばれる複数の元素の組合せである。)を有する金属オキシニトリドから作られた少なくとも1つの層を有することを特徴とするタッチセンサ装置。
- 前記金属オキシニトリドからなる層が20%未満の反射率を有することを特徴とする請求項1に記載のタッチセンサ装置。
- 前記金属オキシニトリド層MoaXbOcNdが窒素原子の3倍以上、9倍以下の酸素原子を有することを特徴とする請求項1又は2に記載のタッチセンサ装置。
- 前記金属オキシニトリド層MoaXbOcNdについて、下記の関係が成り立つことを特徴とする請求項1〜3のいずれか1項に記載のタッチセンサ装置。
0≦b≦0.25a、0.5≦c≦0.75、0.01≦d≦0.2、a+b+c+d=1及びc+d≦0.8。 - 前記接触構造が複数層状に構成されており、更に、Al、Mo、Cu、Ag若しくはAu又はこれらの金属の1つに基づく合金からなる金属層を有することを特徴とする請求項1〜4のいずれか1項に記載のタッチセンサ装置。
- センサ電極として形成された前記センサ要素が格子状に配列されており、複数の第一のセンサ要素が第一の方向において異なる位置に配列されており、複数の第二のセンサ要素が第二の方向において異なる位置に配列されており、前記センサ電極が、各場合において、交点において少なくとも1つの電気絶縁層により互いに分離されており、前記複数の第一のセンサ電極が前記交点において金属オキシニトリドを有する前記接触構造(4)により接触していることを特徴とする請求項1〜5のいずれか1項に記載のタッチセンサ装置。
- 前記接触構造(4’)が前記タッチセンサ要素を活性化エレクトロニクス及び/又は解析エレクトロニクスに電気的に接続するための接触端子として形成されていることを特徴とする請求項1〜5のいずれか1項に記載のタッチセンサ装置。
- 投影型容量式タッチセンサとして形成されていることを特徴とする請求項1〜7のいずれか1項に記載のタッチセンサ装置。
- 請求項1〜8のいずれか1項に記載のタッチセンサ装置を有するタッチセンサディスプレイユニット(タッチパネル)であって、該タッチセンサ装置がディスプレイユニットの上流に搭載され(アウトセル)又はディスプレイユニット中に組み込まれている(オンセル、インセル)タッチセンサディスプレイユニット。
- 前記接触構造が少なくとも1つの金属層及び少なくとも1つのオキシニトリド層を有し、層の順序において、前記金属オキシニトリド層が、前記金属層からの間隔よりも更に大きい間隔をおいて前記ディスプレイユニット層から離れて配置されている請求項9に記載のタッチセンサディスプレイ。
- 請求項1〜8のいずれかに記載のタッチセンサ装置の接触構造を製造するためのスパッタリングターゲットMo1−zXz(ここで、Xは、ニオブ、タンタル、バナジウム、タングステン、クロム、レニウム、ハフニウム、チタン及びジルコニウムからなる元素群から選ばれる複数の元素の組合せであり、0≦z≦0.2である。)の使用。
- 請求項1〜8のいずれかに記載のタッチセンサ装置を製造するための方法であって、
前記金属オキシニトリド層が、酸素及び窒素の供給下に、スパッタリングターゲットMo1−zXz(ここで、Xは、ニオブ、タンタル、バナジウム、タングステン、クロム、レニウム、ハフニウム、チタン及びジルコニウムからなる元素群から選ばれる元素又はこのニオブ、タンタル、バナジウム、タングステン、クロム、レニウム、ハフニウム、チタン及びジルコニウムからなる元素群から選ばれる複数の元素の組合せであり、0≦z≦0.2である。)を用いて、気相蒸着法により製造される方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ATGM319/2013 | 2013-10-04 | ||
ATGM319/2013U AT13879U1 (de) | 2013-10-04 | 2013-10-04 | Berührungssensoranordnung |
PCT/AT2014/000178 WO2015048828A1 (de) | 2013-10-04 | 2014-10-01 | Berührungssensoranordnung |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016533562A true JP2016533562A (ja) | 2016-10-27 |
JP2016533562A5 JP2016533562A5 (ja) | 2017-09-21 |
JP6747970B2 JP6747970B2 (ja) | 2020-08-26 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2016519861A Active JP6747970B2 (ja) | 2013-10-04 | 2014-10-01 | タッチセンサ装置 |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6747970B2 (ja) |
KR (1) | KR102388979B1 (ja) |
CN (1) | CN105593800B (ja) |
AT (1) | AT13879U1 (ja) |
TW (1) | TWI623871B (ja) |
WO (1) | WO2015048828A1 (ja) |
Cited By (2)
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JPWO2017170862A1 (ja) * | 2016-04-01 | 2018-04-05 | 凸版印刷株式会社 | 印刷体、印刷体管理装置、情報出力システム、及び印刷体のページ識別方法 |
JP2021505971A (ja) * | 2017-12-19 | 2021-02-18 | 友達光電股▲ふん▼有限公司AU Optronics Corporation | 金属構造、その作成方法及びそれを応用した表示パネル |
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WO2016159602A1 (ko) * | 2015-03-27 | 2016-10-06 | 주식회사 엘지화학 | 전도성 구조체, 이의 제조방법 및 전도성 구조체를 포함하는 전극 |
US11293088B2 (en) * | 2015-12-07 | 2022-04-05 | Lg Chem, Ltd. | Conductive structure, method for manufacturing same, and electrode comprising conductive structure |
TWI581158B (zh) * | 2016-06-01 | 2017-05-01 | 友達光電股份有限公司 | 觸控面板及其製作方法 |
KR102573333B1 (ko) * | 2016-06-28 | 2023-08-31 | 삼성디스플레이 주식회사 | 표시 장치 |
US10151953B2 (en) * | 2017-02-22 | 2018-12-11 | A. U. Vista, Inc. | In-plane switching display having protrusion electrodes with metal enhanced adhesion |
CN110872687B (zh) * | 2018-09-03 | 2022-07-19 | 大同特殊钢株式会社 | 层叠体及靶材 |
TWI722860B (zh) * | 2020-04-08 | 2021-03-21 | 新唐科技股份有限公司 | 氣體感測材料與氣體感測器 |
CN114510167B (zh) * | 2020-11-17 | 2024-04-12 | 瀚宇彩晶股份有限公司 | 触控感测面板 |
CN112680967B (zh) * | 2020-12-15 | 2022-02-18 | 武汉纺织大学 | 具有单向导湿作用的压阻传感织物及其制备方法 |
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2013
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-
2014
- 2014-08-20 TW TW103128585A patent/TWI623871B/zh active
- 2014-10-01 WO PCT/AT2014/000178 patent/WO2015048828A1/de active Application Filing
- 2014-10-01 CN CN201480054704.5A patent/CN105593800B/zh active Active
- 2014-10-01 KR KR1020167008753A patent/KR102388979B1/ko active IP Right Grant
- 2014-10-01 JP JP2016519861A patent/JP6747970B2/ja active Active
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Also Published As
Publication number | Publication date |
---|---|
TWI623871B (zh) | 2018-05-11 |
WO2015048828A1 (de) | 2015-04-09 |
AT13879U1 (de) | 2014-10-15 |
CN105593800B (zh) | 2019-11-08 |
JP6747970B2 (ja) | 2020-08-26 |
TW201528096A (zh) | 2015-07-16 |
KR20160067849A (ko) | 2016-06-14 |
CN105593800A (zh) | 2016-05-18 |
KR102388979B1 (ko) | 2022-04-20 |
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