JP2016206449A - パターン形成方法 - Google Patents
パターン形成方法 Download PDFInfo
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- JP2016206449A JP2016206449A JP2015088519A JP2015088519A JP2016206449A JP 2016206449 A JP2016206449 A JP 2016206449A JP 2015088519 A JP2015088519 A JP 2015088519A JP 2015088519 A JP2015088519 A JP 2015088519A JP 2016206449 A JP2016206449 A JP 2016206449A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Drying Of Semiconductors (AREA)
- Inorganic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
図1−1〜図1−3は、第1の実施形態によるパターン形成方法の手順の一例を模式的に示す断面図である。パターン形成方法として、半導体装置のコンタクトと、このコンタクトに接続される配線と、をデュアルダマシン法で形成する方法について説明する。
第1の実施形態では、マスク膜上に第1レジストパターンと第2レジストパターンとを積層させてパターン形成を行っている。そして、第1レジストパターンに、Siまたは金属をポリマー主鎖中に含まない第1感放射線性組成物を使用し、第2レジストパターンに、Siまたは金属をポリマー主鎖中に含む第2感放射線性組成物を使用した。第2の実施形態では、第1レジストパターンに、Siまたは金属をポリマー主鎖中に含む第2感放射線性組成物を使用し、第2レジストパターンに、Siまたは金属をポリマー主鎖中に含まない第1感放射線性組成物を使用する場合について説明する。
Claims (5)
- 被加工膜上に第1感放射線性組成物に由来する第1レジスト膜を形成し、
前記第1レジスト膜を露光および現像して、第1レジストパターンを形成し、
前記第1レジストパターンに第2感放射線性組成物の溶剤に対して不溶化する不溶化処理を実施し、
前記第1レジストパターン上に、前記第2感放射線性組成物に由来する第2レジスト膜を形成し、
前記第2レジスト膜を露光および現像して、第2レジストパターンを形成し、
ここで、前記第1感放射線性組成物および前記第2感放射線性組成物の少なくともいずれか一方が、酸素に対する耐性を有する高分子化合物であるパターン形成方法。 - 前記酸素に対する耐性を有する高分子化合物は、ポリマー主鎖中にSiまたは金属を含む請求項1に記載のパターン形成方法。
- 前記金属は、Ti,W,Al,Ta,Hf,ZrおよびMoの群から選択される少なくとも1つの元素である請求項2に記載のパターン形成方法。
- 前記第1レジスト膜の現像と前記第2レジスト膜の現像とは、有機溶媒を用いて行う請求項1に記載のパターン形成方法。
- 前記不溶化処理は、前記第1レジストパターンを加熱する処理あるいは前記第1レジストパターンにエネルギ線を照射する処理である請求項1に記載のパターン形成方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015088519A JP2016206449A (ja) | 2015-04-23 | 2015-04-23 | パターン形成方法 |
TW104126617A TWI581329B (zh) | 2015-04-23 | 2015-08-14 | 圖案形成方法 |
KR1020150120954A KR101699620B1 (ko) | 2015-04-23 | 2015-08-27 | 패턴 형성 방법 |
US14/838,773 US20160313644A1 (en) | 2015-04-23 | 2015-08-28 | Pattern formation method |
CN201510549468.0A CN106066574B (zh) | 2015-04-23 | 2015-08-31 | 图案形成方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015088519A JP2016206449A (ja) | 2015-04-23 | 2015-04-23 | パターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016206449A true JP2016206449A (ja) | 2016-12-08 |
Family
ID=57147654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015088519A Pending JP2016206449A (ja) | 2015-04-23 | 2015-04-23 | パターン形成方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20160313644A1 (ja) |
JP (1) | JP2016206449A (ja) |
KR (1) | KR101699620B1 (ja) |
CN (1) | CN106066574B (ja) |
TW (1) | TWI581329B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI682533B (zh) * | 2019-06-21 | 2020-01-11 | 華邦電子股份有限公司 | 記憶體裝置及其製造方法 |
KR102328590B1 (ko) * | 2019-09-16 | 2021-11-17 | 아주대학교산학협력단 | 플라즈마 식각 방법 |
US11164845B2 (en) * | 2020-01-30 | 2021-11-02 | International Business Machines Corporation | Resist structure for forming bumps |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135462A (ja) * | 2007-11-30 | 2009-06-18 | Taiwan Semiconductor Manufacturing Co Ltd | リソグラフィによるダブルパターンニング方法 |
JP2009217250A (ja) * | 2008-02-14 | 2009-09-24 | Shin Etsu Chem Co Ltd | ダブルパターン形成方法 |
JP2010188668A (ja) * | 2009-02-19 | 2010-09-02 | Jsr Corp | スタンパの製造方法及びスタンパ |
WO2016163174A1 (ja) * | 2015-04-07 | 2016-10-13 | 富士フイルム株式会社 | パターン形成方法、エッチング方法、及び、電子デバイスの製造方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6303270B1 (en) * | 1999-03-01 | 2001-10-16 | The Curators Of The University Of Missouri | Highly plasma etch-resistant photoresist composition containing a photosensitive polymeric titania precursor |
JP2003303808A (ja) * | 2002-04-08 | 2003-10-24 | Nec Electronics Corp | 半導体装置の製造方法 |
CN1316564C (zh) * | 2002-04-11 | 2007-05-16 | 联华电子股份有限公司 | 复合光致抗蚀剂层结构 |
CN1215378C (zh) * | 2002-06-21 | 2005-08-17 | 旺宏电子股份有限公司 | 避免定位误差的双镶嵌结构制作方法 |
KR20080004792A (ko) * | 2006-07-06 | 2008-01-10 | 주식회사 하이닉스반도체 | 2층 포토레지스트용 중합체, 상기 중합체를 함유한포토레지스트 조성물 및 이를 이용한 포토레지스트 패턴의형성 방법 |
JP4877388B2 (ja) * | 2007-03-28 | 2012-02-15 | Jsr株式会社 | ポジ型感放射線性組成物およびそれを用いたレジストパターン形成方法 |
TW201005440A (en) * | 2008-07-15 | 2010-02-01 | Jsr Corp | Positive radiation-sensitive composition and process for producing resist pattern using the same |
JP5444668B2 (ja) | 2008-09-10 | 2014-03-19 | Jsr株式会社 | レジストパターン形成方法 |
JP5516195B2 (ja) * | 2009-08-04 | 2014-06-11 | 信越化学工業株式会社 | パターン形成方法及びレジスト材料 |
US8647817B2 (en) * | 2012-01-03 | 2014-02-11 | Tokyo Electron Limited | Vapor treatment process for pattern smoothing and inline critical dimension slimming |
US8791024B1 (en) * | 2013-05-14 | 2014-07-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method to define multiple layer patterns using a single exposure |
-
2015
- 2015-04-23 JP JP2015088519A patent/JP2016206449A/ja active Pending
- 2015-08-14 TW TW104126617A patent/TWI581329B/zh not_active IP Right Cessation
- 2015-08-27 KR KR1020150120954A patent/KR101699620B1/ko active IP Right Grant
- 2015-08-28 US US14/838,773 patent/US20160313644A1/en not_active Abandoned
- 2015-08-31 CN CN201510549468.0A patent/CN106066574B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009135462A (ja) * | 2007-11-30 | 2009-06-18 | Taiwan Semiconductor Manufacturing Co Ltd | リソグラフィによるダブルパターンニング方法 |
JP2009217250A (ja) * | 2008-02-14 | 2009-09-24 | Shin Etsu Chem Co Ltd | ダブルパターン形成方法 |
JP2010188668A (ja) * | 2009-02-19 | 2010-09-02 | Jsr Corp | スタンパの製造方法及びスタンパ |
WO2016163174A1 (ja) * | 2015-04-07 | 2016-10-13 | 富士フイルム株式会社 | パターン形成方法、エッチング方法、及び、電子デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106066574B (zh) | 2019-11-05 |
TW201639026A (zh) | 2016-11-01 |
KR101699620B1 (ko) | 2017-01-24 |
CN106066574A (zh) | 2016-11-02 |
TWI581329B (zh) | 2017-05-01 |
KR20160126835A (ko) | 2016-11-02 |
US20160313644A1 (en) | 2016-10-27 |
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