JP2016115762A - Wiring printed matter and method of manufacturing the same - Google Patents

Wiring printed matter and method of manufacturing the same Download PDF

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JP2016115762A
JP2016115762A JP2014251947A JP2014251947A JP2016115762A JP 2016115762 A JP2016115762 A JP 2016115762A JP 2014251947 A JP2014251947 A JP 2014251947A JP 2014251947 A JP2014251947 A JP 2014251947A JP 2016115762 A JP2016115762 A JP 2016115762A
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Prior art keywords
wiring
base material
ink layer
bending
printed
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JP6794091B2 (en
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隆憲 大原
Takanori Ohara
隆憲 大原
恭市 山本
Kyoichi Yamamoto
恭市 山本
健太郎 窪田
Kentaro Kubota
健太郎 窪田
林　健司
Kenji Hayashi
健司 林
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Toppan Inc
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Toppan Printing Co Ltd
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Priority to JP2014251947A priority Critical patent/JP6794091B2/en
Priority to CN201580065344.3A priority patent/CN107006120B/en
Priority to EP15866751.9A priority patent/EP3232744B1/en
Priority to PCT/JP2015/003999 priority patent/WO2016092716A1/en
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Priority to US15/614,335 priority patent/US10212810B2/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/22—Secondary treatment of printed circuits
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire

Abstract

PROBLEM TO BE SOLVED: To suppress the risk of damaging the wiring, when the wiring is miniaturized.SOLUTION: Wiring 3 is formed by forming an ink layer of conductive ink on a sheet-like base material 2, and bending the base material 2 before the ink layer is hardened, thereafter hardening the ink layer. Since the ink layer has flexibility when bending the base material 2, damage on the ink layer incident to bending deformation of the base material 2 is suppressed, and the risk of damage on the wiring 3 can be suppressed when miniaturizing the wiring 3.SELECTED DRAWING: Figure 1

Description

本発明は、基材上でインキ層を硬化させることにより配線を形成してなる配線印刷物、及びその製造方法に関するものである。   The present invention relates to a printed matter obtained by forming a wiring by curing an ink layer on a substrate, and a method for producing the printed matter.

曲げ変形によって立体的にされた基材の上に配線が形成されている配線印刷物を製造する場合、立体的にされた基材上への配線の形成は煩雑である。このため、基材とは別に、未硬化又は半硬化状態のフレキシブル基板を用意し、このフレキシブル基板の上に銅箔を接着して配線を形成し、曲げ加工されている基材に、フレキシブル基板を熱圧着する方法が提案されている（特許文献１）。   When manufacturing a printed wiring product in which wiring is formed on a base material that is three-dimensional by bending deformation, formation of the wiring on the three-dimensional base material is complicated. Therefore, separately from the base material, an uncured or semi-cured flexible substrate is prepared, a copper foil is bonded onto the flexible substrate to form a wiring, and the flexible substrate is applied to the bent base material. A method of thermocompression bonding is proposed (Patent Document 1).

特開平２−２７２７９３号公報JP-A-2-272793

しかし、配線を微細化する場合には、配線の機械的強度が脆弱になるため、この特許文献１の方法によっても、フレキシブル基板の曲げに伴って生じる曲げ応力に起因して、配線にクラックや基材からの剥がれなどの損傷が生じるおそれが大きい。   However, when the wiring is miniaturized, the mechanical strength of the wiring becomes fragile. Therefore, even with the method of Patent Document 1, cracks or cracks are caused in the wiring due to the bending stress caused by the bending of the flexible substrate. There is a high risk of damage such as peeling from the substrate.

そこで本発明の目的は、配線を微細化した場合における配線の損傷のおそれを抑制しうる配線印刷物及びその製造方法を提供することにある。   Accordingly, an object of the present invention is to provide a printed wiring product that can suppress the risk of damage to the wiring when the wiring is miniaturized, and a method for manufacturing the same.

本発明の一態様は、
シート状の基材と、当該基材上に形成された配線と、を含む配線印刷物であって、
前記基材上に導電性インキによりインキ層を形成したのち、当該インキ層の硬化前に前記基材を曲げ変形し、その後に前記インキ層を硬化させることにより、前記配線が形成されていることを特徴とする配線印刷物である。 One embodiment of the present invention provides:
A printed wiring material including a sheet-like base material and wiring formed on the base material,
The wiring is formed by forming an ink layer with conductive ink on the base material, bending the base material before curing the ink layer, and then curing the ink layer. A printed wiring product characterized by the above.

この態様によれば、シート状の基材上に導電性インキによりインキ層を形成したのち、インキ層の硬化前に基材を曲げ変形し、その後にインキ層を硬化させることにより、配線を形成するので、基材の曲げ変形の際にはインキ層が柔軟性を有し、これによって、基材の曲げ変形に伴うインキ層の破損を抑制し、配線を微細化した場合における配線の損傷のおそれを抑制することができる。   According to this aspect, after forming an ink layer with a conductive ink on a sheet-like substrate, the substrate is bent before the ink layer is cured, and then the ink layer is cured to form a wiring. Therefore, the ink layer has flexibility in bending deformation of the base material, thereby suppressing the damage of the ink layer accompanying the bending deformation of the base material, and reducing the wiring damage when the wiring is miniaturized. The fear can be suppressed.

本発明の別の一態様は、
前記インキ層を形成する前に、前記基材を塑性変形させると共に、前記基材を弾性的に平坦化した状態で前記インキ層を形成したことを特徴とする。 Another aspect of the present invention is:
Before forming the ink layer, the base material is plastically deformed, and the ink layer is formed with the base material elastically flattened.

この態様によれば、基材を平坦化した状態から解放することに伴って基材２が弾性的に復帰することにより、印刷後の曲げ変形の少なくとも一部が行われることになる。したがって、印刷後の曲げ変形を支援することができ、曲げ変形を行う際において基材の印刷面への接触の必要性を抑制することも可能になる。   According to this aspect, at least a part of the bending deformation after printing is performed by elastically returning the base material 2 as the base material is released from the flattened state. Therefore, it is possible to support bending deformation after printing, and it is also possible to suppress the necessity of contact with the printing surface of the substrate when performing bending deformation.

本発明の別の一態様は、
前記基材が、曲げ変形を促進するための曲げ促進加工部を有し、前記曲げ変形が前記曲げ促進加工部において行われ、
前記インキ層が前記曲げ促進加工部に交差して延在していることを特徴とする。 Another aspect of the present invention is:
The base material has a bending promotion processing part for promoting bending deformation, and the bending deformation is performed in the bending promotion processing part,
The ink layer extends so as to intersect the bending promoting portion.

この態様によれば、曲げ促進加工部を利用して曲げ変形を容易に且つ正確な位置で行うことができ、また曲がった形状を容易に維持することができる。また、曲げ変形が曲げ促進加工部において行われ、インキ層が曲げ促進加工部に交差して延在している構成でありながら、基材の曲げ変形がインキ層の硬化前に行われるため、配線の損傷のおそれを好適に抑制することができる。   According to this aspect, it is possible to easily perform bending deformation at an accurate position using the bending acceleration processed portion, and it is possible to easily maintain a bent shape. In addition, since the bending deformation is performed in the bending acceleration processing portion and the ink layer is configured to extend across the bending acceleration processing portion, the base material bending deformation is performed before the ink layer is cured, The possibility of damage to the wiring can be suitably suppressed.

前記曲げ促進加工部が、切り込み部と接続部とが交互に配されたミシン目であり、前記インキ層のうち少なくとも１つが、前記接続部において前記ミシン目に交差していることとするのが好適である。この態様によれば、ミシン目を利用する場合であっても配線の損傷のおそれを好適に抑制することができる。   The bending promoting processed portion is a perforation in which cut portions and connection portions are alternately arranged, and at least one of the ink layers intersects the perforation in the connection portion. Is preferred. According to this aspect, even when the perforation is used, the possibility of damage to the wiring can be suitably suppressed.

本発明の別の一態様は、
シート状の基材と、当該基材上に形成された第１及び第２の配線と、を含む配線印刷物であって、
前記第１及び第２の配線が、導電性インキによりインキ層を形成したのち当該インキ層を硬化させることにより形成されており、
前記基材が第１及び第２の表面を有し、前記第１の表面には前記第１の配線が形成され、前記第２の表面には前記第２の配線が形成され、
前記第１の配線の第１の接続点と前記第２の配線の第１の接続点、及び前記第１の配線の第２の接続点前記第２の配線の第２の接続点が、それぞれ前記基材を挟んで互いに対応した位置にあることを特徴とする配線印刷物である。 Another aspect of the present invention is:
A printed wiring material including a sheet-like base material and first and second wirings formed on the base material,
The first and second wirings are formed by forming an ink layer with conductive ink and then curing the ink layer,
The substrate has first and second surfaces, the first wiring is formed on the first surface, and the second wiring is formed on the second surface;
A first connection point of the first wiring, a first connection point of the second wiring, and a second connection point of the first wiring; and a second connection point of the second wiring, respectively. The printed wiring product is located at a position corresponding to each other with the substrate interposed therebetween.

この態様によれば、第１の配線の第１の接続点と第２の配線の第１の接続点、及び第１の配線の第２の接続点と第２の配線の第２の接続点が、それぞれ基材を挟んで互いに対応した位置にあるので、これら第１の接続点同士の間、及び第２の接続点同士の間をそれぞれ導通させることにより、第１の配線と第２の配線との協働によって電気抵抗を抑制し、導通を強化し、配線の不良又は破損に対する冗長性を促進することができる。   According to this aspect, the first connection point of the first wiring and the first connection point of the second wiring, and the second connection point of the first wiring and the second connection point of the second wiring. Are located at positions corresponding to each other with the base material interposed therebetween, and by conducting between the first connection points and between the second connection points, the first wiring and the second wiring By cooperating with the wiring, electrical resistance can be suppressed, conduction can be enhanced, and redundancy against wiring failure or damage can be promoted.

この態様では更に、前記基材が少なくとも一つの開口部を有し、前記開口部を通じて前記第１の配線と前記第２の配線とを相互接続する接続片を更に備えても良い。この場合には、簡易な手段で本発明に所期の効果を得ることができる。   In this aspect, the base material may further include a connection piece having at least one opening and interconnecting the first wiring and the second wiring through the opening. In this case, the desired effect of the present invention can be obtained by simple means.

本発明では、前記インキ層が基材の上に形成された後に、前記基材が除去されても良い。   In the present invention, the base material may be removed after the ink layer is formed on the base material.

また本発明では、前記基材が紙であることとするのが好適である。紙は、ＰＥＴ（ポリエチレンテレフタレート）やＰＥＮ（ポリエチレンナフタレート）などの樹脂材料に比べて、耐熱性能が高く、曲げ変形によっても割れが生じにくく、また廃棄後の分解も比較的容易である点で有利である。但し本発明における基材は紙に限られず、ＰＥＴやＰＥＮなどの樹脂材料を用いても良く、また不織布や布などの他のシート状材料を用いても良い。また、一般に配線で広く用いられているフォトリソグラフィ法では、レジストの現像やエッチングなど基材を液体にさらす工程が含まれるため、紙などの液体に弱い材料を使うことが困難であるが、本発明では配線を印刷によって形成することとしたので、基材を液体にさらす工程を省略でき、したがって液体に弱い材料であっても基材として用いることができる。   In the present invention, it is preferable that the substrate is paper. Compared to resin materials such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), paper has high heat resistance, is less susceptible to cracking due to bending deformation, and is relatively easy to disassemble after disposal. It is advantageous. However, the base material in the present invention is not limited to paper, and a resin material such as PET or PEN may be used, or another sheet material such as a nonwoven fabric or cloth may be used. In general, the photolithography method widely used for wiring includes a step of exposing the substrate to a liquid such as resist development and etching, and thus it is difficult to use a material that is weak against a liquid such as paper. In the invention, since the wiring is formed by printing, the step of exposing the substrate to the liquid can be omitted, and thus even a material weak to the liquid can be used as the substrate.

本発明の別の態様は、
シート状の基材上に導電性インキによりインキ層を形成する工程と、
前記インキ層の形成後であって前記インキ層の硬化前に、前記基材を曲げ変形し、これによって前記インキ層の少なくとも一部を曲げ変形する工程と、
前記曲げ変形後にインキ層を硬化させる工程と、
を含むことを特徴とする配線印刷物の製造方法である。 Another aspect of the present invention provides:
Forming an ink layer with conductive ink on a sheet-like substrate; and
Bending the substrate after forming the ink layer and before curing the ink layer, thereby bending and deforming at least a portion of the ink layer; and
Curing the ink layer after the bending deformation;
It is a manufacturing method of the printed wiring material characterized by including.

当該態様の製造方法では更に、
前記インキ層を形成する工程の前に、前記基材を塑性変形させる工程を更に含み、
前記インキ層を形成する工程は、前記基材を弾性的に平坦化した状態で実行するのが好適である。 In the manufacturing method of the aspect,
Before the step of forming the ink layer, further comprising the step of plastically deforming the substrate,
The step of forming the ink layer is preferably performed in a state where the base material is elastically flattened.

本発明の第１実施形態の配線印刷物を示す斜視図である。It is a perspective view which shows the wiring printed matter of 1st Embodiment of this invention. 第１実施形態における基材を示す斜視図である。It is a perspective view which shows the base material in 1st Embodiment. 第１実施形態における基材を予備曲げ変形した状態を示す斜視図である。It is a perspective view which shows the state which carried out the pre-bending deformation | transformation of the base material in 1st Embodiment. 第１実施形態におけるインキ層を形成した状態を示す斜視図である。It is a perspective view which shows the state in which the ink layer in 1st Embodiment was formed. 第１実施形態の製造方法を示すフローチャートである。It is a flowchart which shows the manufacturing method of 1st Embodiment. 第１実施形態における曲げ促進加工部をミシン目とした変形例を示す要部拡大図である。It is a principal part enlarged view which shows the modification which made the bending promotion processing part in 1st Embodiment perforated. 第１実施形態における曲げ変形を比較的大きい曲率半径をもって行う変形例を示す斜視図である。It is a perspective view which shows the modification which performs the bending deformation in 1st Embodiment with a comparatively big curvature radius. 第２実施形態の配線印刷物を示す斜視図である。It is a perspective view which shows the wiring printed matter of 2nd Embodiment. 第２実施形態の配線印刷物の要部を示す断面図である。It is sectional drawing which shows the principal part of the printed wiring material of 2nd Embodiment. 第３実施形態の配線印刷物を示す平面図である。It is a top view which shows the wiring printed matter of 3rd Embodiment. 第３実施形態の配線印刷物を含んで構成される紙巻コイルを示す平面図である。It is a top view which shows the paper winding coil comprised including the printed wiring material of 3rd Embodiment. 第４実施形態の配線印刷物を示す平面図である。It is a top view which shows the wiring printed matter of 4th Embodiment. 第４実施形態の配線印刷物を変形して構成される紙巻コイルを示す平面図である。It is a top view which shows the paper winding coil comprised by deform | transforming the printed wiring material of 4th Embodiment. 第５実施形態における基材にインキ層を形成した状態を示す平面図である。It is a top view which shows the state which formed the ink layer in the base material in 5th Embodiment. 第５実施形態の配線印刷物を示す斜視図である。It is a perspective view which shows the wiring printed matter of 5th Embodiment.

以下、図面を参照しながら、本発明の実施形態について説明する。図１〜図４において、本発明の第１実施形態に係る配線印刷物１は、凹版オフセット印刷を利用して、紙からなる基材２上にインキ層を印刷することによって配線３を形成したものである。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 to 4, the printed wiring material 1 according to the first embodiment of the present invention is obtained by forming the wiring 3 by printing an ink layer on a base material 2 made of paper using intaglio offset printing. It is.

図１は完成した配線印刷物１を示す。図１において、基材２は厚さ６０μｍの紙からなり、折り曲げ線４を有する。折り曲げ線４は、図２に示されるように、２本の山折り線４ａと２本の谷折り線４ｂとを含む。折り曲げ線４は本発明における曲げ促進加工部とされている。曲げ促進加工部は、基材２の曲げ変形を促進するために基材２を部分的に加工したものである。   FIG. 1 shows a completed printed wiring 1. In FIG. 1, the substrate 2 is made of paper having a thickness of 60 μm and has a fold line 4. As shown in FIG. 2, the fold line 4 includes two mountain fold lines 4a and two valley fold lines 4b. The fold line 4 is a bending promoting portion in the present invention. The bending promotion processing part is a part of the base material 2 processed in order to promote the bending deformation of the base material 2.

曲げ促進の手段は、例えば、基材２の厚さ方向に貫通又は部分的に貫入した切り込み部と、当該切込み部が形成されていない接続部とが、長手方向に交互に配されたミシン目とすることができる。ミシン目の場合には、切り込み部に起因する基材２の断面積の減少によって、曲げ変形を促進することができる。別の構成として、曲げ促進加工部としての折り曲げ線４は、基材２を表裏方向に圧縮して厚さを部分的に縮小したプレス部としてもよい。プレス部の場合には、基材２の厚さの減少に伴う断面二次モーメントの減少によって、曲げ変形を促進することができる。曲げ促進加工の別の手段として、基材２を厚さ方向に削り落としても良く、また厚さ方向に貫通しない浅い切り込みを入れても良い。これらの削り落としや切り込みは、基材２のうち配線３を形成しない面に施すか、配線を形成する面に施す場合にはミシン目と同様に接続部を間欠的に残して施しても良い。１箇所の折り曲げ線４を、複数のあるいは複数種類の曲げ促進加工を並列的あるいは直列的に組み合わせて構成してもよい。   The means for promoting bending is, for example, a perforation in which cut portions penetrating or partially penetrating in the thickness direction of the base material 2 and connection portions where the cut portions are not formed are alternately arranged in the longitudinal direction. It can be. In the case of a perforation, bending deformation can be promoted by reducing the cross-sectional area of the base material 2 due to the cut portion. As another configuration, the fold line 4 as the bending promoting portion may be a press portion in which the base material 2 is compressed in the front and back directions and the thickness is partially reduced. In the case of the press portion, bending deformation can be promoted by a decrease in the second moment of section accompanying a decrease in the thickness of the substrate 2. As another means of bending promotion processing, the base material 2 may be scraped off in the thickness direction, or a shallow cut that does not penetrate in the thickness direction may be made. These shavings and cuts may be made on the surface of the substrate 2 where the wiring 3 is not formed, or when the surface is formed on the surface where the wiring is formed, the connection portion may be intermittently left as in the case of the perforation. . One bending line 4 may be configured by combining a plurality of or a plurality of types of bending promoting processes in parallel or in series.

インキ層は、導電性インキを印刷してなる。インキ層の線幅及び線間は、例えば２０μｍ／２０μｍ以下、好ましくは１０μｍ／１０μｍ以下とすることができる。導電性インキは、例えば銀ペースト又は銅ペーストを用いるのが好適である。導電性インキとしては、印刷から硬化までの間に、後述する基材２の曲げ変形のための十分な時間を確保できる材料を用いるのが好適である。硬化は焼成のほか、加熱、自然乾燥、紫外線硬化、冷却（熱可塑性材料を含む導電性インキを用いる場合）など各種の手段を選択することができる。導電性インキの印刷は、例えば凹版オフセット印刷によって実行できるが、他の印刷方法であっても良い。   The ink layer is formed by printing conductive ink. The line width and the line spacing of the ink layer can be, for example, 20 μm / 20 μm or less, preferably 10 μm / 10 μm or less. As the conductive ink, for example, a silver paste or a copper paste is preferably used. As the conductive ink, it is preferable to use a material that can secure a sufficient time for bending deformation of the substrate 2 described later between printing and curing. For curing, various means such as heating, natural drying, ultraviolet curing, cooling (when using conductive ink containing a thermoplastic material) can be selected in addition to baking. The conductive ink can be printed by, for example, intaglio offset printing, but other printing methods may be used.

第１実施形態の配線印刷物１を製造する手順について以下に説明する。図５において、まず、基材２を予備曲げ変形する（Ｓ１０）。この予備曲げ変形は、基材２を折り曲げ線４において塑性変形する処理であって、機械又は手作業による折り込み、あるいは型を使ったプレスによって行うことができる。予備曲げ変形は加熱処理を伴っても良い。この予備曲げ変形によって、初期状態で図２のように平坦であった基材２が、図３に示されるように、完成品と同一の形状（あるいは、平坦な形状よりも完成品に近似した形状）とされる。   A procedure for manufacturing the printed wiring material 1 according to the first embodiment will be described below. In FIG. 5, first, the base material 2 is subjected to a preliminary bending deformation (S10). This pre-bending deformation is a process of plastically deforming the base material 2 at the fold line 4 and can be performed by folding by machine or manual work, or by pressing using a mold. The pre-bending deformation may be accompanied by heat treatment. Due to this pre-bending deformation, the base material 2 which was flat as shown in FIG. 2 in the initial state is the same shape as the finished product (or approximated to the finished product rather than the flat shape as shown in FIG. 3). Shape).

次に、基材２を平坦化した状態で、基材２上にインキ層を形成する（Ｓ２０）。基材２は適切な型枠などの保持部材（図示省略）を用いることによって、平坦に延ばした状態に保持することができる。インキ層の形成は、凹版オフセット印刷などの印刷によって行うことができる。凹版オフセット印刷による場合に、印刷に用いられるグラビア版は、配線に対応する溝を銅板、ニッケル版などの金属版、あるいはガラス版に形成し、その表面にクロムメッキやカーボンメッキによる耐擦性皮膜を形成してなる。このグラビア版に対して、ドクターブレードによって一定の速度で導電性インキを充填する。次に、グラビア版上の導電性インキをブランケット上に転写する。ブランケットは、例えば略円筒形のブランケット胴の表面にシリコーンブランケットを固定してなる。次に、ブランケット上の導電性インキを基材２に押し付け、転写する。この転写により、図４に示されるように、平坦化された状態の基材２上にインキ層（符号３で示される）が形成される。保持部材としては型枠のほか、基材２の端部を挟持して緊張状態に保持する挟持手段や、基材２を裏面から負圧などで吸着する吸着手段を用いることができる。   Next, an ink layer is formed on the base material 2 in a state where the base material 2 is flattened (S20). The base material 2 can be held in a flatly extended state by using a holding member (not shown) such as an appropriate formwork. The ink layer can be formed by printing such as intaglio offset printing. In the case of intaglio offset printing, the gravure plate used for printing forms a groove corresponding to the wiring on a metal plate such as a copper plate or nickel plate, or a glass plate, and the surface is a rub-resistant coating by chromium plating or carbon plating. Formed. The gravure plate is filled with conductive ink at a constant speed by a doctor blade. Next, the conductive ink on the gravure plate is transferred onto the blanket. The blanket is formed, for example, by fixing a silicone blanket on the surface of a substantially cylindrical blanket cylinder. Next, the conductive ink on the blanket is pressed against the substrate 2 and transferred. By this transfer, an ink layer (indicated by reference numeral 3) is formed on the flattened substrate 2 as shown in FIG. As the holding member, in addition to the mold, a holding means for holding the end portion of the base material 2 to hold it in a tension state, or an adsorption means for adsorbing the base material 2 from the back surface with a negative pressure or the like can be used.

次に、インキ層の硬化前に、基材２を曲げ変形する（Ｓ３０）。この曲げ変形の少なくとも一部は、基材２を平坦化した状態に保持するための保持部材から、基材２を解放することによって実行することができ、その場合には、基材２の表面のうちインキ層が形成されている部分に触れる必要をなくして、配線の損傷を抑制することが可能になる。別法として、ステップＳ３０の曲げ変形を、ステップＳ１０の予備曲げ変形と同様の手段、あるいは完成品と同一の形状に基材２を保持する手段によって行うことも可能である。この曲げ変形の結果、基材２は図１に示した製品と同一の形状に、屈曲及び立体化される。   Next, the base material 2 is bent and deformed before the ink layer is cured (S30). At least a part of this bending deformation can be performed by releasing the base material 2 from a holding member for holding the base material 2 in a flattened state. In this case, it is not necessary to touch the portion where the ink layer is formed, and damage to the wiring can be suppressed. Alternatively, the bending deformation in step S30 can be performed by means similar to the preliminary bending deformation in step S10, or by means for holding the substrate 2 in the same shape as the finished product. As a result of this bending deformation, the substrate 2 is bent and three-dimensionalized into the same shape as the product shown in FIG.

最後に、基材２が完成品と同一の形状を維持した状態（あるいは完成品と同一の形状に保持された状態）で、インキ層を硬化させる（Ｓ４０）。この硬化は上述のとおり、焼成、加熱、自然乾燥、紫外線硬化、冷却（熱可塑性材料を含む導電性インキを用いる場合）など、使用する導電性インキの種類及び成分に応じた各種の手段によって実行することができる。加熱による場合には、赤外線ヒータまたは熱風乾燥機を用いる、あるいはこれらを併用することができる。このようにして、図１に示されるような完成品の配線印刷物１が得られる。   Finally, the ink layer is cured in a state where the base material 2 maintains the same shape as the finished product (or a state where the base material 2 is held in the same shape as the finished product) (S40). As described above, this curing is performed by various means according to the type and components of the conductive ink used, such as baking, heating, natural drying, ultraviolet curing, and cooling (when using conductive ink containing thermoplastic material). can do. In the case of heating, an infrared heater or a hot air dryer can be used, or these can be used in combination. In this way, a finished printed wiring product 1 as shown in FIG. 1 is obtained.

以上のとおり、本実施形態では、シート状の基材２上に導電性インキによりインキ層を形成したのち、インキ層の硬化前に基材２を曲げ変形し、その後にインキ層を硬化させることにより、配線３を形成した。このため、基材２の曲げ変形の際にはインキ層が未硬化あるいは半硬化の状態であって柔軟性を有し、これによって、基材２の曲げ変形に伴うインキ層の破損を抑制し、配線３を微細化した場合における配線３の損傷のおそれを抑制することができる。   As described above, in this embodiment, after forming an ink layer with conductive ink on the sheet-like substrate 2, the substrate 2 is bent and deformed before the ink layer is cured, and then the ink layer is cured. Thus, the wiring 3 was formed. For this reason, when the base material 2 is bent and deformed, the ink layer is in an uncured or semi-cured state and has flexibility, thereby suppressing breakage of the ink layer accompanying the bending deformation of the base material 2. The possibility of damage to the wiring 3 when the wiring 3 is miniaturized can be suppressed.

また、本実施形態では、インキ層を形成する前に、基材２を塑性変形させると共に、基材２を弾性的に平坦化した状態でインキ層を形成するので、基材２を平坦化した状態から解放することに伴って基材２が弾性的に復帰することにより、曲げ変形の少なくとも一部が行われることになる。したがって印刷後の曲げ変形を支援することができ、印刷後の曲げ変形を行う際において基材２の印刷面への接触の必要性を抑制することも可能になる。   In this embodiment, the base material 2 is plastically deformed before the ink layer is formed, and the ink layer is formed in a state where the base material 2 is elastically flattened. When the base material 2 is elastically restored as it is released from the state, at least a part of the bending deformation is performed. Therefore, it is possible to support the bending deformation after printing, and it is possible to suppress the necessity of contact with the printing surface of the substrate 2 when performing the bending deformation after printing.

また、本実施形態では、基材２が、曲げ変形を促進するための曲げ促進加工部（折り曲げ線４）を有することとしたので、曲げ変形を容易に且つ正確な位置で行うことができ、また曲がった形状を容易に維持することができる。また、曲げ変形が曲げ促進加工部において行われ、インキ層が曲げ促進加工部に交差して延在している構成でありながら、基材２の曲げ変形がインキ層の硬化前に行われるため、配線３の損傷のおそれを好適に抑制することができる。   Moreover, in this embodiment, since the base material 2 has the bending acceleration processing part (bending line 4) for accelerating bending deformation, bending deformation can be easily performed at an accurate position, Further, the bent shape can be easily maintained. Further, the bending deformation of the base material 2 is performed before the ink layer is cured while the bending deformation is performed in the bending acceleration processing portion and the ink layer extends so as to intersect the bending acceleration processing portion. The possibility of damage to the wiring 3 can be suitably suppressed.

また、本実施形態では、基材２が紙であることとしたので、ＰＥＴ（ポリエチレンテレフタレート）やＰＥＮ（ポリエチレンナフタレート）などの樹脂材料に比べて耐熱性能が高い。ＰＥＴやＰＥＮではガラス転移点温度が低いため、焼成温度の低いインキしか使用できず、体積抵抗値を下げることが困難である上、曲げ変形すると割れが生じやすくなり、また分解しにくく環境負荷となる問題がある。これに対して紙は耐熱性能が高く、曲げ変形によっても割れが生じにくく、また廃棄後の分解も比較的容易である点で有利である。但し本発明における基材２は紙に限られず、ＰＥＴやＰＥＮなどの樹脂材料を用いても良く、また不織布や布などの他のシート状材料を用いても良い。   Moreover, in this embodiment, since the base material 2 was paper, its heat resistance is higher than resin materials such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate). Since PET and PEN have a low glass transition temperature, only ink with a low firing temperature can be used, and it is difficult to lower the volume resistance value. There is a problem. On the other hand, paper is advantageous in that it has high heat resistance, is not easily cracked by bending deformation, and is relatively easy to disassemble after disposal. However, the substrate 2 in the present invention is not limited to paper, and a resin material such as PET or PEN may be used, or another sheet-like material such as a nonwoven fabric or cloth may be used.

また、一般に配線で広く用いられているフォトリソグラフィ法では、レジストの現像やエッチングなど基材を液体にさらす工程が含まれるため、紙などの液体に弱い材料を使うことが困難であるが、本実施形態では配線を印刷によって形成することとしたので、基材を液体にさらす工程を省略でき、したがって液体に弱い材料であっても基材として用いることができる。   In general, the photolithography method widely used for wiring includes a step of exposing the substrate to a liquid such as resist development and etching, and thus it is difficult to use a material that is weak against a liquid such as paper. In the embodiment, since the wiring is formed by printing, the step of exposing the base material to the liquid can be omitted. Therefore, even a material weak to the liquid can be used as the base material.

なお、図６に示されるように、曲げ促進加工部（折り曲げ線４）を、切り込み部４ｃと接続部４ｄとが長手方向に交互に配されたミシン目４ｅとする場合には、インキ層（符号３で示される）のうち少なくとも１つが、接続部４ｄにおいてミシン目４ｅに交差していることとすれば、折り曲げ線４における配線３の破損を特に好適に抑制できる。この場合に、切り込み部の長さは例えば０．３ｍｍ、接続部４ｄの長さは例えば０．２ｍｍとすることができ、且つこの場合には配線３の幅と間隔をいずれも１０μｍとすると、両端部に５０μｍずつのマージンを設けたとしても、５本の配線３を接続部４ｄに交差させて配置することが可能である。切り込み部４ｃに代えて、基材を厚さ方向に圧縮したプレス部を、そのような圧縮を行わない部分としての接続部４ｄと長手方向に交互に設けても良く、この場合にもインキ層のうち少なくとも１つが、接続部４ｄにおいて折り曲げ線４に交差していることとすることができる。   As shown in FIG. 6, in the case where the bending promoting portion (bending line 4) is a perforation 4e in which cut portions 4c and connecting portions 4d are alternately arranged in the longitudinal direction, an ink layer ( If at least one of them (indicated by reference numeral 3) intersects the perforation 4e at the connecting portion 4d, the breakage of the wiring 3 at the bending line 4 can be particularly suitably suppressed. In this case, the length of the cut portion can be set to, for example, 0.3 mm, the length of the connection portion 4d can be set to, for example, 0.2 mm, and in this case, if the width and interval of the wiring 3 are both 10 μm, Even if a margin of 50 μm is provided at both ends, it is possible to arrange the five wirings 3 so as to intersect the connection part 4d. Instead of the cut portion 4c, a press portion obtained by compressing the base material in the thickness direction may be provided alternately in the longitudinal direction with the connection portion 4d as a portion where such compression is not performed. It can be assumed that at least one of them intersects the fold line 4 at the connecting portion 4d.

また、図７に示されるように、比較的大きい曲率半径をもって基材２の曲げ変形を行っても良い。この場合にも、基材２上にインキ層（符号３で示される）を形成したのち、インキ層の硬化前に基材２を曲げ変形し、その後にインキ層を硬化させることにより、配線の損傷のおそれを抑制することができる。この場合には、曲げ促進加工部としての折り曲げ線４を設けなくてもよく、あるいは曲げ変形が行われる領域の全体にわたって複数の互いに平行な折り曲げ線４を設けても良い。   In addition, as shown in FIG. 7, the base material 2 may be bent and deformed with a relatively large radius of curvature. Also in this case, after forming the ink layer (indicated by reference numeral 3) on the substrate 2, the substrate 2 is bent and deformed before the ink layer is cured, and then the ink layer is cured, thereby The risk of damage can be suppressed. In this case, it is not necessary to provide the fold line 4 as the bending promoting portion, or a plurality of parallel fold lines 4 may be provided over the entire region where the bending deformation is performed.

次に、本発明の第２実施形態について説明する。図８，図９において、本発明の第２実施形態に係る配線印刷物１１は、紙からなる基材１２の表面に第１の配線１３を、また裏面に第２の配線１４を、それぞれ形成したものである。   Next, a second embodiment of the present invention will be described. 8 and 9, the printed printed matter 11 according to the second embodiment of the present invention has the first wiring 13 formed on the front surface of the base material 12 made of paper and the second wiring 14 formed on the back surface. Is.

基材１２の材質、及び第１及び第２の配線１３，１４の材質は、それぞれ上記第１実施形態で用いられたものと同様である。第１及び第２の配線１３，１４は、導電性インキによりインキ層を形成したのち、当該インキ層を硬化させることにより形成されている。   The material of the substrate 12 and the materials of the first and second wirings 13 and 14 are the same as those used in the first embodiment. The first and second wirings 13 and 14 are formed by forming an ink layer with conductive ink and then curing the ink layer.

第１の配線１３と第２の配線１４の形状は鏡面対称であり、且つ両者は基材１２を挟んで互いに対応した位置になるように形成されている。すなわち、基材１２の表面から見た場合に、第１の配線１３と第２の配線１４の位置は、それらの全領域にわたって一致して（重なって）いる。   The shapes of the first wiring 13 and the second wiring 14 are mirror-symmetric and are formed so as to correspond to each other with the base material 12 interposed therebetween. That is, when viewed from the surface of the base material 12, the positions of the first wiring 13 and the second wiring 14 coincide (overlap) over the entire region.

第１の配線１３の第１の接続点１３ａと、第２の配線１４の第１の接続点１４ａは、基材１２を挟んで互いに対応した位置にある。また、第１の配線１３の第２の接続点１３ｂと、第２の配線１４の第２の接続点１４ｂは、基材１２を挟んで互いに対応した位置にある。   The first connection point 13a of the first wiring 13 and the first connection point 14a of the second wiring 14 are in positions corresponding to each other with the base material 12 interposed therebetween. Further, the second connection point 13 b of the first wiring 13 and the second connection point 14 b of the second wiring 14 are in positions corresponding to each other with the base material 12 interposed therebetween.

基材１２には、開口部１５ａ，１５ｂが設けられている。図９に示されるように、第１の配線１３の第１の接続点１３ａと第２の配線１４の第１の接続点１４ａは、開口部１５ａ,１５ｂを通じて延在する接続片１６によって、相互接続されている。接続片１６は、紙などの可撓性かつ絶縁性の材料からなる基材１７の表面に、導電性の材料により配線１８を形成したものである。第１の配線１３、第２の配線１４、及び接続片１６の配線１８は、上記第１実施形態におけるインキ層と同様の材料により、インキ層を印刷後、硬化前に基材１７を曲げ変形して接続片１６の配線１８を第１の配線１３及び第２の配線１４に当接させ、その状態でインキ層を硬化させて形成することができる。配線１８の印刷は、基材１７の予備曲げ変形及び弾性的な平坦化の後に行うことができる。なお、このような方法に代えて、第１の配線１３、第２の配線１４、及び接続片１６の配線１８の硬化後に、これらを導電性の接着材料（例えば導電ペースト又は導電フィルム）によって接着しても良い。   The base material 12 is provided with openings 15a and 15b. As shown in FIG. 9, the first connection point 13a of the first wiring 13 and the first connection point 14a of the second wiring 14 are connected to each other by the connection piece 16 extending through the openings 15a and 15b. It is connected. The connection piece 16 has a wiring 18 formed of a conductive material on the surface of a base material 17 made of a flexible and insulating material such as paper. The first wiring 13, the second wiring 14, and the wiring 18 of the connection piece 16 are made of the same material as the ink layer in the first embodiment. Then, the wiring 18 of the connection piece 16 can be brought into contact with the first wiring 13 and the second wiring 14 and the ink layer can be cured in this state. The wiring 18 can be printed after preliminary bending deformation and elastic flattening of the substrate 17. Instead of such a method, after the first wiring 13, the second wiring 14, and the wiring 18 of the connection piece 16 are cured, they are bonded with a conductive adhesive material (for example, a conductive paste or a conductive film). You may do it.

以上のとおり構成された第２実施形態に係る配線印刷物１１によれば、第１の配線１３の第１の接続点１３ａと第２の配線１４の第１の接続点１４ａ、及び第１の配線１３の第２の接続点１３ｂと第２の配線１４の第２の接続点１４ｂが、それぞれ基材１２を挟んで互いに対応した位置にあるので、これら第１の接続点１３ａ，１４ａの間、及び第２の接続点１３ｂ，１４ｂの間をそれぞれ導通させることにより、第１の配線１３と第２の配線１４との協働によって電気抵抗を抑制し、導通を強化し、配線の不良又は破損に対する冗長性を促進することができる。   According to the printed wiring material 11 according to the second embodiment configured as described above, the first connection point 13a of the first wiring 13, the first connection point 14a of the second wiring 14, and the first wiring. Since the 13 second connection points 13b and the second connection points 14b of the second wiring 14 are in positions corresponding to each other across the base material 12, between these first connection points 13a and 14a, And the second connection points 13b and 14b are electrically connected to each other, whereby the electrical resistance is suppressed by the cooperation of the first wiring 13 and the second wiring 14, the conduction is enhanced, and the wiring is defective or damaged. Redundancy can be promoted.

また、第２実施形態では、基材１２が少なくとも一つの開口部１５ａ，１５ｂを有し、この開口部１５ａ，１５ｂを通じて第１の配線１３と第２の配線１４とを相互接続する接続片１６を更に備えたので、簡易な構成で本発明に所期の効果を得ることができる。   In the second embodiment, the base member 12 has at least one opening 15a, 15b, and the connection piece 16 interconnects the first wiring 13 and the second wiring 14 through the opening 15a, 15b. Therefore, the desired effect of the present invention can be obtained with a simple configuration.

なお、第２実施形態では、第１の配線１３と第２の配線１４とを全体として鏡面対称としたが、第１の配線１３の第１の接続点１３ａと第２の配線１４の第１の接続点１４ａ、及び第１の配線１３の第２の接続点１３ｂと第２の配線１４の第２の接続点１４ｂが、それぞれ基材１２を挟んで互いに対応した位置であるか、あるいは少なくとも接続片１６のような接続手段によって基材１２の表裏の導通を行える程度に近接した位置にある限り、第１の配線１３と第２の配線１４とは鏡面対称でなくても良い（すなわち、基材１２を挟んで互いに対応した位置になくても良い）。   In the second embodiment, the first wiring 13 and the second wiring 14 are mirror-symmetrical as a whole, but the first connection point 13a of the first wiring 13 and the first wiring 14 of the second wiring 14 are the same. And the second connection point 13b of the first wiring 13 and the second connection point 14b of the second wiring 14 are positions corresponding to each other across the base material 12, or at least The first wiring 13 and the second wiring 14 do not have to be mirror-symmetric as long as they are close enough to allow conduction between the front and back of the substrate 12 by connection means such as the connection piece 16 (that is, They may not be in positions corresponding to each other across the base material 12).

第１及び第２の接続点のうち少なくとも１つは、配線１３，１４の端部でなくても良い（すなわち、配線１３，１４の中間部分であっても良い）。一対の配線につき３つ以上の接続点を設けても良い。１つの接続片１６に複数の配線１８を並行して設けて、複数組の第１及び第２の配線の間の導通を１つの接続片で行えるようにしても良い。また、第２実施形態では少なくとも一つの開口部１５ａ，１５ｂを設けたが、開口部は設けなくても良い。その場合には、例えば第１の配線１３と第２の配線１４との第１の接続点１３ａ，１４ａを基材１２の縁部の近傍に設け、これら第１の接続点１３ａ，１４ａを接続片１６によって相互接続するのが好適である。   At least one of the first and second connection points may not be an end portion of the wirings 13 and 14 (that is, may be an intermediate portion of the wirings 13 and 14). Three or more connection points may be provided for a pair of wirings. A plurality of wirings 18 may be provided in parallel on one connection piece 16 so that conduction between a plurality of sets of first and second wirings can be performed by one connection piece. In the second embodiment, at least one opening 15a, 15b is provided, but the opening may not be provided. In that case, for example, the first connection points 13a and 14a between the first wiring 13 and the second wiring 14 are provided in the vicinity of the edge of the base member 12, and the first connection points 13a and 14a are connected. It is preferred that they are interconnected by strips 16.

次に、本発明の第３実施形態について説明する。図１０，図１１において、本発明の第３実施形態に係る配線印刷物２１は、紙からなる帯状の基材２２の表面に、配線２３を形成したものである。配線２３の印刷は、ロールトゥロール方式（すなわち、ロール状に巻いた基材２２に配線２３を形成し、これを再び巻き取る方式）により連続的に行うことができる。基材２２の材質及び配線２３の材質は、それぞれ上記第１実施形態で用いられたものと同様である。配線２３は、導電性インキによりインキ層を形成したのち、当該インキ層を硬化させることにより形成されている。配線２３の印刷は、基材２２の予備曲げ変形及び弾性的な平坦化の後に行うことができる。   Next, a third embodiment of the present invention will be described. 10 and 11, a printed wiring product 21 according to the third embodiment of the present invention is obtained by forming a wiring 23 on the surface of a strip-like base material 22 made of paper. The wiring 23 can be printed continuously by a roll-to-roll method (that is, a method in which the wiring 23 is formed on the base material 22 wound in a roll shape and wound up again). The material of the base material 22 and the material of the wiring 23 are the same as those used in the first embodiment. The wiring 23 is formed by forming an ink layer with conductive ink and then curing the ink layer. The wiring 23 can be printed after preliminary bending deformation and elastic flattening of the base material 22.

このようにして形成された配線印刷物２１は、図１１に示されるように、例えば紙からなる円筒形の芯材２４に巻きつけた状態で接着され、これによって紙巻コイル２５が製造される。この巻きつけは、インキ層の印刷と同時に行っても良い。インキ層の硬化は、基材２２を芯材２４に巻きつけた後に行うことができる。この場合、インキ層が、巻きつけた側の基材に移らないように、半硬化処理を行なってインキ中の溶剤を飛ばすことが好ましい。巻きつけの際には、隣り合う基材２２が互いに接触しても良く、また一部又は全部が重なっても良い。   As shown in FIG. 11, the printed wiring material 21 formed in this way is bonded in a state of being wound around a cylindrical core member 24 made of, for example, paper, whereby the paper-wound coil 25 is manufactured. This winding may be performed simultaneously with the printing of the ink layer. The ink layer can be cured after the base material 22 is wound around the core material 24. In this case, it is preferable to carry out a semi-curing treatment to remove the solvent in the ink so that the ink layer does not move to the substrate on the wound side. When winding, the adjacent base materials 22 may contact each other, and a part or all may overlap.

次に、本発明の第４実施形態について説明する。図１２，図１３において、本発明の第４実施形態に係る配線印刷物３１は、紙からなる基材３２の表面に、配線３３を形成したものである。本実施形態では４本の配線３３を並行して図示しているが、配線３３の本数は任意である。配線３３の線幅及び線間は、例えば２０μｍ／２０μｍ以下、好ましくは１０μｍ／１０μｍ以下とすることができる。各配線３３の両端部には、電気的接続を提供するために幅広化された取出し部３４が設けられている。図１２中右側の端部では、各配線３３がその長手方向に対して直角方向に屈曲しており、基材３２にはその長手方向に対し側方に突出した突出部３５が設けられている。基材３２の材質及び配線３３の材質は、それぞれ上記第１実施形態で用いられたものと同様である。配線３３は、導電性インキによりインキ層を形成したのち、当該インキ層を硬化させることにより形成されている。   Next, a fourth embodiment of the present invention will be described. 12 and 13, a printed wiring product 31 according to the fourth embodiment of the present invention is obtained by forming a wiring 33 on the surface of a base material 32 made of paper. In the present embodiment, four wirings 33 are illustrated in parallel, but the number of wirings 33 is arbitrary. The line width and the line spacing of the wiring 33 can be set to, for example, 20 μm / 20 μm or less, preferably 10 μm / 10 μm or less. At both ends of each wiring 33, an extraction portion 34 that is widened to provide electrical connection is provided. In the right end portion in FIG. 12, each wiring 33 is bent in a direction perpendicular to the longitudinal direction, and the base member 32 is provided with a protruding portion 35 protruding laterally with respect to the longitudinal direction. . The material of the base material 32 and the material of the wiring 33 are the same as those used in the first embodiment. The wiring 33 is formed by forming an ink layer with conductive ink and then curing the ink layer.

このようにして形成された配線印刷物３１は、図１２に示されるように、全体をらせん状に曲げ変形することによって、紙巻コイルに加工される。配線３３の印刷は、基材３２の予備曲げ変形及び弾性的な平坦化の後に行うことができる。ただし、本実施形態では、曲げ変形に伴ってインキ層が基材３２の裏面に接触することになるため、インキ層の硬化は曲げ変形前に行っても良い。この曲げ変形された状態を固定するために、例えば配線印刷物３１を筒状のケーシングに挿入してもよく、また接着剤を使用しても良い。一方の端部の取り出し部３４と、これに隣接する配線３３における他方の端部の取り出し分３４とを順次接続することにより、全ての配線３３が直列に接続されたコイルを作成することができる。また、隣接する配線３３を接続せずに並列な配線３３として使用することも出来る。この場合、例えば装置内で並列に走る配線の占める体積を縮めることも可能である。   As shown in FIG. 12, the printed wiring product 31 formed in this way is processed into a paper coil by bending and deforming the whole in a spiral shape. The wiring 33 can be printed after preliminary bending deformation and elastic flattening of the substrate 32. However, in the present embodiment, the ink layer comes into contact with the back surface of the substrate 32 along with the bending deformation, and thus the ink layer may be cured before the bending deformation. In order to fix the bent state, for example, the printed wiring material 31 may be inserted into a cylindrical casing, or an adhesive may be used. By sequentially connecting the lead-out portion 34 at one end and the lead-out portion 34 at the other end of the wiring 33 adjacent thereto, a coil in which all the wirings 33 are connected in series can be created. . Moreover, it can also be used as the parallel wiring 33, without connecting the adjacent wiring 33. FIG. In this case, for example, it is possible to reduce the volume occupied by the wires running in parallel in the apparatus.

次に、本発明の第５実施形態について説明する。図１４，図１５において、本発明の第５実施形態に係る配線印刷物４１は、紙からなる基材４２の表面に、配線４３を形成すると共に、これを曲げ変形し、基材４２を除去することにより、配管（不図示）の端部に取り付けてろ過に使用するためのフィルタとしたものである。   Next, a fifth embodiment of the present invention will be described. 14 and 15, the printed printed matter 41 according to the fifth embodiment of the present invention forms the wiring 43 on the surface of the base material 42 made of paper, bends and deforms the wiring 43, and removes the base material 42. Thus, the filter is attached to the end of a pipe (not shown) and used for filtration.

基材４２は、正方形の中央部分４２ａの４辺に、同じく正方形の周辺部分４２ｂが接続された形状を有し、中央部分４２ａと各周辺部分４２ｂとの境界部分は、山折りの折り曲げ線４４とされている。折り曲げ線４４の構成は、上述した第１実施形態における折り曲げ線４と同様である。中央部分４２ａ及び周辺部分４２ｂの全体にわたって、配線３３が形成される。配線３３の延在方向すなわち長手方向は、中央部分４２ａ及び周辺部分４２ｂの各辺に対して４５度をなしているが、配線３３のパターンはこれ以外のものであっても良い。配線３３の本数は任意である。配線３３の線幅及び線間は、例えば２０μｍ／２０μｍ以下、好ましくは１０μｍ／１０μｍ以下とすることができる。配線４３の材料は、上述した第１実施形態における配線３とそれぞれ同様である。   The base material 42 has a shape in which a square peripheral portion 42b is similarly connected to four sides of a square central portion 42a, and a boundary portion between the central portion 42a and each peripheral portion 42b is a fold-folded fold line 44. It is said that. The configuration of the fold line 44 is the same as that of the fold line 4 in the first embodiment described above. The wiring 33 is formed over the entire central portion 42a and the peripheral portion 42b. The extending direction, that is, the longitudinal direction of the wiring 33 is 45 degrees with respect to each side of the central portion 42a and the peripheral portion 42b, but the pattern of the wiring 33 may be other than this. The number of wirings 33 is arbitrary. The line width and the line spacing of the wiring 33 can be set to, for example, 20 μm / 20 μm or less, preferably 10 μm / 10 μm or less. The material of the wiring 43 is the same as that of the wiring 3 in the first embodiment described above.

予備曲げ変形及び弾性的な平坦化の後に、配線３３のためのインキ層が印刷によって形成された基材４２は、図１５に示されるように、折り曲げ線４４において９０°山折りに曲げ変形される。インキ層の硬化は、第１実施形態と同様に、基材４２を曲げ変形した後に行うことができる。曲げ変形後の各周辺部分４２ｂ同士の相互接続は、両者が接合する稜線への配線３３と同様の材料の印刷によって、配線３３の硬化前又は硬化後に行うことができ、また、配線３３と同様の又は別異の導電性の接着材料（例えば導電ペースト又は導電フィルム）を用いた接着によって行うこともできる。フィルタが使用される流体の圧力が十分に低い場合には、曲げ変形後の各周辺部分４２ｂ同士の相互接続は、行わなくても良い。   After the pre-bending deformation and elastic flattening, the base material 42 on which the ink layer for the wiring 33 is formed by printing is bent and deformed into a 90 ° mountain fold at a fold line 44 as shown in FIG. The The ink layer can be cured after the substrate 42 is bent and deformed, as in the first embodiment. The interconnection between the peripheral portions 42b after bending deformation can be performed before or after the wiring 33 is cured by printing the same material as that of the wiring 33 on the ridgeline where both are joined. It is also possible to perform adhesion by using a conductive adhesive material (for example, a conductive paste or a conductive film). When the pressure of the fluid in which the filter is used is sufficiently low, the peripheral portions 42b after bending deformation need not be interconnected.

最後に、基材４２が除去される。基材４２の除去には、例えばセルロースを溶解することが可能な溶媒材料、例えばＮ−メチルモルホリンを用いることができる。基材４２をオブラートなどの水溶性の材料とする場合には、水によってこれを除去することができる。別法として、基材４２の除去は基材４２を燃焼させることによって行っても良い。以上によって、完成品であるフィルタを得ることができる。フィルタの形状は四角柱状のほか、６角柱・８角柱などの多角柱状、円柱状、錐形状あるいは錐台形状など、各種の立体形状あるいは平面形状から選択することができる。   Finally, the base material 42 is removed. For removing the base material 42, for example, a solvent material capable of dissolving cellulose, for example, N-methylmorpholine can be used. When the base material 42 is a water-soluble material such as an wafer, it can be removed with water. Alternatively, the substrate 42 may be removed by burning the substrate 42. The filter which is a finished product can be obtained by the above. The shape of the filter can be selected from various three-dimensional shapes or planar shapes such as a rectangular column shape, a polygonal column shape such as a hexagonal column or an octagonal column, a cylindrical shape, a cone shape, or a truncated cone shape.

なお、本発明は上述した各実施形態の範囲に限定されうるものではなく、当業者の知識に基づいて設計の変更などの変形を加えることも可能であり、そのような変形が加えられた態様も本発明の範囲に含まれうるものである。本発明の各要素は可能な限り組み合わせて用いることができる。例えば、第１ないし第４実施形態の態様においても、基材なしに配線のみでその形状を保持しうる場合には、配線印刷物の完成後に基材を除去することができる。基材の除去には第５実施形態において用いられた方法を用いることができる。   The present invention is not limited to the scope of each of the above-described embodiments, and modifications such as design changes can be added based on the knowledge of those skilled in the art. Can also be included in the scope of the present invention. Each element of the present invention can be used in combination as much as possible. For example, also in the aspects of the first to fourth embodiments, the base material can be removed after completion of the printed wiring material when the shape can be maintained only by the wiring without the base material. The method used in the fifth embodiment can be used for removing the substrate.

また、本発明の配線印刷物は、これを配線基板に適用するのが特に好適であるが、これ以外に、例えば、アンテナや電磁波シールドなどに用いることができ、かかる適用も本発明の範疇に属するものである。   Further, the printed wiring material of the present invention is particularly preferably applied to a wiring board, but besides this, it can be used for, for example, an antenna or an electromagnetic wave shield, and such application also belongs to the category of the present invention. Is.

１，１１，２１，３１，４１ 配線印刷物
２，１２，２２，３２，４２ 基材
３，１３，１８，２３，３３，４３ 配線又はインキ層
４，４４ 折り曲げ線
４ｅ ミシン目
４ｃ 切り込み部
４ｄ 接続部
１３ 第１の配線
１４ 第２の配線
１３ａ，１４ａ 第１の接続点
１３ｂ，１４ｂ 第２の接続点
１５ａ，１５ｂ 開口部
１６ 接続片 1,11,21,31,41 Printed wiring 2,12,22,32,42 Base material 3,13,18,23,33,43 Wiring or ink layer 4,44 Folding line 4e Perforation 4c Notch 4d Connection Part 13 First wiring 14 Second wiring 13a, 14a First connection point 13b, 14b Second connection point 15a, 15b Opening 16 Connection piece

Claims (10)

シート状の基材と、当該基材上に形成された配線と、を含む配線印刷物であって、
前記基材上に導電性インキによりインキ層を形成したのち、当該インキ層の硬化前に前記基材を曲げ変形し、その後に前記インキ層を硬化させることにより、前記配線が形成されていることを特徴とする配線印刷物。 A printed wiring material including a sheet-like base material and wiring formed on the base material,
The wiring is formed by forming an ink layer with conductive ink on the base material, bending the base material before curing the ink layer, and then curing the ink layer. Printed wiring characterized by 前記インキ層を形成する前に、前記基材を塑性変形させると共に、前記基材を弾性的に平坦化した状態で前記インキ層を形成したことを特徴とする請求項１に記載の配線印刷物。   The printed matter according to claim 1, wherein the ink layer is formed in a state in which the base material is plastically deformed and the base material is elastically flattened before the ink layer is formed. 前記基材が、曲げ変形を促進するための曲げ促進加工部を有し、前記曲げ変形が前記曲げ促進加工部において行われ、
前記インキ層が前記曲げ促進加工部に交差して延在していることを特徴とする請求項１又は２に記載の配線印刷物。 The base material has a bending promotion processing part for promoting bending deformation, and the bending deformation is performed in the bending promotion processing part,
The printed matter according to claim 1, wherein the ink layer extends so as to intersect the bending promoting portion. 前記曲げ促進加工部が、切り込み部と接続部とが交互に配されたミシン目であり、
前記インキ層のうち少なくとも１つが、前記接続部において前記ミシン目に交差していることを特徴とする請求項３に記載の配線印刷物。 The bending promoting processed portion is a perforation in which cut portions and connecting portions are alternately arranged,
The printed matter according to claim 3, wherein at least one of the ink layers intersects the perforation at the connection portion. シート状の基材と、当該基材上に形成された第１及び第２の配線と、を含む配線印刷物であって、
前記第１及び第２の配線が、導電性インキによりインキ層を形成したのち当該インキ層を硬化させることにより形成されており、
前記基材が第１及び第２の表面を有し、前記第１の表面には前記第１の配線が形成され、前記第２の表面には前記第２の配線が形成され、
前記第１の配線の第１の接続点と前記第２の配線の第１の接続点、及び前記第１の配線の第２の接続点前記第２の配線の第２の接続点が、それぞれ前記基材を挟んで互いに対応した位置にあることを特徴とする配線印刷物。 A printed wiring material including a sheet-like base material and first and second wirings formed on the base material,
The first and second wirings are formed by forming an ink layer with conductive ink and then curing the ink layer,
The substrate has first and second surfaces, the first wiring is formed on the first surface, and the second wiring is formed on the second surface;
A first connection point of the first wiring, a first connection point of the second wiring, and a second connection point of the first wiring; and a second connection point of the second wiring, respectively. A printed wiring product, wherein the printed materials are in positions corresponding to each other with the base material interposed therebetween. 前記基材が少なくとも一つの開口部を有し、前記開口部を通じて前記第１の配線と前記第２の配線とを相互接続する接続片を更に備えたことを特徴とする請求項５に記載の配線印刷物。   The said base material has at least 1 opening part, The connection piece which interconnects the said 1st wiring and the said 2nd wiring through the said opening part was further provided, The connection piece of Claim 5 characterized by the above-mentioned. Printed wiring. 前記インキ層が基材の上に形成された後に、前記基材が除去されていることを特徴とする請求項１ないし６のいずれかに記載の配線印刷物。   The printed wiring product according to claim 1, wherein the base material is removed after the ink layer is formed on the base material. 前記基材が紙であることを特徴とする請求項１ないし７のいずれかに記載の配線印刷物。   The printed wiring material according to claim 1, wherein the substrate is paper. シート状の基材上に導電性インキによりインキ層を形成する工程と、
前記インキ層の形成後であって前記インキ層の硬化前に、前記基材を曲げ変形し、これによって前記インキ層の少なくとも一部を曲げ変形する工程と、
前記曲げ変形後にインキ層を硬化させる工程と、
を含むことを特徴とする配線印刷物の製造方法。 Forming an ink layer with conductive ink on a sheet-like substrate; and
Bending the substrate after forming the ink layer and before curing the ink layer, thereby bending and deforming at least a portion of the ink layer; and
Curing the ink layer after the bending deformation;
A method for producing a printed wiring material, comprising: 前記インキ層を形成する工程の前に、前記基材を塑性変形させる工程を更に含み、
前記インキ層を形成する工程は、前記基材を弾性的に平坦化した状態で実行することを特徴とする請求項９に記載の配線印刷物の製造方法。 Before the step of forming the ink layer, further comprising the step of plastically deforming the substrate,
The method for producing a printed printed matter according to claim 9, wherein the step of forming the ink layer is performed in a state where the base material is elastically flattened.
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