JP2016001709A - 固体撮像装置の製造方法 - Google Patents
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- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
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- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
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- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
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Abstract
Description
(1)ゲート電極膜18の下にあるゲート絶縁膜17とのエッチング選択比を確保してゲート絶縁膜17でエッチングをストップさせること。
(2)ゲート電極G1、G2を目標寸法範囲内に制御すること。
(3)ゲート電極膜18のエッチング残渣が発生しやすい活性領域と素子分離の境界部分においてエッチング残渣が発生しないこと。
Claims (15)
- 画素部および周辺回路部を有する固体撮像装置の製造方法であって、
前記画素部の第1素子分離および第1活性領域を半導体基板に形成するとともに前記周辺回路部の第2素子分離および第2活性領域を前記半導体基板に形成する工程と、
前記第1素子分離、前記第1活性領域、前記第2素子分離および前記第2活性領域を覆うようにゲート電極膜を形成する工程と、
前記ゲート電極膜のうち前記画素部に対応する部分の少なくとも一部分に対して選択的にn型不純物を注入する工程と、
前記n型不純物を注入する前記工程の後に、前記ゲート電極膜のパターニングを行うことにより前記画素部の第1ゲート電極および前記周辺回路部の第2ゲート電極を形成する工程と、を含み、
前記少なくとも一部分は、前記第1素子分離と前記第1活性領域との境界部分の上に位置する部分を含む、
ことを特徴とする固体撮像装置の製造方法。 - 前記第1ゲート電極および前記第2ゲート電極を形成する前記工程の後に、前記第2ゲート電極に不純物を注入する工程を更に含む、
ことを特徴とする請求項1に記載の固体撮像装置の製造方法。 - 前記第2ゲート電極に不純物を注入する前記工程において、前記第2ゲート電極を含むMOSトランジスタのソースおよびドレインとなるべき領域にも不純物が注入される、
ことを特徴とする請求項2に記載の固体撮像装置の製造方法。 - 前記n型不純物を注入する前記工程において、前記ゲート電極膜のうち前記画素部に対応する部分の全域に前記n型不純物が注入される、
ことを特徴とする請求項1乃至3のいずれか1項に記載の固体撮像装置の製造方法。 - 前記第1ゲート電極および前記第2ゲート電極を形成する前記工程の後に、前記第1ゲート電極および前記第2ゲート電極が形成された前記半導体基板を覆う絶縁膜を形成する工程と、
前記絶縁膜のうち前記画素部に対応する部分、および、前記第2ゲート電極の側面にサイドスペーサを構成する部分が残るように前記絶縁膜をエッチングする工程と、
前記絶縁膜をエッチングする前記工程の後に、前記第2ゲート電極を含むMOSトランジスタのソースおよびドレインとなるべき領域に不純物を注入する工程と、
を更に含むことを特徴とする請求項1乃至4のいずれか1項に記載の固体撮像装置の製造方法。 - 前記第2ゲート電極を含むMOSトランジスタのソースおよびドレインとなるべき領域に不純物を注入する前記工程では、前記第1ゲート電極、および、前記半導体基板のうち前記画素部に対応する部分には不純物が注入されない、
ことを特徴とする請求項5に記載の固体撮像装置の製造方法。 - 前記画素部は、複数の第1ゲート電極を有し、
前記少なくとも一部分は、前記画素部の前記複数の第1ゲート電極の少なくとも1つの第1ゲート電極となるべき部分の少なくとも一部を更に含む、
ことを特徴とする請求項1乃至6のいずれか1項に記載の固体撮像装置の製造方法。 - 前記少なくとも1つの第1ゲート電極は、増幅MOSトランジスタのゲート電極を含む、
ことを特徴とする請求項7に記載の固体撮像装置の製造方法。 - 前記ゲート電極膜を形成する工程では、前記ゲート電極膜としてノンドープの半導体膜を形成する、
ことを特徴とする請求項1乃至8のいずれか1項に記載の固体撮像装置の製造方法。 - 前記第1素子分離および前記第2素子分離は、STI(Shallow Trench Isolation)である、
ことを特徴とする請求項1乃至9のいずれか1項に記載の固体撮像装置の製造方法。 - 前記ゲート電極膜を形成する工程の前に、前記画素部の第1ゲート絶縁膜および前記周辺回路部の第2ゲート絶縁膜を形成する工程を含み、
前記第1ゲート絶縁膜は、前記第2ゲート絶縁膜より厚い、
ことを特徴とする請求項1乃至10のいずれか1項に記載の固体撮像装置の製造方法。 - 前記画素部のMOSトランジスタは、シングルドレイン構造を有し、前記周辺回路部のMOSトランジスタは、LDD構造(Lightly Doped Drain)構造を有する、
ことを特徴とする請求項1乃至11のいずれか1項に記載の固体撮像装置の製造方法。 - 前記周辺回路部のMOSトランジスタは、金属半導体化合物層を有し、前記画素部のMOSトランジスタは、前記金属半導体化合物層と同じ金属成分を含む金属半導体化合物層を有しない、
ことを特徴とする請求項1乃至12のいずれか1項に記載の固体撮像装置の製造方法。 - 前記周辺回路部は、抵抗素子を含み、
前記n型不純物を注入する前記工程において、前記抵抗素子となるべき部分にも前記n型不純物が注入される、
ことを特徴とする請求項1乃至13のいずれか1項に記載の固体撮像装置の製造方法。 - 前記ゲート電極膜のうち前記第1素子分離と前記第1活性領域との境界部分の上に位置する部分とは異なる部分にp型不純物を注入する工程を更に含む、
ことを特徴とする請求項1乃至14のいずれか1項に記載の固体撮像装置の製造方法。
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WO2021152943A1 (ja) * | 2020-01-30 | 2021-08-05 | パナソニックIpマネジメント株式会社 | 撮像装置 |
WO2023276744A1 (ja) * | 2021-06-30 | 2023-01-05 | パナソニックIpマネジメント株式会社 | 撮像装置及びその製造方法 |
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US9935140B2 (en) | 2015-05-19 | 2018-04-03 | Canon Kabushiki Kaisha | Solid state imaging device, manufacturing method of solid state imaging device, and imaging system |
KR20170084519A (ko) * | 2016-01-12 | 2017-07-20 | 삼성전자주식회사 | 이미지 센서 |
JP2017183668A (ja) * | 2016-03-31 | 2017-10-05 | キヤノン株式会社 | 固体撮像装置の製造方法 |
CN115207003A (zh) * | 2021-04-09 | 2022-10-18 | 和鑫光电股份有限公司 | 光感测装置的光感测单元 |
CN114300581B (zh) * | 2021-12-31 | 2024-05-17 | 北海惠科半导体科技有限公司 | 光敏元件的制备方法及半导体器件 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012528A (ja) * | 1998-06-26 | 2000-01-14 | Sony Corp | 段差部を覆う膜のエッチング方法 |
JP2007027705A (ja) * | 2005-07-11 | 2007-02-01 | Samsung Electronics Co Ltd | イメージセンサ及びその製造方法 |
JP2007158031A (ja) * | 2005-12-05 | 2007-06-21 | Sony Corp | 固体撮像装置 |
JP2007207828A (ja) * | 2006-01-31 | 2007-08-16 | Matsushita Electric Ind Co Ltd | 固体撮像装置の製造方法 |
JP2009117681A (ja) * | 2007-11-08 | 2009-05-28 | Panasonic Corp | 半導体装置の製造方法および固体撮像装置の製造方法 |
JP2012182426A (ja) * | 2011-02-09 | 2012-09-20 | Canon Inc | 固体撮像装置、固体撮像装置を用いた撮像システム及び固体撮像装置の製造方法 |
JP2013084741A (ja) * | 2011-10-07 | 2013-05-09 | Canon Inc | 光電変換装置および撮像システム |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100684870B1 (ko) | 2004-12-07 | 2007-02-20 | 삼성전자주식회사 | 씨모스 이미지 센서 및 그 형성 방법 |
JP5110820B2 (ja) * | 2006-08-02 | 2012-12-26 | キヤノン株式会社 | 光電変換装置、光電変換装置の製造方法及び撮像システム |
JP4862878B2 (ja) | 2008-10-30 | 2012-01-25 | ソニー株式会社 | 固体撮像装置、その製造方法および撮像装置 |
JP2010161236A (ja) | 2009-01-08 | 2010-07-22 | Canon Inc | 光電変換装置の製造方法 |
KR20110036312A (ko) * | 2009-10-01 | 2011-04-07 | 삼성전자주식회사 | 반도체 소자 및 그 제조 방법 |
JP2012094672A (ja) | 2010-10-27 | 2012-05-17 | Sony Corp | 半導体装置、および、半導体装置の製造方法 |
JP2014072485A (ja) | 2012-10-01 | 2014-04-21 | Renesas Electronics Corp | 撮像装置およびその製造方法 |
JP6305030B2 (ja) | 2013-11-22 | 2018-04-04 | キヤノン株式会社 | 光電変換装置の製造方法 |
-
2014
- 2014-06-12 JP JP2014121849A patent/JP2016001709A/ja active Pending
-
2015
- 2015-06-01 US US14/726,769 patent/US9716126B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012528A (ja) * | 1998-06-26 | 2000-01-14 | Sony Corp | 段差部を覆う膜のエッチング方法 |
JP2007027705A (ja) * | 2005-07-11 | 2007-02-01 | Samsung Electronics Co Ltd | イメージセンサ及びその製造方法 |
JP2007158031A (ja) * | 2005-12-05 | 2007-06-21 | Sony Corp | 固体撮像装置 |
JP2007207828A (ja) * | 2006-01-31 | 2007-08-16 | Matsushita Electric Ind Co Ltd | 固体撮像装置の製造方法 |
JP2009117681A (ja) * | 2007-11-08 | 2009-05-28 | Panasonic Corp | 半導体装置の製造方法および固体撮像装置の製造方法 |
JP2012182426A (ja) * | 2011-02-09 | 2012-09-20 | Canon Inc | 固体撮像装置、固体撮像装置を用いた撮像システム及び固体撮像装置の製造方法 |
JP2013084741A (ja) * | 2011-10-07 | 2013-05-09 | Canon Inc | 光電変換装置および撮像システム |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2021152943A1 (ja) * | 2020-01-30 | 2021-08-05 | パナソニックIpマネジメント株式会社 | 撮像装置 |
WO2023276744A1 (ja) * | 2021-06-30 | 2023-01-05 | パナソニックIpマネジメント株式会社 | 撮像装置及びその製造方法 |
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