JP2015193163A - 圧電アクチュエータ - Google Patents
圧電アクチュエータ Download PDFInfo
- Publication number
- JP2015193163A JP2015193163A JP2014072695A JP2014072695A JP2015193163A JP 2015193163 A JP2015193163 A JP 2015193163A JP 2014072695 A JP2014072695 A JP 2014072695A JP 2014072695 A JP2014072695 A JP 2014072695A JP 2015193163 A JP2015193163 A JP 2015193163A
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric actuator
- diaphragm
- compliance
- piezoelectric
- mpa
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006073 displacement reaction Methods 0.000 claims abstract description 80
- 230000007423 decrease Effects 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims description 15
- 238000003980 solgel method Methods 0.000 claims description 6
- 230000006835 compression Effects 0.000 abstract description 4
- 238000007906 compression Methods 0.000 abstract description 4
- 230000035882 stress Effects 0.000 description 111
- 239000010410 layer Substances 0.000 description 66
- 239000010408 film Substances 0.000 description 12
- 239000011241 protective layer Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 230000003042 antagnostic effect Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2047—Membrane type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/11—Embodiments of or processes related to ink-jet heads characterised by specific geometrical characteristics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/077—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition
- H10N30/078—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by liquid phase deposition by sol-gel deposition
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
アンス−変位体積特性に極点(図2(b)中のバツ印)が生じる。なお、図中の極点は、複数の測定点に基づいて、その分布の近似曲線より導出してある。
2 振動板
3 圧電層
4 個別電極
10 圧力室
11a 上面(一平面)
Claims (2)
- 一平面に固定されて当該一平面に開口する圧力室を覆い、印加される電圧により前記圧力室に向かって凸状に変位し当該圧力室内の液体に圧力を付与する圧電アクチュエータにおいて、
前記一平面に固定され、圧縮応力を有する振動板と、
前記振動板の前記一平面とは反対側で前記一平面と直交する方向に沿って前記圧力室と重なって積層され、引っ張り応力を有する圧電層と、
前記圧電層上に積層された個別電極とを含んでおり、
前記振動板の圧縮応力が、前記圧電アクチュエータのコンプライアンスと電圧印加時の前記圧力室の変位体積との関係において、前記コンプライアンスの増加に対し、前記変位体積が増加から減少に転じる極点を生じる閾値以上の大きさであり、
前記圧電アクチェエータの厚みは、前記極点を与える前記コンプライアンスに対応した所定厚みよりも大きいことを特徴とする圧電アクチュエータ。 - 前記圧電層は、ゾルゲル法により前記振動板上に形成されることを特徴とする請求項1に記載の圧電アクチュエータ。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014072695A JP6217495B2 (ja) | 2014-03-31 | 2014-03-31 | 圧電アクチュエータ |
US14/663,536 US9419200B2 (en) | 2014-03-31 | 2015-03-20 | Piezoelectric actuator and recording head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014072695A JP6217495B2 (ja) | 2014-03-31 | 2014-03-31 | 圧電アクチュエータ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015193163A true JP2015193163A (ja) | 2015-11-05 |
JP6217495B2 JP6217495B2 (ja) | 2017-10-25 |
Family
ID=54189115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014072695A Active JP6217495B2 (ja) | 2014-03-31 | 2014-03-31 | 圧電アクチュエータ |
Country Status (2)
Country | Link |
---|---|
US (1) | US9419200B2 (ja) |
JP (1) | JP6217495B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020168749A (ja) * | 2019-04-01 | 2020-10-15 | ブラザー工業株式会社 | 液体吐出ヘッド及び液体吐出システム |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI695934B (zh) * | 2019-03-29 | 2020-06-11 | 研能科技股份有限公司 | 微機電泵浦 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11334063A (ja) * | 1998-05-22 | 1999-12-07 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
JP2006319945A (ja) * | 2005-04-12 | 2006-11-24 | Osaka Industrial Promotion Organization | ダイアフラム型センサ素子とその製造方法 |
WO2011007645A1 (ja) * | 2009-07-15 | 2011-01-20 | コニカミノルタホールディングス株式会社 | 薄膜アクチュエータ、及びインクジェットヘッド |
JP2011140117A (ja) * | 2010-01-05 | 2011-07-21 | Konica Minolta Holdings Inc | 薄膜アクチュエータ、及びインクジェットヘッド |
JP2013086287A (ja) * | 2011-10-14 | 2013-05-13 | Toshiba Corp | インクジェット式記録ヘッド |
JP2013102024A (ja) * | 2011-11-08 | 2013-05-23 | Konica Minolta Holdings Inc | 圧電素子およびその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3019845B1 (ja) * | 1997-11-25 | 2000-03-13 | セイコーエプソン株式会社 | インクジェット式記録ヘッド及びインクジェット式記録装置 |
JP2001026106A (ja) | 1999-07-15 | 2001-01-30 | Fujitsu Ltd | インクジェットヘッドおよびインクジェットプリンタ |
JP3879685B2 (ja) | 2002-03-18 | 2007-02-14 | セイコーエプソン株式会社 | 圧電素子、圧電アクチュエータ、及び、液体噴射ヘッド |
JP5041765B2 (ja) | 2005-09-05 | 2012-10-03 | キヤノン株式会社 | エピタキシャル酸化物膜、圧電膜、圧電膜素子、圧電膜素子を用いた液体吐出ヘッド及び液体吐出装置 |
US8969105B2 (en) | 2010-07-26 | 2015-03-03 | Fujifilm Corporation | Forming a device having a curved piezoelectric membrane |
EP2663649A4 (en) | 2011-01-10 | 2014-08-27 | American University In Cairo | DIRECT DETECTION OF UNAMPIFIED RNA FROM HEPATITIS C VIRUS USING UNMANNED GOLD NANOPARTICLES |
JP2013063559A (ja) | 2011-09-16 | 2013-04-11 | Ricoh Co Ltd | インクジェット記録装置 |
-
2014
- 2014-03-31 JP JP2014072695A patent/JP6217495B2/ja active Active
-
2015
- 2015-03-20 US US14/663,536 patent/US9419200B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11334063A (ja) * | 1998-05-22 | 1999-12-07 | Seiko Epson Corp | インクジェット式記録ヘッド及びインクジェット式記録装置 |
JP2006319945A (ja) * | 2005-04-12 | 2006-11-24 | Osaka Industrial Promotion Organization | ダイアフラム型センサ素子とその製造方法 |
WO2011007645A1 (ja) * | 2009-07-15 | 2011-01-20 | コニカミノルタホールディングス株式会社 | 薄膜アクチュエータ、及びインクジェットヘッド |
JP2011140117A (ja) * | 2010-01-05 | 2011-07-21 | Konica Minolta Holdings Inc | 薄膜アクチュエータ、及びインクジェットヘッド |
JP2013086287A (ja) * | 2011-10-14 | 2013-05-13 | Toshiba Corp | インクジェット式記録ヘッド |
JP2013102024A (ja) * | 2011-11-08 | 2013-05-23 | Konica Minolta Holdings Inc | 圧電素子およびその製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020168749A (ja) * | 2019-04-01 | 2020-10-15 | ブラザー工業株式会社 | 液体吐出ヘッド及び液体吐出システム |
JP7268453B2 (ja) | 2019-04-01 | 2023-05-08 | ブラザー工業株式会社 | 液体吐出ヘッド及び液体吐出システム |
Also Published As
Publication number | Publication date |
---|---|
JP6217495B2 (ja) | 2017-10-25 |
US20150273830A1 (en) | 2015-10-01 |
US9419200B2 (en) | 2016-08-16 |
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