JP2016029161A5 - - Google Patents

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Publication number
JP2016029161A5
JP2016029161A5 JP2015140131A JP2015140131A JP2016029161A5 JP 2016029161 A5 JP2016029161 A5 JP 2016029161A5 JP 2015140131 A JP2015140131 A JP 2015140131A JP 2015140131 A JP2015140131 A JP 2015140131A JP 2016029161 A5 JP2016029161 A5 JP 2016029161A5
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JP
Japan
Prior art keywords
pressure
sensitive adhesive
sheet according
adhesive layer
adhesive sheet
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Application number
JP2015140131A
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Japanese (ja)
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JP6525779B2 (en
JP2016029161A (en
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Priority to JP2015140131A priority Critical patent/JP6525779B2/en
Priority claimed from JP2015140131A external-priority patent/JP6525779B2/en
Publication of JP2016029161A publication Critical patent/JP2016029161A/en
Publication of JP2016029161A5 publication Critical patent/JP2016029161A5/ja
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Claims (8)

粘着剤層と、該粘着剤層の片側に配置された樹脂層と、樹脂層の前記粘着剤層とは反対側に配置された基材とを備え、
該粘着剤層側から、該粘着剤層を貫通するようにして切断溝を形成した際に、切断溝形成後、２５℃で１時間経過した後に切断溝が消失しない、
粘着シート。 An adhesive layer, a resin layer disposed on one side of the adhesive layer, and a substrate disposed on the opposite side of the resin layer from the adhesive layer ,
From the pressure-sensitive adhesive layer side, when the cut groove is formed so as to penetrate the pressure-sensitive adhesive layer, the cut groove does not disappear after 1 hour at 25 ° C. after the formation of the cut groove.
Adhesive sheet. 前記粘着剤層の厚みが、５０μｍ以下である、請求項１に記載の粘着シート。   The pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive layer has a thickness of 50 μm or less. 前記樹脂層の２５℃におけるナノインデンテーション法による弾性率が、１ＭＰａ以上である、請求項１または２に記載の粘着シート。   The pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the elastic modulus of the resin layer by a nanoindentation method at 25 ° C is 1 MPa or more. 加熱により粘着力が低下する、請求項１から３のいずれかに記載の粘着シート。   The pressure-sensitive adhesive sheet according to any one of claims 1 to 3, wherein the pressure-sensitive adhesive force is reduced by heating. 前記粘着剤層が、熱膨張性微小球を含む、請求項４に記載の粘着シート。   The pressure-sensitive adhesive sheet according to claim 4, wherein the pressure-sensitive adhesive layer contains thermally expandable microspheres. 加熱前の粘着力（ａ１）と加熱した後の粘着力（ａ２）との比（ａ２／ａ１）が、０．０００１〜０．５である、請求項４または５に記載の粘着シート。   The pressure-sensitive adhesive sheet according to claim 4 or 5, wherein the ratio (a2 / a1) between the pressure-sensitive adhesive force (a1) before heating and the pressure-sensitive adhesive force (a2) after heating is 0.0001 to 0.5. 加熱により前記熱膨張性微小球を膨張または発泡させた際の、前記粘着剤層の前記樹脂層とは反対側の面の表面粗さＲａが、３μｍ以上である、請求項５に記載の粘着シート。   The pressure-sensitive adhesive according to claim 5, wherein the surface roughness Ra of the surface of the pressure-sensitive adhesive layer opposite to the resin layer when the heat-expandable microspheres are expanded or foamed by heating is 3 μm or more. Sheet. 請求項１から７のいずれかに記載の粘着シート上に、電子部品材料を貼着した後、
該電子部品材料を切断加工することを含む、
電子部品の製造方法。
On the pressure-sensitive adhesive sheet according to any one of claims 1 to 7, after bonding the electronic component material,
Cutting the electronic component material,
Manufacturing method of electronic components.
JP2015140131A 2013-03-15 2015-07-14 Adhesive sheet Active JP6525779B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015140131A JP6525779B2 (en) 2013-03-15 2015-07-14 Adhesive sheet

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013053850 2013-03-15
JP2013053850 2013-03-15
JP2015140131A JP6525779B2 (en) 2013-03-15 2015-07-14 Adhesive sheet

Related Parent Applications (1)

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JP2015505528A Division JP5801010B2 (en) 2013-03-15 2014-03-12 Adhesive sheet

Publications (3)

Publication Number Publication Date
JP2016029161A JP2016029161A (en) 2016-03-03
JP2016029161A5 true JP2016029161A5 (en) 2017-04-06
JP6525779B2 JP6525779B2 (en) 2019-06-05

Family

ID=51536845

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015505528A Active JP5801010B2 (en) 2013-03-15 2014-03-12 Adhesive sheet
JP2015140131A Active JP6525779B2 (en) 2013-03-15 2015-07-14 Adhesive sheet

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2015505528A Active JP5801010B2 (en) 2013-03-15 2014-03-12 Adhesive sheet

Country Status (5)

Country Link
JP (2) JP5801010B2 (en)
KR (1) KR101637862B1 (en)
CN (1) CN105102565B (en)
TW (1) TWI557206B (en)
WO (1) WO2014142194A1 (en)

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JP6712916B2 (en) * 2016-07-11 2020-06-24 日東電工株式会社 Adhesive sheet
SG11201902922WA (en) * 2016-10-03 2019-05-30 Lintec Corp Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
SG11201906443UA (en) * 2017-01-20 2019-08-27 Mitsui Chemicals Tohcello Inc Adhesive film and method for manufacturing electronic apparatus
JP6908395B2 (en) * 2017-02-28 2021-07-28 日東電工株式会社 Adhesive tape
JP7017334B2 (en) * 2017-04-17 2022-02-08 日東電工株式会社 Dicing die bond film
JP6902394B2 (en) * 2017-05-15 2021-07-14 ポリプラスチックス株式会社 Composite molded product with sealing properties
JP6881139B2 (en) * 2017-08-07 2021-06-02 三菱ケミカル株式会社 Photo-curable adhesive sheet
JP7075326B2 (en) * 2018-10-05 2022-05-25 日東電工株式会社 Dicing die bond film
JP7446773B2 (en) * 2019-11-07 2024-03-11 日東電工株式会社 Dicing tape and dicing die bond film
JP2021082649A (en) * 2019-11-15 2021-05-27 昭和電工マテリアルズ株式会社 Dicing/die bonding integrated film and manufacturing method thereof, and manufacturing method of semiconductor device
JP2021123603A (en) * 2020-01-31 2021-08-30 リンテック株式会社 Adhesive sheet

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