JP2015213203A - Crystal vibration element and method of manufacturing the same - Google Patents

Crystal vibration element and method of manufacturing the same Download PDF

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JP2015213203A
JP2015213203A JP2014094344A JP2014094344A JP2015213203A JP 2015213203 A JP2015213203 A JP 2015213203A JP 2014094344 A JP2014094344 A JP 2014094344A JP 2014094344 A JP2014094344 A JP 2014094344A JP 2015213203 A JP2015213203 A JP 2015213203A
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thin
base
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vibrating arm
notch
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JP6457199B2 (en
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井上　憲司
Kenji Inoue
憲司 井上
孝宏 尾賀
Takahiro Oga
孝宏 尾賀
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Kyocera Crystal Device Corp
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Abstract

PROBLEM TO BE SOLVED: To provide a vibration element capable of suppressing inflow of a conductive adhesive to the vibration part side of the base, reliably at a slit, when forming a slit in the base, and to provide a method of manufacturing the same.SOLUTION: A base 11 has an upper surface 111 and a lower surface 112 in the thickness direction, and the lower surface 112 is fixed to an element mounting member by means of a conductive adhesive 31. Outer slits 15a, 15b are formed in the outer periphery of the base 11, so as to penetrate the upper surface 111 and lower surface 112. Inner slits 16a, 16b are formed in the inner periphery of the outer slits 15a, 15b so as to bring about a state recessed from the upper surface 111 and lower surface 112, respectively, in the thickness direction. Thin wall portions 17a, 17b are provided, respectively, in the inner slits 16a, 16b.

Description

本発明は、例えば基準信号源やクロック信号源に用いられる水晶振動素子、及びその製造方法に関する。以下、水晶振動素子の一例として、音叉型屈曲水晶振動素子（以下「振動素子」と略称する。）について説明する。   The present invention relates to a crystal resonator element used for, for example, a reference signal source and a clock signal source, and a manufacturing method thereof. Hereinafter, a tuning fork-type bending quartz crystal vibrating element (hereinafter abbreviated as “vibrating element”) will be described as an example of a quartz crystal vibrating element.

図９は、関連技術１の振動素子を示す斜視図である。以下、この図面に基づき説明する。   FIG. 9 is a perspective view showing a vibration element according to Related Technique 1. FIG. Hereinafter, description will be given based on this drawing.

本関連技術１の振動素子２１０は、基部２１１と、振動腕部２１２ａ，２１２ｂと、切れ込み部２１５ａ，２１５ｂとを備えている。このような構造の振動素子２１０は、例えば特許文献１、２に開示されている。   The vibration element 210 of the related technology 1 includes a base 211, vibration arm portions 212a and 212b, and cutout portions 215a and 215b. The vibration element 210 having such a structure is disclosed in Patent Documents 1 and 2, for example.

基部２１１は、上面２４１側及び下面２４２側から見て四角形状であり、下面２４２が素子搭載部材（図示せず）に導電性接着剤２３１によって固定される。振動腕部２１２ａ，２１２ｂは、基部２１１から延設され、それぞれ溝部２１３ａ，２１３ｂが形成されている。切れ込み部２１５ａ，２１５ｂは、基部２１１の上面２４１から下面２４２までを貫いており、基部２１１の対向側面にそれぞれ形成されている。   The base 211 has a square shape when viewed from the upper surface 241 side and the lower surface 242 side, and the lower surface 242 is fixed to an element mounting member (not shown) by the conductive adhesive 231. The vibrating arm portions 212a and 212b are extended from the base portion 211 and formed with groove portions 213a and 213b, respectively. The notches 215a and 215b penetrate from the upper surface 241 to the lower surface 242 of the base 211, and are formed on opposite sides of the base 211, respectively.

基部２１１及び振動腕部２１２ａ，２１２ｂは、水晶振動片２１４からなる。振動素子２１０は、水晶振動片２１４の他に、パッド電極２２１ａ，２２１ｂ、励振電極２２２ａ，２２２ｂ、周波数調整用金属膜２２３ａ，２２３ｂ、配線パターン２２４ａ，２２４ｂなども備えている。   The base portion 211 and the vibrating arm portions 212 a and 212 b are made of a crystal vibrating piece 214. The vibration element 210 includes pad electrodes 221a and 221b, excitation electrodes 222a and 222b, frequency adjustment metal films 223a and 223b, wiring patterns 224a and 224b, and the like in addition to the crystal vibrating piece 214.

基部２１１において振動腕部２１２ａ，２１２ｂに近い部分は、振動腕部２１２ａ，２１２ｂの屈曲振動とともに振動する。この部分を導電性接着剤２３１で固定してしまうと、振動エネルギが素子搭載部材側へ漏れる問題（以下「振動漏れ」という。）が発生する。この振動漏れは、振動エネルギの損失となるため、振動素子２１０のＣＩ（Crystal Impedance）値を劣化すなわち増加させる要因となる。   The portions of the base 211 close to the vibrating arm portions 212a and 212b vibrate together with the bending vibration of the vibrating arm portions 212a and 212b. If this portion is fixed with the conductive adhesive 231, a problem that vibration energy leaks to the element mounting member side (hereinafter referred to as “vibration leakage”) occurs. This vibration leakage is a loss of vibration energy, and thus causes deterioration or increase in the CI (Crystal Impedance) value of the vibration element 210.

ここで、切れ込み部２１５ａ，２１５ｂは、基部２１１の振動腕部２１２ａ，２１２ｂ側へ導電性接着剤２３１が流れ込むことを防いでいる。   Here, the cut portions 215 a and 215 b prevent the conductive adhesive 231 from flowing into the vibrating arm portions 212 a and 212 b of the base portion 211.

特開昭５９−１８３５２０号公報JP 59-183520 A 特開２００２−２６１５７５号公報JP 2002-261575 A

しかしながら、関連技術１の振動素子２１０には、次のような問題があった。   However, the vibration element 210 of Related Art 1 has the following problems.

切れ込み部２１５ａ，２１５ｂを設けても、例えば導電性接着剤２３１の供給量が多くなった場合などに、導電性接着剤２３１が切れ込み部２１５ａ，２１５ｂを越えて基部２１１の振動腕部２１２ａ，２１２ｂ側へ流れ込むことがあった。近年、振動素子１０の小型化に伴い、切れ込み部２１５ａ，２１５ｂも微細化しているため、この問題がますます深刻化している。   Even when the cut portions 215a and 215b are provided, for example, when the supply amount of the conductive adhesive 231 increases, the conductive adhesive 231 exceeds the cut portions 215a and 215b and the vibrating arm portions 212a and 212b of the base 211. It sometimes flowed to the side. In recent years, with the miniaturization of the vibration element 10, the notches 215a and 215b are also miniaturized, and this problem is becoming more serious.

そこで、本発明の目的は、基部に切れ込み部を形成した場合に、基部の振動部側への導電性接着剤の流れ込みを、切れ込み部で確実に抑制し得る、振動素子及びその製造方法を提供することにある。   Accordingly, an object of the present invention is to provide a vibration element and a method of manufacturing the same that can reliably suppress the flow of the conductive adhesive to the vibrating portion side of the base when the cut portion is formed in the base portion. There is to do.

本発明に係る振動素子は、
厚さ方向に上面及び下面を有するとともに、この下面が導電性接着剤によって素子搭載部材に固定される基部と、
この基部から延設された振動部と、
前記上面と前記下面とを貫くように前記基部の外周に形成された外側切れ込み部と、
前記上面と前記下面とから前記厚さ方向に窪んだ状態になるように前記外側切れ込み部の内周に形成された内側切れ込み部と、
前記上面が延長された仮想的な面を延長上面とし、前記下面が延長された仮想的な面を延長下面としたとき、前記内側切れ込み部内に形成され、前記延長上面及び前記延長下面の少なくとも一方から離れた状態で突出する薄肉部と、
を備えている。 The vibration element according to the present invention is
A base having an upper surface and a lower surface in the thickness direction, and the lower surface fixed to the element mounting member by a conductive adhesive;
A vibrating portion extending from the base, and
An outer notch formed on the outer periphery of the base so as to penetrate the upper surface and the lower surface;
An inner notch formed on the inner periphery of the outer notch so as to be recessed in the thickness direction from the upper surface and the lower surface,
When the virtual surface with the upper surface extended is an extended upper surface, and the virtual surface with the lower surface extended is an extended lower surface, it is formed in the inner notch, and at least one of the extended upper surface and the extended lower surface A thin-walled portion that protrudes away from the
It has.

本発明に係る製造方法は、
前記振動部に前記延設方向に沿って溝部が形成された本発明に係る振動素子を製造する方法であって、
前記溝部を形成する際に、同時に前記内側切れ込み部及び前記薄肉部を形成する、
ことを特徴とする。 The manufacturing method according to the present invention includes:
A method of manufacturing a vibration element according to the present invention in which a groove is formed along the extending direction in the vibration part,
When forming the groove portion, simultaneously form the inner cut portion and the thin portion,
It is characterized by that.

本発明によれば、外側切れ込み部内に内側切れ込み部を設け、内側切れ込み部内で突出する薄肉部を設けたことにより、内側切れ込み部及び薄肉部に導電性接着剤を導くことができるので、基部の振動部側への導電性接着剤の流れ込みを、外側切れ込み部で確実に抑制できる。   According to the present invention, by providing the inner cut portion in the outer cut portion and providing the thin wall portion protruding in the inner cut portion, the conductive adhesive can be guided to the inner cut portion and the thin wall portion. The flow of the conductive adhesive to the vibrating part side can be reliably suppressed by the outer cut part.

実施形態１の振動素子を示す斜視図である。FIG. 3 is a perspective view illustrating a vibration element according to the first embodiment. 図２［Ａ］は図１におけるIIａ−IIａ線断面図であり、図２［Ｂ］は図１におけるIIｂ−IIｂ線断面図であり、図２［Ｃ］は図１の振動素子を素子搭載部材に実装した状態を示す概略断面図である。2 [A] is a cross-sectional view taken along the line IIa-IIa in FIG. 1, FIG. 2 [B] is a cross-sectional view taken along the line IIb-IIb in FIG. 1, and FIG. It is a schematic sectional drawing which shows the state mounted in the member. 外側切れ込み部、内側切れ込み部及び薄肉部を示す斜視図であり、図３［Ａ］は実施形態１、図３［Ｂ］は変形例１である。It is a perspective view which shows an outer side cut | notch part, an inner side cut | notch part, and a thin part, FIG. 3 [A] is Embodiment 1 and FIG. 外側切れ込み部、内側切れ込み部及び薄肉部を示す斜視図であり、図４［Ｃ］は変形例２、図４［Ｄ］は変形例３である。It is a perspective view which shows an outer side cut part, an inner side cut part, and a thin part, FIG. 4 [C] is the modification 2, FIG. 4 [D] is the modification 3. FIG. 実施形態２の製造方法における各工程を示す断面図であり、図５［Ａ］、図５［Ｂ］、図５［Ｃ］の順に工程が進行する。It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 5 [A], FIG. 5 [B], and FIG. 5 [C]. 実施形態２の製造方法における各工程を示す断面図であり、図６［Ｄ］、図６［Ｅ］、図６［Ｆ］の順に工程が進行する。It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 6 [D], FIG. 6 [E], and FIG. 6 [F]. 実施形態２の製造方法における各工程を示す断面図であり、図７［Ｇ］、図７［Ｈ］、図７［Ｉ］の順に工程が進行する。It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 7 [G], FIG. 7 [H], and FIG. 7 [I]. 実施形態２の製造方法における各工程を示す断面図であり、図８［Ｊ］、図８［Ｋ］、図８［Ｌ］の順に工程が進行する。It is sectional drawing which shows each process in the manufacturing method of Embodiment 2, and a process progresses in order of FIG. 8 [J], FIG. 8 [K], and FIG. 8 [L]. 関連技術の振動素子を示す斜視図である。It is a perspective view which shows the vibration element of related technology.

以下、添付図面を参照しながら、本発明を実施するための形態（以下「実施形態」という。）について説明する。なお、本明細書及び図面において、実質的に同一の構成要素については同一の符号を用いる。また、図面に描かれた形状は、当業者が理解しやすいように描かれているため、実際の寸法及び比率とは必ずしも一致していない。   DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described with reference to the accompanying drawings. In the present specification and drawings, the same reference numerals are used for substantially the same components. Moreover, since the shape drawn on drawing is drawn so that those skilled in the art can understand easily, it does not necessarily correspond with an actual dimension and ratio.

図１は、実施形態１の振動素子を示す平面図である。図２［Ａ］は、図１におけるIIａ−IIａ線断面図である。図２［Ｂ］は、図１におけるIIｂ−IIｂ線断面図である。図２［Ｃ］は、図１の振動素子を素子搭載部材に実装した状態を示す概略断面図である。図３［Ａ］は、図１における外側切れ込み部、内側切れ込み部及び薄肉部を示す斜視図である。以下、これらの図面に基づき説明する。なお、延長上面１１３、延長下面１１４、薄肉部上面１７１及び薄肉部下面１７２については、図２［Ｂ］にのみ符合を付す。第一面１５１、第二面１５２、第三面１５３及び交線１５４については、図３［Ａ］にのみ符合を付す。   FIG. 1 is a plan view illustrating the vibration element according to the first embodiment. 2A is a cross-sectional view taken along line IIa-IIa in FIG. 2B is a cross-sectional view taken along line IIb-IIb in FIG. FIG. 2C is a schematic cross-sectional view illustrating a state where the vibration element of FIG. 1 is mounted on an element mounting member. FIG. 3A is a perspective view showing the outer cut portion, the inner cut portion, and the thin portion in FIG. Hereinafter, description will be given based on these drawings. Note that the extension upper surface 113, the extension lower surface 114, the thin-walled upper surface 171 and the thin-walled lower surface 172 are denoted by reference numerals only in FIG. About the 1st surface 151, the 2nd surface 152, the 3rd surface 153, and the intersection line 154, a code | symbol is attached | subjected only to FIG. 3 [A].

図１に示すように、本実施形態１の振動素子１０は、基部１１と、振動部としての二本の振動腕部１２ａ，１２ｂと、外側切れ込み部１５ａ，１５ｂと、内側切れ込み部１６ａ，１６ｂと、薄肉部１７ａ，１７ｂとを備えている。基部１１は、厚さ方向に上面１１１及び下面１１２を有するとともに、下面１１２が導電性接着剤３１によって素子搭載部材３２（図２［Ｃ］）に固定される。振動腕部１２ａ，１２ｂは、基部１１から延設されている。外側切れ込み部１５ａ，１５ｂは、上面１１１と下面１１２とを貫くように、それぞれ基部１１の外周に形成されている。内側切れ込み部１６ａは、上面１１１と下面１１２とから厚さ方向に窪んだ状態になるように、外側切れ込み部１５ａの内周に形成されている。内側切れ込み部１６ｂは、上面１１１と下面１１２とから厚さ方向にそれぞれ窪んだ状態になるように、外側切れ込み部１５ｂの内周に形成されている。   As shown in FIG. 1, the vibration element 10 according to the first embodiment includes a base 11, two vibrating arm portions 12a and 12b as vibration portions, outer cut portions 15a and 15b, and inner cut portions 16a and 16b. And thin-walled portions 17a and 17b. The base 11 has an upper surface 111 and a lower surface 112 in the thickness direction, and the lower surface 112 is fixed to the element mounting member 32 (FIG. 2C) by the conductive adhesive 31. The vibrating arm portions 12 a and 12 b are extended from the base portion 11. The outer notches 15a and 15b are formed on the outer periphery of the base 11 so as to penetrate the upper surface 111 and the lower surface 112, respectively. The inner cut portion 16a is formed on the inner periphery of the outer cut portion 15a so as to be recessed from the upper surface 111 and the lower surface 112 in the thickness direction. The inner cut portion 16b is formed on the inner periphery of the outer cut portion 15b so as to be recessed from the upper surface 111 and the lower surface 112 in the thickness direction.

図２［Ｂ］に示すように、上面１１１が延長された仮想的な面を延長上面１１３とし、下面１１２が延長された仮想的な面を延長下面１１４とする。このとき、薄肉部１７ａ，１７ｂは、それぞれ内側切れ込み部１６ａ，１６ｂ内に設けられ、延長上面１１３及び延長下面１１４の少なくとも一方から離れた状態で突出する。詳しく言えば、薄肉部１７ａ，１７ｂは薄肉部上面１７１及び薄肉部下面１７２を有し、薄肉部上面１７１は延長上面１１３から離れた面であり、薄肉部下面１７２は延長下面１１４から離れた面である。   As shown in FIG. 2B, a virtual surface with the upper surface 111 extended is referred to as an extended upper surface 113, and a virtual surface with the lower surface 112 extended is referred to as an extended lower surface 114. At this time, the thin portions 17a and 17b are provided in the inner cut portions 16a and 16b, respectively, and protrude in a state separated from at least one of the extended upper surface 113 and the extended lower surface 114. More specifically, the thin portions 17a and 17b have a thin portion upper surface 171 and a thin portion lower surface 172. The thin portion upper surface 171 is a surface away from the extended upper surface 113, and the thin wall lower surface 172 is a surface away from the extended lower surface 114. It is.

図３［Ａ］に示すように、外側切れ込み部１５ａの内周には、振動腕部１２ａ側の第一面１５１と、振動腕部１２ａ側の反対（基端面１１０）側の第二面１５２とが含まれる。少なくとも第二面１５２に内側切れ込み部１６ａが形成されている。外側切れ込み部１５ａは、上面１１１側及び下面１１２側から見て四角形状である。そのため、外側切れ込み部１５ａの内周には、第一面１５１と第二面１５２とを結ぶ第三面１５３が更に含まれる。第三面１５３と第二面１５２との交線１５４を含む部分に、内側切れ込み部１６ａが形成されている。内側切れ込み部１６ａ及び薄肉部１７ａも平面視略四角形状である。   As shown in FIG. 3A, on the inner periphery of the outer cut portion 15a, there are a first surface 151 on the vibrating arm portion 12a side and a second surface 152 on the opposite (base end surface 110) side on the vibrating arm portion 12a side. And are included. An inner cut portion 16 a is formed on at least the second surface 152. The outer cut 15a has a rectangular shape when viewed from the upper surface 111 side and the lower surface 112 side. Therefore, a third surface 153 that connects the first surface 151 and the second surface 152 is further included in the inner periphery of the outer cut portion 15a. An inner cut portion 16 a is formed at a portion including the intersection line 154 between the third surface 153 and the second surface 152. The inner cut portion 16a and the thin portion 17a are also substantially rectangular in plan view.

図１に示す外側切れ込み部１５ｂ、内側切れ込み部１６ｂ及び薄肉部１７ｂは、外側切れ込み部１５ａ、内側切れ込み部１６ａ及び薄肉部１７ａと、中心線（振動腕部１２ａ，１２ｂの延設方向）を挟んで線対称となる構造である。   The outer cut portion 15b, the inner cut portion 16b, and the thin portion 17b shown in FIG. 1 sandwich the center line (the extending direction of the vibrating arm portions 12a and 12b) with the outer cut portion 15a, the inner cut portion 16a, and the thin portion 17a. This is a line-symmetric structure.

振動腕部１２ａ，１２ｂは、それぞれ基部１１から同じ方向に延設され、その延設方向に沿って溝部１３ａ，１３ｂが設けられている。基部１１及び振動腕部１２ａ，１２ｂは、水晶振動片１４からなる。振動素子１０は、水晶振動片１４の他に、パッド電極２１ａ，２１ｂ、励振電極２２ａ，２２ｂ、周波数調整用金属膜２３ａ，２３ｂ、配線パターン２４ａ，２４ｂなども備えている。   The vibrating arm portions 12a and 12b are extended from the base portion 11 in the same direction, and groove portions 13a and 13b are provided along the extending direction. The base portion 11 and the vibrating arm portions 12 a and 12 b are made of a crystal vibrating piece 14. In addition to the crystal vibrating piece 14, the vibration element 10 includes pad electrodes 21a and 21b, excitation electrodes 22a and 22b, frequency adjusting metal films 23a and 23b, wiring patterns 24a and 24b, and the like.

次に、振動素子１０の構成について更に詳しく説明する。   Next, the configuration of the vibration element 10 will be described in more detail.

基部１１は、平面視略四角形状の平板となっている。水晶振動片１４は、基部１１と振動腕部１２ａ，１２ｂとが一体となって音叉形状をなしており、成膜技術、フォトリソグラフィ技術、ウェットエッチング技術によって製造される。   The base 11 is a flat plate having a substantially rectangular shape in plan view. The quartz crystal resonator element 14 has a tuning fork shape in which the base 11 and the vibrating arms 12a and 12b are integrated, and is manufactured by a film forming technique, a photolithography technique, and a wet etching technique.

溝部１３ａ，１３ｂは、振動腕部１２ａの表裏面に二本ずつ及び振動腕部１２ｂの表裏面に二本ずつ、基部１１との境界部分から振動腕部１２ａ，１２ｂの先端に向って、振動腕部１２ａ，１２ｂの長さ方向と平行に所定の長さで設けられる。なお、溝部１３ａ，１３ｂは、本実施形態１では振動腕部１２ａの表裏面に二本ずつ及び振動腕部１２ｂの表裏面に二本ずつ設けられているが、それらの本数に制限はなく、例えば振動腕部１２ａの表裏面に一本ずつ及び振動腕部１２ｂの表裏面に一本ずつ設けてもよく、また、表裏のどちらか片面にのみ設けてもよい。   The groove portions 13a, 13b vibrate from the boundary portion with the base 11 toward the tips of the vibrating arm portions 12a, 12b, two on the front and back surfaces of the vibrating arm portion 12a and two on the front and back surfaces of the vibrating arm portion 12b. The arm portions 12a and 12b are provided with a predetermined length parallel to the length direction of the arms 12a and 12b. In the first embodiment, two grooves 13a and 13b are provided on the front and back surfaces of the vibrating arm 12a and two grooves on the front and back surfaces of the vibrating arm 12b. However, the number of the grooves 13a and 13b is not limited. For example, one may be provided on the front and back surfaces of the vibrating arm portion 12a and one on each of the front and back surfaces of the vibrating arm portion 12b, or may be provided on only one side of the front and back surfaces.

振動腕部１２ａには、水晶を挟んで対向する平面同士が同極となるように、両側面に励振電極２２ａが設けられ、表裏面の溝部１３ａの内側に励振電極２２ｂが設けられる。同様に、振動腕部１２ｂには、水晶を挟んで対向する平面同士が同極となるように、両側面に励振電極２２ｂが設けられ、表裏面の溝部１３ｂの内側に励振電極２２ａが設けられる。したがって、振動腕部１２ａにおいては両側面に設けられた励振電極２２ａと溝部１３ａ内に設けられた励振電極２２ｂとが異極同士となり、振動腕部１２ｂにおいては両側面に設けられた励振電極２２ｂと溝部１３ｂ内に設けられた励振電極２２ａとが異極同士となる。   The vibrating arm 12a is provided with excitation electrodes 22a on both side surfaces so that the planes facing each other across the crystal have the same polarity, and an excitation electrode 22b is provided inside the groove 13a on the front and back surfaces. Similarly, the vibrating arm portion 12b is provided with excitation electrodes 22b on both side surfaces so that the planes facing each other across the crystal have the same polarity, and the excitation electrode 22a is provided inside the groove portion 13b on the front and back surfaces. . Accordingly, in the vibrating arm portion 12a, the excitation electrode 22a provided on both side surfaces and the excitation electrode 22b provided in the groove portion 13a have different polarities, and in the vibrating arm portion 12b, the excitation electrode 22b provided on both side surfaces. And the excitation electrode 22a provided in the groove 13b have different polarities.

基部１１には、パッド電極２１ａ，２１ｂと配線パターン２４ａ，２４ｂとが設けられる。配線パターン２４ａはパッド電極２１ａと励振電極２２ａとの間を電気的に接続し、配線パターン２４ｂは、パッド電極２１ｂと励振電極２２ｂとの間をそれぞれ電気的に接続する。パッド電極２１ａ、励振電極２２ａ、周波数調整用金属膜２３ａ及び配線パターン２４ａは、互いに電気的に導通している。パッド電極２１ｂ、励振電極２２ｂ、周波数調整用金属膜２３ｂ及び配線パターン２４ｂも、互いに電気的に導通している。   The base 11 is provided with pad electrodes 21a and 21b and wiring patterns 24a and 24b. The wiring pattern 24a electrically connects the pad electrode 21a and the excitation electrode 22a, and the wiring pattern 24b electrically connects the pad electrode 21b and the excitation electrode 22b. The pad electrode 21a, the excitation electrode 22a, the frequency adjusting metal film 23a, and the wiring pattern 24a are electrically connected to each other. The pad electrode 21b, the excitation electrode 22b, the frequency adjusting metal film 23b, and the wiring pattern 24b are also electrically connected to each other.

振動素子１０は、パッド電極２１ａ，２１ｂ及び導電性接着剤３１を介して、素子搭載部材３２側のパッド電極３３に固定されると同時に電気的に接続される。   The vibration element 10 is fixed and electrically connected to the pad electrode 33 on the element mounting member 32 side via the pad electrodes 21 a and 21 b and the conductive adhesive 31.

水晶の結晶は三方晶系である。水晶の頂点を通る結晶軸をＺ軸、Ｚ軸に垂直な平面内の稜線を結ぶ三つの結晶軸をＸ軸、Ｘ軸及びＺ軸に直交する座標軸をＹ軸とする。ここで、これらのＸ軸、Ｙ軸及びＺ軸からなる座標系をＸ軸を中心として±５度の範囲で回転させたときの回転後のＹ軸及びＺ軸を、それぞれＹ’軸及びＺ’軸とする。この場合、本実施形態１では、二本の振動腕部１２ａ，１２ｂの延設方向がＹ’軸の方向であり、二本の振動腕部１２ａ，１２ｂの並ぶ方向がＸ軸の方向である。   Quartz crystals are trigonal. A crystal axis passing through the crystal apex is defined as a Z axis, three crystal axes connecting ridge lines in a plane perpendicular to the Z axis are defined as an X axis, and a coordinate axis orthogonal to the X axis and the Z axis is defined as a Y axis. Here, when the coordinate system consisting of these X, Y, and Z axes is rotated within a range of ± 5 degrees around the X axis, the rotated Y axis and Z axis are respectively represented as Y ′ axis and Z axis. 'As axis. In this case, in the first embodiment, the extending direction of the two vibrating arm portions 12a and 12b is the Y′-axis direction, and the direction in which the two vibrating arm portions 12a and 12b are arranged is the X-axis direction. .

次に、振動素子１０の動作を説明する。音叉型の振動素子１０を振動させる場合、パッド電極２１ａ，２１ｂに交番電圧を印加する。印加後のある電気的状態を瞬間的に捉えると、振動腕部１２ａの表裏の溝部１３ａに設けられた励振電極２２ｂはプラス電位となり、振動腕部１２ａの両側面に設けられた励振電極２２ａはマイナス電位となり、プラスからマイナスに電界が生じる。このとき、振動腕部１２ｂの表裏の溝部１３ｂに設けられた励振電極２２ａはマイナス電位となり、振動腕部１２ｂの両側面に設けられた励振電極２２ｂはプラス電位となり、振動腕部１２ａに生じた極性とは反対の極性となり、プラスからマイナスに電界が生じる。この交番電圧で生じた電界によって、振動腕部１２ａ，１２ｂに伸縮現象が生じ、所定の共振周波数の屈曲振動モードが得られる。   Next, the operation of the vibration element 10 will be described. When the tuning fork type vibration element 10 is vibrated, an alternating voltage is applied to the pad electrodes 21a and 21b. When an electrical state after application is instantaneously captured, the excitation electrodes 22b provided in the groove portions 13a on the front and back of the vibrating arm portion 12a have a positive potential, and the excitation electrodes 22a provided on both side surfaces of the vibrating arm portion 12a are A negative electric potential is generated, and an electric field is generated from positive to negative. At this time, the excitation electrode 22a provided in the groove 13b on the front and back sides of the vibrating arm portion 12b has a negative potential, and the excitation electrode 22b provided on both side surfaces of the vibrating arm portion 12b has a positive potential, and is generated in the vibrating arm portion 12a. The polarity is opposite to the polarity, and an electric field is generated from plus to minus. The electric field generated by the alternating voltage causes a stretching phenomenon in the vibrating arm portions 12a and 12b, and a flexural vibration mode having a predetermined resonance frequency is obtained.

次に、振動素子１０の作用及び効果について説明する。   Next, the operation and effect of the vibration element 10 will be described.

（１）本実施形態１によれば、外側切れ込み部１５ａ，１５ｂ内に内側切れ込み部１６ａ，１６ｂを設け、内側切れ込み部１６ａ，１６ｂ内で突出する薄肉部１７ａ，１７ｂを設けたことにより、内側切れ込み部１６ａ，１６ｂ及び薄肉部１７ａ，１７ｂに導電性接着剤３１を導くことができるので、基部１１の振動腕部１２ａ，１２ｂ側への導電性接着剤３１の流れ込みを、外側切れ込み部１５ａ，１５ｂで確実に抑えられる。つまり、外側切れ込み部１５ａ，１５ｂを越えて振動腕部１２ａ，１２ｂ側へ流れ込もうとする導電性接着剤３１は、表面張力によって内側切れ込み部１６ａ，１６ｂ内を這い上がり更に薄肉部１７ａ，１７ｂを這い上がってそこに留まることにより、その先へは進まない。   (1) According to the first embodiment, the inner notches 16a and 16b are provided in the outer notches 15a and 15b, and the thin portions 17a and 17b projecting in the inner notches 16a and 16b are provided. Since the conductive adhesive 31 can be guided to the cut portions 16a and 16b and the thin portions 17a and 17b, the flow of the conductive adhesive 31 to the vibrating arm portions 12a and 12b of the base portion 11 is prevented from flowing into the outer cut portions 15a and 15a. It is reliably suppressed by 15b. That is, the conductive adhesive 31 that is about to flow into the vibrating arm portions 12a and 12b beyond the outer notches 15a and 15b scoops up the inner notches 16a and 16b due to surface tension, and is further thinned portions 17a and 17b. If you crawl up and stay there, you can't go further.

内側切れ込み部１６ａ，１６ｂ内で突出する薄肉部１７ａ，１７ｂを設けたことにより、下面１１２から上面１１１までの沿面距離を十分に稼げるので、上面１１１にまで達するような導電性接着剤３１の過度の這い上がりを抑えられる。よって、上面１１１における配線パターン２４ａ，２４ｂ等の短絡を防止できる。   Since the creeping distance from the lower surface 112 to the upper surface 111 can be sufficiently obtained by providing the thin portions 17a and 17b that protrude in the inner cut portions 16a and 16b, the conductive adhesive 31 that reaches the upper surface 111 is excessively excessive. Can suppress the crawl up. Therefore, a short circuit of the wiring patterns 24a, 24b, etc. on the upper surface 111 can be prevented.

また、内側切れ込み部１６ａ，１６ｂ及び薄肉部１７ａ，１７ｂを設けたことにより、外側切れ込み部１５ａ，１５ｂだけを設けた場合に比べて、導電性接着剤３１の付着面積を更に増やすことができるので、導電性接着剤３１と振動素子１０との接着強度を更に高めることができる。   Moreover, since the inner cut portions 16a and 16b and the thin portions 17a and 17b are provided, the adhesion area of the conductive adhesive 31 can be further increased as compared with the case where only the outer cut portions 15a and 15b are provided. Further, the adhesive strength between the conductive adhesive 31 and the vibration element 10 can be further increased.

（２）外側切れ込み部１５ａ，１５ｂの内周には振動腕部１２ａ，１２ｂ側の第一面１５１と振動腕部１２ａ，１２ｂ側の反対側の第二面１５２とが含まれ、少なくとも第二面１５２に内側切れ込み部１６ａ，１６ｂが形成されている場合は、第一面１５１へ流れ込もうとする導電性接着剤３１をその手前で抑えられるので、振動漏れをより低減できる。なぜなら、導電性接着剤３１が振動腕部１２ａ，１２ｂに近づくほど、振動漏れは大きくなるからである。したがって、本実施形態１では、第三面１５３と第二面１５２との交線１５４を含む部分に、内側切れ込み部１６ａ，１６ｂが形成することが望ましい。   (2) The inner peripheries of the outer notches 15a and 15b include a first surface 151 on the vibrating arm portions 12a and 12b side and a second surface 152 on the opposite side to the vibrating arm portions 12a and 12b, and at least second In the case where the inner cut portions 16a and 16b are formed on the surface 152, the conductive adhesive 31 which is about to flow into the first surface 151 can be suppressed in front of the surface 152, so that vibration leakage can be further reduced. This is because vibration leakage increases as the conductive adhesive 31 approaches the vibrating arm portions 12a and 12b. Therefore, in the first embodiment, it is desirable that the inner cut portions 16a and 16b are formed in a portion including the intersection line 154 between the third surface 153 and the second surface 152.

（３）薄肉部上面１７１が延長上面１１３から離れた面であり、薄肉部下面１７２が延長下面１１４から離れた面である場合は、基部１１を上下対称に形成できるので、基部１１の上面１１１及び下面１１２のどちらを素子搭載部材３２に接着しても同様の振動特性が得られる。したがって、上面１１１及び下面１１２を確認する手間を省けるので、実装工程を簡易化できる。   (3) When the thin wall upper surface 171 is a surface away from the extended upper surface 113 and the thin wall lower surface 172 is a surface separated from the extended lower surface 114, the base 11 can be formed vertically symmetrically. The same vibration characteristic can be obtained regardless of which of the lower surface 112 and the lower surface 112 is bonded to the element mounting member 32. Therefore, the trouble of checking the upper surface 111 and the lower surface 112 can be saved, so that the mounting process can be simplified.

次に、実施形態１の変形例における外側切れ込み部、内側切れ込み部及び薄肉部を、図３及び図４に基づき説明する。   Next, the outer cut portion, the inner cut portion, and the thin portion in the modified example of the first embodiment will be described with reference to FIGS. 3 and 4.

図３［Ｂ］には、変形例１における外側切れ込み部６５ａ、内側切れ込み部６６ａ及び薄肉部６７ａが示されている。外側切れ込み部６５ａは平面視略１／４円形状であり、内側切れ込み部６６ａは平面視略３／４円形状である。外側切れ込み部６５ａの内周には、振動腕部１２ａ側の第一面６５１と、振動腕部１２ａ側の反対（基端面１１０）側の第二面６５２とが含まれる。第一面６５１は円弧状の凹曲面からなり、第二面６５２は平面からなる。内側切れ込み部６６ａは、少なくとも第二面６５２に形成されており、詳しくは、第一面６５１と第二面１５２との交線６５４を含む部分に形成されている。   FIG. 3B shows an outer cut portion 65a, an inner cut portion 66a, and a thin portion 67a in Modification 1. The outer notch 65a has a substantially ¼ circular shape in plan view, and the inner notch 66a has a substantially ¾ circular shape in plan view. The inner periphery of the outer notch 65a includes a first surface 651 on the vibrating arm 12a side and a second surface 652 on the opposite (base end surface 110) side on the vibrating arm 12a side. The first surface 651 is an arc-shaped concave curved surface, and the second surface 652 is a flat surface. The inner notch 66a is formed in at least the second surface 652, and specifically, is formed in a portion including the intersection line 654 between the first surface 651 and the second surface 152.

図４［Ｃ］には、変形例２における外側切れ込み部７５ａ、内側切れ込み部７６ａ及び薄肉部７７ａが示されている。薄肉部７７ａは、図２［Ｂ］で言えば延長下面１１４と薄肉部下面１７２とが一致した構造である。外側切れ込み部７５ａの内周には、振動腕部１２ａ側の第一面７５１と、振動腕部１２ａ側の反対（基端面１１０）側の第二面７５２とが含まれる。外側切れ込み部７５ａは、平面視略四角形状である。そのため、外側切れ込み部７５ａの内周には、第一面７５１と第二面７５２とを結ぶ第三面７５３が更に含まれる。内側切れ込み部７６ａは、少なくとも第二面７５２に形成されており、詳しくは、第三面７５３と第二面７５２との交線７５４を含む部分に形成されている。   FIG. 4C shows an outer cut portion 75a, an inner cut portion 76a, and a thin portion 77a in Modification 2. In FIG. 2B, the thin-walled portion 77a has a structure in which the extended lower surface 114 and the thin-walled lower surface 172 coincide. The inner periphery of the outer notch 75a includes a first surface 751 on the vibrating arm 12a side and a second surface 752 on the opposite (base end surface 110) side on the vibrating arm 12a side. The outer notch 75a has a substantially rectangular shape in plan view. Therefore, a third surface 753 that connects the first surface 751 and the second surface 752 is further included in the inner periphery of the outer notch 75a. The inner notch 76a is formed in at least the second surface 752, and specifically, is formed in a portion including the intersection line 754 between the third surface 753 and the second surface 752.

図４［Ｄ］には、変形例３における外側切れ込み部８５ａ、内側切れ込み部８６ａ及び薄肉部８７ａが示されている。薄肉部８７ａは、図２［Ｂ］で言えば延長上面１１３と薄肉部上面１７１とが一致した構造である。外側切れ込み部８５ａの内周には、振動腕部１２ａ側の第一面８５１と、振動腕部１２ａ側の反対（基端面１１０）側の第二面８５２とが含まれる。外側切れ込み部８５ａは、平面視略四角形状である。そのため、外側切れ込み部８５ａの内周には、第一面８５１と第二面８５２とを結ぶ第三面８５３が更に含まれる。内側切れ込み部８６ａは、少なくとも第二面８５２に形成されており、詳しくは、第三面８５３と第二面８５２との交線８５４を含む部分に形成されている。   FIG. 4D shows an outer cut portion 85a, an inner cut portion 86a, and a thin portion 87a in Modification 3. In FIG. 2B, the thin-walled portion 87a has a structure in which the extended upper surface 113 and the thin-walled portion upper surface 171 coincide. The inner periphery of the outer notch 85a includes a first surface 851 on the vibrating arm 12a side and a second surface 852 on the opposite (base end surface 110) side on the vibrating arm 12a side. The outer notch 85a has a substantially rectangular shape in plan view. Therefore, a third surface 853 connecting the first surface 851 and the second surface 852 is further included in the inner periphery of the outer cutout portion 85a. The inner notch 86a is formed in at least the second surface 852, and specifically, is formed in a portion including the intersection line 854 between the third surface 853 and the second surface 852.

上記変形例１〜３に示すように、外側切れ込み部、内側切れ込み部及び薄肉部の形状は任意である。また、これらの個数及び位置も任意である。変形例１〜３のその他の構成、作用及び効果は、実施形態１のそれらと同様である。   As shown in the first to third modifications, the shapes of the outer cut portion, the inner cut portion, and the thin portion are arbitrary. Also, the number and position of these are arbitrary. Other configurations, operations, and effects of the first to third modifications are the same as those of the first embodiment.

次に、実施形態１の振動素子を製造する方法を実施形態２の製造方法として説明する。図５乃至図８は、実施形態２の製造方法における各工程を示す断面図である。以下、図１及び図２に図５乃至図８を加えて、本実施形態２の製造方法について説明する。   Next, a method for manufacturing the resonator element according to the first embodiment will be described as a manufacturing method according to the second embodiment. 5 to 8 are cross-sectional views showing each step in the manufacturing method of the second embodiment. Hereinafter, the manufacturing method of the second embodiment will be described with reference to FIGS.

図１に示すように、振動腕部１２ａと振動腕部１２ｂとは対称的に同じ構造であり、基部１１の振動腕部１２ａ側と振動腕部１２ｂ側とも対称的に同じ構造である。そこで、図５乃至図８では、図１におけるIIａ−IIａ線断面及びIIｂ−IIｂ線断面において、振動腕部１２ａ側のみ、及び、基部１１の振動腕部１２ａ側のみの製造工程を示す。   As shown in FIG. 1, the vibrating arm portion 12a and the vibrating arm portion 12b have the same structure symmetrically, and the vibrating arm portion 12a side and the vibrating arm portion 12b side of the base 11 have the same symmetrical structure. Accordingly, FIGS. 5 to 8 show a manufacturing process only on the vibrating arm portion 12a side and only on the vibrating arm portion 12a side of the base 11 in the IIa-IIa line cross section and the IIb-IIb line cross section in FIG.

本実施形態２の製造方法は、実施形態１の振動素子１０を製造する方法であって、溝部１３ａを形成する際に、同時に内側切れ込み部１６ａ及び薄肉部１７ａを形成する、ことを特徴とする。以下に詳しく説明する。   The manufacturing method according to the second embodiment is a method for manufacturing the resonator element 10 according to the first embodiment, and is characterized in that the inner cut portion 16a and the thin portion 17a are simultaneously formed when the groove portion 13a is formed. . This will be described in detail below.

まず、図５［Ａ］に示すように、例えば水晶Ｚ板からなる基板４１の表面及び裏面に耐食膜４２を形成し、耐食膜４２の上にフォトレジスト膜４３を形成し、振動腕部となる領域５２及び基部となる領域５１にのみにフォトレジスト膜４３が残るようにフォトレジスト膜４３の一部を除去することにより、外形パターニングを行う。このとき、外側切れ込み部となる領域５５のフォトレジスト膜４３も除去する。耐食膜４２は、水晶のエッチング液に対して耐食性を有する金属からなり、例えばクロムからなる単一層でもクロム及び金からなる複数層でもよい。フォトレジスト膜４３は、例えばスピンコート法によって塗布される。   First, as shown in FIG. 5A, for example, a corrosion-resistant film 42 is formed on the front and back surfaces of a substrate 41 made of a quartz Z plate, a photoresist film 43 is formed on the corrosion-resistant film 42, and a vibrating arm portion and The external patterning is performed by removing a part of the photoresist film 43 so that the photoresist film 43 remains only in the region 52 and the base region 51. At this time, the photoresist film 43 in the region 55 that becomes the outer cut portion is also removed. The corrosion-resistant film 42 is made of a metal having corrosion resistance against the crystal etching solution, and may be a single layer made of chromium or a plurality of layers made of chromium and gold, for example. The photoresist film 43 is applied by, for example, a spin coat method.

続いて、図５［Ｂ］に示すように、図５［Ａ］でフォトレジスト膜４３が形成されなかった部分の耐食膜４２を、エッチングにより除去する。例えば、専用のエッチング液を用いたウェットエッチングで、フォトレジスト膜４３に覆われていない耐食膜４２を除去する。これにより、耐食膜４２が除去された部分には、基板４１が現れることになる。   Subsequently, as shown in FIG. 5B, the portion of the corrosion-resistant film 42 where the photoresist film 43 is not formed in FIG. 5A is removed by etching. For example, the corrosion-resistant film 42 not covered with the photoresist film 43 is removed by wet etching using a dedicated etching solution. Thereby, the substrate 41 appears in the portion where the corrosion-resistant film 42 is removed.

続いて、図５［Ｃ］に示すように、図５［Ｂ］で残っていたフォトレジスト膜４３を全て除去する。   Subsequently, as shown in FIG. 5 [C], the photoresist film 43 remaining in FIG. 5 [B] is all removed.

続いて、図６［Ｄ］に示すように、耐食膜４２も含めた基板４１の全面にフォトレジスト膜４４を形成する。   Subsequently, as shown in FIG. 6D, a photoresist film 44 is formed on the entire surface of the substrate 41 including the corrosion resistant film 42.

続いて、図６［Ｅ］に示すように、フォトレジスト膜４４の一部を除去する。このとき、振動腕部となる領域５２及び基部となる領域５１以外の部分のフォトレジスト膜４４を除去するだけでなく、溝部となる領域５３及び内側切れ込み部となる領域５６のフォトレジスト膜４４も除去することにより、溝部及び内側切れ込み部パターニングを行う。   Subsequently, as shown in FIG. 6E, a part of the photoresist film 44 is removed. At this time, not only the portion of the photoresist film 44 other than the region 52 to be the vibrating arm portion and the region 51 to be the base portion is removed, but also the region 53 to be the groove portion and the photoresist film 44 in the region 56 to be the inner cut portion. By removing, the groove portion and the inner cut portion patterning is performed.

続いて、図６［Ｆ］に示すように、外形エッチングを行う。すなわち、水晶Ｚ板からなる基板４１において、振動腕部となる領域５２及び基部となる領域５１のみを残してエッチングする。これにより、耐食膜４２に覆われていない基板４１すなわち水晶の露出面を、バッファードフッ酸（ＨＦ＋ＮＨ４Ｆ）を用いて完全に抜くことにより、振動腕部１２ａ及び基部１１の外形並びに外側切れ込み部１５ａを形成する。   Subsequently, as shown in FIG. 6 [F], outer shape etching is performed. That is, in the substrate 41 made of a quartz Z plate, the etching is performed leaving only the region 52 serving as the vibrating arm portion and the region 51 serving as the base portion. As a result, the substrate 41 that is not covered with the corrosion-resistant film 42, that is, the exposed surface of the crystal, is completely removed using buffered hydrofluoric acid (HF + NH4F), whereby the outer shape of the vibrating arm portion 12a and the base portion 11 and the outer cut portion 15a. Form.

続いて、図７［Ｇ］に示すように、溝部となる領域５３及び内側切れ込み部となる領域５６の耐食膜４２を除去する。   Subsequently, as shown in FIG. 7G, the corrosion-resistant film 42 in the region 53 that becomes the groove and the region 56 that becomes the inner cut portion is removed.

続いて、図７［Ｈ］に示すように、溝部及び内側切れ込み部エッチングを行う。すなわち、水晶Ｚ板からなる基板４１において、溝部となる領域５３及び内側切れ込み部となる領域５６を一定の深さにエッチングする。これにより、耐食膜４２に覆われていない基板４１すなわち水晶の露出面を、バッファードフッ酸（ＨＦ＋ＮＨ４Ｆ）を用いてハーフエッチングすることにより、溝部１３ａと同時に内側切れ込み部１６ａ及び薄肉部１７ａを形成する。   Subsequently, as shown in FIG. 7 [H], the groove portion and the inner cut portion are etched. That is, in the substrate 41 made of a quartz Z plate, the region 53 to be a groove and the region 56 to be an inner cut are etched to a certain depth. As a result, the substrate 41 that is not covered with the corrosion-resistant film 42, that is, the exposed surface of the crystal is half-etched using buffered hydrofluoric acid (HF + NH4F), thereby forming the inner cut portion 16a and the thin portion 17a simultaneously with the groove portion 13a. To do.

続いて、図７［Ｉ］に示すように、耐食膜４２及びフォトレジスト膜４４を全て除去する。   Subsequently, as shown in FIG. 7I, all of the corrosion-resistant film 42 and the photoresist film 44 are removed.

続いて、図８［Ｊ］に示すように、基板４１の表裏全面に電極膜４６を形成する。電極膜４６は、例えばクロム又はチタンの単層膜や、その上にパラジウム又は金を形成した積層膜などであり、例えばスパッタリングや蒸着で成膜する。   Subsequently, an electrode film 46 is formed on the entire front and back surfaces of the substrate 41 as shown in FIG. The electrode film 46 is, for example, a single layer film of chromium or titanium, or a laminated film in which palladium or gold is formed thereon, and is formed by sputtering or vapor deposition, for example.

続いて、図８［Ｋ］に示すように、電極膜４６の全面に電着法によりフォトレジスト膜４５を形成し、電極パターンを露光及び現像する。このとき、基部となる領域５１では、電極となる領域５８がフォトレジスト膜４５で覆われる。なお、溝部となる領域５３のように微細な凹凸にまでフォトレジスト膜４５を形成するには、電着法が適している。電極となる領域５８には、図８［Ｌ］に示すパッド電極２１ｂとなる領域に加え、図１に示すパッド電極２１ａ及び配線パターン２４ａ，２４ｂとなる領域も含まれる。   Subsequently, as shown in FIG. 8K, a photoresist film 45 is formed on the entire surface of the electrode film 46 by electrodeposition, and the electrode pattern is exposed and developed. At this time, in the region 51 serving as the base, the region 58 serving as the electrode is covered with the photoresist film 45. In addition, the electrodeposition method is suitable for forming the photoresist film 45 to the minute unevenness like the region 53 to be the groove. The region 58 serving as an electrode includes the region serving as the pad electrode 21a and the wiring patterns 24a and 24b illustrated in FIG. 1 in addition to the region serving as the pad electrode 21b illustrated in FIG.

最後に、図８［Ｌ］に示すように、フォトレジスト膜４５で覆われていない電極膜４６をエッチングにより除去し、その後フォトレジスト膜４５も除去する。これにより、振動腕部１２ａ及び溝部１３ａに励振電極２２ａ，２２ｂが形成され、基部１１、外側切れ込み部１５ａ、内側切れ込み部１６ａ及び薄肉部１７ａにパッド電極２１ｂが形成される。このとき、図１に示すように、パッド電極２１ａ及び配線パターン２４ａ，２４ｂも形成され、振動素子１０が完成する。なお、周波数調整用金属膜２３ａ，２３ｂは、例えば別途メタルマスク及び蒸着で形成してもよい。   Finally, as shown in FIG. 8L, the electrode film 46 not covered with the photoresist film 45 is removed by etching, and then the photoresist film 45 is also removed. As a result, the excitation electrodes 22a and 22b are formed in the vibrating arm portion 12a and the groove portion 13a, and the pad electrode 21b is formed in the base portion 11, the outer cut portion 15a, the inner cut portion 16a, and the thin portion 17a. At this time, as shown in FIG. 1, the pad electrode 21a and the wiring patterns 24a and 24b are also formed, and the vibration element 10 is completed. The frequency adjusting metal films 23a and 23b may be formed by, for example, a separate metal mask and vapor deposition.

本実施形態２の製造方法によれば、図７［Ｈ］に示すように、溝部１３ａ，１３ｂと同時に内側切れ込み部１６ａ，１６ｂ及び薄肉部１７ａ，１７ｂを形成することにより、溝部形成時のフォトマスク（図６［Ｅ］）を変更するだけで既存の工程をそのまま使用できる。   According to the manufacturing method of the second embodiment, as shown in FIG. 7 [H], the inner notches 16a and 16b and the thin portions 17a and 17b are formed simultaneously with the grooves 13a and 13b. The existing process can be used as it is simply by changing the mask (FIG. 6E).

なお、本実施形態２の製造方法は、溝部１３ａ，１３ｂと同時に内側切れ込み部１６ａ，１６ｂ及び薄肉部１７ａ，１７ｂを形成する工程が含まれていれば、他の工程はどのようなものであってもよい。例えば、溝部、内側切れ込み部及び薄肉部はエッチング抑制パターンを用いて外形及び外側切れ込み部と同時に形成してもよいし、電極はリフトオフ法によって形成してもよいし、フォトレジスト膜はポジ型における潜像を利用することによって塗布及び剥離の回数を減らしてもよい。本実施形態２のその他の構成、作用及び効果は、実施形態１のそれらと同様である。   In addition, the manufacturing method of this Embodiment 2 will be what other processes will be, if the process of forming the inner notches 16a and 16b and the thin parts 17a and 17b simultaneously with the groove parts 13a and 13b is included. May be. For example, the groove portion, the inner cut portion and the thin portion may be formed simultaneously with the outer shape and the outer cut portion using an etching suppression pattern, the electrode may be formed by a lift-off method, and the photoresist film is a positive type. You may reduce the frequency | count of application | coating and peeling by utilizing a latent image. Other configurations, operations, and effects of the second embodiment are the same as those of the first embodiment.

以上、上記各実施形態を参照して本発明を説明したが、本発明は上記各実施形態に限定されるものではない。本発明の構成や詳細については、当業者が理解し得るさまざまな変更を加えることができる。また、本発明には、上記各実施形態の構成の一部又は全部を相互に適宜組み合わせたものも含まれる。   Although the present invention has been described with reference to the above embodiments, the present invention is not limited to the above embodiments. Various changes that can be understood by those skilled in the art can be made to the configuration and details of the present invention. Further, the present invention includes a combination of some or all of the configurations of the above-described embodiments as appropriate.

本発明は、基部と振動部と切れ込み部とを備える振動素子であればどのようなものにでも利用でき、例えば音叉型屈曲振動素子、厚みすべり振動素子などの他に、ジャイロセンサなどのセンサ素子にも利用可能である。   The present invention can be used for any vibration element provided with a base, a vibration part, and a notch. For example, in addition to a tuning fork type bending vibration element and a thickness shear vibration element, a sensor element such as a gyro sensor Also available.

＜実施形態１＞
１０ 振動素子
１１ 基部
１１０ 基端面
１１１ 上面
１１２ 下面
１１３ 延長上面
１１４ 延長下面
１２ａ，１２ｂ 振動腕部
１３ａ，１３ｂ 溝部
１４ 水晶振動片
１５ａ，１５ｂ 外側切れ込み部
１５１ 第一面
１５２ 第二面
１５３ 第三面
１５４ 交線
１６ａ，１６ｂ 内側切れ込み部
１７ａ，１７ｂ 薄肉部
１７１ 薄肉部上面
１７２ 薄肉部下面
２１ａ，２１ｂ パッド電極
２２ａ，２２ｂ 励振電極
２３ａ，２３ｂ 周波数調整用金属膜
２４ａ，２４ｂ 配線パターン
３１ 導電性接着剤
３２ 素子搭載部材
３３ パッド電極
＜変形例＞
６５ａ，７５ａ，８５ａ， 外側切れ込み部
６５１，７５１，８５１ 第一面
６５２，７５２，８５２ 第二面
７５３，８５３ 第三面
６５４，７５４，８５４ 交線
６６ａ，７６ａ，８６ａ 内側切れ込み部
６７ａ，７７ａ，８７ａ 薄肉部
＜実施形態２＞
４１ 基板
４２ 耐食膜
４３，４４，４５ フォトレジスト膜
４６ 電極膜
５１ 基部となる領域
５２ 振動腕部となる領域
５３ 溝部となる領域
５５ 外側切れ込み部となる領域
５６ 内側切れ込み部となる領域
５８ 電極となる領域
＜関連技術１＞
２１０ 振動素子
２１１ 基部
２４１ 上面
２４２ 下面
２１２ａ，２１２ｂ 振動腕部
２１３ａ，２１３ｂ 溝部
２１４ 水晶振動片
２１５ａ，２１５ｂ 切れ込み部
２２１ａ，２２１ｂ パッド電極
２２２ａ，２２２ｂ 励振電極
２２３ａ，２２３ｂ 周波数調整用金属膜
２２４ａ，２２４ｂ 配線パターン
２３１ 導電性接着剤 <Embodiment 1>
DESCRIPTION OF SYMBOLS 10 Vibration element 11 Base part 110 Base end surface 111 Upper surface 112 Lower surface 113 Extension upper surface 114 Extension lower surface 12a, 12b Vibration arm part 13a, 13b Groove part 14 Crystal vibration piece 15a, 15b Outer notch part 151 First surface 152 Second surface 153 Third surface 154 Intersection 16a, 16b Inner cut portion 17a, 17b Thin portion 171 Thin portion upper surface 172 Thin portion lower surface 21a, 21b Pad electrode 22a, 22b Excitation electrode 23a, 23b Frequency adjusting metal film 24a, 24b Wiring pattern 31 Conductive adhesive 32 Element mounting member 33 Pad electrode <Modification>
65a, 75a, 85a, outer notch 651, 751, 851 first surface 652, 752, 852 second surface 753, 853 third surface 654, 754, 854 intersection line 66a, 76a, 86a inner notch 67a, 77a, 87a Thin-walled portion <Embodiment 2>
41 Substrate 42 Corrosion resistant film 43, 44, 45 Photoresist film 46 Electrode film 51 Area to be the base 52 Area to be the vibrating arm part 53 Area to be the groove part 55 Area to be the outer cut part 56 Area to be the inner cut part 58 Electrode Area <Related Technology 1>
210 vibrating element 211 base 241 upper surface 242 lower surface 212a, 212b vibrating arm 213a, 213b groove 214 crystal vibrating piece 215a, 215b notch 221a, 221b pad electrode 222a, 222b excitation electrode 223a, 223b frequency adjusting metal film 224a, 224b Pattern 231 conductive adhesive

Claims (5)

厚さ方向に上面及び下面を有するとともに、この下面が導電性接着剤によって素子搭載部材に固定される基部と、
この基部から延設された振動部と、
前記上面と前記下面とを貫くように前記基部の外周に形成された外側切れ込み部と、
前記上面と前記下面とから前記厚さ方向に窪んだ状態になるように前記外側切れ込み部の内周に形成された内側切れ込み部と、
前記上面が延長された仮想的な面を延長上面とし、前記下面が延長された仮想的な面を延長下面としたとき、前記内側切れ込み部内に形成され、前記延長上面及び前記延長下面の少なくとも一方から離れた状態で突出する薄肉部と、
を備えた水晶振動素子。 A base having an upper surface and a lower surface in the thickness direction, and the lower surface fixed to the element mounting member by a conductive adhesive;
A vibrating portion extending from the base, and
An outer notch formed on the outer periphery of the base so as to penetrate the upper surface and the lower surface;
An inner notch formed on an inner periphery of the outer notch so as to be recessed in the thickness direction from the upper surface and the lower surface;
When the virtual surface with the upper surface extended is an extended upper surface, and the virtual surface with the lower surface extended is an extended lower surface, it is formed in the inner notch, and at least one of the extended upper surface and the extended lower surface A thin-walled portion that protrudes away from the
Crystal oscillator with 前記外側切れ込み部の内周には、前記振動部側の第一面と、前記振動部側の反対側の第二面とが含まれ、
少なくとも前記第二面に前記内側切れ込み部が形成された、
請求項１記載の水晶振動素子。 The inner periphery of the outer notch includes a first surface on the vibrating portion side and a second surface on the opposite side of the vibrating portion side,
The inner notch is formed on at least the second surface,
The crystal resonator element according to claim 1. 前記外側切れ込み部は、前記上面側及び下面側から見て四角形状であり、
前記外側切れ込み部の内周には、前記第一面と前記第二面とを結ぶ第三面が更に含まれ、
この第三面と前記第二面との交線を含む部分に前記内側切れ込み部が形成された、
請求項２記載の水晶振動素子。 The outer notch is rectangular when viewed from the upper surface side and the lower surface side,
The inner periphery of the outer cut portion further includes a third surface connecting the first surface and the second surface,
The inner cut portion is formed in a portion including an intersection line between the third surface and the second surface,
The crystal resonator element according to claim 2. 前記薄肉部は薄肉部上面及び薄肉部下面を有し、
前記薄肉部上面は前記延長上面から離れた面であり、
前記薄肉部下面は前記延長下面から離れた面である、
請求項１乃至３のいずれか一つに記載の水晶振動素子。 The thin portion has a thin portion upper surface and a thin portion lower surface,
The thin-walled upper surface is a surface away from the extended upper surface,
The thin wall lower surface is a surface away from the extended lower surface,
The crystal resonator element according to claim 1. 前記振動部に前記延設方向に沿って溝部が形成された請求項１乃４のいずれか一つに記載の水晶振動素子を製造する方法であって、
前記溝部を形成する際に、同時に前記内側切れ込み部及び前記薄肉部を形成する、
ことを特徴とする水晶振動素子の製造方法。 The method for manufacturing a crystal resonator element according to any one of claims 1 to 4, wherein a groove portion is formed along the extending direction in the vibrating portion.
When forming the groove portion, simultaneously form the inner cut portion and the thin portion,
A method for manufacturing a quartz crystal resonator element.
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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004260718A (en) * 2003-02-27 2004-09-16 Seiko Epson Corp Tuning fork type vibration pieces, manufacturing method of tuning fork type vibration pieces, and piezoelectric device
JP2013078079A (en) * 2011-09-30 2013-04-25 Seiko Instruments Inc Piezoelectric vibration piece, piezoelectric transducer, oscillator, electronic apparatus, and radio controlled watch

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004260718A (en) * 2003-02-27 2004-09-16 Seiko Epson Corp Tuning fork type vibration pieces, manufacturing method of tuning fork type vibration pieces, and piezoelectric device
JP2013078079A (en) * 2011-09-30 2013-04-25 Seiko Instruments Inc Piezoelectric vibration piece, piezoelectric transducer, oscillator, electronic apparatus, and radio controlled watch

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