JP2016523024A - 集積アンテナ用ホーン様延長部 - Google Patents
集積アンテナ用ホーン様延長部 Download PDFInfo
- Publication number
- JP2016523024A JP2016523024A JP2016510639A JP2016510639A JP2016523024A JP 2016523024 A JP2016523024 A JP 2016523024A JP 2016510639 A JP2016510639 A JP 2016510639A JP 2016510639 A JP2016510639 A JP 2016510639A JP 2016523024 A JP2016523024 A JP 2016523024A
- Authority
- JP
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- Prior art keywords
- horn
- antenna
- integrated circuit
- seal ring
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 230000005855 radiation Effects 0.000 claims description 50
- 239000002184 metal Substances 0.000 claims description 48
- 229910052751 metal Inorganic materials 0.000 claims description 48
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 27
- 229910052710 silicon Inorganic materials 0.000 claims description 25
- 239000010703 silicon Substances 0.000 claims description 25
- 238000005259 measurement Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 229910002601 GaN Inorganic materials 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 8
- 239000011159 matrix material Substances 0.000 claims 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims 1
- 239000011247 coating layer Substances 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000013459 approach Methods 0.000 description 12
- 238000013461 design Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 229910052581 Si3N4 Inorganic materials 0.000 description 6
- 230000010287 polarization Effects 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 235000012431 wafers Nutrition 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000005672 electromagnetic field Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000005507 spraying Methods 0.000 description 4
- 238000010146 3D printing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 238000010137 moulding (plastic) Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/06—Waveguide mouths
- H01Q13/065—Waveguide mouths provided with a flange or a choke
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
- H01Q19/08—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens for modifying the radiation pattern of a radiating horn in which it is located
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0087—Apparatus or processes specially adapted for manufacturing antenna arrays
- H01Q21/0093—Monolithic arrays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Radar Systems Or Details Thereof (AREA)
- Waveguide Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Support Of Aerials (AREA)
Abstract
Description
‐半導体集積回路に形成され、電磁信号の送信及び電磁信号の受信の機能のうちの少なくとも1つを実行するように設けられたアンテナアセンブリを含むモジュールと、
‐該モジュールに適合された基部、及びモジュールに適合されるときにアンテナアセンブリを取り囲む入力開口部を有する延長ホーン形状部分を含むホーン様構造とを含む。
‐半導体集積回路に形成され、電磁信号の送信及び電磁信号の受信の機能のうちの少なくとも1つを実行するように設けられたアンテナアセンブリを含むモジュールと、
‐該モジュールに適合された基部、及びモジュールに適合されるときにアンテナアセンブリを取り囲む入力開口部を有する延長ホーン形状部分を含むホーン様構造とを含む。
Claims (14)
- 1つ又は複数のアンテナを有する集積された送信機・受信機を備え、前記送信機・受信機は、前記アンテナの放射パターンに方向性を与えるホーン様構造と組み合わせられた集積回路又は筐体に組み合わせられることを特徴とする装置。
- 前記ホーン様構造は金属製である、請求項1に記載の装置。
- 前記ホーン様構造はプラスチック製であり、金属又は金属様構造で被覆される、請求項1又は請求項2のいずれか1項に記載の装置。
- 前記ホーン様構造に、剛性及び頑強性を向上し固定を容易にするための、追加のフランジ及び/又は補強リブ及び/又は設置孔が追加される、請求項1〜3のいずれか1項に記載の装置。
- 前記組み合わせられた構造の全体がレーダシステムに用いられる、請求項1〜4のいずれか1項に記載の装置。
- 前記アンテナを備えた少なくとも2つの前記受信機は、反射の到来方向(angle of arrival)が測定可能であるように用いられる、請求項1〜5のいずれか1項に記載の装置。
- 前記ホーン様構造の外側に金属被覆層が設けられる、請求項1〜6のいずれか1項に記載の装置。
- 前記ホーン様構造は、比誘電率を有する材料で充填され、レンズ様の形状を有する、請求項1〜7のいずれか1項に記載の装置。
- 前記集積回路のマトリックスは、前記集積回路の上部に取り付けられた前記ホーン様構造のマトリックスと組み合わせてPCBに設置される、請求項1〜8のいずれか1項に記載の装置。
- シリコン、シリコンゲルマニウム、ヒ化ガリウム、又は窒化ガリウムの半導体材料が用いられている、請求項1〜9のいずれか1項に記載の装置。
- 通信又はレーダへの適用のための集積された送信機・受信機を含み、
1つ以上のアンテナが半導体材料に集積され、1つ以上のシールリングが使用され、第1シールリングには、およそすべてのドーピング層及びおよそすべての金属層が用いられ、第2シールリングには、前記集積回路の部分においておよそすべてのドーピング層及びおよそすべての金属層が用いられ、前記集積回路の他の部分に導電(半導体及び/又は金属)層が用いられ、1つ以上のアンテナが前記第1シールリングと前記第2シールリングとの間に形成され、前記アンテナは、単一の金属層(及び対応するビア層又は層)における孔を(好ましくは)含む前記第1シールリングの孔を用いて、金属接続トラックによって、前記第1シールリング内の電子回路に接続され、所望の前記アンテナ放射パターンが全体として得られ、標準的な半導体工程における所望の信頼性及び生産性もまた得られる、請求項1〜10のいずれか1項に記載の装置。 - 前記集積回路にパッドが適用される、請求項1〜11のいずれか1項に記載の装置。
- 前記アンテナはボンドパッドに接続され、全体をテストすることができるように、高周波信号が測定されるか又は注入される、請求項1〜12のいずれか1項に記載の装置。
- 追加の測定回路が追加されて、1つ以上のアンテナポートのDC電圧・電流、及び/又は高周波電圧・電流・電力、周波数及び/又は反射及び/又は適合性を測定する、請求項1〜13のいずれか1項に記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL1040185A NL1040185C2 (en) | 2013-04-26 | 2013-04-26 | Horn-like extension for integrated antenna. |
NL1040185 | 2013-04-26 | ||
PCT/NL2014/050276 WO2014175741A1 (en) | 2013-04-26 | 2014-04-28 | Horn-like extension for integrated antenna |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016523024A true JP2016523024A (ja) | 2016-08-04 |
JP6408561B2 JP6408561B2 (ja) | 2018-10-17 |
Family
ID=48951528
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016510639A Active JP6408561B2 (ja) | 2013-04-26 | 2014-04-28 | 集積アンテナ用ホーン様延長部 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9979091B2 (ja) |
EP (1) | EP2989680B1 (ja) |
JP (1) | JP6408561B2 (ja) |
NL (1) | NL1040185C2 (ja) |
WO (1) | WO2014175741A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109888456A (zh) * | 2019-02-27 | 2019-06-14 | 中国科学院微电子研究所 | 硅基喇叭封装天线***集成结构及其制备方法 |
JP2020204538A (ja) * | 2019-06-18 | 2020-12-24 | 日立オートモティブシステムズ株式会社 | レーダ装置及びレーダ装置の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3414791B1 (en) * | 2016-07-20 | 2020-12-23 | Huawei Technologies Co., Ltd. | Antenna package for a millimetre wave integrated circuit |
RU175123U1 (ru) * | 2017-03-20 | 2017-11-21 | Акционерное общество "Научно-исследовательский институт Приборостроения имени В.В. Тихомирова" | Панель волноводно-рупорных излучателей |
US10171133B1 (en) * | 2018-02-20 | 2019-01-01 | Automated Assembly Corporation | Transponder arrangement |
KR102572820B1 (ko) | 2018-11-19 | 2023-08-30 | 삼성전자 주식회사 | 혼 구조를 이용한 안테나 및 그것을 포함하는 전자 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5491079U (ja) * | 1977-12-09 | 1979-06-27 | ||
US20030151560A1 (en) * | 2001-11-26 | 2003-08-14 | Vega Grieshaber Kg | Antenna system for a level measurement apparatus |
US20030179148A1 (en) * | 2002-03-18 | 2003-09-25 | Magnus Ohlsson | Horn antenna |
JP2006287579A (ja) * | 2005-03-31 | 2006-10-19 | Denso Corp | 高周波モジュールおよび高周波モジュール群 |
JP2007235563A (ja) * | 2006-03-01 | 2007-09-13 | Mitsubishi Electric Corp | アンテナ用放射器の接続構造 |
JP2009081833A (ja) * | 2007-09-07 | 2009-04-16 | Sharp Corp | 無線通信装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3556832B2 (ja) * | 1998-05-22 | 2004-08-25 | 三菱電機株式会社 | フェーズドアレーアンテナ |
JP4523223B2 (ja) * | 2002-04-26 | 2010-08-11 | 株式会社日立製作所 | レーダセンサ |
JP2007286843A (ja) * | 2006-04-14 | 2007-11-01 | Ricoh Co Ltd | 半導体装置 |
US20090066598A1 (en) * | 2007-09-07 | 2009-03-12 | Tyco Electronics Corporation And M/A-Com, Inc. | Modular waveguide feed horn |
US7852270B2 (en) * | 2007-09-07 | 2010-12-14 | Sharp Kabushiki Kaisha | Wireless communication device |
WO2014049088A1 (en) | 2012-09-26 | 2014-04-03 | Omniradar Bv | Radiofrequency module |
-
2013
- 2013-04-26 NL NL1040185A patent/NL1040185C2/en not_active IP Right Cessation
-
2014
- 2014-04-28 US US14/785,822 patent/US9979091B2/en active Active
- 2014-04-28 EP EP14725549.1A patent/EP2989680B1/en active Active
- 2014-04-28 JP JP2016510639A patent/JP6408561B2/ja active Active
- 2014-04-28 WO PCT/NL2014/050276 patent/WO2014175741A1/en active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5491079U (ja) * | 1977-12-09 | 1979-06-27 | ||
US20030151560A1 (en) * | 2001-11-26 | 2003-08-14 | Vega Grieshaber Kg | Antenna system for a level measurement apparatus |
US20030179148A1 (en) * | 2002-03-18 | 2003-09-25 | Magnus Ohlsson | Horn antenna |
JP2006287579A (ja) * | 2005-03-31 | 2006-10-19 | Denso Corp | 高周波モジュールおよび高周波モジュール群 |
JP2007235563A (ja) * | 2006-03-01 | 2007-09-13 | Mitsubishi Electric Corp | アンテナ用放射器の接続構造 |
JP2009081833A (ja) * | 2007-09-07 | 2009-04-16 | Sharp Corp | 無線通信装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109888456A (zh) * | 2019-02-27 | 2019-06-14 | 中国科学院微电子研究所 | 硅基喇叭封装天线***集成结构及其制备方法 |
CN109888456B (zh) * | 2019-02-27 | 2020-09-25 | 中国科学院微电子研究所 | 硅基喇叭封装天线***集成结构及其制备方法 |
JP2020204538A (ja) * | 2019-06-18 | 2020-12-24 | 日立オートモティブシステムズ株式会社 | レーダ装置及びレーダ装置の製造方法 |
JP7261666B2 (ja) | 2019-06-18 | 2023-04-20 | 日立Astemo株式会社 | レーダ装置及びレーダ装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
NL1040185C2 (en) | 2014-10-29 |
EP2989680B1 (en) | 2016-11-16 |
WO2014175741A1 (en) | 2014-10-30 |
EP2989680A1 (en) | 2016-03-02 |
US9979091B2 (en) | 2018-05-22 |
US20160079675A1 (en) | 2016-03-17 |
JP6408561B2 (ja) | 2018-10-17 |
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