JP2016219791A - 基材にコーティングを施すための装置及び方法 - Google Patents
基材にコーティングを施すための装置及び方法 Download PDFInfo
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- JP2016219791A JP2016219791A JP2016077944A JP2016077944A JP2016219791A JP 2016219791 A JP2016219791 A JP 2016219791A JP 2016077944 A JP2016077944 A JP 2016077944A JP 2016077944 A JP2016077944 A JP 2016077944A JP 2016219791 A JP2016219791 A JP 2016219791A
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- 238000000576 coating method Methods 0.000 title claims abstract description 97
- 239000011248 coating agent Substances 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000000463 material Substances 0.000 title abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 64
- 239000007788 liquid Substances 0.000 claims abstract description 57
- 239000007921 spray Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims description 34
- 230000005499 meniscus Effects 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000005303 weighing Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/34—Applying different liquids or other fluent materials simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/033—Manufacturing methods by local deposition of the material of the bonding area
- H01L2224/0331—Manufacturing methods by local deposition of the material of the bonding area in liquid form
- H01L2224/03312—Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/03—Manufacturing methods
- H01L2224/033—Manufacturing methods by local deposition of the material of the bonding area
- H01L2224/0331—Manufacturing methods by local deposition of the material of the bonding area in liquid form
- H01L2224/03318—Manufacturing methods by local deposition of the material of the bonding area in liquid form by dispensing droplets
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
【解決手段】コーティング液2を噴霧して基材3に塗布するのに用いる計量装置5と、所定量の溶媒を計量装置5の前端に与えることができるように、計量装置5の前端側に偏心して配置された溶媒ディスペンサ10と、を備える。コーティング液2は、計量システム4を介して供給され、計量装置5によって、基材3に噴霧状に塗布される。塗布の間、計量装置及び基材の互いの距離は適切に調整される。
【選択図】図1
Description
Claims (11)
- 基材(3)にコーティングを施すための装置であって、
コーティング液(2)を噴霧して基材(3)に塗布するのに用いる計量装置(5)と、
計量装置(5)の前端側に偏心して配置された溶媒ディスペンサ(10)と、
を備え、
所定量の溶媒(14)を計量装置(5)の前端に与えることができることを特徴とする装置。
- 溶媒ディスペンサが、計量装置(5)の前端に向けられたスプレーノズル(10)であることを特徴とする請求項1に記載の装置。
- 溶媒ディスペンサが、溶媒の液滴を計量装置に供給できる投与アーム(10)とそして形成されることを特徴とする請求項1に記載の装置。
- 計量装置(5)及び溶媒ディスペンサ(10)の互いの距離が調整可能であることを特徴とする請求項3に記載の装置。
- コーティング液(2)がフォトレジストであることを特徴とする請求項1から4の何れか1項に記載の装置。
- 請求項1から5の何れか1項に記載の装置を用いて基材にコーティングを施す方法であって、
− コーティング液(2)が塗布される前に、溶媒(14)が計量装置(5)の前端に位置するコーティング液(2)に接するように、所定量の溶媒(14)を計量装置(5)の前端に導き、
− 引き続いて、待機期間の後、計量装置(5)を用いて、コーティング液(2)が基材(3)に塗布される、
方法。
- コーティング液(2)が、計量装置(5)の前端に凹形のメニスカスを形成し、溶媒(14)がメニスカス(7)に入ることを特徴とする請求項6に記載の方法。
- 溶媒(14)が計量装置(5)の前端にスプレーされることを特徴とする請求項6または7に記載の方法。
- 溶媒(14)が、計量装置(5)の前端で規定された平面に実質的に平行な方向にスプレーされることを特徴とする請求項8に記載の方法。
- 溶媒(14)が計量装置(5)の前端に接するように、計量装置(5)及び溶媒ディスペンサ(10)の互いの距離が調整されることを特徴とする請求項6または7に記載の方法。
- 待機期間が約10から120秒であり、好ましくは20から60秒であることを特徴とする請求項6から10の何れか1項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2014597A NL2014597B1 (en) | 2015-04-08 | 2015-04-08 | Method and device for applying a coating to a substrate. |
NL2014597 | 2015-04-08 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016219791A true JP2016219791A (ja) | 2016-12-22 |
JP2016219791A5 JP2016219791A5 (ja) | 2020-05-21 |
JP6715658B2 JP6715658B2 (ja) | 2020-07-01 |
Family
ID=53836151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016077944A Expired - Fee Related JP6715658B2 (ja) | 2015-04-08 | 2016-04-08 | 基材にコーティングを施すための装置及び方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20160296968A1 (ja) |
JP (1) | JP6715658B2 (ja) |
KR (1) | KR20160120679A (ja) |
CN (1) | CN106054535B (ja) |
AT (1) | AT517014B1 (ja) |
DE (1) | DE102016106399A1 (ja) |
NL (1) | NL2014597B1 (ja) |
TW (1) | TWI754612B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116618241B (zh) * | 2023-07-24 | 2023-09-12 | 江苏泽润新能科技股份有限公司 | 一种汽车电池包灌胶装置 |
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2015
- 2015-04-08 NL NL2014597A patent/NL2014597B1/en not_active IP Right Cessation
-
2016
- 2016-04-07 DE DE102016106399.1A patent/DE102016106399A1/de not_active Withdrawn
- 2016-04-07 KR KR1020160042830A patent/KR20160120679A/ko active Search and Examination
- 2016-04-07 TW TW105110913A patent/TWI754612B/zh active
- 2016-04-08 US US15/093,828 patent/US20160296968A1/en not_active Abandoned
- 2016-04-08 JP JP2016077944A patent/JP6715658B2/ja not_active Expired - Fee Related
- 2016-04-08 CN CN201610217781.9A patent/CN106054535B/zh not_active Expired - Fee Related
- 2016-04-08 AT AT502912016A patent/AT517014B1/de not_active IP Right Cessation
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JPH021862A (ja) * | 1988-06-13 | 1990-01-08 | Tokyo Electron Ltd | 塗布方法 |
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KR20160120679A (ko) | 2016-10-18 |
AT517014A3 (de) | 2019-11-15 |
US20160296968A1 (en) | 2016-10-13 |
NL2014597A (en) | 2016-10-12 |
CN106054535A (zh) | 2016-10-26 |
TWI754612B (zh) | 2022-02-11 |
AT517014B1 (de) | 2019-11-15 |
CN106054535B (zh) | 2021-04-27 |
TW201709985A (zh) | 2017-03-16 |
AT517014A2 (de) | 2016-10-15 |
NL2014597B1 (en) | 2017-01-20 |
JP6715658B2 (ja) | 2020-07-01 |
DE102016106399A1 (de) | 2016-10-13 |
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