JP2015526862A - 電気光学部品とそれらの製造方法 - Google Patents
電気光学部品とそれらの製造方法 Download PDFInfo
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- JP2015526862A JP2015526862A JP2015527418A JP2015527418A JP2015526862A JP 2015526862 A JP2015526862 A JP 2015526862A JP 2015527418 A JP2015527418 A JP 2015527418A JP 2015527418 A JP2015527418 A JP 2015527418A JP 2015526862 A JP2015526862 A JP 2015526862A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
Description
・ 基板10を提供し、
・ 埋め込み導電性構造体20とバリア層構造体30を有する前記基板を提供する工程を含み、
前記バリア層構造体30は第1の無機層32、第2の無機層34、および、前記無機層と前記有機層の間にメッシュによって区画される有機層部36aを有する有機層36とを含み、導電性構造体20は囲みメッシュ24と複数の相互に絶縁された導電性素子22a,22bを含み、前記の囲みメッシュは相互に別々のゾーンの26a、26bに格納され、前記の互いに絶縁された導電性素子22a,22bのそれぞれに配置されている。
第2の無機層34、有機層36および前記第1の無機層とがそれぞれ、導電性構造から空いたまま残されている空間、すなわち、導電性構造体の開口部内に、付着される。有機材料が、導電性構造体20の空いたままの表面には、付着していないか、または、残存していないことが重要である。これは、水分または他の有害な物質類が横方向に有機層を通って拡散することができないようにするためである。これは、例えば、有機材料を付着させる工程S4の前に、その空いたままの表面にディウェッティング材料を塗布することによって達成することができる。あるいは、有機材料は、後から、空いたままの表面から機械的にまたは化学的に除去(図4Eの工程S4A)してもよい。第1の無機層32を付着させる工程に続いて、このようにして得られた各層の積層体を、基板10と積層させる(図4G参照)。工程S6は、第1の無機層32に空いたままの表面に基板10を積層する方法を示している。続いて、一時的なキャリアTCは工程S7において除去されることが、図4Hに示される。この方法による箔の製造に適した材料および処理方法は、国際公開第2011/016725号に記載されている。図4Aから4Hに記載の方法は、図3Bに示す箔をもたらす。
Claims (11)
- 導電性材料の構造体(導電性構造体)(20)を担持する基板(10)を備える電気光学部品であって、前記導電性構造体(20)は、第1の無機層(32)、第2の無機層(34)および前記各無機層の間にある有機層(36)とを有するバリア構造体(30)に埋設されており、前記第2の無機層および前記有機層は、有機層部(36a)の中に導電性構造体によって区画され、前記電気光学部品は、第1の透光性導電層(42)、第2の導電層(44)および第1および第2の導電層との間に配置された電気光学層(46)をさらに備え、前記透光性導電層が陰極であって前記第2の導電層が陽極であるか、または、前記透光性導電層が陽極であって前記第2の導電層が陰極であり、および、前記電気光学部品はさらにバリア構造体と共に電気光学素子(40)を封入する保護層(50)を含み、
前記導電性構造体は、囲みメッシュ(24)および少なくとも1つの導電性素子(22a)を備えており、前記少なくとも1つの導電性素子(22a)は、囲みメッシュ(24)によって囲まれたゾーン(26a)の中に配置され、および、
前記第1の透光性導電層(42)は、囲みメッシュ(24)の、基板(10)とは反対側の表面に設けられ、前記第2の導電層(44)が前記第1の透光性導電層(42)と前記電気光学層(46)を横方向に超えた位置にて前記少なくとも1つの導電性素子(22a)と物理的及び電気的に接触していることを特徴とする、電気光学部品。 - 前記電気光学層(46)が、少なくとも1つの導電性素子(22a)の方向に第1の透光性導電層(42)を越えて延びている、請求項1に記載の電気光学部品。
- 前記少なくとも1つの導電性素子(22a)が、横方向に相互に別々のゾーンにメッシュで囲まれて、相互に絶縁された導電性要素のうちの1つであり、前記相互に絶縁された導電性素子(22aおよび22b)が、メッシュ(24)で囲まれた開口部の平均面積の平方根の0.5から3倍の間の範囲の最小寸法を有する境界ボックスを有している、請求項1に記載の電気光学部品。
- 前記境界ボックスは、最小寸法の1.5から10倍の間の範囲の最大寸法を有している、請求項3に記載の電気光学部品。
- 前記絶縁された導電性要素と前記囲みメッシュ(24)との間の最短距離が、メッシュ要素の幅(w)の1から5倍の間の範囲を有している、請求項1に記載の電気光学部品。
- 相互に独立した複数のゾーンが、前記境界ボックスの長さ方向に一列に配置されている、請求項3に記載の電気光学部品。
- 2つの連続する相互に絶縁された導電性素子(22a,22b)の各境界ボックスは、メッシュ(24)で囲まれた開口部の平均面積の平方根よりも小さい相互の距離を有している、請求項6に記載の電気光学部品。
- 電気光学部品の製造方法であって、該方法は箔を製造する以下の工程、すなわち、
・ 基板(10)を提供する工程、
・ 導電性材料の埋め込み構造体(導電性構造体)(20)を有するバリア層構造体(30)を備えた基板を提供する工程であって、該バリア層構造体(30)は、第1の無機層(32)、第2の無機層(34)および前記各無機層の間の無機層を備え、該有機層は導電性構造体によって有機層部分(36a)へと区画されており、前記導電性構造体は、囲みメッシュ(24)および相互に絶縁された導電性素子(22a,22b)を備えており、該囲みメッシュは相互に別々のゾーン(26a,26b)を囲んでおり、それぞれのゾーンに、互いに絶縁された導電性素子(22a,22b)が配置される、工程を備え、さらに、以下の工程、すなわち、
・ 箔上に第1の透光性導電層(42)を付着させる工程、
・ 前記第1の導電層上に電気光学層(46)を付着させる工程、
・ 前記電気光学層の上に、第2の導電層(44)および囲まれた領域に1またはそれ以上の絶縁された導電性素子(22a)とを付着させる工程であって、該1つ以上の絶縁された導電性素子(22a)は第1の透光性導電層(42)と電気的に接触しておらず、該第1の透光性導電層(42)、該電気光学層(46)および該第2の導電層(44)が電気光学素子を形成する、工程、
・ バリア層を設ける工程であって、該バリア層と前記箔における埋め込み導電性構造体は、電気光学素子を封止している、工程、
・ 前記カプセル化された電気光学部品を分離する工程、
を備える、方法。 - 請求項8に記載の方法であって、前記基板が、前記基板に埋め込まれたメッシュのバリア層構造体(30)が設けられる以下の工程、すなわち、
・ 一時的なキャリア(TC)を提供する工程(S1)
・ 前記一時的なキャリア(TC)の主面に前記導電性構造体(20)を付着させる工程(S2)、
・ 引き続き、前記第2の無機層(34)、前記有機層(36)および前記第1の無機層(32)を前記導電性構造体における残りの空間を開けたままで付着させる工程(S3,S4,S5)、
・ 前記基板(10)に積み上げられた前記各層(TC,20,34,36,32)を積層化する工程(S6)、
・ 積み上げられた前記各層から前記一時的なキャリア(TC)を除去する工程(S7)、
によって提供される、方法。 - 請求項8に記載の方法であって、前記基板が、前記基板に埋め込まれたメッシュのバリア層構造体(30)が設けられる以下の工程、すなわち、
・ 前記第1の無機層を前記基板上に付着させる工程(S10)、
・ 前記有機層を、前記無機層の上に塗布し(S11)、前記有機層が、埋め込まれた導電性構造体のパターンと共形となるよう設けられる(S12)工程、
・ 第2の無機層の上にパターニングされた有機層をコーティングする工程(S13)、
・ 前記コーティングされた有機層におけるトレンチ内に前記導電性構造体を形成するよう前記導電性材料を付着させる工程(S14)、
によって提供される、方法。 - 請求項8に記載の方法であって、前記基板が、前記基板(10)に埋め込まれた導電性構造体のバリア層構造体(30)が設けられる以下の工程、すなわち、
・ 第1の表面部(TC1)及びキャリア部(TC2)を有する金属箔(TC)を提供する工程(S20)
・ 前記箔(TC)の第1の表面部(TC1)を、導電性構造体のパターンと共形となり、前記キャリア部の表面を露出させるよう、形成するためのパターンに従ってパターニングする工程(S21)
・ 前記キャリア部(TC2)の露出された表面を、前記第2の無機層(34)でコーティングする工程(S22)
・ 前記有機層を前記コーティングされた第1の表面に付着させる工程(S23)
・ 前記第1の無機層を付着させる工程(S24)
・ そうして第1の無機層の側で得られた前記の積み上げられた積層体を、前記基板に積層させる工程(S25)
・ 前記金属箔のキャリア部を除去する工程(S26)
によって提供される、方法。
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EP12180925.5A EP2698836A1 (en) | 2012-08-17 | 2012-08-17 | Foil, electro-optic component and method of manufacturing these |
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PCT/NL2013/050602 WO2014027891A1 (en) | 2012-08-17 | 2013-08-16 | Electro-optic component and method of manufacturing these |
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JP2021043263A (ja) * | 2019-09-06 | 2021-03-18 | 富士通オプティカルコンポーネンツ株式会社 | 光変調装置及び光変調装置の製造方法 |
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