JP2016032825A - 半田ボールおよび電子部材 - Google Patents
半田ボールおよび電子部材 Download PDFInfo
- Publication number
- JP2016032825A JP2016032825A JP2014156057A JP2014156057A JP2016032825A JP 2016032825 A JP2016032825 A JP 2016032825A JP 2014156057 A JP2014156057 A JP 2014156057A JP 2014156057 A JP2014156057 A JP 2014156057A JP 2016032825 A JP2016032825 A JP 2016032825A
- Authority
- JP
- Japan
- Prior art keywords
- mass
- solder ball
- solder
- drop impact
- impact resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Powder Metallurgy (AREA)
Abstract
【解決手段】本発明は、Niを0.04〜0.2質量%含有し、残部がSnおよび不可避不純物でなり、CuがICP分析による検出限界以下とした半田ボールである。これにより、本発明では、一段と耐落下衝撃特性に優れた半田ボール、およびこれを用いた電子部材を提供できる。
【選択図】なし
Description
Claims (7)
- Niを0.04〜0.2質量%含有し、残部がSnおよび不可避不純物であり、CuがICP分析による検出限界以下である
ことを特徴とする半田ボール。 - P,Mg,Gaのうち少なくとも1種、または2種以上を総計で0.006質量%以下で含有する
ことを特徴とする請求項1記載の半田ボール。 - Agを0.1〜1.5質量%で含有する
ことを特徴とする請求項1または2記載の半田ボール。 - Biを0.1〜1.5質量%で含有する
ことを特徴とする請求項1または2記載の半田ボール。 - 前記Niの含有量が、0.04質量%以上0.1質量%未満である
ことを特徴とする請求項1〜4のうちいずれか1項記載の半田ボール。 - 前記Snが低α線Snからなり、発するα線量が1[cph/cm2]以下である
ことを特徴とする請求項1〜5のうちいずれか1項記載の半田ボール。 - 複数の電子部品間を接合部によって接合した電子部材であって、該接合部の一部又は全部が請求項1〜6のうちいずれか1項記載の半田ボールによって形成されている
ことを特徴とする電子部材。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014156057A JP6408282B2 (ja) | 2014-07-31 | 2014-07-31 | 半田ボールおよび電子部材 |
PCT/JP2015/069802 WO2016017398A1 (ja) | 2014-07-31 | 2015-07-09 | 半田ボールおよび電子部材 |
US15/329,746 US20170209964A1 (en) | 2014-07-31 | 2015-07-09 | Solder ball and electronic member |
TW104122901A TW201611938A (en) | 2014-07-31 | 2015-07-15 | Solder ball and electronic member |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014156057A JP6408282B2 (ja) | 2014-07-31 | 2014-07-31 | 半田ボールおよび電子部材 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016032825A true JP2016032825A (ja) | 2016-03-10 |
JP6408282B2 JP6408282B2 (ja) | 2018-10-17 |
Family
ID=55217303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014156057A Active JP6408282B2 (ja) | 2014-07-31 | 2014-07-31 | 半田ボールおよび電子部材 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20170209964A1 (ja) |
JP (1) | JP6408282B2 (ja) |
TW (1) | TW201611938A (ja) |
WO (1) | WO2016017398A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI803174B (zh) * | 2022-01-27 | 2023-05-21 | 福懋科技股份有限公司 | 應用於球柵陣列封裝基板的球墊及形成方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01283398A (ja) * | 1988-05-09 | 1989-11-14 | Mitsui Mining & Smelting Co Ltd | 錫およびその製造方法 |
JP2002018589A (ja) * | 2000-07-03 | 2002-01-22 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2004058085A (ja) * | 2002-07-26 | 2004-02-26 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2005040847A (ja) * | 2003-07-25 | 2005-02-17 | Hitachi Metals Ltd | はんだボールの製造方法 |
JP2010099736A (ja) * | 2008-09-25 | 2010-05-06 | Hitachi Metals Ltd | 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002096191A (ja) * | 2000-09-18 | 2002-04-02 | Matsushita Electric Ind Co Ltd | はんだ材料およびこれを利用する電気・電子機器 |
-
2014
- 2014-07-31 JP JP2014156057A patent/JP6408282B2/ja active Active
-
2015
- 2015-07-09 US US15/329,746 patent/US20170209964A1/en not_active Abandoned
- 2015-07-09 WO PCT/JP2015/069802 patent/WO2016017398A1/ja active Application Filing
- 2015-07-15 TW TW104122901A patent/TW201611938A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01283398A (ja) * | 1988-05-09 | 1989-11-14 | Mitsui Mining & Smelting Co Ltd | 錫およびその製造方法 |
JP2002018589A (ja) * | 2000-07-03 | 2002-01-22 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2004058085A (ja) * | 2002-07-26 | 2004-02-26 | Senju Metal Ind Co Ltd | 鉛フリーはんだ合金 |
JP2005040847A (ja) * | 2003-07-25 | 2005-02-17 | Hitachi Metals Ltd | はんだボールの製造方法 |
JP2010099736A (ja) * | 2008-09-25 | 2010-05-06 | Hitachi Metals Ltd | 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品 |
Also Published As
Publication number | Publication date |
---|---|
US20170209964A1 (en) | 2017-07-27 |
TW201611938A (en) | 2016-04-01 |
WO2016017398A1 (ja) | 2016-02-04 |
JP6408282B2 (ja) | 2018-10-17 |
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