JP2016023974A - Current sensor - Google Patents

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JP2016023974A
JP2016023974A JP2014146934A JP2014146934A JP2016023974A JP 2016023974 A JP2016023974 A JP 2016023974A JP 2014146934 A JP2014146934 A JP 2014146934A JP 2014146934 A JP2014146934 A JP 2014146934A JP 2016023974 A JP2016023974 A JP 2016023974A
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current
current path
magnetic field
insulating substrate
control plate
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千葉　健
Takeshi Chiba
健 千葉
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Alps Green Devices Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a current sensor that can be downsized while maintaining insulation resistance.SOLUTION: A current sensor 100 comprises: a U-shaped current path 1 through which a current to be measured flows; a U-shaped magnetic field control plate 3 for controlling a magnetic field generated by the current to be measured; a rectangular shaped insulating substrate 5; a magnetic sensor element 7a, mounted on the insulating substrate 5, for measuring the magnetic field; and a plurality of terminals 9 provided on the insulating substrate 5 and electrically connected to the magnetic sensor element 7a. The terminals 9 are arranged along a first short side 5a of the insulating substrate 5, the magnetic sensor element 7a is arranged at a center of an opening width of the magnetic field control plate 3, and both of end parts 1a of the current path 1 are arranged so as to be in contact with both of long sides 5c of the insulating substrate 5 facing each other. The current path 1 is formed so that a center of a wider part 1b formed in both of the end parts 1a of the current path 1 is closer to a second side 5b of the insulating substrate 5 than a center of a narrower part 1c formed in a vicinity of the magnetic sensor element 7a.SELECTED DRAWING: Figure 1

Description

本発明は、被測定電流によって生じる磁界に基づいて電流値を算出する電流センサに係わり、特に小型化可能な電流センサに係わる。   The present invention relates to a current sensor that calculates a current value based on a magnetic field generated by a current to be measured, and more particularly to a current sensor that can be miniaturized.

近年、各種機器の制御や監視のために機器に取り付けられて、機器に流れる電流を測定する電流センサが一般に用いられている。この種の電流センサとして、電流路に流れる電流から生じる磁界を感知する磁気抵抗効果素子やホール素子等の磁気センサ素子を用いた電流センサが知られている。   In recent years, a current sensor that is attached to a device and measures a current flowing through the device is generally used for controlling and monitoring various devices. As this type of current sensor, a current sensor using a magnetic sensor element such as a magnetoresistive effect element or a Hall element that senses a magnetic field generated from a current flowing in a current path is known.

このような電流センサの一例として、被測定電流が流れる電流線をＵ字形状とした電流センサが特許文献１に記載されている。特許文献１に開示された電流センサ９００の構造を図８に示す。   As an example of such a current sensor, Patent Document 1 discloses a current sensor in which a current line through which a current to be measured flows has a U shape. The structure of the current sensor 900 disclosed in Patent Document 1 is shown in FIG.

電流センサ９００は、電流の流れる方向が逆向きで同じ電流量の平行電流線部９３２ａ及び９３２ｂを、貫通穴９３０ａを介して回路基板９３０上に配置し、その平行電流線部９３２ａ及び９３２ｂの軸を結ぶ延長線上に磁気検出素子９１０を配置する。また、磁気検出素子９１０の磁界検出方向はその延長線とは直角方向であり、磁気検出素子９１０に近い側の平行電流線部９３２ｂの磁界と、遠い側の平行電流線部９３２ａの逆方向の磁界の差分を検知して、平行電流線部９３２に流れる電流量を検知する。   In the current sensor 900, parallel current line portions 932a and 932b having the same amount of current flowing in opposite directions are arranged on the circuit board 930 through the through holes 930a, and the axes of the parallel current line portions 932a and 932b are arranged. The magnetic detection element 910 is disposed on an extension line connecting the two. The magnetic field detection direction of the magnetic detection element 910 is a direction perpendicular to the extension line, and the magnetic field of the parallel current line portion 932b near the magnetic detection element 910 is opposite to the parallel current line portion 932a on the far side. The amount of current flowing in the parallel current line portion 932 is detected by detecting the difference in magnetic field.

この構成によれば、電流センサ９００のサイズが大型化することなく、高感度で電流量を検出でき、生産も容易に行うことが可能な電流センサを提供することができる、としている。   According to this configuration, it is possible to provide a current sensor that can detect a current amount with high sensitivity and can be easily produced without increasing the size of the current sensor 900.

特開２００４−３１７１６６号公報JP 2004-317166 A

しかしながら特許文献１に開示された電流センサ９００には、以下のような課題があった。   However, the current sensor 900 disclosed in Patent Document 1 has the following problems.

電流センサ９００では、測定した電流量の情報を外部の回路に伝送するため、回路基板９３０に複数の端子が取り付けられている。該複数の端子は、回路基板９３０の端部に取り付けられているが、端子に近い側の平行電流線部９３２ａと端子との間において、絶縁耐性を維持するために、測定する電流量の大きさに対応した絶縁距離を確保する必要がある。従って、測定する電流量が大きくなった場合には、平行電流線部９３２ａと複数の端子との間の距離を拡げる必要がある。その結果、電流センサ９００の小型化が困難になるという問題があった。   In the current sensor 900, a plurality of terminals are attached to the circuit board 930 in order to transmit information on the measured current amount to an external circuit. The plurality of terminals are attached to the end portion of the circuit board 930. In order to maintain insulation resistance between the parallel current line portion 932a on the side close to the terminal and the terminal, the amount of current to be measured is large. It is necessary to secure an insulation distance corresponding to the thickness. Therefore, when the amount of current to be measured increases, it is necessary to increase the distance between the parallel current line portion 932a and the plurality of terminals. As a result, there is a problem that it is difficult to reduce the size of the current sensor 900.

本発明は、このような従来技術の実情に鑑みてなされたもので、その目的は、絶縁耐性を維持したまま小型化することが可能な電流センサを提供することにある。   The present invention has been made in view of the actual situation of the prior art, and an object thereof is to provide a current sensor that can be miniaturized while maintaining insulation resistance.

この課題を解決するために、本発明の電流センサは、被測定電流の流れる電流路と、前記被測定電流によって発生する磁場を制御する磁界制御板と、長方形形状をした絶縁基板と、前記絶縁基板に搭載されていて、前記磁場を測定する磁気センサ素子と、前記絶縁基板に設けられ、前記磁気センサ素子と電気的に接続された複数の端子と、を備えた電流センサであって、複数の前記端子は、前記絶縁基板の一方の短辺である第１短辺に沿って配置され、前記電流路がＵ字状に折り曲げられており、前記電流路の両方の端部が前記絶縁基板の対向する両方の長辺に当接するように配置されていると共に、前記電流路の各端部の一方の側面が前記第１短辺と対向する第２短辺の付近に位置するように配置され、前記磁界制御板がＵ字状に折り曲げられており、前記磁界制御板の一方の端部である第１端部が前記第２短辺に当接するように配置されていて、前記磁気センサ素子は、前記磁界制御板の開口幅の中心に配置され、前記電流路の両方の端部には幅広部が形成されていると共に、前記電流路の前記磁気センサ素子の近傍には、前記幅広部より幅が狭い幅狭部が形成されており、前記幅狭部は、その幅が前記磁界制御板の開口幅よりも狭いと共に、前記磁気センサ素子と対向する位置に配置され、前記幅広部の中心が前記幅狭部の中心より前記第２短辺に近い、という特徴を有する。   In order to solve this problem, a current sensor according to the present invention includes a current path through which a current to be measured flows, a magnetic field control plate for controlling a magnetic field generated by the current to be measured, an insulating substrate having a rectangular shape, and the insulation A current sensor that is mounted on a substrate and includes a magnetic sensor element that measures the magnetic field, and a plurality of terminals that are provided on the insulating substrate and are electrically connected to the magnetic sensor element. The terminal is disposed along a first short side which is one short side of the insulating substrate, the current path is bent in a U-shape, and both ends of the current path are formed on the insulating substrate. Are arranged so as to be in contact with both opposing long sides of the current path, and arranged so that one side surface of each end portion of the current path is located in the vicinity of the second short side facing the first short side. The magnetic field control plate is bent in a U shape The magnetic sensor element is arranged such that a first end, which is one end of the magnetic field control plate, is in contact with the second short side, and the magnetic sensor element is a center of the opening width of the magnetic field control plate. A wide portion is formed at both ends of the current path, and a narrow portion narrower than the wide portion is formed in the vicinity of the magnetic sensor element of the current path. The narrow portion is narrower than the opening width of the magnetic field control plate, and is disposed at a position facing the magnetic sensor element, and the center of the wide portion is the second portion from the center of the narrow portion. It has the feature of being close to 2 short sides.

このように構成された電流センサは、複数の端子が絶縁基板の第１短辺に沿って配置され、電流路の両方の端部が絶縁基板の対向する両方の長辺に当接するように配置されていて、電流路の両方の端部に形成された幅広部の中心が、磁気センサ素子の近傍に形成された幅狭部の中心より第２短辺に近くなるように電流路を形成させたので、電流路と端子との間の距離をより長い距離に設定することができる。その結果、絶縁距離を確保することが容易にできるため、絶縁耐性を維持したままでの電流センサの小型化が容易に可能となる。   The current sensor thus configured is arranged such that a plurality of terminals are arranged along the first short side of the insulating substrate, and both ends of the current path are in contact with both opposing long sides of the insulating substrate. The current path is formed so that the center of the wide part formed at both ends of the current path is closer to the second short side than the center of the narrow part formed near the magnetic sensor element. Therefore, the distance between the current path and the terminal can be set to a longer distance. As a result, since it is possible to easily secure the insulation distance, it is possible to easily downsize the current sensor while maintaining the insulation resistance.

また、上記の構成において、樹脂製の筐体を備え、前記電流路の両方の端部の表面と前記磁界制御板の天面部の表面と前記絶縁基板の第１短辺の表面とが前記筐体の最大外形の内側面近傍にあると共に、外部に対して露出している、という特徴を有する。   Further, in the above configuration, a resin housing is provided, and the surfaces of both ends of the current path, the surface of the top surface of the magnetic field control plate, and the surface of the first short side of the insulating substrate are the housing. It is in the vicinity of the inner surface of the maximum outer shape of the body and is exposed to the outside.

このように構成された電流センサでは、電流路と磁界制御板と絶縁基板とからなる電流センサ主要部の外形が、電流路の両方の端部の先端部と複数の端子とを除いて、筐体の最大外形ぎりぎりに収まっていると共に、電流路、磁界制御板、及び絶縁基板５それぞれの一部の領域の表面が外部に対して露出している。そのため、電流路の両方の端部の先端部と複数の端子とを除く電流センサ主要部の外形と筐体の最大外形とがほぼ同一になる。その結果、筐体には余分な領域が含まれないため、電流センサをより小型化することができる。   In the current sensor configured as described above, the outer shape of the main part of the current sensor composed of the current path, the magnetic field control plate, and the insulating substrate is the same except for the tip of both ends of the current path and the plurality of terminals. In addition to being within the maximum outline of the body, the current paths, the magnetic field control plate, and the surfaces of some regions of the insulating substrate 5 are exposed to the outside. Therefore, the outer shape of the main part of the current sensor excluding the tip portions at both ends of the current path and the plurality of terminals is substantially the same as the maximum outer shape of the housing. As a result, since the extra area is not included in the housing, the current sensor can be further downsized.

また、上記の構成において、前記電流路の両方の端部の先端と、前記磁界制御板の両方の端部の先端と、が同一方向を向いている、という特徴を有する。   In the above configuration, the ends of both ends of the current path and the ends of both ends of the magnetic field control plate are directed in the same direction.

このように構成された電流センサでは、磁界制御板の開口方向において絶縁基板とマザー基板とが存在することになるため、磁気センサ素子と磁界制御板の開口方向側の下側隣接電流路との間の距離をより長い距離に設定することができ、磁気センサ素子に対する下側隣接電流路からの影響を受けにくくすることができる。   In the current sensor configured as described above, since the insulating substrate and the mother substrate exist in the opening direction of the magnetic field control plate, the magnetic sensor element and the lower adjacent current path on the opening direction side of the magnetic field control plate The distance between them can be set to a longer distance, and the magnetic sensor element can be hardly affected by the lower adjacent current path.

また、上記の構成において、前記電流路の両方の端部の先端は、複数の挿入片に分かれている、という特徴を有する。   In the above configuration, the ends of both ends of the current path are divided into a plurality of insertion pieces.

このように構成された電流センサでは、電流路の両方の端部の先端が複数の挿入片に分かれているので、電流センサをマザー基板に半田付けする際に、半田の熱を逃げにくくすることができる。そのため、半田付けをし易くすることができる。   In the current sensor configured as described above, since the tip of both ends of the current path is divided into a plurality of insertion pieces, it is difficult to escape the heat of the solder when the current sensor is soldered to the mother board. Can do. Therefore, soldering can be facilitated.

本発明の電流センサは、複数の端子が絶縁基板の第１短辺に沿って配置され、電流路の両方の端部が絶縁基板の対向する両方の長辺に当接するように配置されていて、電流路の両方の端部に形成された幅広部の中心が、磁気センサ素子の近傍に形成された幅狭部の中心より第２短辺に近くなるように電流路を形成させたので、電流路と端子との間の距離をより長い距離に設定することができる。その結果、絶縁距離を確保することが容易にできるため、絶縁耐性を維持したままでの電流センサの小型化が容易に可能となる。   In the current sensor of the present invention, a plurality of terminals are arranged along the first short side of the insulating substrate, and both ends of the current path are arranged so as to come into contact with both opposing long sides of the insulating substrate. The current path is formed so that the center of the wide portion formed at both ends of the current path is closer to the second short side than the center of the narrow portion formed in the vicinity of the magnetic sensor element. The distance between the current path and the terminal can be set to a longer distance. As a result, since it is possible to easily secure the insulation distance, it is possible to easily downsize the current sensor while maintaining the insulation resistance.

筐体を外した状態の電流センサ主要部の外観を示す斜視図である。It is a perspective view which shows the external appearance of the main part of the current sensor in the state where the housing is removed. 電流センサの外観を示す斜視図である。It is a perspective view which shows the external appearance of a current sensor. 電流センサ主要部の側面図である。It is a side view of the main part of a current sensor. 電流センサ主要部の側面図である。It is a side view of the main part of a current sensor. 電流センサ主要部の平面図である。It is a top view of the principal part of an electric current sensor. 電流センサ主要部の各構成要件間の距離を示す模式図である。It is a schematic diagram which shows the distance between each component requirements of the main part of an electric current sensor. 電流センサ主要部の各構成要件間の距離を示す模式図である。It is a schematic diagram which shows the distance between each component requirements of the main part of an electric current sensor. 従来例に係る電流センサの外観を示す斜視図である。It is a perspective view which shows the external appearance of the current sensor which concerns on a prior art example.

以下、本発明の実施形態について、図面を参照しながら説明する。尚、本明細書では、特に断りの無い限り、各図面のＸ１側を右側、Ｘ２側を左側、Ｙ１側を奥側、Ｙ２側を手前側、Ｚ１側を上側、Ｚ２側を下側として説明する。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the present specification, unless otherwise specified, the X1 side of each drawing is described as the right side, the X2 side as the left side, the Y1 side as the back side, the Y2 side as the near side, the Z1 side as the upper side, and the Z2 side as the lower side. To do.

実施形態に係る電流センサ１００の構成及び動作について図１乃至図６を用いて説明する。電流センサ１００は、各種機器に搭載され、制御や監視のために、該機器に流れる電流を測定する電流センサである。また、電流センサ１００は、電流センサ１００を搭載した機器に設けられたマザー基板５１上に取り付けられる。   The configuration and operation of the current sensor 100 according to the embodiment will be described with reference to FIGS. The current sensor 100 is a current sensor that is mounted on various devices and measures a current flowing through the device for control and monitoring. The current sensor 100 is attached on a mother board 51 provided in a device on which the current sensor 100 is mounted.

図１は、電流センサ１００から筐体１１を外した状態の電流センサ主要部９０の外観を示す斜視図であり、図２は、筐体１１を取り付けた状態の電流センサ１００の外観を示す斜視図である。また、図３は、電流センサ主要部９０を右側から見た場合の側面図であり、図４は、電流センサ主要部９０を手前側から見た場合の側面図である。図５は、電流センサ主要部９０の平面図である。図６は、電流センサ１００をマザー基板５１に搭載した状態での、電流センサ主要部９０の各構成要件間の左右方向における距離を示す模式図である。尚、図６では、説明を分かり易くするために電流路１を破線で示している。   FIG. 1 is a perspective view showing the external appearance of the current sensor main part 90 with the housing 11 removed from the current sensor 100, and FIG. 2 is a perspective view showing the external appearance of the current sensor 100 with the housing 11 attached. FIG. FIG. 3 is a side view when the current sensor main part 90 is viewed from the right side, and FIG. 4 is a side view when the current sensor main part 90 is viewed from the front side. FIG. 5 is a plan view of the main part 90 of the current sensor. FIG. 6 is a schematic diagram showing the distance in the left-right direction between the constituent elements of the current sensor main part 90 in a state where the current sensor 100 is mounted on the mother board 51. In FIG. 6, the current path 1 is indicated by a broken line for easy understanding.

図１に示すように、電流センサ主要部９０は、被測定電流の流れる電流路１と、被測定電流によって発生する磁場を制御する磁界制御板３と、長方形形状をした絶縁基板５と、絶縁基板５に搭載されていて、磁場を測定する磁気センサ素子７ａを内蔵したセンサＩＣ７と、を備えている。そして、絶縁基板５には、磁気センサ素子７ａと電気的に接続された複数の端子９が設けられている。複数の端子９は、絶縁基板５の一方の短辺である第１短辺５ａに沿って配置され、台座１３を介して絶縁基板５に取り付けられている。また、電流路１の両方の端部１ａの先端は、複数の挿入片１ｄに分かれている。   As shown in FIG. 1, the current sensor main part 90 includes a current path 1 through which a current to be measured flows, a magnetic field control plate 3 for controlling a magnetic field generated by the current to be measured, an insulating substrate 5 having a rectangular shape, The sensor IC 7 is mounted on the substrate 5 and includes a magnetic sensor element 7a for measuring a magnetic field. The insulating substrate 5 is provided with a plurality of terminals 9 electrically connected to the magnetic sensor element 7a. The plurality of terminals 9 are arranged along the first short side 5 a which is one short side of the insulating substrate 5, and are attached to the insulating substrate 5 via the pedestal 13. Further, the tips of both end portions 1a of the current path 1 are divided into a plurality of insertion pieces 1d.

図２に示すように、電流センサ１００は樹脂製の筐体１１を備えており、前述した電流路１と磁界制御板３と絶縁基板５とを含む電流センサ主要部９０が筐体１１内に収納され、接着剤等で取り付けられている。また、電流路１の両方の端部１ａの表面と磁界制御板３の天面部３ｃの表面と絶縁基板５の第１短辺５ａの表面とは、筐体１１の最大外形の内側面近傍にある。また、電流路１の両方の端部１ａの表面と磁界制御板３の天面部３ｃの表面と絶縁基板５の第１短辺５ａの表面とは、外部に対して露出している。   As shown in FIG. 2, the current sensor 100 includes a resin casing 11, and the current sensor main part 90 including the current path 1, the magnetic field control plate 3, and the insulating substrate 5 is contained in the casing 11. Housed and attached with adhesive or the like. Further, the surface of both end portions 1 a of the current path 1, the surface of the top surface portion 3 c of the magnetic field control plate 3, and the surface of the first short side 5 a of the insulating substrate 5 are in the vicinity of the inner surface of the maximum outer shape of the housing 11. is there. Further, the surfaces of both end portions 1a of the current path 1, the surface of the top surface portion 3c of the magnetic field control plate 3, and the surface of the first short side 5a of the insulating substrate 5 are exposed to the outside.

従って、電流路１と磁界制御板３と絶縁基板５とからなる電流センサ主要部９０が、挿入片１ｄと端子９とを除いて、筐体１１の最大外形ぎりぎりに収まっている。また、電流路１、磁界制御板３、及び絶縁基板５それぞれの一部の領域の表面が外部に対して露出している。そのため、挿入片１ｄと端子９とを除く電流センサ主要部９０の外形と筐体１１の最大外形とがほぼ同一になる。その結果、筐体１１には余分な領域が含まれないため、電流センサ１００をより小型化することができる。   Therefore, the main part 90 of the current sensor composed of the current path 1, the magnetic field control plate 3, and the insulating substrate 5 is within the maximum outline of the housing 11 except for the insertion piece 1 d and the terminal 9. Moreover, the surface of the partial area | region of each of the electric current path 1, the magnetic field control board 3, and the insulated substrate 5 is exposed with respect to the exterior. Therefore, the outer shape of the main part 90 of the current sensor excluding the insertion piece 1d and the terminal 9 and the maximum outer shape of the housing 11 are substantially the same. As a result, the casing 11 does not include an extra area, and thus the current sensor 100 can be further downsized.

電流路１は、図３に示すように、Ｕ字状に折り曲げられており、電流路１の両方の端部１ａが絶縁基板５の対向する両方の長辺５ｃに当接するように配置されている。そして、電流路１の各端部１ａの一方の側面が図４に示すように、絶縁基板５の、第１短辺５ａと対向する第２短辺５ｂの付近に位置するように配置されている。また、図１及び図５に示すように、電流路１の両方の端部１ａには、幅広部１ｂが形成されていると共に、電流路１の磁気センサ素子７ａの近傍には、幅広部１ｂより幅が狭い幅狭部１ｃが形成されている。   As shown in FIG. 3, the current path 1 is bent in a U shape, and is arranged so that both end portions 1 a of the current path 1 abut on both opposing long sides 5 c of the insulating substrate 5. Yes. As shown in FIG. 4, one side surface of each end 1a of the current path 1 is disposed so as to be positioned in the vicinity of the second short side 5b facing the first short side 5a of the insulating substrate 5. Yes. As shown in FIGS. 1 and 5, wide portions 1 b are formed at both ends 1 a of the current path 1, and the wide portion 1 b is located near the magnetic sensor element 7 a of the current path 1. A narrower portion 1c having a narrower width is formed.

前述したように、電流路１の両方の端部１ａの先端は複数の挿入片１ｄに分かれている。図４に示す各挿入片１ｄは、マザー基板５１に設けられた取り付け穴（図示せず）に挿入され、マザー基板５１に半田によって取り付けられる。このように、電流路１の両方の端部１ａの先端が複数の挿入片４ｄに分かれているので、電流センサ１００をマザー基板５１に半田付けする際に、半田の熱が挿入片４ｄに伝わりやすく、しかも幅広部１ｂへ半田の熱を逃げにくくすることができる。   As described above, the tips of both ends 1a of the current path 1 are divided into a plurality of insertion pieces 1d. Each insertion piece 1d shown in FIG. 4 is inserted into an attachment hole (not shown) provided in the mother board 51 and attached to the mother board 51 by soldering. As described above, since the tips of both end portions 1a of the current path 1 are divided into the plurality of insertion pieces 4d, when soldering the current sensor 100 to the mother board 51, the heat of the solder is transmitted to the insertion pieces 4d. It is easy to make it difficult for the heat of the solder to escape to the wide portion 1b.

図３及び図４に示すように、複数の端子９は、電子回路（図示せず）が搭載されているマザー基板５１に設けられた取り付け穴（図示せず）に挿入され、電流路１と同時に半田によって取り付けられる。その結果、磁気センサ素子７ａが、複数の端子９を介してマザー基板５１に搭載されている電子回路に接続される。   As shown in FIGS. 3 and 4, the plurality of terminals 9 are inserted into mounting holes (not shown) provided in a mother board 51 on which an electronic circuit (not shown) is mounted. At the same time, it is attached by solder. As a result, the magnetic sensor element 7 a is connected to an electronic circuit mounted on the mother substrate 51 through the plurality of terminals 9.

磁界制御板３は、図４に示すように、Ｕ字状に折り曲げられており、磁界制御板３の一方の端部である第１端部３ａが絶縁基板５の第２短辺５ｂに当接するように配置される。一方、磁界制御板３の他方の端部である第２端部３ｂは、図１及び図４に示すように、絶縁基板５に設けられた取り付け穴５ｄに挿入されている。第２端部３ｂが、絶縁基板５の取り付け穴５ｄに挿入されることによって、絶縁基板５に対する磁界制御板３の位置が決定することになる。尚、磁界制御板３は、絶縁基板５に取り付けられているが、図４に示すように、マザー基板５１には取り付けられない。   As shown in FIG. 4, the magnetic field control plate 3 is bent in a U shape, and the first end 3 a, which is one end of the magnetic field control plate 3, contacts the second short side 5 b of the insulating substrate 5. Arranged to touch. On the other hand, the second end 3b which is the other end of the magnetic field control plate 3 is inserted into a mounting hole 5d provided in the insulating substrate 5, as shown in FIGS. By inserting the second end 3 b into the mounting hole 5 d of the insulating substrate 5, the position of the magnetic field control plate 3 with respect to the insulating substrate 5 is determined. Although the magnetic field control plate 3 is attached to the insulating substrate 5, it is not attached to the mother substrate 51 as shown in FIG.

磁界制御板３は、高透磁率で飽和磁束密度の大きい磁性材で構成されており、図４及び図５に示すように、電流路１の幅狭部１ｃ及び磁気センサ素子７ａを上側から覆っている。磁界制御板３は、電流路１による磁場を磁気センサ７ａの周辺に集中させる働きをすると共に、外部磁場を弱めて磁気センサ素子７ａを磁気シールドする働きもある。   The magnetic field control plate 3 is made of a magnetic material having a high magnetic permeability and a high saturation magnetic flux density, and covers the narrow portion 1c of the current path 1 and the magnetic sensor element 7a from above as shown in FIGS. ing. The magnetic field control plate 3 functions to concentrate the magnetic field generated by the current path 1 around the magnetic sensor 7a, and also serves to shield the magnetic sensor element 7a by weakening the external magnetic field.

センサＩＣ７に内蔵されている磁気センサ素子７ａの、手前側から奥側への方向（Ｙ１−Ｙ２方向）における位置は、図５に示すように、磁界制御板３の手前側から奥側への方向における開口幅Ｄ１の中心位置に設定されている。一方、磁気センサ素子７ａの左右方向（Ｘ１−Ｘ２方向）における位置は、図６に示すように、磁界制御板３の左右方向における開口幅Ｄ２の中心位置に設定されている。言い換えれば、磁気センサ素子７ａを含むセンサＩＣ７は、磁気センサ素子７ａの位置が磁界制御板３の長方形形状をした開口部の中心位置になるように載置される。その結果、磁気センサ素子７ａの左右方向における取り付け位置を示す中心線Ｃ１は、磁界制御板３の左右方向における開口幅Ｄ２を２分割する位置になる。   The position of the magnetic sensor element 7a built in the sensor IC 7 in the direction from the near side to the far side (Y1-Y2 direction) is from the near side to the far side of the magnetic field control plate 3, as shown in FIG. It is set to the center position of the opening width D1 in the direction. On the other hand, the position in the left-right direction (X1-X2 direction) of the magnetic sensor element 7a is set to the center position of the opening width D2 in the left-right direction of the magnetic field control plate 3, as shown in FIG. In other words, the sensor IC 7 including the magnetic sensor element 7 a is placed so that the position of the magnetic sensor element 7 a is the center position of the rectangular opening of the magnetic field control plate 3. As a result, the center line C1 indicating the mounting position of the magnetic sensor element 7a in the left-right direction is a position that divides the opening width D2 of the magnetic field control plate 3 in the left-right direction into two.

磁気センサ素子７ａは、電流路１に流れる被測定電流から生じる磁界を感知し、その磁界強度の値によって電流路１に流れる被測定電流の値を決定する。この被測定電流の値は、複数の端子９を介してマザー基板５１に搭載されている電子回路（図示せず）に伝送され、各種制御等に使用される。   The magnetic sensor element 7a senses the magnetic field generated from the current to be measured flowing in the current path 1, and determines the value of the current to be measured flowing in the current path 1 based on the value of the magnetic field strength. The value of the current to be measured is transmitted to an electronic circuit (not shown) mounted on the mother board 51 through a plurality of terminals 9 and used for various controls.

図１、図５及び図６に示すように、また、前述したように、電流路１の両方の端部１ａには、幅広部１ｂが形成されていると共に、電流路１の磁気センサ素子７ａの近傍には、幅広部１ｂより幅が狭い幅狭部１ｃが形成されている。ここで、幅広部１ｂの幅は幅Ｄ３に設定され、幅狭部１ｃの幅は幅Ｄ４に設定されている。そして、幅狭部１ｃは、図６に示すように、磁気センサ素子７ａの上方で、磁気センサ素子７ａと対向する位置に配置されている。   As shown in FIGS. 1, 5 and 6, and as described above, wide end portions 1b are formed at both ends 1a of the current path 1, and the magnetic sensor element 7a of the current path 1 is formed. Is formed with a narrow portion 1c having a width smaller than that of the wide portion 1b. Here, the width of the wide portion 1b is set to the width D3, and the width of the narrow portion 1c is set to the width D4. And as shown in FIG. 6, the narrow part 1c is arrange | positioned in the position facing the magnetic sensor element 7a above the magnetic sensor element 7a.

電流路１において幅広部１ｂ以外に幅広部１ｂより幅の狭い幅狭部１ｃを形成させることによって、幅狭部１ｃにおける磁場を強めることができる。また、幅狭部１ｃは、電流路１に流れる被測定電流の、所定の電流値に対する磁束密度が所定の値になるように、その幅Ｄ４及び取り付け位置が設定される。例えば、被測定電流が１００Ａの時に磁束密度が１８ｍＴになるように幅Ｄ４及び取り付け位置が設定される。   By forming the narrow part 1c narrower than the wide part 1b in addition to the wide part 1b in the current path 1, the magnetic field in the narrow part 1c can be strengthened. Further, the width D4 and the attachment position of the narrow portion 1c are set so that the magnetic flux density with respect to a predetermined current value of the current to be measured flowing in the current path 1 becomes a predetermined value. For example, the width D4 and the attachment position are set so that the magnetic flux density is 18 mT when the measured current is 100A.

電流路１の幅狭部１ｃの幅Ｄ４は、磁界制御板３の左右方向（Ｘ１−Ｘ２方向）における開口幅Ｄ２よりも狭い。また、図６に示すように、幅狭部１ｃの中心位置を示す中心線Ｃ２は、磁気センサ素子７ａの中心位置を示す中心線Ｃ１と同一の、磁界制御板３の左右方向における開口幅Ｄ２を２分割する位置にある。言い換えれば、幅狭部１ｃの中心の位置は、磁気センサ素子７ａの中心の位置と同様に、磁界制御板３の第１端部３ａの内側の面、即ち絶縁基板５の第２短辺５ｂからＤ２／２の距離にある。   The width D4 of the narrow portion 1c of the current path 1 is narrower than the opening width D2 of the magnetic field control plate 3 in the left-right direction (X1-X2 direction). As shown in FIG. 6, the center line C2 indicating the center position of the narrow portion 1c is the same as the center line C1 indicating the center position of the magnetic sensor element 7a, and the opening width D2 in the left-right direction of the magnetic field control plate 3 is the same. Is in a position where it is divided into two. In other words, the center position of the narrow portion 1c is the inner surface of the first end 3a of the magnetic field control plate 3, that is, the second short side 5b of the insulating substrate 5 in the same manner as the center position of the magnetic sensor element 7a. To D2 / 2.

一方、幅広部１ｂの左右方向における幅Ｄ３を２分割する中心線Ｃ３は、図６に示すように、電流路１の幅狭部１ｃの取り付け位置を示す中心線Ｃ２より右側にある。即ち、幅広部１ｂの中心は幅狭部１ｃの中心より絶縁基板５の第２短辺５ｂに近い。   On the other hand, the center line C3 that divides the width D3 in the left-right direction of the wide portion 1b into two is on the right side of the center line C2 that indicates the attachment position of the narrow portion 1c of the current path 1, as shown in FIG. That is, the center of the wide portion 1b is closer to the second short side 5b of the insulating substrate 5 than the center of the narrow portion 1c.

ところで、大電流の流れる電流センサ１００において、電流路１は電源の１次側とみなされ、複数の端子９は電源の２次側とみなされる。電源の１次側と２次側との間の距離は、決められた絶縁距離以上に保たれていなければならない。従って、電流路１においても、電源の１次側と電源の２次側との間の距離を決められた絶縁距離以上に設定するため、図６に示す電流路１の複数の挿入片１ｄの内の最も端子９に近い挿入片１ｄと端子９との間の距離Ｔ１を、必要な絶縁距離以上に設定している。その結果、電流センサ１００は、絶縁耐性を維持することができる。   By the way, in the current sensor 100 through which a large current flows, the current path 1 is regarded as the primary side of the power source, and the plurality of terminals 9 are regarded as the secondary side of the power source. The distance between the primary side and the secondary side of the power supply must be kept above a predetermined insulation distance. Therefore, also in the current path 1, in order to set the distance between the primary side of the power source and the secondary side of the power source to be equal to or greater than the determined insulation distance, the plurality of insertion pieces 1d of the current path 1 shown in FIG. A distance T1 between the insertion piece 1d closest to the terminal 9 and the terminal 9 is set to be equal to or greater than a necessary insulation distance. As a result, the current sensor 100 can maintain insulation resistance.

前述したように、電流路１の幅広部１ｂの左右方向（Ｘ１−Ｘ２方向）における中心の位置は、幅狭部１ｃの中心の位置より絶縁基板５の第２短辺５ｂに近い位置に設定されている。このように設定することによって、幅広部１ｂの中心の位置を幅狭部１ｃの中心の位置と同一の位置に設定した場合に比較して、電流路１の複数の挿入片１ｄの内の最も端子９に近い挿入片１ｄと端子９との間の距離Ｔ１をより長い距離に設定することが容易になる。従って、必要な絶縁距離を確保することが容易にできる。   As described above, the center position of the wide portion 1b of the current path 1 in the left-right direction (X1-X2 direction) is set closer to the second short side 5b of the insulating substrate 5 than the center position of the narrow portion 1c. Has been. By setting in this way, compared to the case where the center position of the wide portion 1b is set to the same position as the center position of the narrow portion 1c, the most of the plurality of insertion pieces 1d of the current path 1 is the same. It becomes easy to set the distance T1 between the insertion piece 1d close to the terminal 9 and the terminal 9 to a longer distance. Therefore, it is possible to easily secure a necessary insulation distance.

このように、電流センサ１００では、複数の端子９が絶縁基板５の第１短辺５ａに沿って配置され、電流路１の両方の端部１ａが絶縁基板５の対向する両方の長辺５ｃに当接するように配置されていて、電流路１の両方の端部１ａに形成された幅広部１ｂの中心が、磁気センサ素子７ａの近傍に形成された幅狭部１ｃの中心より絶縁基板５の第２短辺５ｂに近くなるように電流路１を形成させたので、電流路１と端子９との間の距離をより長い距離に設定することが容易になる。その結果、必要な絶縁距離を確保することが容易にできるため、絶縁耐性を維持したままでの電流センサ１００の小型化が容易に可能となる。   As described above, in the current sensor 100, the plurality of terminals 9 are arranged along the first short side 5 a of the insulating substrate 5, and both end portions 1 a of the current path 1 are both long sides 5 c of the insulating substrate 5 facing each other. The center of the wide portion 1b formed at both end portions 1a of the current path 1 is in contact with the insulating substrate 5 from the center of the narrow portion 1c formed near the magnetic sensor element 7a. Since the current path 1 is formed so as to be close to the second short side 5b, it is easy to set the distance between the current path 1 and the terminal 9 to a longer distance. As a result, since it is possible to easily secure a necessary insulation distance, it is possible to easily reduce the size of the current sensor 100 while maintaining insulation resistance.

また、電流路１と磁界制御板３と絶縁基板５とからなる電流センサ主要部９０が、挿入片１ｄと端子９とを除いて、筐体１１の最大外形ぎりぎりに収まっている。そのため、挿入片１ｄと端子９とを除く電流センサ主要部９０の外形と筐体１１の最大外形とがほぼ同一になる。その結果、筐体１１には余分な領域が含まれないため、電流センサ１００をより小型化することができる。   The main part 90 of the current sensor including the current path 1, the magnetic field control plate 3, and the insulating substrate 5 is within the maximum outer shape of the housing 11 except for the insertion piece 1 d and the terminal 9. Therefore, the outer shape of the main part 90 of the current sensor excluding the insertion piece 1d and the terminal 9 and the maximum outer shape of the housing 11 are substantially the same. As a result, the casing 11 does not include an extra area, and thus the current sensor 100 can be further downsized.

また、電流路１の両方の端部１ａの先端が複数の挿入片１ｄに分かれているので、電流センサ１００をマザー基板５１に半田付けする際に、半田の熱が挿入片４ｄに伝わりやすく、しかも幅広部１ｂへ半田の熱を逃げにくくすることができる。そのため、半田付けをし易くすることができる。   Further, since the tips of both end portions 1a of the current path 1 are divided into a plurality of insertion pieces 1d, when soldering the current sensor 100 to the mother board 51, the heat of the solder is easily transmitted to the insertion pieces 4d. Moreover, it is possible to make it difficult for heat of the solder to escape to the wide portion 1b. Therefore, soldering can be facilitated.

次に、実施形態に係る電流センサ１００と、電流センサ１００より外側に存在する可能性のある上側隣接電流路３１及び下側隣接電流路３２と、の関係について図７を用いて説明する。   Next, the relationship between the current sensor 100 according to the embodiment and the upper adjacent current path 31 and the lower adjacent current path 32 that may exist outside the current sensor 100 will be described with reference to FIG.

図７は、電流センサ１００をマザー基板５１に搭載した状態での、電流センサ主要部９０の各構成要件間の上下方向における距離を示す模式図である。尚、説明を分かり易くするために電流路１を破線で示している。   FIG. 7 is a schematic diagram illustrating the distance in the vertical direction between the constituent elements of the current sensor main portion 90 in a state where the current sensor 100 is mounted on the mother board 51. Note that the current path 1 is indicated by a broken line for easy understanding.

電流センサ１００の外側には外部磁場を生成させている上側隣接電流路３１及び又は下側隣接電流路３２が存在することがある。上側隣接電流路３１は、磁界制御板３の上方に距離Ａ１を隔てて存在している。また、下側隣接電流路３２は、電流路１の挿入片１ｄの先端との間に距離Ａ２を隔てて存在している。通常、電流センサ１００の上側及び下側に隣接電流路が存在する場合、上記距離Ａ１と距離Ａ２とは同一の距離に設定される。   There may be an upper adjacent current path 31 and / or a lower adjacent current path 32 that generate an external magnetic field outside the current sensor 100. The upper adjacent current path 31 exists above the magnetic field control plate 3 with a distance A1. Further, the lower adjacent current path 32 exists at a distance A2 from the tip of the insertion piece 1d of the current path 1. Usually, when adjacent current paths exist above and below the current sensor 100, the distance A1 and the distance A2 are set to the same distance.

磁気センサ素子７ａと上側隣接電流路３１との間は、距離Ａ１を含んで距離Ｂ１だけ離れている。また、磁気センサ素子７ａと上側隣接電流路３１との間には磁界制御板３がある。従って、磁界制御板３によって磁気センサ素子７ａへの上側隣接電流路３１からの影響を受けにくくすることができる。   The magnetic sensor element 7a and the upper adjacent current path 31 are separated by a distance B1 including the distance A1. There is a magnetic field control plate 3 between the magnetic sensor element 7 a and the upper adjacent current path 31. Therefore, the magnetic field control plate 3 can make it difficult to be affected by the upper adjacent current path 31 to the magnetic sensor element 7a.

一方、磁気センサ素子７ａと下側隣接電流路３２との間は、距離Ａ２を含んで距離Ｂ２だけ離れている。ここで、電流路１の両方の端部１ａにある挿入片１ｄの先端と、磁界制御板３の両方の端部、即ち第１端部３ａ及び第２端部３ｂの先端とが、どちらも同一方向（下方）を向いている。従って、磁気センサ素子７ａと下側隣接電流路３２との間には、センサＩＣ７と磁界制御板３が取り付けられている絶縁基板５、及び電流センサ１００が取り付けられているマザー基板５１が存在することになる。   On the other hand, the magnetic sensor element 7a and the lower adjacent current path 32 are separated by a distance B2 including the distance A2. Here, both the tip of the insertion piece 1d at both ends 1a of the current path 1 and both ends of the magnetic field control plate 3, that is, the tips of the first end 3a and the second end 3b, It faces the same direction (downward). Therefore, between the magnetic sensor element 7a and the lower adjacent current path 32, there is an insulating substrate 5 to which the sensor IC 7 and the magnetic field control plate 3 are attached, and a mother substrate 51 to which the current sensor 100 is attached. It will be.

磁気センサ素子７ａと下側隣接電流路３２との間には、磁界制御板３は存在しないが、絶縁基板５及びマザー基板５１が存在するため、必然的に磁気センサ素子７ａと下側隣接電流路３２との間の距離Ｂ２をより長い距離に設定することができる。その結果、磁気センサ素子７ａへの下側隣接電流路３２からの影響をより受けにくくすることができる。尚、距離Ｂ２は距離Ｂ１の２倍程度に設定される。距離Ｂ２を距離Ｂ１の２倍程度に設定することにより、磁気センサ素子７ａへの下側隣接電流路３２からの影響を、磁気センサ素子７ａへの上側隣接電流路３１からの影響と同等程度までに受けにくくすることができる。   There is no magnetic field control plate 3 between the magnetic sensor element 7a and the lower adjacent current path 32. However, since the insulating substrate 5 and the mother substrate 51 exist, the magnetic sensor element 7a and the lower adjacent current path inevitably exist. The distance B2 between the road 32 can be set to a longer distance. As a result, the magnetic sensor element 7a can be less affected by the lower adjacent current path 32. The distance B2 is set to about twice the distance B1. By setting the distance B2 to be about twice the distance B1, the influence from the lower adjacent current path 32 to the magnetic sensor element 7a is reduced to the same level as the influence from the upper adjacent current path 31 to the magnetic sensor element 7a. Can be difficult to receive.

このように、電流センサ１００では、電流路１の両方の端部１ａの先端と、磁界制御板３の両方の端部、即ち第１端部３ａ及び第２端部３ｂの先端とが、同一方向を向いているので、磁界制御板３の開口方向において絶縁基板５とマザー基板５１とが存在することになる。そのため、磁気センサ素子７ａと磁界制御板３の開口方向側の下側隣接電流路３２との間の距離をより長い距離に設定することができ、磁気センサ素子７ａに対する下側隣接電流路３２からの影響を受けにくくすることができる。   Thus, in the current sensor 100, the tips of both ends 1a of the current path 1 and the tips of both ends of the magnetic field control plate 3, that is, the tips of the first end 3a and the second end 3b are the same. Therefore, the insulating substrate 5 and the mother substrate 51 exist in the opening direction of the magnetic field control plate 3. Therefore, the distance between the magnetic sensor element 7a and the lower adjacent current path 32 on the opening direction side of the magnetic field control plate 3 can be set to a longer distance, and from the lower adjacent current path 32 to the magnetic sensor element 7a. Can be less affected by

以上説明したように、本発明の電流センサは、複数の端子が絶縁基板の第１短辺に沿って配置され、電流路の両方の端部が絶縁基板の対向する両方の長辺に当接するように配置されていて、電流路の両方の端部に形成された幅広部の中心が、磁気センサ素子の近傍に形成された幅狭部の中心より第２短辺に近くなるように電流路を形成させたので、電流路と端子との間の距離をより長い距離に設定することができる。その結果、絶縁距離を確保することが容易にできるため、絶縁耐性を維持したままでの電流センサの小型化が容易に可能となる。   As described above, in the current sensor of the present invention, the plurality of terminals are arranged along the first short side of the insulating substrate, and both ends of the current path are in contact with both opposing long sides of the insulating substrate. The center of the wide part formed at both ends of the current path is closer to the second short side than the center of the narrow part formed near the magnetic sensor element. Thus, the distance between the current path and the terminal can be set to a longer distance. As a result, since it is possible to easily secure the insulation distance, it is possible to easily downsize the current sensor while maintaining the insulation resistance.

以上のように、本発明の実施形態に係る電流センサ１００について説明したが、本発明は上記の実施形態に限定されるものではなく、要旨を逸脱しない範囲で種々変更して実施することが可能である。   As described above, the current sensor 100 according to the embodiment of the present invention has been described. However, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. It is.

１ 電流路
１ａ 端部
１ｂ 幅広部
１ｃ 幅狭部
１ｄ 挿入片
３ 磁界制御板
３ａ 第１端部
３ｂ 第２端部
３ｃ 天面部
５ 絶縁基板
５ａ 第１短辺
５ｂ 第２短辺
５ｃ 長辺
５ｄ 取り付け穴
７ センサＩＣ
７ａ 磁気センサ素子
９ 端子
１１ 筐体
１３ 台座
３１ 上側隣接電流路
３２ 下側隣接電流路
５１ マザー基板
９０ 電流センサ主要部
１００ 電流センサ

DESCRIPTION OF SYMBOLS 1 Current path 1a End part 1b Wide part 1c Narrow part 1d Insertion piece 3 Magnetic field control board 3a 1st end part 3b 2nd end part 3c Top surface part 5 Insulating substrate 5a 1st short side 5b 2nd short side 5c Long side 5d Mounting hole 7 Sensor IC
7a Magnetic sensor element 9 Terminal 11 Housing 13 Base 31 Upper adjacent current path 32 Lower adjacent current path 51 Mother board 90 Current sensor main part 100 Current sensor

Claims (4)

被測定電流の流れる電流路と、前記被測定電流によって発生する磁場を制御する磁界制御板と、長方形形状をした絶縁基板と、前記絶縁基板に搭載されていて、前記磁場を測定する磁気センサ素子と、前記絶縁基板に設けられ、前記磁気センサ素子と電気的に接続された複数の端子と、を備えた電流センサであって、
複数の前記端子は、前記絶縁基板の一方の短辺である第１短辺に沿って配置され、
前記電流路がＵ字状に折り曲げられており、前記電流路の両方の端部が前記絶縁基板の対向する両方の長辺に当接するように配置されていると共に、前記電流路の各端部の一方の側面が前記第１短辺と対向する第２短辺の付近に位置するように配置され、
前記磁界制御板がＵ字状に折り曲げられており、前記磁界制御板の一方の端部である第１端部が前記第２短辺に当接するように配置されていて、
前記磁気センサ素子は、前記磁界制御板の開口幅の中心に配置され、
前記電流路の両方の端部には幅広部が形成されていると共に、前記電流路の前記磁気センサ素子の近傍には、前記幅広部より幅が狭い幅狭部が形成されており、前記幅狭部は、その幅が前記磁界制御板の開口幅よりも狭いと共に、前記磁気センサ素子と対向する位置に配置され、前記幅広部の中心が前記幅狭部の中心より前記第２短辺に近い、ことを特徴とする電流センサ。 A current path through which a current to be measured flows, a magnetic field control plate that controls a magnetic field generated by the current to be measured, a rectangular insulating substrate, and a magnetic sensor element that is mounted on the insulating substrate and measures the magnetic field And a plurality of terminals provided on the insulating substrate and electrically connected to the magnetic sensor element, and a current sensor comprising:
The plurality of terminals are arranged along a first short side which is one short side of the insulating substrate,
The current path is bent in a U-shape, and both ends of the current path are disposed so as to abut both opposing long sides of the insulating substrate, and each end of the current path Is disposed such that one side surface thereof is located in the vicinity of the second short side facing the first short side,
The magnetic field control plate is bent in a U shape, and a first end that is one end of the magnetic field control plate is disposed so as to abut on the second short side,
The magnetic sensor element is disposed at the center of the opening width of the magnetic field control plate,
A wide part is formed at both ends of the current path, and a narrow part narrower than the wide part is formed in the vicinity of the magnetic sensor element of the current path. The narrow portion has a width narrower than the opening width of the magnetic field control plate and is disposed at a position facing the magnetic sensor element, and the center of the wide portion is closer to the second short side than the center of the narrow portion. A current sensor characterized by being close. 樹脂製の筐体を備え、
前記電流路の両方の端部の表面と前記磁界制御板の天面部の表面と前記絶縁基板の第１短辺の表面とが前記筐体の最大外形の内側面近傍にあると共に、外部に対して露出している、ことを特徴とする請求項１に記載の電流センサ。 It has a resin housing,
The surface of both ends of the current path, the surface of the top surface portion of the magnetic field control plate, and the surface of the first short side of the insulating substrate are in the vicinity of the inner surface of the maximum outer shape of the housing, and to the outside The current sensor according to claim 1, wherein the current sensor is exposed. 前記電流路の両方の端部の先端と、前記磁界制御板の両方の端部の先端と、が同一方向を向いている、ことを特徴とする請求項１又は請求項２に記載の電流センサ。   3. The current sensor according to claim 1, wherein the leading ends of both ends of the current path and the leading ends of both ends of the magnetic field control plate face the same direction. 4. . 前記電流路の両方の端部の先端は、複数の挿入片に分かれている、ことを特徴とする請求項１乃至請求項３の何れかに記載の電流センサ。
The current sensor according to claim 1, wherein tips of both ends of the current path are divided into a plurality of insertion pieces.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021070833A1 (en) * 2019-10-08 2021-04-15
JP7242887B2 (en) 2019-10-08 2023-03-20 アルプスアルパイン株式会社 current detector

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